CN104718175A - 由陶瓷材料构成的包括基底和壁的部件 - Google Patents

由陶瓷材料构成的包括基底和壁的部件 Download PDF

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CN104718175A
CN104718175A CN201380054237.1A CN201380054237A CN104718175A CN 104718175 A CN104718175 A CN 104718175A CN 201380054237 A CN201380054237 A CN 201380054237A CN 104718175 A CN104718175 A CN 104718175A
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parts
porosity
substrate
wall
core
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CN104718175B (zh
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迈克尔·波德戈斯基
鲁多维奇·埃德蒙·卡米尔·莫利耶
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Safran Aircraft Engines SAS
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Abstract

本发明涉及一种由陶瓷材料构成的部件(10)，所述部件(10)包括形成基底(11)的部分和形成壁(13)的部分，其特征在于，所述基底(11)由具有低的孔隙度的陶瓷材料制成并且所述壁(13)通过陶瓷粉末烧结来获得，并且，所述壁包括外壳(13E)和芯部(13N)，所述芯部位于所述外壳内，所述芯部的孔隙度大于所述基底的孔隙度并且随着离开所述基底渐远而增大。

Description

由陶瓷材料构成的包括基底和壁的部件
技术领域
本发明的领域为制造至少部分地由陶瓷材料制成的部件的领域，并且更特别地为制造用于涡轮发动机(特别是燃气涡轮发动机)的部件的领域，所述部件例如为涡轮转子叶片或固定的喷嘴轮叶。
背景技术
在涡轮发动机的高温气体流经的热部件中，使用了能够经受所述温度水平的金属合金，并且如果必要的话，通过流体适当的冷却使得所述部件能够在超过材料的稳定性的温度下工作。
在航空领域中开发新型燃气涡轮发动机的背景下，正在寻找在高温下具有良好的结构特性的更轻质的材料。陶瓷为能够满足这些要求的材料。陶瓷被用于位于从涡轮到发动机的后段、在燃烧室的下游的部件。
已知粉末烧结的制造技术，所述制造技术为一种用于由或多或少较细的粉末直接生产机械部件或其它物品的方法。根据一种制造方法，使用多个过程来使粉末结块以形成未完成状态的部件，所述部件然后被加热到足以使晶粒通过沿其接触区域扩散而熔化或粘合到一起的温度。因此，使部件获得了一定水平的凝聚。根据特定技术，部件由连续层构造而成。在所述方法中，材料呈粉末的形式，粉末在沿与部件的一部分的表面相应的路径引导的激光束或电子束的作用下被加热。重复应用粉末和使用激光束或电子束使粉末烧结的过程使得可逐步地将部件变厚并且获得所需的形状。由激光束或电子束应用的热量取决于材料的性质。如果必要的话，对热敏感的(为预制陶瓷或不为预制陶瓷的)聚合物能够被使用以确保部件的形成期间的粘合，在非预制陶瓷的聚合物的情况下，聚合物然后能够通过热处理被消除。图2绘出了通过激光加热来生产部件的工具，并且下文详细描述了所述技术的实施。
对于燃气涡轮发动机的热部件，鉴于陶瓷的极限温度大于现有技术中使用的合金的极限温度，本申请人已经设定了根据使用激光束或电子束来粘合粉末的技术由陶瓷材料生产部件(例如，涡轮转子叶片)的目标。
本发明的另一目标在于使旋转部件(例如，涡轮转子叶片)的根部区域中的机械应力减小到这样的程度以致根部区域的机械应力保持为最大的手段。
因为缺陷引发由整块陶瓷材料制成的部件上的张力，本发明的另一目标在于减小面临临界尺寸缺陷的概率的手段。
因为可能要面临的温度会超出用于陶瓷的使用的极限温度，本发明的另一目标在于设计冷却的部件。
因为冷却由流体在部件中的流通来确保，为此，意在所述部件内产生通道，本发明的另一目标在于用于使陶瓷成形为使得能够在制造所述部件期间产生这种类型的通道的方法。
更特别地，所述方法不需要使用大量的加工技术。
发明内容
根据本发明，这些目标通过由陶瓷材料制成的部件来实现，所述部件包括形成基底的部分和形成壁的部分，所述部件的特征在于，所述基底由具有低的孔隙度的陶瓷材料制成并且所述壁通过陶瓷粉末烧结来获得，并且，所述基底具有外壳或外轮廓和芯部，所述芯部位于所述外壳内，并且所述芯部的孔隙度大于所述基底的孔隙度并且随着所述基底变得渐远而增大。
