JP2008041281A - Joint connector and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a joint connector which can protect a chip component even when a vibration is applied to the joint connector. <P>SOLUTION: The joint connector 10 includes a housing 11, bus lines 12, a plurality of connector terminals 13, a plurality of chip components 14, and a molding material 15. The connector terminals 13, 13 are arranged on both sides of the bus lines 12 along their longitudinal direction, and each connector terminal 13 has a bent portion 13a in the middle between one end and the other end of the connector terminal 13. The chip components 14, 14 are disposed in such a way that each chip component 14 bridges one end of each connector terminal 13 and the bus line 12 to be connected to the connector terminal 13 and the bus line 12 using a conductive adhesive. The chip component 14 is molded with the molding material 15. Specifically, the molding material 15 molds at least the periphery of connection spots between the connector terminal 13 of the chip component 14 and bus line 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a joint connector having a component protection structure and a method for manufacturing the joint connector.

  In recent years, many communication devices are installed in automobiles. Along with the increase in the number of communication devices to be mounted and higher functionality, it is necessary to transmit and receive a large amount of control signals to a plurality of communication devices. As a result, the number of cables connected to the communication device increases, and a long time is required for connection work. Further, when a failure occurs in the communication device or the connection cable, the restoration work is often difficult.

  Recently, a communication device has a communication function capable of transmitting and receiving information based on a predetermined protocol, and a control signal to each communication device is multiplexed on a common bus wiring and transmitted. The number can be reduced.

  Therefore, a joint connector has been proposed in order to multiplex and transmit control signals to a plurality of communication devices on a common bus wiring (see Patent Document 1).

  FIG. 9 is an exploded perspective view of a conventional joint connector used in conventional CAN (Control Area Network) communication. The conventional joint connector 41 includes a housing 43, a joint circuit 45, and a termination resistor circuit 30. The joint circuit 45 and the termination resistor circuit 30 are accommodated in the housing body 41a.

  The housing 43 covers a housing body 41a having a substantially rectangular parallelepiped lower opening, a plurality of connector fitting parts 43a, 43a,... Opened at the top of the housing body 41a, and a lower opening of the housing body 41a. And a lower cover 43b. The housing main body 41a and the lower cover 43b are integrally molded products made of an insulating resin material.

  The joint circuit 45 includes a bus wiring 46, a plurality of connector terminals 45a, 45a,... Branched and connected to the bus wiring 46 in a substantially vertical direction, and a plurality of chip components 48, 48,. Each chip component 48 is connected so as to traverse each connector terminal 45 a of the bus wiring 46. Among the plurality of connector fitting portions 43a, 43a,..., Some are used as bus connection ports for connecting the bus wiring 46 for multiplex communication, and the rest are used as connection ports for connecting communication devices. Yes. As shown in FIG. 9, the plurality of connector terminals 45a, 45a,..., The bus wiring 46, and the communication device are electrically connected via female connectors 50 that are fitted at both ends of each connector fitting portion 43a. ing.

  The termination resistor circuit 30 is a circuit connected to the joint circuit 45 in order to prevent inconvenience due to signal reflection at the termination of the bus wiring 46 when the joint connector 41 is used at the termination of the bus wiring 46. . Termination resistor circuit 30 includes a second resistor 32 connected in series to first resistor 31 and a capacitor 33 connected between first resistor 31 and second resistor 32.

The joint circuit 45 includes a plurality of connector terminals 45a, 45a,... Incorporated in the respective connector fitting portions 43a, 43a,. , 43a,... Are integrated in a chain as a branch connection form for electrically connecting a plurality of connector terminals 45a, 45a,. Therefore, as compared with the case where the connector terminals are individually soldered to the printed wiring board, the time required for quality control of the soldered portion is not required, and the productivity can be greatly improved.
JP 2003-123919 A

  However, in the joint connector 41 disclosed in Patent Document 1, since the periphery of the chip component 48 is hollow, for example, when vibration is applied to the joint connector 41 due to traveling of an automobile, the connector terminal 45a is connected to the chip component 48. There is a problem in that vibration propagates and a crack is generated in the chip component 48 or the connection part of the chip component 48 is peeled off from the connector terminal 45 a and the bus wiring 46.

