JP2007327932A - Temperature information output device and its execution method of semiconductor memory element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature information output device and its method of a semiconductor memory element for performing a temperature correction process inside a semiconductor memory element chip. <P>SOLUTION: This device is equipped with a temperature sensing part for fluctuating and outputting a potential level of the first voltage in response to a temperature change; a comparison part for increasing or decreasing a set digital code value in response to a value determined by comparing the first voltage with a potential level of the second voltage, and outputting the result as an adjustment code; and a potential level adjustment part for determining the potential level wherein the second voltage can be changed at the maximum and the potential level wherein the second voltage can be changed at the minimum in response to a temperature control code and the adjustment code, and adjusting and outputting the potential level of the second voltage corresponding thereto. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic compensation structure of a temperature information output device (ODTS) of a memory device, and more particularly, a circuit for adjusting a voltage error caused by a process change or the like through automatic compensation of a temperature information output device. And a method.

  The DRAM cell includes a transistor that functions as a switch and a capacitor that stores electric charges (data). Data is classified into “high” or “low” depending on whether or not the capacitor in the memory cell has electric charge, that is, depending on the level of the terminal voltage of the capacitor.

  Since data is stored in a form in which charges are accumulated in the capacitor, there is no power consumption in principle. However, since there is a leakage current due to PN coupling of the MOS transistor, the stored initial charge amount may disappear and data may be lost. In order to prevent this, the data in the memory cell must be read before the data is lost, and recharged with a normal charge amount in accordance with the read information.

  This operation must be repeated periodically to maintain data storage. Such a process of recharging the cell charges is called a refresh operation, and the refresh control is usually performed by a DRAM controller. As described above, since refresh operation is required, refresh power is consumed in the DRAM. In battery operated systems where lower power is required, reducing power consumption is extremely important and a critical issue.

  As an attempt to reduce power consumption necessary for refresh, there is a case where the refresh cycle is changed according to temperature. The data storage time in the DRAM becomes longer as the temperature becomes lower. Therefore, if the temperature region is divided into a plurality of regions and the frequency of the refresh clock is relatively lowered in the low temperature region, power consumption will be reduced. Therefore, there is a need for a device that can accurately sense the temperature inside the DRAM and reduce the frequency of the refresh clock.

In addition, the semiconductor memory device generates more heat from the semiconductor memory device itself as its integration level and operation speed increase. The heat generated in this manner increases the internal temperature of the semiconductor memory device and interferes with normal operation, which may cause a failure of the semiconductor memory device. Accordingly, there is a need for a device that can accurately sense the temperature of a semiconductor memory device and output information on the sensed temperature.
JP 2005-31077 A

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a semiconductor memory device temperature information output apparatus and method for performing a temperature correction process inside a semiconductor memory device chip. It is in.

  In order to achieve the above object, according to a temperature information output apparatus for a semiconductor device according to the present invention, a temperature sensing unit that varies and outputs a potential level of a first voltage in response to a change in temperature; Responding to a value obtained by comparing one voltage with the potential level of the second voltage, increasing or decreasing the set digital code value and outputting as an adjustment code, and responding to the temperature control code and the adjustment code, And a potential level adjusting unit that determines a potential level at which the second voltage can vary to the maximum and a potential level at which the second voltage can vary to the minimum, and adjusts and outputs the potential level of the second voltage accordingly.

  Furthermore, a decoding unit that decodes the set temperature code and outputs it as a temperature control code is further provided.

  Further, the potential level adjustment unit responds to the adjustment code, and the maximum variation voltage having a potential level at which the second voltage can vary to the maximum according to the set reference voltage, and the potential level at which the second voltage can vary to the minimum An adjustment unit that generates a minimum variation voltage, and in response to the set temperature code or the temperature control code, adjusts the potential level of the second voltage that is an analog value, and the potential level of the second voltage Comprises a digital-analog conversion adjusting unit that adjusts between the minimum potential level and the maximum potential level.

  Further, the adjustment unit receives and decodes the adjustment code to generate a variation adjustment code, and in response to the variation adjustment code, the potential levels of the maximum variation voltage and the minimum variation voltage are set. A potential adjustment unit that adjusts and adjusts the potential level of the distribution voltage corresponding to the potential levels of the maximum variation voltage and the minimum variation voltage, compares the reference voltage and the distribution voltage, and determines the potential according to the result. And a comparison control unit that controls the adjustment unit.

  Further, the potential adjustment unit is responsive to the output signal of the comparison control unit to control the generation of the maximum fluctuation voltage and the minimum fluctuation voltage, and in response to the fluctuation adjustment code, the maximum fluctuation A fluctuation voltage adjustment unit that adjusts a potential level of the voltage and the minimum fluctuation voltage; and a distribution voltage adjustment unit that adjusts the potential level of the distribution voltage corresponding to the potential levels of the maximum fluctuation voltage and the minimum fluctuation voltage. It is characterized by.

  Further, the output control unit controls the connection between the power supply voltage connected to the drain / source path and the fluctuation voltage adjustment unit in response to the output signal of the comparison control unit received at the gate It is characterized by providing.

  Further, the variable voltage adjustment unit includes a plurality of resistors connected in series, and a plurality of switching units that are ON / OFF controlled in response to the variation adjustment code and are connected in parallel one-to-one with the plurality of resistors. It is characterized by that.

  Further, the digital-analog conversion adjustment unit compares the potential level of the first output voltage with the potential level of the minimum fluctuation voltage, determines the potential level of the first bias voltage according to the value, and determines the first bias voltage level. The potential level of the output voltage is varied according to the potential level of the first bias voltage, and the potential level of the second output voltage is compared with the potential level of the maximum variation voltage. The second bias voltage potential level is determined accordingly, the second output voltage potential level varies according to the potential level of the second bias voltage, and the temperature code or the temperature control. A second voltage determining unit that adjusts the potential level of the second voltage in response to the code and determines the potential level of the second voltage according to the first bias voltage and the second bias voltage; Characterized in that it comprises.

