JP4349106B2 - Optical pickup and optical disc apparatus - Google Patents

Optical pickup and optical disc apparatus Download PDF

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JP4349106B2
JP4349106B2 JP2003402617A JP2003402617A JP4349106B2 JP 4349106 B2 JP4349106 B2 JP 4349106B2 JP 2003402617 A JP2003402617 A JP 2003402617A JP 2003402617 A JP2003402617 A JP 2003402617A JP 4349106 B2 JP4349106 B2 JP 4349106B2
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optical
light
optical member
light source
receiving element
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JP2005166157A (en
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治郎 三政
浩 谷川
雅春 深草
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Description

本発明は、パーソナルコンピュータ,ノートブック型コンピュータ,モバイル端末機器などの電子機器に搭載される光ディスク装置及びその光ディスク装置に好適に用いられる光ピックアップに関するものである。   The present invention relates to an optical disk device mounted on an electronic device such as a personal computer, a notebook computer, or a mobile terminal device, and an optical pickup suitably used for the optical disk device.

光学記録媒体として、DVD(デジタルビデオディスク)、CD−R(書き込み可能なコンパクトディスク)、CD−RW(書き換え可能なコンパクトディスク)等の種々の光ディスクが開発されている。DVDにおいては、波長約650nmのレーザ光により情報の記録または再生が行われる。一方、CD−RやCD−RWにおいては、波長約780nmのレーザー光により情報の記録または再生が行われる。このような複数種類の光ディスクに対して情報の記録または再生を行う光ディスク装置が提案されている。   As optical recording media, various optical discs such as DVD (digital video disc), CD-R (writeable compact disc), CD-RW (rewritable compact disc) have been developed. In a DVD, information is recorded or reproduced by a laser beam having a wavelength of about 650 nm. On the other hand, in CD-R and CD-RW, information is recorded or reproduced by laser light having a wavelength of about 780 nm. An optical disc apparatus that records or reproduces information on a plurality of types of optical discs has been proposed.

また、このような複数種類の光ディスクに対して情報の記録または再生を行う光ディスク装置において、光ディスク装置に搭載される光ピックアップの光源としては、複数の異なる波長の光束を出射するレーザー素子を1つのパッケージに隣接して配置したもの(いわゆるハイブリッド型2波長半導体レーザー)や、1つの半導体基板に複数の波長の光源を集積化したもの(いわゆるモノリシック型2波長半導体レーザー)などが用いられている。   Further, in such an optical disc apparatus that records or reproduces information on a plurality of types of optical discs, a single laser element that emits light beams of different wavelengths is used as a light source of an optical pickup mounted on the optical disc apparatus. A device disposed adjacent to a package (a so-called hybrid two-wavelength semiconductor laser) or a device in which light sources having a plurality of wavelengths are integrated on a single semiconductor substrate (a so-called monolithic two-wavelength semiconductor laser) is used.

また、薄型化や小型化の要請に従って、これら光源は、リードフレーム上に半導体レーザー素子を実装し、その半導体レーザー素子を保護膜で覆い、リードフレームを電流供給可能なラインに電気的に接続する構成が採用されている。この構成は所謂フレームレーザー光源と呼ばれている。   Further, in accordance with demands for thinning and miniaturization, these light sources mount a semiconductor laser element on a lead frame, cover the semiconductor laser element with a protective film, and electrically connect the lead frame to a line capable of supplying current. Configuration is adopted. This configuration is called a so-called frame laser light source.

フレームレーザー光源を用いた先行例としては、(特許文献1)〜(特許文献5)などが存在する。   As a prior example using a frame laser light source, there are (Patent Document 1) to (Patent Document 5) and the like.

また、光源及び受光素子を精度良く位置決めするために、(特許文献6)に示すように結合部材に光源,受光素子を接合する構成も存在する。
特開平10−241195号公報 特開平10−241189号公報 特開2000−137924号公報 特開2002−74722号公報 特開2003−59094号公報 特開2001−312835号公報
In addition, in order to accurately position the light source and the light receiving element, there is a configuration in which the light source and the light receiving element are joined to the coupling member as shown in (Patent Document 6).
JP-A-10-241195 JP-A-10-241189 JP 2000-137924 A JP 2002-74722 A JP 2003-59094 A JP 2001-31835 A

しかしながら上記(特許文献1)〜(特許文献5)の構成では、光源或いは受光素子がプレートに固定されているので、光源と受光素子の位置決めが非常に難しく、精度良い組み立てが必要となり、生産性を向上させることが困難である。特に、2波長半導体レーザー素子を光源として用いた場合(特許文献2参照)には、光源と受光素子との位置関係は極めて高い精度が求められ、同様に生産性を向上させることは困難である。   However, in the configurations of the above (Patent Document 1) to (Patent Document 5), since the light source or the light receiving element is fixed to the plate, it is very difficult to position the light source and the light receiving element, and accurate assembly is required, and productivity is increased. It is difficult to improve. In particular, when a two-wavelength semiconductor laser element is used as a light source (see Patent Document 2), the positional relationship between the light source and the light receiving element is required to have extremely high accuracy, and it is difficult to improve productivity as well. .

これら、光源と受光素子の位置調整を精度良く行う方法としては、(特許文献6)に記載されているように結合部材を用いて、光源と受光素子の位置調整を行って結合部材に接合する方法があり、比較的位置調整が容易であるものの、光源と光ガイド部材間に介在する接合材の影響によって、光束に収差を生じ、光学特性の劣化に繋がっていた。 As a method for accurately adjusting the position of the light source and the light receiving element, as described in (Patent Document 6), using the coupling member, the position of the light source and the light receiving element is adjusted and joined to the coupling member. Although there is a method and the position adjustment is relatively easy, an aberration is caused in the light beam due to the influence of the bonding material interposed between the light source and the light guide member, leading to deterioration of the optical characteristics.

本発明は前記従来の課題を解決するもので、フレームレーザー光源を用い、しかも特に好ましくは2波長半導体レーザー光源を用いた場合においても、生産性や作業性を改善することができるか、或いは、光学特性を改善できることの少なくとも一方を実現できる光ピックアップ及び光ディスク装置を提供することを目的としている。   The present invention solves the above-mentioned conventional problems, and even when a frame laser light source is used and particularly preferably a two-wavelength semiconductor laser light source is used, productivity and workability can be improved, or An object of the present invention is to provide an optical pickup and an optical disc apparatus that can realize at least one of the improvement of optical characteristics.

本発明は、プレートと複数の端子部をモールド部材で互いに固定し前記プレートに半導体レーザー素子を設けた光源と、受光素子と、前記光源と前記受光素子との間に設けた前記光源からの光を通過させる第1の光学部材と、前記第1の光学部材からの光を外部へ出射するとともに前記外部からの光をその内部で反射させて前記受光素子へ出射する第2の光学部材と、前記光源を配置する空間部分と前記第1及び前記第2の光学部材を載置する載置部と前記受光素子を取り付ける1対の取付部とを有する結合ベースと、を備え、前記空間部分には前記光源のプレートの両側方部が配置される1対の接合部が設けられ、前記載置部は、前記空間部分と連通して前記光源からの光を通過させる小径部と前記小径部を塞ぐように前記第1の光学部材を収納する大径部とを設けた貫通孔を有し、前記貫通孔の大径部の開口部分の周縁部に前記第2の光学部材を載置することで前記光源と前記第1の光学部材との間及び前記第1の光学部材と前記第2の光学部材との間に接合材が非介在となる所定の隙間を設けた構成とした。 The present invention provides a light source in which a plate and a plurality of terminal portions are fixed to each other with a molding member and a semiconductor laser element is provided on the plate, a light receiving element, and light from the light source provided between the light source and the light receiving element. And a second optical member that emits the light from the first optical member to the outside and reflects the light from the outside to the light receiving element. A coupling base having a space portion for disposing the light source, a placement portion for placing the first and second optical members, and a pair of attachment portions for attaching the light receiving elements; Is provided with a pair of joint portions in which both side portions of the plate of the light source are disposed, and the placement portion includes a small diameter portion that communicates with the space portion and allows light from the light source to pass therethrough and the small diameter portion. The first optical member so as to close The light source and the first optical member have a through-hole provided with a large-diameter portion to be accommodated, and the second optical member is placed on a peripheral portion of the opening portion of the large-diameter portion of the through-hole. And a gap between the first optical member and the second optical member is provided with a predetermined gap in which no bonding material is interposed .

本発明は、前記構成によって、フレームレーザー光源を用いたとしても、受光素子と光源をそれぞれ調整可能なように結合ベースを用いて、各部を固定することで、光学調整が行いやすく、作業性などが向上し、生産性を向上させることができる。また、光源と第1の光学部材との間及び第1の光学部材と第2の光学部材との間に接合材が非配置となるような構成とすることができるので、光束に収差を発生させることを抑制できる。 In the present invention, even if a frame laser light source is used according to the above configuration, by using a coupling base so that each of the light receiving element and the light source can be adjusted, each part is fixed, so that optical adjustment can be easily performed, workability, etc. Can be improved and productivity can be improved. In addition, since the bonding material is not disposed between the light source and the first optical member and between the first optical member and the second optical member , aberration is generated in the light flux. Can be suppressed.

この様に、光学調整が困難な複数の異なる波長の光束を出射する光源を用いたとしても、組み立て時において調整が容易で、しかも光学特性の劣化を防止できるので、小型な構成を得ることができ、特性的にも優位となる。   In this way, even if a light source that emits light beams having a plurality of different wavelengths that are difficult to optically adjust is used, adjustment is easy at the time of assembly, and deterioration of optical characteristics can be prevented, so that a compact configuration can be obtained. Can be superior in terms of characteristics.

請求項1記載の発明は、プレートと複数の端子部をモールド部材で互いに固定しプレートに半導体レーザー素子を設けた光源と、受光素子と、光源と受光素子との間に設けた光源からの光を通過させる第1の光学部材と、第1の光学部材からの光を外部へ出射するとともに外部からの光をその内部で反射させて受光素子へ出射する第2の光学部材と、光源を配置する空間部分と第1及び第2の光学部材を載置する載置部と受光素子を取り付ける1対の取付部とを有する結合ベースと、を備え、空間部分には光源のプレートの両側方部が配置される1対の接合部が設けられ、載置部は、空間部分と連通して光源からの光を通過させる小径部と小径部を塞ぐように第1の光学部材を収納する大径部とを設けた貫通孔を有し、貫通孔の大径部の開口部分の周縁部に第2の光学部材を載置することで光源と第1の光学部材との間及び第1の光学部材と第2の光学部材との間に接合材が非介在となる所定の隙間を設けたことを特徴とする光ピックアップであり、フレームレーザー光源を用いたとしても、受光素子と光源をそれぞれ調整可能なように結合ベースを用いて、各部を固定することで、光学調整が行いやすく、作業性などが向上し、生産性を向上させることができる。また、光源と第1の光学部材との間及び第1の光学部材と第2の光学部材との間に接合材が非配置となるような構成とすることができるので、光束に収差を発生させることを抑制できる。また、大径部の中に第1の光学部材を設けることで、装置の小型化を実現できる。また、第1の光学部材を結合ベースに取り付ける際に、貫通孔の中に手放しで第1の光学部材を保持でき、組み立て性が向上する。 According to the first aspect of the present invention, a plate and a plurality of terminal portions are fixed to each other with a molding member, a light source provided with a semiconductor laser element on the plate, a light receiving element, and light from a light source provided between the light source and the light receiving element A first optical member that allows light to pass through, a second optical member that emits light from the first optical member to the outside, reflects light from the outside, and emits the light to the light receiving element, and a light source And a coupling base having a mounting portion on which the first and second optical members are mounted and a pair of mounting portions to which the light receiving elements are mounted. The mounting portion is provided with a small diameter portion that communicates with the space portion and allows light from the light source to pass therethrough, and a large diameter that houses the first optical member so as to close the small diameter portion. And a large-diameter opening in the through-hole. The second optical member is placed on the peripheral part of the minute, so that the bonding material is not interposed between the light source and the first optical member and between the first optical member and the second optical member. The optical pickup is characterized by providing a gap between the two , and even if a frame laser light source is used, each part is fixed by using a coupling base so that the light receiving element and the light source can be adjusted, thereby optical adjustment. It is easy to perform, and workability etc. improve and productivity can be improved. In addition, since the bonding material is not disposed between the light source and the first optical member and between the first optical member and the second optical member , aberration is generated in the light flux. Can be suppressed. Further, by providing the first optical member in the large diameter portion, it is possible to reduce the size of the apparatus. Moreover, when attaching a 1st optical member to a coupling | bonding base, a 1st optical member can be hold | maintained in a through-hole and an assembly property improves.

