JP2008034207A - Wiring material, connection structure of wiring material, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring material capable of avoiding inconvenience caused by soldering connection when a conductor provided for a wiring material such as an ultrathin coaxial cable is connected to a conductor pattern formed on a connection object member such as a circuit board, and of facilitating connection work between the conductor and the conductor pattern part; a connection structure of a wiring material; and its manufacturing method. <P>SOLUTION: A multicore cable 1 is provided with a plurality of ultrathin coaxial cables 2 each having a center conductor 3. The center conductor 3 is connected to a conductor pattern part 10 of a circuit board 9. A part of the center conductor 3 connected to the conductor pattern part 10 is covered with an adhesive 30. The center conductor 3 and the conductor pattern part 10 are connected to each other by the adhesive 30. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring material used for an electronic device or the like, a connection structure of the wiring material, and a manufacturing method thereof.

  In recent years, in the field of electronic devices, for example, notebook computers and mobile phones have become widespread, and these information communication devices are required to be reduced in size and weight. For this reason, extremely thin coaxial cables are used for the connection between the device body and the liquid crystal display and the wiring material in the device, and wiring is performed in the form of a multi-core cable in which these multiple ultra-fine coaxial cables are integrated together. Is to be performed.

  Further, when performing the connection work of the multi-core cable, in each micro coaxial cable constituting the multi-core cable, the outer conductor is securely connected to the ground, and the central conductor is a conductor pattern portion having a predetermined pattern (or It is necessary to connect to a connected member such as a circuit board on which a circuit pattern portion) is formed.

  Here, conventionally, a technique for performing these connections by soldering is known. More specifically, for example, a fine conductor having a center conductor, an insulator covering the outer periphery of the center conductor, an outer conductor covering the outer periphery of the insulator, and a jacket layer covering the outer periphery of the outer conductor. In a multi-core cable having a plurality of coaxial cables, the center conductor of the micro coaxial cable is exposed and bonded to the center conductor and a cable connection pad that is a conductor pattern portion having a predetermined pitch formed on the circuit board. A technique for connecting a central conductor and a cable connecting pad by applying solder as a member and heating the solder is disclosed (for example, see Patent Document 1).

Moreover, the technique which performs these connections with an anisotropic conductive adhesive is disclosed. More specifically, first, each of the plurality of micro coaxial cables constituting the multi-core cable is arranged in an arrangement groove formed on the base by etching or the like and fixed with an adhesive. Next, by polishing the micro coaxial cable together with the base, the center conductor and the outer conductor of each micro coaxial cable are exposed. Then, an anisotropic conductive adhesive is applied to the exposed surfaces of the center conductor and the outer conductor, and a circuit board such as a printed circuit board on which a signal conductor pattern portion having a predetermined pattern and a ground conductor pattern portion are formed is thermocompression bonded A technique for connecting the central conductor and the signal conductor pattern portion and the external conductor and the ground conductor pattern portion by fixing the base conductor to the base is disclosed (for example, see Patent Document 2).
JP 2002-95129 A JP 2003-143728 A

  Here, in recent years, with the reduction in size and weight of electronic devices, there has been an increasing demand for narrow pitches of micro coaxial cables. However, in the connection by solder described in Patent Document 1, the pitches are arranged at a narrow pitch. When connecting the central conductor of the micro coaxial cable to the circuit board on which the conductor pattern portion is formed, there is a problem that a solder bridge occurs and it is difficult to maintain insulation between the micro coaxial cables.

  In addition, when connecting the central conductor and the conductor pattern part by soldering, it is necessary to use a heated soldering iron or heat treatment such as reflow. Need to work. At this time, when the circuit board on which the conductor pattern portion is formed is formed of resin, the above-described heat is transferred to the circuit board, and as a result, the circuit board is deformed by the heat.

  Further, in the connection using the anisotropic conductive adhesive described in Patent Document 2, as described above, etching for forming the alignment groove of the base, polishing for exposing the central conductor and the external conductor, etc. Processing work is required. Therefore, there is a problem that the connection process becomes complicated because the connection process becomes long.

  Therefore, the present invention has been made in view of the above-described problems, and when connecting a conductor included in a wiring material such as an ultrafine coaxial cable to a conductor pattern portion formed on a connected member such as a circuit board, soldering is performed. It is an object of the present invention to provide a wiring material, a wiring material connection structure, and a method for manufacturing the same that can avoid inconvenience caused by the connection and can easily connect the conductor and the conductor pattern portion.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided a wiring member including a conductor connected to a conductor pattern portion of a connected member, wherein a portion of the conductor connected to the conductor pattern portion is an adhesive. It is characterized by being covered with.

  According to this configuration, when the conductor and the conductor pattern portion are connected, the conductor and the conductor pattern portion can be connected by the adhesive, so that it is not necessary to use solder. Therefore, it is possible to avoid the occurrence of a solder bridge that occurs when using the solder described in the above-described prior art, and it is possible to maintain good insulation between the conductors of the wiring material. In addition, since heat treatment such as a heated soldering iron or reflow is not required, heat does not directly act on the conductor and the conductor pattern portion. Therefore, even when the circuit board on which the conductor pattern portion is formed is formed of resin, since heat is not transmitted to the circuit board, the problem that the circuit board is deformed by heat can be avoided.

