JP2008041952A - Evaporative cooling system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an evaporative cooling system which can be miniaturized while cooling performance is improved. <P>SOLUTION: The evaporating cooling system comprises an evaporator 30 and a condenser 40. The evaporator 30 is installed by bringing it into contact with an inverter 20, and it comprises a circuit 50A constituting a part of a circuit 50 where an evaporative cooling medium circulates inside. The condenser 40 is arranged above the evaporator 30, and is disposed in a position where a circuit 50C with the vaporized evaporative cooling medium circulating therein is brought close to a circuit 100A in which LLC cooling an engine 10 circulates. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a boiling cooling device that cools an electronic element by the heat of vaporization of a refrigerant, and particularly relates to a boiling cooling device that cools an electronic element mounted on a vehicle including an internal combustion engine.

  In recent years, the performance of electronic elements such as thyristors and power transistors has been remarkably improved, and the amount of heat generated from the electronic elements has increased accordingly. On the other hand, for example, in an electric vehicle equipped with an electric motor and a direct current battery (this electric vehicle includes a hybrid vehicle and a fuel cell vehicle), power is converted by an inverter to supply electric power from the direct current battery to the electric motor. . As the rated output of the motor increases, the amount of heat generated by such electronic elements as inverters also increases, and sufficient cooling measures are required.

  In a vehicle, since there is a restriction on a mounting space, downsizing of an electronic element such as an inverter, a case for storing the electronic element, and a cooling device for the electronic element is required. This miniaturization tends to further increase the heat generation density of the electronic element. Therefore, in the cooling device for the electronic element mounted on the vehicle, it is necessary to achieve both cooling efficiency and downsizing. Regarding such a cooling device, there is a technique disclosed in the following publications.

  Japanese Patent Laying-Open No. 2002-4860 (Patent Document 1) discloses a technology that achieves both a compact cooling system and cooling performance in a cooling apparatus for a hybrid electric vehicle. The hybrid electric vehicle cooling device disclosed in this publication is a hybrid electric vehicle including a generator driven by an engine such as an internal combustion engine and an electric motor driven by an inverter by electric power obtained thereby. A cooling jacket provided in each of the generator, motor and inverter, wherein the inverter cooling jacket and the generator and motor cooling jacket are connected in parallel to a radiator (heat radiator) equipped with a cooling fan. A cooling jacket configured to circulate the refrigerant by a pumping means such as a pump, a variable throttle means provided on the inlet side of the cooling jacket provided in the inverter, and a cooling temperature at the inverter module outlet are monitored to When the load is large, it is near the saturation temperature of the refrigerant. While controlling the variable throttle means so as, when the heat load of the inverter is small, and a controller for controlling the operation of the cooling fan so that the specified value or less which is lower than the saturation temperature.

According to the hybrid electric vehicle cooling device disclosed in this publication, the generator and the motor having a complicated structure and a relatively small heat generation density are cooled by liquid phase convection heat transfer. An inverter having a large heat generation density is cooled by boiling heat transfer having a cooling efficiency better than that of liquid phase convection heat transfer. A common refrigerant is used for liquid phase convection heat transfer and boiling heat transfer. Thereby, components, such as a heat radiator, an electric pump, and a reserve tank, can be shared. Therefore, both downsizing of the cooling system and cooling performance can be achieved.
Japanese Patent Laid-Open No. 2002-4860

  However, in the hybrid electric vehicle cooling device disclosed in Patent Document 1, the refrigerant that cools the generator, the motor, and the inverter is cooled by a dedicated air-cooled radiator that is separate from the radiator of the engine cooling system. . The air-cooled radiator needs to have a larger heat transfer area than the water-cooled radiator, and thus becomes larger. Therefore, it was necessary to further reduce the size of the cooling device.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a boiling cooling device that can be downsized while improving cooling performance.