  A first current mirror circuit configured to vary the potential level of the first output voltage in response to the potential level of the first bias voltage; and a potential level of the first output voltage; And a first comparator that compares the potential level of the minimum fluctuation voltage with the potential level of the first bias voltage in accordance with the value.

  A second current mirror circuit configured to vary the potential level of the second output voltage in response to the potential level of the second bias voltage; and a potential level of the second output voltage; And a second comparator that compares the potential level of the maximum variation voltage with the potential level of the second bias voltage in accordance with the value.

  Further, the second voltage determination unit is responsive to the temperature code or the temperature control code within a variable potential level determined according to the first bias voltage and the second bias voltage, and A third current mirror circuit for adjusting the potential level of the voltage is provided.

  Further, the comparator is responsive to a value obtained by comparing the potential level of the first voltage and the potential level of the second voltage, and is responsive to the code control signal. And a code counter unit that outputs an adjustment code by decreasing or increasing the set digital code value.

  In order to achieve the above object, according to the temperature information output device for a semiconductor device according to the present invention, in response to a change in temperature, a temperature sensing unit that varies and outputs the potential level of the first voltage; In response to a value obtained by comparing the first voltage with the potential level of the second voltage, the set digital code value is changed and output as the first adjustment code in the first test mode, or in the second test mode A comparator for outputting as a temperature information code, and responding to the first adjustment code during the first test mode or in response to a second adjustment code set during the second test mode, A potential level adjusting unit that determines a potential level that can be changed to the maximum and a potential level that can be changed to a minimum, and adjusts and outputs the potential level of the second voltage according to the potential level, and in the first test mode Or decodes the set temperature code, or the decoding by selecting the temperature information code in the second test mode, and a decoding selection unit for outputting as a temperature control code.

  Further, the potential level adjustment unit responds to the first adjustment code during the first test mode or responds to the second adjustment code during the second test mode according to the set reference voltage. An adjustment unit for generating a maximum fluctuation voltage having a potential level at which the second voltage can fluctuate maximally and a minimum fluctuation voltage having a potential level at which the second voltage can fluctuate in order to track one voltage; And a digital-analog conversion adjustment unit that adjusts the potential level of the second voltage and adjusts the potential level of the second voltage between the minimum potential level and the maximum potential level. It is characterized by that.

  Further, the adjustment unit decodes the first adjustment code in the first test mode or decodes the second adjustment code in the second test mode to generate a variation adjustment code, and the variation A potential adjusting unit that adjusts the potential levels of the maximum and minimum fluctuation voltages in response to the adjustment code and adjusts the potential level of the distribution voltage in accordance with the potential levels of the maximum and minimum fluctuation voltages; And a comparison control unit that compares the reference voltage with the distribution voltage and controls the potential adjustment unit according to the result.

  Further, the potential adjustment unit is responsive to the output signal of the comparison control unit to control the generation of the maximum fluctuation voltage and the minimum fluctuation voltage, and in response to the fluctuation adjustment code, the maximum fluctuation A fluctuation voltage adjustment unit that adjusts a potential level of the voltage and the minimum fluctuation voltage; and a distribution voltage adjustment unit that adjusts the potential level of the distribution voltage corresponding to the potential levels of the maximum fluctuation voltage and the minimum fluctuation voltage. It is characterized by.

  In addition, the output control unit controls the connection between the power supply voltage connected to the drain / source path and the fluctuation voltage adjusting unit in response to the output signal of the comparison control unit received at the gate A transistor is provided.

  Further, the variable voltage adjustment unit includes a plurality of resistors connected in series, and a plurality of switching units that are ON / OFF controlled in response to the variation adjustment code and are connected in parallel one-to-one with the plurality of resistors. It is characterized by that.

  Further, the digital-analog conversion adjustment unit compares the potential level of the first output voltage with the potential level of the minimum fluctuation voltage, determines the potential level of the first bias voltage according to the value, and determines the first bias voltage level. The potential level of the output voltage is varied according to the potential level of the first bias voltage, and the potential level of the second output voltage is compared with the potential level of the maximum variation voltage. In response to the second bias voltage, the second bias voltage is responsive to the temperature control code and a second bias determining unit that varies according to the potential level of the second bias voltage. And a second voltage determining unit that adjusts the potential level of the second voltage and determines a potential level that can be varied according to the first bias voltage and the second bias voltage. That.

  A first current mirror circuit configured to vary the potential level of the first output voltage in response to the potential level of the first bias voltage; and a potential level of the first output voltage; And a first comparator that compares the potential level of the minimum fluctuation voltage with the potential level of the first bias voltage in accordance with the value.

  A second current mirror circuit configured to vary the potential level of the second output voltage in response to the potential level of the second bias voltage; and a potential level of the second output voltage; And a second comparator for comparing the maximum potential level and varying the potential level of the second bias voltage in accordance with the value.

  Further, the second voltage determination unit is responsive to the temperature control code within a variable potential level determined according to the first bias voltage and the second bias voltage, and a potential level of the second voltage. And a third current mirror circuit for adjusting.

  Further, the comparator is responsive to a value obtained by comparing the potential level of the first voltage and the potential level of the second voltage, and is responsive to the code control signal. And a code counter unit that outputs the first adjustment code in the first test mode or outputs the temperature information code in the second test mode by decreasing or increasing the set digital code value. Features.

  Further, the decode selection unit selects and outputs one of a set temperature code or the temperature information code in response to a selection signal, and in response to the selection signal A demultiplexing unit that outputs the first adjustment code to the potential level adjustment unit in the first test mode or outputs the temperature information code to the multiplexing unit in the second test mode; and the multiplexing unit And a decoding unit that decodes the code output from and outputs the code as the temperature control code.

  Further, the selection signal is active during the first test mode and inactive during the second test mode.

  In addition, in order to achieve the above object, according to the temperature information output method of a semiconductor device according to the present invention, the potential level of the first voltage is changed and output in response to a value sensed that the temperature changes. A first step comparing the potential level of the first voltage with the potential level of the second voltage, and increasing or decreasing a digital code value set in response to the value to output as an adjustment code; And, in response to the adjustment code, generating a maximum variation voltage having a potential level at which the second voltage can vary maximum, and a minimum variation voltage having a potential level at which the second voltage can vary minimum; A fourth step of varying the potential level of the second voltage so that the potential level of the second voltage becomes equal to the potential level of the first voltage according to the maximum variation voltage and the minimum variation voltage; No.

