JP2008021911A - Piece jig for substrate dividing device, and substrate dividing device provided therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piece jig for dividing device of an assembled printed circuit board which is provided with reusable components, and to provide a substrate dividing device in order to cope with manufacturing of a wide variety of products in small quantities. <P>SOLUTION: The substrate dividing device consists of each piece jig for a substrate dividing device. The device is composed of an upper dividing piece jig that comprises an upper piece, a spring, a punch holder, and a punch; and a lower dividing piece jig that comprises a lower piece arranged oppositely to the upper piece and a lower-piece presser, an upper jig arranged at a position above a printed circuit board, and a lower jig arranged at a position below the printed circuit board. The upper jig is composed of one fixed design jig plate and two individual design jig plates, onto which each upper dividing piece jig of the piece jig for a substrate dividing device is freely attachably/detachably mounted. The one fixed design jig plate and the two individual design jig plates are freely attachably/detachably arranged respectively in turn from the upper position to the lower position. The lower jig is composed of one fixed design jig plate and one individual design jig plate, onto which each lower dividing piece jig of the piece jig for a substrate dividing device is freely attachably/detachably mounted. The one fixed design jig plate and the one individual design jig plate are freely attachably/detachably arranged respectively in turn from the lower position to the upper position. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a board dividing device piece jig used for dividing an individual printed wiring board from an aggregate printed wiring board formed by combining a plurality of individual printed wiring boards, and a substrate dividing apparatus provided with the same, in particular. The present invention relates to a board dividing device piece jig that can be removed from the apparatus and can be reused, and a substrate dividing apparatus including the same.

  The small-sized individual printed wiring board 61 used for applications such as an SD card and a camera module is in the form of a collective printed wiring board 60 in which a plurality of individual printed wiring boards 61 are coupled as shown in FIG. Often used.

  Such a collective printed wiring board 60 is generally provided with a connecting portion 64 on the side surface or corner of the individual printed wiring board 61, and the individual printed wiring boards 61 are connected to each other by the connecting portion 64. And the outer frame 62 are connected to each other.

  As a method of mounting various electronic components typified by a resistor, a capacitor and the like on the surface of such an individual printed wiring board 61, it is first required in the state of the collective printed wiring board 60 as shown in FIG. The component is mounted by soldering and reflow heating. Next, the connecting portion 64 that connects the individual printed wiring boards 61 is cut by punching to obtain the individual printed wiring board 61 as a single unit.

  Here, after mounting the above components, a processing method for cutting the connecting portion 64 that connects the individual printed wiring boards 61 by punching is to use a conventional substrate dividing apparatus provided with a substrate dividing jig. It was done by.

  As an example of a conventional substrate dividing apparatus, as shown in FIG. 8, a dividing line related to the connecting portion of the aggregate printed wiring board 86 is arranged with the cutting edges of the upper blade 74 and the lower blade 87 sandwiched between each other. The lower die 88 supporting and fixing the lower blade 87, the upper die lower member 76 supporting and fixing the upper blade 74, and the upper die upper member 70 supporting and fixing a dropping pin 75 that can be moved up and down by a spring 72. There is a substrate dividing device, and this substrate dividing device cuts the printed wiring board along the dividing line by the cooperation of the upper blade 74 and the lower blade 87 when the upper die dropping pin 75 is lowered (see FIG. Patent Document 1).

  In this type of substrate dividing apparatus, when cutting the coupling portion 64 shown in FIG. 7, since the individual printed wiring board 61 can be held at the same time as the cutting, the individual prints after cutting the coupling portion 64 are performed. The wiring board 61 is not dropped, and parts are not dropped or an electrical failure is not caused by dropping. Further, since a plurality of individual printed wiring boards 61 can be collected by a single cutting process, this is an effective processing method in the case of industrial mass production.

  However, the conventional substrate dividing apparatus has the following problems.

  The substrate dividing apparatus as shown in FIG. 8 is effective in greatly reducing the production cost and the production time because a large number of printed wiring boards can be divided. However, in recent years, electrical appliances typified by mobile phones and personal computers have a short model change unit period, and new models are sent to the market one after another, and the printed wiring boards used inside the electrical appliances are also individual. The specifications frequently change, and the substrate dividing apparatus corresponding to the specifications is often required.