  Further, there is no need to perform processing operations such as etching for forming the arrangement grooves of the base and polishing for exposing the conductors. Therefore, since a plurality of conductors arranged at a narrow pitch can be connected to each conductor pattern portion provided on the circuit board at a time with a simple configuration, the connection process is simplified. , Making the connection work easier.

  The invention according to claim 2 is the wiring member according to claim 1, wherein the surface of the end portion of the conductor in the length direction of the conductor is covered with an adhesive. According to this configuration, when connecting the end portion of the conductor to the conductor pattern portion, the amount of the adhesive used can be minimized, so that the wiring material can be reduced in weight, and the adhesive It is possible to prevent a decrease in flexibility of the wiring material due to curing.

  A third aspect of the present invention is the wiring member according to the first aspect, wherein the entire surface of the conductor is covered with an adhesive in the length direction of the conductor. According to this configuration, when connecting the conductor of the wiring material to the conductor pattern portion, the wiring material can be cut into a desired length and used. In addition, even when the configuration of the wiring material (that is, the length of the wiring material or the connection position with the conductor pattern portion) is not specified, it is possible to cope with it.

  A fourth aspect of the present invention is the wiring member according to any one of the first to third aspects, wherein the adhesive is mainly composed of a thermosetting resin. According to this configuration, the heat resistance of the adhesive is improved when reheating such as reflow is performed, so that the inconvenience of peeling of the joint between the conductor and the conductor pattern portion due to heating during the reheating is avoided. Can do.

  A fifth aspect of the present invention is the wiring member according to any one of the first to fourth aspects, wherein the adhesive is a conductive adhesive containing a conductive substance. According to this configuration, when the conductor is connected to the conductor pattern portion, the conductor-conductor pattern portion can be connected with a low conductive resistance.

  Invention of Claim 6 is wiring material of Claim 5, Comprising: As for the adhesive agent, the electroconductive fine particles which have the shape where many needle-shaped or fine particle | grains were connected to linear form are insulated. An anisotropic conductive adhesive dispersed in a conductive resin. According to this configuration, when the conductor is connected to the conductor pattern portion, the conductor-conductor pattern portion is reliably connected even when the height of each conductor connected to the conductor pattern portion varies. It becomes possible.

  According to the seventh aspect of the present invention, in the wiring material connection structure in which the conductor is connected to the conductor pattern portion of the connected member, the portion of the conductor connected to the conductor pattern portion is bonded. The conductor and the conductor pattern portion are connected by an adhesive and are covered with an agent.

  According to this configuration, when the conductor and the conductor pattern portion are connected, the conductor and the conductor pattern portion can be connected by the adhesive, so that it is not necessary to use solder. Therefore, it is possible to avoid the occurrence of a solder bridge that occurs when using the solder described in the above-described prior art, and it is possible to maintain good insulation between the conductors of the wiring material. In addition, since heat treatment such as a heated soldering iron or reflow is not required, heat does not directly act on the conductor and the conductor pattern portion. Therefore, even when the circuit board on which the conductor pattern portion is formed is formed of resin, since heat is not transmitted to the circuit board, the problem that the circuit board is deformed by heat can be avoided.

  Further, there is no need to perform processing operations such as etching for forming the arrangement grooves of the base and polishing for exposing the conductors. Therefore, since a plurality of conductors arranged at a narrow pitch can be connected to each conductor pattern portion provided on the circuit board at a time with a simple configuration, the connection process is simplified. , Making the connection work easier.

  Invention of Claim 8 is a connection structure of the wiring material of Claim 7, Comprising: The part connected to a conductor pattern part and a conductor pattern part of a conductor is a heat resistant resin film, and this heat resistance The insulating resin film is sealed with a sealing resin film formed of an insulating resin film, and the insulating resin film is formed of a thermosetting resin or a thermoplastic resin.

  According to this configuration, since the sealing resin film includes the heat resistant resin film, the insulating resin film is applied with a predetermined pressure via the heat resistant resin film by, for example, a heated pressure-bonding member. In a pressed state, the insulating resin film can be heated and melted. Also, the insulating resin film is heated and melted and heated or cooled to a curing temperature to cure the insulating resin film, and the conductor and the conductor pattern portion are securely sealed with the sealing resin film. It becomes possible. Therefore, it is possible to prevent metal pieces, etc. constituting other members of the wiring material from scattering into the conductor pattern portion to which the conductor is connected and entering between the conductor pattern portions. As a result, insulation between the conductors can be prevented. It is possible to reliably prevent occurrence of a short circuit while maintaining the above.

  The invention according to claim 9 is a method for manufacturing a wiring material connection structure in which a conductor is connected to a conductor pattern portion of a connected member of a wiring material having a conductor, and the conductor is covered with an adhesive, The step of placing the portion connected to the conductor pattern portion on the conductor pattern portion, the portion of the conductor covered with the adhesive and connected to the conductor pattern portion, and the conductor pattern portion are subjected to heat and pressure treatment And a step of connecting via an adhesive.