Further, in the conventional joint connector 41, conductive foreign matters such as dust enter from the connector fitting portion 43a and adhere between the connector terminal 45a and the bus wiring 46, and the connector terminal 45a and the bus wiring 46 may be short-circuited. was there.
Further, Patent Document 1 discloses that the chain bus bar and the bus bar are accommodated and held in the connector housing by insert molding at the time of injection molding of the connector housing made of an insulating resin material. Since the injection pressure directly acts on the chip component, there is a possibility that the chip component may crack or the separation between the chip component and the conductor may occur.

  This invention is made | formed in view of such a situation, Even if it is a case where a chip component is protected by setting it as the structure which molds a chip component and vibration is added to a joint connector, it originates in the vibration. An object of the present invention is to provide a joint connector that can absorb stress and prevent the chip component from cracking or preventing the chip component and the conductor from being peeled from each other.

  In addition, the present invention protects the connection part of the chip component by molding the connector part of the chip part and the connection part of the bus wiring, and the chip part can be connected even when vibration is applied to the joint connector. An object of the present invention is to provide a joint connector that can prevent peeling from a connector terminal and bus wiring.

  Furthermore, the present invention has a structure in which a chip component is mounted on one end of the connector terminal and a bent portion is provided between the one end and the other end of the connector terminal, so that the connection end (the other end) of the connector terminal is in a desired direction. It is an object of the present invention to provide a joint connector.

  Furthermore, this invention aims at provision of the joint connector which can improve productivity using reflow solder by comprising a housing with a heat resistant resin.

  Furthermore, according to the present invention, it is not necessary to apply heat for melting the solder compared to the connection by soldering by using a conductive adhesive to connect the chip component to the connector terminal and the bus wiring. Therefore, an object of the present invention is to provide a joint connector that does not require consideration of the heat resistance of the housing material.

  Furthermore, the present invention provides a method for manufacturing a joint connector regardless of a method for forming a housing by incorporating connector terminals and bus wiring into the housing after molding the housing and connecting chip components to the connector terminals and bus wiring. For the purpose of provision.

  Furthermore, according to the present invention, even when the housing is formed by injection molding, since the chip component is molded before the molding, the injection pressure does not directly act on the chip component, and the chip component is cracked. It is an object of the present invention to provide a method for manufacturing a joint connector capable of preventing occurrence or peeling at a joint between a chip component and a conductor.

  Furthermore, the present invention is a plate-like conductor in which the connector terminal and the bus wiring are integrally formed, and the plate-like conductor is incorporated into the inside of the housing in a state where the middle between the one end and the other end of the connector terminal is bent. It is an object of the present invention to provide a method for manufacturing a joint connector in which a plurality of connector terminals can be bent at a time by bending a shaped conductor and manufacturing efficiency is improved.

  In the joint connector according to the first invention, a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings and the chip parts are connected to a housing. In the accommodated joint connector, the chip component is molded.

  In the first invention, a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the chip parts are molded. And the chip component is accommodated in the housing in a molded state. In this way, since the chip component is protected by the mold, even when vibration is applied to the joint connector, the stress caused by the vibration is absorbed, and the chip component is cracked or Prevents peeling at the joint with the conductor.

  The joint connector according to a second aspect of the present invention is characterized in that the connector terminal of the chip component and the connection portion of the bus wiring are molded.

  In the second invention, the connector terminal of the chip component and the connection portion of the bus wiring are molded. As described above, since the connector part of the chip component and the connection part of the bus wiring are protected by the mold, even when vibration is applied to the joint connector, the stress due to the vibration is absorbed and the chip component is Prevents peeling from the connector terminal and bus wiring. Further, since the connector part of the chip component and the connection point of the bus wiring are protected by the mold, there is no possibility that the bus wiring and the connector terminal are short-circuited.

  A joint connector according to a third aspect of the invention is characterized in that the connector terminal has the chip component mounted at one end and a bent portion between the one end and the other end.

  In the third invention, the chip component is mounted on one end of the connector terminal, and the bent portion is provided between the one end and the other end of the connector terminal. Thereby, the connection end (other end) of a connector terminal can be made into a desired direction, and it becomes possible to apply to various joint connectors.

  The joint connector according to a fourth aspect of the present invention is characterized in that the housing is a heat resistant resin.

