JP2007334996A - Thin film magnetic head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin film magnetic head which can suppress PTP (Pole Tip Protrusion) without impairing the heat dissipation effects. <P>SOLUTION: It has a lower core layer 21 and an upper core layer 34 facing each other leaving a space in the layer thickness direction and the upper core layer 34 is connected to the upper magnetic pole layer 26 regulating the track width. The thickness H2 of the front surface 21b of the lower core layer 21 is made smaller than the thickness H1 of the rear section 21e over the whole area. Thus, PTP is appropriately reduced without impairing the heat dissipation effects. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a thin film magnetic head that performs recording by applying a magnetic field to a medium surface of a recording medium such as a disk, and in particular, suppresses the generation of PTP (Pole Tip Propulsion) without impairing the heat dissipation effect. The present invention relates to a thin film magnetic head that can be used.

  The recording head basically has a layer structure described in FIG. That is, it has a lower core layer (lower magnetic pole of Patent Document 1), an upper core layer (upper magnetic pole of Patent Document 1), and a coil layer. The lower core layer and the upper core layer are opposed to each other in the film thickness direction through a nonmagnetic gap layer on the surface facing the recording medium. The lower core layer and the rear portion of the upper core layer are magnetically connected. The coil layer is located between the lower core layer and the upper core layer behind the opposed surface.

Both the front end surface of the upper core layer and the front end surface of the lower core layer are exposed at the facing surface. The front end surface of the upper core layer is exposed with a track width Tw. The area of the front end face of the lower core layer is very large compared to the area of the front end face of the upper core layer.
JP 2004-247001 A JP 2002-237007 A JP 2003-132507 A

  By the way, the front end surface of the lower core layer occupies a very large exposed area on the facing surface as compared with other parts when the temperature inside the recording head becomes high due to an increase in the environmental temperature in which the recording head is used or heat generated from the coil However, a so-called PTP (Pole Tip Protrusion) phenomenon occurs in which it protrudes from the facing surface due to a difference in thermal expansion coefficient with the insulating material around the lower core layer. The front end surface of the lower core layer easily collides with the recording medium due to the generation of the PTP.

  On the other hand, when suppressing the generation of the PTP, it is necessary not to impair the heat dissipation effect by the lower core layer.

  The lower core layer faces the coil layer with a large volume in the film thickness direction. The lower core layer has a heat radiating function for radiating heat generated from the coil layer to the slider side, but does not impair the heat radiating effect of the lower core layer and suppresses the generation of the PTP. It is necessary to improve the shape.

  Further, the improvement in the shape of the lower core layer must prevent the recording efficiency from being lowered.

  A reproducing head is provided below the recording head and between the slider. The read head includes a lower shield layer, an upper shield layer, and a magnetic detection element such as a GMR element interposed between the shield layers. An insulating separation layer is provided between the upper shield layer and the lower core layer. The upper shield layer is close in distance to the lower core layer, and the area of the front end face exposed at the facing surface is relatively large. Therefore, further suppression of PTP generation includes the upper shield layer. It is necessary to think.

  In Patent Document 1 described above, the same problem as described above is raised, but as a solution, the sum of the film thickness of the lower shield layer and the upper shield layer is regulated.

  However, the shape of the lower core layer has not been improved to suppress the generation of PTP. In addition, Patent Document 1 is to suppress thermal deformation by reducing the thickness of the shield as a whole. However, if the thickness of the film is reduced as a whole, the heat dissipation effect is lowered, which is not preferable. .

  Neither Patent Document 2 nor Patent Document 3 has a problem with the occurrence of PTP described above. That is, these documents do not improve the shape of the lower core layer so as to suppress the generation of PTP.

  Therefore, the present invention is to solve the above-described conventional problems, and in particular, to provide a thin film magnetic head capable of suppressing PTP (Pole Tip Protrusion) without impairing the heat dissipation effect. .

The thin film magnetic head in the present invention is
A first magnetic layer and a second magnetic layer facing each other at an interval in a film thickness direction, and a coil layer positioned between the first magnetic layer and the second magnetic layer,
The track width is regulated by the width dimension of the front end face of the second magnetic layer, or the second magnetic layer is overlapped with the pole layer regulating the track width,
The front end surface of the first magnetic layer is exposed to the facing surface, and the film thickness of the first magnetic layer on the front end surface is the same as that of the coil layer of the first magnetic layer. It is characterized in that it is formed thinner than the maximum film thickness at a position facing in the direction.

  In the present invention, this makes it possible to suppress the generation of PTP without impairing the heat dissipation effect. That is, in the related art, the front end surface of the first magnetic layer has a much larger area than the front end surface of the second magnetic layer, which is the side that regulates the track width. By making the film thickness of the front end surface of the first magnetic layer as a whole thinner than that behind the first magnetic layer, the area of the front end surface of the first magnetic layer can be made smaller than before. At this time, since it has a large film thickness and a large volume at the position facing the coil layer, the generation of PTP can be effectively suppressed without impairing the heat dissipation effect.

  In the present invention, the first magnetic layer is formed below the coil layer, is magnetically connected to the first magnetic layer on the first magnetic layer, and has a front end surface on the facing surface. An exposed raised layer is formed, and the film thickness of the front end surface of the lower magnetic part including the first magnetic layer and the raised layer is opposed to the coil layer of the first magnetic layer in the film thickness direction in the entire region. It is preferable to be formed thinner than the maximum film thickness at the position.

  In the present invention, the first magnetic layer is formed below the coil layer, and the lower surface of the front portion of the first magnetic layer is located behind the front portion so that the film thickness is reduced. It is preferable that it is formed upward from the side toward the front end surface. Thereby, the recording magnetic field can be smoothly induced in the vicinity of the gap, and good recording characteristics can be obtained.

The thin film magnetic head in the present invention is
A first magnetic layer and a second magnetic layer facing each other with a sense in the film thickness direction, and a coil layer positioned between the first magnetic layer and the second magnetic layer,
The second magnetic layer is formed above the first magnetic layer, and a track width is regulated by a width dimension of a front end surface of the second magnetic layer, or the second magnetic layer is formed of the track It is superimposed with the pole layer that regulates the width,
The front end surface of the first magnetic layer is exposed to the facing surface, and the lower surface of the front portion of the first magnetic layer is formed upward from the rear side of the front portion toward the front end surface,
The film thickness of the first magnetic layer at the front end surface is at least partly thinner than the maximum film thickness of the first magnetic layer at a position facing the coil layer in the film thickness direction. It is characterized by this.

  In the present invention, this makes it possible to suppress the generation of PTP without impairing the heat dissipation effect. In addition, the recording magnetic field can be smoothly induced in the vicinity of the gap, and good recording characteristics can be obtained.

  According to the present invention, a raised layer is formed on the first magnetic layer so as to be magnetically connected to the first magnetic layer and having a front end surface exposed to the facing surface, and the first magnetic layer and the raised layer are formed. Of the front end surface of the lower magnetic part including the layer, at least the film thickness of the first magnetic layer located on both sides of the raised layer is opposed to the coil layer of the first magnetic layer in the film thickness direction. It is preferable that the film is formed thinner than the maximum film thickness at the position.

  In the present invention, it is preferable that the lower surface of the front portion of the first magnetic layer is formed as an inclined surface or a curved surface because better recording characteristics can be obtained.