  According to this configuration, when the conductor and the conductor pattern portion are connected, the conductor and the conductor pattern portion can be connected by the adhesive, so that it is not necessary to use solder. Therefore, it is possible to avoid the occurrence of a solder bridge that occurs when using the solder described in the above-described prior art, and it is possible to maintain good insulation between the conductors of the wiring material. In addition, since heat treatment such as a heated soldering iron or reflow is not required, heat does not directly act on the conductor and the conductor pattern portion. Therefore, even when the circuit board on which the conductor pattern portion is formed is formed of resin, since heat is not transmitted to the circuit board, the problem that the circuit board is deformed by heat can be avoided.

  Further, there is no need to perform processing operations such as etching for forming the arrangement grooves of the base and polishing for exposing the conductors. Therefore, since a plurality of conductors arranged at a narrow pitch can be connected to each conductor pattern portion provided on the circuit board at a time with a simple configuration, the connection process is simplified. , Making the connection work easier.

  Invention of Claim 10 is a manufacturing method of the connection structure of the wiring material of Claim 9, Comprising: It is comprised with the heat resistant resin film and the thermosetting resin, or the thermoplastic resin, The insulating resin film of the sealing resin film formed of the formed insulating resin film is made to face the portion of the conductor placed on the conductor pattern portion that is covered with the adhesive and connected to the conductor pattern portion. The step of interposing an insulating resin film between the portion of the conductor covered with the adhesive and connected to the conductor pattern portion and the heat resistant resin film, and the heat and pressure treatment are performed. The part of the conductor that is covered with the adhesive and connected to the conductor pattern part by heat-melting and curing the insulating resin film in the state of being pressed in the direction of the conductor through the film And the conductive pattern section, characterized by further comprising the step of sealing the resin film for sealing.

  According to this configuration, since the sealing resin film includes the heat resistant resin film, the insulating resin film is applied with a predetermined pressure via the heat resistant resin film by, for example, a heated pressure-bonding member. In a pressed state, the insulating resin film can be heated and melted. Also, the insulating resin film is heated and melted and heated or cooled to a curing temperature to cure the insulating resin film, and the conductor and the conductor pattern portion are securely sealed with the sealing resin film. It becomes possible. Therefore, it is possible to prevent metal pieces, etc. constituting other members of the wiring material from scattering into the conductor pattern portion to which the conductor is connected and entering between the conductor pattern portions. As a result, insulation between the conductors can be prevented. It is possible to reliably prevent occurrence of a short circuit while maintaining the above.

  According to the present invention, it is possible to avoid inconvenience caused by soldering when connecting a conductor included in a wiring member such as a microfine coaxial cable to a conductor pattern portion formed on a connected member such as a circuit board. In addition, since a plurality of conductors arranged at a narrow pitch can be connected to each conductor pattern portion provided on the circuit board at a time by a simple configuration, the connection process is simplified. , Making the connection work easier.

  Hereinafter, a preferred embodiment of the present invention will be described. FIG. 1 is a top view for explaining a wiring material connection structure according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG. 3 is a cross-sectional view for explaining the wiring material according to the embodiment of the present invention, FIG. 4 is a cross-sectional view taken along the line BB in FIG. 1, and FIG. 5 is a cross-sectional view taken along the line CC in FIG. It is. In the present embodiment, the connection structure of the wiring material in which the center conductor of the micro coaxial cable that is the wiring material is connected to the conductor pattern portion formed on the circuit board that is the connected member will be described as an example. .

  As shown in FIG. 1, the multi-core cable 1 includes a plurality of (four in the present embodiment) micro coaxial cables 2 that are wiring materials, and is configured by bundling the micro coaxial cables 2. Yes. 1 to 3, the micro coaxial cable 2 includes a center conductor 3, an insulator 4 that covers the outer periphery of the center conductor 3, and an outer conductor 5 that covers the outer periphery of the insulator 4. And a jacket layer 6 which is an outer skin covering the outer periphery of the outer conductor 5.

  More specifically, this multi-core cable 1 is composed of, for example, an outer periphery of a center conductor 3 having an outer diameter of 0.063 mm twisted from seven conductors having an outer diameter of 0.021 mm formed of silver-plated copper alloy wire or the like. Are provided with an insulator 4 made of tetrafluoroethylene perfluoroalkyl vinyl ether resin having a thickness of 0.05 mm, and the outer periphery of the insulator 4 is made of a tin-plated copper alloy wire having an outer diameter of 0.025 mm. An outer conductor 5 in which the formed conductor is horizontally wound and shielded is provided, and a jacket layer 6 having a thickness of 0.03 mm formed of tetrafluoroethylene perfluoroalkyl vinyl ether resin or the like is provided on the outer periphery of the outer conductor 5. The micro coaxial cables 2 having an outer diameter of 0.26 mm are arranged in parallel at a narrow pitch of 0.3 mm, for example.

  As shown in FIG. 2, a part of the outer conductor 5 is exposed by removing the jacket layer 6 having a predetermined length at the end 20 of the micro coaxial cable 2. Further, a part of the insulator 4 is exposed by removing a part of the exposed outer conductor 5, and a part of the central conductor 3 is exposed by removing a part of the exposed insulator 4. It has a configuration.