由于其孔隙度或密度梯度，根据本发明的部件的结构使得可具有相当轻的部分，从而在移动部件的情况下确保降低了基底上的应力水平。此外，所述部件具有以下优点：由于部件内的陶瓷的体积的减小从而减小了面临临界尺寸的缺陷的可能性，所述缺陷可能弱化所述结构。
此外，多孔性质或腔的存在(与现有技术相反，不需要加工)使得可提供冷却流体的流通。
优选地，基底通过陶瓷粉末烧结来生产。
根据其它的特征，一方面，形成基底的材料的孔隙度小于3％，并且另一方面，芯部的孔隙度大于5％、优选地介于10到50％之间。
术语“孔隙度”涉及部件中的空白空间占所考虑的部分的比例。所述空白空间与材料的结构有关，并且所述空白空间涉及结构中粘合的陶瓷材料的晶粒之间形成的空间。材料的密度与其孔隙度成反比关系。
在本申请中，针对形成壁的部分，在另一实施例中，通过由粘合陶瓷晶粒形成的狭窄分割部形成的腔的体积和分隔部的体积之间的关系也用孔隙度来表示。
此外，如果提供了冷却，基底还包括用于将冷却空气输送至壁的通道。在这种情况下，通道不由基底的孔隙度的定义覆盖。
在本申请中，本发明具有两个方面：
-控制陶瓷的孔隙度并且因此控制密度；
-在部件的壁内产生腔，从而导致材料的体积减小。
因此，根据第一实施例，芯部包括由陶瓷晶粒制成的多孔材料，陶瓷晶粒通过局部烧结来粘合并且在其间形成空间。
“局部烧结”应被理解为意味着在比导致最大密度的温度低的温度下烧结的技术。
根据另一实施例，芯部包括通过分割部分离的腔，所述分割部利用激光束或电子束烧结而产生。分割部为密集的；分割部的孔隙度小于3％。
有利地，芯部具有拥有不同腔的部分，特别是其中腔的尺寸随着基底变得渐远而增大的部分。
根据特定实施例，部件包括壁的延伸部中的踵状部(heel)，踵状部的孔隙度小于形成芯部的材料的孔隙度。
本发明特别涉及一种涡轮发动机叶片，所述涡轮发动机叶片的基底形成叶片的根部、壁形成叶片翼面(或叶片翼型)，所述涡轮发动机叶片可选地具有孔隙度小于芯部的孔隙度的踵状部。
本发明还涉及一种用于制造这种部件的方法，所述方法具有以下步骤：通过使用包含粉末的烧结托盘来形成壁，基底在步骤开始时与所述烧结托盘齐平，所述方法包括：利用激光束或电子束对连续层中的粉末选择性烧结，所述连续层通过使所述部件在烧结托盘中逐步向下移动来获得。
所述方法特别包括：通过粉末烧结单独地生产基底并且然后通过沉积连续的陶瓷粉末层形成壁，并且通过烧结所述层而将所述层粘合。
附图说明
通过下述所给出的仅为示例性并非限制性的实施例的详细说明性描述，并且参考附图，本发明将更好地被理解并且本发明的其它目标、细节、特征和优点将更清楚地显现。
在附图中：
图1示出了由陶瓷材料制成的具有根据本发明的结构的涡轮转子叶片；
图2示出了激光熔合烧结机器；
图3示出了根据本发明的部件的单个基底的示例；
图4示出了通过激光烧结在图3的基底上形成的第一层；
图5示出了相同基底上的双涡轮叶片的一个变化形式。
具体实施方式
参考图1，能够看到涡轮叶片10，涡轮叶片10形成了能够根据本发明来生产的部件。叶片包括根部，即基底11，通过基底11，叶片被安装在涡轮盘的轮缘上。根部具有安装在其上的平台12并且沿其轴线XX于发动机的操作期间在所受到的离心力的方向上通过壁13延伸，壁13形成了被热发动机气体拂掠的叶片翼面。在这种情况下，叶片具有安装在其上的踵状部15，踵状部15设置有密封条16。踵状部15和平台分别为燃气发动机的导管的外表面元件和内表面元件，叶片翼面在外表面元件和内表面元件之间径向延伸。密封条与设置在涡轮级的定子上的环形成了密封。
根据本发明，由陶瓷材料制成的所述部件具有沿其轴线XX变化的密度。密度的变化通过沿相对于轴线XX横向的平面的截面被示意性地示出，所述平面为：部件沿轴线XX的A、B、C和D。
基底11具有最大密度。例如，基底为通过使陶瓷粉末在模具中成形而获得的元件，所述粉末可选地与粘合剂结合。所述步骤紧接着是对由模具生产的未完成的毛坯进行烧结热处理。根据所使用的材料的组成，处理可包括中间的脱粘步骤。所述元件的孔隙度优选地小于3％。
壁13具有外壳13E和芯部13N。外壳形成了壁的外表面。外壳是薄的(例如小于1mm，优选地大约为0.5mm)，并且具有与基底类似的低的孔隙度。外壳界定了芯部13N，芯部13N的孔隙度较大。所述孔隙度大于5％、优选地介于10到50％之间。因此，其密度较低，从而在部件被安装在转子上时(如在所述示例中)提供了减小基底上的离心机械应力的上述优点。有利地，密度沿整个轴线不相同。如截面B和C中所能够看到的，所述密度通过具有较小或较大的筛孔尺寸的不同的网格图形来示意性地示出。由截面D所示出的踵状部可具有比基底的密度低且比壁的密度高的密度。踵状部通过陶瓷粉末烧结的晶粒来生产。
这种部件部分地通过粉末烧结来生产，下文陈述了其生产方法是由与图2所示的相关的装置想到的方法，图2示出了用于通过激光束或电子束的粉末烧结来生产部件的机器。