  Therefore, the substrate dividing apparatus as shown in FIG. 8 is effective in the case of mass production type manufacturing, but in the case of small quantity and multi-product production, it is processed by one type of dividing apparatus. Due to the small number of products produced, there was a problem that the depreciation cost of equipment increased.

Also, when manufacturing a substrate dividing apparatus corresponding to a new product, it has to be made early in a short period of time, causing a problem such as a delay in delivery time.
JP-A-6-238595

  The problem to be solved by the present invention based on such a background is that a board dividing apparatus that divides an individual printed wiring board from an aggregate printed wiring board formed by combining a plurality of individual printed wiring boards corresponds to a small variety of products. It is another object of the present invention to provide a board splitting device jig and a board splitting device having reusable parts so that they can be manufactured easily and in a short period of time.

  The inventor has made various studies in order to solve the above problems. As a result, the piece jig for the substrate dividing apparatus is composed of a pair of upper and lower divided piece jigs that can be detached from the substrate dividing apparatus, and the substrate dividing apparatus is further fixed to a reusable fixed design jig plate and an individual design jig. The present invention has been completed by finding that a very good result can be obtained if the pair of upper and lower divided piece jigs are detachably mounted on the individual design jig plate while being constituted by a tool plate.

  That is, the present invention is a piece jig for a substrate dividing device for punching out the connecting portion and dividing the individual printed wiring board individually from a collective printed wiring board in which a plurality of individual printed wiring boards are connected by a connecting portion, Substrate division comprising an upper division piece jig composed of an upper piece, a spring, a punch holder, and a punch, and a lower division piece jig comprised of a lower piece and a lower piece presser arranged opposite to the upper piece The problem is solved by the piece jig for the apparatus.

  Further, the present invention is a substrate dividing apparatus for punching out the connecting portion and dividing the individual printed wiring board individually from a collective printed wiring board in which a plurality of individual printed wiring boards are connected by a connecting portion. The apparatus is composed of an upper jig arranged above the printed wiring board and a lower jig arranged below the printed wiring board, and the upper jig is detachably arranged in order from the upper to the lower one. It consists of two individual design jig plates that are detachably mounted with a design jig plate and an upper division piece jig of the board dividing apparatus piece jig, and the lower jig is detachably arranged in order from the lower to the upper. According to a substrate splitting apparatus, comprising: one fixed design jig plate; and one individual design jig plate on which a lower split piece jig of the board split device piece jig is detachably mounted. It is obtained by solving the above problems.

  According to the present invention, since the piece jig for the substrate dividing apparatus can be detached from the substrate dividing apparatus as a single unit, it can be reused. In addition, each jig plate of the substrate dividing apparatus can be detached from the substrate dividing apparatus as a single unit, so that it can be reused. As a result, since the substrate dividing apparatus provided with the dividing piece jig can be manufactured easily and in a short period of time, it is possible to cope with a small variety of products.

The present invention will be described below with reference to the drawings showing embodiments.
First, the term “printed wiring board P1” used in the following description refers to a collective printed wiring board 60 in which a plurality of individual printed wiring boards 61 are connected via a coupling portion 64 as shown in FIG. Such a printed wiring board. Moreover, the place where the target punching process is performed by the substrate dividing apparatus is a coupling portion 64 to which the individual printed wiring board 61 is connected.

  FIG. 1 shows a substrate dividing apparatus according to the present invention.

  The overall configuration of the substrate dividing apparatus of the present invention shown in FIG. 1 is roughly divided into an upper jig L1 and a lower jig L2. The upper jig L1 is composed of three types of jig plates including a top plate 1, a punch plate 2, and a stripper support plate 3, and the upper split Komaji is located inside the punch plate 2 and the stripper support plate 3. The tool 30 is detachably accommodated. The lower jig L2 is composed of two types of jig plates including a die support plate 4 and a die holder 5, and a lower divided piece jig 40 is detachably accommodated inside the die plate 4. ing. The characteristic locations and functions of the jig plates L1 and L2 and the board splitting device piece jigs 30 and 40 will be described in the following order.