  As shown in FIGS. 1 and 2, the external conductor 5 exposed at the end 20 of each micro coaxial cable 2 is connected to a ground bar 7 for grounding the external conductor 5. More specifically, as shown in FIG. 4, the outer conductor 5 and the ground bar 7 are connected by sandwiching the outer conductor 5 with the ground bar 7 from above and below via the adhesive 8. ing.

  The ground bar 7 is formed by processing a metal plate (for example, a metal foil). The ground bar 7 mechanically fixes each of the fine coaxial cables 2 and obtains conduction with the external conductor 5. Further, as shown in FIG. 1, the ground bar 7 is integrally formed along the arrangement direction of the plurality of micro coaxial cables 2 (direction of the arrow X in the figure), and a plurality of ground bars 7 are provided on the ground bar 7. By connecting the two extra fine coaxial cables 2, the outer conductors 5 of the extra fine coaxial cable 2 are collectively grounded.

  In addition, it is preferable to use a conductive adhesive for the adhesive 8 that connects the outer conductor 5 and the ground bar 7. As the conductive adhesive, for example, an insulating thermosetting resin such as an epoxy resin as a main component and a conductive substance dispersed in the resin can be used. For example, an epoxy resin in which a powder of a conductive substance such as copper, silver, or graphite is dispersed can be used. By using such a conductive adhesive, the outer conductor 5 and the ground bar 7 of each micro coaxial cable 2 can be conductively connected at a time. Therefore, the connection structure between each micro coaxial cable 2 and the ground bar 7 is simplified and the connection work is facilitated.

  Further, as shown in FIG. 1, the circuit board 9 which is a connected member to which the micro coaxial cable 2 is connected has a conductor pattern portion having a predetermined pattern which is a connection portion with the above-described exposed central conductor 3. (Or a circuit pattern portion) 10 is formed. The conductor pattern portion 10 is formed by, for example, gold plating on a conductive metal such as copper on the surface of the circuit board 9 formed of an insulating resin. The conductor pattern portion 10 is formed with a width D of 0.2 mm, and the interval between the conductor pattern portions 10 (that is, the width of the insulating portion 13 between the conductor pattern portions 10) E is, for example, 0. It is provided to be 1 mm.

  As shown in FIGS. 2 and 4, the circuit board 9 is provided with a grounding portion 12, and the ground bar 7 to which each micro coaxial cable 2 is connected is in contact with the grounding portion 12. Has been. More specifically, the external conductor 5 of each micro coaxial cable 2 is connected to the ground by connecting the ground bar 7 connected to the external conductor 5 to the grounding portion 12 provided on the circuit board 9 by soldering. It is configured to be electrically connected to the grounding portion 12 of the circuit board 9 through the bar 7 and to connect the external conductor 5 to the ground.

  As described above, the ground bar 7 to which the outer conductor 5 of the micro coaxial cable 2 constituting the multi-core cable 1 is connected is connected to the ground portion 12 of the circuit board 9, and the central conductor 3 is connected to the conductor pattern portion of the circuit board 9. The connection structure 50 of the micro coaxial cable 2 that is the wiring material shown in FIG.

  In the present embodiment, as shown in FIGS. 2 and 5, the portion of the central conductor 3 connected to the conductor pattern portion 10 (that is, one end portion of the central conductor 3) is covered with an adhesive 30. ing. That is, the surface (that is, the outer periphery) of the end portion of the center conductor 3 in the length direction of the center conductor 3 (that is, the direction of the arrow W shown in FIG. 2) is covered with the adhesive 30. The center conductor 3 and the conductor pattern portion 10 are connected by the adhesive 30. That is, in the present embodiment, when the center conductor 3 and the conductor pattern portion 10 are connected, the center conductor 3 and the conductor pattern portion 10 are connected by the adhesive 30 instead of the solder.

  In the present embodiment, a conductive adhesive containing a conductive substance can be used for the adhesive 30 that connects the central conductor 3 and the conductor pattern portion 10 described above. In this case, the central conductor 3 and the conductor pattern portion 10 are electrically connected via the adhesive 30.

  As the conductive adhesive, in the same manner as the adhesive 8 for connecting the outer conductor 5 and the ground bar 7, for example, an insulating thermosetting resin such as an epoxy resin is a main component, and copper is contained in the resin. A material in which a conductive material such as silver or graphite is dispersed can be used. In general, in the connection by solder described in the above-mentioned prior art, the center conductor and the conductor pattern are heated by the reheat treatment when reheat treatment such as reflow is performed after the center conductor and the conductor pattern portion are connected by solder. The solder used to connect the parts is remelted and leaks, and the solder joint part is peeled off. On the other hand, as in the present embodiment, by using the adhesive 30 mainly composed of a thermosetting resin, the heat resistance of the adhesive 30 when performing the reheating such as the reflow described above is improved. It is possible to avoid the inconvenience that the joint between the central conductor 3 and the conductor pattern portion 10 is peeled off by heating during the reheat treatment.