  And a step of determining and outputting an initial potential level of the second voltage in response to a code obtained by decoding the set temperature code between the first step and the second step. To do.

  Further, the second step to the fourth step are repeated until the first voltage and the second voltage are at the same potential level.

  Here, the semiconductor element may be a semiconductor memory element or a memory device.

  In the present invention, in the production process of the semiconductor memory device, for each die, it is recovered that the voltage range of the base-emitter voltage (VBE) of the bipolar junction transistor (BJT) with respect to temperature is different. In the semiconductor temperature information output circuit, the digital code generated inside the chip is used as the adjustment code when the potential level inside the chip must be controlled by inputting the adjustment code from the outside in order to increase the accuracy of temperature compensation. Thus, the process of measuring the potential level inside the chip externally and inputting the adjustment code can be omitted. For this purpose, a structure using a digital code generated from the inside of a conventional semiconductor temperature information output circuit as an adjustment code is required.

  When producing a semiconductor memory device having a temperature information output device, the base-emitter voltage (VBE) range of the bipolar junction transistor varies with temperature for each die. Therefore, according to the present invention, in the temperature information output device, an adjustment code is created and used inside the chip by applying a preset temperature code to the temperature information output device in order to increase the accuracy of temperature compensation. In such a case, when the adjustment code is input from the outside, it is possible to reduce the voltage error caused by the use of the external equipment. Similarly, it is possible to reduce a voltage error that occurs while measuring an internal voltage using an external device.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a block diagram illustrating a temperature information output apparatus for a semiconductor memory device according to a first embodiment of the present invention.

  The semiconductor memory device temperature information output apparatus (ODTS) 100 according to the first embodiment of the present invention includes a temperature sensing unit 10, a digital-analog conversion unit DAC20, a voltage comparison unit 30, a code counter unit 40, an adjustment unit 50, and The decoding unit 60 is configured.

  Specifically, the temperature sensing unit 10 has a base-emitter voltage (VBE) change of about −1.8 mV in a bipolar junction transistor in a bandgap circuit that is not affected by changes in the temperature and power supply voltage of the semiconductor memory device. The temperature of the semiconductor memory device is sensed by utilizing the fact that it is / ° C. Then, by amplifying the base-emitter voltage (VBE) of the bipolar junction transistor that fluctuates minutely, the first voltage VPTAT corresponding to the temperature one to one is output. That is, the higher the temperature of the semiconductor memory device, the lower the base-emitter voltage (VBE) of the bipolar junction transistor is output.

  The digital-analog conversion unit 20 is a digital-analog converter that receives the maximum variation voltage DAC_HI and the minimum variation voltage DAC_LOW output from the adjustment unit 50 and performs digital-analog conversion, and is output from the decoding unit 60. In response to a temperature control code TEMP_CODE that is a digital value, the second voltage VPDAC that is an analog value is converted and output.

  Then, the voltage comparison unit 30 compares the first voltage VPTAT and the second voltage VPDAC and outputs a control signal INC_DEC_CON. At this time, if the potential level of the first voltage VPTAT is smaller than the potential level of the second voltage VPDAC, the control signal INC_DEC_CON that decreases the preset digital code of the code counter unit 40 is output, and the potential level of the first voltage VPTAT Is greater than the potential level of the second voltage VPDAC, the control signal INC_DEC_CON for increasing the preset digital code of the code counter unit 40 is output.

  Further, the code counter unit 40 receives the control signal INC_DEC_CON from the voltage comparison unit 30 and outputs a temperature information code THERMAL_CODE having temperature information by increasing or decreasing a digital value preset therein. To do.

  The adjustment unit 50 receives the reference voltage VREF output from the bandgap circuit that is not affected by changes in the temperature and power supply voltage of the semiconductor memory element, and receives the maximum fluctuation that is not affected by changes in the temperature and power supply voltage of the semiconductor memory element. The voltage DAC_HI and the minimum fluctuation voltage DAC_LOW are output. At this time, in the semiconductor memory device, since the voltage range of the base-emitter voltage (VBE) of the bipolar junction transistor with respect to the temperature is different for each die in the production process, the adjustment code TRIM_CODE_EXT is used to increase the accuracy of temperature compensation. Is input from the outside to control the potential level of the maximum variation voltage DAC_HI and the potential level of the minimum variation voltage DAC_LOW. Here, the potential level of the maximum variation voltage DAC_HI and the potential level of the minimum variation voltage DAC_LOW change together with a certain voltage difference.

  The decoding unit 60 transmits the temperature information code THERMAL_CODE output from the code counter unit 40 to the digital-analog conversion unit 20 again via feedback. At this time, in order to eliminate an error that may occur due to a transmission time difference, the temperature information code THERMAL_CODE is decoded and output as a temperature control code TEMP_CODE. Here, the error that may occur due to the transmission time difference is that when the digital-analog converter 20 reacts more sensitively than the transmission time difference and outputs the second voltage VPDAC, incorrect information is input to the voltage comparison unit 30. Means an error.

  FIG. 2A is a diagram showing a base-emitter voltage (VBE) of a bipolar junction transistor according to a temperature for each process in the temperature sensing unit 10, and FIG. 2B is a base-emitter voltage (VBE) of the bipolar junction transistor according to a temperature. FIG.

  As shown in FIGS. 2A and 2B, it can be seen that the base-emitter voltage (VBE) of the bipolar junction transistor of the temperature sensing unit 10 changes linearly according to the temperature of the semiconductor memory device.

