JP2008026726A - Compact camera module capable of surface mounting and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact camera module capable of surface mounting which prevents optical characteristics of a lens module from being adversely affected by a high temperature during a process of surface mounting. <P>SOLUTION: The compact camera module capable of surface mounting comprises at least a compact camera module base 106 and the lens module 104 assembled into the compact camera module base, wherein the upper part of the compact camera module base is covered by utilizing a heat insulating cap 102. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a compact camera module, and more particularly, to a compact camera module that can be surface mounted.

  In recent years, mobile phones have been greatly welcomed because they have built-in camera functions. In particular, since the opening of the third generation mobile phone system, each mobile phone has one or two compact cameras (CCM). ) To implement the video telephone function. In addition, the supply and demand of compact cameras in the market is booming due to the application of image phones and webcams.

  Since the CCM is very compact and its control circuit needs to be small, the control circuit is assembled using a surface mount method (SMT) that is highly accurate and suitable for miniaturization. It is common. In the CCM method, in order to maintain a uniform temperature, the tin paste is usually melted and soldered by heating with infrared rays or hot air. In the case of lead-containing solder, the soldering temperature is about 217 to 230 ° C, and in the case of lead-free solder, the soldering temperature is about 237 to 265 ° C. On the other hand, the surface-mounted component is exposed to a high temperature of at least 150 ° C. or higher throughout the soldering process. A CCM lens is usually made of a molded article such as polycarbonate (PC) or an optical plastic material. However, although they are inexpensive, their heat-resistant temperature is only about 80-120 ° C. Therefore, if the entire compact camera module is introduced into the surface mounting process in a high temperature atmosphere, the optical characteristics of the lens module will be seriously affected.

  Due to limitations in the above process, a compact camera module is manufactured by a method in which the lens module and the control circuit are designed separately and the control circuit is separately manufactured, and then the control circuit is combined with the lens module. It has become. Further, combinations include a flexible printed circuit board type (FPCB), a board-to-board type, and a socket type.

  These combined forms have one obvious drawback common to all. That is, the space required is too large. The reason for this is that the lens module and the control circuit module are combined only after the control circuit module has undergone the surface mounting process. Therefore, each combination type requires components such as a coupler, and the height or area is the same. Therefore, it cannot be an ideal value. In addition to the disadvantage of occupying a large space, each combination type requires another base and coupler, which leads to waste of cost and resources. For example, in the case of the flexible printed circuit board type, in addition to the cost of the controller and the lens module, the cost of the flexible printed circuit board and the coupler connecting both are added. In addition, in order to determine the quality of the product, the control circuit module requires an inspection process after the surface mounting process, and the compact camera module also requires another inspection process after its completion. It is a waste of human power.

  Due to the drawbacks of the compact camera module as described above, it is no longer possible to meet the immediate market demands. Therefore, development of compact camera modules that can overcome the limitations of the surface mounting process, reduce the number of manufacturing steps, and achieve smaller volume and lower cost is the current goal of each manufacturer. ing.

  The present invention has been proposed in view of such circumstances, and an object of the present invention is to provide a method for manufacturing a compact camera module for overcoming the problem of limitations in the surface mounting process.

  Furthermore, an object of the present invention is to provide a compact camera module that can reduce the number of manufacturing and inspection processes and achieve further reduction in volume and cost.

  To achieve the above object, the present invention provides a step of preparing a compact camera module base, a step of incorporating a lens module into the compact camera module base, a step of covering the compact camera module base with a heat insulating cap, A method of manufacturing a surface-mountable compact camera module including at least a surface mounting step.

  Furthermore, in order to achieve the above-described object, the present invention provides a compact camera module base, a lens module incorporated in the compact camera module base, and a surface mounting process by covering the compact camera module base from above. A surface mountable compact camera module having at least a heat insulating cap for avoiding optical characteristics of the lens module so as not to be affected by high temperature during the process is provided.

  The advantage of the present invention is that the lens module is directly coupled to the control circuit module and introduced together into the surface mounting process, thereby reducing the conventional drawbacks, ie, the control circuit in the compact camera module, the lens module, and the like. The problem of having to be assembled after separately manufacturing is overcome, the occupied volume is reduced, and the cost and the number of steps of the coupler and assembly can be reduced. Furthermore, as for the quality of the compact camera module, only a single inspection after the surface mounting process is required, and it is not necessary to separately inspect the control circuit module and the lens module, thereby reducing manpower and the time required for the inspection process. Can be shortened.

  In the present invention, the entire compact camera module can be covered using the heat insulating cap, and the lens module in the compact camera module can be introduced into the surface mounting process together with the control circuit module. Thereby, the number of manufacturing steps, volume, and cost of the entire compact camera module can be reduced. Under the conditions that do not limit the concept and application scope of the present invention, those skilled in the art to which the present invention pertains will understand the concept of the present invention and then modify the application scope of the present invention. Of course, it can meet application demand. In addition, the materials and equipment used can be modified to match the parameters in various processes.