  Although there is no restriction | limiting in particular in the thermosetting resin used for this adhesive agent 30, The adhesive agent 30 excellent in heat resistance and adhesive force can be produced by using an epoxy resin as a thermosetting resin. It becomes possible.

  In addition, as an epoxy resin to be used, for example, bisphenol A type, F type, S type, or AD type epoxy resin, naphthalene type epoxy resin, novolac type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin Etc. can be used. A phenoxy resin that is a high molecular weight epoxy resin can also be used.

  In the present embodiment, an anisotropic conductive adhesive containing conductive fine particles can be used for the adhesive 30 that connects the above-described center conductor 3 and the conductor pattern portion 10. More specifically, as the anisotropic conductive adhesive, for example, an insulating thermosetting resin such as the above-described epoxy resin is a main component, and in the resin, needle-shaped or fine particles (for example, A large number of spherical metal particles and metal particles made of metal-plated spherical resin particles) are used, in which conductive particles having a so-called shape with a large aspect ratio are dispersed. can do. The aspect ratio here refers to the ratio of the short diameter (cross-sectional length of the conductive material) and the long diameter (length of the conductive material) of the conductive fine particles.

  The fine particles used in the present invention preferably include a ferromagnetic material in a part thereof, such as a single metal having ferromagnetism, two or more kinds of alloys having ferromagnetism, a metal having ferromagnetism, and Either alloys with other metals and composites containing metals with ferromagnetism can be used. For example, nickel, iron, cobalt, and two or more kinds of alloys thereof can be used.

  In this case, the aspect ratio of the conductive fine particles is preferably 10 or more. By using such conductive fine particles, when an anisotropic conductive adhesive is used as the adhesive 30, the contact probability between the conductive fine particles is increased. Therefore, the central conductor 3 and the conductor pattern portion 10 can be connected without increasing the blending amount of the conductive fine particles.

  The aspect ratio of the conductive fine particles is directly measured by a method such as observation with a CCD microscope. In the case of conductive fine particles whose cross section is not a circle, the aspect ratio is obtained by setting the maximum length of the cross section as the short diameter. Further, the conductive fine particles do not necessarily have a straight shape, and can be used without any problems even if they are slightly bent or branched. In this case, the aspect ratio is obtained with the maximum length of the conductive fine particles as the major axis.

  Moreover, it is desirable that the short diameter of the conductive fine particles is 1 μm or less. By using such conductive fine particles, when an anisotropic conductive adhesive is used as the adhesive 30, the contact probability between the conductive fine particles is further increased. Thus, the center conductor 3 and the conductor pattern portion 10 can be connected.

  An adhesive 30 containing a latent curing agent can also be used. As this latent curing agent, for example, a curing agent that is excellent in storage stability at a low temperature and hardly undergoes a curing reaction at room temperature, but that rapidly performs a curing reaction by heat or light can be used. More specifically, for example, imidazole series, hydrazide series, boron trifluoride-amine complex, amine imide, polyamine series, tertiary amine, alkyl urea series and other amine series, dicyandiamide series, and modified products thereof These may be used alone or as a mixture of two or more.

  In addition, as a method of coating the adhesive 30 on the portion of the center conductor 3 that is connected to the conductor pattern portion 10, for example, as shown in FIG. The part connected to 10 is inserted | pinched with the adhesive agent 30 (for example, the above-mentioned anisotropic anisotropic conductive adhesive) from the up-down direction. Next, at the broken line F shown in FIG. 6 (a), the adhesive 30 is cut, and as shown in FIG. 6 (b), a film is formed on the surface of each central conductor 3 connected to the conductor pattern portion 10. The method of scooping up the anisotropic conductive adhesive of a shape is mentioned.

  In the present embodiment, as shown in FIGS. 2 and 5, the exposed portion of the conductor pattern portion 10 of the circuit board 9 and the central conductor 3 connected to the conductor pattern portion 10 is formed of the heat resistant resin film 13. And it is good also as a structure sealed with the resin film 15 for sealing which consists of the insulating resin film 14 formed in the said heat resistant resin 13 film.

  As the heat resistant resin film 13, a resin film excellent in flexibility in addition to high heat resistance is suitably used. As such a resin film, for example, a polyamide resin film, a polyimide resin film such as polyimide or polyamideimide, or polyethylene naphthalate is preferably used.

  Moreover, there is no restriction | limiting in particular as resin which comprises the insulating resin film 14, For example, thermosetting resins, such as an epoxy resin, a phenol resin, a polyurethane resin, an unsaturated polyester resin, a polyimide resin, a urea resin, are used. be able to. Of these, in particular, by using an epoxy resin as the thermosetting resin, it is possible to improve the film formability, heat resistance, and adhesive strength of the insulating resin film 14. The insulating resin film 14 can be formed on the surface of the heat resistant resin film 13 by, for example, a coating film forming method.

  With such a configuration, since the sealing resin film 15 includes the heat resistant resin film 13, the heat resistant resin film is formed by, for example, a head 16 (see FIG. 7), which is a heated pressure bonding member, which will be described later. The insulating resin film 14 can be heated and melted in a state in which the insulating resin film 14 made of a thermosetting resin is pressurized with a predetermined pressure via 13. Further, the insulating resin film 14 is heated and melted, heated to a curing temperature, and the insulating resin film 14 made of a thermosetting resin is cured, whereby the central conductor 3 and the conductor pattern portion 10 are insulated. The resin film 14 can be reliably sealed.