  However, in the semiconductor memory device temperature information output apparatus 100 as described above, in the production process of the semiconductor memory device, the voltage range of the base-emitter voltage (VBE) of the bipolar junction transistor with respect to the temperature differs for each die. The potential level of the maximum variation voltage DAC_HI and the minimum variation voltage DAC_LOW of the adjustment unit 50 that controls the potential level of the second voltage VPDAC output from the digital-analog conversion unit 20 to improve the accuracy of the temperature compensation. The potential level is controlled by inputting an adjustment code TRIM_CODE_EXT from the outside, but has the following problems.

  In order to increase the accuracy of temperature compensation, what is the potential level of the first voltage VPAT output from the temperature sensing unit 10 and the potential level of the second voltage VPDAC output from the digital-analog conversion unit 20? However, it is usually measured using equipment that measures voltage externally. However, when measuring externally in this way, an error may occur due to the offset of the equipment to be measured.

  Also, according to the internal potential level measured using the measurement equipment, the adjustment voltage TRIM_CODE_EXT is input from the outside to adjust the internal voltage, thereby confirming whether the accurate potential level is output internally At this time, the potential level of the internal voltage must be measured externally, so that an error may occur due to the offset of the equipment to be measured.

  For example, the potential level of the first voltage VPAT output from the temperature sensing unit 10 and the potential of the second voltage VPDAC output from the digital-analog conversion unit 20 due to an offset generated between the semiconductor memory device and the measurement equipment. If the offset voltage difference from the level is 20 mV, the actually output temperature information signal has a temperature error value of about 10 ° C.

  FIG. 3 is a block diagram illustrating a temperature information output apparatus for a semiconductor memory device according to a second embodiment of the present invention.

  The temperature information output apparatus 1000 for a semiconductor memory device according to the second embodiment of the present invention includes a temperature sensing unit 1200 that outputs a voltage level of the first voltage VPTAT in response to a change in temperature, and a first voltage VPTAT. In response to a value obtained by comparing the potential level of the second voltage VPDAC with the potential level of the second voltage VPDAC, the digital code value that has been set is increased or decreased and output as an adjustment code TRIM_CODE_IN, and in response to the adjustment code TRIM_CODE_IN A potential level adjustment that determines the potential level at which the second voltage VPDAC can vary to the maximum and the potential level at which the second voltage VPDAC can vary to the minimum according to the reference voltage VREF, and adjusts and outputs the potential level of the second voltage VPDAC accordingly Part 1600.

  Further, it further includes a first decoding unit 1700 that decodes the set temperature code TCAL_CODE and outputs it as a temperature control code TEMP_CODE.

  Specifically, the comparison unit 1400 compares the first voltage VPTAT and the second voltage VPDAC, receives the control signal INC_DEC_CON from the voltage comparison unit 1420 that outputs the control signal INC_DEC_CON, and the voltage comparison unit 1420, and internally Is provided with a code counter unit 1440 that increases or decreases a preset digital value and outputs it as an adjustment code TRIM_CODE_IN. At this time, if the potential level of the first voltage VPTAT is smaller than the potential level of the second voltage VPDAC, the control signal INC_DEC_CON for decreasing the preset digital code of the code counter unit 1440 is output, and the potential of the first voltage VPTAT When the level is higher than the potential level of the second voltage VPDAC, the control signal INC_DEC_CON for increasing the preset digital code of the code counter unit 1440 is output.

  The potential level adjustment unit 1600 is responsive to the adjustment code TRIM_CODE_IN output from the code counter unit 1440, and has a maximum variation voltage DAC_HI having a potential level at which the second voltage VPDAC can vary to the maximum according to the reference voltage VREF, and a minimum In accordance with the maximum fluctuation voltage DAC_HI and the minimum fluctuation voltage DAC_LOW in response to the temperature code TCAL_CODE or the temperature control code TEMP_CODE, which is determined and output, the minimum fluctuation voltage DAC_LOW having a potential level that can vary A digital-analog converter DAC 1640 that determines the potential level of the second voltage VPDAC is provided.

  Here, the digital-analog conversion unit DAC 1640 can receive the set temperature code TCAL_CODE or the temperature control code TEMP_CODE and determine the potential level of the second voltage VPDAC, which is input to the digital-analog conversion unit 1640. This means that the code may be input without passing through the first decoding unit 1700.

  FIG. 4 is a detailed circuit diagram showing an embodiment of the digital-analog converter 1640 in the temperature information output device for the semiconductor memory device shown in FIG.

  The digital-analog converter 1640 according to the embodiment of the present invention compares the potential level of the first output voltage OUT_1 with the potential level of the minimum fluctuation voltage DAC_LOW, and determines the potential level of the first bias voltage BIAS1 according to the value. A first bias determining unit 1642 that determines the second bias that compares the potential level of the second output voltage OUT_2 and the potential level of the maximum variation voltage DAC_HI and determines the potential level of the second bias voltage BIAS2 according to the value The determination unit 1644 and the temperature code TCAL_CODE: SW <0>,..., SW <N> or the temperature control code TEMP_CODE: SW <0>,..., SW <N> are enabled, and the first bias voltage BIAS1 and Second voltage determination for adjusting the potential level of the second voltage VPDAC in accordance with the second bias voltage BIAS2. Equipped with a 1646.

  Here, the potential level of the first output voltage OUT_1 varies according to the potential level of the first bias voltage BIAS1, and the potential level of the second output voltage OUT_2 varies according to the potential level of the second bias voltage BIAS2. .

  More specifically, the first bias determination unit 1642 is configured to change the potential level of the first output voltage OUT_1 in response to the first bias voltage BIAS1, and the potential level of the first output voltage OUT_1. A first comparator 1642A that compares the potential level of the minimum variation voltage DAC_LOW and varies the potential level of the first bias voltage BIAS1 according to the value is provided.

  In addition, the second bias determination unit 1644 responds to the potential level of the second bias voltage BIAS2, and changes the potential level of the second output voltage OUT_2 and the potential level of the second output voltage OUT_2. Is provided with a second comparator 1644A that compares the potential level of the maximum fluctuation voltage DAC_HI and varies the potential level of the second bias voltage BIAS2 according to the value.

