JP2008004219A - Optical pickup device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that in an optical pickup device mounting a frame laser, in spite of that dustproof for a semiconductor laser device is especially important, dustproof of a whole optical system is very hard, also when dustproof is performed for only the semiconductor laser device part, it becomes expensive, therefore, an appropriate dustproof method is not obtained. <P>SOLUTION: A laser mounting member 11 is constituted so as to seal the semiconductor laser device 10 for dustproof. Also, an outgoing opening 47 of a laser beam generated by the semiconductor laser device 10 is constituted so as to seal by a grating 21 being an optical element. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical pickup device including a frame type semiconductor laser device.

  A semiconductor laser device is used as a light source in an optical pickup device used for recording and reproduction of a disk-shaped optical recording medium such as a CD or a DVD.

  There are several shapes of semiconductor laser devices, but conventionally, a so-called CAN type or stem type has been often used. This is a semiconductor laser chip mounted on a metal stem and sealed with a cylindrical metal cap having a glass window on the exit surface.

  On the other hand, in recent years, a semiconductor laser device called a frame type is often used for the purpose of cost reduction for these devices. This is a semiconductor laser chip mounted on the upper surface of a plate-shaped metal frame, and resin is outsert-molded to surround the semiconductor laser chip on the metal frame, and has a glass window and a sealing structure. It has the feature that the price is low because it is not.

  In a CAN type semiconductor laser device, the semiconductor laser chip is placed in a completely sealed container. For this reason, in the CAN type semiconductor laser device, dust does not adhere to the semiconductor laser chip itself. Of course, dust adheres to the glass window on the exit surface, but since the exit light has a diameter of several hundred μm at the position of the glass window, some dust is not a problem. Further, since the laser light in the optical pickup also has a certain radius, some dust does not matter so much.

  On the other hand, in the case of a frame type semiconductor laser device, since the semiconductor laser chip is almost bare, dust easily adheres to the semiconductor laser chip. Since the emitted light is a very small point on the end face of the semiconductor laser chip, even a slight amount of dust may greatly affect the emitted light. Thus, in the case of a frame type semiconductor laser device, the dust prevention of the semiconductor laser device is very important.

  With respect to such problems, for example, in Patent Document 1, the semiconductor laser device is attached so that the side on which the semiconductor laser chip is located is on the lower side. In this method, the semiconductor laser chip portion is mostly covered by the laser mounting portion of the optical pickup device, which is advantageous in terms of dust prevention.

  However, this method is not sufficient. This is due to the following reason.

  In Patent Document 1, the majority is covered by the laser mounting portion, but the portion from which the laser beam is emitted is open to the inside of the optical pickup. This is because the emitted laser beam is not blocked or affected. Since optical elements such as prisms, lenses, and diffraction gratings are arranged inside the optical pickup, the structure is designed in consideration of dust prevention. However, such an optical system usually has a plurality of movable parts for adjustment. Since this movable part is adjusted from the outside, it has an opening for receiving jigs for adjustment, or the movable part is provided outside and covers the optical system to secure the movable amount It must be either a structure with a gap between them. For this reason, it is very difficult to completely seal the entire optical system, and dust prevention is insufficient in a structure in which the laser light emitting portion of the semiconductor laser device is open to the inside of the optical pickup.

  Thus, the conventional method is insufficient with respect to dust prevention, and there is no description about a solution to this.

In addition, as described above, the semiconductor laser device is easily affected by dust. Therefore, if sufficient dust prevention is provided for only this portion, the portion where the laser beam is emitted is inevitably made of a transparent member. Must be covered. Since the laser beam in the optical pickup device needs to be focused on a very small point on the disk recording surface, the wavefronts must be accurately aligned. For this reason, this transparent member is a simple dust-proof cover, but requires a very small wavefront aberration, and becomes expensive.
JP 2005-190520 A

  The problem to be solved by the present invention is that, in an optical pickup device equipped with a frame laser, it is very difficult to protect the entire optical system even though dust protection is particularly important for the semiconductor laser device. It is expensive to attempt to sufficiently protect only the device portion, and there is no appropriate dust prevention method.

  In order to solve the above problems, the optical pickup device of the present invention is configured so that the laser mounting member is sealed to prevent dust, and the semiconductor laser device is hermetically sealed. The main feature is that it is configured to be sealed by the element.

