JP2008028292A - Substrate for forming wiring, method for forming wiring and method for manufacturing plasma display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for forming a high versatility wiring capable of precisely making the same including various types of shapes, to provide a method for forming the high reliability wiring utilizing the wiring substrate, and to provide a method for manufacturirng a plasma display. <P>SOLUTION: The substrate for forming the wiring 10 is formed by regularly disposing on the substrate 10A many dotted hydrophilic regions 12 surrounded by a hydrophobic region 11. The hydrophobic region 11 is disposed on the substrate in the form of a grid. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring forming substrate, a wiring forming method, and a plasma display manufacturing method.

  As an example of a method for forming a wiring, it is known to form a wiring by firing a conductive ink applied on a substrate using an ink jet method (a droplet discharge method). As described above, in the ink jet process, it becomes difficult to form fine wiring when ink spreads on the substrate. Therefore, after the liquid repellent treatment that exhibits liquid repellency is performed on the entire surface of the substrate, the conductive ink is discharged onto the substrate. However, when conductive ink is ejected onto a substrate having liquid repellency, a pool of droplets (bulge) is generated on the substrate, making it difficult to form a wiring in a desired shape.

Therefore, a method of forming wiring by forming a lyophilic part and a liquid repellent part in a predetermined pattern using an organic molecular film on the substrate surface, and selectively applying conductive ink only to the lyophilic part. (For example, refer to Patent Document 1).
JP 2002-164635 A

  In the above method, the lyophilic part and the liquid repellent part are formed in a predetermined pattern by irradiating the organic molecular film formed on the substrate with ultraviolet rays through a mask. Therefore, only wiring corresponding to a predetermined pattern can be formed on the substrate, and a lyophilic portion and a liquid-repellent portion corresponding to each pattern are formed to form wiring of another pattern. It is necessary to prepare a substrate. As described above, the substrate (wiring forming substrate) used in the above method is very poor in versatility.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a highly versatile wiring forming substrate capable of accurately forming wirings having various shapes. It is another object of the present invention to provide a method of forming a wiring and a method of manufacturing a plasma display, which can obtain a highly reliable product using the wiring substrate.

  The wiring forming substrate of the present invention is characterized in that a large number of dot-like lyophilic regions surrounded by a liquid repellent region are regularly arranged on the substrate.

  According to the wiring forming substrate of the present invention, even when the conductive functional liquid discharged onto the substrate by, for example, the droplet discharge method protrudes from the lyophilic area, the conductive functional liquid surrounds the lyophilic area. It is repelled by the area and is well held in the dot-like lyophilic area. Further, when the conductive functional liquid is discharged between the adjacent lyophilic areas, the conductive functional liquid is reliably held in each lyophilic area, and the lyophobic area existing between the adjacent lyophilic areas. Will be covered.

  Therefore, by changing the region where the conductive functional liquid is discharged, it becomes a highly versatile substrate capable of accurately forming wirings having various shapes.

  In the wiring forming substrate, it is preferable that the liquid repellent region is provided in a lattice pattern on the substrate.

  According to this configuration, since the liquid-repellent region has a lattice shape, the lyophilic region surrounded by the liquid-repellent region is regularly arranged in a rectangular shape, as described above. A highly versatile substrate can be satisfactorily configured.

  Or in the said board | substrate for wiring formation, it is preferable that the said lyophilic area | region is arrange | positioned on the said board | substrate in zigzag form.

  According to this configuration, the lyophilic regions are regularly arranged, and a highly versatile substrate as described above can be satisfactorily configured.

  The wiring forming method of the present invention includes a step of regularly arranging a large number of dot-like lyophilic regions surrounded by a liquid repellent region on a substrate, and a droplet discharge method on the substrate. The method includes a step of discharging the conductive functional liquid in a wiring pattern and a step of baking the conductive functional liquid to form a wiring.

  According to the wiring formation method of the present invention, even when the conductive functional liquid discharged onto the substrate by the droplet discharge method protrudes from the lyophilic area, the conductive functional liquid remains in the liquid repellent area surrounding the lyophilic area. It is repelled and held well in the dot-like lyophilic region. In addition, the conductive functional liquid discharged over the adjacent lyophilic areas is reliably held in each lyophilic area, and covers the lyophobic area existing between the adjacent lyophilic areas. By firing the conductive functional liquid held on the substrate in this way, the wiring can be formed with high accuracy. Further, since a highly versatile wiring forming substrate corresponding to various wiring shapes is used, the flexibility in forming the wiring is high.

