JP2008036921A - Transfer press apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer press apparatus which, being a press apparatus for conducting a transfer on a resin plate by a stamper arranged on a hot table, can certainly hold the stamper and, particularly, can make the transfer by the stamper favorable. <P>SOLUTION: In the transfer press apparatus 11 that conducts the transfer on the resin plate P by the stamper 31 arranged on the hot table 24 there is arranged the stamper holding mechanism consisting of: a plurality of the suction grooves 29, 30 arranged on the hot table 24 correspondingly to the non-pressurized region 31b of the stamper 31; the air suction passages 32, 33 provided in either part of the suction grooves 29, 30; and the air suction apparatus 40 connected to the air suction passages 32, 33. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a transfer press apparatus, and more particularly to a stamper holding mechanism of a transfer press apparatus.

As a stamper holding mechanism and attachment device of a conventional thermal transfer press apparatus, those described in Patent Document 1 are known. In Patent Document 1, a through hole 231 is formed in the stamper holder 23 in a region corresponding to the entire surface of the stamper 24. The effect that the stamper 24 can be uniformly adsorbed over the entire surface by performing suction from the through hole 231 is described. However, the stamper mounting device described in Patent Document 1 has a through-hole 231 provided on the back surface of the transfer surface of the stamper 24, so that the portion of the through-hole 231 becomes a depression and is not transferred well. . Further, since the plate thickness of the general stamper 24 is about 0.3 mm, there is a problem that the stamper itself is deformed by the through hole 231. Furthermore, a method described in Patent Document 2 is known as a method for sucking and holding a stamper of a light guide plate mold by injection molding. However, the thing of patent document 2 cannot exhibit sufficient attraction | suction force since the air path is not formed in the whole outer peripheral direction of a stamper.

JP 2006-175617 A (Claim 1, FIG. 3) JP-A-11-34120 (Claims 1, 5 and 6)

Therefore, an object of the present invention is to provide a transfer press apparatus that can reliably hold a stamper in a press apparatus that performs transfer onto a resin plate using a stamper disposed on a hot plate. It is another object of the present invention to provide a transfer press apparatus that can improve transfer with a stamper.

The transfer press apparatus according to claim 1 of the present invention is a transfer press apparatus for transferring to a resin plate by a stamper provided on the hot plate, and is provided on the hot plate corresponding to the non-pressurized area of the stamper. A stamper holding mechanism comprising a plurality of suction grooves, an air suction passage provided in any part of the suction groove, and an air suction device connected to the air suction passage is provided. .

The transfer press device according to claim 2 of the present invention is a press device for transferring to a resin plate by a substantially rectangular stamper disposed on a hot plate, for holding the stamper to prevent the stamper from being lifted or dropped in the vertical direction. A stamper holding mechanism is provided in which a stamper holder and a positioning stamper holder that determines only the position of the stamper are separately provided.

According to a third aspect of the present invention, there is provided a transfer press apparatus according to a third aspect of the present invention, wherein the holding stamper holder is attached to the hot plate by the three sides of the stamper. A stamper holding mechanism is provided which is fixed in correspondence with the outer peripheral edge portion and is attached by moving the stamper along the surface of the hot plate from the remaining hot plate on one side.

According to a first aspect of the present invention, there is provided a transfer press device comprising: a plurality of suction grooves disposed on a hot plate corresponding to a non-pressurized region of a stamper; and an air provided in any part of the suction grooves. Since the stamper holding mechanism including the suction passage and the air suction device connected to the air suction passage is provided, the transfer to the resin plate can be performed more securely with the stamper held on the hot plate. .

In the transfer press device according to claim 2 of the present invention, a holding stamper holder for preventing the stamper from being lifted or dropped in the vertical direction and a positioning stamper holder for determining only the position of the stamper are provided separately. Since the stamper holding mechanism is provided, the stamper can be accurately positioned while simplifying the structure of each stamper holder.

Further, in the transfer press apparatus according to claim 3 of the present invention, the holding stamper holder is fixed in correspondence with the outer peripheral edge portions of the three sides of the stamper attached to the hot plate, and heat is applied from the remaining hot plate on one side. Since the stamper holding mechanism for moving and attaching the stamper along the surface of the plate is disposed, the stamper can be securely attached to the hot plate without bending, and the stamper is not damaged.

