JP2007524518A5 - - Google Patents

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Publication number
JP2007524518A5
JP2007524518A5 JP2006533931A JP2006533931A JP2007524518A5 JP 2007524518 A5 JP2007524518 A5 JP 2007524518A5 JP 2006533931 A JP2006533931 A JP 2006533931A JP 2006533931 A JP2006533931 A JP 2006533931A JP 2007524518 A5 JP2007524518 A5 JP 2007524518A5
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JP
Japan
Prior art keywords
sensor signal
electric motor
cmp system
reference data
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006533931A
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English (en)
Japanese (ja)
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JP4815351B2 (ja
JP2007524518A (ja
Filing date
Publication date
Priority claimed from DE10345381A external-priority patent/DE10345381B4/de
Application filed filed Critical
Priority claimed from PCT/US2004/030410 external-priority patent/WO2005032763A1/en
Publication of JP2007524518A publication Critical patent/JP2007524518A/ja
Publication of JP2007524518A5 publication Critical patent/JP2007524518A5/ja
Application granted granted Critical
Publication of JP4815351B2 publication Critical patent/JP4815351B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2006533931A 2003-09-30 2004-09-17 パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム Expired - Lifetime JP4815351B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10345381A DE10345381B4 (de) 2003-09-30 2003-09-30 Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
DE10345381.4 2003-09-30
US10/859,336 2004-06-02
US10/859,336 US6957997B2 (en) 2003-09-30 2004-06-02 Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
PCT/US2004/030410 WO2005032763A1 (en) 2003-09-30 2004-09-17 A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner

Publications (3)

Publication Number Publication Date
JP2007524518A JP2007524518A (ja) 2007-08-30
JP2007524518A5 true JP2007524518A5 (cg-RX-API-DMAC7.html) 2007-11-08
JP4815351B2 JP4815351B2 (ja) 2011-11-16

Family

ID=34353214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006533931A Expired - Lifetime JP4815351B2 (ja) 2003-09-30 2004-09-17 パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム

Country Status (5)

Country Link
US (1) US6957997B2 (cg-RX-API-DMAC7.html)
JP (1) JP4815351B2 (cg-RX-API-DMAC7.html)
CN (1) CN100475445C (cg-RX-API-DMAC7.html)
DE (1) DE10345381B4 (cg-RX-API-DMAC7.html)
TW (1) TWI335853B (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8870625B2 (en) * 2007-11-28 2014-10-28 Ebara Corporation Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method
US8323078B2 (en) * 2008-05-05 2012-12-04 Qualcomm Incorporated Apparatus for polishing semi-conductor dice
TWI381904B (zh) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
WO2011139501A2 (en) * 2010-04-30 2011-11-10 Applied Materials, Inc. Pad conditioning sweep torque modeling to achieve constant removal rate
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
JP5750877B2 (ja) * 2010-12-09 2015-07-22 株式会社Sumco ウェーハの片面研磨方法、ウェーハの製造方法およびウェーハの片面研磨装置
US9862070B2 (en) * 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement
KR102388170B1 (ko) * 2014-09-02 2022-04-19 가부시키가이샤 에바라 세이사꾸쇼 종점 검출 방법, 연마 장치 및 연마 방법
KR102591906B1 (ko) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
CN111684571A (zh) * 2018-02-05 2020-09-18 应用材料公司 用于3d打印的cmp垫的压电终点指示
KR102706476B1 (ko) 2018-03-14 2024-09-13 어플라이드 머티어리얼스, 인코포레이티드 패드 컨디셔너 절삭률 모니터링
US11806833B2 (en) * 2018-08-31 2023-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization system and a method of using the same
CN111421462B (zh) * 2019-01-08 2022-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
JP7465498B2 (ja) * 2020-03-24 2024-04-11 株式会社荏原製作所 ワークピースの化学機械研磨システム、演算システム、および化学機械研磨のシミュレーションモデルを作成する方法
CN117620880A (zh) * 2023-11-27 2024-03-01 浙江大学 一种集成电路化学机械研磨机台的健康状况预测评估方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970751A (ja) * 1995-09-06 1997-03-18 Ebara Corp ポリッシング装置
EP0810064B1 (en) * 1996-05-30 2002-09-25 Ebara Corporation Polishing apparatus having interlock function
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP4030247B2 (ja) 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
JP3632500B2 (ja) * 1999-05-21 2005-03-23 株式会社日立製作所 回転加工装置
US6288648B1 (en) * 1999-08-27 2001-09-11 Lucent Technologies Inc. Apparatus and method for determining a need to change a polishing pad conditioning wheel
US6306008B1 (en) 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
JP2001260001A (ja) * 2000-03-13 2001-09-25 Hitachi Ltd 半導体装置の平坦化方法及びその装置
JP2002126998A (ja) 2000-10-26 2002-05-08 Hitachi Ltd 研磨方法および研磨装置
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
EP1247616B1 (en) * 2001-04-02 2006-07-05 Infineon Technologies AG Method for conditioning a polishing pad surface
JP2003117816A (ja) * 2001-10-03 2003-04-23 Hitachi Ltd 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法
JP2003200342A (ja) * 2001-12-28 2003-07-15 Tokyo Seimitsu Co Ltd ウェーハ加工装置用コンディショナー装置
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers
JP2005022028A (ja) * 2003-07-02 2005-01-27 Tokyo Seimitsu Co Ltd 研磨パッドのドレッシング装置及び該装置を有する加工装置

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