  The manufacturing process of the surface mountable compact camera module in this embodiment will be described in detail with reference to FIGS.

  FIG. 1 is a structural diagram showing a surface mountable compact camera module according to a preferred embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line I-II of FIG. 1 for the surface mountable compact camera module of the present invention. As is clear from FIG. 1, the compact camera module of the embodiment was covered on the substrate 108, the lens module 104, the compact camera module base 106 for installing the lens module 104, and the lens module 104. It consists of a polyester film 110 and a heat insulating cap 102. Further, the internal structure of the compact camera module will be described with reference to FIG. Inside the compact camera module, an image sensor (photosensitive element) 202 positioned on the substrate 108 and a lens 204 are provided. A circuit element 201 essential for controlling the compact camera module is provided on the substrate 108. Furthermore, in order to overcome the disadvantage that the conventional lens module 104 and the lens 204 cannot withstand high temperatures during the surface mounting process, the present embodiment covers the entire compact camera module using one heat insulating cap 102, A thermal cap 102 is used to isolate the module from high temperatures in the surface mounting process. This prevents the internal lens from damaging the optical properties due to the high temperature.

  A reflow furnace in a normal surface mounting process solders each element over a high temperature of 200 ° C. or more and a time of about 3 minutes. However, the tolerable temperature of the polycarbonate or optical plastic material used for the lens 204 inside the lens module 104 is only about 80-120 ° C. Therefore, in order to enable the lens module 104 to be introduced into the surface mounting process, in the present invention, the heat in the surface mounting process penetrates (transfers) into the lens module 104 by using one heat insulating cap 102. To prevent.

  The heat insulating cap 102 used here is composed of a plastic material that withstands high temperatures having low thermal conductivity and high heat resistance (the heat-resistant temperature is higher than the temperature that occurs during the surface mounting process). . Since the heat resistant temperature of the plastic material that can withstand this high temperature is 300 ° C. or higher, the heat insulating cap 102 is not affected by the high temperature during the process during the surface mounting process. Furthermore, since the heat insulating cap 102 has low thermal conductivity, the inside of the heat insulating cap 102 should be isolated from the influence of hot air during the surface mounting process so that the internal temperature of the heat insulating cap 102 does not exceed 80 ° C. within 3 minutes. Can do. Such a design of the heat insulating cap 102 can achieve the purpose of introducing the surface mounting process of the lens module 104. Below, in order to understand the use and purpose of each element, the manufacturing process of the compact camera module of a present Example is demonstrated.

  In order to understand the installation order of each element and its effect, description will be given with reference to FIGS. 3A to 3F. These drawings are cross-sectional views showing the order of the steps of the manufacturing method according to the embodiment of the present invention, and all the cross-sections are cross-sections taken along the line I-II in FIG. The same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. First, FIG. 3A shows the compact camera module base 106. The compact camera module base 106 is made of a liquid crystal polymer material that can withstand a high temperature of 250 ° C. A substrate 108 is disposed on the bottom of the compact camera module base 106, and a photosensitive element (image sensor) 202 and a circuit element 201 essential for controlling the compact camera module are provided thereon.

  Next, in FIG. 3B, the lens module 104 is installed on the compact camera module base 106. In order to increase the assembly efficiency, a screwing method is employed in this embodiment. The lens module 104 is tuned by adjusting lens module parameters in advance so that the best image can be obtained during use. A lens 204 is provided in the lens module 104. Usually, the lens 204 is made of polycarbonate or optical plastic.

  After the assembly is completed, the polyester film 110 is covered on the lens module 104 as shown in FIG. 3C. The polyester film 110 protects the lens module 104 and prevents foreign matters such as dust particles from entering the compact camera module 104 and causing defects.

  Next, as shown in FIG. 3D, the heat insulating cap 102 is covered on the upper part of the compact camera module base 106. The heat insulating cap 102 is made of a heat resistant plastic material that can withstand a high temperature of 300 ° C. and does not deform. Moreover, it has low thermal conductivity, and the internal temperature can be prevented from exceeding 80 ° C. in a short time during the surface mounting process.

  Next, surface mounting is performed in the state shown in FIG. 3E. Since surface mounting is a known technique, its detailed description is omitted. After the surface mounting process is completed, the heat insulating cap 102 and the polyester film 110 are removed as shown in FIG. 3F. Thereafter, a sampling inspection is performed to verify the product. In FIG. 3F, except for the samples that need to be inspected, these treatments are omitted, that is, the product is shipped directly to the customer without removing the heat insulating cap 102 and the polyester film 110, and when the customer needs it. The heat insulating cap 102 and the polyester film 110 can be removed. In this way, since the heat insulating cap 102 and the polyester film 110 are used for protection during transportation, it is possible to reduce the damage rate due to collision and the like, and to reduce the dust-proof packaging cost.