  In addition, the second voltage determination unit 1646 has a temperature code TCAL_CODE: SW <0>,..., SW <N> within a variable potential level determined according to the first bias voltage BIAS1 and the second bias voltage BIAS2. Alternatively, a third current mirror circuit that adjusts the potential level of the second voltage VPDAC in response to the temperature control code TEMP_CODE: SW <0>,..., SW <N> is provided.

  That is, if the values of the temperature code TCAL_CODE: SW <0>,..., SW <N> or the temperature control code TEMP_CODE: SW <0>,..., SW <N> are all “1”, the maximum fluctuation voltage DAC_HI A second voltage VPDAC having the same potential level is output. Similarly, if the values of the temperature code TCAL_CODE: SW <0>,..., SW <N> or the temperature control code TEMP_CODE: SW <0>,..., SW <N> are all “0”, the minimum fluctuation voltage DAC_LOW A second voltage VPDAC having a potential level equal to is output. Accordingly, the potential level of the second voltage VPDAC changes to a value between the maximum fluctuation voltage DAC_HI and the minimum fluctuation voltage DAC_LOW in accordance with the temperature code TCAL_CODE or the temperature control code TEMP_CODE.

  FIG. 5 is a detailed circuit diagram showing the adjustment unit 1620 in the temperature information output device for the semiconductor memory device shown in FIG.

  The adjustment unit 1620 receives and decodes the adjustment code TRIM_CODE_IN to generate the fluctuation adjustment codes D0 to DN-1, and the maximum fluctuation voltage DAC_HI in response to the fluctuation adjustment codes D0 to DN-1. And a potential adjustment unit 1626 that adjusts the potential level of the minimum variation voltage DAC_LOW and adjusts the potential level of the distribution voltage DIVI_VOL corresponding to the potential levels of the maximum variation voltage DAC_HI and the minimum variation voltage DAC_LOW, and the reference voltage VREF and the distribution voltage A comparison control unit 1624 that compares DIVI_VOL and controls the potential adjustment unit 1626 according to the result is provided.

  Here, the potential adjustment unit 1626 responds to the output signal of the comparison control unit 1624 to the output control unit 1626A that controls the generation of the maximum variation voltage DAC_HI and the minimum variation voltage DAC_LOW, and the variation adjustment codes D0 to DN-1. In response, the fluctuation voltage adjustment unit 1626B that adjusts the potential levels of the maximum fluctuation voltage DAC_HI and the minimum fluctuation voltage DAC_LOW, and the distribution voltage DIVI_VOL corresponding to the potential level of the maximum fluctuation voltage DAC_HI and the potential level of the minimum fluctuation voltage DAC_LOW. A distribution voltage adjustment unit 1626C for adjusting the potential level is provided.

  The output control unit 1626A is a PMOS that controls connection between the power supply voltage (VDD) connected to the source / drain path and the fluctuation voltage adjustment unit 1626B in response to the output signal of the comparison control unit 1624 received by the gate. A transistor P1 is provided.

  The fluctuation voltage adjustment unit 1626B is ON / OFF controlled in response to the plurality of resistors R_21, R_22,..., R_2N and the fluctuation adjustment codes D0 to DN-1 connected in series, and the plurality of resistors R_21, R_22, .., SW_2N, each of which includes a plurality of switching units SW_21, SW_22,.

  The distribution voltage adjustment unit 1626C includes a fixed resistor set corresponding to the variable voltage adjustment unit 1626B that exhibits the effect of the variable resistance by the plurality of resistors R_21, R_22,..., R_2N, thereby providing the potential of the distribution voltage DIVI_VOL. Adjust the level.

  As described above, the adjusting unit 1620 according to the present invention controls the minimum variation voltage by controlling the plurality of resistors R_21, R_22,..., R_2N to function as a load according to the value of the adjustment code TRIM_CODE_IN. The potential level of the DAC_LOW is determined, and the potential level of the maximum variation voltage DAC_HI having a certain difference from the minimum variation voltage DAC_LOW is determined.

  The reference voltage VREF necessary for determining the potential level of the minimum fluctuation voltage DAC_LOW and the maximum fluctuation voltage DAC_HI is a voltage output from the band gap circuit, and is affected by fluctuations in PVT (process, voltage, temperature). Hardly receive. However, the above-described temperature information output device senses temperature using the fact that the change in the base-emitter voltage (VBE) of the bipolar junction transistor is about −1.8 mV / ° C., that is, it is extremely sensitive. Even a slight difference (for example, about 10 mV) caused by a change in the semiconductor process may cause a large difference between the temperature sensed value and the actual output value. For this reason, although not described in detail in the present invention, the reference voltage VREF used in the present invention is a voltage obtained by adjusting in advance a difference generated by a change in the process of the bandgap circuit via an external device.

  However, even if the voltage difference generated by the change in the process of the bandgap circuit is adjusted using the external equipment, the voltage difference generated by the change in the process of the remaining part excluding the bandgap circuit remains. Therefore, in the automatic compensation structure of the present invention, in order to improve the accuracy of the output temperature information, the voltage difference of the latter (the voltage difference generated by the process change of the remaining part excluding the band gap circuit) is changed to the temperature information circuit. Adjust through automatic compensation.

  As described above, if the present embodiment is applied, the voltage range of the base-emitter voltage (VBE) of the bipolar junction transistor with respect to temperature differs for each die in the production process of the semiconductor memory device. By applying the set temperature code TCAL_CODE to the temperature information output device and using the adjustment code TRIM_CODE_IN to increase the accuracy of temperature compensation inside the chip, use external equipment as in the conventional technology Thus, accurate temperature compensation can be achieved without measuring the internal voltage. That is, it is possible to prevent the occurrence of an error due to the offset of the equipment to be measured externally, which has been a problem of the prior art.

  The temperature information output method of the semiconductor memory device according to the second embodiment of the present invention will be described with reference to FIGS.