  In the wiring formation method, it is preferable that a landing diameter of the conductive functional liquid discharged by the droplet discharge method is larger than a width of the liquid repellent region.

  According to this configuration, a part of the discharged conductive functional liquid lands on the lyophilic area and spreads well, thus preventing the accumulation of the conductive functional liquid on the liquid repellent area. can do.

  A method of manufacturing a plasma display according to the present invention is a method of manufacturing a plasma display including a pair of substrates arranged opposite to each other, an address electrode provided on one substrate, and a bus electrode provided on the other substrate. In the method, a step of regularly arranging a large number of dot-like lyophilic regions surrounded by a liquid-repellent region on a substrate, and a conductive function using a droplet discharge method on the wiring formation substrate A step of discharging the liquid in a wiring pattern; and a step of forming at least one of the address electrode and the bus electrode by firing the conductive functional liquid.

  The manufacturing method of the plasma display of the present invention uses a wiring forming substrate that is highly versatile and can form wiring with high accuracy, so that at least one of the address electrode and the bus electrode is manufactured. The plasma display itself provided with the bus electrode is also highly reliable.

  Embodiments according to the present invention will be described below.

  First, an embodiment of a wiring formation substrate will be described. The wiring forming substrate according to the present embodiment is used in embodiments related to a wiring forming method and a plasma display manufacturing method which will be described later.

  FIG. 1 is a plan view showing a schematic configuration of a wiring formation substrate according to the present embodiment. In FIG. 1, reference numeral 10 denotes a wiring formation substrate. The wiring forming substrate 10 is mainly composed of a glass substrate (substrate) 10A. As shown in FIG. 1, a large number of dot-like parent members formed on the glass substrate 10A and surrounded by a liquid repellent region 11 are used. The liquid region 12 is configured by regular arrangement.

  In addition, as a base material which comprises the board | substrate for wiring formation, it is not limited to the said glass substrate 10A, For example, various things, such as Si wafer, a plastic film, a metal plate, are mentioned. Furthermore, those in which a semiconductor film, a metal film, a dielectric film, an organic film or the like is formed as a base layer on the surface of these various material substrates are also included.

  Here, the liquid repellent area 11 and the lyophilic area 12 are liquid repellent to the wiring forming ink (conductive functional liquid) to be ejected by using an ink jet method (droplet ejection method) as will be described later. It means the area showing sex or lyophilicity.

  Here, the ink will be described. The ink is composed of a dispersion liquid in which conductive fine particles are dispersed in a dispersion medium. In the present embodiment, as the conductive fine particles, for example, metal oxides containing at least one of gold, silver, copper, aluminum, palladium, and nickel, these oxides, conductive polymers, Superconductor fine particles are used. These conductive fine particles can be used by coating the surface with an organic substance or the like in order to improve dispersibility. The particle diameter of the conductive fine particles is preferably 1 nm or more and 0.1 μm or less. If it is larger than 0.1 μm, there is a risk of clogging in the discharge nozzle of the droplet discharge head described later. On the other hand, if the thickness is smaller than 1 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of organic substances in the obtained film becomes excessive.

  The dispersion medium is not particularly limited as long as it can disperse the conductive fine particles and does not cause aggregation. For example, in addition to water, alcohols such as methanol, ethanol, propanol, butanol, n-heptane, n-octane, decane, dodecane, tetradecane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydro Hydrocarbon compounds such as naphthalene and cyclohexylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2- Methoxyethyl) ether, ether compounds such as p-dioxane, propylene carbonate, γ- Butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, can be exemplified polar compounds such as cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferable and more preferable dispersion media in terms of fine particle dispersibility, dispersion stability, and ease of application to the droplet discharge method. Examples thereof include water and hydrocarbon compounds. In the present embodiment, a hydrocarbon compound is used as the dispersion medium.