  Further, in the present invention, it is more effective that the periphery of the first magnetic layer excluding the front end surface and the space between the lower surface of the front portion of the first magnetic layer and the facing surface are filled with an inorganic insulating layer. It is preferable because the generation of PTP can be suppressed.

  In the present invention, a lower shield layer, an upper shield layer, and a magnetic detection element positioned between the lower shield layer and the upper shield layer are provided below the first magnetic layer, and the first magnetic layer and the Even when the upper shield layer faces the insulating layer, the generation of PTP can be appropriately suppressed.

  The upper shield layer that is close to the first magnetic layer and has a relatively large volume also affects the generation of PTP. In the present invention, the lower surface of the front portion of the first magnetic layer is formed upward from the rear toward the front end surface, that is, in a direction away from the upper shield layer. The interaction between the front portion and the upper shield layer can be appropriately weakened. Therefore, even in the composite thin film magnetic head in which the recording head and the reproducing head are laminated as in the present invention, the generation of PTP can be more effectively suppressed.

  In the present invention, the front end surface of the upper shield layer is exposed to the facing surface, and at least a part of the film thickness at the front end surface is opposed to the coil layer in the film thickness direction via the first magnetic layer. It is preferable to be formed thinner than the maximum film thickness at the position. At this time, it is preferable that the upper surface of the front portion of the upper shield layer is formed downward so that the film thickness decreases from the rear side of the front portion toward the front end surface. Thereby, more effectively, the distance between the front part of the first magnetic layer and the front part of the upper shield layer is separated from the rear toward the front end surface, and the front part of the first magnetic layer and the upper shield are separated. The interaction between the front part of the layers can be further weakened. In addition, since the area of the front end face of the upper shield layer can be reduced, generation of PTP can be more effectively suppressed. In addition, since the film thickness of the upper shield layer is not reduced in the rear region facing the coil layer, the heat dissipation effect by the upper shield layer is not impaired.

  In the present invention, the width dimension in the track width direction on the front end face of the first magnetic layer is smaller than the maximum width dimension of the first magnetic layer at a position facing the coil layer in the film thickness direction. Preferably it is formed. Thereby, the area of the front end face of the first magnetic layer can be made smaller, and the generation of PTP can be more effectively suppressed.

  According to the thin film magnetic head of the present invention, it is possible to appropriately suppress the generation of PTP (Pole Tip Protection) without impairing the heat dissipation effect.

  FIG. 1 is a partial front view of a composite magnetic head including the recording head (thin film magnetic head) of the first embodiment. FIG. 2 is a cross-sectional view of the composite magnetic head shown in FIG. It is the fragmentary sectional view which cut | disconnected from the surface parallel to Z plane and was seen from the arrow direction.

  FIG. 3 is a partial front view of a composite magnetic head including the recording head (thin film magnetic head) of the second embodiment, and FIG. 4 is a cross-sectional view of the composite magnetic head shown in FIG. It is the fragmentary sectional view which cut | disconnected from the surface parallel to Z plane and was seen from the arrow direction.

FIG. 5 is a partial front view of the composite magnetic head showing the third embodiment.
FIG. 6 is a partial front view of a composite magnetic head including the recording head (thin film magnetic head) of the fourth embodiment. FIG. 7 is a cross-sectional view of the composite magnetic head shown in FIG. It is the fragmentary sectional view which cut | disconnected from the surface parallel to Z plane and was seen from the arrow direction.

  FIG. 8 is a partial front view of a composite magnetic head including the recording head (thin film magnetic head) of the fifth embodiment. FIG. 9 is a cross-sectional view of the composite magnetic head shown in FIG. It is the fragmentary sectional view which cut | disconnected from the surface parallel to Z plane and was seen from the arrow direction.

  FIG. 10 is a partial front view of a composite magnetic head including a recording head (thin film magnetic head) according to the sixth embodiment. FIG. 11 is a cross-sectional view of the composite magnetic head shown in FIG. It is the fragmentary sectional view which cut | disconnected from the surface parallel to Z plane and was seen from the arrow direction.

  Each of the recording heads shown in FIG. 1 to FIG. 11 is a “in-plane magnetic recording type” thin film magnetic head for recording horizontally on a disk.

  FIG. 12 is a partial front view of a perpendicular magnetic recording type recording head (thin film magnetic head) of the seventh embodiment. FIG. 13 shows a composite magnetic head including the recording head shown in FIG. It is the fragmentary sectional view which cut | disconnected from the surface parallel to the YZ plane, and was seen from the arrow direction.

  The recording head shown in FIGS. 12 and 13 is a “perpendicular magnetic recording type” thin film magnetic head for recording perpendicularly to the disk.

  In each figure, common layers are denoted by the same reference numerals. In each figure, the X direction is the track width direction, the Y direction is the height direction, and the Z direction is the film thickness direction. Each direction is orthogonal to the remaining two directions. A plane parallel to the XZ plane shown in the figure is a “facing surface facing the recording medium”, and a direction perpendicular to the facing surface and away from the recording medium is a “height direction” (backward). The direction approaching the recording medium is the “medium direction” (front).

The slider 10 is made of a nonmagnetic material such as Al ₂ O ₃ .TiC. The opposed surface 10a of the slider 10 faces a recording medium (not shown), and when the recording medium rotates, the slider 10 is moved by the airflow on the surface. Floats from the surface of the recording medium or the slider 10 slides on the recording medium. Facing surface H of the recording medium of the reproducing head H _R and the recording head H _W will be described later is formed on the slider 10 is formed in a substantially flush with the opposing surface 10a of the slider 10.

The trailing end surface (upper surface) 10b of the slider 10, the insulating layer 12 of an inorganic material such as _Al 2 _{O 3} or SiO ₂ is formed, the reproducing head _{H R} on the insulating layer 12 is formed .

Reproducing head H _R is a lower shield layer 13, and the lower shield layer 13 lower gap layer 17 formed on, and the lower gap layer 17 magnetic detecting element 14 formed on the upper the magnetic detection element 14 The upper gap layer 15 is covered and the upper shield layer 16 is formed on the upper gap layer 15. The lower shield layer 13 and the upper shield layer 16 are made of a magnetic material such as NiFe. The lower gap layer 17 and the upper gap layer 15 are formed of an insulating material such as Al ₂ O ₃ or SiO ₂ . The magnetic detection element 14 is a magnetoresistive effect element such as AMR, GMR, or TMR.

A separation layer 20 made of an insulating material is formed on the upper shield layer 16. The separation layer 20 is formed of an insulating material such as Al ₂ O ₃ or SiO ₂ .
Wherein on the isolation layer 20, the recording head H _W is provided.

  As shown in FIG. 2, a lower core layer (first magnetic layer) 21 is formed on the separation layer 20. The lower core layer 21 is made of a magnetic material such as NiFe. An upper surface 21a of the lower core layer 21 is a flattened surface, and a Gd determining layer 22 is provided on the upper surface 21a of the lower core layer 21 at a predetermined distance from the facing surface H in the height direction (Y direction in the drawing). Is provided. The Gd determining layer 22 may be formed of an organic insulating material or an inorganic insulating material. A magnetic pole portion 23 is formed from the upper surface 21a of the lower core layer 21 to the Gd determining layer 22 in the height direction from the facing surface H. The magnetic pole part 23 is formed in order of the lower magnetic pole layer 24, the gap layer 25, and the upper magnetic pole layer 26 from the bottom. The formation of the lower magnetic pole layer 24 is optional. The lower magnetic pole layer 24 and the upper magnetic pole layer 26 are made of a magnetic material such as NiFe. The lower magnetic pole layer 24 and the upper magnetic pole layer 26 are made of a magnetic material having a higher saturation magnetic flux density than the lower core layer 21 and the upper core layer 34. The gap layer 25 is made of a nonmagnetic material such as NiP.