An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a longitudinal sectional view of a transfer press apparatus according to this embodiment. FIG. 2 is a plan view of a hot plate used in the transfer press apparatus in the present embodiment. FIG. 3 is an enlarged perspective view of the stamper holder in the present embodiment.

As shown in FIG. 1, in the transfer press device 11, a press cylinder ram 13 (not shown) as a press device is attached to an upper plate 12 as a movable plate, and the upper plate 12 is a lower plate 14 as a fixed plate. Can be moved up and down. A heat plate 18 as a first heat plate is disposed on the lower surface of the upper board 12 via a heat insulating plate 16 and a rubber film 17 as an elastic body. As the rubber film 17 in this embodiment, heat-resistant silicon rubber is preferably used. The reason why the rubber film 17 is disposed under the hot plate 18 in this way is mainly intended to satisfactorily correct the subtle parallelism of the hot plate 18. In this embodiment, the upper board 12 does not have a temperature control function. However, the temperature may be controlled by forming a passage through which the medium flows in the upper board. Further, a side wall portion 19 in which a vacuum chamber 15 is formed during molding is slidably disposed so as to surround the periphery of the hot plate 18. A bracket 20 is fixed to the outer peripheral portion of the ram 13, and a spring 21 is attached between the lower surface of the bracket 20 and the upper surface of the side wall portion 19.

On the other hand, a hot plate 24 as a second hot plate is disposed on the upper surface of the lower board 14 via a heat insulating plate 22 and a rubber film 23. And the side wall part 25 in which the vacuum chamber 15 is formed at the time of shaping | molding is formed so that the circumference | surroundings of the hot plate 24 may be surrounded. An O-ring 26 is attached to the entire upper surface of the side wall portion 25 on the lower plate 14 side. When the upper board 12 is lowered toward the lower board 14, the lower surface of the side wall portion 19 and the upper surface of the side wall portion 25 are brought into contact with each other and sealed by the O-ring 26. It is supposed to be formed. Further, the press device 11 has a structure in which the spring 21 is compressed via the bracket 20 by further lowering the ram 13 so that the upper board 12 can further be lowered toward the lower board 14.

The side wall 25 on the lower plate 14 side is provided with a ventilation passage 27 connected to a vacuum suction device (not shown) provided outside in order to vacuum the inside of the vacuum chamber 15. Moreover, although the press apparatus 11 comprises mechanisms, such as a bed and a tie bar, similar to a general press apparatus, illustration and description thereof are omitted. Note that the pressurizing device of the press device may be below the lower board, or other driving means such as an electric motor may be used. Further, the structure of the vacuum chamber is not limited to that of this embodiment, and the vacuum chamber is not essential in the present invention.

Next, the hot plates 18 and 24 of the press apparatus 11 will be described with reference to FIGS. Since the structure of the hot plate 18 on the upper board 12 side and the hot plate 24 on the lower board 14 side are substantially the same, only the hot plate 24 on the lower board 14 side will be described. As shown in FIG. 2, the hot plate 24 is obtained by processing one iron plate. The hot plate central portion 28 is a portion to which a pressing force is applied when performing transfer molding, and the stamper 31 can be disposed. In the present embodiment, the thickness of the hot plate central portion 28 is 11 mm. As shown in FIG. 1, a plurality of linear passages 34 through which steam as a heating medium and cooling water as a cooling medium can flow are arranged inside the hot plate 24. The longitudinal end portion of the hot plate 24 extends in the hot plate width direction as compared with the hot plate central portion 28 and the plate thickness is thicker than the hot plate central portion 28. . An extended portion on one side of the portion of the hot plate central portion 28 is an introduction side manifold portion 35, and an introduction side branch passage 36 having a large diameter is provided in a direction orthogonal to the passage 34. . The introduction-side branch passage 36 is connected to a steam supply device, a cooling water supply device, and a compressed air supply device (all not shown) via an external conduit 39 and a valve (not shown). And compressed air can be selectively supplied.