請求項2記載の発明は、周縁部には複数の突起を設け、複数の突起の上に第2の光学部材を設けたことを特徴とする請求項1記載の光ピックアップであり、第1の光学部材と第2の光学部材の間に隙間を精度良く形成でき、光学特性のばらつきを抑えることができる。 The invention according to claim 2 is the optical pickup according to claim 1 , wherein a plurality of protrusions are provided on the peripheral portion, and a second optical member is provided on the plurality of protrusions. A gap can be accurately formed between the optical member and the second optical member, and variations in optical characteristics can be suppressed.

請求項3記載の発明は、請求項1〜請求項2いずれか1記載の光ピックアップと、媒体を回転させる回転駆動手段と、回転駆動手段に対して光ピックアップを近づけたり離したりする移動手段とを備えたことを特徴とする光ディスク装置であり、フレームレーザー光源を用いたとしても、受光素子と光源をそれぞれ調整可能なように結合ベースを用いて、各部を固定することで、光学調整が行いやすく、作業性などが向上し、生産性を向上させることができる。また、光源と第1の光学部材との間及び第1の光学部材と第2の光学部材との間に接合材が非配置となるような構成とすることができるので、光束に収差を発生させることを抑制できる。また、大径部の中に第1の光学部材を設けることで、装置の小型化を実現できる。また、第1の光学部材を結合ベースに取り付ける際に、貫通孔の中に手放しで第1の光学部材を保持でき、組み立て性が向上する。また、薄型化、小型化が実現できる。 According to a third aspect of the present invention, there is provided an optical pickup according to any one of the first to second aspects , a rotation driving means for rotating the medium, and a moving means for moving the optical pickup closer to or away from the rotation driving means. Even if a frame laser light source is used, optical adjustment is performed by fixing each part using a coupling base so that the light receiving element and the light source can be adjusted respectively. It is easy, workability and the like are improved, and productivity can be improved. In addition, since the bonding material is not disposed between the light source and the first optical member and between the first optical member and the second optical member, aberration is generated in the light flux. Can be suppressed. Further, by providing the first optical member in the large diameter portion, it is possible to reduce the size of the apparatus. Moreover, when attaching a 1st optical member to a coupling | bonding base, a 1st optical member can be hold | maintained in a through-hole and an assembly property improves. Further, it is possible to reduce the thickness and size.

図1,図2は本発明の一実施の形態における光ピックアップを示す斜視図及び分解斜視図である。   1 and 2 are a perspective view and an exploded perspective view showing an optical pickup according to an embodiment of the present invention.

図1,図2において、1は光源、2は受光素子、3は結合ベース、4,5はそれぞれ光学部材である。光源1,受光素子2及び光学部材4,5はそれぞれ結合ベース3に接合されている。光源1と光学部材4,5の間には結合ベース3に設けられた貫通孔3aが存在しており、光源1から出射された光は貫通孔3aを通過して光学部材4,5に入射され、光学部材5から出射された光は、少なくとも図示していない対物レンズ等の集光手段を通して、図示していない光ディスクに照射され、光ディスクに対して所定の情報記録等を行う。   1 and 2, 1 is a light source, 2 is a light receiving element, 3 is a coupling base, and 4 and 5 are optical members. The light source 1, the light receiving element 2 and the optical members 4 and 5 are respectively joined to the coupling base 3. There is a through hole 3a provided in the coupling base 3 between the light source 1 and the optical members 4 and 5, and the light emitted from the light source 1 passes through the through hole 3a and enters the optical members 4 and 5. The light emitted from the optical member 5 is irradiated onto an optical disk (not shown) through at least condensing means such as an objective lens (not shown) to perform predetermined information recording on the optical disk.

また、光ディスクから反射してきた光は、少なくとも対物レンズなどを通過し、光学部材5に入射され、光学部材5内部で1乃至複数回反射などを行った後に、受光素子2に入射される。受光素子2では、入射した光を電気信号に変換し、その電気信号は信号生成系の回路部に送られ、その回路部においてトラッキングエラー信号,フォーカスエラー信号,RF信号などを生成し、それら各信号を基に、光ピックアップのトラッキング制御やフォーカス制御を行い、更にRF信号から所望の情報を生成する。   The light reflected from the optical disk passes through at least the objective lens and the like, is incident on the optical member 5, is reflected one or more times inside the optical member 5, and then enters the light receiving element 2. In the light receiving element 2, incident light is converted into an electric signal, and the electric signal is sent to a circuit section of a signal generation system, which generates a tracking error signal, a focus error signal, an RF signal, etc. Based on the signal, tracking control and focus control of the optical pickup are performed, and further desired information is generated from the RF signal.

光源1は結合ベース3の後部から取り付けられ、光源1の先端における光出射部と結合ベース3に取り付けられた光学部材4が対向するように互いに結合ベース3に取り付けられている。また、受光素子2の光入射面は少なくとも光学部材5の側方部と対向しており、光学部材5の底部には光学部材4が対向している。   The light source 1 is attached from the rear part of the coupling base 3, and is attached to the coupling base 3 so that the light emitting part at the tip of the light source 1 and the optical member 4 attached to the coupling base 3 face each other. The light incident surface of the light receiving element 2 faces at least the side part of the optical member 5, and the optical member 4 faces the bottom of the optical member 5.

以下、各部ついて、詳細に説明する。   Hereinafter, each part will be described in detail.

まず、光源1について説明する。   First, the light source 1 will be described.

光源1としては、例えば、図3,図4に示されるフレームレーザー光源が好適に用いられる。光源1としてのフレームレーザー光源は、プレート6の一部をモールド部材7で覆うように構成されている。プレート6としては、銅,銅合金,銀,銀合金,アルミ,アルミ合金,鉄,鉄合金などの金属製の板状体が好ましく用いられ、更に好ましくは、この板状体の上に半田付け性の良い材料をメッキや蒸着などの手段でコーティングすることが好ましい。なお、本実施の形態では、板状体を金属材料で構成したが、金属材料以外でも熱伝導性が良く、導電性が高い材料、例えば導電性セラミック等を用いることができる。本実施の形態では、プレート6としては、銅或いは銅合金で構成された板状体の上にAg或いはAg合金のメッキ膜を設けた。プレート6は両側方にはみ出た、側方部6a,6bが設けられており、この側方部6a,6bは放熱を促す様に設けられたり、或いは他の部材への取付性を向上させるように設けられたりなどする。   As the light source 1, for example, a frame laser light source shown in FIGS. 3 and 4 is preferably used. The frame laser light source as the light source 1 is configured to cover a part of the plate 6 with a mold member 7. The plate 6 is preferably a metal plate such as copper, copper alloy, silver, silver alloy, aluminum, aluminum alloy, iron, iron alloy, and more preferably soldered on the plate. It is preferable to coat a good material by means such as plating or vapor deposition. In the present embodiment, the plate-like body is made of a metal material. However, a material having good thermal conductivity and high conductivity other than the metal material, such as a conductive ceramic, can be used. In the present embodiment, as the plate 6, a plated film made of Ag or an Ag alloy is provided on a plate-like body made of copper or a copper alloy. The plate 6 is provided with side portions 6a and 6b that protrude from both sides, and the side portions 6a and 6b are provided so as to promote heat dissipation or to improve the mounting property to other members. And so on.

プレート6には、絶縁部を有するサブマウント8を介して半導体レーザー素子9が設けられており、半導体レーザー素子9の上面はプレート6と金などのワイヤーで電気的に接続されている。この時、半導体レーザー素子9の光出射面はフレームレーザー光源の上部に配置される。サブマウント8の基台は絶縁材料で構成され、サブマウント8の半導体レーザー素子9が形成される面には分離された電極11,12が形成され、電極11,12上に半導体レーザー素子9が電気的に接合されている。 A semiconductor laser element 9 is provided on the plate 6 via a submount 8 having an insulating portion, and the upper surface of the semiconductor laser element 9 is electrically connected to the plate 6 by a wire such as gold. At this time, the light emitting surface of the semiconductor laser element 9 is disposed above the frame laser light source. Base submount 8 is composed of an insulating material, the surface on which the semiconductor laser device 9 of the submount 8 are formed are electrodes 11 and 12 which are separated form, the semiconductor laser device 9 on the electrodes 11 and 12 Electrically joined.

半導体レーザー素子9は、モノブロックすなわち、一つのブロックに1乃至複数の異なる波長の光を出射する構成となっている。本実施の形態では、波長約650nm(例えばDVD系)のレーザー光と、波長約780nm(CD系)のレーザー光を出射する半導体レーザー素子9を用いた。なお、半導体レーザー素子9から出射される光は一つでも良いし、また、三つ以上の互いに波長の異なる光を照射しても良い。本実施の形態における光ピックアップの場合、特に、複数の互いに異なる波長の光を出射する半導体レーザー素子9を用いる場合に適している。また、本実施の形態では、互いに波長の異なる複数の光を出射する場合に、半導体レーザー素子としてはモノブロックを用いたが、一つのブロックで一つの波長の光束を出射する複数個の半導体レーザー素子9をプレート6の上に実装して、互いに異なる波長の光を複数出射しても良い。多少この場合には、光源1のサイズが大きくなる可能性はあるものの、任意の異なる波長の光束を出射する半導体レーザー素子9を搭載できるので、大幅に波長の異なる複数の光束を出射する構成とすることが容易である。 The semiconductor laser element 9 is configured to emit light of one to a plurality of different wavelengths in a monoblock, that is, one block. In the present embodiment, the semiconductor laser element 9 that emits laser light having a wavelength of about 650 nm (for example, DVD system) and laser light having a wavelength of about 780 nm (CD system) is used. The light emitted from the semiconductor laser element 9 may be one, or three or more lights having different wavelengths may be irradiated. The optical pickup according to the present embodiment is particularly suitable when a plurality of semiconductor laser elements 9 that emit light having different wavelengths are used. In the present embodiment, when emitting a plurality of lights having different wavelengths, a monoblock is used as the semiconductor laser element, but a plurality of semiconductor lasers emitting a light beam of one wavelength in one block. The element 9 may be mounted on the plate 6 to emit a plurality of lights having different wavelengths. In this case, although the size of the light source 1 may be increased, the semiconductor laser element 9 that emits light beams having arbitrary different wavelengths can be mounted, so that a plurality of light beams having significantly different wavelengths are emitted. Easy to do.

13,14,15はそれぞれ端子部で、端子部13はプレート6と一体形成されている。すなわち、プレート6と端子部13は電気的に接続されている。また、端子部14,15は、プレート6及び端子部13とは分離して設けられており、モールド部材7にて互いに固定されている。端子部14の端部は導電性のワイヤ16を介して電極12と電気的に接合しており、端子部15はワイヤ17を介して電極13と互いに電気的に接合している。   Reference numerals 13, 14, and 15 denote terminal portions, and the terminal portion 13 is formed integrally with the plate 6. That is, the plate 6 and the terminal portion 13 are electrically connected. The terminal portions 14 and 15 are provided separately from the plate 6 and the terminal portion 13, and are fixed to each other by the mold member 7. The end portion of the terminal portion 14 is electrically joined to the electrode 12 via a conductive wire 16, and the terminal portion 15 is electrically joined to the electrode 13 via a wire 17.