  The substrate dividing apparatus of the present invention shown in FIG. 1 has a structure in which each jig plate constituting the substrate dividing apparatus can be individually detached in order to solve the conventional problems or problems.

  First, the top plate 1, the punch plate 2 and the stripper support plate 3 constituting the upper jig L1 can be removed individually, that is, the above three kinds of jig plates are individually present, and their respective jigs. The fixture plate is detachably fixed by the plate connection fittings 21a and 21b so as to be integrated to constitute the upper jig L1 of the substrate dividing apparatus. In the example shown in FIG. 1, these jig plates are detachably connected to the top plate 1 and the punch plate 2 by using a plate connection fitting 21 a, and are also used by using the plate connection fitting 21 b. The punch plate 2 and the stripper support plate 3 are connected and fixed in a detachable manner, but the specific connection fixing positions of the plate connection fittings 21a and 21b are determined by the size of the jig plate, and the connection fixing is sufficient. Therefore, the position and size are not limited, and the jig plate is provided at a desired plurality of locations. The plate connection fittings 21a and 21b are not particularly limited as long as the plate members can be detachably connected and fixed, and examples thereof include hexagon socket bolts and knock pins.

  The top plate 1 is disposed on the upper stage of the upper jig L1 as shown in FIG. The role of the top plate 1 mainly includes (i) pressing of the upper split piece jig 30 and (ii) fixing of the guide post 25.

  The (i) pressing of the upper divided piece jig 30 has a role of holding the punch holder 33 and the punch 34 in the upper divided piece jig 30 described later so as not to jump upward. Thereby, even if the upper division | segmentation piece jig | tool 30 operates continuously, a printed wiring board can be divided | segmented stably. On the other hand, the top plate 1 and the upper split piece jig 30 are not fixed and are merely in contact with each other. Thereby, the top plate 1 can be easily removed as a single jig plate by removing the plate connection fitting 21a.

  Next, (ii) the fixing of the guide post 25 will be described. First, when the printed wiring board is divided, the upper jig L1 is lowered, and at that time, a guide post 25 detachably attached to the upper jig L1 is provided in the lower jig L2. By entering into the guide bush 26, the production can be stably performed without causing a position shift even when continuously operated. Therefore, the guide post 25 is important for suppressing misalignment problems, and the top plate 1 is used for detachably fixing the guide post 25. Here, as a means for detachably attaching the guide post 25 to the upper jig L1, for example, there is a method in which the top plate 1 is subjected to a drop preventing shank head relief process and fixed by insertion and press-fitting.

  In addition to being able to be removed as a single jig plate, the top plate 1 used in this manner can be arbitrarily printed circuit board by fixing the position of the guide post 25 on the design. It can also be used in the division of. As a result, the top plate 1 can be reused when manufacturing a substrate dividing apparatus having another design specification. Furthermore, since the top plate 1 can be reused, the substrate dividing apparatus can be manufactured in a short period of time, and the cost for manufacturing can be reduced.

  As shown in FIG. 1, the punch plate 2 is disposed in the middle stage of the upper jig L1. The role of the punch plate 2 includes accommodation of the upper split piece jig 30.

  The accommodation of the upper divided piece jig 30 is necessary for providing the upper divided piece jig 30 at a desired position where the printed wiring board is divided. The upper divided piece jig 30 is accommodated by, for example, providing a penetrating structure divided piece jig accommodating space 35 in the punch plate 2 and accommodating and arranging the upper divided piece jig 30 in the divided piece jig accommodating space 35. . On the other hand, the punch plate 2 and the upper divided piece jig 30 are not bonded and fixed. As a result, the upper divided piece jig 30 is accommodated in the divided piece jig receiving space 35 provided in the punch plate 2, and the upper divided piece jig 30 is easily put in and out of the divided piece jig containing space 35. be able to. Further, the punch plate 2 can be easily removed as a single jig plate by removing the plate connection fitting 21a and the plate connection fitting 21b.

  In addition to being detachable as a single jig plate, the punch plate 2 used in this manner can be easily designed and manufactured by providing, for example, a split jig housing space 35 having a penetrating structure. can do. As a result, the punch plate 2 can be manufactured in a short period of time if the desired position for dividing the printed wiring board can be recognized by design, and the substrate dividing apparatus can be manufactured in a short period of time. Therefore, it is possible to cope with a small variety of products.