  In the fourth invention, the housing is made of a heat resistant resin. Thereby, productivity can be improved using reflow solder.

  A joint connector according to a fifth aspect of the present invention is characterized in that the chip component is connected to the connector terminal and the bus wiring using a conductive adhesive.

  In the fifth invention, the chip component is connected to the connector terminal and the bus wiring using the conductive adhesive. As a result, it is not necessary to apply heat for melting the solder as compared with the connection by solder, and it is not necessary to consider the heat resistance of the housing material, so that a low-cost housing resin can be used.

  In the joint connector manufacturing method according to the sixth aspect of the invention, a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings and the chip parts are connected. In the manufacturing method of the joint connector accommodated in the housing, the assembling step of incorporating the connector terminal and the bus wiring into the housing, the step of connecting the chip component to the connector terminal and the bus wiring, And a step of molding a chip component.

  In the sixth invention, first, the connector terminal and the bus wiring are incorporated in the housing, and then the chip component is connected to the connector terminal and the bus wiring. Then, the chip part is molded. As described above, after forming the housing, the connector terminal and the bus wiring are incorporated into the housing, and the chip component is connected to the connector terminal and the bus wiring. Therefore, any method of forming the housing such as injection molding may be used.

  According to a seventh aspect of the present invention, there is provided a joint connector manufacturing method in which a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings, and the chip parts. In the method of manufacturing a joint connector housed in a housing, the step of connecting the chip component to the connector terminal and the bus wiring, the step of molding the chip component, the connector terminal, the bus wiring and the chip component And an assembling step of incorporating the inside of the housing.

  In the seventh invention, first, the chip component is connected to the connector terminal and the bus wiring, and then the chip component is molded. Then, the connector terminal, the bus wiring, and the chip component are incorporated into the housing.

  According to an eighth aspect of the present invention, there is provided a joint connector manufacturing method, wherein the connector terminal and the bus wiring are integrally formed plate-shaped conductors, and the assembling step includes connecting the plate-shaped conductor to one end of the connector terminal. It is incorporated in the inside of the housing in a bent state between the other end.

  In the eighth invention, the connector terminal and the bus wiring are integrally formed with the plate-like conductor, and the plate-like conductor is incorporated into the housing in a state where the middle between the one end and the other end of the connector terminal is bent. Thus, by bending the plate-like conductor, a plurality of connector terminals can be bent at a time, and the manufacturing efficiency is improved.

  According to a ninth aspect of the present invention, there is provided a joint connector manufacturing method in which a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings, and the chip parts. In the method of manufacturing the joint connector accommodated in the housing, the housing is formed integrally with the connector terminal and the bus wiring so that the connector terminal and a part of the bus wiring are exposed, and the exposed The method includes a step of connecting the chip component to a connector terminal and the bus wiring, and a step of molding the chip component.

  In the ninth invention, first, the housing is formed integrally with the connector terminal and the bus wiring so that a part of the connector terminal and the bus wiring is exposed. Next, chip components are connected to the exposed connector terminals and bus wiring. Then, the chip part is molded. As described above, when the housing is integrally formed, the chip parts can be mounted after the housing is formed by exposing a part of the connector terminals and the bus wiring. Therefore, the injection pressure does not directly act on the chip component, and it is possible to prevent the chip component from cracking or peeling from occurring at the joint between the chip component and the conductor.

  In the joint connector manufacturing method according to the tenth invention, a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings and the chip parts are connected. In the method of manufacturing a joint connector housed in a housing, the step of connecting the chip component to the connector terminal and the bus wiring, the step of molding the chip component, the connector terminal, the bus wiring and the chip component And a step of forming the housing for housing the resin by injection molding.

  In the tenth invention, first, the chip component is connected to the connector terminal and the bus wiring, and then the chip component is molded. And the housing which accommodates a connector terminal, bus wiring, and a chip component is formed by injection molding. Thus, even when the housing is formed by injection molding, since the chip component is molded before the molding, the injection pressure does not directly act on the chip component, and the chip component is cracked. Further, it is possible to prevent peeling at the joint portion between the chip component and the conductor.

  According to the present invention, since the chip component is molded, the chip component can be protected. For example, even when vibration is applied to the joint connector, the stress caused by the vibration can be absorbed, cracks occur in the chip component, and peeling occurs at the joint between the chip component and the conductor. Can be prevented.