  The boiling cooling device according to the first invention cools an electronic element mounted on a vehicle equipped with an internal combustion engine by boiling heat transfer. The boiling cooling device is provided at a position close to the electronic element, and is connected to the first cooling means for cooling the electronic element by heat of vaporization when the first refrigerant boils, and the first cooling means. A first circulation path through which the first refrigerant circulates, a second circulation path through which a second refrigerant having a higher heat transfer coefficient than air circulates to cool the internal combustion engine, and one of the first circulation paths. And a second cooling means for cooling the first refrigerant using the second refrigerant.

  According to the first invention, the first cooling means is provided at a position close to the electronic element, and cools the electronic element that generates heat by heat of vaporization when the first refrigerant boils. Therefore, it is possible to cool the electronic element more efficiently than air cooling or water cooling, and it is possible to reduce the size of the first cooling means by reducing the heat transfer area. The second cooling means is provided at a position where a part of the first circulation path through which the first refrigerant circulates and a part of the second circulation path through which the second refrigerant circulates are adjacent to each other. The first refrigerant is cooled using this refrigerant. This second refrigerant has a heat transfer coefficient larger than that of air. Therefore, compared with air cooling, a heat-transfer area can be made small and a 2nd cooling means can be reduced in size. Furthermore, the second refrigerant is a refrigerant that cools the internal combustion engine. That is, the internal combustion engine and the first refrigerant are cooled by the common second refrigerant. Therefore, compared with the case where the first refrigerant is cooled with the dedicated refrigerant, for example, a reserve tank for storing the dedicated refrigerant, an electric pump for circulating the dedicated refrigerant, a radiator for releasing the heat of the dedicated refrigerant, and the like are newly provided. There is no need. Further, for example, when the first refrigerant is naturally convected in the first circulation path, there is no need to newly provide an electric pump dedicated to the first refrigerant and a reserve tank dedicated to the first refrigerant. As a result, it is possible to provide a boiling cooling device that can be downsized while improving the cooling performance.

  In the boiling cooling apparatus according to the second invention, in addition to the configuration of the first invention, the second cooling means includes a part of the first circulation path through which the vaporized first refrigerant circulates and the second cooling means. It is provided at a position close to a part of the circulation path.

  According to the second invention, a part of the first circulation path through which the vaporized first refrigerant circulates and a part of the second circulation path are close to each other. Thereby, the heat | fever of the vaporized 1st refrigerant | coolant is transmitted to a 2nd refrigerant | coolant. Therefore, the vaporized first refrigerant can be condensed using the second refrigerant.

  In the boiling cooling device according to the third invention, in addition to the configuration of the first or second invention, the first circulation path is provided independently of the second circulation path. In the first circulation path, the first refrigerant having a saturation temperature higher than the temperature of the second refrigerant circulates.

  According to the third invention, the first circulation path is provided independently of the second circulation path. Therefore, the temperature of the first refrigerant and the temperature of the second refrigerant can be set to different values. Furthermore, the component of the first refrigerant can be selected to be different from the component of the second refrigerant, and the internal pressure of the first circulation path can be easily adjusted by downsizing the first circulation path. . By selecting the components and adjusting the internal pressure, the first refrigerant having a saturation temperature higher than the temperature of the second refrigerant circulates in the first circulation path. Thereby, the temperature of the vaporized 1st refrigerant | coolant can be reduced to saturation temperature using a 2nd refrigerant | coolant, and a 1st refrigerant | coolant can be condensed.

  In the boiling cooling device according to the fourth invention, in addition to the configuration of the first or second invention, the first circulation path is provided independently of the second circulation path. In the first circulation path, the first refrigerant having a saturation temperature higher than the temperature of the second refrigerant and lower than the maximum temperature at which the electronic element normally operates circulates.

  According to the fourth invention, the first circulation path is provided independently of the second circulation path, and the temperature of the first refrigerant and the temperature of the second refrigerant are set to different values. Furthermore, it is possible to select the component of the first refrigerant and adjust the internal pressure of the first circulation path. By selecting the components and adjusting the internal pressure, the first refrigerant having a saturation temperature higher than the temperature of the second refrigerant circulates in the first circulation path. Therefore, the first refrigerant can be condensed by lowering the temperature of the vaporized first refrigerant to the saturation temperature using the second refrigerant. Furthermore, the saturation temperature of the first refrigerant is lower than the maximum temperature at which the electronic element operates normally. Thereby, the electronic device can be cooled by the heat of vaporization of the boiling refrigerant, and the temperature of the electronic device can be maintained at a normal operating temperature.

