JP2007503604A5 - - Google Patents
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- JP2007503604A5 JP2007503604A5 JP2006523987A JP2006523987A JP2007503604A5 JP 2007503604 A5 JP2007503604 A5 JP 2007503604A5 JP 2006523987 A JP2006523987 A JP 2006523987A JP 2006523987 A JP2006523987 A JP 2006523987A JP 2007503604 A5 JP2007503604 A5 JP 2007503604A5
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- JP
- Japan
- Prior art keywords
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- article
- parts
- mold
- surfactant
- Prior art date
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- 239000002243 precursor Substances 0.000 claims 6
- 239000004094 surface-active agent Substances 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 3
- 239000010419 fine particle Substances 0.000 claims 3
- 229910052698 phosphorus Inorganic materials 0.000 claims 3
- -1 phosphorus compound Chemical class 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000011574 phosphorus Substances 0.000 claims 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000001723 curing Methods 0.000 claims 1
- 239000003085 diluting agent Substances 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 125000004437 phosphorous atom Chemical group 0.000 claims 1
- 238000000016 photochemical curing Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 125000000542 sulfonic acid group Chemical group 0.000 claims 1
Claims (6)
前記感光性材料中に分散せしめられたセラミック微粒子と、
少なくとも1個のリン原子を少なくとも1個の−OH基とともに有するリン系化合物を含む第1の界面活性剤と、
スルホン酸基を有するスルホン酸系化合物を含む第2の界面活性剤とを含んでなることを特徴とする前駆ペースト。 A photosensitive material;
Ceramic fine particles dispersed in the photosensitive material;
A first surfactant comprising a phosphorus compound having at least one phosphorus atom with at least one -OH group;
A precursor paste comprising a second surfactant containing a sulfonic acid-based compound having a sulfonic acid group.
感光性樹脂 5〜15重量部、
セラミック微粒子 60〜90重量部、
リン系化合物からなる第1の界面活性剤 0.1〜1.0重量部、
スルホン酸系化合物からなる第2の界面活性剤 0.1〜1.0重量部、
希釈剤 5〜15重量部、及び
光重合開始剤 0.02〜0.25重量部、
を含むことを特徴とする請求項1〜3のいずれか1項に記載の前駆ペースト。 The paste is
5 to 15 parts by weight of photosensitive resin,
60 to 90 parts by weight of ceramic fine particles,
0.1-1.0 part by weight of a first surfactant comprising a phosphorus compound,
0.1 to 1.0 part by weight of a second surfactant comprising a sulfonic acid compound,
5 to 15 parts by weight of a diluent, and 0.02 to 0.25 parts by weight of a photopolymerization initiator,
The precursor paste according to any one of claims 1 to 3, comprising:
形成されるべき突起パターンに対応する形状及び寸法を有する溝パターンを備えた可とう性成形型を用意することと、
前記成形型の溝に請求項1〜4のいずれか1項に記載の前駆ペーストを充填することと、
前記成形型を基板上にラミネートすることと、
前記ペーストを光硬化させることと、
前記成形型を取り去ることと、
を含んでなることを特徴とする物品の製造方法。 A method of manufacturing an article comprising:
Providing a flexible mold with a groove pattern having a shape and dimensions corresponding to the protrusion pattern to be formed;
Filling the groove of the mold with the precursor paste according to any one of claims 1 to 4 ,
Laminating the mold on a substrate;
Photocuring the paste;
Removing the mold;
A method for producing an article comprising:
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003208442A JP2005068181A (en) | 2003-08-22 | 2003-08-22 | Precursor paste of microstructure, microstructure and method for producing the same |
PCT/US2004/026701 WO2005019934A2 (en) | 2003-08-22 | 2004-08-17 | Precursor paste and method of producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007503604A JP2007503604A (en) | 2007-02-22 |
JP2007503604A5 true JP2007503604A5 (en) | 2007-07-26 |
Family
ID=34208978
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003208442A Pending JP2005068181A (en) | 2003-08-22 | 2003-08-22 | Precursor paste of microstructure, microstructure and method for producing the same |
JP2006523987A Withdrawn JP2007503604A (en) | 2003-08-22 | 2004-08-17 | Precursor paste and method for producing the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003208442A Pending JP2005068181A (en) | 2003-08-22 | 2003-08-22 | Precursor paste of microstructure, microstructure and method for producing the same |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1656589A2 (en) |
JP (2) | JP2005068181A (en) |
KR (1) | KR20060118406A (en) |
CN (1) | CN1839352A (en) |
CA (1) | CA2536520A1 (en) |
TW (1) | TW200513794A (en) |
WO (1) | WO2005019934A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7019819B2 (en) | 2002-11-13 | 2006-03-28 | Molecular Imprints, Inc. | Chucking system for modulating shapes of substrates |
US7442336B2 (en) | 2003-08-21 | 2008-10-28 | Molecular Imprints, Inc. | Capillary imprinting technique |
JP2008511124A (en) | 2004-08-26 | 2008-04-10 | スリーエム イノベイティブ プロパティズ カンパニー | Method for forming a microstructure with a template |
US7478791B2 (en) | 2005-04-15 | 2009-01-20 | 3M Innovative Properties Company | Flexible mold comprising cured polymerizable resin composition |
EP1958025B1 (en) * | 2005-12-08 | 2011-05-18 | Molecular Imprints, Inc. | Method for expelling gas positioned between a substrate and a mold |
US10670962B2 (en) | 2017-02-20 | 2020-06-02 | Samsung Electronics Co., Ltd. | Photosensitive compositions, preparation methods thereof, and quantum dot polymer composite pattern produced therefrom |
JP2019019673A (en) * | 2017-07-11 | 2019-02-07 | 日立オートモティブシステムズ株式会社 | pump |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2738393B1 (en) * | 1995-09-06 | 2000-03-24 | Kyocera Corp | PLASMA DISPLAY SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF |
JP3699336B2 (en) * | 2000-06-08 | 2005-09-28 | スリーエム イノベイティブ プロパティズ カンパニー | Manufacturing method of rib for plasma display panel substrate |
-
2003
- 2003-08-22 JP JP2003208442A patent/JP2005068181A/en active Pending
-
2004
- 2004-08-17 WO PCT/US2004/026701 patent/WO2005019934A2/en active Application Filing
- 2004-08-17 JP JP2006523987A patent/JP2007503604A/en not_active Withdrawn
- 2004-08-17 EP EP04781405A patent/EP1656589A2/en not_active Withdrawn
- 2004-08-17 CA CA002536520A patent/CA2536520A1/en not_active Abandoned
- 2004-08-17 KR KR1020067003498A patent/KR20060118406A/en not_active Application Discontinuation
- 2004-08-17 CN CN 200480024065 patent/CN1839352A/en active Pending
- 2004-08-20 TW TW093125238A patent/TW200513794A/en unknown
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