  According to the present invention, since the connection part between the connector terminal of the chip component and the bus wiring is molded, the connection part of the chip part can be protected. Therefore, even when vibration is applied to the joint connector, the chip component can be prevented from peeling off from the connector terminal and the bus wiring, and the bus wiring and the connector terminal can be prevented from being short-circuited. Can do.

  According to the present invention, since the chip component is mounted on one end of the connector terminal and has a bent portion in the middle between the one end and the other end of the connector terminal, the connection end (the other end) of the connector terminal is arranged in a desired direction. It can be. Thereby, it becomes possible to apply to various joint connectors, and the use application spreads.

  According to the present invention, when the housing is made of a heat-resistant resin, productivity can be improved by using reflow soldering.

  According to the present invention, when the chip component is connected to the connector terminal and the bus wiring using the conductive adhesive, heat for melting the solder can be applied as compared with the connection using the solder. It becomes unnecessary, and it becomes unnecessary to consider the heat resistance of the housing material.

  According to the present invention, after forming the housing, the connector terminals and the bus wiring are incorporated into the housing, and the chip parts are connected to the connector terminals and the bus wiring. Therefore, any forming method can be used for forming the housing. No cracks occur in the chip component during the manufacturing process, and no peeling occurs at the joint between the chip component and the conductor.

  According to the present invention, even when the housing is formed by injection molding, since the chip component is molded before the molding, the injection pressure does not directly act on the chip component and the manufacturing process is in progress. In addition, it is possible to prevent the chip component from being cracked or the chip part and the conductor from being separated from each other.

  According to the present invention, the connector terminal and the bus wiring are integrally formed plate-like conductors, and the plate-like conductor is incorporated into the housing in a state where the middle between the one end and the other end of the connector terminal is bent. By bending the plate-like conductor, it is possible to bend a plurality of connector terminals at a time, thereby producing excellent effects such as improving the production efficiency.

  Hereinafter, the present invention will be described in detail with reference to the drawings illustrating embodiments thereof.

(Embodiment 1)
1 is a perspective view of a joint connector according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of the joint connector according to Embodiment 1 of the present invention. Note that the connection portion with the communication device corresponds to the lower side of each figure.
The joint connector 10 according to the first embodiment of the present invention includes a housing 11, a bus wiring 12, a plurality of connector terminals 13, 13,..., A plurality of chip components 14, 14,. Prepare.

  The housing 11 has a substantially rectangular parallelepiped shape having openings 11a and 11b at the upper and lower portions, respectively, and accommodates the bus wiring 12, the connector terminals 13, 13,... And the chip components 14, 14,. One opening 11a is used as a connection port for connecting a communication device, and the connection ends of the connector terminals 13, 13,... Are connected to the connection portion of the communication device through the opening 11a. The other opening 11b is used as a window for mounting the chip component 14 and molding with the molding material 15, as will be described later.

  The chip component 14 functions as various filters depending on its configuration. For example, the chip component 14 is a chip resistor and a chip coil, and the chip resistor and the chip coil are connected in parallel to function as a noise filter. Further, the chip component 14 functions as a low-pass filter by connecting the chip resistor and the chip capacitor in series. As a result, it is possible to remove high frequency noise mixed in the signal input to the connector terminal 13.

  The connector terminals 13, 13,... Are arranged on both sides of the bus wiring 12 in the longitudinal direction. Each connector terminal 13 has a chip component 14 mounted on one end thereof, and is intermediate between the one end and the other end. Has a bent portion 13a. By providing the bent portion 13a, the connection end (the above-mentioned other end) of the connector terminal 13 can be set in a desired direction. In this example, an example in which the angle of the bent portion 13a is set to approximately 90 ° so that the mounting surface of the chip component 14 and the connection end is approximately 90 ° is shown, but the angle of the bent portion 13a is limited to this. It is not something.

  Each chip component 14 is disposed so as to cross one end of the connector terminal 13 and the bus wiring 12. A connection pad (not shown) is provided on the back surface of each chip component 14, and each chip component 14 is disposed at a corresponding position in a state where the conductive adhesive 16 is applied to the connection pad. 13 and the bus wiring 12.