例えば、半導体レーザー素子9がDVD系の光ディスクに対して情報の記録/再生の少なくとも一方を行う光束と、CD系の光ディスクに対して、情報の記録/再生の少なくとも一方を行う光束を出射させる場合には、端子部13はグランドに接続し、端子部14はDVD系の光束を出射させる様な電流を供給する回路に接続し、端子部15はCD系の光束を出射させる様な電流を供給する回路に接続される。すなわち、DVD系の光束を出射させる場合には、例えば電流は端子部14,ワイヤ16,電極12,半導体レーザー素子9,ワイヤ10,プレート6,端子部13の順に流れる。CD系の光束を出射させる場合には、例えば電流は端子部15,ワイヤ17,電極11,半導体レーザー素子9,ワイヤ10,プレート6,端子部13の順に流れる。   For example, when the semiconductor laser element 9 emits a light beam that performs at least one of information recording / reproduction with respect to a DVD optical disk and a light beam that performs at least one of information recording / reproduction with respect to a CD optical disk The terminal unit 13 is connected to the ground, the terminal unit 14 is connected to a circuit that supplies a current that emits a DVD-type light beam, and the terminal unit 15 supplies a current that emits a CD-type light beam. Connected to the circuit. That is, when a DVD-type light beam is emitted, for example, current flows in the order of the terminal portion 14, the wire 16, the electrode 12, the semiconductor laser element 9, the wire 10, the plate 6, and the terminal portion 13. In the case of emitting a CD light beam, for example, current flows in the order of the terminal portion 15, the wire 17, the electrode 11, the semiconductor laser element 9, the wire 10, the plate 6, and the terminal portion 13.

モールド部材7は、樹脂材料やセラミック材料などの絶縁性材料が好適に用いられ、時に好ましくは樹脂材料を用いることであり、樹脂材料を用いることで、光源1の製作が非常に容易になる。また、樹脂材料の中でも、高耐熱性(250℃以上)を有し、バリなどの発生が少ない材料が好ましく、本実施の形態では、PPS(ポリフェニレンスルフィド)を用いた。また、使用可能な樹脂材料としてはエポキシ樹脂,ウレタン樹脂,液晶ポリマーなどを好適に用いることができる。   The mold member 7 is preferably made of an insulating material such as a resin material or a ceramic material. Sometimes, a resin material is preferably used, and the use of the resin material makes it very easy to manufacture the light source 1. Among the resin materials, a material having high heat resistance (250 ° C. or higher) and less generation of burrs is preferable. In this embodiment, PPS (polyphenylene sulfide) is used. Moreover, as a usable resin material, an epoxy resin, a urethane resin, a liquid crystal polymer, or the like can be suitably used.

モールド部材7は上述の様に、端子部13と一体になったプレート6,端子部14,15を互いに固定しており、しかも図3に示すように、光源1の前面においてモールド部材7は光束の出斜面側を開口させた壁部を有している。壁部内には、サブマウント8,半導体レーザー素子,プレート6の一部,ワイヤ10,ワイヤ16,ワイヤ17,端子部14の一部,端子部15の一部が配置される。また、図4に示すように光源1の裏面には、プレート6の半導体レーザー素子9を設けた側と反対側の面の一部が露出するようにモールド部材7が設けられている。前面側のモールド部材7及び裏面側のモールド部材7は一体構成となっている。   As described above, the mold member 7 fixes the plate 6 and the terminal portions 14 and 15 integrated with the terminal portion 13 to each other. Further, as shown in FIG. It has the wall part which opened the exit slope side. In the wall portion, a submount 8, a semiconductor laser element, a part of the plate 6, a wire 10, a wire 16, a wire 17, a part of the terminal part 14, and a part of the terminal part 15 are arranged. As shown in FIG. 4, a mold member 7 is provided on the back surface of the light source 1 so that a part of the surface of the plate 6 opposite to the side where the semiconductor laser element 9 is provided is exposed. The mold member 7 on the front side and the mold member 7 on the back side are integrated.

次に結合ベース3について図5,図6を用いて詳細に説明する。   Next, the coupling base 3 will be described in detail with reference to FIGS.

結合ベース3は、比較的、軽量,高精度での形状加工性,放熱性等を兼ね備えた材料で形成させることが好ましく、例えば、亜鉛,亜鉛合金,アルミ,アルミ合金,チタン,チ
タン合金などが好適に用いられる。本実施の形態では、コスト面などを考慮し、亜鉛ダイキャストで結合ベース3を構成した。なお、結合ベース3と他の部材との接合性を向上させたり、或いは結合ベース3に耐候性を持たせる等の種々の目的のために、結合ベース3の全表面あるいは少なくとも一部の表面にAu,Au合金,Sn,Sn合金(Sn−Cu,Sn−Ag−Sn等)で構成された膜,フィルム等を設けることが好ましい。時に、前述の金属材料をメッキ等で形成することが量産性等の面で好ましい。この時、膜,フィルムの厚みとしては、3μm以上とすることが好ましく、コスト面などを考慮すると20μm以下とすることが好ましい。また、膜として構成する場合には電界メッキや無電界メッキなどのメッキの手法を用いて形成したが、蒸着やスパッタリングなどの手法を用いて形成しても良い。
The coupling base 3 is preferably formed of a material having relatively light weight, high precision shape workability, heat dissipation, etc., for example, zinc, zinc alloy, aluminum, aluminum alloy, titanium, titanium alloy, etc. Preferably used. In the present embodiment, the bonding base 3 is configured by zinc die casting in consideration of cost and the like. Note that, for various purposes such as improving the bondability between the coupling base 3 and other members or providing the coupling base 3 with weather resistance, the entire surface of the coupling base 3 or at least a part of the surface thereof is provided. It is preferable to provide a film, a film, or the like made of Au, Au alloy, Sn, Sn alloy (Sn—Cu, Sn—Ag—Sn, etc.). Sometimes, it is preferable in terms of mass productivity to form the aforementioned metal material by plating or the like. At this time, the thickness of the film or film is preferably 3 μm or more, and is preferably 20 μm or less in consideration of cost. Further, when the film is formed as a film, it is formed using a plating technique such as electroplating or electroless plating, but may be formed using a technique such as vapor deposition or sputtering.

結合ベース3には、他の部材などに結合ベース3を固定する固定部18,19が設けられており、固定部18,19にはそれぞれ他の部材などにネジ,カシメピンなどの締結手段が挿入される貫通孔18a,19aが設けられている。本実施の形態では、この貫通孔18a,19aにネジを挿入し、そのネジを他の部材のネジ孔に挿入して締め付けて固定した。   The coupling base 3 is provided with fixing portions 18 and 19 for fixing the coupling base 3 to other members and the like, and fastening means such as screws and caulking pins are inserted into the fixing members 18 and 19 respectively. Through-holes 18a and 19a are provided. In the present embodiment, screws are inserted into the through holes 18a and 19a, and the screws are inserted into screw holes of other members and fastened to be fixed.

なお、本実施の形態では、他の部材への取付をネジで行ったが、有機接着剤や半田などの接合材もしくは超音波溶接などの溶接手段を用いた結合ベース3を他の部材に取り付けても良く、この場合には、貫通孔18a,19bは設けなくても良く、代わりに接着面や接合面に凹凸や所定の面粗さを設けたり、或いは溝等を設けて、接合接着強度を向上させても良い。   In this embodiment, the attachment to other members is performed with screws, but the coupling base 3 using a bonding material such as an organic adhesive or solder or welding means such as ultrasonic welding is attached to the other members. In this case, the through holes 18a and 19b may not be provided. Instead, the bonding surface or the bonding surface is provided with unevenness or a predetermined surface roughness, or a groove or the like is provided. May be improved.

なお、本実施の形態では、貫通孔18a,19aをそれぞれ固定部18,19に設けたが、例えば一方の固定部18にのみ貫通孔18aを設け、固定部19には貫通孔19aを設けない構成でも良い。この場合には、固定部18はネジなどの他の部材に固定し、固定部19は、他の部材に固定部19の挿入部などを設けて係止させて、結合ベース3を他の部材に固定する方法でも良い。また、本実施の形態では、貫通孔18a,19aの断面形状としては、円形や角部を円弧状にした略方形形状としたり、或いは楕円形状としたが、一部にスリットを設け、断面略C字型の貫通孔にしたり、或いは断面半円状としても良い。   In the present embodiment, the through holes 18a and 19a are provided in the fixing portions 18 and 19, respectively. However, for example, the through hole 18a is provided only in one fixing portion 18, and the through hole 19a is not provided in the fixing portion 19. It may be configured. In this case, the fixing portion 18 is fixed to another member such as a screw, and the fixing portion 19 is provided with an insertion portion or the like of the fixing portion 19 on another member to be locked, and the coupling base 3 is connected to the other member. It is also possible to fix it to. In the present embodiment, the cross-sectional shape of the through holes 18a and 19a is a circle, a substantially square shape with corners arcuate, or an oval shape. A C-shaped through-hole or a semicircular cross section may be used.

更に、好ましくは、図5,図6に示すように固定部18,19の外端に位置決め用の略V字或いは略U字型の凹部18b,19bを設けても良い。この凹部18b,19bは結合ベース3を他の部材に取付の際に位置決め用として設けられたり、或いは、結合ベース3に光源1,受光素子2,光学部材4,5を取り付ける組み立て作業時の基準部として用いてもよい。なお、本実施の形態では、凹部18b,19bを設けたが、固定部18,19の少なくとも一方に設けても良いし、あるいは、他の治具などを用いて光ピックアップの組み立てや、他の部材への取付を行う場合には、特に凹部18b,19bを設ける必要はない。ただ、その他の理由で凹部18b,19bが必要な場合には、例え他の治具などで組み立てを行う場合でも、凹部18b,19bを固定部18,19に設けても良い。   Further, preferably, as shown in FIGS. 5 and 6, positioning substantially V-shaped or U-shaped concave portions 18 b and 19 b may be provided at the outer ends of the fixing portions 18 and 19. The recesses 18b and 19b are provided for positioning when the coupling base 3 is attached to another member, or a reference for assembly work for attaching the light source 1, the light receiving element 2, and the optical members 4 and 5 to the coupling base 3. It may be used as a part. In this embodiment, the recesses 18b and 19b are provided. However, the recesses 18b and 19b may be provided on at least one of the fixing parts 18 and 19, or an assembly of the optical pickup using another jig or the like, When attaching to a member, it is not necessary to provide the recesses 18b and 19b. However, when the recesses 18b and 19b are necessary for other reasons, the recesses 18b and 19b may be provided in the fixing portions 18 and 19 even when assembling with another jig or the like.

固定部18,19の間には、少なくとも光源1,受光素子2,光学部材4,5を取り付ける本体部20が設けられており、本体部20の両脇に固定部18,19が一体に設けられる構成となっている。なお、本実施の形態では、本体部20と固定部18,19を一体に形成したが、固定部18,19に相当する部材を別部材で設け、本体部20に固定部18,19に相当する部材を、接着,係止,係合,溶接などのいずれか一つの手法を用いて取り付けても良い。   A main body 20 for attaching at least the light source 1, the light receiving element 2, the optical members 4 and 5 is provided between the fixing parts 18 and 19. The fixing parts 18 and 19 are integrally provided on both sides of the main body 20. It has a configuration that can be. In the present embodiment, the main body portion 20 and the fixing portions 18 and 19 are integrally formed. However, a member corresponding to the fixing portions 18 and 19 is provided as a separate member, and the main body portion 20 corresponds to the fixing portions 18 and 19. The member to be attached may be attached using any one method such as adhesion, locking, engagement, and welding.