激光束或电子束发生器1发射适当的粉末束2，粉末束2指向反射镜3的布置，反射镜3的最后一个镜4能够枢转以便确保待生产的部件(例如，上述的叶片10)的表面被拂掠。
已经形成的部件P的部分浸入托盘6中，使得所述部分能够覆盖有粉末层7，粉末层7适合于以规律间隔烧结。用于供应粉末的第二托盘8被定位在烧结托盘6的侧部并且被所述烧结粉末7充满。形成活塞9的装置使得看将给定量的粉末7从供应托盘8移动到烧结托盘6，以便使部件P的部分覆盖有给定厚度的粉末层。所述层的厚度与部件的部分在束2于晶粒之间烧结传递期间所增加的厚度相应。用于降低烧结托盘6和升高供应托盘8的装置一方面使得能将待烧结的部件的部分P保持与托盘6的侧部齐平并且另一方面使具有正确厚度的粉末层7与供应托盘8的活塞9相对。
在连续的基本操作中执行晶粒的烧结和粘合以形成部件10，所述基本操作按照以下方式发生：因为部件P的部分与烧结托盘6的侧部齐平，活塞9朝所述托盘6移动，使得活塞9在部件P的部分上沉积所需厚度的粉末7并且然后回复到供应托盘8的端部处的待命位置。激光束或电子束2使用摆镜4来拂掠部件P的部分的表面，从而导致局部熔化或温度的增加，使得晶粒之间的扩散被激活(层的表面层的晶粒间的扩散被激活并且导致所述层聚集到部件P)并且增加了厚度。形成的部件P的部分然后向下移动以补偿其厚度的增加并且使得其表面再次与烧结托盘6齐平，然而供应托盘8被升高以提供与活塞9相对的适当量的粉末7。所述过程被重复数次，使得达到用于完成部件10的所需的几何构造和尺寸。
根据本发明，待生产的部件的基底11首先被布置在烧结托盘6中。图3中所示出的所述基底11优选地使用常规的陶瓷粉末烧结方法来单独地获得，也就是说，通过在模具中形成未完成的部件，然后是与中间的粘合步骤一起的烧结热处理，所述部件通过陶瓷粉末和粘合剂形成。在涡轮转子叶片的情况下，基底11优选地包括叶片的根部并且可选地包括平台。常规方法使得能够通过烧结来生产部件，所述部件非常密集并且具有小于3％的孔隙度。根据本发明的方法的特征，基底11在其上表面上包括平坦表面部分，如果设置有平台的话，所述平坦表面部分可选地在平台的区域中。
基底与陶瓷粉末一起被布置在烧结托盘中，使得平坦表面部分与粉末的表面齐平。所述方法然后包括利用与上面陈述的步骤一致的激光束或电子束在所述基底11上生产壁13的步骤(图4)。光束的路径由控制构件控制，所述控制构件保持了在其存储器中壁的几何特征。为了生产层，光束不仅根据位置而且还根据能量输入来控制。
外壳13E的表面因此针对以与基底的孔隙度相似的给定的孔隙度(特别为小于3％的孔隙度)构造的层而产生。在所述表面的下方，芯部13N被构造成使得其孔隙度大于所述表面的孔隙度。较低的孔隙度通过将光束的能量保持在低水平以便获得局部烧结来获得。孔隙度大于基底的孔隙度。所述孔隙度至少为5％、优选地介于10到50％之间。此外，通过所述层构造部件层使得生产具有孔隙度沿轴线XX变化的芯部的层。所述孔隙度有利地在基底和踵状部之间增大。
根据壁的芯部的一个变化形式，控制激光束的运动以便产生分割部，所述分割部在所述分割部之间以蜂窝状结构的方式形成腔。所述分割部由与形成外壳的表面类似的密致材料制成。腔的尺寸有利地可在基底和叶片的踵状部之间变化(优选是增大)。
所使用的陶瓷材料可以为任意的种类。优选地，选择能够在大于1000℃的温度下使用的陶瓷材料；所述陶瓷例如为诸如碳化硅(SiC)之类的碳化物、诸如氧化铝(Al2O3)之类的氧化物或诸如氮化硅(Si3N4)之类的氮化物。共晶陶瓷也是适合的。
选择粉末的粒度标准以便粉末能通过激光束或电子束完成烧结。可以看出，粉末的尺寸越小，越容易在低温下产生局部烧结。
激光束或电子束适合于处理的材料。例如，在氧化铝Al2O3的情况下，在9400cm-1下发射、具有介于10到30W的粉末并且在96mm/s的速度下具有最佳运动的钇铝石榴石(YAG)激光器适合于所述应用。
陶瓷可为具有热熔前体的混合物的部分，热熔前体形成了粘合剂并且热熔前体可选地随后通过适当的热处理来消除。
可选地，如果有必要减小粗糙度，则提供最终加工。
用于制造所述部件的方法导致显著的残余应力，残余应力由层的连续熔化产生的热梯度而引起。所述梯度可根据待生产的部件的截面的几何构造、厚度和变化增大。取决于材料，由所述梯度引起残余应力可导致部件在构造期间变形并且在使用期间开裂或破裂。因此，重要的是，在烧结过程期间控制温度并且保持粉末中的温度均匀以便使凝固期间的残余应力最小。为此，使用了适当的加热设备，例如，电阻加热设备。
根据本发明的一个变化形式，部件为如附图5中示出的一对涡轮叶片。本发明提供的解决方案因此使得能通过直接制造在相同的基底上生产两个壁。基底111包括平台112和用于安装在涡轮盘上的根部。与涡轮转子中的两个相邻壁相应的两个壁113、113'支撑在所述平台上。所述两个壁以上述的相同的方式被构造。