  In the present embodiment, the chip component 14 and its periphery are molded by the molding material 15. More specifically, the molding material 15 molds at least the connection portion of the connector terminal 13 of the chip component 14 and the bus wiring 12. In this example, the molding material 15 is injected from the opening 11b to close the opening 11b. As a molding method, various methods such as a transfer mold and a potting mold can be applied.

  As described above, since the chip component 14 is molded by the molding material 15, compared to the conventional configuration in which the periphery thereof is hollow, for example, when vibration is applied to the joint connector 10 by traveling of an automobile. However, the stress caused by the vibration can be absorbed by the molding material 15, and the chip component 14 can be prevented from being cracked or separated from the connector terminal 13 and the bus wiring 12. .

  Further, even when conductive foreign matter such as dust is mixed from the opening 11a, the chip components 14, 14,... Are molded by the molding material 15, and the connector terminals 13 of the chip components 14 and the connection points of the bus wiring 12 are connected. Therefore, there is no possibility that the connector terminal 13 and the bus wiring 12 are short-circuited. Therefore, the chip component 14 can maintain the function as various filters.

  Next, a method for manufacturing the joint connector 10 having the above-described configuration will be described. FIG. 3 is an explanatory diagram for explaining a method of manufacturing the joint connector according to Embodiment 1 of the present invention.

  In the joint connector manufacturing method according to the first embodiment of the present invention, first, the housing 11 is formed by injection molding, and a plurality of connector terminals 13, 13,... (FIG. 3A).

  As shown in FIG. 4, the connector terminals 13, 13,... And the bus wiring 12 are plate conductors (lead frames) 17 integrally formed by press molding or the like, and the plate conductors 17 are connected to the connector terminals 13, 13. .. Are assembled into the housing 11 with the middle between one end and the other end bent.

  In this example, the connector terminals 13, 13,... Are arranged in duplicate on both sides along the longitudinal direction of the bus wiring 12, and the connector terminals 13, 13 on each side are connected to the tie bar 17a. Yes. The tie bar 17a is a dummy component and is cut as will be described later.

  In this way, by using the plate-like conductor 17 in which the connector terminals 13, 13,... And the bus wiring 12 are integrally formed, the plate-like conductor 17 is bent, so that the plurality of connector terminals 13, 13,. Can be bent and the manufacturing efficiency is improved.

  Next, a conductive adhesive 16 is applied to the back surfaces (connection surfaces) of the chip components 14, 14,... And arranged so as to cross one end of the connector terminal 13 and the bus wiring 12. It connects to the terminal 13 and the bus wiring 12 (FIG. 3B). Thus, by using the conductive adhesive 16, it is not necessary to apply heat for melting the solder as compared with the connection by solder, and it is not necessary to consider the heat resistance of the housing material. When a heat resistant resin is used as the housing 11, instead of the conductive adhesive 16, the connection of each chip component 14 to the connector terminal 13 and the bus wiring 12 described above (FIG. 3B) Reflow solder can be used. By using reflow soldering, it is possible to reduce soldering defects as compared with flow soldering using fluidized solder.

  Then, the molding material 15 is injected from the upper opening 11 b provided in the housing 11, and the chip component 14 (at least around the connection portion of the connector terminal 13 of the chip component 14 and the bus wiring 12) is molded with the molding material 15 ( FIG. 3 (c)). Thereby, even if the adhesive property of the conductive adhesive 16 is weak, the chip component 14 is prevented from being detached from the connector terminal 13 and the bus wiring 12 by molding the chip component 14 with the molding material 15. To do. In addition, various methods, such as a transfer mold and a potting mold, can be applied as a molding method, and the method is appropriately selected according to the situation.

  Then, the tie bar 17a of the plate-like conductor 17 is cut to divide the connector terminals 13, 13,... Into individual terminals (FIG. 3 (d)). Since each connector terminal 13 is connected to the bus wiring 12 via the chip member 14 and further protected by the molding material 15, each connector terminal 13 is separated even when the tie bar 17a is cut. Without being divided into individual terminals.