本体部20には対向した一対の側壁21,22が立設されており、側壁21,22の間
には光学部材5が配置される。側壁21には壁部21a,21bが設けられており、壁部21aは壁部21bよりも高さが高くなっており、しかも壁部21aと壁部21bの間は傾斜部21cで一体に連結されている。同様に側壁22には壁部22a,22bが設けられており、壁部22aは壁部22bよりも高さが高くなっており、しかも壁部22aと壁部22bの間は傾斜部22cで一体に連結されている。また、壁部21b,22bにはそれぞれ互いに対向するテーパー部21d,22dが設けられている。
A pair of opposite side walls 21 and 22 are erected on the main body 20, and the optical member 5 is disposed between the side walls 21 and 22. The side wall 21 is provided with wall portions 21a and 21b. The wall portion 21a is higher than the wall portion 21b, and the wall portion 21a and the wall portion 21b are integrally connected by an inclined portion 21c. Has been. Similarly, the side wall 22 is provided with wall portions 22a and 22b, the wall portion 22a is higher than the wall portion 22b, and the wall portion 22a and the wall portion 22b are integrated with an inclined portion 22c. It is connected to. The wall portions 21b and 22b are provided with tapered portions 21d and 22d that face each other.

また、壁部21a,22bの傾斜部21c,22cと反対側には、それぞれ略平坦な受光素子2の取付部23,24が設けられており、受光素子2はこの取付部23,24に接着などの手法を用いて固定される。なお、取付部23,24は略同一平面であることが望ましい。取付部23,24は底部においてほぼ同一平面の連結部で連結されている。また、この様に壁部21a,22aは受光素子2を取り付ける取付面23,24を設けているので、ある程度の機械的強度が必要となる。その対策の一例としては、傾斜部21c,22cを設けることで、壁部21a,22aの底部の幅が広くなり、側部21a,22aの機械的強度を増すように構成している。   Further, on the opposite side of the wall portions 21a and 22b from the inclined portions 21c and 22c, mounting portions 23 and 24 of the substantially flat light receiving element 2 are provided, respectively, and the light receiving element 2 is bonded to the mounting portions 23 and 24. It is fixed using methods such as. In addition, it is desirable for the attachment parts 23 and 24 to be substantially the same plane. The attachment parts 23 and 24 are connected at the bottom part by a connection part of substantially the same plane. Since the wall portions 21a and 22a are provided with the attachment surfaces 23 and 24 for attaching the light receiving element 2 in this way, a certain degree of mechanical strength is required. As an example of the countermeasure, by providing the inclined portions 21c and 22c, the bottom portions of the wall portions 21a and 22a are widened, and the mechanical strength of the side portions 21a and 22a is increased.

テーパー部21d,22dは例えば、光学部材4,5を本体部20に取り付ける際に、光学部材4,5を挿入しやすくしたりあるいは、光学部材4,5に傷などが入らないように設けられている。更にこのテーパー部21d,22dを設けることで、後述するように光学部材5を搭載して接着剤で光学部材5を本体部20に固定する際に接着剤をこのテーパー部21d,22dと光学部材5との間に貯めることができ、接合強度を増すことも可能となる。   The tapered portions 21d and 22d are provided, for example, so that the optical members 4 and 5 can be easily inserted when the optical members 4 and 5 are attached to the main body portion 20, or the optical members 4 and 5 are not damaged. ing. Further, by providing the tapered portions 21d and 22d, when the optical member 5 is mounted and the optical member 5 is fixed to the main body portion 20 with an adhesive as will be described later, the adhesive is attached to the tapered portions 21d and 22d and the optical member. 5, the bonding strength can be increased.

本体部20の一方の側面部には、他の部分よりも隆起した隆起部25が設けられており、この隆起部25は、本体部20の底部にしかも固定部18,19の間に設けられた第1隆起部24aと、本体部20の側部にしかも壁部21aの側面部にかけて設けられた第2隆起部25bとを有している。また、第1隆起部25aと第2隆起部25bは接続されており、図6では、略逆T字型に構成されている。   One side surface portion of the main body portion 20 is provided with a raised portion 25 that is higher than the other portion, and this raised portion 25 is provided at the bottom of the main body portion 20 and between the fixing portions 18 and 19. The first raised portion 24a and the second raised portion 25b provided on the side portion of the main body portion 20 and on the side surface portion of the wall portion 21a. Moreover, the 1st protruding part 25a and the 2nd protruding part 25b are connected, and it is comprised by the substantially inverted T shape in FIG.

隆起部25を設けることでその部分の厚みを増すことが可能となり、例えば本体部20の機械的強度を増すことができ、結合ベース3の撓みや変形を抑制できる。更に、壁部21aの側部にも第2隆起部25bが設けられているので、壁部21aの更なる機械的強度の補強を実現でき、安定した受光素子2の固定を行うことができる。   By providing the raised portion 25, the thickness of the portion can be increased. For example, the mechanical strength of the main body portion 20 can be increased, and the bending and deformation of the coupling base 3 can be suppressed. Furthermore, since the second raised portion 25b is also provided on the side portion of the wall portion 21a, the mechanical strength of the wall portion 21a can be further increased, and the light receiving element 2 can be stably fixed.

なお、結合ベース3を構成する材料,サイズ,形状によっては、この隆起部25を設けなくても良く、更に設ける場合においても、図6に示す形状に限らず、円形状,方形状,略C字型,略楕円型,略F字型,略E字型などの様々な形状で隆起部25を設けることが可能である。   Depending on the material, size, and shape of the coupling base 3, this raised portion 25 may not be provided, and even when it is provided, the shape is not limited to the shape shown in FIG. The raised portion 25 can be provided in various shapes such as a letter shape, a substantially elliptical shape, a substantially F shape, and a substantially E shape.

また、壁部21aには端部まで達した窪み部26が設けられ、壁部22aには略V字或いは略U字状の溝27が設けられている。これは、後述するように取付部23,24に受光素子2を接着剤などで接合する際に接着剤が光学部材4まで達し難いように設けられる。壁部21aは前述の様に隆起部25が設けられているために十分な広さの取付部23を得ることができるので、壁部21aの端部まで達した窪み部26としたが、壁部22aでは、この隆起部25が設けられていない分、端部まで達した窪み部を設けると、取付部24の面積が小さくなるので、端部まで達していない溝27とした。   The wall portion 21a is provided with a recessed portion 26 reaching the end portion, and the wall portion 22a is provided with a substantially V-shaped or substantially U-shaped groove 27. As described later, this is provided so that the adhesive does not easily reach the optical member 4 when the light receiving element 2 is joined to the attachment portions 23 and 24 with an adhesive or the like. Since the wall portion 21a is provided with the raised portion 25 as described above, the attachment portion 23 having a sufficiently wide area can be obtained. Therefore, the wall portion 21a is formed as the recess portion 26 reaching the end portion of the wall portion 21a. In the portion 22a, since the area of the mounting portion 24 is reduced by providing a recess portion that reaches the end portion because the raised portion 25 is not provided, the groove 27 does not reach the end portion.

なお、この窪み部26及び溝27も仕様などによっては設けなくても良い。   Note that the recess 26 and the groove 27 may not be provided depending on the specifications.

また、壁部21a,22aが対峙し、壁部21b,22bが対峙するように側壁21,
22は設けられている。
Further, the side walls 21a and 22a face each other, and the side walls 21b and 22b face each other.
22 is provided.

本体部20には、光学部材4,5の載置部28が設けられており、載置部28の両脇に側壁21,22が一体に立設されている。なお、本実施の形態では、側壁21,22を載置部28に一体に立設させたが、側壁21,22を別部材で構成し、その側壁21,22を載置部28の両脇に接着,係止,係合,溶接などのいずれか一つの手法を用いて取り付けても良い。   The main body 20 is provided with mounting portions 28 for the optical members 4 and 5, and side walls 21 and 22 are integrally provided on both sides of the mounting portion 28. In the present embodiment, the side walls 21 and 22 are erected integrally with the mounting portion 28, but the side walls 21 and 22 are formed of separate members, and the side walls 21 and 22 are disposed on both sides of the mounting portion 28. It may be attached using any one method such as adhesion, locking, engagement, and welding.

載置部28には、貫通孔3aが設けられており、貫通孔3aには、断面が大きな大径部32と、断面が小さな小径部33を連結して構成されている。本実施の形態では、大径部32及び小径部33をともに、断面形状が角部を円弧状とした略長方形状とし、しかも略相似形としたが、断面形状を円形状,楕円形状,5角形以上の多角形状等の他の形状でも良く、また、大径部32と小径部33の断面形状を異なる形状としても良い。すなわち、大径部32を上述の通り略長方形状とし、小径部33を略円形状としても良い。   The mounting portion 28 is provided with a through hole 3a, and the through hole 3a is configured by connecting a large diameter portion 32 having a large cross section and a small diameter portion 33 having a small cross section. In the present embodiment, the large-diameter portion 32 and the small-diameter portion 33 both have a substantially rectangular shape with a cross-sectional shape having an arcuate corner portion, and a substantially similar shape, but the cross-sectional shape is circular, elliptical, 5 Other shapes such as a polygonal shape more than a square may be used, and the cross-sectional shapes of the large diameter portion 32 and the small diameter portion 33 may be different. That is, the large diameter portion 32 may be substantially rectangular as described above, and the small diameter portion 33 may be substantially circular.

大径部33は光学部材4を収納可能としているので、光学部材4が収納できる程度の断面及び深さを有している。なお、本実施の形態では、大径部32及び小径部33を設けることで、大径部32に光学部材4を収納しても脱落することを防止できる等のメリットがあるが、光学部材4を他の治具などで貫通孔3a内に保持しておく様に工程などを考慮すれば、特に大径部32,小径部33を設けずに、貫通孔3aをストレートな構造とすることもできる。すなわち、例えば貫通孔3aの断面を全ての領域において所定の半径の円形とすることもできる。   Since the large-diameter portion 33 can accommodate the optical member 4, the large-diameter portion 33 has a cross section and a depth enough to accommodate the optical member 4. In the present embodiment, the provision of the large diameter portion 32 and the small diameter portion 33 has an advantage that the optical member 4 can be prevented from falling off even when the optical member 4 is stored in the large diameter portion 32. If the process is taken into consideration so as to be held in the through-hole 3a with another jig or the like, the through-hole 3a may be formed in a straight structure without providing the large-diameter portion 32 and the small-diameter portion 33. it can. That is, for example, the cross-section of the through-hole 3a can be circular with a predetermined radius in all regions.

また、貫通孔3aをストレート構造とした場合に上述の様に光学部材4が貫通孔3aが脱落するのを防止するように、貫通孔3aが構成する内に壁に一体或いは別体で突起部などを設けることもできる。この様な構成では、光学部材4の脱落を防止でき、組み立て性が向上する。   Further, when the through hole 3a has a straight structure, as described above, the optical member 4 prevents the through hole 3a from dropping out. Etc. can also be provided. In such a configuration, the optical member 4 can be prevented from falling off, and the assemblability is improved.

載置部28における貫通孔3aの開口部分の周縁部には、突起部29,30,31が設けられており。この突起29,30,31は載置部28に一体もしくは別体で設けられる。別体で設ける場合には、突起片を載置部28の貫通孔3aの開口周辺に接着,係止,係合,溶接などのいずれか一つの手法を用いて取り付けても良い。   Protrusions 29, 30, and 31 are provided on the peripheral edge portion of the opening portion of the through hole 3 a in the mounting portion 28. The protrusions 29, 30, and 31 are provided integrally or separately on the placement unit 28. When provided separately, the protruding piece may be attached to the periphery of the opening of the through hole 3a of the mounting portion 28 by using any one of methods such as adhesion, locking, engagement, and welding.

なお、本実施の形態では、結合ベース3に貫通孔3aを設けたが、貫通孔に限らずU字状の切り欠き等の開口部であればよい。   In the present embodiment, the through hole 3a is provided in the coupling base 3. However, the opening is not limited to the through hole but may be an opening such as a U-shaped notch.