  The surface tension of the conductive fine particle dispersion is preferably in the range of 0.02 N / m to 0.07 N / m. When the functional liquid is discharged by the droplet discharge method, if the surface tension is less than 0.02 N / m, the wettability of the functional liquid to the nozzle surface increases, and thus flight bending easily occurs, and 0.07 N / m is set. If it exceeds the upper limit, the shape of the meniscus at the nozzle tip is not stable, and it becomes difficult to control the discharge amount and the discharge timing. In order to adjust the surface tension, a small amount of a surface tension regulator such as a fluorine-based, silicone-based, or nonionic-based material may be added to the dispersion within a range that does not significantly reduce the contact angle with the substrate. The nonionic surface tension modifier improves the wettability of the functional liquid to the substrate, improves the leveling property of the film, and helps prevent the occurrence of fine irregularities on the film. The surface tension modifier may contain an organic compound such as alcohol, ether, ester, or ketone, if necessary.

  The viscosity of the dispersion is preferably 1 mPa · s to 50 mPa · s. When discharging the functional liquid as droplets using the droplet discharge method, if the viscosity is less than 1 mPa · s, the nozzle periphery is easily contaminated by the outflow of the functional liquid, and if the viscosity is greater than 50 mPa · s. The frequency of clogging in the nozzle holes increases, and it becomes difficult to smoothly discharge droplets.

  The lyophilic region 12 preferably has a static contact angle with respect to ink of less than 40 °. As a result, the ink discharged to the lyophilic region 12 is wet and spreads and is held well. On the other hand, the liquid repellent region 11 preferably has a static contact angle with respect to ink of 40 ° or more. Thereby, wetting and spreading on the substrate of the ink discharged to the lyophilic region 12 can be suppressed. For example, if the static contact angle in the lyophilic region 12 is set to 10 ° to 20 ° and the static contact angle in the lyophobic region 11 is set to 40 ° to 50 °, the wettability of each of the regions 11 and 12 can be improved. The difference becomes clear.

  In the present embodiment, the liquid repellent region 11 is provided in a lattice shape on the glass substrate 10A. Therefore, the lyophilic region 12 is formed in a square shape (dod shape) surrounded by the lyophobic region 11, and is regularly arranged on the glass substrate 10A.

  The size of the lyophilic region 12 (the length of one side of the square) is preferably 0.5 μm to 1.0 mm. Further, the ratio of the sizes of the liquid repellent area 11 and the lyophilic area 12 is not particularly limited, but the width of the liquid repellent area 11 (interval between adjacent lyophilic areas 12) is determined by an inkjet method described later. It is preferably smaller than the landing diameter of ink to be ejected (generally about 35 μm). As described above, since the width of the liquid repellent area 11 is larger than the landing diameter of the ink, the ink droplets that have landed on the liquid repellent area 11 spread into the lyophilic area 12 and become liquid pools on the liquid repellent area 11 ( (Bulge) does not occur.

  The wiring forming substrate 10 can be formed by the following method.

  In this embodiment, as a material containing fluorine or a fluorine compound, for example, a fluororesin is formed on the glass substrate 10A by a spin coating method. The fluororesin exhibits liquid repellency with respect to the ink containing the hydrocarbon-based dispersion medium.

  Subsequently, UV (ultraviolet light) having a short wavelength is irradiated onto the glass substrate 10A through a photomask having openings corresponding to the dot-like lyophilic regions 12 as shown in FIG. Then, the region of the fluororesin that has been irradiated with UV having a short wavelength becomes the lyophilic region 12 that exhibits lyophilicity with respect to ink. Further, the region where the UV irradiation is not performed by the mask becomes the liquid repellent region 11 by maintaining the liquid repellent property by the fluororesin.

  Through the steps described above, the wiring forming substrate 10 in which the dot-like lyophilic regions 12 surrounded by the liquid repellent regions 11 are regularly arranged can be formed on the glass substrate 10A.

  The method for manufacturing the wiring forming substrate 10 is not limited to the above method. For example, a positive photosensitive resist and a fluororesin are sequentially laminated on the glass substrate 10A, and the photosensitive resist is exposed through a photomask in which an opening corresponding to the lyophilic region 12 is formed. Thereby, the photosensitive resist in the exposed portion (region corresponding to the lyophilic region 12) and the fluororesin provided on the photosensitive resist are removed, and a part of the glass substrate 10A is exposed. Since the surface of the glass substrate 10A is lyophilic with respect to ink, the exposed surface of the glass substrate 10A functions as the lyophilic region 12. Further, the portion where the fluororesin is provided functions as the liquid repellent region 11. The wiring forming substrate 10 can be formed by the above method.

