JP2007516111A - 熱放散性高温層組織及びその製造方法 - Google Patents
熱放散性高温層組織及びその製造方法 Download PDFInfo
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Abstract
Description
基板4及び層10を有する層組織に関する上述した構造は、基板4に中間層と層10を有する層組織にも同様に該当する。
こうして層毎にを多孔性構造10の雌型の原型全体を合成物質のCADの原型により積み上げる。合成物質以外の他の材料も同様に考えられる。
図18に基づく処理段階で被覆されていない部位23は、この段階で閉ざされており、従って基板4に境を接する第1の細孔25が形成されている。この層範囲10´は、もう1つの層範囲10´´のために補充されている。
環状燃焼室106は、例えば環状の熱ガス溝111と連続している。そこに例えば順次連結された4つのタービン段112がタービン108を構成している。各タービン段112は、例えば2個の環状羽根から構成されている。作動ガス113の流動方向に、案内翼115の熱ガス溝111内に回転翼120により構成される列125が続いている。
1 層組織 4 基板 7 中間層 8 中間層の表面 9 基板の表面
14 基板のもう1方の表面 10 多孔性層、外側多孔性層 15 セグメント
13 冷却溝 16 多孔性層の外側表面
KM 冷媒 161 一方の軸端 164 もう1方の軸端
110 燃焼室 111 熱ガス溝 1 層組織 16 外側表面
12 保護層、外側の保護層 17 軸方向 11 ラジアル方向 10 多 孔性の層
25 細孔 26 冷却溝 4 基板 9 基板の表面 14 基板のもう1方の表面
22 孔壁 19 孔壁切断面 28 細孔の幅
α、α1、α2 基板表面又は中間層表面と多孔性層の孔壁がなす角度
20 基板と多孔性層又は中間層の移行部 KM 冷媒 d=壁の厚さ、孔径
8 中間層の表面、9 基板の表面 37 基板表面と多孔性層の孔壁の接触面
1 層組織 4 基板 10′ 第1の層 10′′ 11 ラジアル方向
17 軸方向 19 孔壁の切口(切断面) 23 部位
25 細孔 37 接触面
46 鋳型 43 容積体 40 細道
10 多孔性層 ラジアル方向 49 連続層 52 ペースト
100 ガスタービン(設備) 102 回転軸 104 吸気ケーシング
135 空気 105 圧縮機 106 環状燃焼室 110 燃焼室
107 バーナ 108 タービン 109 排ガスケーシング
111 環状の熱ガス溝 112 タービン段 113 作動ガス
115 案内翼列 133 タービンディスク
138 タービン(108)の内側ケーシング 143 固定子(静翼)
140 固定リング 143 固定子 130 案内翼 120 回転翼
110、106 燃焼室 107 バーナ 153 燃焼室壁
155 熱防御要素としての内張り 158 温度センサ
161 一方の軸端 164 もう一方の軸端
Claims (34)
- 少なくとも基板(4)と、この基板(4)上に載っている少なくとも部分的に多孔性の層(10)とから成り、この多孔性の層(10)の細孔(25)が、それぞれ孔壁(22)により境界付けられており、基板(4)の表面(9、14)に孔壁の一部が接している層組織(1)において、その表面(9、14)に接している孔壁(22)は、基板(4)の表面(9、14)の範囲において、この範囲に接していない孔壁(22)に比べて、拡大された切断面を有し、それにより基板(4)に対し改善された機械的接合が生じることを特徴とする層組織。
- 基板(4)を持つ層組織(1)が、その表面(9)により熱媒体を有する領域(110、111)に接しており、多孔性の層(10)が、基板(4)の表面(9)に対向している表面(14)上に形成されていることを特徴とする請求項1記載の層組織。
- 層組織(1)は、その基板(4)の表面(9)により領域(110、111)内に存在する熱媒体に曝されることができ、多孔性の層(10)は基板(4)の表面(9)上に形成されていることを特徴とする請求項1又は2記載の層組織。
- 多孔性層(10)と基板(4)との接触帯域が、基板表面(9、14)において、それぞれ孔壁切断面(19)により形成されており、この孔壁切断面(19)の大きさが、この孔壁切断面(19)と基板(4)と間に改善された機械的接合が生じるように、表面(9、14)の範囲に接していない孔壁切断面(19)よりも大きいことを特徴とする請求項1乃至3の1つに記載の層組織。
- 孔壁(22)及び/又はこの孔壁切断面(19)の基板(4)との接触面が、多孔性層(10)により覆われている基板(4)の表面(9、14)の少なくとも10%を占めていることを特徴とする請求項1又は4のいずれかに記載の層組織。
- 孔壁(22)の厚さは、特に基板(4)の表面に垂直に延びるラジアル方向(11)において、異なっていることを特徴とする請求項1又は5に記載の層組織。
- 孔壁(22)の厚さがラジアル方向(11)に沿って勾配を有することを特徴とする請求項6記載の層組織。
- 孔壁(22)の厚さが基板(4)の近くで厚くなっていることを特徴とする請求項6又は7記載の層組織。
- 孔壁(22)の厚さが基板(4)を出発点として多孔性層(10)の外表面(16)へと厚くなるように形成されていることを特徴とする請求項6又は7記載の層組織。
- ラジアル方向(11)が基板(4)から出発して層組織(1)の外表面(16)へと延びており、細孔(25)の大きさ(28)は、ラジアル方向(11)に沿って勾配を有することを特徴とする請求項1、6、7、8又は9の1つに記載の層組織。
- 基板(4)に近い細孔の大きさ(28)は、多孔性層(10)の外表面(16)の近くの細孔の大きさよりも小さいことを特徴とする請求項10記載の層組織。
- 孔壁(22)又は孔壁(22)内の溝(26)のエッジが少なくとも部分的に丸味をつけてあることを特徴とする請求項1記載の層組織。
- 多孔性層(10)がハニカム構造を有していることを特徴とする請求項1記載の層組織。
- 多孔性層(10)は、少なくとも部分的に冷媒が貫流可能な構造を有していることを特徴とする請求項1記載の層組織。
- 多孔性層(10)は、少なくともこの層(10)の外表面の範囲内に少なくとも1つの保護層(12)を有することを特徴とする請求項1記載の層組織。
- この多孔性層(10)内の少なくとも外表面(16)の範囲内に、少なくとも1つの保護層(12)が施されていることを特徴とする請求項1又は15に記載の層組織。
- 少なくとも1つの保護層(12)が多孔性層(10)の表面(16)上に施されていることを特徴とする請求項1又は15に記載の層組織。