The extending portion on the other side of the hot plate central portion 28 is a discharge side manifold portion 42 having a thicker plate thickness than the portion of the hot plate central portion 28, and the discharge side branch passage 43 having a large diameter is provided therein. It is provided in a direction orthogonal to the passage 34. The discharge side branch passage 43 is connected to an external conduit 46, and is connected to a steam supply device, a cooling water supply device, and a compressed air supply device (all not shown) by a valve (not shown) outside the press device 11. It is provided so that it can be switched and connected.

As described above, the heat plate central portion 28 has a plurality of linear passages communicating from the introduction side branch passage 36 of the introduction side manifold portion 35 toward the discharge side branch passage 43 of the discharge side manifold portion 42. 34 are provided parallel to the same depth from the surface. Therefore, the heat medium such as steam and water flowing through the passage 34 in the hot plate 24 flows through the linear passage 34, and the flow velocity is hardly lowered in the middle. In the present embodiment, one or two passages 34 are formed outside the passages 34 except for the lower portions of the grooves 29b and 30b of the suction grooves 29 and 30 described later. The hot plate 24 is made of hardened and tempered steel or brihardened steel having excellent specularity and wear resistance. The plate thickness of the hot plate 24 is 11 mm in this embodiment. The diameter of the passage 34 in the central portion of the hot plate 28 is 5.5 mm, and the distance between the passages 34 (the distance between the side wall portion of the passage 34 and the side wall surface of the other passage 34 is 8 mm. The distance between the surface of the plate 24 and the side wall of the passage 34 is 3 mm, and the number of the passages 34 in the hot plate 24 is such that 40 passages 34 are formed in a direction perpendicular to the hot plate width direction. And covers substantially the entire back surface of the stamper 31.

The stamper 31 performs transfer to an optical product such as a light guide plate, and has a substantially rectangular outer shape. In the present embodiment, the stamper 31 has a rectangular shape, but the outer peripheral edge portion 31a that is each side may be uneven, and the shape is not limited. As the stamper 31, a nickel stamper having a plate thickness of 0.3 mm in which a fine uneven pattern (including protrusions, pits, grooves, etc.) is formed in the transfer region 31c excluding the outer peripheral portion 31b on the surface is used. The stamper 31 may be made of other metal, and the thickness of the stamper 31 is about 0.2 mm to 0.7 mm. Further, the back surface of the stamper may be coated with a metal having a higher thermal conductivity than nickel, or an elastic sheet or the like may be disposed between the hot plate and the stamper. In this embodiment, the transfer region 31c substantially matches the outer shape of the resin plate P, corresponds to the pressurizing region, and the outer peripheral portion 31b matches the non-pressurizing region. However, a substantially entire surface is a transfer region, and depending on the size of the resin plate, a stamper in which the transfer region includes a non-pressurized region or a stamper other than the transfer region is assumed. Further, in the present embodiment, the stamper 31 is disposed on the surface of the hot plate 18 or 24 on the upper plate 12 side or the lower plate 14 side, respectively, but only on one of the hot plates. Also good.

The heat plate 24 on the side of the lower plate 14 will be described as an example. On the surface of the heat plate 24, the resin plate P is placed on the surface of the heat plate 28, and the surrounding area excluding the pressurizing region where the pressure is actually applied. A plurality of suction grooves 29 and 30 are formed in the non-pressurized region. Specifically, the two grooves 29 a and 29 a of the suction groove 29 are provided in the introduction side manifold portion 35 in a direction parallel to the introduction side branch passage 36. The remaining two grooves 29b and 29b are provided in the vicinity of both side surfaces 28a and 28a of the hot plate central portion 28 in a direction parallel to the passage 34, and are connected to the grooves 29a and 29a at both ends. Accordingly, the suction groove 29 is formed in a rectangle (rectangular shape), and the grooves 29a and 29b have a width of 0.5 to 2 mm and a depth of 0.3 to 2 mm, respectively. In addition, outside the suction groove 29, a suction groove 30 is similarly formed in a substantially rectangular shape (quadrangle). Therefore, the groove 29a of the suction groove 29 and the groove 30a of the suction groove 30 are arranged in parallel with an interval of 1 to 3 mm in width, and the groove 29b and the groove 30b are also arranged in parallel at the same interval. The width and depth of the grooves 30a and 30b are the same as the grooves 29a and 29b of the suction groove 29. The positions where the air suction passages 32 and 33 are disposed on the hot plate 24 are other than the transfer region 31c of the stamper 31 that performs transfer to the resin plate P when the stamper 31 is disposed on the upper surface of the hot plate 24. The position corresponding to the back surface of the outer peripheral portion 31b, which is a non-pressurized region provided in a band shape between the transfer region 31c and the outer peripheral edge portion 31a.