  The liquid repellent area 11 and the lyophilic area 12 are relatively defined by the difference in wettability with respect to the ink ejected on the substrate, and accordingly, the liquid repellent area 11 and the liquid repellent area 11 and A material constituting the lyophilic region 12 is appropriately selected.

  When an ink containing a hydrocarbon compound-based dispersion medium is used as in the present embodiment, a self-assembled film (SAM) or the like may be formed as the liquid repellent region 11 in addition to the fluororesin. Good. The self-assembled film (self-assembled monolayer: SAM (Self Assembled Monolayer)) is formed by orienting single molecules, so it can be made extremely thin and uniform at the molecular level. Become a film. That is, since the same molecule is located on the surface of the film, uniform and excellent liquid repellency and lyophilicity can be imparted to the surface of the film.

Further, when an ink containing an aqueous dispersion medium is used as the ink, the liquid repellent region 11 may be formed by HMDS treatment. The HMDS treatment is a method in which hexamethyldisilazane ((CH ₃ ) ₃ SiNHSi (CH ₃ ) ₃ ) is vaporized (for example, 120 sec) and then contacted with the surface of the object and then dried (for example, at 95 ° C. for 60 sec). It is. The HMDS treated surface thus formed functions as a liquid repellent region because it exhibits liquid repellency with respect to ink.

  In addition to the above method, after the liquid repellent treatment is performed on the entire surface of the glass substrate 10A, a spot-like light is irradiated onto the liquid repellent treated surface by using a laser or an electron beam, so that a dot-shaped parent is obtained. A liquid region may be formed. Thus, by using a laser or an electron beam, the wiring forming substrate 10 can be formed without using a mask.

  Alternatively, the wiring forming substrate 10 may be formed by laminating a liquid repellent layer and a lyophilic layer on the glass substrate 10A using a printing method such as slit coating or offset printing.

  When the lyophilic region 12 to be formed is large, a liquid repellent layer is formed on the entire surface of the glass substrate 10A, and then a material for forming the dot-like lyophilic region 12 is applied using an inkjet method to form a wiring. The substrate 10 for use may be formed.

  The dodd-like lyophilic region 12 is not limited to the substantially rectangular shape described above as long as it is regularly arranged on the glass substrate 10A, and is, for example, a polygon such as a circle or a triangle. May be. The dot-like lyophilic regions 12 may be regularly arranged. For example, the lyophilic regions 12 may be arranged in a staggered manner as shown in FIG.

  In the wiring forming substrate 10 having such a configuration, even when ink ejected onto the substrate by the ink jet method protrudes from the lyophilic region 12 as described later, this ink repels the lyophilic region 12. By being repelled by the liquid region 11, the liquid region 11 can be held well. Further, the ink ejected between the adjacent lyophilic regions 12 is in a state of covering the lyophobic region 11 between these adjacent lyophilic regions. Further, since the lyophilic area 12 is regularly arranged, the wiring pattern drawn by being held on the lyophilic area 12 becomes highly accurate.

  Therefore, by changing the area from which ink is ejected, it becomes a highly versatile substrate that can accurately form different wiring patterns.

(Wiring formation method)
Next, an embodiment according to the wiring forming method of the present invention will be described. In the present embodiment, the case where the wiring forming substrate 10 is used and wiring is formed on the wiring forming substrate 10 will be described. In the present embodiment, ink is ejected onto the wiring forming substrate 10 using an inkjet method.

  Here, examples of the discharge technique of the droplet discharge method include a charge control method, a pressure vibration method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method. In the charge control method, a charge is applied to a material with a charging electrode, and the flight direction of the material is controlled with a deflection electrode to be discharged from a discharge nozzle. In addition, the pressure vibration method applies an ultra-high pressure of about 30 kg / cm 2 to the material and discharges the material to the nozzle tip side. When no control voltage is applied, the material goes straight and is discharged from the discharge nozzle. When a control voltage is applied, electrostatic repulsion occurs between the materials, and the materials are scattered and are not discharged from the discharge nozzle. The electromechanical conversion method utilizes the property that a piezoelectric element (piezoelectric element) is deformed by receiving a pulse-like electric signal. The piezoelectric element is deformed through a flexible substance in a space where material is stored. Pressure is applied, and the material is extruded from this space and discharged from the discharge nozzle.