- 少なくとも1つの保護層(12)が金属又はセラミックでできていることを特徴とする請求項15、16又は17に記載の層組織。
- 多孔性層(10)は、金属製であり、また保護層(12)がセラミックであることを特徴とする請求項15〜18の1つに記載の層組織。
- 層組織(1)は、ガス又は蒸気タービンの構造部材、特にタービン翼(120、130)又は燃焼室の内張り(155)であることを特徴とする請求項1記載の層組織。
- 基板(4)が金属、特に鉄、ニッケル又はコバルトベースの超合金でできていることを特徴とする請求項1又は20に記載の層組織。
- 多孔性層(10)がセラミックで形成されていることを特徴とする請求項1又は18に記載の層組織。
- 多孔性層(10)が金属、特にMCrAlX組成を有し、その際Mは鉄、コバルト又はニッケルの群の少なくとも1つの元素を表し、Xはイットリウム及び/又は少なくとも1つの希土類の元素を表すことを特徴とする請求項1に記載の層組織。
- 多孔性層(10)が基板(4)と一体に形成されていることを特徴とする請求項1、22又は23に記載の層組織。
- 層組織(1)が基板(4)及び/又は孔壁(22)内に冷却溝(13、26)を有することを特徴とする請求項1記載の層組織。
- 多孔性層(10)の細孔(25)が媒体中の異質粒子の大きさよりも大きい大きさ(28)を有することを特徴とする請求項1記載の層組織。
- 多孔性層(10)を複数の工程段階で層毎に形成することを特徴とする、特に請求項1に記載の多孔性の層(10)を有する層組織(1)の製造方法。
- 多孔性層(10)の外表面を基板(4)と、特にろう接により結合することを特徴とする請求項28に記載の方法。
- 多孔性の層(10)の製造に、ステレオリソグラフィ、特にレーザによるステレオリソグラフィを使用することを特徴とする請求項27に記載の方法。
- 層(10´、10´´、10´´´)毎に合成物質等が、雌型として基板(4)上に施され、レーザ(20)により硬化され、層(10)の材料を充填され、特に鋳造され、それにより多孔性層(10)の細孔(25)が生じることを特徴とする請求項27又は29に記載の方法。
- 多孔性層(10)、特に合成物質から成る多孔性層(10)を、多孔性層(10)用鋳型を合成物質により原型を作成して製造することを特徴とする請求項27又は29に記載の方法。
- 多孔性層(10)の材料を含むプリントペーストを、多孔性層(10)と細孔(25)が生じるように、基板(4)上に層毎に施すことを特徴とする請求項27に記載の方法。
- この多孔性層(10)を基板(4)と一緒に製造することを特徴とする請求項1記載の方法。
- 上記基板(4)を多孔性層(10)と一緒に溶融冶金法により、特に鋳造して製造することを特徴とする請求項33に記載の方法。
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EP03026281.0 | 2003-11-14 | ||
EP20030026281 EP1533113A1 (de) | 2003-11-14 | 2003-11-14 | Hochtemperatur-Schichtsystem zur Wärmeableitung und Verfahren zu dessen Herstellung |
PCT/EP2004/011429 WO2005049312A1 (de) | 2003-11-14 | 2004-10-12 | Hochtemperatur-schichtsystem zur wärmeableitung und verfahren zu dessen herstellung |
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EP (2) | EP1533113A1 (ja) |
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- 2004-10-12 CA CA 2545954 patent/CA2545954C/en not_active Expired - Fee Related
- 2004-10-12 ES ES04790316T patent/ES2281020T3/es active Active
- 2004-10-12 WO PCT/EP2004/011429 patent/WO2005049312A1/de active Application Filing
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- 2004-10-12 DE DE200450003085 patent/DE502004003085D1/de active Active
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Also Published As
Publication number | Publication date |
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EP1682342B1 (de) | 2007-02-28 |
CN1878664A (zh) | 2006-12-13 |
BRPI0416514B1 (pt) | 2015-05-19 |
EP1533113A1 (de) | 2005-05-25 |
CA2545954C (en) | 2009-12-15 |
CN100534778C (zh) | 2009-09-02 |
US7670675B2 (en) | 2010-03-02 |
RU2330162C2 (ru) | 2008-07-27 |
JP4818118B2 (ja) | 2011-11-16 |
ES2281020T3 (es) | 2007-09-16 |
KR101282842B1 (ko) | 2013-07-05 |
ATE355167T1 (de) | 2006-03-15 |
CA2545954A1 (en) | 2005-06-02 |
US20070275210A1 (en) | 2007-11-29 |
WO2005049312A1 (de) | 2005-06-02 |
KR20060129216A (ko) | 2006-12-15 |
DE502004003085D1 (de) | 2007-04-12 |
EP1682342A1 (de) | 2006-07-26 |
RU2006120543A (ru) | 2007-12-27 |
BRPI0416514A (pt) | 2007-01-09 |
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