本実施の形態では、図5,図6に示すように、貫通孔3aの開口部における側壁21,22と非対向の部分の一方には比較的大きな突起29を一つ設け、他方の部分には、比較的小さな突起30,31を並列して設けた。この時、この突起29,30,31の高さは、好ましくは全てほぼ同じ高さで構成する。また、この突起29,30,31の上面には光学部材5が載置され、その結果光学部材5は突起29,30,31の高さの分、光学部材4とは所定の距離を持って離れ、光学部材4,5は互いに非接触となるように構成される。   In this embodiment, as shown in FIGS. 5 and 6, one relatively large protrusion 29 is provided on one side of the opening of the through-hole 3 a that is not opposed to the side walls 21 and 22, and the other portion is provided. Are provided with relatively small protrusions 30 and 31 in parallel. At this time, the heights of the protrusions 29, 30, and 31 are preferably substantially the same. Further, the optical member 5 is placed on the upper surfaces of the protrusions 29, 30, 31. As a result, the optical member 5 has a predetermined distance from the optical member 4 by the height of the protrusions 29, 30, 31. The optical members 4 and 5 are separated from each other and are not in contact with each other.

なお、本実施の形態では、貫通孔3aの開口の一方の側に一つの突起29を設けた他方に突起30,31を並列させて設け、光学部材5を載置した際に3点支持となるように構成して安定した載置ができるように構成したが、どちらもそれぞれ突起を一個ずつ設けても良いし、複数個それぞれ突起を設けても良い。また、光学調整等を行う際にわざと光学部材5を傾斜して取り付ける場合については、左右で突起の高さを異ならせても良い。すなわち、図5,図6に示す構成では、例えば突起29を高くし、突起30,31の高さを
低くすることで、光学部材5は傾斜して取り付けられることになる。
In the present embodiment, one protrusion 29 is provided on one side of the opening of the through hole 3a, and the protrusions 30 and 31 are provided in parallel to each other. When the optical member 5 is placed, three-point support is provided. However, in either case, one protrusion may be provided, or a plurality of protrusions may be provided. In addition, when the optical member 5 is intentionally attached at the time of optical adjustment or the like, the height of the protrusions may be different on the left and right. That is, in the configuration shown in FIGS. 5 and 6, the optical member 5 is attached with an inclination by, for example, increasing the protrusion 29 and decreasing the height of the protrusions 30 and 31.

なお、本実施の形態では、突起29,30,31の断面形状は略方形状としたが、略円形状,略多角形状,略三角形状など仕様や工程などに応じて適度に形状を変更できる。   In the present embodiment, the cross-sectional shape of the protrusions 29, 30, and 31 is a substantially rectangular shape, but the shape can be appropriately changed according to specifications and processes such as a substantially circular shape, a substantially polygonal shape, and a substantially triangular shape. .

更に、本実施の形態では突起29,30,31を設けたが、例えば、光学部材4の厚みよりも所定以上大径部32の深さを深くすることで、光学部材を大径部32に収納した際に、開口部と光学部材4の間に隙間が生じるように構成すれば、特に突起29,30,31を設けなくても、光学部材5は載置部28に載置され、しかも光学部材4は大径部32の中に完全に収納されているので、容易に光学部材4,5間に隙間を形成されることができる。   Furthermore, although the projections 29, 30, and 31 are provided in the present embodiment, for example, by increasing the depth of the large diameter portion 32 by a predetermined amount or more than the thickness of the optical member 4, the optical member is changed to the large diameter portion 32. If it is configured so that a gap is created between the opening and the optical member 4 when stored, the optical member 5 is placed on the placement portion 28 without providing the projections 29, 30, 31. Since the optical member 4 is completely stored in the large-diameter portion 32, a gap can be easily formed between the optical members 4 and 5.

また、本実施の形態では、貫通孔3aを大径部32,小径部33で構成したが、中径部を大径部と小径部の間に設けて、段部が2つ設ける構成としても良い。さらに、本実施の形態では、大径部32と小径部32の間には段部を設けた構成としたが、載置部28から離れるに従って連続的に径が小さくなるように構成しても良い。すなわち、貫通孔3aにおいて載置部28側の開口の断面積は載置部28側と反対側の開口の断面積よりも広く構成する。   In the present embodiment, the through hole 3a is constituted by the large diameter portion 32 and the small diameter portion 33. However, the medium diameter portion may be provided between the large diameter portion and the small diameter portion, and two step portions may be provided. good. Furthermore, in the present embodiment, a step portion is provided between the large diameter portion 32 and the small diameter portion 32. However, the diameter may be continuously reduced as the distance from the placement portion 28 increases. good. That is, the cross-sectional area of the opening on the mounting portion 28 side in the through hole 3a is configured to be larger than the cross-sectional area of the opening on the opposite side to the mounting portion 28 side.

更に、載置部28側から大径部32,小径部33,大径部32の様に貫通孔3aの中途部分に径の小さな部分を有する構成でも良い。   Furthermore, the structure which has a small diameter part in the middle part of the through-hole 3a like the large diameter part 32, the small diameter part 33, and the large diameter part 32 from the mounting part 28 side may be sufficient.

なお、貫通孔3aが断面方形あるいは断面多角形状などの円形以外の場合には、大径部32と小径部33は、その断面積において、大径部32が広く、小径部33は断面積が小さいということを意味する。   When the through hole 3a is other than a circular shape such as a square cross section or a polygonal cross section, the large diameter portion 32 and the small diameter portion 33 have a large cross section in which the large diameter portion 32 is wide and the small diameter portion 33 has a cross sectional area. It means small.

本体部20は載置部28の底部側において、載置部28と固定部18,19を一体に接続する支持部34と、光源1を挿入する空間部分35が併設されている。また、載置部28からは空間部分35の方に突出した突出部36が設けられている。この突出部36と支持部34は空間を介して対峙している。固定部18,19の間に支持部34と空間部分35が設けられる。   On the bottom side of the mounting portion 28, the main body portion 20 is provided with a support portion 34 that integrally connects the mounting portion 28 and the fixing portions 18 and 19, and a space portion 35 into which the light source 1 is inserted. Further, a protruding portion 36 protruding from the placement portion 28 toward the space portion 35 is provided. The projecting portion 36 and the support portion 34 face each other through a space. A support portion 34 and a space portion 35 are provided between the fixing portions 18 and 19.

空間部分35は貫通孔3aと連通している。また、固定部18,19からは、突出部37,39が空間部分35に向かって突出しており、この突出部37,39と支持部34の間には、隙間38,40が設けられている。この隙間38,40には主に光源1の側方部6a,6bが挿入される。また、隙間38,40に面している支持部34には側方部6a,6bが接合される接合部41,42が設けられる。   The space portion 35 communicates with the through hole 3a. Further, projecting portions 37 and 39 project from the fixed portions 18 and 19 toward the space portion 35, and gaps 38 and 40 are provided between the projecting portions 37 and 39 and the support portion 34. . The side portions 6 a and 6 b of the light source 1 are mainly inserted into the gaps 38 and 40. The support portion 34 facing the gaps 38 and 40 is provided with joint portions 41 and 42 to which the side portions 6a and 6b are joined.

また、本体部20の隆起部25を設けた側には、空間部分35と連通した貫通孔100が設けられており、光源1の位置あわせを行うときに観測できるように設けられている。なお、多少工程は複雑にはあるが、この貫通孔100に透明なガラスや樹脂フィルムで覆ったり、あるいは透明樹脂やガラスなどを貫通孔100に埋設しても良い。   Further, a through hole 100 communicating with the space portion 35 is provided on the side of the main body 20 where the raised portion 25 is provided, so that observation can be performed when the light source 1 is aligned. Although the process is somewhat complicated, the through hole 100 may be covered with a transparent glass or resin film, or a transparent resin or glass may be embedded in the through hole 100.

次に受光素子2について図7,図8を用いて詳細に説明する。   Next, the light receiving element 2 will be described in detail with reference to FIGS.

受光素子2は、光ディスクからの反射光や、光源1から出射され光ディスクを経由せず入射される光が入射される受光素子体43と、受光素子体43を実装する基板44と、基板44に実装され、電源電圧を安定化させることができるコンデンサ45,46が設けられている。   The light receiving element 2 includes a light receiving element body 43 on which reflected light from the optical disk or light emitted from the light source 1 and incident without passing through the optical disk is incident, a substrate 44 on which the light receiving element body 43 is mounted, and a substrate 44 Capacitors 45 and 46 that are mounted and can stabilize the power supply voltage are provided.

受光素子体43は、モールド樹脂などで構成されたケース43a内にフォトディテクタなどを設けたフォトセンサ基板43cが内蔵されており、フォトセンサ基板43cには、フォトディテクタが仕様などに応じて所定のパターンで複数配置されている。ケース43aからは、複数のリード43aが外部に露出しており、このリード43bはフォトセンサ基板43cに電気的に接続されている。また、リード43bは受光素子体43aの駆動に必要な電力を内部のフォトセンサ基板43cに伝えたり、フォトセンサ基板43cで受光した光が電気信号に変換され、その電気信号を外部に導く働きを有する。ケース43aは少なくともフォトセンサ基板43cと対向する窓部分43dが透明〜半透明となる様に構成されている。更に好ましく、少なくともフォトセンサ基板43cのセンサが設けられている部分と窓部分43dが対向するように構成される。また、ケース43aは全体をクリア樹脂などの透明樹脂でモールドして構成することで、別途別部材などを設けずに透明な窓部分を設けることが可能となる。また、迷光などの不要な光が窓部分43d以外から進入するのを防止等の目的で、窓部分43以外の部分を不透明な樹脂やセラミックなどで構成し、窓部分43の部分に透明なガラス,透明な樹脂フィルム等を設ける構成としても良い。更に、本実施の形態では、ケース43aを透明なクリア樹脂とし、窓部分43を他の部分よりも段落ちさせて、薄くして透明にして、他の部分にエンボスを設けたり或いは表面粗さを粗くして非透明になるように構成した。また、塵対策などが他の手段で行われている場合には、窓部分43dには何も設けず、フォトセンサ基板43cのセンサ部分をむき出しにする構成でも良い。   The light receiving element body 43 includes a photo sensor substrate 43c provided with a photo detector in a case 43a made of mold resin or the like. The photo sensor substrate 43c has a photo detector in a predetermined pattern according to the specifications. Several are arranged. A plurality of leads 43a are exposed to the outside from the case 43a, and the leads 43b are electrically connected to the photosensor substrate 43c. The lead 43b has a function of transmitting electric power necessary for driving the light receiving element body 43a to the internal photosensor substrate 43c, or converting light received by the photosensor substrate 43c into an electrical signal, and guiding the electrical signal to the outside. Have. The case 43a is configured such that at least the window portion 43d facing the photosensor substrate 43c is transparent to translucent. More preferably, at least a portion of the photosensor substrate 43c where the sensor is provided and the window portion 43d are configured to face each other. Further, the case 43a is entirely formed by molding with a transparent resin such as a clear resin, so that a transparent window portion can be provided without providing a separate member. Further, in order to prevent unnecessary light such as stray light from entering from other than the window portion 43d, the portion other than the window portion 43 is made of an opaque resin or ceramic, and a transparent glass is formed on the window portion 43. , A transparent resin film or the like may be provided. Further, in the present embodiment, the case 43a is made of a transparent clear resin, the window portion 43 is stepped down from other portions, made thin and transparent, and other portions are provided with embossing or surface roughness. Was made rough and non-transparent. When dust countermeasures are taken by other means, the window portion 43d may be provided with nothing and the sensor portion of the photosensor substrate 43c may be exposed.

本実施の形態では、基板44はフレキシブルプリント基板の様な可撓性を有する基板や多層のフレキシブルプリント基板を用いた。なお、基板44の形状を特に可変にしなくても良い場合では、基板44はセラミック基板,セラミック多層基板,ガラスエポキシ基板,多層のガラスエポキシ基板等のある程度の弾性或いは剛性を有するものを用いることができる。   In this embodiment, the substrate 44 is a flexible substrate such as a flexible printed substrate or a multilayer flexible printed substrate. In the case where the shape of the substrate 44 does not need to be particularly variable, a substrate 44 having a certain degree of elasticity or rigidity such as a ceramic substrate, a ceramic multilayer substrate, a glass epoxy substrate, or a multilayer glass epoxy substrate is used. it can.