  In response to a value sensed to change the temperature, a first step of changing and outputting the potential level of the first voltage VPTAT, and a second voltage in response to a code TEMP_CODE decoded from the set temperature code TCAL_CODE The second step of determining and outputting the initial potential level of VPDAC is compared with the potential level of the first voltage VPAT and the second voltage VPDAC, and the digital code value set in response to the value is increased or decreased. In response to the adjustment code TRIM_CODE_IN, in response to the adjustment code TRIM_CODE_IN, a maximum fluctuation voltage DAC_HI having a potential level at which the second voltage VPDAC can fluctuate at maximum and a minimum fluctuation voltage DAC_LOW at which fluctuation can be minimized are output. The fourth step, and the maximum fluctuation voltage DAC_ Depending on the I and the minimum voltage change DAC_LOW, and a fifth step in which the potential level of the second voltage VPDAC is to vary the potential level of the second voltage VPDAC so as to be equal to the first voltage VPTAT.

  The third to fifth steps described above are repeated until the first voltage VPTAT and the second voltage VPDAC have the same potential level.

  Further, the above-described second step can be omitted. That is, the initial potential level of the second voltage VPDAC can also be determined in response to the set temperature code TCAL_CODE.

  FIG. 6 is a diagram showing simulation waveforms of the circuit configured according to the second embodiment of the present invention.

  As shown in the figure, the second voltage VPDAC output from the temperature information output device is equal to the first voltage VPTAT output from the temperature sensing unit according to the first voltage VPTAT output from the temperature sensing unit. It shows increasing until the voltage is reached.

  If the potential level of the second voltage VPDAC output from the temperature information output device is equal to the potential level of the first voltage VPDAT output from the temperature sensing unit, the digital code TRIM_CODE generated and output from the inside is provided. <0>, TRIM_CODE <1>, TRIM_CODE <2>, TRIM_CODE <3>, TRIM_CODE <4> are recognized as valid adjustment codes (TRIM_CODE is valid), and are output as signals having temperature information after adjustment work.

  FIG. 7 is a block diagram illustrating a temperature information output apparatus for a semiconductor memory device according to a third embodiment of the present invention.

  The temperature information output apparatus 2000 for a semiconductor memory device according to the third embodiment of the present invention includes a temperature sensing unit 2200 that outputs a voltage level of the first voltage VPTAT in response to a change in temperature, and a first voltage VPTAT. In response to a value obtained by comparing the potential level of the second voltage VPDAC with the potential level of the second voltage VPDAC, the set digital code value is increased or decreased and output as the first adjustment code TRIM_CODE_IN in the first test mode, or The comparison unit 2400 that outputs the temperature information code THERMAL_CODE in the second test mode, responds to the first adjustment code TRIM_CODE_IN in the first test mode, or responds to the second adjustment code TRIM_CODE_EXT set in the second test mode. 2 Voltage VPDAC can be changed to the maximum The potential level that can be changed to the minimum and the potential level that can be changed to the minimum is determined, and the potential level adjustment unit 2600 that adjusts and outputs the potential level of the second voltage VPDAC accordingly, and the temperature code TCAL_CODE set in the first test mode are decoded. Or a decode selection unit 2700 that decodes the temperature information code THERMAL_CODE and outputs it as the temperature control code TEMP_CODE in the second test mode.

  The semiconductor memory device temperature information output apparatus 2000 according to the third embodiment of the present invention performs the same operation as that of the semiconductor memory device temperature information output apparatus 1000 according to the second embodiment of the present invention in the first test mode. In the second test mode, the same operation as the temperature information output apparatus 100 for the semiconductor memory device according to the first embodiment is performed.

  For the temperature information output apparatus 2000 for a semiconductor memory device according to the third embodiment of the present invention, only the portions having a different configuration from the temperature information output apparatus according to the first and second embodiments will be described in detail.

  First, the adjustment unit 2620 of the potential level adjustment unit 2600 according to the third embodiment of the present invention receives the first adjustment code TRIM_CODE_IN in the first test mode, and sets the potential levels of the maximum variation voltage DAC_HI and the minimum variation voltage DAC_LOW. The second adjustment code TRIM_CODE_EXT is received during the second test mode, and the potential levels of the maximum variation voltage DAC_HI and the minimum variation voltage DAC_LOW are determined. In other words, the adjustment code TRIM_CODE for increasing the accuracy of temperature compensation is used by using a code output from the inside of the circuit in the first test mode, or a code input from the outside in the second test mode. is there.

  The decode selection unit 2700 according to the third embodiment of the present invention selects and outputs one of the set temperature code TCAL_CODE or temperature information code THERMAL_CODE in response to the selection signal SEL. In response to the selection signal SEL, the multiplex unit 2720 outputs a first adjustment code TRIM_CODE_IN in the first test mode, or outputs a temperature information code THERMAL_CODE in the second test mode, and a multiplex unit 2720. The decoding part 2760 which decodes the code | cord | chord output from this and outputs it as temperature control code TEMP_CODE is provided.

  Here, the demultiplexing unit 2740 receives the output code of the comparison unit 2400 and outputs the first adjustment code TRIM_CODE_IN to the potential level adjustment unit 2600 during the first test mode, or temperature information during the second test mode. The code THERMAL_CODE is output to the multiplexing unit 2720.

  Further, the selection signal SEL becomes active during the first test mode or becomes inactive during the second test mode.

  That is, in the second embodiment described above, only the method of creating the adjustment code TRIM_CODE for increasing the accuracy of temperature compensation by applying the set temperature code to the temperature information output device is used inside the chip. In the third embodiment, the first test mode is divided into a first test mode and a second test mode, and the first test mode is used to increase the accuracy of temperature compensation by applying the set temperature code to the temperature information output device. The method is the same as that used in the second embodiment of the present invention in which the first adjustment code TRIM_CODE_IN is generated and used inside the chip, and the second test mode is used in the conventional technique using the second adjustment code TRIM_CODE_EXT externally. The first test mode and the second test are configured by controlling the selection signal SEL in the same manner as the method described above. User mode is to be selected and used.

  As described above, if this embodiment is applied, the voltage range of the base-emitter voltage (VBE) of the bipolar junction transistor with respect to the temperature differs for each die in the production process of the semiconductor memory device. By applying the set temperature code to the temperature information output device, the first adjustment code TRIM_CODE_IN for increasing the accuracy of temperature compensation is created and used inside the chip. Not only can accurate temperature compensation be possible without using an internal voltage measurement, but the user can also select and use conventional techniques and the present invention. That is, it is possible to prevent an error from occurring due to the offset of the equipment to be measured externally, which has been a problem in the prior art.