  In the boiling cooling device according to the fifth aspect of the invention, in addition to the configuration of any one of the first to fourth aspects, the first cooling means is a first refrigerant evaporator. The second cooling means is a first refrigerant condenser.

  According to the fifth invention, the first refrigerant evaporated by the evaporator can be condensed by the condenser.

  The boiling cooling device according to the sixth invention further includes a second refrigerant radiator in addition to the configuration of any one of the first to fifth inventions.

  According to the sixth invention, the second refrigerant that has absorbed the heat of the internal combustion engine and the heat of the first refrigerant is cooled by one radiator. Thereby, compared with the case where the first refrigerant is cooled by the dedicated refrigerant, it is not necessary to newly provide a radiator for releasing the heat of the dedicated refrigerant, and the boiling cooling device can be downsized.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated. In the following description, the cooling device according to the present embodiment is applied to a hybrid vehicle. However, the cooling device according to the present invention is not limited to being applied to a hybrid vehicle.

<First Embodiment>
With reference to FIG. 1, the boiling cooling apparatus which concerns on this Embodiment is demonstrated. A hybrid vehicle equipped with a boiling cooling device includes an engine 10, an inverter 20, an evaporator 30, a condenser 40, a circulation path 50, an electric pump 60, a radiator 70, a reserve tank 80, an LLC (Long Life Coolant) circuit 100. In the following description, the upper side of the paper surface of FIG. 1 is described as the actual upper side, and the lower side of the paper surface of FIG. 1 is described as the actual lower side. The direction is not limited to this.

  The engine 10 is one of the driving sources of the hybrid vehicle, and generates heat when driven.

  The inverter 20 converts a direct current from a drive battery (not shown) into an alternating current and supplies the alternating current to a motor that is one of the drive sources. The inverter 20 generates heat when converting a direct current into an alternating current. A material that operates normally even at a temperature higher than the saturation temperature of the boiling refrigerant described later is used for the elements constituting the inverter 20.

  The evaporator 30 is provided in contact with the inverter 20 and includes a circulation path 50A that constitutes a part of the circulation path 50 in which the boiling refrigerant circulates. The evaporator 30 transfers the heat of the inverter 20 to the circulation path 50A to boil and evaporate the boiling refrigerant.

  The condenser 40 is provided above the evaporator 30, and is provided at a position where a circulation path 50 </ b> C constituting a part of the circulation path 50 and an LLC circulation path 100 </ b> A constituting a part of the LLC circulation path 100 are close to each other. The condenser 40 condenses the vaporized boiling refrigerant by transmitting the heat of the boiling refrigerant circulating in the circulation path 50C to the LLC circulating in the LLC circulation path 100A.

  The circulation path 50 is a path for natural convection of the boiling refrigerant, and is configured independently of the LLC circulation path 100. The circulation path 50 includes circulation paths 50A, 50B, 50C, and 50D. When the inverter 20 is not operating, the boiling refrigerant stays in the circulation path 50A as a liquid. Due to the heat of the inverter 20, the boiling refrigerant boils in the circulation path 50A. The refrigerant vapor boiled and vaporized rises in the circulation path 50B and reaches the circulation path 50C. The refrigerant vapor that reaches the circulation path 50C is cooled and condensed by the LLC circulating in the LLC circulation path 100A. The condensed and liquefied refrigerant descends the circulation path 50D and returns to the circulation path 50A again. In addition, the structure of the circulation path 50 is not limited to this. Further, the circulation path 50 may have a structure in which the boiling refrigerant is forced convection instead of natural convection.

  The saturation temperature of the boiling refrigerant circulating in the circulation path 50 is set higher than the LLC temperature and lower than the maximum temperature at which the inverter 20 operates normally by selection of refrigerant components and adjustment of the internal pressure of the circulation path 50. Yes.

  The electric pump 60 is operated by the engine 10 and the motor, and causes the LLC to circulate in the LLC circuit 100.