Air suction passages 32 are provided toward the inside of the hot plate 24 at the four corners where the grooves 29a and 29b of the suction groove 29 abut. The suction groove 30 is also provided with air suction passages 33 at the four corners where the grooves 30a and 30b abut. The air suction passage 32 and the air suction passage 33 are both connected to a pipe 37, and the pipe 37 is connected to the air suction device 40 through a valve or the like (not shown). Accordingly, by operating the air suction device 40 to perform air suction, a negative pressure is applied to the entire suction grooves 29 and 30 so that the stamper 31 is sucked and held, and a stamper holding mechanism is formed therefrom. . In the present invention, the air in the surface portion of the wall portion 44 between the suction groove 29 and the suction groove 30 is completely deaerated, so that the stamper 31 is firmly adsorbed by the surface of the hot plate 24. The air suction passage may be provided in any part of the suction groove, and the number thereof is not limited, and the air suction passage may be provided in the center of the groove constituting each side.

Note that at least one communication passage may be formed in the wall portion between the suction grooves, and the inner and outer suction grooves may be connected. Further, the suction groove is not limited to a perfect square, and may be bent several times in the middle, or may be partially broken if it is substantially rectangular. Furthermore, the suction groove may be provided with rectangular suction grooves having three or more different sizes. If the stamper has a small outer shape and does not cover all of the suction grooves, air suction to the outer suction grooves may be blocked and only the inner suction grooves may be used. Further, the suction groove formed on the surface of the hot plate is formed to have a wide width (for example, 5 to 15 mm), and an O-ring, other elastic body, or a block having a plate thickness corresponding to the groove depth is formed on the wide groove. A plurality of suction grooves may be formed on the bottom surface. In that case, the position of the groove can be appropriately arranged according to the size of the resin plate, the size of the transfer region of the resin plate, the size of the stamper, and the like.

Further, as shown in FIG. 3, the stamper 31 of this embodiment is held and positioned in the vicinity of the outer peripheral edge 31a by a stamper holding mechanism using a stamper holder in addition to the above-described stamper holding mechanism using air suction. ing. The stamper holder includes a holding stamper holder 51 that prevents the stamper 31 from being lifted in the vertical direction or falling off on the upper plate 12 side, and a positioning stamper holder that determines only the position of the stamper 31 in the surface direction of the hot plate 24. 52, both of which are screwed into screw holes 58 and 62 formed in the hot plate 24 and fixed.

The holding stamper holder 51 includes a screw portion 53 and a cylindrical main body portion 54 having a diameter of 5 to 15 mm and a height of about 2 to 4 mm. A recess 55 having a depth of about 1.5 mm and a depth of about 2 to 5 mm is formed sideways. The upper side of the concave portion 55 (the lower side when attached to the upper board 12) is a pressing surface 56 of the stamper 31, and a vertical surface 57 is formed at the back of the concave portion 55. The holding stamper holder 51 is configured such that a screw portion 53 is screwed into a screw hole 58 formed in the upper surface of the hot plate 24 and fixed. The outer peripheral edge 31a of the stamper 31 is inserted into the recess 55. The holding stamper holder is not limited to a cylindrical shape, and may be a rectangular shape. The positioning stamper holder 52 includes a screw portion 59 and a cylindrical main body portion 60 having a diameter of 5 to 15 mm and a height of about 2 to 4 mm, and one side surface of the circumferential surface of the main body portion 60 is in contact with the contact surface 61. It has become. The reason why the positioning stamper holder 52 is provided in a columnar shape is that the accuracy of the contact surface 61 is easily obtained in processing, and the stamper 31 can be positioned at a more accurate position. The positioning stamper holder 52 is fixed by screwing a screw portion 59 into a screw hole 62 formed in the upper surface of the hot plate 24. The holding stamper holder 51 and the positioning stamper holder 52 are provided with screw holes 58 so that the holding stamper holder 51 is fixed at a position closer to the outer peripheral edge 31a of the stamper 31, and the presser surface 56 is provided. Is configured to press the outer peripheral portion 31b in the vicinity of the outer peripheral edge portion 31a of the stamper 31. Further, the positioning stamper holder 52 is provided with a screw hole 62 so that the outer peripheral edge 31 a of the stamper 31 is fixed at a position where the stamper 31 contacts the contact surface 61, thereby preventing lateral displacement of the stamper 31. The screw holes 58 and 62 are located at the same distance from the outer peripheral edge 31 a of the stamper 31, and the holding stamper holder 51 has a diameter larger than the diameter of the positioning stamper holder 52. Larger ones may be used. The positioning stamper holder 52 is not essential, and the stamper 31 may be positioned by the vertical surface 57 of the recess 55 of the holding stamper holder 51. In the present invention, the stamper 31 disposed on the hot plate 24 is accurately positioned, and is prevented from being displaced and lifted, so that good transfer can be performed.