  As shown in FIG. 2, a coil insulating base layer 27 is formed from the rear of the magnetic pole portion 23 to the upper surface 21 a of the lower core layer 21. A first coil layer 28 made of a nonmagnetic conductive material is formed on the coil insulating base layer 27. The first coil layer 28 is, for example, a planar coil formed in a spiral shape. A connection layer 29 made of a magnetic material is formed on the upper surface 21 a of the lower core layer 21 at a position away from the facing surface H in the height direction, and the first coil layer 28 is formed around the insulating layer 29. It is formed in the spiral shape described above.

As shown in FIG. 2, between the turns of the first coil layer 28 is filled with a coil insulating layer 30 such as Al ₂ O ₃ . As shown in FIG. 2, the upper surface 26a of the upper magnetic pole layer 26, the upper surface 30a of the coil insulating layer 30, the upper surface 28a of the first coil layer 28, and the upper surface 29a of the connection layer 29 are formed in the same plane.

  A second coil layer 32 is formed on the first coil layer 28 and the coil insulating layer 30 via a coil insulating base layer 31. Similar to the first coil layer 28, the second coil layer 32 is a planar coil formed in a spiral shape, and the winding center of the first coil layer 28 and the winding center of the second coil layer 32 are conductively connected. ing. The first coil layer 28 and the second coil layer 32 are formed in opposite directions.

  As shown in FIG. 2, the second coil layer 32 is covered with a coil insulating layer 33 made of, for example, an organic insulating material, and the upper core made of a magnetic material is formed on the coil insulating layer 33. A layer (second magnetic layer) 34 is formed. A front portion 34 a of the upper core layer 34 is in contact with the upper magnetic pole layer 26, and a rear portion 34 b of the upper core layer 34 is in contact with the connection layer 29.

The recording head Hw is covered with a protective layer 35 made of an insulating material such as Al ₂ O ₃ .

  As shown in FIG. 1, the front end face 13a of the lower shield layer 13, the front end face 16a of the upper shield layer 16, the front end face 21b of the lower core layer 21, the front end face 23a of the magnetic pole part 23, and the front end face of the upper core layer 34 34 c is exposed to the facing surface H. The front end surface 34c of the upper core layer 34 is slightly retracted rearward in the height direction and may not be exposed to the facing surface H.

  The width dimension of the front end face 13a of the lower shield layer 13, the front end face 16a of the upper shield layer 16 and the front end face 21b of the lower core layer 21 in the track width direction (X direction in the drawing) is exposed with substantially the same width dimension T1. ing. The width dimension T1 is about 5.00 to 150 μm.

  A width dimension of the front end face 23a of the magnetic pole portion 23 in the track width direction (X direction in the drawing) is formed with a track width Tw. The track width Tw is restricted by the width dimension of the upper magnetic pole layer 26 in the track width direction (X direction in the drawing). The width dimension T2 in the track width direction of the front end face 34c of the upper core layer 34 is formed to be slightly wider than the track width Tw. The track width Tw is about 0.05 to 3.00 μm. The width dimension T2 is about 0.2 to 3.0 μm.

  FIG. 14 is a partial plan view of the lower core layer 21. The lower core layer 21 is formed to extend in the height direction (Y direction in the drawing) while maintaining the width dimension T1 of the front end face 21b substantially the same. Has been. That is, both end surfaces 21c and 21c in the track width direction (X direction in the drawing) of the lower core layer 21 extend substantially parallel to the height direction (Y direction in the drawing). The lower core layer 21 is formed in a substantially rectangular shape. Although not shown, the lower shield layer 13 and the upper shield layer 16 also extend in the height direction (Y direction shown in the figure) while maintaining the width dimension T1 of the front end faces 13a and 16a substantially the same as the lower core layer 21. Is formed.

The periphery of the lower core layer 21 excluding the front end face 21b is surrounded by an insulating layer 36 formed of an inorganic insulating material such as Al ₂ O ₃ or SiO ₂ .

  As shown in FIG. 2, the front portion 21d formed with a predetermined length L1 from the front end surface 21b to the height direction of the lower core layer 21 has a film thickness from the height side toward the front end surface 21b. The film thickness decreases gradually. The rear part 21e is formed with a substantially constant film thickness H1 rather than the front part 21d. The length L1 of the front part 21d is about 0.1 to 6.0 μm.

  As shown in FIGS. 1 and 2, the film thickness H2 of the front end face 21b is thinner than the film thickness H1 in the entire area. A dotted line portion shown in FIG. 1 indicates an outer periphery of the rear portion 21e.

  In the present embodiment, the lower core layer 21 at a portion facing the coil layers 28 and 32 in the film thickness direction (Z direction in the drawing) is formed with a film thickness H1 having the same thickness as the conventional one. The lower core layer 21 is made of a magnetic material and has a higher thermal conductivity than the insulating layer 36 (see FIG. 14) extending around the lower core layer 21. Therefore, in the present embodiment, a good heat dissipation effect by the lower core layer 21 can be obtained as in the conventional case.

  Further, in the present embodiment, as described above, since the film thickness H2 of the front end face 21b of the lower core layer 21 is thinner than the film thickness H1 in the entire region, the exposure of the front end face 21b is performed. It is possible to appropriately reduce the area, and accordingly, it is possible to appropriately suppress the generation of PTP (Pole Tip Protection) due to the difference in thermal expansion coefficient.

As shown in FIG. 2, an insulating layer 37 formed of an inorganic insulating material such as Al ₂ O ₃ or SiO ₂ is provided between the front portion 21 d and the facing surface H. In this embodiment, the insulating layer 37 and the separation layer 20 are formed as separate components, but the insulating layer 37 and the separation layer 20 may be formed as a single component. By providing the insulating layer 37, the lower surface 21d1 of the inclined front portion 21d is blocked from protruding forward by the insulating layer 37 of an inorganic insulating material having a small thermal expansion coefficient, and the protruding amount of the front end surface 21b Can be reduced more effectively. The insulating layers 36 and 37 are preferably made of Al ₂ O ₃ or SiO ₂ . In the present embodiment, the use of an organic material for the insulating layers 36 and 37 is not excluded, but generally, an organic material has lower heat resistance than an inorganic material. Therefore, when using an organic material, It is necessary to have heat resistance equal to or higher than that of Al ₂ O ₃ or SiO ₂ . When the insulating layers 36 and 37 have low heat resistance and the insulating layers 36 and 37 are softened due to an increase in operating environment temperature or the like, the expansion of the lower core layer 21 cannot be appropriately inhibited, and the film thickness of the lower core layer 21 is reduced. Even if the thickness of the front end face 21b is reduced, the front end face 21b is likely to protrude. The heat resistance can be indicated by the softening point.