  In the electrothermal conversion method, a material is rapidly vaporized by a heater provided in a space in which the material is stored to generate bubbles, and the material in the space is discharged by the pressure of the bubbles. In the electrostatic attraction method, a minute pressure is applied to a space in which a material is stored, a meniscus of material is formed on the discharge nozzle, and an electrostatic attractive force is applied in this state before the material is drawn out. In addition to this, techniques such as a system that uses a change in the viscosity of a fluid due to an electric field and a system that uses a discharge spark are also applicable. The droplet discharge method has an advantage that the use of the material is less wasteful and a desired amount of the material can be accurately disposed at a desired position. In addition, the amount of one drop of the liquid material discharged by the droplet discharge method is 1 to 300 nanograms, for example. In the present embodiment, a method using a piezo element is particularly preferably used.

  Here, prior to the description of the wiring formation process, a case where ink is ejected onto the wiring forming substrate 10 will be described. FIG. 3 is a diagram showing a state in which the ink 13 is ejected onto the wiring forming substrate 10. In FIG. 3, a two-dot chain line indicates a landing area of the ink 13.

  In principle, the ink 13 that has landed on the wiring forming substrate 10 is repelled by the liquid repellent area 11 and spreads into the dot-like lyophilic area 12 surrounded by the liquid repellent area 11. Further, the ink 13 that has landed between adjacent lyophilic regions 12 (when the ink landing region includes a plurality of lyophilic regions 12 as shown in FIG. 3) The liquid-repellent region 11 existing between the adjacent lyophilic regions 12 is also covered. That is, the ink 13 is held in the area indicated by the dotted hatching in FIG. According to the wiring forming substrate 10 according to the present embodiment, the ink 13 can be favorably held on the liquid repellent area 11 and the lyophilic area 12 included in the landing area of the ink 13. Therefore, various patterns can be drawn on the substrate by changing the position of ejecting ink.

  Next, a case where ink 13 is ejected onto the wiring forming substrate 10 to draw a wiring pattern will be described. The wiring pattern means a pattern in which the ink 13 is ejected onto the wiring forming substrate 10, and the wiring is formed by drying and baking the wiring pattern.

  4 and 5 are schematic views showing a state in which a wiring pattern is drawn on the wiring forming substrate 10. In the following description, as shown in FIGS. 4 and 5, it is assumed that the landing diameter of the ink (ink droplet) 13 ejected from the inkjet head is approximately equal to the width of two rows of the lyophilic region 12. A wiring pattern is formed along the moving direction of the head.

  4A is a diagram showing a state in which a wiring pattern is drawn on the wiring forming substrate 10, and FIGS. 4B and 4C are cross-sectional views taken along line AA ′ in FIG. This corresponds to a cross-sectional view of the wiring forming substrate 10 as viewed in the direction of the arrow.

  First, the ink 13 is ejected from the inkjet head (not shown) onto the wiring forming substrate 10 to draw a wiring pattern on the substrate. At this time, as shown in FIG. 4A, the ink 13 is securely held on the lyophilic area 12 and the liquid repellent area 11 included in the area where the ink 13 is ejected, and the wiring pattern P1 is formed on the substrate. , P2 are formed.

  Further, even when the ends of the wiring patterns P1 and P2 protrude from the lyophilic area 12, the ink 13 is repelled in the lyophobic area 11 surrounding the periphery, and as shown in FIG. Retained.

  Therefore, the wiring patterns P1 and P2 drawn on the wiring forming substrate 10 by the ink jet method do not spread more and more on the substrate than necessary, and do not cause a liquid pool (bulge).

  After drawing the wiring patterns P1 and P2, a drying process is performed as necessary to remove the dispersion medium. For example, the drying process can be performed by a normal hot plate or an electric furnace that heats the wiring forming substrate 10. In this embodiment, for example, 180 ° C. heating is performed for about 60 minutes. This heating is not necessarily performed in the air, such as in a nitrogen atmosphere.

  This drying process can also be performed by lamp annealing. The light source used for lamp annealing is not particularly limited, but excimer laser such as infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. Can be used as a light source. In general, these light sources have an output in the range of 10 W to 5000 W, but in the present embodiment, a range of 100 W to 1000 W is sufficient.