  The stripper support plate 3 is arranged at the lower stage of the upper jig L1 as shown in FIG. The role of the stripper support plate 3 includes fixing the position of the upper piece 31 of the upper dividing jig 30 in particular.

  Fixing the position of the upper divided piece jig 30, particularly the upper piece 31, is necessary to provide the upper divided piece jig 30 at a desired position where the printed wiring board is divided. The position of the upper piece 31 is fixed by, for example, providing an upper piece accommodation space 36 of a penetrating structure in the stripper support plate 3 and fixing the upper piece 31 of the upper divided piece jig 30 in the upper piece accommodation space 36. Done. By fixing the position of the upper piece 31, the printed wiring board can be stably divided even if the upper division piece jig 30 is continuously operated. On the other hand, the position fixing of the stripper support plate 3 and the upper split piece jig 30, particularly the upper piece 31, is merely housed, unlike the state of connection fixing or adhesive fixing by a connection or adhesion method. Since the gap between the upper piece 31 and the upper piece accommodation space 36 accompanying the accommodation is strictly designed, the upper piece 31 is not in an unintentionally shaken state. Thus, the upper piece 31 is in a state of being accommodated in the upper piece accommodation space 36 provided in the stripper support plate 3, and the upper piece 31 can be easily put in and out of the upper piece accommodation space 36. Further, the stripper support plate 3 can be easily removed as a single jig plate by removing the plate connecting bracket 21b.

  In addition to being removable as a single jig plate, the stripper support plate 3 used in this manner can be easily designed and manufactured by providing, for example, an upper piece storage space 36 of a penetrating structure. can do. As a result, the stripper support plate 3 can be manufactured in a short period of time if the desired position for dividing the printed wiring board can be recognized in the design, and the substrate dividing apparatus can be manufactured in a short period of time. Therefore, it is possible to cope with a small variety of products.

  In addition, the die support plate 4 and the die holder 5 constituting the lower jig L2 can be individually removed, that is, the above two kinds of jig plates exist individually and are connected to each other. The lower jig L2 of the substrate dividing apparatus is configured by being detachably fixed by the metal fitting 21c. In the example shown in FIG. 1, these jig plates are detachably connected to the die support plate 4 and the die holder 5 using the plate connection fitting 21c. The specific connection fixing location is determined by the size of the jig plate, and the purpose is that the connection fixing is sufficiently performed. Are provided at a plurality of locations. In addition, the same thing as the above-mentioned plate connection metal fittings 21a and 21b is used as the plate connection metal fitting 21c.

  The die support plate 4 is disposed on the upper stage of the lower jig L2 as shown in FIG. The roles of the die support plate 4 mainly include (i) fixing of the position of the lower piece 41 of the lower divided piece jig 40, and (ii) fixing of the support guide 24.

  (I) The position of the lower divided piece jig 40, particularly the position of the lower piece 41, is fixed to prevent the lower divided piece jig 40, which will be described later, from protruding in the vertical direction. Thereby, even if the lower division | segmentation piece jig | tool 40 operates continuously, a printed wiring board can be divided | segmented stably. On the other hand, the position fixing of the die support plate 4 and the lower split piece jig 40, particularly the lower piece 41, is merely housed, unlike the state of connection fixing or adhesive fixing by connection or adhesion method. Since the gap between the lower piece 41 and the lower piece accommodation space 37 accompanying the accommodation is strictly designed, the lower piece 41 is in a state in which no unintentional shake occurs.

  Next, (ii) fixing of the support guide 24 will be described. First, as shown in FIG. 4, the support guide 24 is used to arrange the printed wiring board P <b> 1 on the support guide 24.

  In addition to being detachable as a single jig plate, the die support plate 4 used in this manner can be easily designed and manufactured by providing, for example, a lower piece storage space 37 of a penetrating structure. can do. As a result, the die support plate 4 can be manufactured in a short period of time if the desired position for dividing the printed wiring board can be recognized by design, and the substrate dividing apparatus can be manufactured in a short period of time. Therefore, it is possible to cope with a small variety of products.