  The radiator 70 includes a tube (not shown) through which the LLC flows and a fin (not shown) in contact with the tube, and releases heat of the LLC flowing through the tube to the outside air through the fin.

  The reserve tank 80 is a tank that stores LLC, and is connected to the radiator cap 72 through a supply path 82. When the internal pressure of the LLC circuit 100 becomes larger than a certain value due to the expanded LLC due to the temperature rise, the pressurizing valve (not shown) of the radiator cap 72 is opened, and the expanded portion of the LLC is sent to the reserve blank 80. When the internal pressure of the LLC circuit 100 becomes smaller than a certain value due to the LLC contracted due to the temperature drop, the negative pressure valve (not shown) of the radiator cap 72 is opened, and the contraction of the LLC is replenished from the reserve blank 80.

  The LLC circulation path 100 is a path through which LLC circulates by the operation of the electric pump 60. The LLC circuit 100 includes LLC circuits 100A, 100B, 100C, 100D, 100E, and 100F, a merge unit 102, and a branch unit 104. The LLC that has absorbed the heat of the boiling refrigerant in the LLC circulation path 100A provided in the condenser 40 flows through the LLC circulation path 100B, and merges with the LLC flowing through the LLC circulation path 100C that has absorbed the heat of the engine 10 at the junction 102. And enters the radiator 70. The LLC cooled by the radiator 70 flows through the LLC circuit 100D, and is branched by the branching unit 104 into an LLC circuit 100E connected to the condenser 40 and an LLC circuit 100F connected to the engine 10.

  The operation of the boiling cooling device according to the present embodiment based on the above structure will be described.

  When the driving operation of the hybrid vehicle is started by the driver, the engine 10 and the motor start to be driven, and the engine 10 and the inverter 20 generate heat. The heat generated in the inverter 20 is transmitted to the liquid boiling refrigerant that stays in the circulation path 50 </ b> A inside the evaporator 30. When the temperature of the liquid boiling refrigerant reaches the saturation temperature, the boiling refrigerant boils and begins to vaporize.

  Here, since the circulation path 50 of the boiling refrigerant and the LLC circulation path 100 are independent, the components of the boiling refrigerant can be selected differently from the LLC, and the internal pressure of the circulation path 50 can be easily adjusted. Can do. The saturation temperature of the boiling refrigerant is set lower than the maximum temperature at which the inverter 20 operates normally by selecting the components of the boiling refrigerant, adjusting the internal pressure of the circulation path 50, selecting the materials of the elements constituting the inverter 20, and the like. . Thereby, the inverter 20 can be cooled by the heat of vaporization of the boiling refrigerant, and the temperature of the inverter 20 can be maintained at a normal operating temperature. Therefore, the inverter 20 can be cooled more efficiently than air cooling or water cooling, and the evaporator 30 can be downsized by reducing the heat transfer area of the evaporator 30.

  Furthermore, since the boiling refrigerant circuit 50 and the LLC circuit 100 are independent, it is not necessary to exchange the boiling refrigerant when replacing the LLC, and the number of times the boiling refrigerant is exchanged and the internal pressure of the circulation circuit 50 due to the exchange. The number of readjustments can be reduced. Further, the circulation path 50 can be downsized to reduce the exchange amount of the boiling refrigerant. Therefore, maintainability at the time of exchanging boiling refrigerant can be improved.

  The boiling refrigerant evaporated in the circulation path 50 </ b> A ascends the circulation path 50 </ b> B and reaches the circulation path 50 </ b> C inside the condenser 40. The circuit 50C is close to the LLC circuit 100A through which LLC flows. Here, since the circulation path 50 and the LLC circulation path 100 are provided independently, the temperature of the boiling refrigerant and the temperature of the LLC are different values. Further, the saturation temperature of the boiling refrigerant is set higher than the temperature of the LLC by selecting the components of the boiling refrigerant and adjusting the internal pressure of the circulation path 50. Therefore, it is possible to condense the boiling refrigerant vaporized using LLC having a heat transfer coefficient larger than that of air. Thereby, compared with the case where a boiling refrigerant is condensed by air cooling, the heat transfer area of the condenser 40 can be made small and the condenser 40 can be reduced in size. Furthermore, the engine 10 and the boiling refrigerant can be cooled by a common LLC. The LLC that has absorbed the heat of the boiling refrigerant circulates in the LLC circulation path 100 by the electric pump 60 and radiates heat with the radiator 70 together with the heat of the engine 10. Thereby, compared with the case where the boiling refrigerant is cooled by a dedicated refrigerant, it is possible to suppress newly providing a dedicated reserve tank, an electric pump, a radiator, and the like, and to reduce the size of the boiling cooling apparatus.