  The optical pickup device of the present invention is configured so that the laser mounting member is sealed to prevent dust, and the semiconductor laser device is hermetically sealed, and the laser light emission port generated by the semiconductor laser device is sealed by an optical element. Therefore, the semiconductor laser device can be completely sealed, and an optical pickup device equipped with a frame laser having a sufficient dust-proofing effect can be obtained, and the cost is low.

  The present invention extends from the upper surface of the metal frame to the lower surface so as to surround a metal frame having a semiconductor laser chip mounted on the upper surface side and an element mounting portion of the upper surface of the metal frame on which the semiconductor laser chip is mounted. A semiconductor laser device having a molded resin portion, an optical element through which a laser beam generated by the semiconductor laser device passes to record or reproduce information on a disk-shaped recording medium, and the semiconductor laser device A laser mounting member to be mounted, wherein the laser mounting member is configured to hermetically seal the semiconductor laser device for dust prevention, and the laser light emitting port generated by the semiconductor laser device includes the optical element. It is sealed by.

  The laser mounting member may be provided as an independent member.

  In addition, the optical element that seals the laser light emission port may be configured to be movable with respect to the laser mounting member.

  Further, an electrical connection member for performing electrical connection to the semiconductor laser device may be further provided, and the electrical connection member may be configured as a part of a member for sealing the semiconductor laser device.

  The heat generated by the semiconductor laser device may be transmitted to the laser mounting member.

  As a result, an optical pickup device equipped with a frame laser having a sufficient dustproof effect was realized at low cost.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
The optical pickup device according to the present embodiment can reproduce each disk of DVD and CD, and can record on each disk such as DVD-R, DVD-RW, DVD-RAM, CD-R, and CD-RW. Is possible. Needless to say, the application of the present invention is not limited to this.

  FIG. 1 is a perspective view showing a configuration of an optical pickup device according to an embodiment of the present invention.

  In FIG. 1, 1 is an optical stand, 2 is a heat sink, 3 is a main shaft bearing, 4 is a countershaft bearing, 5 is a substrate, 6 is an objective lens, and 7 is a lens actuator.

  2 is a perspective view showing a state in which the substrate 5, the lens actuator 7, the heat radiating plate 2, and a laser FPC (to be described later) of the optical pickup device according to the embodiment of the present invention are omitted, and FIG. FIG. 2B is a perspective view seen from above, and FIG. 2B is a view seen obliquely from below. In addition, the perspective direction of FIG. 1 and FIG. 2 (a) is reversed 180 degree | times.

  In FIG. 2, 10 is a semiconductor laser device, 11 is a laser mounting member, 14 is PBS, 15 is a collimating lens, 16 is a rising mirror, 17 is FPBS, 18 is a detector, 19 is a detection lens, 20 is a front light monitor, 21 is a grating.

  The semiconductor laser device 10 is a so-called frame type, and its external features will be described later. This is a light source of an optical pickup device and can oscillate laser light having a wavelength suitable for recording and reproduction of DVD and CD.

  It is necessary to adjust the mounting position and angle of the semiconductor laser device 10 with high accuracy. Therefore, the semiconductor laser device 10 is directly bonded and fixed to the laser mounting member 11 having a function for this adjustment, and the position and angle of the semiconductor laser device 10 are adjusted by adjusting the position and angle of the laser mounting member 11. To do. After this adjustment, the laser mounting member 11 is bonded and fixed to the optical bench 1.

  Because of this adjustment, the relative position of the laser mounting member 11 with respect to the optical bench 1 changes, and there is a gap between the laser mounting member 11 and the optical bench 1 to allow this change. Further, since the adjustment is performed from the outside, the laser mounting member 11 is attached to the outside of the optical bench 1 as shown in FIG. Further, since the laser beam emitted from the laser mounting member 11 must be incident on the inside of the optical bench 1, the optical bench 1 has an opening for this purpose, and the inside of the optical bench 1 through the aforementioned gap and this opening. Dust penetrates relatively easily.

  Further, a grating holder A and a grating holder B (not shown) are attached to the laser mounting member 11 in a state where the position and angle can be adjusted with respect to each other. A grating 21 is bonded and fixed to the grating holder B, whereby the position and angle of the grating 21 can be adjusted. After this adjustment, the grating holder A, the grating holder B, and the laser mounting member 11 are bonded and fixed to each other.