  Subsequently, in order to improve the electrical contact between the fine particles in the wiring patterns P1 and P2, it is necessary to completely remove the dispersion medium. Further, when a coating agent such as an organic substance is coated on the surface of the conductive fine particles in order to improve dispersibility, it is also necessary to remove this coating agent. For this reason, the substrate after the discharge process is subjected to heat treatment and / or light treatment.

  The heat treatment and / or light treatment is usually performed in the air, but can also be performed in an inert gas atmosphere such as nitrogen, argon, helium, etc., if necessary. The heat treatment and / or light treatment temperature includes the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as fine particle dispersibility and oxidation, the presence and amount of coating agent, and the heat resistance of the substrate. It is determined appropriately in consideration of temperature and the like. For example, it is necessary to bake at about 250 ° C. in order to remove the coating agent made of organic matter. Through the above steps, the dry films of the wiring patterns P1 and P2 ensure electrical contact between the fine particles and are converted into conductive films. As described above, the wirings 21 and 22 are formed on the wiring forming substrate 10 as shown in FIG.

  According to such a method of forming the wirings 21 and 22, the wiring patterns P1 and P2 are drawn on the wiring forming substrate 10, and the wiring patterns P1 and P2 are baked, so that the accurate wirings 21 and 22 are formed. Can be formed. In addition, the wiring forming substrate 10 is not limited to the shape of the wirings 21 and 22, and can be suitably formed with wirings having various shapes by changing the position at which the ink 13 is discharged. It is expensive. Therefore, the wiring forming method according to the present invention forms wiring on the highly versatile wiring forming substrate 10, and therefore, the design flexibility during wiring formation is very high.

  If the lattice pattern of the liquid-repellent region 11 of the wiring forming substrate 10 is made finer, as shown in FIG. 5, the ink 13 is ejected in an oblique direction, and the oblique wiring can be formed with high accuracy.

  Subsequently, the wiring forming method of the present invention can be applied when forming a part of a thin film transistor (TFT) used as a switching element in a liquid crystal device or the like as shown in FIG. 6 and a wiring connected thereto. In FIG. 6, on a TFT substrate P having TFTs, a gate wiring 40, a gate electrode 41 electrically connected to the gate wiring 40, a source wiring 42, and a source electrically connected to the source wiring 42. An electrode 43, a drain electrode 44, and a pixel electrode 45 electrically connected to the drain electrode 44 are provided. The gate wiring 40 is formed so as to extend in the X-axis direction, and the gate electrode 41 is formed so as to extend in the Y-axis direction. Further, the width H2 of the gate electrode 41 is narrower than the width H1 of the gate wiring 40. The gate wiring 40 and the gate electrode 41 can be formed by the wiring pattern forming method according to the present invention.

  Hereinafter, a method for manufacturing a TFT will be described with reference to FIGS.

  First, the wiring forming substrate 10 is formed as a substrate for forming TFTs. On the wiring forming substrate 10, dot-like lyophilic regions 12 are regularly arranged surrounded by the liquid repellent region 11 as described above.

  In the gate scanning electrode formation step, the gate wiring 40 and the gate electrode 41 are formed by discharging droplets containing a conductive material onto the wiring forming substrate 10 by using an inkjet method.

  As the conductive material at this time, Ag, Al, Au, Cu, palladium, Ni, W-Si, Ti, Mo, Ta, a conductive polymer, or the like can be suitably used. The conductive ink (ink 13) constituting the gate wiring 40 and the gate electrode 41 formed on the wiring forming substrate 10 is favorably held in the lyophilic region 12 and is formed in the adjacent lyophilic region 12. A fine pattern can be obtained by covering the liquid-repellent region 11 therebetween.

  In addition, as shown in FIG. 6, the width H <b> 2 of the gate electrode 41 needs to be narrower than the width H <b> 1 of the gate wiring 40. Therefore, as shown in FIG. 7, the pattern is drawn by ejecting the ink 13 so that the lyophilic regions 12 are included in, for example, two rows in the region constituting the gate electrode 41. Then, the ink 13 is ejected so that the lyophilic region 12 is included in three or more rows (three rows in FIG. 7) in the region constituting the gate wiring 40. Thereby, patterns (gate wiring 40 and gate electrode 41) P3 and P4 having different widths can be accurately formed on the substrate. Then, by drying and baking the patterns P3 and P4, the gate wiring 40 is formed from the pattern P3, and the gate electrode 41 is formed from the pattern P4. Through the above steps, the gate wiring 40 and the gate electrode 41 can be satisfactorily formed on the wiring forming substrate 10.