  The die holder 5 is arranged at the lower stage of the lower jig L2 as shown in FIG. The role of the die holder 5 includes the formation of a dust receiving space 38.

  The dust reception will be described. This is for receiving dust generated when the printed wiring board is divided, and by providing a dust receiving space 38 by the die holder 5 below the lower dividing jig 40, the dust receiving space 38 is provided with dust. Is supposed to fall.

  In addition to being detachable as a single jig plate, the die holder 5 used in such a manner can be arbitrarily printed by fixing the design position such as the dust receiving space 38. The wiring board can also be used in division. Thereby, the die holder 5 can be reused when manufacturing another substrate dividing apparatus. Furthermore, since the die holder 5 can be reused, the substrate dividing apparatus can be manufactured in a short period of time, and the manufacturing cost can be reduced, so that it is possible to deal with a small variety of products.

  The top plate 1, punch plate 2, stripper support plate 3, die support plate 4, and die holder 5 described so far are designed according to individual specifications of the reusable top plate 1, die holder 5 and printed wiring board. The punch plate 2, the stripper support plate 3 and the die support plate 4 can be classified. In the present invention, the reusable top plate 1 and die holder 5 are referred to as “fixed design jig plate” whose design specifications are constant, and the punch plate 2 and stripper support that can be designed according to the individual specifications of the printed wiring board. The plate 3 and the die support plate 4 are referred to as “individually designed jig plates”.

  FIG. 2 shows a piece jig for a substrate dividing apparatus according to the present invention. With reference to FIG. 2, the board jig for a substrate dividing apparatus according to the present invention will be described in the following order.

  2 is roughly divided into an upper divided piece jig 30 and a lower divided piece jig 40. As shown in FIG. As shown in FIG. 2 (a), the upper split piece jig 30 is composed of an upper piece 31, a spring 32, a punch holder 33, and a punch 34, which are arranged in order from the lower part to the upper part so as to be assembled and separated. The upper divided piece jig 30 configured and assembled with the above components has a structure shown in FIG. Incidentally, the upper piece 31 is provided with an outward projecting portion 31 a at the upper end thereof, and is engaged with the stripper support plate 3. Further, as shown in FIG. 2 (a), the lower split piece jig 40 is composed of parts of a lower piece 41 and a lower piece presser 42, and the lower divided piece jig 40 after assembling the both parts, The structure shown in FIG. Incidentally, the lower piece 41 is provided with an outward projecting portion 41 a at an upper portion thereof, and is engaged with the die support plate 4. The lower piece presser 42 is formed of a bowl-shaped body having a lower piece mounting notch, and is detachably fitted into a groove 41b formed in a lower portion of the lower piece 41, and is engaged with the die support plate 4. It is supposed to be.

  Each component constituting the piece jig for the substrate dividing apparatus will be described. The upper piece 31 and the lower piece 41 are arranged to face each other, and play a role of pressing and fixing the printed wiring board when dividing the printed wiring board. Therefore, the tip of each piece is provided with a convex shape so as to be effective when pressing and fixing the printed wiring board and not contacting various electronic components mounted on the printed wiring board. Further, in both the upper piece 31 and the lower piece 41, a through hole 45 shown in a dotted line portion of each piece portion in FIG. 2A is provided in the punching direction, and the punch 34 enters the through hole 45. The punch 34 repeatedly moves up and down.

  As shown in FIG. 2, the spring 32 is interposed between the upper piece 31 and the punch holder 33 so as to be placed on the upper surface of the upper piece 31. The spring strength, spring coefficient, and the like of the spring 32 depend on the stroke of the punch 34 when dividing the printed wiring board, and are appropriately set according to individual specifications.

  Like the upper piece 31 and the lower piece 41, the punch holder 33 is provided with a through hole 45 indicated by a dotted line in the punch holder 33 in FIG. 2A, and the punch 34 enters the through hole 45. The punch 34 repeatedly moves up and down.

  As shown in FIG. 1, the lower piece presser 42 used for the lower divided piece jig 40 is used when fixing the lower piece 41 to the die support holder 4 so that it can be stably operated even when continuously operated. The printed wiring board can be divided.

