JP2008016583A5 - - Google Patents

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Publication number
JP2008016583A5
JP2008016583A5 JP2006185140A JP2006185140A JP2008016583A5 JP 2008016583 A5 JP2008016583 A5 JP 2008016583A5 JP 2006185140 A JP2006185140 A JP 2006185140A JP 2006185140 A JP2006185140 A JP 2006185140A JP 2008016583 A5 JP2008016583 A5 JP 2008016583A5
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JP
Japan
Prior art keywords
light emitting
light
emitting device
emitting element
conductor wiring
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JP2006185140A
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Japanese (ja)
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JP5034342B2 (en
JP2008016583A (en
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Priority to JP2006185140A priority Critical patent/JP5034342B2/en
Priority claimed from JP2006185140A external-priority patent/JP5034342B2/en
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Publication of JP2008016583A5 publication Critical patent/JP2008016583A5/ja
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Claims (6)

透光性放熱部材と、前記透光性放熱部材の表面にパターン形成された導体配線と、前記導体配線にフリップチップ実装された発光素子と、前記発光素子を被覆する波長変換部材と、を有し、
前記透光性放熱部材は、前記発光素子と対向する面の非導体配線形成領域に、絶縁性で且つ非透光性の無機部材が形成されていることを特徴とする発光装置。 A translucent heat radiating member; conductor wiring patterned on the surface of the translucent heat radiating member; a light emitting element flip-chip mounted on the conductor wiring; and a wavelength conversion member covering the light emitting element. And
The light-transmitting heat dissipation member is characterized in that an insulating and non-transparent inorganic member is formed in a non-conductor wiring formation region on a surface facing the light-emitting element. 前記無機部材は、前記透光性部材と前記導体配線との界面に延在していることを特徴とする請求項１に記載の発光装置。 The light emitting device according to claim 1, wherein the inorganic member extends to an interface between the translucent member and the conductor wiring. 前記発光素子の実装面と前記無機部材との距離は、前記発光素子の他の面からの前記波長変換部材の厚みよりも短いことを特徴とする請求項１または２に記載の発光装置。 3. The light emitting device according to claim 1, wherein a distance between the mounting surface of the light emitting element and the inorganic member is shorter than a thickness of the wavelength conversion member from another surface of the light emitting element. 前記無機部材は、ＮｉThe inorganic member is Ni ２2 ＯO ３3 、ＳｉＣ、Ｃ, SiC, C ３3 ＮN ４4 、Ｔａ, Ta ２2 ＯO ５5 、ＳｉＯ, SiO ２2 、ＳｉＮ、ＡｌＮ、Ａｌ, SiN, AlN, Al ２2 ＯO ３3 、ＺｒＯ, ZrO ２2 、ＺｎＯ、ＴｉＯ, ZnO, TiO ２2 、Ｙ, Y ２2 ＯO ３3 およびＳｉAnd Si ３3 ＮN ４4 から選択される少なくとも１種であることを特徴とする請求項１乃至３のいずれか１つに記載の発光装置。The light-emitting device according to claim 1, wherein the light-emitting device is at least one selected from the group consisting of: 前記無機部材は、多層膜であることを特徴とする請求項１乃至４のいずれか１つに記載の発光装置。The light emitting device according to claim 1, wherein the inorganic member is a multilayer film. 前記多層膜は、光遮断層と絶縁層を有することを特徴とする請求項５に記載の発光装置。The light emitting device according to claim 5, wherein the multilayer film includes a light blocking layer and an insulating layer.
JP2006185140A 2006-07-05 2006-07-05 Light emitting device Active JP5034342B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006185140A JP5034342B2 (en) 2006-07-05 2006-07-05 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006185140A JP5034342B2 (en) 2006-07-05 2006-07-05 Light emitting device

Publications (3)

Publication Number Publication Date
JP2008016583A JP2008016583A (en) 2008-01-24
JP2008016583A5 true JP2008016583A5 (en) 2009-08-06
JP5034342B2 JP5034342B2 (en) 2012-09-26

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ID=39073332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006185140A Active JP5034342B2 (en) 2006-07-05 2006-07-05 Light emitting device

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JP (1) JP5034342B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231440A (en) * 2008-03-21 2009-10-08 Nippon Carbide Ind Co Inc Wiring substrate for mounting light emitting element, and light emitting device
JPWO2011016282A1 (en) * 2009-08-05 2013-01-10 コニカミノルタアドバンストレイヤー株式会社 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD
KR101858254B1 (en) 2011-08-22 2018-05-15 엘지이노텍 주식회사 Light emitting device, light emitting apparatus and fabricating method for light emitting device
US8889439B2 (en) * 2012-08-24 2014-11-18 Tsmc Solid State Lighting Ltd. Method and apparatus for packaging phosphor-coated LEDs

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057373A (en) * 2000-08-08 2002-02-22 Matsushita Electric Ind Co Ltd Semiconductor light-emitting device
JP4114557B2 (en) * 2003-06-25 2008-07-09 松下電工株式会社 Light emitting device
JP4539235B2 (en) * 2004-08-27 2010-09-08 日亜化学工業株式会社 Semiconductor device and manufacturing method thereof

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