  Components such as the semiconductor laser device 10, the laser mounting member 11, the grating holder A, the grating holder B, and the grating 21 constitute a laser unit. Details of the laser unit will be described later.

  In addition to the laser mounting member 11, all components are attached to the optical bench 1. For this reason, dimensional accuracy, temperature changes, dimensional stability against changes with time, and good heat dissipation from each component are required. For this reason, it is constituted by zinc die casting.

  The heat radiating plate 2 mainly radiates heat from the semiconductor laser device 10. For this reason, it is composed of an aluminum plate and is filled with liquid silicon rubber having a good thermal conductivity (not shown) between the laser mounting member 11 and solidified. Thereby, heat from the semiconductor laser device 10 can be radiated to the outside through the laser mounting member 11.

  Laser light emitted from the semiconductor laser device 10 is suitable for recording and reproduction through a grating 21, PBS 14, a collimating lens 15, a rising mirror 16, a λ / 4 plate (quarter wavelength plate) (not shown), and an objective lens 6. In order to record or reproduce information, a track on a disc (not shown) is irradiated.

  At this time, a part of the laser light emitted from the semiconductor laser device 10 is divided by the PBS 14 and enters the front light monitor 20 through the FPBS 17. The front light monitor 20 outputs an electrical output proportional to the amount of incident light. The light output of the semiconductor laser device 10 is controlled based on this.

  Reflected light from a disk track (not shown) passes through the reverse path, that is, the objective lens 6, a λ / 4 plate (not shown), the rising mirror 16, and the collimating lens 15, reflected by the PBS 14, and passed through the detection lens 19. 18 is incident.

  At the time of reproduction, the detector 18 takes out recorded information contained in reflected light from a track of a disc (not shown) as an electric signal, and emits it from the objective lens 6 to a track of the disc (not shown). Servo signals necessary for the laser beam to accurately focus on a track of a disk (not shown) and trace without departing from the track are electrically output based on the incident light.

  The lens actuator 7 drives the objective lens 6 based on this servo signal, and the laser beam emitted from the objective lens 6 accurately focuses on the track of the disk (not shown) and traces without departing from this. The objective lens 6 is driven as described above.

  Similarly to the laser mounting member 11, the position and mounting angle of the detector 18 and the lens actuator 7 need to be adjusted. For this reason, for the same reason as in the case of the laser mounting member 11, dust enters the optical bench 1 relatively easily from this portion.

  In this way, dust is relatively likely to enter the optical bench 1.

  A circuit for driving the semiconductor laser device 10 is mounted on the substrate 5. Further, the connections for the detector 18, the front light monitor 20, and the lens actuator 7 are collected.

  The optical pickup device is supported by a main shaft bearing 3 and a sub shaft bearing 4 so as to be movable in a radial direction of a disk (not shown) by a main shaft and a sub shaft (not shown).

  3 is a detailed perspective view of the semiconductor laser device 10. FIG. 3A is a view from the side where the semiconductor laser chip is mounted, and FIG. 3B is a view from the back side. In FIG. 3, 31 is a semiconductor laser chip, 32 is a metal frame, 33 is a resin portion, 34 is a terminal, and 35 is a fin portion of the metal frame.

  The semiconductor laser chip 31 is a laser beam oscillation unit made of a crystal such as gallium, arsenic, or indium. This is adhered to the metal frame 32 with an adhesive having good thermal conductivity. The laser light is emitted from the end surface on the front side (upper side in FIG. 3) of the semiconductor laser chip 31. Laser light emitted from the semiconductor laser device is not parallel light but has a certain spread angle. For this reason, the laser beam emitted from this end face is a very small point. For this reason, even if dust adheres to this end face, even a slight amount of laser light may have a large effect.

  The metal frame 32 is a plate having a thickness of 0.6 mm and is made of a copper alloy having a good thermal conductivity. On both sides of the metal frame 32, fin portions 35 of the metal frame are provided, and the semiconductor laser device 10 is attached to the laser mounting member 11 by bonding these portions.

  The resin portion 33 is made of resin and is formed on the metal frame 32 by outsert molding. As shown in FIG. 3A, this is formed so as to surround the semiconductor laser chip 31, and protects the semiconductor laser chip 31 from being easily touched by an operator's finger, and a terminal 34. It also has a function to hold However, this only surrounds the periphery of the semiconductor laser chip 31, and the upper surface and the entire surface from which the laser light is emitted are completely open, and it is not possible to prevent dust from entering.