In this embodiment, the set of the holding stamper holder 51 and the positioning stamper holder 52 is disposed and fixed at two locations on one side of the outer peripheral edge 31 a of the stamper 31. The set of stamper holders 51 and 52 is provided corresponding to the outer peripheral edge 31a on the three sides of the stamper 31, and is not provided on the hot plate 41 on the other side. When the stamper 31 is attached, as shown by an arrow A in FIG. 2, the stamper 31 is moved so as to slide along the surface of the hot plate 24 from the remaining hot plate 41 on one side. The stamper holder 51 is attached so as to be submerged below the presser surface 56. Therefore, the stamper 31 can be securely attached to the hot plate 24 without bending, and the stamper 31 is not damaged. In addition, as shown by 51a and 51b in FIG. 2, the stamper holder set may be attached later on the remaining one side heat plate 41 after the stamper 31 is attached. Not. Accordingly, the stamper holders 51 and 52 may be provided so as to substantially correspond to the outer peripheral edge 31 a of at least three sides of the stamper 31. Needless to say, when the stamper 31 is attached, air suction is not performed from the air suction device 40 via the suction grooves 29 and 30, and air suction is performed after the stamper 31 is disposed at a fixed position.

As another example, the holding stamper holder may use an ultra-low flat head screw having a large diameter flat head with a minus or hexagonal hole. Then, when the screw is completely screwed into the screw hole of the hot plate, a screw hole is formed so that an interval of about 1 mm is formed between the lower surface of the flat head on the upper surface of the hot plate. By doing so, after the stamper is placed at a fixed position, the outer peripheral edge of the stamper is held without being strongly pressed by attaching the ultra-low flat head screw to the screw hole at a position close to the outer peripheral edge of the stamper. be able to.

Next, the transfer press molding method of this embodiment will be described. In this embodiment, a transparent acrylic resin plate P (glass transition temperature (Tg) 100 ° C.) having an equal plate thickness of 5 mm and a diagonal length of 17 inches is used as the resin plate. In the present invention, the resin plate is not limited to acrylic, and may be made of another thermoplastic resin such as polycarbonate or cycloolefin polymer. Moreover, as a resin board, what differs in plate | board thickness by the one side and an other side, or a film-like thing may be sufficient. When the plate thickness is different, the upper board may be pivotally supported with respect to the ram or the like. The supplied resin plate P may be preheated.

When the previous transfer molding is completed, the vacuum chamber 15 is opened, the mold is opened, and the temperature of the hot plate 24 of the press device 11 from which the molded product is taken out is 35 ° C., and the resin plate P is placed. However, the temperature is such that no warpage occurs. The interior of the passage 34 of the hot plate 24 is in a state in which excess cooling water does not remain by switching compressed valves (not shown) and supplying compressed air from the compressed air supply device. Next, the resin plate P is supplied and placed on the stamper 31 disposed on the hot plate 24 in the above state. As soon as the resin plate P is supplied and placed, the primary mold closing process is started. In the primary mold closing process, the ram 13 of the pressure cylinder is operated, and the side wall 19 and the side wall 25 are brought into contact with each other to form the vacuum chamber 15. When the primary mold closing step is completed, the vacuum chamber 15 is depressurized by a vacuum suction means (not shown). In the state where the primary mold closing process is completed, the resin plate P and the heat plate 18 on the upper panel 12 side are not yet in contact with each other. Then, when a predetermined degree of vacuum is reached or a predetermined time elapses, the secondary mold closing process is started. In the secondary mold closing process, the pressurizing cylinder is actuated again to lower the hot plate 18 on the upper board 12 side toward the hot plate 24 on the lower board 14 on which the resin plate P is placed, thereby closing the mold. I do. When the stamper 31 of the hot plate 18 on the upper board 12 side and the resin plate P come into contact with each other, the secondary mold closing process is completed, and then the process proceeds to the heating / pressurizing process.