基板44は略L字或いは略T字型に形成されており、基板44は外部との接続を行う外部接続端子44bを有する接続部44aと、受光素子体43やコンデンサ45,46等の部材が実装される実装部44cとを有しており、実装部44cと接続部44aは、略垂直あるいは所定の傾斜を有して一体に成形されている。この様に実装部44cと接続部44aを一体で構成することで、所定形状の基板44を作製しさえすれば、良いので基板44の製造が容易になり、生産性が向上する。なお、本実施の形態では、基板44を略L字或いは略T字型としたが、当然、仕様などによって、様々な形状を採用することは可能である。   The substrate 44 is formed in a substantially L-shape or a substantially T-shape, and the substrate 44 includes a connection portion 44a having an external connection terminal 44b for connection to the outside, and members such as the light receiving element body 43 and the capacitors 45 and 46. The mounting part 44c to be mounted is provided, and the mounting part 44c and the connection part 44a are integrally formed with a substantially vertical or predetermined inclination. In this way, by configuring the mounting portion 44c and the connection portion 44a as one body, it is sufficient that the substrate 44 having a predetermined shape is manufactured, so that the substrate 44 can be easily manufactured and the productivity is improved. In the present embodiment, the substrate 44 is substantially L-shaped or substantially T-shaped, but naturally various shapes can be adopted depending on the specifications.

本実施の形態の形状であれば、例えば、実装部44cと接続部44aを一体構成としたが、例えば、実装部44cと接続部44aを別々に構成し、実装部44cに各部材を実装した後に、接続部44aを実装部に取り付ける構成としても良く、あるいは、基板44として、単に円盤,四角板,帯状などの形状のものを用い、それら基板44上に外部接続端子44b,受光素子体43を設けたりしてもよい。   In the case of the shape of the present embodiment, for example, the mounting portion 44c and the connecting portion 44a are integrally configured. For example, the mounting portion 44c and the connecting portion 44a are separately configured, and each member is mounted on the mounting portion 44c. The connection portion 44a may be attached to the mounting portion later, or a substrate 44 having a shape such as a disk, a square plate, or a belt is used, and the external connection terminals 44b and the light receiving element body 43 are formed on the substrate 44. May be provided.

本実施の形態では、外部接続端子44bが配置される領域、すなわち、接続部44aの先端部においては、他の部分よりも幅広にして他の回路などとの接続を行いやすくしている。   In the present embodiment, the region where the external connection terminal 44b is arranged, that is, the tip of the connection portion 44a is wider than other portions to facilitate connection to other circuits.

コンデンサ45,46はセラミックコンデンサなどが好適に用いられ、受光素子体43内に設けられたオペアンプなどによって生じる発振防止などの目的で用いられている。本実施の形態では、コンデンサ45,46をセラミックコンデンサで構成したが、積層セラミックコンデンサ,タンタルコンデンサ,電解コンデンサ等を仕様などによって用いても良い。   The capacitors 45 and 46 are preferably ceramic capacitors and are used for the purpose of preventing oscillation caused by an operational amplifier or the like provided in the light receiving element body 43. In the present embodiment, the capacitors 45 and 46 are formed of ceramic capacitors, but multilayer ceramic capacitors, tantalum capacitors, electrolytic capacitors, and the like may be used depending on the specifications.

次に光学部材4,5について図9〜図11を用いて詳細に説明する。   Next, the optical members 4 and 5 will be described in detail with reference to FIGS.

光学部材4は、略直方体状の透明な光学ガラスで構成された基体47、基体47の光源1と対向する面に設けられ、光源1から出射された光を3ビームに分離する回折格子48、基体47の光源1と対向する面と反対側の面(光学部材5と対向する面)には開口制限膜49が設けられている。   The optical member 4 is provided on a base 47 made of transparent optical glass having a substantially rectangular parallelepiped shape, a diffraction grating 48 provided on a surface of the base 47 facing the light source 1 and separating light emitted from the light source 1 into three beams. An opening limiting film 49 is provided on the surface of the substrate 47 opposite to the surface facing the light source 1 (the surface facing the optical member 5).

開口制限膜49は例えばSiO2膜とAl23膜を交互に複数回積層して光を吸収する構成とし、略環状に設けられている。すなわち、開口制限膜49で取り囲まれた領域を通過した光は所望の断面積を有する出射光が通過する。すなわちこの開口制限膜49の中央部の開口の大きさを調整することで、光源1から出射される光の断面積を調整可能とすることができる。また、本実施の形態では、開口制限を行うのに、開口制限膜49を設けたが、シート状の開口制限部材を貼り付けたり、他の不透明なブロックを貼り付けたりしてもよく、制限開口部を設ければよい。また、開口制限部としては貫通孔3aの断面の大きさを調整してもよい。すなわち、光学部材4の光源1側の貫通孔3aの開口の大きさを調整することで、貫通孔3a自体が開口制限部と機能し、別途光学部材4等に開口制限膜49等を設けなくても良い。 The opening limiting film 49 is configured to absorb light by laminating, for example, an SiO 2 film and an Al 2 O 3 film alternately a plurality of times, and is provided in a substantially annular shape. In other words, the light that has passed through the region surrounded by the aperture limiting film 49 passes through the emitted light having a desired cross-sectional area. That is, by adjusting the size of the opening at the center of the opening limiting film 49, the cross-sectional area of the light emitted from the light source 1 can be adjusted. In this embodiment, the opening restriction film 49 is provided to restrict the opening. However, a sheet-like opening restriction member or other opaque block may be attached. An opening may be provided. Moreover, you may adjust the magnitude | size of the cross section of the through-hole 3a as an opening restriction part. That is, by adjusting the size of the opening of the through hole 3a on the light source 1 side of the optical member 4, the through hole 3a itself functions as an opening restricting portion, and the optical member 4 or the like is not provided with the opening restricting film 49 or the like separately. May be.

なお、本実施の形態では、開口制限膜49で構成された開口形状は略方形状としたが、光ピックアップの光学設計の状況に応じて、円形や多角形あるいは楕円形状としても良い。また、基体47は略直方体としたけれども、立方体形状や半球形状としても良い。また、回折格子48は基体47の表面部に設けたが、回折格子48の保護の目的で、回折格子48を設けた面に基体47と同一の材料で構成した透明基板や、透明フィルムを設けたり、透明な保護膜を設けても良い。 In the present embodiment, the opening shape formed by the opening limiting film 49 is a substantially rectangular shape, but may be a circular shape, a polygonal shape, or an elliptical shape depending on the optical design of the optical pickup. Further, although the base body 47 has a substantially rectangular parallelepiped shape, it may have a cubic shape or a hemispherical shape. The diffraction grating 48 is provided on the surface of the base 47. For the purpose of protecting the diffraction grating 48, a transparent substrate or a transparent film made of the same material as the base 47 is provided on the surface where the diffraction grating 48 is provided. Alternatively, a transparent protective film may be provided.

光学部材5は、透明な光学ガラスや光学樹脂で構成されたブロック50,51,52,53を互いにガラスやUV硬化樹脂などで接合して構成され、全体として略直方体形状となっている。光学部材5は互いに略平行な傾斜面54,55,56が内蔵されている。傾斜面54はブロック50,51の間に形成されており、この傾斜面54はブロック50,51の接合面に相当する。この傾斜面54には波長選択膜が設けられており、この波長選択膜はブロック50,51の少なくとも一方の面に形成されている。傾斜面55はブロック51,52の間に形成されており、この傾斜面55はブロック51,52の接合面に相当する。この傾斜面55には偏光分離膜が設けられており、この偏光分離膜はブロック51,52の少なくとも一方の面に形成されている。傾斜面55はブロック52,53の間に形成されており、この傾斜面55はブロック52,53の接合面に相当する。この傾斜面55にはサーボなどに用いられるホログラムが設けられており、このホログラムはブロック52,53の少なくとも一方の面に形成されている。   The optical member 5 is formed by joining blocks 50, 51, 52, and 53 made of transparent optical glass or optical resin with glass or UV curable resin, and has a substantially rectangular parallelepiped shape as a whole. The optical member 5 includes inclined surfaces 54, 55, and 56 that are substantially parallel to each other. The inclined surface 54 is formed between the blocks 50 and 51, and the inclined surface 54 corresponds to the joint surface of the blocks 50 and 51. The inclined surface 54 is provided with a wavelength selection film, and this wavelength selection film is formed on at least one surface of the blocks 50 and 51. The inclined surface 55 is formed between the blocks 51 and 52, and the inclined surface 55 corresponds to the joint surface of the blocks 51 and 52. The inclined surface 55 is provided with a polarization separation film, and this polarization separation film is formed on at least one of the blocks 51 and 52. The inclined surface 55 is formed between the blocks 52 and 53, and the inclined surface 55 corresponds to the joint surface of the blocks 52 and 53. The inclined surface 55 is provided with a hologram used for servo and the like, and this hologram is formed on at least one surface of the blocks 52 and 53.

なお、本実施の形態では、光学部材5を4つのブロックで構成したが、光学設計の仕様などによって、5つ以上のブロックで構成しても良く、その結果傾斜面を4つ以上光学部材5の中に内蔵させても良い。   In the present embodiment, the optical member 5 is composed of four blocks. However, depending on optical design specifications, the optical member 5 may be composed of five or more blocks. As a result, the optical member 5 is composed of four or more inclined surfaces. It may be built in.

なお、本実施の形態では光学部材4を省略することもできる。すなわち、1ビームで記録/再生の少なくとも一方を行う場合には、回折格子48は不要であり、しかも特に開口制限を必要としない場合には、開口制限膜49は不要である。また、開口制限膜49のみが必要な場合には、光学部材5の光源1からの光入射面側に一体に設けることができる。   In the present embodiment, the optical member 4 can be omitted. That is, when performing at least one of recording / reproduction with one beam, the diffraction grating 48 is unnecessary, and when the aperture limitation is not particularly required, the aperture limiting film 49 is unnecessary. Further, when only the aperture limiting film 49 is necessary, it can be integrally provided on the light incident surface side of the optical member 5 from the light source 1.

以上の様に構成された光学部材4,5を用いた場合の光路について図11を用いて説明する。なお、図11は光学部材5を説明のために分離しているので、多少光路は、実際と
は異なっている。また、本実施の形態では、光源1からは、DVDに対して有効は波長の光と、CDに対して有効な波長を出射するのを前提としている。光源1からDVDに対して情報の記録/再生の少なくとも一方を実現できる波長の光を出射すると、光学部材4に設けられた回折格子48及び開口制限膜49を通過することで、3ビームに分離されるとともに、所定の開口を有する光束となる(A1)。光学部材4を通過した後、光学部材5に入射すると、波長選択膜を有した傾斜面54,傾斜面55に設けられた偏光分離膜を透過してブロック52の上面から光が出射される(A2,A3,A4の順で光は通過)。なお、実質的には光の光路A1〜A4はほぼ直線状である。光ディスクで反射してきた光は、光路A4,A3の順で直線的に傾斜面54に入射し、傾斜面54に設けられた波長選択膜で反射され、光路A5で傾斜面55を透過し、光路A6で受光素子2に入射される。
An optical path when the optical members 4 and 5 configured as described above are used will be described with reference to FIG. In FIG. 11, since the optical member 5 is separated for explanation, the optical path is somewhat different from the actual one. In the present embodiment, it is assumed that the light source 1 emits light having a wavelength effective for DVD and a wavelength effective for CD. When light having a wavelength capable of realizing at least one of information recording / reproduction is emitted from the light source 1 to the DVD, it passes through the diffraction grating 48 and the aperture limiting film 49 provided in the optical member 4 and is separated into three beams. At the same time, the light beam has a predetermined aperture (A1). After passing through the optical member 4 and entering the optical member 5, light is emitted from the upper surface of the block 52 through the inclined surface 54 having the wavelength selection film and the polarization separation film provided on the inclined surface 55 ( The light passes in the order of A2, A3 and A4). The light paths A1 to A4 of light are substantially linear. The light reflected by the optical disc is linearly incident on the inclined surface 54 in the order of the optical paths A4 and A3, reflected by the wavelength selection film provided on the inclined surface 54, transmitted through the inclined surface 55 by the optical path A5, and the optical path. The light enters the light receiving element 2 at A6.