  Next, a method of connecting the central conductor 3 and the conductor pattern portion 10 in the wiring material connection structure of the present invention will be described. First, each of the plurality of micro coaxial cables 2 constituting the multi-core cable 1 is cut in a lump to have a predetermined length. Next, the jacket layer 6 having a predetermined length is cut at each end 20 of the plurality of micro coaxial cables 2. Next, the outer conductor 5 having a predetermined length is cut, and the cut jacket layer 6 and the outer conductor 5 are removed. Next, the adhesive 8 is temporarily bonded to the ground bar 7, and the exposed external conductor 5 is sandwiched from above and below by the ground bar 7 to which the adhesive 8 is temporarily bonded, and the adhesive 8 is attached to the exposed surface of the external conductor 5. Paste. And the external conductor 5 and the ground bar 7 are connected through a conductive adhesive by performing a heating and pressurizing process.

  Next, at each end portion 20 of the plurality of micro coaxial cables 2, the outer conductor 5 on the distal end side (that is, the arrow Y side in FIG. 1) from the portion to which the ground bar 7 is connected is connected to, for example, a rotating brush or the like. To loosen and loosen the winding of the outer conductor 5, pull the loosened outer conductor 5, remove a part thereof, and expose the insulator 4. Next, by removing a part of the insulator 4 at the end portion 20, a portion of the central conductor 3 connected to the conductor pattern portion 10 of the circuit board 9 is exposed. Next, the adhesive 30 is provided on the exposed portion of the center conductor 3, and the portion of the center conductor 3 connected to the conductor pattern portion 10 is covered with the adhesive 30.

  Next, the ground bar 7 to which the external conductor 5 is connected is connected to a grounding portion 12 provided on the circuit board 9 by soldering or conductive adhesive, thereby forming each micro coaxial cable constituting the multi-core cable 1. With respect to the cable 2, the external conductor 5 is grounded to the ground portion 12. In addition, when connecting with a conductive adhesive, the ground bar 7 and the grounding part 12 are connected through a conductive adhesive by performing a heating and pressurizing process.

  Then, while aligning the conductor pattern portion 10 with the portion of the center conductor 3 that is covered with the adhesive 30 and connected to the conductor pattern portion 10, the center conductor 3 is bonded to the conductor pattern portion 10. The part covered with the agent 30 and connected to the conductor pattern part 10 is placed. Next, as shown in FIG. 7, the insulating resin film 14 side of the sealing resin film 15 including the heat-resistant resin film 13 and the insulating resin film 14 made of a thermosetting resin faces downward (that is, The insulating resin film 14 is placed in the state of facing the portion of the center conductor 3 placed on the conductor pattern portion 10 that is covered with the adhesive 30 and connected to the conductor pattern portion 10). The insulating resin film 14 is interposed between the portion connected to the conductor pattern portion 10 and the heat resistant resin film 13.

  Next, as shown in FIG. 7, the head 16, which is a pressure bonding member, is installed above the sealing resin film 15. And the said head 16 is moved to the direction of the arrow D in a figure, and the insulating resin film 14 comprised with a thermosetting resin is predetermined | prescribed to the direction of the center conductor 3 through the heat resistant resin film 13 It is heated and melted under pressure, and heated to the curing temperature. In this case, since the insulating resin film 14 is mainly composed of a thermosetting resin, the adhesive 30 softens once when heated at the curing temperature described above, but the heating is continued. It will be hardened. Then, when a preset curing time has elapsed, the heating state by the head 16 is released, the maintenance state of the curing temperature of the insulating resin film 14 is released, and cooling is started.

  Further, by this heat and pressure treatment, the central conductor 3 and the conductor pattern portion 10 are connected via the adhesive 30, and the central conductor 3 is covered with the adhesive 30 by the sealing resin film 15, The connection structure 50 of the part connected to the conductor pattern part 10 and the micro coaxial cable 2 in which the conductor pattern part 10 is sealed is manufactured. That is, when the center conductor 3 and the conductor pattern portion 10 are sealed with the sealing resin film 15 by performing heat and pressure treatment, the center conductor 3 and the conductor pattern portion 10 are connected via the adhesive 30. It is configured to do. With such a configuration, the center conductor 3 and the conductor pattern portion 10 can be sealed and connected simultaneously.

According to the present embodiment described above, the following effects can be obtained.
(1) In the present embodiment, the portion of the central conductor 3 that is connected to the conductor pattern portion 10 is covered with the adhesive 30. Further, the central conductor 3 and the conductor pattern portion 10 are connected by an adhesive 30. Accordingly, when the center conductor 3 and the conductor pattern portion 10 are connected, the center conductor 3 and the conductor pattern portion 10 can be connected by the adhesive 30, so that it is not necessary to use solder. As a result, it is possible to avoid the occurrence of a solder bridge that occurs when using the solder described in the above-described prior art, and it is possible to maintain good insulation between the center conductors 3 of the micro coaxial cable 2.