  The upper piece 31, the spring 32, the punch holder 33, the punch 34, and the lower piece 41 and the lower piece presser 42 constituting the upper divided piece jig 30 and the lower divided piece jig 40 can be handled as individual parts. . Similarly, since the upper divided piece jig 30 and the lower divided piece jig 40 are not fixed to the jig plate, they can be handled as individual parts.

  Therefore, the upper division piece jig 30 and the lower division piece jig 40 can be reused, and the substrate division apparatus can be produced in a short period of time, and the production cost can be reduced. This is advantageous in that

  FIG. 3 shows the driving state of the piece jig for the substrate splitting device of the present invention.

  First, the upper divided piece jig 30 and the lower divided piece jig 40 which are the piece jigs for the substrate dividing apparatus of the present invention are in the state shown in FIG. 3A when the printed wiring board is pressed and fixed. That is, the upper piece 31 of the upper divided piece jig 30 presses and fixes the printed wiring board at the A3 dotted line, and the lower piece 41 of the lower divided jig 40 holds and fixes the printed wiring board at the A4 dotted line.

  Next, when the upper jig L1 shown in FIG. 1 is lowered, the upper divided piece jig 30 is in the state shown in FIG. At this time, the upper piece 31 of the upper divided piece jig 30 is fixed by pressing the printed wiring board at the A3 dotted line, and does not fall below the A3 dotted line. On the other hand, when the upper jig L1 is lowered, the punch 34 provided in the upper division piece jig 30 is lowered from the A3 dotted line portion, and a desired divided portion of the printed wiring board is punched and continuously processed. While being inserted into the through hole 45 of the lower piece 41, the punched dust is discharged through the through hole 45. At this time, since the lower split piece jig 40 is fixed to the die support plate 4 and does not move, the punching with the punch 34 is performed well.

  As described above, the piece jig for a substrate dividing apparatus according to the present invention performs a punching process by dividing a printed wiring board. The driving of the above-mentioned substrate splitting device piece jig will be described together with the substrate splitting device with reference to FIGS.

  FIG. 4 shows a state in which the printed wiring board P1 is arranged in the board dividing apparatus shown in FIG. As the printed wiring board P1 used here, for example, a printed wiring board such as a collective printed wiring board 60 in which individual printed wiring boards 61 are connected via a coupling portion 64 as shown in FIG. Moreover, the place where the target punching process is performed by the substrate dividing apparatus is a coupling portion 64 to which the individual printed wiring board 61 is connected.

  The printed wiring board P1 is arranged in the board dividing apparatus by inserting the tip of the support guide 24 into a through hole such as a guide hole provided in the printed wiring board P1, and after the insertion, FIG. The printed wiring board P1 shown in FIG.

  Here, the printed wiring board P <b> 1 is in contact with the tip of the lower piece 41 to form an arrangement state supported by the lower piece 41 in addition to the support guide 24. From such an arrangement state of the printed wiring board P1 shown in FIG. 4, the upper jig L1 descends and the printed wiring board is divided.

  Next, as shown in FIG. 5, the upper jig L1 is lowered, and the upper piece 31 of the upper divided piece jig 30 is in contact with the printed wiring board P1. At this time, as the substrate dividing apparatus, the guide post 25 is also lowered simultaneously, and the guide post 25 is inserted into the guide bush 26. By inserting the guide post 25 into the guide bush 26, the upper mold L1 and the lower mold L2 are normally aligned, and there is no misalignment associated with the lowering. On the other hand, at the stage shown in FIG. 5, the printed wiring board P1 is not yet divided. It is simply a state of supporting the substrate.

  Next, as shown in FIG. 6, when the upper jig L1 is further lowered, the upper piece 31 of the upper divided piece jig 30 presses and fixes the printed wiring board on the surface of the printed wiring board P1, and does not descend any further. . On the other hand, when the upper jig L1 descends, the punch 34 provided inside the upper division piece jig 30 descends from the surface of the printed wiring board P1, and punches a desired portion of the printed wiring board to be divided. While being continuously inserted into the through hole 45 of the lower piece 41, the punched dust is discharged through the through hole 45. At this time, since the lower split piece jig 40 is fixed to the die support plate 4 and does not move, the punching with the punch 34 is performed well.