  The above-described preferred embodiments of the present invention have been disclosed for the purpose of illustration, and those having ordinary knowledge in the technical field to which the present invention pertains depart from the technical idea of the present invention. Various substitutions, modifications, and alterations are possible within the scope of not being included, and such substitutions, alterations, and the like belong to the scope of the claims.

  For example, the logic gates and transistors exemplified in the above-described embodiments should be implemented so that the positions and types thereof are different depending on the polarity of an input signal.

1 is a block diagram showing a temperature information output device for a semiconductor memory device according to a first embodiment of the present invention. It is a figure which shows the output voltage with respect to the change of the output voltage with respect to the temperature according to process in the temperature sensing part of FIG. 1, and the change of temperature. It is a block diagram which shows the temperature information output device of the semiconductor memory element which concerns on 2nd Embodiment of this invention. FIG. 4 is a detailed circuit diagram illustrating a digital-analog conversion unit in the temperature information output device of the semiconductor memory device shown in FIG. 3. FIG. 4 is a detailed circuit diagram showing an adjustment unit in the temperature information output device for the semiconductor memory element shown in FIG. It is a figure which shows the simulation waveform of the circuit which concerns on 2nd Embodiment of this invention. It is a block diagram which shows the temperature information output device of the semiconductor memory element which concerns on 3rd Embodiment of this invention.

Explanation of symbols

1000 Temperature information output device 1200 Temperature sensing unit 1400 Comparison unit 1420 Voltage comparison unit 1440 Code counter unit 1600 Potential level adjustment unit 1620 Adjustment unit 1640 Digital-analog conversion unit 1700 First decoding unit

Claims (28)