  In addition, since no heat treatment such as a heated soldering iron or reflow is required, heat does not directly act on the central conductor 3 and the conductor pattern portion 10. Therefore, even if the circuit board 9 on which the conductor pattern portion 10 is formed is made of resin, heat is not transmitted to the circuit board 9, so that the problem that the circuit board 9 is deformed by heat is avoided. can do.

  Further, there is no need to perform processing operations such as etching for forming the base array grooves and polishing for exposing the central conductor. Accordingly, the plurality of center conductors 3 arranged at a narrow pitch are formed on the circuit board 9 with a simple configuration (for example, by applying a heating and pressurizing process with the head 16 that is a heated crimp member described above). Since it is possible to connect to each conductor pattern portion 10 provided at a time, the connection process is simplified and the connection work is facilitated.

  (2) In this embodiment, when connecting the end portion of the center conductor 3 to the conductor pattern portion 10, the adhesive 30 is applied only to the end portion of the center conductor 3 so as to reduce the amount of the adhesive 30 used as much as possible. From the viewpoint that it is efficient to coat the surface, the surface of the end portion of the center conductor 3 in the length direction W of the center conductor 3 is covered with the adhesive 30. Therefore, when the end portion of the center conductor 3 is connected to the conductor pattern portion 10, the amount of the adhesive 30 used can be minimized, so that the micro coaxial cable 2 that is a wiring material can be reduced in weight. In addition, it is possible to prevent a decrease in flexibility of the micro coaxial cable 2 due to the curing of the adhesive 30.

  (3) In the present embodiment, the adhesive 30 that connects the central conductor 3 and the conductor pattern portion 10 has a thermosetting resin as a main component. Therefore, since the heat resistance of the adhesive 30 is improved when re-heat treatment such as reflow is performed, inconvenience that the joint portion between the central conductor 3 and the conductor pattern portion 10 is peeled off by heating during the re-heat treatment is avoided. Can do.

  (4) In the present embodiment, a conductive adhesive containing a conductive substance is used as the adhesive 30 that connects the central conductor 3 and the conductor pattern portion 10. Therefore, since it becomes possible to connect between the center conductor 3 -conductor pattern part 10 by low conductive resistance, it becomes possible to improve the electroconductivity between the center conductor 3 -conductor pattern part 10.

  (5) In the present embodiment, the anisotropic conductive material in which conductive fine particles having a needle shape or a shape in which a large number of fine particles are connected in a straight chain is dispersed in an insulating resin is used as the adhesive 30. The adhesive is used. Therefore, even if there is a variation in the height of each central conductor 3 connected to the conductor pattern portion 10, it is possible to reliably connect the center conductor 3 to the conductor pattern portion 10.

  (6) In the present embodiment, the conductor pattern portion 10 of the circuit board 9 and the portion of the central conductor 3 connected to the conductor pattern portion 10 that is connected to the conductor pattern portion 10 are the heat resistant resin film 13 and These are sealed with a sealing resin film 15 made of an insulating resin film 14 formed on the heat resistant resin 13 film. The insulating resin film 14 is made of a thermosetting resin. Accordingly, since the central conductor 3 and the conductor pattern portion 10 can be reliably sealed with the insulating resin film 14, for example, a metal piece (for example, a ground bar) constituting another member of the micro coaxial cable 2 is used. 7) can be prevented from scattering into the conductor pattern portion 10 to which the central conductor 3 is connected and entering between the conductor pattern portions 10, and as a result, between the central conductors 3 can be prevented. It is possible to reliably maintain insulation and prevent occurrence of a short circuit.

In addition, you may change the said embodiment as follows.
In the above-described embodiment, as shown in FIG. 2, the surface of one end portion of the center conductor 3 is covered with the adhesive 30, but as shown in FIG. 8, the length direction of the center conductor 3 In W, the entire surface of the central conductor 3 (that is, the entire outer periphery) is covered with the adhesive 30 (that is, the adhesive 30 is provided in the entire length direction W of the central conductor 3), and the outer periphery of the adhesive 30 Can be covered with the insulator 4. With such a configuration, when the central conductor 3 of the micro coaxial cable 2 is connected to the conductor pattern portion 10, the micro coaxial cable 2 can be cut into a desired length and used. Further, even when the configuration of the micro coaxial cable 2 that is a wiring material (that is, the length of the micro coaxial cable 2 or the connection position with the conductor pattern portion 10) is not specified, it is possible to cope with it.

In the above-described embodiment, the surface of one end portion of the center conductor 3 is covered with the adhesive 30. However, as shown in FIG. 9, the center conductor in the longitudinal direction W of the center conductor 3 is used. It is good also as a structure which coat | covers the surface of the both ends of 3 with the adhesive agent 30. FIG.