  What is important throughout the process is the design of the insulating cap 102. Those skilled in the art can respond to various process requirements, costs, and practical requirements by changing the length of the internal temperature of the heat insulating cap 102 by increasing or decreasing the thickness of the heat insulating cap 102.

  From the preferred embodiments of the present invention, it can be seen that the following advantages can be obtained by applying the present invention. That is, by installing the heat insulating cap, the lens module of the compact camera module and the control circuit module can be assembled together and introduced into the surface mounting process. By doing so, it is not necessary to separately connect the lens module and the control circuit module with a coupler, thereby reducing the cost, reducing the volume, and saving resources. In addition, since the lens and the control circuit module are already assembled together before being introduced into the surface mounting process, it is not necessary to perform the next assembling process after the surface mounting process as in the prior art. Only one inspection after the surface mounting process is required, which can greatly increase the production efficiency and reduce the number of inspection personnel.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to these embodiments, and various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the present invention. Of course. Therefore, the scope of protection of the present invention should be considered as defined by the appended claims.

FIG. 2 is a structural diagram illustrating a surface mountable compact camera module according to a preferred embodiment of the present invention. It is a figure which shows the cross section in the I-II line | wire of FIG. 1 of the compact camera module which can be surface mounted by this invention. It is sectional drawing which shows each process in the compact camera module manufacturing method which can be mounted on the surface of the preferable Example by this invention, and shows the cross section in the position in the I-II line of FIG. It is sectional drawing which shows each process in the compact camera module manufacturing method which can be mounted on the surface of the preferable Example by this invention, and shows the cross section in the position in the I-II line of FIG. It is sectional drawing which shows each process in the compact camera module manufacturing method which can be mounted on the surface of the preferable Example by this invention, and shows the cross section in the position in the I-II line of FIG. It is sectional drawing which shows each process in the compact camera module manufacturing method which can be mounted on the surface of the preferable Example by this invention, and shows the cross section in the position in the I-II line of FIG. It is sectional drawing which shows each process in the compact camera module manufacturing method which can be mounted on the surface of the preferable Example by this invention, and shows the cross section in the position in the I-II line of FIG. It is sectional drawing which shows each process in the compact camera module manufacturing method which can be mounted on the surface of the preferable Example by this invention, and shows the cross section in the position in the I-II line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 102 Thermal insulation cap 104 Lens module 106 Compact camera module base 108 Board | substrate 110 Polyester film 201 Circuit element 202 Photosensitive element (image sensor)
204 lens

Claims (12)

(A) preparing a compact camera module base;
(B) incorporating a lens module into the compact camera module base;
(C) covering the compact camera module base with a heat insulating cap;
(D) A method for producing a surface-mountable compact camera module, comprising at least a step of performing surface mounting.   The surface mountable compact camera module according to claim 1, wherein the compact camera module includes at least an image sensor, the lens module, and a control circuit for controlling the compact camera module. Production method.   2. The method for manufacturing a surface mountable compact camera module according to claim 1, wherein the material of the compact camera module base is a liquid crystal polymer material.   2. The method of manufacturing a surface mountable compact camera module according to claim 1, wherein the step (b) further includes tuning of lens module parameters relating to the lens module.   2. The surface mounting according to claim 1, wherein in the step (b), the lens module is further covered with a polyester film for preventing foreign matters such as dust particles from entering the compact camera module. 3. Possible manufacturing method of compact camera module.   The heat insulating cap isolates the compact camera module from a high temperature in a general surface mounting process, and for the material of the heat insulating cap, the temperature in the heat insulating cap is set within the period of the step (d). 2. The surface according to claim 1, wherein the surface is a plastic material capable of withstanding a high temperature to be lower than the heat resistant temperature of the lens in the step, and the heat resistant temperature is higher than a temperature generated during the period of the step (d). Manufacturing method of mountable compact camera module. Compact camera module base,
A lens module incorporated in the compact camera module base;
By covering from above the compact camera module base, it has at least a heat insulating cap for avoiding optical characteristics of the lens module from being affected by high temperature during the surface mounting process. A compact surface mountable compact camera module.   The surface mountable compact camera module according to claim 7, wherein the compact camera module includes at least an image sensor, the lens module, and a control circuit for controlling the compact camera module.   8. The surface mountable compact camera module according to claim 7, wherein the material of the compact camera module base is a polymer liquid crystal material.   8. The surface mountable compact camera module according to claim 7, wherein the lens parameter is tuned so that the best image can be obtained in use before the lens module is assembled.   8. The surface mountable compact camera module according to claim 7, wherein an upper portion of the lens module is covered with a polyester film for preventing foreign matters such as dust particles from entering the compact camera module. . The material of the heat insulating cap is a plastic material that can withstand high temperatures in order to make the lens temperature in the lens module lower than the heat resistance temperature of the lens body during the surface mounting process, and the heat resistance temperature of the surface mounting process is 8. The surface mountable compact camera module according to claim 7, wherein the temperature is higher than a temperature generated within a period.

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