  As described above, according to the boiling cooling device according to the present embodiment, the inverter is cooled by the vaporization heat of the boiling refrigerant staying in the evaporator. Therefore, it is possible to reduce the evaporator by reducing the heat transfer area while improving the cooling performance as compared with air cooling or water cooling. The vaporized boiling refrigerant is condensed by LLC in the condenser. Since LLC, which is a liquid, has a heat transfer coefficient larger than that of air, it is possible to reduce the heat transfer area and reduce the size of the condenser as compared with the case where the boiling refrigerant is cooled by an air-cooled radiator. Furthermore, LLC which condenses a boiling refrigerant is LLC used for engine cooling. Therefore, it is possible to suppress the provision of a dedicated reserve tank, an electric pump, a radiator, and the like as compared with the case where the boiling refrigerant is cooled by the dedicated refrigerant. As a result, it is possible to provide a boiling cooling device that can be downsized while improving the cooling performance.

  In the boiling cooling device according to the present embodiment, when the boiling refrigerant is forced convection in the circulation path 50 instead of natural convection, it is necessary to provide an electric pump dedicated to the boiling refrigerant and a reserve tank dedicated to the boiling refrigerant. Even in such a case, since the circulation path 50 and the LLC circulation path 100 are independent, by reducing the size of the circulation path 50, the electric pump dedicated to the boiling refrigerant and the reserve tank dedicated to the boiling refrigerant are reduced in size. Can be

  Further, in the boiling cooling device according to the present embodiment, a switching valve provided in the LLC circuit 100 and a control unit that controls the switching valve are provided, depending on the temperature and load state of the engine 10 and the inverter 20. Thus, the flow of LLC may be controlled. For example, when the switching valve is provided at the junction 102 and the branching section 104 and the engine 10 is low in temperature and needs to be warmed up, the LLC is circulated between the engine 10 and the condenser 40 without being circulated to the radiator 70. Thus, the control unit controls the opening and closing of the switching valve. Thereby, the engine 10 can be warmed up quickly. Further, when the engine 10 is stopped and the warm-up is completed, an electric pump is further provided in the LLC circulation path 100D, and the LLC is circulated between the condenser 40 and the radiator 70 without circulating the LLC to the engine 10. The control unit controls the opening and closing of the switching valve so as to make it happen. Thereby, LLC can be cooled rapidly.

<Modification of the first embodiment>
With reference to FIG. 2, the boiling cooling apparatus which concerns on the modification of 1st Embodiment is demonstrated. Compared with the configuration of the boiling cooling device according to the first embodiment described above, the boiling cooling device according to the modification of the first embodiment is an LLC circulation that connects the engine 10 and the condenser 40 in parallel. It differs from the path 100 in that it includes an LLC circuit 200 that connects the engine 10 and the condenser 40 in series. The configuration other than these is the same as the configuration of the boiling cooling apparatus according to the first embodiment described above. The same reference numerals are assigned to the same components. Their functions are the same. Therefore, detailed description thereof will not be repeated here.

  The LLC circuit 200 includes LLC circuits 100A, 200A, 200B, and 200C. The LLC that has absorbed the heat of the boiling refrigerant in the LLC circuit 100 </ b> A flows through the LLC circuit 200 </ b> A and enters the engine 10 to absorb the heat of the engine 10. The LLC that has absorbed the heat of the boiling refrigerant and the heat of the engine 10 flows through the circulation path 200 </ b> B and radiates heat by the radiator 70. The LLC radiated by the radiator 70 flows through the LLC circuit 200C and returns to the LLC circuit 100A again.