Claims (11)

1.由陶瓷材料制成的部件(10)，所述部件(10)包括形成基底(11)的部分和形成壁(13)的部分，其特征在于，所述基底(11)由具有低的孔隙度的陶瓷材料制成并且所述壁(13)通过陶瓷粉末烧结来获得，并且，所述壁具有外壳(13E)和芯部(13N)，所述芯部位于所述外壳内，并且所述芯部的孔隙度大于所述基底的孔隙度并且随着所述基底变得渐远而增大。
2.根据前项权利要求所述的部件，其中，所述基底(11)通过陶瓷粉末烧结来生产。
3.根据权利要求1或权利要求2所述的部件，形成所述基底(11)的材料的孔隙度小于3％。
4.根据前述权利要求中任一项所述的部件，其中，所述芯部(13N)的孔隙度大于5％、优选地介于10到50％之间。
5.根据权利要求1至4中任一项所述的部件，其中，所述芯部(13N)包括由通过局部烧结粘合的陶瓷晶粒制成的多孔材料。
6.根据权利要求1至3中任一项所述的部件，其中，所述芯部(13N)包括通过分割部分离的腔，形成所述分割部的材料具有小于3％的孔隙度。
7.根据前述权利要求中任一项所述的部件，其中，所述芯部(13N)具有拥有不同腔的部分，特别地，其中所述尺寸随着所述基底变得渐远而增大。
8.根据前述权利要求中任一项所述的部件，包括所述壁(13)的延伸部中的踵状部(15)，所述踵状部(15)的孔隙度小于形成所述芯部的材料的孔隙度。
9.根据前述权利要求中任一项所述的部件，形成了涡轮发动机叶片，所述涡轮发动机叶片的基底形成所述叶片的根部、所述壁形成叶片翼面，所述涡轮发动机叶片可选地具有孔隙度小于所述芯部的孔隙度的踵状部。
10.用于制造部件的方法，所述部件是根据前述权利要求中任一项所述的部件，所述方法包括以下步骤：通过使用包含粉末的烧结托盘(6)来形成壁(13)，所述基底(11)在步骤开始时与所述烧结托盘(6)齐平，并且所述方法包括：利用激光束或电子束对连续层中的粉末选择性烧结，所述连续层通过使所述部件在所述烧结托盘(6)中逐步向下移动来获得。
11.根据前项权利要求所述的方法，包括：通过粉末烧结单独地生产所述基底并且然后通过沉积连续的陶瓷粉末层形成所述壁，并且通过烧结所述层将所述层粘合。
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