  As described above, in the manufacturing method according to the present embodiment, the connector terminals 13, 13,... And the bus wiring 12 are incorporated into the housing 11 after the housing 11 is molded, and the connector terminals 13, 13,. Since the chip parts 14, 14,... Are connected to the housing 11, any forming method such as injection molding may be used for the housing 11. That is, in this example, the housing 11 is formed by injection molding, but the method of forming the housing 11 is not questioned, and the method of forming the housing 11 may be selected according to the application.

  As shown in FIG. 8A, the housing 11 may be formed integrally with the connector terminals 13, 13,... And the bus wiring 12 (for example, injection molding). When integrally formed, the connector terminals 13, 13,... And a part of the bus wiring 12 (corresponding to the opening 11a) are exposed. Then, the chip components 14, 14,... Are connected to the exposed connector terminals 13, 13,. The subsequent steps are the same as described above.

(Embodiment 2)
In Embodiment 1, each chip component 14 is connected to the connector terminal 13 and the bus wiring 12 after being assembled in the housing 11, and the chip component 14 is molded. However, each chip component is used as the connector terminal and the bus wiring. After connecting and molding the chip component, it may be incorporated into the housing. This is the second embodiment.

5 is a perspective view of a joint connector according to Embodiment 2 of the present invention, and FIG. 6 is a cross-sectional view of the joint connector according to Embodiment 2 of the present invention. Note that the connection portion with the communication device corresponds to the lower side of each figure.
The joint connector 20 according to the second embodiment of the present invention includes a housing 21, a bus wiring 12, a plurality of connector terminals 13, 13,..., A plurality of chip components 14, 14,. Prepare.

  The housing 21 has a substantially rectangular parallelepiped shape having an opening 21a in the lower portion, and accommodates the bus wiring 12, the connector terminals 13, 13,... And the chip components 14, 14,. The opening 21a is used as a connection port for connecting a communication device, and the connection ends of the connector terminals 13, 13,... Are connected to the connection portion of the communication device through the opening 21a.

  In the present embodiment, the chip component 14 is molded by the molding material 25. More specifically, the molding material 25 molds at least the periphery of the connection portion between the connector terminal 13 of the chip component 14 and the bus wiring 12. In this example, unlike Embodiment 1, since molding is performed before incorporation into the housing, it is not necessary to provide an opening for injecting molding material at the top of the housing 21. Since other configurations are the same as those of the first embodiment, the corresponding parts are denoted by the same reference numerals and detailed description thereof is omitted.

  In this way, since the chip component 14 is molded by the molding material 25, compared to the conventional configuration in which the periphery is hollow, for example, when vibration is applied to the joint connector 10 due to traveling of an automobile. However, the stress caused by the vibration can be absorbed by the molding material 25, and the chip component 14 can be prevented from being cracked or separated from the connector terminal 13 and the bus wiring 12. .

  Further, even when conductive foreign matter such as dust is mixed from the opening 21a, the periphery of the chip components 14, 14,... Is molded by the molding material 25, and the connector terminals 13 and the bus wiring 12 of the chip components 14 are connected. Since the connection portion is protected, there is no possibility that the connector terminal 13 and the bus wiring 12 are short-circuited. Therefore, the chip component 14 can maintain the function as various filters.

  Next, a method for manufacturing the joint connector 20 having the above-described configuration will be described. FIG. 7 is an explanatory diagram for explaining a method of manufacturing a joint connector according to Embodiment 2 of the present invention.

  In the joint connector manufacturing method according to the second embodiment of the present invention, first, the conductive adhesive 16 is applied to the back surfaces (connection surfaces) of the chip components 14, 14,..., One end of the connector terminal 13 and the bus wiring 12. Each chip component 14 is connected to the connector terminal 13 and the bus wiring 12 by arranging them so as to cross each other (FIG. 7A). In this example, as in the first embodiment, as shown in FIG. 4, a plate-like conductor (lead frame) 17 in which the connector terminals 13, 13,... And the bus wiring 12 are integrally formed is used.

  Next, the chip component 14 (at least around the connection portion of the connector terminal 13 of the chip component 14 and the bus wiring 12) is molded with the molding material 25 (FIG. 7B). The molding method and the type of the molding material 25 are the same as in the first embodiment, and various selections are possible.