  Further, after the printed wiring board P1 is divided by the punching process, the upper jig L1 is raised and the next printed wiring board is processed in the same manner. On the other hand, when the upper jig L1 is raised, the punch 34 is also raised, and accordingly there is a concern that the printed wiring board P1 is lifted. However, in the present invention, the upper piece 31 of the upper divided piece jig 30 is the printed wiring board. Since a so-called strip function is activated in which P1 is pressed and punch 34 is removed, processing is performed satisfactorily without lifting printed wiring board P1.

  In the above-described substrate dividing apparatus piece jig and the substrate dividing apparatus including the same, the upper divided piece jig 30 and the lower divided piece jig 40 can be reused, and the top plate 1 and the die holder 5 can be reused. Since the reusability is possible, the substrate dividing apparatus can be manufactured in a short period of time, and the cost for manufacturing can be reduced. Therefore, the above-mentioned problem against the background of a small variety of products can be solved.

FIG. 3 is a schematic cross-sectional explanatory diagram of the substrate dividing apparatus of the present invention. The schematic front explanatory drawing of the piece jig for substrate splitting devices of the present invention. The schematic front explanatory drawing which shows the drive state of the piece jig | tool for board | substrate division apparatuses of this invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 5 is a schematic cross-sectional explanatory diagram illustrating a driving state of the substrate dividing apparatus of the present invention subsequent to FIG. 4. FIG. 6 is a schematic cross-sectional explanatory view showing a driving state of the substrate dividing apparatus of the present invention subsequent to FIG. FIG. 3 is a schematic plan view showing a collective printed wiring board. Schematic cross-sectional explanatory drawing of the conventional board | substrate division | segmentation apparatus.

Explanation of symbols

1: Top plate 2: Punch plate 3: Stripper support plate 4: Die support plate 5: Die holders 21a, 21b, 21c: Plate connection bracket 24: Support guide 25: Guide post 26: Guide bush 30: Upper split piece jig 31 : Upper piece 32: Spring 33: Punch holder 34: Punch 35: Divided piece jig receiving space 36: Upper piece containing space 37: Lower piece containing space 38: Dust receiving space 40: Lower divided piece jig 41: Lower piece 42: Lower piece holder 45: Through hole P1: Printed wiring board L1: Upper jig L2: Lower jig

Claims (5)

  A board jig for a board splitting device, in which a plurality of individual printed wiring boards are connected to each other by a coupling portion, and the coupling portion is punched out to divide the individual printed wiring board into individual pieces. A board splitting device jig comprising an upper splitting piece jig constituted by a holder and a punch, and a lower dividing piece jig constituted by a lower piece and a lower piece presser arranged to face the upper piece.   The upper split piece jig includes an upper piece and a punch holder having a through hole in a punching direction, a spring interposed between the upper piece and the punch holder, a through hole of the punch holder, a spring, and a through hole of the upper piece. 2. The piece jig for a substrate dividing apparatus according to claim 1, wherein the piece jig is configured to be assembled and separated by a punch to be inserted.   The lower split piece jig is composed of a lower piece having a through hole through which a punch is inserted in the punching direction, and a lower piece presser that detachably fixes the lower piece to the lower jig of the substrate dividing apparatus. 3. A piece jig for a substrate dividing apparatus according to claim 1, wherein the piece jig is used.   A board dividing apparatus for punching out the connecting portion from a collective printed wiring board formed by connecting a plurality of individual printed wiring boards by a connecting portion, and dividing the individual printed wiring board into individual printed wiring boards. An upper jig and a lower jig arranged in the lower order, and the upper jig is detachably arranged in order from the upper order to the lower order, and a fixed design jig plate, It consists of two individually designed jig plates on which the upper division piece jig of the board division apparatus piece jig is detachably mounted, and the lower jig is detachably arranged in order from one lower order to the upper order. A substrate dividing apparatus comprising: a tool plate; and one individual design jig plate on which a lower dividing piece jig of the piece jig for the substrate dividing apparatus is detachably mounted.   The substrate dividing apparatus according to claim 4, wherein the substrate dividing apparatus piece jig is the substrate dividing apparatus piece jig according to claim 1.

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