  Next, as shown in FIG. 8A, the gate insulating film 31 is formed using, for example, the CVD method so as to cover the gate electrode 41 and the gate wiring 40 (not shown). In FIG. 8, a process of forming the peripheral portion of the gate electrode 41 is illustrated. Silicon nitride was formed as the gate insulating film 31. In the present embodiment, after the gate insulating film 31 is formed, a planarization process is performed, so that the upper surface of the gate insulating film 31 becomes a flat surface.

Next, as shown in FIG. 8B, the active layer 30 and the contact layer 29 are continuously formed on the gate insulating film 31 by plasma CVD. An amorphous silicon film is formed as the active layer 30 and an n ⁺ -type silicon film is formed as the contact layer 29 by changing the source gas and plasma conditions.

  Next, as shown in FIG. 8C, a bank 34 is formed on the upper surface of the gate insulating film 31 by using a photolithography method. As a material constituting the bank 34, a polymer material such as an acrylic resin, a polyimide resin, an olefin resin, or a melamine resin is preferably used.

In order to provide the bank 34 with liquid repellency, it is necessary to perform CF ₄ plasma treatment or the like (plasma treatment using a gas having a fluorine component). A material filled with a fluorine group or the like may be used. In this case, CF ₄ plasma treatment or the like can be omitted.

  Next, as shown in FIG. 8 (c), droplets containing a conductive material are ejected by ink jetting into the region partitioned by the bank 34, so that the gate as shown in FIG. 8 (d). A source electrode 43 and a drain electrode 44 intersecting with the electrode 41 are formed.

When the source electrode 43 and the drain electrode 44 are formed, a metal protective layer made of Ni is formed first, then a conductive film layer made of silver is formed, and finally a metal protective layer made of Ni is formed. . The metal protective layer is formed first in order to prevent silver from diffusing into the silicon nitride active layer, the amorphous silicon film, and the n ⁺ type silicon film.

  As the conductive material at this time, a conductive polymer such as Ag, Al, Au, or Cu can be preferably used. Since the source electrode 43 and the drain electrode 44 formed in this manner are given sufficient liquid repellency to the bank 34 in advance, the protrusion from the bank 34 can be suppressed.

  Further, an insulating material 37 is disposed so as to fill the groove 34a in which the source electrode 43 and the drain electrode 44 are disposed. Through the above steps, the flat upper surface 32 made of the bank 34 and the insulating material 37 is formed on the gate insulating film 31 provided on the wiring forming substrate 10.

  Further, a pixel electrode (ITO) 45 connected to the drain electrode 44 through the contact hole 39 is formed on the upper surface 32. When forming the source wiring 42, the wiring forming method according to the present invention may be used.

(Plasma display manufacturing method)
Next, a plasma display obtained by an embodiment of the plasma display manufacturing method will be described with reference to the drawings.

  FIG. 9 is an exploded perspective view showing the plasma display 100. The plasma display 100 is generally composed of a glass substrate (one substrate) 101 and a glass substrate (the other substrate) 102 disposed to face each other, and a discharge display unit 110 formed therebetween. .

  The discharge display unit 110 includes a plurality of discharge chambers 116, and among the plurality of discharge chambers 116, three of the red discharge chamber 116 (R), the green discharge chamber 116 (G), and the blue discharge chamber 116 (B). The two discharge chambers 116 are arranged so as to form one pixel. Address electrodes 111 are formed in stripes at predetermined intervals on the upper surface of the (glass) substrate 101, a dielectric layer 119 is formed so as to cover the address electrodes 111 and the upper surface of the substrate 101, and further a dielectric layer. A partition wall 115 is formed so as to be positioned between the address electrodes 111 on the 119 and along the address electrodes 111. The partition wall 115 is also partitioned at a predetermined interval in a direction perpendicular to the address electrode 111 at a predetermined position in the longitudinal direction (not shown), and is basically adjacent to the left and right sides of the address electrode 111 in the width direction. A rectangular region partitioned by the barrier ribs and the barrier ribs extending in a direction orthogonal to the address electrodes 111 is formed, and a discharge chamber 116 is formed so as to correspond to the rectangular regions. One pixel is composed of three pairs. In addition, a phosphor 117 is arranged inside a rectangular region defined by the partition 115. The phosphor 117 emits red, green, or blue fluorescence. The red phosphor 117 (R) is located at the bottom of the red discharge chamber 116 (R), and the bottom of the green discharge chamber 116 (G). Are arranged with a green phosphor 117 (G) and a blue phosphor 117 (B) at the bottom of the blue discharge chamber 116 (B).