  The terminal 34 is a terminal for making an electrical connection, and is made from the same plate material as the metal frame 32 by pressing at the same time as the metal frame 32.

  FIG. 4 is a detailed explanatory diagram of the laser unit 51. FIG. 4A is a perspective view of the assembly of the laser unit 51 as viewed obliquely from the front, and FIG. 4B is a perspective view of the components constituting the laser unit 51 in an exploded state.

  In FIG. 4, 51 is a laser unit, 12 is a grating holder A, 13 is a grating holder B, 40 is a grating holder pressing spring, 41 is a laser FPC, 42 is a grating mounting portion, 43 is a rotating boss portion, and 44 is rotating. A boss receiving portion, 45 is an X-axis adjusting portion, 46 is an X-axis adjusting guide portion, 47 is a laser beam emission port, 48 is a mounting hole, 49 is a grating holder pressing portion, and 50 is a mounting hole engaging portion.

  The grating holder B13 is provided with a grating mounting portion 42, and the grating 21 is bonded and fixed to the grating mounting portion 42 of the grating holder B13. The grating holder B13 is further provided with a rotating boss portion 43, which is fitted in a rotating boss receiving portion 44 provided on the grating holder A12 in a rotatable state. The grating holder A12 is further provided with an X-axis adjusting portion 45, which moves to the X-axis adjusting guide portion 46 provided on the laser mounting member 11 in the direction of the arrow indicated as the X direction in FIG. The mating is possible.

  The grating holder pressing spring 40 is provided with an attachment hole 48, which is attached to the laser mounting member 11 by engaging with an attachment hole engaging portion 50 provided in the laser mounting member 11. There is another mounting hole engaging portion 50 on the opposite side. The grating holder pressing spring 40 is provided with a grating holder pressing portion 49, and this portion abuts on the grating holder B13, thereby pressing the grating holder A12 and the grating holder B13 against the laser mounting member 11.

  With these configurations, the grating 21 can be adjusted in angle and position with respect to the laser mounting member 11. After the angle and position of the grating 21 with respect to the laser mounting member 11 are adjusted, the grating holder A12, the grating holder B13, and the laser mounting member 11 are bonded and fixed to each other.

  On the front surface of the laser mounting member 11, an opening for emitting laser light oscillated by the semiconductor laser device 10 and a laser light emitting port 47 are provided.

  The semiconductor laser device 10 is inserted into the laser mounting member 11 from behind the laser mounting member 11 and bonded and fixed to the laser mounting member 11. A laser FPC 41 is attached to a terminal 34 of the semiconductor laser device 10 for electrical connection between the semiconductor laser device 10 and the substrate 5.

  FIG. 5 is a perspective view of the laser unit 51 as viewed obliquely from the rear and an explanatory view of the assembled state. FIG. 5A is a perspective view of the laser unit 51 as viewed obliquely from the rear, and FIG. 5B is an explanatory view of an assembled state of the laser unit 51 as viewed from the oblique rear.

  The semiconductor laser device 10 is inserted into a laser insertion hole 52 provided in the laser mounting member 11, and the fin portion 35 of the metal frame is bonded to the semiconductor laser device mounting portion 53 of the laser mounting member 11, thereby the laser mounting member 11. Fixed directly to. For this adhesion, an adhesive having a good thermal conductivity is used.

  The laser mounting member 11 is composed of zinc die cast for dimensional accuracy, temperature stability, dimensional stability against changes with time, and good heat dissipation from the semiconductor laser device 10.

  A laser FPC 41 is attached to a terminal 34 of the semiconductor laser device 10 for electrical connection between the semiconductor laser device 10 and the substrate 5. The laser FPC 41 is configured to just block the laser insertion hole 52 provided in the laser mounting member 11 when attached to the semiconductor laser device 10.

  The operation of the optical pickup device configured as described above will be described.

  It is necessary to adjust the mounting angle and position of the grating 21 with respect to the semiconductor laser device 10. The semiconductor laser device 10 also needs to be adjusted in position and angle as described above.