  According to the boiling cooling device according to this modification, the LLC that has absorbed the heat of the boiling refrigerant in the LLC circulation path 100 </ b> A inside the condenser 40 further absorbs the heat of the engine 10. The LLC that has absorbed the heat of the boiling refrigerant and the heat of the engine 10 is dissipated by the radiator 70. Therefore, similarly to the boiling cooling device according to the first embodiment described above, the vaporized boiling refrigerant can be condensed by the LLC used for engine cooling. As a result, while reducing the size of the condenser, compared with the case where the boiling refrigerant is cooled with a dedicated refrigerant, the provision of a dedicated reserve tank, electric pump, radiator, etc. is suppressed, and the boiling cooling device is reduced in size. be able to.

<Second Embodiment>
With reference to FIG. 3, a boiling cooling apparatus according to the second embodiment will be described. Compared with the configuration of the boiling cooling device according to the first embodiment described above, the boiling cooling device according to the second embodiment is replaced with the LLC circulation path 300, the switching valve 310, 320, the electric pump 360, and the sub radiator 370 are different. The configuration other than these is the same as the configuration of the boiling cooling apparatus according to the first embodiment described above. The same reference numerals are assigned to the same components. Their functions are the same. Therefore, detailed description thereof will not be repeated here.

  The LLC circulation path 300 is a circulation path for circulating the boiling refrigerant and LLC for cooling the engine 10. The LLC circuit 300 includes LLC circuits 100A, 300A, 300B, 300C, 300D, 300E, 300F, 300G, 300H, and 300J, a junction unit 302, and a branch unit 304.

  When the temperature of the LLC flowing through the switching valve 310 is lower than a predetermined temperature, the switching valve 310 connects the LLC circuit 300A and the LLC circuit 300B and shuts off the LLC circuit 300H (see FIG. (Not shown). When the temperature of the LLC flowing through the switching valve 310 becomes higher than a predetermined temperature, the switching valve 310 communicates with the LLC circuit 300A and the LLC circuit 300H and is controlled by the control unit so as to shut off the LLC circuit 300B. Is done.

  The switching valve 320 operates in conjunction with the switching valve 310. When the temperature of the LLC flowing through the switching valve 310 is lower than a predetermined temperature, the switching valve 320 communicates with the LLC circuit 300E and the LLC circuit 300G and is controlled by the control unit so as to shut off the LLC circuit 300J. Is done. When the temperature of the LLC flowing through the switching valve 310 becomes higher than a predetermined temperature, the switching valve 320 communicates with the LLC circuit 300G and the LLC circuit 300J and is controlled by the control unit so as to shut off the LLC circuit 300E. Is done.

  The sub radiator 370 is an air-cooled radiator having the same structure as that of the main radiator 70. When the temperature of the LLC flowing through the switching valve 310 becomes higher than a predetermined temperature, the electric pump 360 is operated by the engine 10 and the motor, and circulates the LLC between the condenser 40 and the sub radiator 370.

  The operation of the boiling cooling device according to the present embodiment based on the above structure will be described.

  When the LLC flowing through the switching valve 310 is lower than a predetermined temperature, the switching circuit 310 causes the LLC circuit 300E and the LLC circuit 300G to communicate with each other and the LLC circuit 300J is shut off. Further, the switching circuit 320 allows the LLC circuit 300E and the LLC circuit 300G to communicate with each other and the LLC circuit 300J is shut off. Therefore, the same operation as the boiling cooling device according to the first embodiment described above is performed. That is, as indicated by the arrow in FIG. 3A, the LLC that has absorbed the heat of the boiling refrigerant in the LLC circuit 100A flows through the LLC circuits 300A and 300B by the operation of the electric pump 60, and absorbs the heat of the engine 10. The merging portion 302 and the merging portion 302 join together, and the radiator 70 radiates heat. At this time, it is not necessary to operate the electric pump 360, and the power consumption of the electric pump 360 can be suppressed.