  In the embodiment shown in FIG. 2, since the rear portion 21e is formed with a substantially constant film thickness H1, the thickness of the rear portion 21e to be compared is compared with the film thickness of the front end surface 21b. However, if there is a film thickness difference in the rear portion 21e, the maximum film thickness of the portion facing the coil layers 28 and 32 in the film thickness direction is set to the film on the front end face 21b. Compare with thickness. In the present embodiment, the maximum thickness of the portion of the rear portion 21e facing the coil layers 28 and 32 in the film thickness direction is made thicker than the thickness of the front end face 21b. The heat dissipation effect by is not impaired.

  Here, the film thickness dimension is described. The film thickness H1 of the rear portion 21e of the lower core layer 21 is about 0.3 to 5.0 μm. For example, the film thickness H1 is about 3 μm. The thickness H2 of the front end face 21b of the lower core layer 21 is about 0.1 to 4.0 μm. For example, the film thickness H2 is about 1.0 μm. The film thickness of the entire magnetic pole part 23 is in the range of 0.5 to 5.0 μm. In the magnetic pole part 23, the thickness H5 of the front end face 24a of the lower magnetic pole layer 24 is about 0.1 to 0.7 μm. For example, the film thickness H5 is about 0.4 μm. The thickness H3 of the front end face 16a of the upper shield layer 16 is about 0.3 to 5.0 μm. For example, the film thickness H3 is about 1.5 μm. The film thickness H4 of the front end face 13a of the lower shield layer 13 is about 0.3 to 5.0 μm. For example, the film thickness H4 is about 1 μm.

  As shown in FIG. 2, the front portion 21 d, which is a region where the film thickness is reduced, is preferably located in front of the formation region of the coil layers 28 and 32 (on the opposite surface H side). Accordingly, the lower core layer 21 having a thick film thickness H1 can be made to face the coil layers 28 and 32, and the heat dissipation effect by the lower core layer 21 can be enhanced.

  Further, the lower surface 21d1 of the front portion 21d is an inclined surface whose thickness gradually decreases from the height side of the front portion 21d toward the front end surface 21b (when the inclined surface here is viewed in a cross-sectional shape) It is preferable that the surface appears as a straight inclined line. In addition, as shown in FIG. 16, two or more steps 38 are formed on the lower surface 21d1, and the thickness is intermittently reduced from the height side toward the front end surface 21b, as shown in FIG. It does not exclude the form in which only one step 38 is formed on the lower surface 21d1, and the form in which the lower surface 21d1 is formed in a curved shape as shown in FIG. In FIG. 18, the lower surface 21d1 has a concave shape, but may be formed with a convex curved surface.

  However, as shown in FIG. 2 and FIG. 18, when the film thickness is continuously reduced from the height side (Y direction side in the drawing) toward the front end surface 21b, the magnetic flux can be smoothly and the lower core layer. It is easy to pass through 21 and to improve recording characteristics. If there is a step 38 on the lower surface 21d1 as shown in FIG. 16, the recording characteristics are likely to deteriorate due to the leakage of the recording magnetic field from the angle formed by the step 38, but in the form of FIGS. This is preferable because problems are unlikely to occur.

  Further, in this embodiment, as shown in FIG. 19, not the lower surface 21d1 side of the lower core layer 21 but the upper surface 21d2 is formed as an inclined surface, and the film gradually increases from the height side (Y direction in the drawing) toward the front end surface 21b. It does not exclude making the thickness thinner. However, since the magnetic pole portion 23 is formed on the upper surface 21d2 of the lower core layer 21 or a gap layer is formed, it is preferable that the upper surface 21d2 is formed with a flat surface.

  By the way, in the form shown in FIGS. 1 and 2, a magnetic pole portion 23 exposed to the facing surface H is provided between the lower core layer 21 and the upper core layer 34. The lower magnetic pole layer 24 of the magnetic pole part 23 is overlaid on the lower core layer 21. Here, “overlapping” means not only a case where the lower magnetic pole layer 24 and the lower core layer 21 are directly connected, but also a plating underlayer interposed between the lower magnetic pole layer 24 and the lower core layer 21. This includes cases where

  In this embodiment, it is preferable that the film thickness of the front end face (21b + 24a) of the lower core layer 21 and the lower magnetic pole layer 24 is thinner than the film thickness H1 at the rear part 21e in the entire area. That is, the front end face (21b + 24a) has the thickest film thickness (H2 + H5) where the lower magnetic pole layer 24 is formed on the lower core layer 21, but the film thickness (H2 + H5) It is formed thinner than the thickness H1. Thereby, generation | occurrence | production of PTP can be suppressed more appropriately.

In the composite type thin film magnetic head on the slider 10 as shown in FIG. 2 and the reproducing head H _R and the recording head H _W are laminated via a separating layer 20, is formed at a position closer to the lower core layer 21 Comparative It is considered that a relatively strong interaction is working between the upper shield layer 16 formed with a relatively large volume and the lower core layer 21. That is, the occurrence of PTP has been the most problematic in the conventional lower core layer 21 where the exposed area at the front end face is the largest, but has a relatively large exposed area if not as much as the lower core layer 21; Further, the front end face 16a of the upper shield layer 16 that is close to the lower core layer 21 is also likely to protrude forward due to an increase in the operating environment temperature.

  As in this embodiment, the front end surface 21b of the lower core layer 21 is formed with a film thickness H2 that is smaller than the film thickness H1 of the rear portion 21e, so that the front end surface 21b of the lower core layer 21 and the upper shield layer 16 are formed. The total area including the front end face 16a decreases.

  Moreover, as shown in FIG. 2, the lower surface 21d1 of the front portion 21d of the lower core layer 21 is inclined upward in the direction away from the upper shield layer 16 from the height side of the front portion 21d toward the facing surface H. Therefore, the distance H12 (see FIG. 2) between the front portion 21d of the lower core layer 21 and the upper shield layer 16 gradually increases toward the facing surface H, and thus the front portion 21d of the lower core layer 21. And the upper shield layer 16 are effectively weakened. As a result, generation of PTP from the front end face 21b of the lower core layer 21 to the front end face 16a of the upper shield layer 16 can be more effectively suppressed.

  In order to more effectively suppress the occurrence of PTP, the dotted line in FIG. 3 (the dotted line shown in FIG. 3 indicates the outer periphery of the rear part 21e of the lower core layer 21, and the alternate long and short dash line indicates the rear part 16b of the upper shield layer 16). As shown in FIG. 4 and FIG. 4, the film thickness H6 of the front end face 16a of the upper shield layer 16 may be formed thinner than the film thickness H7 of the rear portion 16b of the upper shield layer 16. preferable. At this time, in this embodiment, a part of the film thickness H6 of the front end surface 16a of the upper shield layer 16 is formed to be thinner than the film thickness H7 of the rear portion 16b of the upper shield layer 16. More preferably, the thickness H6 of the surface 16a is formed to be thinner than the thickness H7 of the rear portion 16b of the upper shield layer 16 in the entire region. Thus, the exposed area of the front end face 16a of the upper shield layer 16 can be reduced without impairing the heat dissipation effect of the upper shield layer 16, and the occurrence of PTP can be more effectively suppressed.