In the heating / pressurizing step, valves connected to the introduction side branch passage 36 and the pipe 39 in the introduction side manifold portion 35 of the hot plates 18 and 24 are switched, and the introduction side branch passage 36 and the like are switched from a steam supply device (not shown). The steam is supplied to the passage 34 via. At the same time or before and after that, the pressurizing cylinder is operated to further lower the ram 13 and pressurize the resin plate P through the hot plates 18 and 24 and the stamper 31. The steam supplied at that time is again collected by the steam supply device via the discharge side branch passage 43 in the discharge side manifold portion 42. Accordingly, since the steam is supplied from the two pipe lines 39, for example, the upper and lower halves of the hot plate 24 in FIG. 2 are heated by the steam sent from the respective pipe lines 39, respectively. Further, since the passage 34 is formed in a straight line in parallel, it is quickly circulated to the discharge side passage. Therefore, in the experimental example conducted by the applicant, one side of the hot plate central portion 28 was heated faster than the other side at the beginning of heating, but the temperature of the hot plate central portion 28 became uniform immediately. Even if a medium such as steam was allowed to flow only from one side of the passage 34 to the other side, there was no practical problem. The supplied steam is preferably about 160 to 180 ° C. and about 0.53 to 1.0 MPa. It is also conceivable to temporarily stop the discharge of steam during heating and pressurization and raise the pressure in the passage to raise the temperature and improve the heating efficiency.

In the heating / pressing step of the press molding method of the present embodiment, the temperature of the hot plates 18 and 24 is increased during pressurization after the mold is closed, so that the upper and lower hot plates 18 and 24 are applied to the resin plate P. Heating and pressing can be performed simultaneously via the stampers 31 and 31. When the temperature of the hot plates 18 and 24 or the stamper 31 is raised to 140 ° C. in 20 seconds to 30 seconds, the supply of steam is stopped. The temperature at which the supply of steam is stopped is preferably 25 ° C. to 80 ° C. higher than the glass transition temperature (Tg) of the resin plate P, and the pressure may be controlled in multiple stages. Further, the pressure applied to the resin plate P through the hot plates 18 and 24 and the stamper 31 by the pressurizing cylinder as a pressurizing device during this time is preferably 6 MPa to 10 MPa. The supply of steam to the hot plates 18 and 24 may be stopped not by detecting that the hot plate temperature has risen to a predetermined temperature but by measuring time with a timer. In the present invention, since the heat plates 18 and 24 are relatively thin and have a small heat capacity, steam that is sufficient for heating can be supplied by a simple boiler.

Even after the supply of steam is stopped, the temperature of the hot plates 18 and 24 slightly overshoots, and then the temperature of the hot plates 18 and 24 gradually decreases. When 50 to 90 seconds elapse from the start of steam supply and the heating / pressurizing process is completed, the process proceeds to the cooling / pressurizing process. In the cooling / pressurizing step, the valve connected to the conduit 39 and the like is switched, and the cooling water is supplied from the cooling water supply device (not shown) to the passage 34 via the introduction side manifold portion 35. The supplied cooling water is sent again to the cooling water supply device via the discharge side manifold portion 42. In this embodiment, normal temperature water is used, but it may be cooled by cooling water whose temperature is controlled at 10 to 40 ° C. In this embodiment, when a predetermined time elapses after the cooling with the cooling water is started, the atmosphere is introduced into the vacuum chamber 15 from the ventilation passage 27 and the decompression in the vacuum chamber 15 is released.