  -As resin which comprises the above-mentioned insulating resin film 14, thermoplastic resins, such as an acrylic resin, ethylene vinyl alcohol, a polyester resin, a urethane resin, an ethylene-vinyl acetate polymer, can also be used. In this case, after interposing the insulating resin film 14 between the center conductor 3 and the heat resistant resin film 13, the head 16 is moved in the direction of arrow D in FIG. Then, the insulating resin film 14 is heated and melted in a state of being pressurized at a predetermined pressure in the direction of the central conductor 3. Next, the heating state of the insulating resin film 14 is released, and cooling is started, whereby the insulating resin film 14 mainly composed of a thermoplastic resin is cured. Then, the center conductor 3 and the conductor pattern portion 10 are connected via the adhesive 30, and the connection of the micro coaxial cable 2 in which the center conductor 3 and the conductor pattern portion 10 are sealed by the sealing resin film 15. The structure 50 will be manufactured. Even in such a configuration, the same effect as that in the case of using a thermosetting resin as the resin constituting the insulating resin film 14 can be obtained.

  In the above embodiment, the outer conductor 5 and the ground bar 7 are connected by the adhesive 8. However, for example, the outer conductor 5 and the ground bar 7 may be connected by solder.

In the above embodiment, the fine coaxial cable 2 including the central conductor 3 is taken as an example of the wiring material. However, the present invention includes other conductors connected to the conductor pattern portion formed on the connected member. Needless to say, the wiring material can also be applied.

  Examples of utilization of the present invention include wiring materials used in electronic devices and the like, wiring material connection structures, and manufacturing methods thereof.

It is a top view for demonstrating the connection structure of the wiring material which concerns on embodiment of this invention. It is AA sectional drawing of FIG. It is sectional drawing for demonstrating the wiring material which concerns on embodiment of this invention. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. (A), (b) is sectional drawing for demonstrating the method of coat | covering the adhesive agent to the part connected to a conductor pattern part of a center conductor. It is sectional drawing for demonstrating the manufacturing method of the connection structure of the wiring material which concerns on embodiment of this invention. It is a fragmentary sectional view for explaining the modification of the wiring material in the embodiment of the present invention. It is a fragmentary sectional view for explaining the modification of the wiring material in the embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Multi-core cable, 2 ... Micro coaxial cable (wiring material), 3 ... Center conductor, 4 ... Insulator, 5 ... Outer conductor, 6 ... Jacket layer, 7 ... Ground bar, 9 ... Circuit board, 10 ... Conductor pattern 13: heat-resistant resin film, 14 ... insulating resin film, 15 ... resin film for sealing, 20 ... end of micro coaxial cable, 30 ... adhesive (conductive adhesive), 50 ... connection of wiring material Structure, W ... Length direction of the central conductor 3

Claims (10)

  A wiring material comprising a conductor connected to a conductor pattern portion of a member to be connected, wherein a portion of the conductor connected to the conductor pattern portion is covered with an adhesive.   The wiring member according to claim 1, wherein a surface of an end portion of the conductor in a length direction of the conductor is covered with the adhesive.   The wiring member according to claim 1, wherein an entire surface of the conductor is covered with the adhesive in a length direction of the conductor.   The wiring material according to claim 1, wherein the adhesive is mainly composed of a thermosetting resin.   The wiring material according to any one of claims 1 to 4, wherein the adhesive is a conductive adhesive containing a conductive substance.   The adhesive is an anisotropic conductive adhesive in which conductive fine particles having a needle shape or a shape in which many fine particles are connected in a straight chain are dispersed in an insulating resin. The wiring material according to claim 5. In the wiring material connection structure of the wiring material having a conductor, the conductor is connected to the conductor pattern portion of the connected member
A portion of the conductor connected to the conductor pattern portion is covered with an adhesive, and the conductor and the conductor pattern portion are connected to each other with the adhesive. Construction.   The conductor pattern portion and a portion of the conductor connected to the conductor pattern portion are sealed with a heat-resistant resin film and a sealing resin film made of an insulating resin film formed on the heat-resistant resin film. The wiring material connection structure according to claim 7, wherein the insulating resin film is formed of a thermosetting resin or a thermoplastic resin. A wiring material having a conductor is a method for manufacturing a wiring material connection structure in which the conductor is connected to a conductor pattern portion of a connected member,
Placing the portion of the conductor covered with an adhesive and connected to the conductor pattern portion on the conductor pattern portion;
A portion of the conductor that is covered with the adhesive and connected to the conductor pattern portion, and a step of connecting the conductor pattern portion through the adhesive by performing a heat and pressure treatment. A method for manufacturing a connection structure for wiring materials, wherein: The insulating resin film of the sealing resin film composed of a heat-resistant resin film and an insulating resin film formed of a thermosetting resin or a thermoplastic resin, and the conductor pattern The conductor placed on the part is covered with the adhesive and is opposed to the part connected to the conductor pattern part, and the conductor is covered with the adhesive and connected to the conductor pattern part. A step of interposing the insulating resin film between the portion and the heat-resistant resin film;
When performing the heating and pressurizing treatment, the insulating resin film is heated and melted in a state of being pressurized in the direction of the conductor through the heat-resistant resin film, and cured, whereby the conductor The wiring material according to claim 9, further comprising a step of sealing the portion that is covered with an adhesive and connected to the conductor pattern portion and the conductor pattern portion with the sealing resin film. A method for manufacturing a connection structure.

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