  Then, the plate-like conductor 17 is bent in the middle between one end and the other end of the connector terminals 13, 13,... And then the tie bar 17a of the plate-like conductor 17 is cut so that the connector terminals 13, 13,. It divides into terminals (FIG. 7C) and is assembled in the housing 21 in the state of FIG. 7C (FIG. 7D). As shown in FIG. 8B, the housing 21 can be formed integrally with the connector terminals 13, 13,... And the bus wiring 12 (for example, injection molding).

  As described above, in the manufacturing method according to the present embodiment, even when the housing 21 is formed by injection molding, the chip components 14, 14,... The pressure does not directly act on the chip parts 14, 14,..., And the chip parts 14, 14,... Crack, or the joint between the chip parts 14, 14,. Can be prevented. That is, in this example, the housing 21 is formed by injection molding. However, as in the first embodiment, the method for forming the housing 21 is not limited, and the method for forming the housing 21 is selected according to the application. Is possible.

  Needless to say, the joint connector according to the present invention can also be applied to connection between bus wiring and a communication terminal device in a network using a multiplex communication protocol other than CAN communication.

  Moreover, although the joint connector which concerns on this invention demonstrated the joint connector for multiplex communication to an example, it is not limited to the multiplex communication.

It is a perspective view of the joint connector which concerns on Embodiment 1 of this invention. It is sectional drawing of the joint connector which concerns on Embodiment 1 of this invention. It is explanatory drawing for demonstrating the manufacturing method of the joint connector which concerns on Embodiment 1 of this invention. It is a top view of a plate-shaped conductor (lead frame). It is a perspective view of the joint connector which concerns on Embodiment 2 of this invention. It is sectional drawing of the joint connector which concerns on Embodiment 2 of this invention. It is explanatory drawing for demonstrating the manufacturing method of the joint connector which concerns on Embodiment 2 of this invention. It is sectional drawing which shows another example of the joint connector which concerns on this invention. It is a disassembled perspective view of the conventional joint connector used by the conventional CAN (Control Area Network) communication.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 20 Joint connector 11, 21 Housing 11a, 11b, 21a Opening part 12 Bus wiring 13 Connector terminal 13a Bending part 14 Chip components 15, 25 Mold material 16 Conductive adhesive 17 Plate-shaped conductor (lead frame)
17a tie bar

Claims (10)

In a joint connector in which a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings and the chip parts are accommodated in a housing,
The joint connector, wherein the chip component is molded. The joint connector according to claim 1, wherein a connection portion of the connector part of the chip component and the bus wiring is molded. The connector terminal is
The chip component is mounted on one end,
The joint connector according to claim 1, further comprising a bent portion between the one end and the other end. The joint connector according to claim 1, wherein the housing is a heat resistant resin. The chip component is
The joint connector according to any one of claims 1 to 3, wherein the joint connector is connected to the connector terminal and the bus wiring by using a conductive adhesive. In a manufacturing method of a joint connector in which a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings and the chip parts are accommodated in a housing. ,
An assembly step of incorporating the connector terminal and the bus wiring into the housing;
Connecting the chip component to the connector terminal and the bus wiring;
And a step of molding the chip component. In a manufacturing method of a joint connector in which a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings and the chip parts are accommodated in a housing. ,
Connecting the chip component to the connector terminal and the bus wiring;
Molding the chip component;
An assembly step of incorporating the connector terminal, the bus wiring, and the chip component into the housing. The connector terminal and the bus wiring are
An integrally formed plate-shaped conductor,
The incorporation step is
The method for manufacturing a joint connector according to claim 6 or 7, wherein the plate-like conductor is incorporated in the housing in a state where the middle between one end and the other end of the connector terminal is bent. In a manufacturing method of a joint connector in which a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings and the chip parts are accommodated in a housing. ,
Forming the housing integrally with the connector terminal and the bus wiring so that a part of the connector terminal and the bus wiring is exposed;
Connecting the chip component to the exposed connector terminal and the bus wiring;
And a step of molding the chip component. In a manufacturing method of a joint connector in which a plurality of connector terminals and bus wirings for connecting a plurality of communication devices are connected via a plurality of chip parts, and the connector terminals, the bus wirings and the chip parts are accommodated in a housing. ,
Connecting the chip component to the connector terminal and the bus wiring;
Molding the chip component;
Forming the housing for housing the connector terminal, the bus wiring, and the chip component by injection molding.

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