  On the other hand, when the calorific value of the engine 10 or the inverter 20 increases and the LLC flowing through the switching valve 310 becomes higher than a predetermined temperature, the LLC circulation path 300A and the LLC circulation path 300H are communicated by the switching valve 310, and the LLC The circulation path 300B is blocked. Further, the switching circuit 320 allows the LLC circuit 300G and the LLC circuit 300J to communicate with each other and the LLC circuit 300E is shut off. Furthermore, the electric pump 360 starts to operate. Thereby, as shown by the arrow in FIG. 3B, the LLC that cools the engine and the LLC that cools the boiling refrigerant circulate independently, and the LLC that has absorbed the heat of the engine 10 is cooled by the radiator 70. The LLC that has absorbed the heat of the boiling refrigerant is cooled by the sub-radiator 370.

  As described above, according to the boiling cooling device according to the present embodiment, when the calorific value of the engine or inverter increases and the LLC temperature becomes higher than a predetermined temperature, the LLC and the boiling refrigerant that cool the engine are reduced. The cooling LLC is temporarily circulated independently. The LLC that has absorbed the heat of the boiling refrigerant is cooled by a dedicated radiator for the LLC that has absorbed the heat of the boiling refrigerant. Therefore, LLC which cools a boiling refrigerant can be cooled rapidly, and an inverter can be cooled more efficiently. Furthermore, at the normal time when the temperature of the LLC is lower than a predetermined temperature, the boiling refrigerant is cooled by the LLC used for engine cooling. Thereby, the power consumption of the electric pump only for LLC which absorbed the heat | fever of the boiling refrigerant | coolant can be suppressed.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a schematic diagram of the boiling cooling apparatus which concerns on the 1st Embodiment of this invention. It is a schematic diagram of the boiling cooling device which concerns on the modification of the 1st Embodiment of this invention. It is a schematic diagram of the boiling cooling device which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

  10 Engine, 20 Inverter, 30 Evaporator, 40 Condenser, 50, 50A, 50B, 50C, 50D Circulation path, 60, 360 Electric pump, 70 Radiator, 72 Radiator cap, 80 Reserve tank, 82 Supply path, 100, 100A , 100B, 100C, 100D, 100E, 100F, 200, 200A, 200B, 200C, 300, 300A, 300B, 300C, 300D, 300E, 300F, 300G, 300H, 300J LLC circuit, 102, 302 junction, 104, 304 branching unit, 310, 320 switching valve, 370 sub-radiator.

Claims (6)

A boiling cooling device for cooling an electronic element mounted on a vehicle including an internal combustion engine by boiling heat transfer, wherein the electronic element generates heat by its operation,
A first cooling means provided at a position close to the electronic element for cooling the electronic element by heat of vaporization when the first refrigerant boils;
A first circulation path connected to the first cooling means and through which the first refrigerant circulates;
A second circulation path for cooling the internal combustion engine and circulating a second refrigerant having a heat transfer coefficient larger than that of air;
Second cooling for cooling the first refrigerant using the second refrigerant, provided at a position where a part of the first circulation path and a part of the second circulation path are close to each other. And boil cooling device.   The said 2nd cooling means is provided in the position where a part of said 1st circulation path through which the vaporized 1st refrigerant circulates and a part of said 2nd circulation path adjoined. Boiling cooling system.   The said 1st circulation path is provided independently with respect to the said 2nd circulation path, The 1st refrigerant | coolant whose saturation temperature is higher than the temperature of the said 2nd refrigerant | coolant circulates in Claim 1 or 2 The boiling cooling device as described.   The first circulation path is provided independently of the second circulation path, and has a saturation temperature that is higher than the temperature of the second refrigerant and lower than the maximum temperature at which the electronic element normally operates. The boiling cooling device according to claim 1 or 2, wherein the first refrigerant circulates. The first cooling means is an evaporator of the first refrigerant;
The boiling cooling device according to any one of claims 1 to 4, wherein the second cooling means is a condenser of the first refrigerant.   The boiling cooling device according to any one of claims 1 to 5, wherein the boiling cooling device further includes a radiator of the second refrigerant.

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