光源1からCDに対して情報の記録/再生の少なくとも一方を実現できる波長の光を出射すると、光学部材4に設けられた回折格子48及び開口制限膜49を通過することで、3ビームに分離されるとともに、所定の開口を有する光束となる(B1)。光学部材4を通過した後、光学部材5に入射すると、波長選択膜を有した傾斜面54,傾斜面55に設けられた偏光分離膜を透過してブロック52の上面から光が出射される(B2,B3,B4の順で光は通過)。なお、実質的には光の光路B1〜B4はほぼ直線状である。光ディスクで反射してきた光は、光路B4で傾斜面55に入射すると偏光分離膜によって反射され、光路B5で傾斜面56に入射し、サーボ制御などに用いられるホログラムに入射して更に反射され、光路B6で光は進行し、傾斜面55で反射して光路B7で受光素子2に入射される。   When light having a wavelength capable of realizing at least one of information recording / reproduction is emitted from the light source 1 to the CD, the light passes through the diffraction grating 48 and the aperture limiting film 49 provided in the optical member 4 to be separated into three beams. At the same time, the light beam has a predetermined aperture (B1). After passing through the optical member 4 and entering the optical member 5, light is emitted from the upper surface of the block 52 through the inclined surface 54 having the wavelength selection film and the polarization separation film provided on the inclined surface 55 ( Light passes in the order of B2, B3, B4). The light paths B1 to B4 of light are substantially linear. The light reflected by the optical disk is reflected by the polarization separation film when entering the inclined surface 55 in the optical path B4, is incident on the inclined surface 56 by the optical path B5, is further reflected by being incident on the hologram used for servo control, etc. The light travels at B6, is reflected by the inclined surface 55, and enters the light receiving element 2 through the optical path B7.

以上の様に構成された光ピックアップにおいて、その組み立て方法について図を用いて説明する。   An assembly method of the optical pickup configured as described above will be described with reference to the drawings.

図12に示すように、貫通孔3a内の段差部もしくは、光学部材4の回折格子48を設けた面(開口制限膜49を設けた側と反対側)の少なくとも一方に、瞬間接着剤等の接着剤を塗布し。光学部材4を大径部32に挿入し、貫通孔3aを塞ぐように光学部材と結合ベース3を接合する。   As shown in FIG. 12, an instantaneous adhesive or the like is formed on at least one of the stepped portion in the through hole 3a or the surface of the optical member 4 on which the diffraction grating 48 is provided (the side opposite to the side on which the opening limiting film 49 is provided). Apply glue. The optical member 4 is inserted into the large diameter portion 32, and the optical member and the coupling base 3 are joined so as to close the through hole 3a.

次に図13に示すように、載置部28上に光学部材5を載置する。この時光学部材5は突起29,30,31上に載置されるとともに、側方を側壁21,22で挟み込まれるように配置される。また、光学部材5は図13で示すX−Y方向に移動させることで、所定に位置決めがなされ、図14に示すように、側壁21,22と光学部材5との間に接着剤60,61を供給し、位置決めされた光学部材5と結合ベース3を短時間で固定する。この時用いられる接着剤60,61は紫外線硬化樹脂を含むものや、吸水性を有し瞬間的に硬化するものなどが好適に用いられる。この時に、側壁21,22に高低差のある壁部21a,21b,22a,22bを設けることで、光学部材5のX−Y方向の位置調整を容易に実現でき、しかもテーパー部21d,22dを設けていることで接着剤60,61は他の場所に流れ出ることを防止でき、しかも接着剤60,61を光学部材65と側壁21,22の間に貯めることができるので、確実に各部を接合でき、しかも他の部分への流出することを抑えることができるので、他の部材への影響を小さくすることができる。   Next, as shown in FIG. 13, the optical member 5 is placed on the placement portion 28. At this time, the optical member 5 is placed on the protrusions 29, 30, and 31 and is disposed so that the side is sandwiched between the side walls 21 and 22. Further, the optical member 5 is moved in the XY direction shown in FIG. 13 to be positioned in a predetermined manner. As shown in FIG. 14, the adhesives 60 and 61 are disposed between the side walls 21 and 22 and the optical member 5. And the positioned optical member 5 and the coupling base 3 are fixed in a short time. As the adhesives 60 and 61 used at this time, an adhesive containing an ultraviolet curable resin, an adhesive having water absorption, or an instantaneous curing is preferably used. At this time, by providing the wall portions 21a, 21b, 22a, and 22b with height differences on the side walls 21 and 22, the position adjustment of the optical member 5 in the XY direction can be easily realized, and the tapered portions 21d and 22d can be formed. By providing, the adhesives 60 and 61 can be prevented from flowing out to other places, and the adhesives 60 and 61 can be stored between the optical member 65 and the side walls 21 and 22, so that the respective parts can be reliably joined. Moreover, since it can suppress flowing out to another part, the influence on another member can be made small.

また、突起29,30,31を設けていることで、光学部材4,5間に0.05mm〜0.17mmの隙間を設けることができ、しかも接着剤がその隙間に介在しないように構成できるので、光学部材4,5間に接着剤などが存在することによって生じる光の収差などの発生を防止でき、光学特性を向上させることができる。   Further, by providing the protrusions 29, 30, and 31, a gap of 0.05 mm to 0.17 mm can be provided between the optical members 4 and 5, and the adhesive can be configured not to intervene in the gap. Therefore, it is possible to prevent the occurrence of light aberration caused by the presence of an adhesive between the optical members 4 and 5, and to improve the optical characteristics.

次に、図15に示すように、光源1を結合ベース3の底部側から空間部分35に挿入するとともに、側方部6b,6aが隙間40,41に配置される。また、受光素子2も側壁
21,22の取付部23,24に当接させ、しかも受光素子2或いは取付部23,24の少なくとも一方の面に紫外線硬化接着剤を塗布しておく。そして、光源1を発光させてX軸方向に移動させてバランス調整を行い、しかも受光素子2も、Y軸やZ軸方向に移動させて、高さ調整やS字調整を行う。この様に、光源1と受光素子2を相対的に動かす構成とすることで、例え、光源1が2つの異なる波長の光を極めて小さな間隔で出射されたとしても、確実にしかも精度良く簡単に光源1と受光素子2の位置決めを行うことができる。これは、例えば、自動機械などで、これら位置調整を行わせることで、生産性を向上させることができる。
Next, as shown in FIG. 15, the light source 1 is inserted into the space portion 35 from the bottom side of the coupling base 3, and the side portions 6 b and 6 a are arranged in the gaps 40 and 41. The light receiving element 2 is also brought into contact with the attachment portions 23 and 24 of the side walls 21 and 22, and an ultraviolet curable adhesive is applied to at least one surface of the light receiving element 2 or the attachment portions 23 and 24. Then, the balance adjustment is performed by causing the light source 1 to emit light and moving in the X-axis direction, and the light receiving element 2 is also moved in the Y-axis and Z-axis directions to perform height adjustment and S-shaped adjustment. In this way, by adopting a configuration in which the light source 1 and the light receiving element 2 are moved relative to each other, even if the light source 1 emits light of two different wavelengths at an extremely small interval, it can be surely and accurately performed easily. The light source 1 and the light receiving element 2 can be positioned. For example, productivity can be improved by causing these positions to be adjusted by an automatic machine or the like.

各部材に対して、所定の位置に調整され、光源1と受光素子2の位置関係において、確実に光ディスクへ光源1からの光が導かれ、しかも光ディスクからの光が受光素子2に入射されることがほぼ確認されたら、今度は、光源1と結合ベース3の間に紫外線硬化接着剤もしくは、Agペーストを塗布しておき、図15に示すZ軸に沿って、光源1を移動させ、例えばDVDに用いられる光のデフォーカス調整を行う。デフォーカス調整が終了したら、紫外線を照射したり熱を直接或いは間接的に加えることで光源1と結合ベース3を仮固定させる。この時、紫外線硬化接着剤やAgペーストは、側方部6a,6bか接合部41,42の少なくとも一方に塗布しておく。また、光源1の位置調整の際には、貫通孔100から人の目視或いは自動機械による画像認識で、観測しながら行われる。光源1と結合ベース3を仮固定したら、図16に示すように、突出部36,37,39とプレート6の少なくとも3カ所に、Agペースト,クリーム半田或いは半田箔等の粘度が比較的高いか或いはバルク状(粉体や顆粒状体を含む)の接合材200をそれぞれ供給し、その接合材200に対して、ヒートガンやレーザー光線を照射することで溶融させ、光源1と結合ベース3との確実な接合を行うことができる。なお、この様に、比較的熱伝導の良い半田やAgペーストなどの金属製の接合材200は、熱伝導率が大きいので、光源1で発生した熱を効果的に結合ベース3に逃がすことができ、光源1の熱対策にも有効である。なお、光源1の熱対策が不要な場合には、仮固定用の紫外線硬化接着剤を本固定の接合材200としても良いし、仮固定を施した後に、本固定として用いられる接合材200をエポキシ樹脂系接着剤,瞬間接着剤,紫外線硬化接着剤などの有機接着剤等としても良い。 Each member is adjusted to a predetermined position, and in the positional relationship between the light source 1 and the light receiving element 2, the light from the light source 1 is reliably guided to the optical disk, and the light from the optical disk is incident on the light receiving element 2. If it is almost confirmed, this time, an ultraviolet curing adhesive or Ag paste is applied between the light source 1 and the coupling base 3, and the light source 1 is moved along the Z axis shown in FIG. The defocus adjustment of the light used for DVD is performed. When the defocus adjustment is completed, the light source 1 and the coupling base 3 are temporarily fixed by irradiating ultraviolet rays or directly or indirectly applying heat. At this time, the ultraviolet curing adhesive or Ag paste is applied to at least one of the side portions 6a and 6b or the joint portions 41 and 42. In addition, when the position of the light source 1 is adjusted, the light source 1 is observed while being observed through human eyes or image recognition by an automatic machine from the through hole 100. When the light source 1 and the coupling base 3 are temporarily fixed, as shown in FIG. 16, is the viscosity of Ag paste, cream solder, solder foil, etc. relatively high in at least three positions of the protrusions 36, 37, 39 and the plate 6? Alternatively, a bulk material (including powders and granules) is supplied, and the joining material 200 is melted by irradiating a heat gun or a laser beam, so that the light source 1 and the coupling base 3 can be reliably connected. Bonding can be performed. Note that, since the metal bonding material 200 such as solder or Ag paste having relatively good thermal conductivity has a high thermal conductivity, the heat generated by the light source 1 can be effectively released to the coupling base 3. This is effective for heat countermeasures of the light source 1. In addition, when the heat countermeasure of the light source 1 is unnecessary, the ultraviolet-curing adhesive for temporary fixing may be used as the main fixing bonding material 200 , or after the temporary fixing, the bonding material 200 used as the main fixing is used. It is good also as organic adhesives, such as an epoxy resin adhesive, an instant adhesive, and an ultraviolet curing adhesive.

次に、図15に示すように。X軸周りに受光素子2を回転させて、例えばCDに用いられる光のデフォーカス調整を行う。デフォーカス調整が完了したら、紫外線を照射して受光素子2と結合ベース3の間に設けられた紫外線硬化接着剤を硬化させ、受光素子2と結合ベース3を接合させる。   Next, as shown in FIG. The light receiving element 2 is rotated around the X axis to perform defocus adjustment of light used for, for example, a CD. When the defocus adjustment is completed, the ultraviolet curing adhesive provided between the light receiving element 2 and the coupling base 3 is cured by irradiating ultraviolet rays, and the light receiving element 2 and the coupling base 3 are joined.