  As shown in FIG. 4, the upper surface 16c1 of the front portion 16c of the upper shield layer 16 is gradually reduced in thickness from the height side (Y direction in the drawing) of the front portion 16c toward the front end surface 16a. It is preferable to form it downward. The upper surface 16c1 may have the step shape described with reference to FIGS. 16 and 17 or the curved surface shape of FIG. 18 in addition to the inclined surface shape shown in FIG.

  Moreover, by forming the upper surface 16c1 of the front portion 16c of the upper shield layer 16 from the height side toward the facing surface H in a direction gradually away from the lower core layer 21, as shown in FIG. The distance H13 between the front portion 21d of the lower core layer 21 and the front portion 16c of the upper shield layer 16 can be more effectively separated. As a result, the interaction between the front part 21d of the lower core layer 21 and the front part 16c of the upper shield layer 16 can be reduced more and more effectively. Therefore, the form of FIG. 4 can suppress the generation of PTP more effectively than the form of FIG. Further, by improving the upper surface side of the upper shield layer 16 and forming the lower surface side as a flattened surface as in the prior art, the gap length with the lower shield layer 13 can be shortened as in the prior art.

In the form shown in FIG. 4, an insulating layer 40 made of an inorganic insulating material such as Al ₂ O ₃ or SiO ₂ is provided between the upper surface 16 c 1 and the facing surface H. The upper surface of the insulating layer 40 and the upper surface 16b1 of the rear portion 16b of the upper shield layer 16 are formed in the same plane. As with the insulating layer 37, the insulating layer 40 is formed of an inorganic insulating material, whereby generation of PTP can be more effectively suppressed. The periphery of the upper shield layer 16 except for the front end face 16a is surrounded by an insulating layer (not shown).

  In order to properly maintain the heat dissipation effect of the upper shield layer 16 in the embodiment of FIG. 4, the rear portion 16b having a thick film thickness H7 is formed so as to oppose the entire area below the formation area of the coil layers 28 and 32. It is preferable.

  Also in the embodiment shown in FIG. 4, as in the case of the lower core layer 21, the film thickness H <b> 7 of the portion compared with the film thickness H <b> 6 of the front end face 16 a of the upper shield layer 16 is the same as that of the coil layers 28 and 32. It is defined as the maximum film thickness of the portion facing in the film thickness direction.

  Further, as shown in FIG. 2, in order to further improve the heat dissipation effect, at least between the lower core layer 21 and the upper shield layer 16, between the upper shield layer 16 and the lower shield layer 13, and between the lower shield layer 13 and the slider 10. Any one place is connected by heat radiation layers 41, 42, 43 formed of a conductive material having a thermal conductivity higher than that of the insulating layer 12, the gap layers 15, 17, and the separation layer 20. Is preferred. As a result, heat can be appropriately released to the slider 10.

  Further, as shown in FIG. 15, the width dimension T3 of the front end face 21b of the lower core layer 21 in the track width direction (X direction in the figure) is made smaller than the width dimension T4 of the rear part 21e, thereby reducing the width of the front end face 21b of FIG. (The dotted line indicates the outer periphery of the rear portion 21e of the lower core layer 21, and the alternate long and short dash line indicates the outer periphery of the rear portion 16b of the upper shield layer 16). As compared with the case of 2, it can be made smaller, and the generation of PTP can be more effectively suppressed. In the form shown in FIG. 15, both side end surfaces 21c, 21c of the rear part 21e are formed in a direction parallel to the height direction (Y direction in the figure), and the width dimension T4 at the rear part 21e is almost the same in any part. However, for example, when the width dimension gradually increases toward the rear, the maximum width dimension at the portion facing the formation region of the coil layers 28 and 32 in the film thickness direction is used as a reference. The width dimension T3 of the front end face 21b is made smaller than the maximum width dimension.

  In the width direction, the front end surface 21b exposed on the facing surface H is formed at a position facing the front end surface 23a of the magnetic pole part 23 and the front end surface 34c of the upper core layer 34 in the film thickness direction. It is preferable that the recesses are at both end portions of the lower core layer 21.

  As shown in FIG. 15, both end surfaces 21f of the front portion 21d of the lower core layer 21 are located on the inner side of the both end surfaces 21c of the rear portion 21e, and the connecting surfaces connecting the both end surfaces 21c and the both end surfaces 21f. 21 g recedes in the height direction (Y direction in the drawing) from the front end surface 21 b, and the insulating layer 36 is interposed between the connecting surface 21 g and the facing surface H. The connecting surface 21g faces in a direction parallel to the track width direction (X direction in the drawing), but may be inclined.

  In the form shown in FIG. 15, the connecting surface 21g is positioned at the boundary between the front portion 21d and the rear portion 21e, but the connecting surface 21g may be positioned in the front portion 21d. Or you may locate in the said back part 21e. However, the portion facing the formation region of the coil layers 28 and 32 in the film thickness direction can appropriately enhance the heat dissipation effect of the lower core layer 21 if formed with a wide width dimension, so that the connection surface 21g is preferably located at the boundary between the front part 21d and the rear part 21e, or is located in the front part 21d.

  The distance L2 between the connecting surface 21g and the facing surface H is preferably about 0.3 to 6.0 μm. Accordingly, the insulating layer 36 having a lower thermal expansion coefficient than that of the lower core layer 21 can be interposed between the connecting surface 21g and the facing surface H in a sufficient volume, and the thermal expansion of the lower core layer 21 can be reduced. It can be effectively suppressed.

  As shown in FIG. 15, the front end surface 21b and the side end surfaces 21c may be connected by an inclined surface 21h.

  In this way, by making the width dimension T3 of the front end face 21b of the lower core layer 21 smaller than the width dimension T4 of the rear part 21e, the front end face 21b of the lower core layer 21 is exposed as shown in FIG. An area can be made smaller and generation | occurrence | production of PTP can be suppressed more effectively.

  The planar shape of the lower core layer 21 shown in FIG. 15 can also be applied to the upper shield layer 16. Thereby, as shown in FIG. 5, the exposed area of the front end face 16a of the upper shield layer 16 can be made smaller, and the occurrence of PTP can be more effectively suppressed.

  In the form shown in FIGS. 6 and 7, a protrusion 60 a is formed in the front part 60 d of the lower core layer 60, and the protrusion 60 a appears on the facing surface H. The dotted line shown in FIG. 6 shows the outer periphery of the rear portion 60 c of the lower core layer 60.

  As shown in FIG. 7, the lower surface 60d1 of the front portion 60d of the lower core layer 60 is formed upward from the height side of the front portion 60d toward the front end surface 60b. The shape of the lower surface 60d1 is not limited to the inclined surface, and may be a step shape shown in FIGS. 16 and 17 or a curved surface shape shown in FIG.

  6 and 7, the front end face 34c of the upper core layer 34 is regulated as the track width Tw. The protrusion 60a has a width T5 that is larger than the track width Tw, and the width T5 is about 0.1 to 5.0 μm. The protrusion 60a has a film thickness H10 of about 0.1 to 0.7 μm. Portions located on both sides in the track width direction (X direction in the drawing) of the protrusion 60a appear on the front end surface 60b with a thin film thickness H11. The film thickness H11 is about 0.1 to 4.0 μm. Further, a length dimension L3 (see FIG. 7) in the height direction of the protrusion 60a is formed within a range of 0.1 to 6.0 μm.