  Next, on the glass substrate 102 side, transparent display electrodes 112 made of a plurality of ITOs are formed in stripes at predetermined intervals in a direction orthogonal to the previous address electrodes 111, and to supplement the high resistance ITO. Further, a bus electrode 112a made of metal is formed. Further, a dielectric layer 113 is formed so as to cover them, and a protective film 114 made of MgO or the like is further formed. The substrate 101 and the glass substrate 102 are bonded to each other so that the address electrodes 111 and the display electrodes 112 are opposed to each other so as to be orthogonal to each other, and are formed on the substrate 101, the partition wall 115, and the glass substrate 102 side. A discharge chamber 116 is formed by exhausting a space surrounded by the protective film 114 and enclosing a rare gas. Note that two display electrodes 112 formed on the glass substrate 102 side are formed so as to be arranged two by two for each discharge chamber 116. The address electrode 111 and the display electrode 112 are connected to an alternating current power supply (not shown), and the phosphor 117 is excited to emit light in the discharge display unit 110 at a necessary position by energizing each electrode, thereby enabling color display. ing.

  In the plasma display manufacturing method according to the present embodiment, the address electrodes 111 provided on the glass substrate 101 side and the bus electrodes 112a provided on the glass substrate 102 side are formed by the wiring formation method described above. is doing.

  In other words, the address electrodes 111 and the bus electrodes 112a are formed on the wiring forming substrate 10 in which a large number of dot-like lyophilic regions 12 surrounded by the liquid-repellent regions 11 are regularly arranged. The ink 13) is ejected and baked.

  Therefore, the manufacturing method of the plasma display 100 can form the address electrodes 111 and the bus electrodes 112a formed with high accuracy, and thus the plasma display 100 with high performance and high reliability can be provided.

It is a top view which shows schematic structure of the board | substrate for wiring formation. It is a figure which shows the modification of the board | substrate for wiring formation. It is a figure which shows the state which discharged the ink on the wiring formation board | substrate. It is a figure explaining the process of drawing a wiring pattern on the board | substrate for wiring formation. It is a figure explaining the process of performing diagonal drawing on the board | substrate for wiring formation. It is a figure which shows the structure of a thin-film transistor. It is a figure explaining the process of forming a gate wiring and a gate electrode. FIG. 8 is a diagram illustrating a process for manufacturing the TFT following FIG. 7. It is a disassembled perspective view which shows a plasma display.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10A ... Glass substrate (substrate), 10 ... Substrate for wiring formation, 11 ... Liquid repellent area, 12 ... Lipophilic area, 13 ... Ink (conductive functional liquid), 100 ... Plasma display, 111 ... Address electrode, 112a ... Bus electrode

Claims (6)

  A substrate for wiring formation, wherein a large number of dot-like lyophilic regions surrounded by a liquid repellent region are regularly arranged on a substrate.   The wiring formation substrate according to claim 1, wherein the liquid repellent region is provided in a lattice shape on the substrate.   The wiring forming substrate according to claim 1, wherein the lyophilic regions are arranged in a staggered pattern on the substrate. A step of regularly arranging a large number of dot-like lyophilic regions surrounded by a liquid repellent region on a substrate;
A step of discharging a conductive functional liquid into a wiring pattern by using a droplet discharge method on the substrate; and a step of baking the conductive functional liquid to form a wiring. Method for forming wiring.   The wiring forming method according to claim 4, wherein a landing diameter of the conductive functional liquid discharged by the droplet discharge method is larger than a width of the liquid repellent region. In a method for manufacturing a plasma display, comprising a pair of substrates arranged opposite to each other, an address electrode provided on one substrate, and a bus electrode provided on the other substrate,
A step of regularly arranging a large number of dot-like lyophilic regions surrounded by a liquid repellent region on a substrate;
A step of discharging a conductive functional liquid into a wiring pattern using a droplet discharge method on the wiring forming substrate, and baking the conductive functional liquid, thereby at least one of the address electrode and the bus electrode is formed. And a step of forming the plasma display.

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