また、図17に示すように、紫外線硬化接着剤を受光素子2と結合ベース3との間に設けた場合に、その接合材300が、光学部材4,5の間に流れ込む可能性があったり、あるいは、光学部材4,5(特に光学部材5)に接触した接合材300が硬化する際に、光学部材4,5(特に光学部材5)を移動させたりすることが発生する。この問題を解決するために、溝27や窪み部26を設けたことで、接合材300の光学部材4,5側への流れ混みを防止できる。   In addition, as shown in FIG. 17, when an ultraviolet curable adhesive is provided between the light receiving element 2 and the coupling base 3, the bonding material 300 may flow between the optical members 4 and 5. Alternatively, when the bonding material 300 in contact with the optical members 4 and 5 (particularly the optical member 5) is cured, the optical members 4 and 5 (particularly the optical member 5) may be moved. In order to solve this problem, by providing the groove 27 and the recessed portion 26, it is possible to prevent the flow of the bonding material 300 toward the optical members 4 and 5 side.

以上のように、本実施の形態では、例え複数の互いに異なる波長の光を出射する光源1を用いたとして、受光素子2との位置関係を結合ベース3を用いて、精度良くしかも作業性良く組み立てられるので、生産性が良く、歩留まりなどを向上させることができる。   As described above, in the present embodiment, assuming that the light source 1 that emits a plurality of light beams having different wavelengths is used, the positional relationship with the light receiving element 2 is used with high accuracy and good workability. As it is assembled, productivity is good and yield can be improved.

更に、光学部材4,5の間に及び光源1と光学部材4の間に接合材を非介在としたことで、光に収差が発生するのを抑制でき、光学特性なども改善される。   Furthermore, since no bonding material is interposed between the optical members 4 and 5 and between the light source 1 and the optical member 4, it is possible to suppress the occurrence of aberrations in the light, and the optical characteristics and the like are improved.

また、この様な光ピックを用いた光学系構成について図18を用いて説明する。   An optical system configuration using such an optical pick will be described with reference to FIG.

光源1から出射された光は光学部材4,5を通過してコリメートレンズ400に入射し、BSプレート401(ビームスプリッタプレート)で反射され、立ち上げプリズム403に導かれる。この時、BSプレート401では、出射された光の一部が透過し、光源1の光量をモニターする受光センサ402に導かれ、受光センサ402の出力によって光源1の発光パワーが調整される。BSプレートからの光は、立ち上げプリズム403の面403aで反射し、面403bで更に反射し、面403aを透過して液晶を挟み込んだホログラム404に入射し対物レンズ405に導かれ、光ディスク406に集光される。光ディスク406で反射した光は対物レンズ405,ホログラムを経由して立ち上げプリズム403に導かれ、面403aを通過し、面403bで反射し更にその後面403aで反射しBSプレート401に導かれ、BSプレート401で反射しコリメータレンズ400を通過し光学部材5に入射され、受光素子2に到達する。   The light emitted from the light source 1 passes through the optical members 4 and 5, enters the collimating lens 400, is reflected by the BS plate 401 (beam splitter plate), and is guided to the rising prism 403. At this time, a part of the emitted light is transmitted through the BS plate 401, guided to the light receiving sensor 402 that monitors the light amount of the light source 1, and the light emission power of the light source 1 is adjusted by the output of the light receiving sensor 402. The light from the BS plate is reflected by the surface 403 a of the rising prism 403, further reflected by the surface 403 b, is transmitted through the surface 403 a, is incident on the hologram 404 sandwiching the liquid crystal, is guided to the objective lens 405, and is applied to the optical disk 406. Focused. The light reflected by the optical disk 406 is guided to the rising prism 403 via the objective lens 405 and the hologram, passes through the surface 403a, is reflected by the surface 403b, is then reflected by the surface 403a, and is guided to the BS plate 401. The light is reflected by the plate 401, passes through the collimator lens 400, enters the optical member 5, and reaches the light receiving element 2.

図19は本発明の一実施の形態における光ピックアップを用いた光ディスク装置を示す図で、図19において、500は筐体で、筐体500は上部筐体部500aと下部筐体部500bを組み合わせて構成されている。なお、上部筐体部500aと下部筐体部500bとは螺旋などを用いて、互いに固着されている。501は筐体に出没自在に設けられたトレイ、502はトレイ501に設けられたスピンドルモータ、503は光ピックで、光ピック503には図1〜図18に示す光ピックアップが用いられ、光ディスクに情報を書き込むか或いは情報を読み出す動作の少なくとも一方を行う。また、光ピック503は、光ディスクの半径方向に移動可能に保持されたキャリッジ(図示せず)に搭載されている。504はトレイ501の前端面に設けられたベゼルで、ベゼル504はトレイ501が筐体500内に収納された時に、トレイ501の出没口505を塞ぐように構成されている。506,507はそれぞれトレイ501及び筐体500の双方に摺動自在に取り付けられたレールで、トレイ501の両側部にこのレール506,507は設けられており、このレール506,507にて図19で示す矢印P方向に筐体500からトレイ501が出没自在に取り付けられている。   FIG. 19 is a diagram showing an optical disc device using an optical pickup according to an embodiment of the present invention. In FIG. 19, reference numeral 500 denotes a casing, and casing 500 is a combination of upper casing portion 500a and lower casing portion 500b. Configured. The upper housing part 500a and the lower housing part 500b are fixed to each other using a spiral or the like. Reference numeral 501 denotes a tray that can be freely moved in and out of the housing, 502 is a spindle motor provided in the tray 501, 503 is an optical pick, and the optical pick 503 uses the optical pickup shown in FIGS. At least one of an operation of writing information or reading information is performed. The optical pick 503 is mounted on a carriage (not shown) held so as to be movable in the radial direction of the optical disc. Reference numeral 504 denotes a bezel provided on the front end surface of the tray 501, and the bezel 504 is configured to close the entrance / exit 505 of the tray 501 when the tray 501 is stored in the housing 500. Reference numerals 506 and 507 are rails slidably attached to both the tray 501 and the casing 500, respectively. The rails 506 and 507 are provided on both sides of the tray 501, and the rails 506 and 507 are shown in FIG. A tray 501 is attached from the housing 500 in the direction indicated by the arrow P.

トレイ501の前端面に設けられたベゼル504にはイジェクトボタン508が設けられており、このイジェクトスイッチ508を押すことで、筐体500に設けられた係合部(図示せず)とトレイ501に設けられた係合部(図示せず)との係合を解除する。   A bezel 504 provided on the front end surface of the tray 501 is provided with an eject button 508. By pressing the eject switch 508, an engagement portion (not shown) provided in the housing 500 and the tray 501 are provided. The engagement with the provided engaging portion (not shown) is released.

本発明の光ピックアップ及び光ディスク装置は、フレームレーザー光源を用い、しかも特に好ましくは2波長半導体レーザー光源を用いた場合においても、生産性や作業性を改善することができるか、或いは、光学特性を改善できることの少なくとも一方を実現でき、パーソナルコンピュータ,ノートブック型コンピュータ,モバイル端末機器などの電子機器に適応できる。   The optical pickup and the optical disk apparatus of the present invention can improve productivity and workability even when a frame laser light source is used, and particularly preferably a two-wavelength semiconductor laser light source is used. At least one of the improvements can be realized and can be applied to electronic devices such as personal computers, notebook computers, and mobile terminal devices.

本発明の一実施の形態における光ピックアップを示す斜視図The perspective view which shows the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップを示す分解斜視図1 is an exploded perspective view showing an optical pickup according to an embodiment of the present invention. 本発明の一実施の形態における光ピックアップの光源示す斜視図The perspective view which shows the light source of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの光源示す斜視図The perspective view which shows the light source of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの結合ベースを示す斜視図The perspective view which shows the coupling | bonding base of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの結合ベースを示す斜視図The perspective view which shows the coupling | bonding base of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの受光素子を示す斜視図The perspective view which shows the light receiving element of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの受光素子を示す斜視図The perspective view which shows the light receiving element of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの光学部材を示す斜視図The perspective view which shows the optical member of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの光学部材を示す斜視図The perspective view which shows the optical member of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの光学部材を示す図The figure which shows the optical member of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの組み立て方法を示す図The figure which shows the assembly method of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの組み立て方法を示す図The figure which shows the assembly method of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの組み立て方法を示す図The figure which shows the assembly method of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの組み立て方法を示す図The figure which shows the assembly method of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの組み立て方法を示す図The figure which shows the assembly method of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの組み立て方法を示す図The figure which shows the assembly method of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップの光学設計の例を示す図The figure which shows the example of the optical design of the optical pick-up in one embodiment of this invention 本発明の一実施の形態における光ピックアップを用いた光ディスク装置を示す図The figure which shows the optical disk apparatus using the optical pick-up in one embodiment of this invention

符号の説明Explanation of symbols

1 光源
2 受光素子
3 結合ベース
3a 貫通孔
4,5 光学部材
6 プレート
6a,6b 側方部
13,14,15 端子部
21,22 側壁
28 載置部
29,30,31 突起
32 大径部
33 小径部
48 回折格子
49 開口制限膜
503 光ピック
502 スピンドルモータ
DESCRIPTION OF SYMBOLS 1 Light source 2 Light receiving element 3 Coupling base 3a Through-hole 4,5 Optical member 6 Plate 6a, 6b Side part 13,14,15 Terminal part 21,22 Side wall 28 Mounting part 29,30,31 Projection 32 Large diameter part 33 Small diameter part 48 Diffraction grating 49 Aperture limiting film 503 Optical pick 502 Spindle motor

Claims (3)

プレートと複数の端子部をモールド部材で互いに固定し前記プレートに半導体レーザー素子を設けた光源と、受光素子と、前記光源と前記受光素子との間に設けた前記光源からの光を通過させる第1の光学部材と、前記第1の光学部材からの光を外部へ出射するとともに前記外部からの光をその内部で反射させて前記受光素子へ出射する第2の光学部材と、前記光源を配置する空間部分と前記第1及び前記第2の光学部材を載置する載置部と前記受光素子を取り付ける1対の取付部とを有する結合ベースと、を備え、前記空間部分には前記光源のプレートの両側方部が配置される1対の接合部が設けられ、前記載置部は、前記空間部分と連通して前記光源からの光を通過させる小径部と前記小径部を塞ぐように前記第1の光学部材を収納する大径部とを設けた貫通孔を有し、前記貫通孔の大径部の開口部分の周縁部に前記第2の光学部材を載置することで前記光源と前記第1の光学部材との間及び前記第1の光学部材と前記第2の光学部材との間に接合材が非介在となる所定の隙間を設けたことを特徴とする光ピックアップ。A light source in which a plate and a plurality of terminal portions are fixed to each other with a molding member and a semiconductor laser element is provided on the plate; a light receiving element; A first optical member, a second optical member that emits the light from the first optical member to the outside, reflects the light from the outside inside, and emits the light to the light receiving element, and the light source And a coupling base having a mounting portion for mounting the first and second optical members, and a pair of mounting portions for mounting the light receiving element. A pair of joint portions in which both side portions of the plate are disposed are provided, and the placement portion is connected to the space portion so as to block the small diameter portion and the small diameter portion that allow light from the light source to pass therethrough. Storing the first optical member A through hole provided with a diameter portion, and placing the second optical member on a peripheral portion of an opening portion of the large diameter portion of the through hole, thereby placing the second optical member between the light source and the first optical member. And a predetermined gap in which a bonding material is not interposed between the first optical member and the second optical member. 前記周縁部には複数の突起を設け、前記複数の突起の上に前記第2の光学部材を設けたことを特徴とする請求項1記載の光ピックアップ。 2. The optical pickup according to claim 1, wherein a plurality of protrusions are provided on the peripheral edge , and the second optical member is provided on the plurality of protrusions. 請求項1〜請求項2いずれか1記載の光ピックアップと、媒体を回転させる回転駆動手段と、前記回転駆動手段に対して前記光ピックアップを近づけたり離したりする移動手段とを備えたことを特徴とする光ディスク装置。 An optical pickup according to any one of claims 1 to 2, a rotation driving unit that rotates a medium, and a moving unit that moves the optical pickup closer to or away from the rotation driving unit. An optical disk device.
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