  In this embodiment, the thickness of the front end surface 60b of the lower core layer 60 is preferably thinner than the thickness H9 of the rear portion 60c of the lower core layer 60 in the entire area. That is, the film thickness H10 of the protrusion 60a is thinner than the film thickness H9 of the rear portion 60c. Thereby, generation | occurrence | production of PTP can be suppressed appropriately.

  However, this embodiment also includes the case where the film thickness H10 of the protrusion 60a is equal to or greater than the film thickness H9 of the rear portion 60c. In such a case, the relationship of film thickness H11 <film thickness H9 ≦ film thickness H10 is established.

  6 and 7, the lower surface 60d1 of the front portion 60d of the lower core layer 60 is formed in an upward direction from the height side toward the front end surface 60b, as in the above-described embodiment. . Therefore, the magnetic flux can smoothly pass through the lower core layer 60 to improve the recording characteristics, and the distance between the front portion 60d of the lower core layer 60 and the upper shield layer 16 is directed to the facing surface H. Therefore, the interaction between the lower core layer 60 and the upper shield layer 16 can be weakened more appropriately. As a result, even if a part of the front end surface 60b of the lower core layer 60 is equal to or larger than the film thickness H9 of the rear portion 60c, the generation of PTP can be effectively suppressed as compared with the conventional case.

  6 and 7 are formed by scraping the upper surface of the lower core layer 60 formed with a constant film thickness to a certain depth by ion milling or the like except for the part that finally becomes the protrusion 60a. is there.

  As shown in FIG. 7, a coil layer 52 is formed behind the protrusion 60 a, and the upper surface of the coil layer 52 and the upper surface of the coil insulating layer 53 filling between the turns of the coil layer 52 are the protrusions. It is formed in the same plane as the upper surface of 60a. An insulating gap layer 61 is formed on the upper surface of the protrusion 60 a, the upper surface of the coil layer 52, and the upper surface of the coil insulating layer 53, and the upper core layer 34 is formed on the gap layer 61. The rear portion of the upper core layer 34 is magnetically connected on the connection layer 29. In the embodiment shown in FIG. 7, the upper core layer 34 can be formed on the flat gap layer 61, and the track width Tw regulated by the width of the front end face 34c of the upper core layer 34 can be formed with high accuracy. .

  The form shown in FIGS. 8 and 9 has a protruding raised layer 50 on the lower core layer 21. The thickness of the raised layer 50 is H8. A coil layer 87 is formed in the rear region of the raised layer 50. The raised layer 50 has a width dimension T8 wider than the track width Tw, and has a film thickness H8 that is relatively thick enough to form a coil layer in the rear region thereof. It is preferable to reduce PTP in consideration of not only the layer 21 but also the raised layer 50. When defining the lower magnetic pole layer including the lower core layer 21 and the raised layer 50, the front end face 21b of the lower core layer 21 and the front end face 50a of the raised layer 50 correspond to the front end face of the lower magnetic part, The film thickness of the front end face of the “lower magnetic part” is preferably thinner than the film thickness H1 of the rear part 21e in the entire region. However, as described with reference to FIGS. 6 and 7, even if the film thickness (H2 + H8) of the front end surface of the portion where the raised layer 50 is formed on the lower core layer 21 is equal to or greater than the film thickness H1. include. The raised layer 50 has a width dimension T8 in the range of 0.1 to 0.5 μm, a film thickness H8 in the range of 0.1 to 0.7 μm, and a length dimension L4 in the range of 0.1 to 6.0 μm. It is.

  8 and 9, the lower surface 21d1 of the front portion 21d of the lower core layer 21 is formed upward from the height side of the front portion 21d toward the front end surface 21b. An insulating layer 37 is interposed between the lower surface 21d1 and the facing surface H. The distance between the lower surface 21d1 of the front portion 21d of the lower core layer 21 and the upper shield layer 16 gradually increases from the height side toward the opposing surface H, and thus the lower core layer 21 and the upper shield layer 16 are increased. Can be weakened appropriately, and as a result, generation of PTP can be effectively suppressed.

  In the form shown in FIGS. 8 and 9, a lower coil layer 87 is formed on the lower core layer 21 via a coil insulating base layer 80 behind the raised layer 50 in the height direction. The upper surface of the coil insulating layer 53 filling the space between the turns and the upper surface of the connection layer 29 are formed in the same plane as the upper surface of the raised layer 50. A Gd determining layer 81 is formed on the same plane at a predetermined distance from the opposing surface H in the height direction, and a lower magnetic pole layer 82 and a gap layer 83 are formed in front and rear of the Gd determining layer 81 from below. In addition, an upper magnetic pole layer 84 is formed on the gap layer 83 and the Gd determining layer 81. The magnetic pole portion 85 is configured by a three-layer structure of the lower magnetic pole layer 82, the gap layer 83, and the upper magnetic pole layer 84, and the track width Tw is regulated by the width dimension of the magnetic pole portion 85 in the track width direction. Both sides and the rear of the magnetic pole part 85 are surrounded by an insulating layer (not shown), and the upper surface of the magnetic pole part 85 and the upper surface of the insulating layer are formed in the same plane. An upper core layer 89 is overlaid on the upper magnetic pole layer 84. The front end surface 89a of the upper core layer 89 may or may not be exposed from the facing surface H. The width dimension T6 of the front end surface 89a of the upper core layer 89 is formed with a width dimension wider than the track width Tw, for example. The periphery of the upper core layer 89 excluding the front end face 89a is surrounded by an insulating layer (not shown), and an upper coil layer 88 is formed on the coil insulating base layer 86 on the upper core layer 89.

  Here, unlike the planar coil layers shown in FIGS. 1 to 7, the coil layers 87 and 88 are provided with a plurality of coil layers 87 and 88, respectively. The magnetic pole portion 85 and the upper core layer 89 are formed so as to extend on both sides thereof, and both end portions of the lower coil layer 87 and both end portions of the upper coil layer 88 are connected to the magnetic pole portion 85 and the upper core layer 89. The layer 89 is connected so as to be spirally wound around the center axis (solenoid coil).

  The form shown in FIGS. 10 and 11 is the simplest form among the forms given so far. That is, the gap layer 90 is formed on the lower core layer 21, and the coil layer 91 is formed on the gap layer 90. The coil layer 91 is covered with a coil insulating layer 92 made of an organic material or the like. An upper core layer 34 is formed on the coil insulating layer 92, and a front portion 34 a of the upper core layer 34 faces the lower core layer 21 through the gap layer 90 on the facing surface H. On the other hand, the rear portion 34 b of the upper core layer 34 is magnetically connected to the lower core layer 21. As shown in FIG. 10, the front end surface 34c of the upper core layer 34 is exposed from the facing surface H, and the width dimension of the front end surface 34c is the track width Tw.

  The form of the lower core layer 21 is the same as that shown in FIG. That is, the film thickness H2 of the front end face 21b of the lower core layer 21 is formed to be thinner than the film thickness H1 at the rear part 21e in the entire region. Therefore, the portion facing the coil layer 91 has a thick film thickness H1, but the exposed area of the front end face 21b is reduced. Therefore, generation | occurrence | production of PTP can be suppressed appropriately, without impairing the thermal radiation effect.