When the temperature of the hot plates 18 and 24 or the stamper 31 reaches 80 ° C., the cooling / pressurizing process is stopped, the pressurizing cylinder is operated, and the mold opening process is started. Note that the temperature at this time is desirably 10 ° C. to 50 ° C. lower than the glass transition temperature (Tg) of the transfer molded molded product. In the mold opening process, since the inside of the vacuum chamber 15 is at atmospheric pressure, the release of the stamper 31 disposed on the hot plate 18 from the molded product and the separation of the side wall portion 19 and the side wall portion 25 are primary and It is performed continuously without discrimination of secondary. In the above, the introduction of air into the vacuum chamber may be started by detecting the temperature of the hot plate, or the transition to the mold opening process may be performed by a timer. Of the time when the heating / pressurizing step and the cooling / pressurizing step are added, the time for pressing at a temperature higher than the glass transition temperature (Tg) of the acrylic resin plate P is 30 to 70 seconds. In the meantime, a fine concavo-convex pattern is transferred onto the surface of the resin plate P. Then, cooling water is further supplied to the hot plates 18 and 24, and the hot plates 18 and 24 are cooled to 35 ° C. When the hot plates 18 and 24 are cooled to a predetermined temperature, the valves are switched, and then the compressed air is supplied to the passage 34 and the like from the compressed air supply device. Then, the molded product is taken out and the next resin plate P is supplied before and after the cooling of the hot plates 18 and 24 and the supply of compressed air to the passage 34 and the like.

During the above molding, the stamper 31 is sucked from the air suction device 40 with a certain suction force that can reliably suck the stamper 31. However, when the upper and lower plates are opened or when the molded product is released from the stamper 31 of the lower plate 14, the suction force may be increased as long as the stamper 31 is not deformed. In the present invention, the stamper 31 holding mechanism by the plurality of suction grooves 29 and 30 arranged on the hot plate 24 and the like and the stamper holding mechanism by the stamper holders 51 and 52 are arranged in parallel. This is advantageous when forming a large light guide plate or light diffusing plate having a direction length of 15 inches or more.

The present invention is not enumerated one by one, but is not limited to the above-described embodiment, and it goes without saying that the present invention can be applied to those modified by a person skilled in the art based on the gist of the present invention. For example, as the resin molded product to be molded, in addition to the light guide plate, optical products such as a light diffusing plate, a lens and a disk, and plate-like bodies (including opaque ones) having other fine patterns are listed. In addition to the transfer press apparatus, the present invention can be used in injection molding.

It is a longitudinal cross-sectional view of the transfer press apparatus in this embodiment. It is a top view of the hot plate used for the transfer press apparatus in this embodiment. It is an expansion perspective view of the stamper holder in this embodiment.

Explanation of symbols

11 Transfer Press Device 12 Upper Panel 13 Ram (Pressurizing Device)
14 Lower plate 18, 24 Hot plate 28 Hot plate center 29, 30 Suction groove 31 Stamper
31a Outer peripheral edge portion 31b Outer peripheral portion 31c Transfer area 32, 33 Air suction passage 34 Passage 37 Pipe 40 Air suction device 51 Holding stamper holder 52 Positioning stamper holder P Resin plate

Claims (3)

In a transfer press apparatus for transferring to a resin plate by a stamper disposed on a hot plate,
A plurality of suction grooves disposed on the hot plate corresponding to the non-pressurized region of the stamper;
An air suction passage provided in any part of the suction groove;
A transfer press device comprising a stamper holding mechanism including an air suction device connected to the air suction passage. In a press device that performs transfer to a resin plate by a substantially rectangular stamper disposed on a hot plate,
A transfer press comprising a stamper holding mechanism in which a holding stamper holder for preventing the stamper from rising or falling in the vertical direction and a positioning stamper holder for determining only the position of the stamper are provided separately. apparatus. In a press device that performs transfer to a resin plate by a substantially rectangular stamper disposed on a hot plate,
A stamper holding mechanism in which a holding stamper holder is fixed in correspondence with the outer peripheral edge portions of the three sides of the stamper attached to the hot plate, and is attached by moving the stamper along the surface of the hot plate from the hot plate on the other side. A transfer press apparatus characterized by comprising:

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