  In the optical pickup device according to the embodiment of the present invention, the grating 21 is bonded and fixed to the grating holder B13. As shown in FIG. 4A, the grating holder B13 is attached to the grating holder A12 so that the rotating boss portion 43 is rotatably fitted to the rotating boss receiving portion 44. It can rotate with respect to the grating holder A12.

  Further, as shown in FIG. 4A, the grating holder A12 moves laterally in the X direction in FIG. 4A with respect to the laser mounting member 11 by moving the X-axis adjusting portion 45 to the X-axis adjusting guide portion 46. The grating holder A12 can be moved in the X direction with respect to the laser mounting member 11 because it is fitted.

  As shown in FIG. 4A, the grating holder pressing spring 40 presses the grating holder A12 and the grating holder B13 so that they do not rotate and move in directions other than the X direction described above. Is arranged.

  As a result, the grating 21 can only rotate and move in the X direction with respect to the laser mounting member 11, and the adjustment in this direction can be performed with high accuracy.

  The laser mounting member 11 is bonded and fixed to the optical bench 1 after adjusting the position and angle with respect to the optical bench 1. Thereafter, the above-described grating 21 is adjusted.

  The semiconductor laser device 10 is directly fixed to the laser mounting member 11 by bonding the fin portion 35 of the metal frame to the semiconductor laser device mounting portion 53 of the laser mounting member 11. Since this bonded portion is directly bonded to the laser mounting member 11 with an adhesive having good thermal conductivity, the heat generated by the semiconductor laser device 10 is transmitted from here to the laser mounting member 11.

  Between the heat radiating plate 2 and the laser mounting member 11, liquid silicon rubber having a good thermal conductivity (not shown) is filled and solidified. For this reason, the heat from the semiconductor laser device 10 is radiated to the outside through the laser mounting member 11.

  After the lens actuator 7 and the detector 18 are also adjusted, they are bonded and fixed to the optical bench 1.

  As described above, dust enters the optical bench 1 relatively easily from the gap for adjustment of the laser mounting member 11, the detector 18, and the lens actuator 7. On the other hand, in the semiconductor laser device 10, the periphery of the semiconductor laser chip 31 is formed so that the resin portion 33 surrounds the semiconductor laser chip 31, and is completely defenseless against dust intrusion. The laser light is emitted from the end face on the front side (upper side in FIG. 3) of the semiconductor laser chip 31. Laser light emitted from the semiconductor laser device is not parallel light but has a certain spread angle. For this reason, the laser beam emitted from this end face is a very small point. For this reason, even if dust adheres to this end face, even a slight amount of laser light may have a large effect.

  For this reason, if the semiconductor laser device 10 has an open structure with respect to the inside of the optical bench 1, dust easily adheres to the end face, which may greatly affect the emitted laser light.

  For this reason, a dust-proof structure for the semiconductor laser device 10 itself is necessary. However, if the laser beam emission part is easily covered with a transparent member, the characteristics of the emission light will be affected.

  In the optical pickup device according to the embodiment of the present invention, the semiconductor laser device 10 is mounted in the laser mounting member 11, and the grating 21 is mounted so as to be movable for adjustment with respect to the laser mounting member 11. FIG. The grating 21 covers the laser beam emission part as shown in FIG. Since the grating 21 is an originally necessary optical element, it does not affect the characteristics of the emitted light and does not increase the cost. Since the emitted laser light has a diameter of about several hundreds μm on the surface of the grating 21, even if dust adheres to this portion, it is not so much affected by the dust.

  In the optical pickup device according to the embodiment of the present invention, the laser insertion hole 52 is configured to be closed by the laser FPC 41. Since the laser FPC 41 is also an essential component, there is no cost increase due to this.

  With these configurations, a sufficient dustproof effect for the semiconductor laser device 10 can be obtained.

  Further, in the optical pickup device according to the embodiment of the present invention, this dustproof effect can be obtained with the laser unit 51 alone. For this reason, if only this laser unit 51 is assembled in a special dustproof chamber at the time of manufacture, the other processes can be performed in a normal environment, and the optical pickup manufacturing process and equipment can be greatly simplified. .

  As a result, in this embodiment, the laser mounting member is configured to seal the semiconductor laser device in order to prevent dust, and the laser light emission port generated by the semiconductor laser device is sealed by the optical element. Due to the construction, in the optical pickup device equipped with the frame laser, it is very difficult to prevent the entire optical system from being dusted even though dustproofing the semiconductor laser device is particularly important. It is possible to obtain an optical pickup apparatus that solves the problem that the dust prevention is expensive and there is no appropriate dust prevention method and the manufacturing process and equipment can be greatly simplified without increasing the cost.