  The lower surface 21d1 of the front portion 21d of the lower core layer 21 is formed upward so that the film thickness gradually decreases from the height side toward the front end surface 21b. Therefore, the distance between the front portion 21d of the lower core layer 21 and the upper shield layer 16 gradually increases as the facing surface H is approached, so that the interaction between the lower core layer 21 and the upper shield layer 16 is appropriately performed. Can be weakened. Therefore, the occurrence of PTP can be more effectively suppressed by having the shape of the lower core layer 21.

  In FIGS. 12 and 13, reference numeral 100 denotes a main magnetic pole layer (second magnetic layer). As shown in FIG. 12, the front end face 100a of the main magnetic pole layer 100 is exposed with a track width Tw.

  A nonmagnetic gap layer 101 is formed on the main magnetic pole layer 100, and a Gd determining layer 102 is formed on the gap layer 101 at a predetermined distance from the facing surface H in the height direction (Y direction in the drawing). Has been. An upper coil layer 88 is formed behind the Gd determining layer 102, and the upper coil layer 88 is covered with a coil insulating layer 103. A return yoke layer (first magnetic layer) 104 is formed on the coil insulating layer 103. A front portion 104 a of the return yoke layer 104 faces the main magnetic pole layer 100 through the gap layer 101, and a rear end of the return yoke layer 104 is magnetically connected to the main magnetic pole layer 100.

  As shown in FIGS. 12 and 13, the maximum film thickness at the position facing the coil layer 88 in the film thickness direction in the rear part 104b in the height direction from the front part 104a of the return yoke layer 104 is H14. It is formed with. On the other hand, the film thickness of the front end surface 104c appearing on the facing surface H of the return yoke layer 104 is H15, and the film thickness H15 of the front end surface 104c is larger than the film thickness H14 of the rear portion 104b in the entire area. Thinly formed.

12, the recording head H _W shown in FIG. 13 is a perpendicular magnetic recording head, applies a perpendicular magnetic field to a recording medium M, is intended to magnetize a hard film Ma of the recording medium M in the vertical direction.

  The recording medium M has, for example, a disk shape, and has a hard film Ma having a high residual magnetization on the surface thereof and a soft film Mb having a high magnetic permeability on the inside thereof, and the center of the disk serves as the rotation axis center. Can be rotated.

  In this perpendicular magnetic recording head, the film thickness H15 of the front end face 104c of the return yoke layer 104 is formed to be thinner than the film thickness H14 of the rear portion 104b, so that the PTP is effectively generated by the return yoke layer 104. Can be suppressed.

  Further, since the portion of the return yoke layer 104 facing the coil layer 88 in the film thickness direction is formed with a thick film thickness, the heat dissipation effect of the return yoke layer 104 is not impaired. The heat absorbed by the return yoke layer 104 is released from above through the protective layer 105.

  The width dimension of the return yoke layer 104 in the track width direction (X direction in the drawing) is T7. The width dimension T7 is about 5.00 to 150 μm. The width T7 is formed with a width that is sufficiently wider than the track width Tw (about 0.05 to 3.00 μm).

  Further, the return yoke layer 104 may be formed below the main magnetic pole layer 100. In such a case, the return yoke layer 104 may be formed in the same shape as the lower core layer 21 shown in FIG.

  A method for manufacturing the lower core layer 21 and the insulating layer 37 shown in FIG. 2 will be described with reference to the drawings shown in FIGS. Each drawing is a process diagram in the manufacturing process, and is shown in a partial sectional view seen from the same cross section as FIG. 20 to 25, the separation layer 20 and the insulating layer 37 shown in FIG. 2 are integrally formed.

  In the step shown in FIG. 20, an insulating layer 95 having a predetermined thickness is formed on the upper shield layer 16 whose surface is a planarized surface. The dotted line portion is the position of the surface H facing the recording medium.

  In the step of FIG. 21, a resist layer 96 is formed on the insulating layer 95. The resist layer 96 is formed on the insulating layer 95 other than the insulating layer 37 and the separation layer 20. The resist layer 96 is, for example, a lift-off resist, and a part of the cap portion 96 a of the resist layer 96 is formed on the insulating layer 95 to be left as the insulating layer 37.

  Then, the insulating layer 95 that is not covered with the resist layer 96 is removed to a certain depth by ion milling (scraped to the position of the dashed line shown in FIG. 21). The ion milling is isotropic, and the surface of the remaining insulating layer 95 is formed as an inclined surface under the cap portion 96 a of the resist layer 96.

  As shown in FIG. 22, the portion of the insulating layer 95 left with a certain thin film thickness is the separation layer 20 shown in FIG. 2, and the raised insulating layer 95 on the surface H facing the recording medium is shown in FIG. 2. Insulating layer 37 shown. The rear end surface 37a of the insulating layer 37 is an inclined surface.

  A plating base layer 97 for plating the lower core layer 21 is formed by sputtering from the insulating layer 37 to the separation layer 20.

  Then, a resist layer 98 is formed on the insulating layer 37 and the separation layer 20, and a pattern 98a of the lower core layer 21 is formed on the resist layer 98 by exposure and development.

  In the step shown in FIG. 23, the lower core layer 21 is formed by plating in the punched pattern 98a. Then, the resist layer 98 is removed, and in the step of FIG. 24, an insulating layer 36 is formed by sputtering or the like around the lower core layer 21 and on the lower core layer 21, and the lower core is formed on the insulating layer 36. The upper surface 21a of the layer 21 is exposed, and the upper surface 21a becomes a flattened surface, and the insulating layer 36 and the lower core layer 21 are shaved using, for example, a CMP technique (the chain line shown in FIG. To the position of). At this time, the lower core layer 21 must be left at a position that is a surface H facing the recording medium. The lower core layer 21 is left with a film thickness H2 at a position that becomes the facing surface H. On the other hand, in the rear region of the lower core layer 21, it is left with a constant film thickness H1, and the film thickness H1 is sufficiently thicker than the film thickness H2.

  Thereafter, each layer shown in FIG. 2 is formed on the lower core layer 21 and finally cut from the position that becomes the opposing surface H. As shown in FIG. The layer 21 is exposed with a film thickness H2.

  Since the lower surface 21d1 of the front portion 21d of the lower core layer 21 is formed on the inclined surface (rear end surface) 37a of the insulating layer 37, the lower surface 21d1 is formed in an inclined surface shape, and the opposing surface H from the rear of the front portion 21d. The film thickness gradually decreases toward the surface.

  The method for forming the insulating layer 37 and the lower core layer 21 is not limited to the steps shown in FIGS. For example, a lift-off resist having an opening at which the insulating layer 37 is formed is formed on the separation layer 20, the insulating layer 37 is formed by sputtering in the opening, and the lift-off resist is removed. There may be.

  Further, as shown in FIGS. 19, 12, and 13, the top surface of the magnetic layer may be scraped by ion milling or the like to reduce the thickness of the front end surface exposed to the opposing surface.

  Although the preferred form of the lower shield layer 13 is not particularly mentioned above, the front end face 13a of the lower shield layer 13 is also preferably thinner than the film thickness in the rear region. At this time, similarly to the lower core layer 21, it is preferable that the lower surface of the front portion is formed so as to incline upward from the rear of the front portion toward the facing surface H. This is to ensure a narrow gap between the shield layers 13 and 16.