  In the present embodiment, the grating 21 is used to protect the semiconductor laser device 10 from dust, but other optical components may be used. In addition, although the optical component used for dust prevention is configured to be movable, depending on the type and configuration of the optical system, it may not be configured to be movable.

  Further, although the laser FPC 41 is used as a member for dust prevention, another member, for example, a part of a heat sink may be used.

  Further, although the laser mounting member 11 is an independent component, it may be configured integrally with the optical bench 1 or the like.

  Moreover, although the heat sink 2 was provided as an independent component, you may make it give the function to another component.

  Further, in order to fix the semiconductor laser device 10 to the laser mounting member 11, an adhesive having a high thermal conductivity is used, but an ordinary adhesive may be used depending on use conditions. In the case of another use condition that requires higher heat dissipation efficiency, an adhesive containing silver or graphite powder may be used. Soldering may also be used.

  In addition, although the recording / reproducing configuration is possible, a configuration dedicated to reproduction may be used. Further, when a high-power laser device such as a read-only optical pickup is not required, the configuration for heat dissipation may be omitted.

  The optical pickup device according to the present invention is configured so that the laser mounting member is sealed to prevent dust, and the semiconductor laser device is hermetically sealed, and the laser light emission port generated by the semiconductor laser device is hermetically sealed by an optical element. With this configuration, it can be applied to an optical pickup device equipped with a frame laser, and is useful for devices such as an optical disk drive device, a reproducing device, and a recording device that can use the optical pickup device.

The perspective view which shows the structure of the optical pick-up apparatus by embodiment of this invention The perspective view which shows the state which excluded the board | substrate of the optical pick-up apparatus, the lens actuator, the heat sink, and the laser FPC The perspective view which shows the detailed structure of the semiconductor laser apparatus of the same optical pick-up apparatus Explanatory drawing which shows the detailed structure of the laser unit of the optical pickup device The perspective view which looked at the laser unit of the optical pick-up apparatus from diagonally back, and explanatory drawing of an assembly state

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical stand 2 Heat sink 3 Main shaft bearing 4 Sub shaft bearing 5 Substrate 6 Objective lens 7 Lens actuator 10 Semiconductor laser device 11 Laser mounting member 12 Grating holder A
13 Grating holder B
14 PBS
15 Collimating lens 16 Rising mirror 17 FPBS
18 detector 19 detection lens 20 front light monitor 21 grating 31 semiconductor laser chip 32 metal frame 33 resin portion 34 terminal 35 fin portion of metal frame 40 grating holder pressing spring 41 laser FPC
42 Grating attachment portion 43 Rotating boss portion 44 Rotating boss receiving portion 45 X-axis adjusting portion 46 X-axis adjusting guide portion 47 Laser beam emitting port 48 Mounting hole 49 Grating holder pressing portion 50 Mounting hole engaging portion 51 Laser unit 52 Laser Insertion hole 53 Semiconductor laser device mounting part

Claims (5)

A metal frame having a semiconductor laser chip mounted on the upper surface side, and a resin formed from the upper surface to the lower surface of the metal frame so as to surround the element mounting portion on which the semiconductor laser chip is mounted on the upper surface of the metal frame A semiconductor laser device having an optical element, an optical element through which laser light generated by the semiconductor laser device passes to record or reproduce information on a disk-shaped recording medium, and a laser on which the semiconductor laser device is mounted A mounting member,
The laser mounting member is configured to seal the semiconductor laser device in order to prevent dust, and an emission port of the laser light generated by the semiconductor laser device is sealed by the optical element. Optical pickup device. The optical pickup device according to claim 1, wherein the laser mounting member is provided as an independent member. The optical pickup device according to claim 1, wherein the optical element that seals the emission port of the laser light is configured to be movable with respect to the laser mounting member. The electrical connection member for making electrical connection with the semiconductor laser device is further provided, and the electrical connection member is configured as a part of a member for sealing the semiconductor laser device. 1. The optical pickup device according to 1. 2. The optical pickup device according to claim 1, wherein heat generated by the semiconductor laser device is transmitted to the laser mounting member.

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