1 is a partial front view of a composite magnetic head including a recording head (thin film magnetic head) of a first embodiment; FIG. 1 is a partial cross-sectional view of the composite magnetic head shown in FIG. 1 cut along a line AA from a plane parallel to the YZ plane and viewed from the arrow direction; The partial front view of the composite type magnetic head containing the recording head (thin film magnetic head) of 2nd Embodiment, FIG. 3 is a partial cross-sectional view of the composite magnetic head shown in FIG. 3 cut along a line BB from a plane parallel to the YZ plane and viewed from the arrow direction; The partial front view of the composite type magnetic head which shows 3rd Embodiment, A partial front view of a composite type magnetic head including a recording head (thin film magnetic head) of a fourth embodiment; FIG. 6 is a partial cross-sectional view of the composite magnetic head shown in FIG. 6 cut along a line C-C from a plane parallel to the YZ plane and viewed from the arrow direction; A partial front view of a composite magnetic head including a recording head (thin film magnetic head) of a fifth embodiment; FIG. 9 is a partial sectional view of the composite magnetic head shown in FIG. 8 cut along a line DD from a plane parallel to the YZ plane and viewed from the arrow direction; A partial front view of a composite magnetic head including a recording head (thin film magnetic head) of a sixth embodiment; FIG. 10 is a partial cross-sectional view of the composite magnetic head shown in FIG. 10 cut along a line EE from a plane parallel to the YZ plane and viewed from the arrow direction; FIG. 10 is a partial front view of a perpendicular magnetic recording type recording head (thin film magnetic head) according to a seventh embodiment; FIG. 13 is a partial cross-sectional view of a composite magnetic head including the recording head shown in FIG. A lower core layer and a partial plan view around it, The lower core layer of the form different from FIG. The partial expanded sectional view of the lower core layer of the form different from FIG. 2, The partial expanded sectional view of the lower core layer of the form different from FIG. 2, The partial expanded sectional view of the lower core layer of the form different from FIG. 2, The partial expanded sectional view of the lower core layer of the form different from FIG. 2, 1 process drawing (partial sectional view) for explaining the formation method of the lower core layer of this embodiment, One process diagram (partial sectional view) performed after FIG. 21 is a process diagram (partial cross-sectional view) performed after FIG. One process diagram (partial sectional view) performed after FIG. FIG. 23 is a process diagram (partial cross-sectional view) performed next to FIG. FIG. 24 is a process diagram (partial sectional view) performed after

Explanation of symbols

10 Slider 13 Lower shield layer 14 Magnetic detection element 16 Upper shield layer 16a Front end surface 16b (of the upper shield layer) Back portion 16c (of the upper shield layer) Front portion 16c1 (of the upper shield layer) Front portion 16c1 ) Upper surface 20 Separating layers 21, 34, 60 Lower core layers 21b, 60b Front end surfaces 21d, 60d (lower core layer) front portions 21d1, 60d1 (lower core layer front portion) lower surface 21e, 60c Rear part (of the lower core layer) 23, 85 Magnetic pole part 24, 82 Lower magnetic pole layer 25, 61, 83 Gap layer 26, 84 Upper magnetic pole layer 28, 32, 52, 87, 88 Coil layer 34, 89 Upper core layer 36, 37, 40, 95 Insulating layer 50 Raised layer 50a Front end face 60a (of raised layer) Protruding portion 96, 98 of lower core layer Resist layer 100 Main magnet Layer 104 Return yoke layer 104a Front portion 104b (return yoke layer) Rear portion 104c (return yoke layer) Front end surface H (return yoke layer) Front end surface H Opposite surface H1 to H15 Film thickness or distance T1 to T8 Width Size

Claims (11)

A first magnetic layer and a second magnetic layer facing each other at an interval in a film thickness direction, and a coil layer positioned between the first magnetic layer and the second magnetic layer,
The track width is regulated by the width dimension of the front end surface of the second magnetic layer, or the second magnetic layer is overlapped with the pole layer regulating the track width,
The front end surface of the first magnetic layer is exposed to the facing surface, and the film thickness of the first magnetic layer on the front end surface is the same as that of the coil layer of the first magnetic layer. A thin film magnetic head, wherein the thin film magnetic head is formed thinner than a maximum film thickness at a position facing in a direction.   The first magnetic layer is formed below the coil layer, and is a raised layer on the first magnetic layer that is magnetically connected to the first magnetic layer and has a front end surface exposed to the facing surface. The thickness of the front end surface of the lower magnetic part including the first magnetic layer and the raised layer is opposed to the coil layer of the first magnetic layer in the film thickness direction in the entire region. 2. The thin film magnetic head according to claim 1, wherein the thin film magnetic head is formed thinner than a maximum film thickness.   The first magnetic layer is formed on a lower side of the coil layer, and a lower surface of a front portion of the first magnetic layer is formed on the front end surface from the rear side of the front portion so that the film thickness is reduced. The thin film magnetic head according to claim 1, wherein the thin film magnetic head is formed so as to face upward. A first magnetic layer and a second magnetic layer facing each other at an interval in a film thickness direction, and a coil layer positioned between the first magnetic layer and the second magnetic layer,
The second magnetic layer is formed above the first magnetic layer, and a track width is regulated by a width dimension of a front end surface of the second magnetic layer, or the second magnetic layer is formed of the track It is superimposed with the pole layer that regulates the width,
The front end surface of the first magnetic layer is exposed to the facing surface, and the lower surface of the front portion of the first magnetic layer is formed upward from the rear side of the front portion toward the front end surface,
The film thickness of the first magnetic layer at the front end surface is at least partly thinner than the maximum film thickness of the first magnetic layer at a position facing the coil layer in the film thickness direction. A thin film magnetic head characterized by that.   A raised layer that is magnetically connected to the first magnetic layer and has a front end surface exposed to the facing surface is formed on the first magnetic layer, and includes the first magnetic layer and the raised layer. Of the front end face of the lower magnetic part, at least the maximum film thickness of the first magnetic layer located on both sides of the raised layer is the position facing the coil layer of the first magnetic layer in the film thickness direction. 5. The thin film magnetic head according to claim 4, wherein the thin film magnetic head is formed thinner than the thickness.   6. The thin film magnetic head according to claim 2, wherein a lower surface of a front portion of the first magnetic layer is formed as an inclined surface or a curved surface.   The periphery of the first magnetic layer excluding the front end surface, and the lower surface of the front portion of the first magnetic layer and the space between the opposing surfaces are filled with an inorganic insulating layer. Thin film magnetic head.   A lower shield layer, an upper shield layer, and a magnetic sensing element positioned between the lower shield layer and the upper shield layer, the first magnetic layer and the upper shield layer; The thin film magnetic head according to claim 2, which are opposed to each other through an insulating layer.   The front end surface of the upper shield layer is exposed to the facing surface, and at least a part of the film thickness on the front end surface is at a position facing the coil layer in the film thickness direction via the first magnetic layer. 9. The thin film magnetic head according to claim 8, wherein the thin film magnetic head is formed thinner than a maximum film thickness.   The thin film magnetic head according to claim 9, wherein an upper surface of a front portion of the upper shield layer is formed downward so that a film thickness decreases from a rear side of the front portion toward the front end surface.   The width dimension in the track width direction of the front end face of the first magnetic layer is formed smaller than the maximum width dimension of the first magnetic layer at a position facing the coil layer in the film thickness direction. Item 11. The thin film magnetic head according to any one of Items 1 to 10.

Images