A temperature sensing unit that varies and outputs the potential level of the first voltage in response to a change in temperature;
A comparator that responds to a value obtained by comparing the first voltage with the potential level of the second voltage, and increases or decreases a set digital code value and outputs the adjusted code as an adjustment code;
In response to the temperature control code and the adjustment code, the potential level at which the second voltage can be varied to the maximum and the potential level at which the second voltage can be varied to the minimum are determined, and the potential level of the second voltage is adjusted accordingly. A temperature information output device for a semiconductor element, comprising: a potential level adjusting unit for outputting.   2. The temperature information output device for a semiconductor device according to claim 1, further comprising a decoding unit that decodes the set temperature code and outputs the decoded temperature code as a temperature control code. The potential level adjuster is
In response to the adjustment code, an adjustment that generates a maximum fluctuation voltage having a potential level at which the second voltage can fluctuate to the maximum and a minimum fluctuation voltage having a potential level at which the second voltage can fluctuate to the minimum according to a set reference voltage. And
In response to the set temperature code or the temperature control code, the potential level of the second voltage, which is an analog value, is adjusted, and the potential level of the second voltage is set to the minimum potential level and the maximum potential level. The temperature information output device for a semiconductor device according to claim 1, further comprising: a digital-analog conversion adjustment unit that adjusts between the two. The adjustment unit is
A decoding unit for generating a fluctuation adjustment code by receiving and decoding the adjustment code;
In response to the fluctuation adjustment code, a potential adjustment unit that adjusts the potential level of the maximum fluctuation voltage and the minimum fluctuation voltage and adjusts the potential level of the distribution voltage corresponding to the potential level of the maximum fluctuation voltage and the minimum fluctuation voltage. When,
The temperature information output device for a semiconductor device according to claim 3, further comprising: a comparison control unit that compares the reference voltage and the distribution voltage and controls the potential adjustment unit according to a result of the comparison. The potential adjusting unit is
In response to the output signal of the comparison control unit, an output control unit that controls generation of the maximum variation voltage and the minimum variation voltage;
In response to the variation adjustment code, a variation voltage adjustment unit that adjusts the potential level of the maximum variation voltage and the minimum variation voltage;
The temperature information output device for a semiconductor device according to claim 4, further comprising: a distribution voltage adjustment unit that adjusts a potential level of the distribution voltage corresponding to the potential levels of the maximum variation voltage and the minimum variation voltage. . The output control unit is
And a transistor for controlling connection between a power supply voltage connected to a drain / source path and the fluctuation voltage adjustment unit in response to an output signal of the comparison control unit received by a gate. Item 6. The semiconductor device temperature information output device according to Item 5. The variable voltage adjustment unit is
A plurality of resistors connected in series;
The temperature information output device for a semiconductor device according to claim 5, further comprising: a plurality of switching units that are on / off controlled in response to the fluctuation adjustment code and that are connected in parallel with the plurality of resistors in a one-to-one relationship. . The digital-analog conversion adjustment unit is
The potential level of the first output voltage is compared with the potential level of the minimum fluctuation voltage, the potential level of the first bias voltage is determined according to the value, and the potential level of the first output voltage is the first bias voltage. A first bias determining unit that varies according to the potential level of the voltage;
The potential level of the second output voltage is compared with the potential level of the maximum fluctuation voltage, and the potential level of the second bias voltage is determined according to the value, and the potential level of the second output voltage is the second bias voltage. A second bias determination unit that varies according to the potential level of the voltage;
A second level for adjusting a potential level of the second voltage in response to the temperature code or the temperature control code, and determining a potential level of the second voltage according to the first bias voltage and the second bias voltage. The temperature information output device for a semiconductor element according to claim 3, further comprising: a voltage determination unit. The first bias determination unit is
A first current mirror circuit that varies the potential level of the first output voltage in response to the potential level of the first bias voltage;
A first comparator that compares the potential level of the first output voltage with the potential level of the minimum variation voltage and varies the potential level of the first bias voltage according to the value. Item 9. The semiconductor device temperature information output device according to Item 8. The second bias determining unit;
A second current mirror circuit that varies the potential level of the second output voltage in response to the potential level of the second bias voltage;
A second comparator that compares the potential level of the second output voltage with the potential level of the maximum variation voltage and varies the potential level of the second bias voltage according to the value. Item 9. The semiconductor device temperature information output device according to Item 8. The second voltage determining unit is
A third current that adjusts the potential level of the second voltage in response to the temperature code or the temperature control code within a variable potential level determined according to the first bias voltage and the second bias voltage. 9. The temperature information output device for a semiconductor device according to claim 8, further comprising a mirror circuit. The comparison unit is
A voltage comparison unit that outputs a code control signal in response to a value obtained by comparing the potential level of the first voltage and the potential level of the second voltage;
The temperature information output of a semiconductor device according to claim 3, further comprising: a code counter unit that outputs an adjustment code by decreasing or increasing a digital code value set in response to the code control signal. apparatus. A temperature sensing unit that varies and outputs the potential level of the first voltage in response to a change in temperature;
In response to a value obtained by comparing the first voltage with the potential level of the second voltage, the set digital code value is changed and output as the first adjustment code in the first test mode, or in the second test mode A comparator that outputs as a temperature information code;
Responsive to the first adjustment code during the first test mode, or in response to a second adjustment code set during the second test mode, the potential level at which the second voltage can vary to the maximum and the minimum A potential level adjusting unit that determines a potential level that can be changed, and adjusts and outputs the potential level of the second voltage accordingly;
A decode selection unit that decodes the temperature code set in the first test mode, or selects and decodes the temperature information code in the second test mode and outputs it as a temperature control code. A temperature information output device for semiconductor elements. The potential level adjuster is
In order to track the first voltage according to a set reference voltage in response to the first adjustment code during a first test mode or in response to the second adjustment code during a second test mode, An adjustment unit that generates a maximum fluctuation voltage having a potential level at which the second voltage can fluctuate to the maximum and a minimum fluctuation voltage having a potential level at which the second voltage can fluctuate to the minimum;
A digital-analog conversion adjustment in which the potential level of the second voltage is adjusted in response to the temperature control code, and the potential level of the second voltage is adjusted between the minimum potential level and the maximum potential level. The temperature information output device for a semiconductor device according to claim 13, further comprising: The adjustment unit is
A decoding unit that decodes the first adjustment code in the first test mode or decodes the second adjustment code in the second test mode to generate a variation adjustment code;
In response to the fluctuation adjustment code, the potential level of the maximum fluctuation voltage and the minimum fluctuation voltage is adjusted, and the potential adjustment of adjusting the potential level of the distribution voltage corresponding to the potential level of the maximum fluctuation voltage and the minimum fluctuation voltage. And
The temperature information output device for a semiconductor device according to claim 14, further comprising: a comparison control unit that compares the reference voltage and the distribution voltage and controls the potential adjustment unit according to a result of the comparison. The potential adjusting unit is
In response to the output signal of the comparison control unit, an output control unit that controls generation of the maximum variation voltage and the minimum variation voltage;
In response to the variation adjustment code, a variation voltage adjustment unit that adjusts the potential level of the maximum variation voltage and the minimum variation voltage;
The temperature information output device for a semiconductor device according to claim 15, further comprising: a distribution voltage adjustment unit that adjusts a potential level of the distribution voltage corresponding to a potential level of the maximum variation voltage and the minimum variation voltage. . The output control unit is
And a PMOS transistor for controlling connection between the power supply voltage connected to the drain / source path and the fluctuation voltage adjusting unit in response to the output signal of the comparison control unit received by the gate. The temperature information output device for a semiconductor device according to claim 16. The variable voltage adjustment unit is
A plurality of resistors connected in series;
The temperature information output device for a semiconductor device according to claim 16, further comprising: a plurality of switching units that are on / off controlled in response to the fluctuation adjustment code and that are connected in parallel with the plurality of resistors in a one-to-one relationship. . The digital-analog conversion adjustment unit is
The potential level of the first output voltage is compared with the potential level of the minimum fluctuation voltage, the potential level of the first bias voltage is determined according to the value, and the potential level of the first output voltage is the first bias voltage. A first bias determining unit that varies according to the potential level of the voltage;
The potential level of the second output voltage is compared with the potential level of the maximum fluctuation voltage, and the potential level of the second bias voltage is determined according to the value, and the potential level of the second output voltage is the second bias voltage. A second bias determination unit that varies according to the potential level of the voltage;
A second voltage determining unit that adjusts a potential level of the second voltage in response to the temperature control code and determines a potential level that can be varied according to the first bias voltage and the second bias voltage. The temperature information output device for a semiconductor device according to claim 14. The first bias determination unit is
A first current mirror circuit that varies the potential level of the first output voltage in response to the potential level of the first bias voltage;
A first comparator that compares the potential level of the first output voltage with the potential level of the minimum variation voltage and varies the potential level of the first bias voltage according to the value. Item 20. A temperature information output device for a semiconductor device according to Item 19. The second bias determining unit;
A second current mirror circuit that varies the potential level of the second output voltage in response to the potential level of the second bias voltage;
20. A second comparator that compares the potential level of the second output voltage with the maximum potential level and varies the potential level of the second bias voltage according to the value. The temperature information output device of the described semiconductor element. The second voltage determining unit is
A third current mirror circuit for adjusting a potential level of the second voltage in response to the temperature control code within a variable potential level determined according to the first bias voltage and the second bias voltage; 20. The temperature information output device for a semiconductor device according to claim 19, further comprising: The comparison unit is
A voltage comparison unit that outputs a code control signal in response to a value obtained by comparing the potential level of the first voltage and the potential level of the second voltage;
A code output as a first adjustment code in the first test mode or a temperature information code in the second test mode by decreasing or increasing the set digital code value in response to the code control signal The temperature information output device for a semiconductor device according to claim 13, further comprising: a counter unit. The decode selection unit
In response to a selection signal, a multiplex unit that selects and outputs either a set temperature code or the temperature information code; and
In response to the selection signal, the demultiplexer outputs the first adjustment code to the potential level adjustment unit in the first test mode, or outputs the temperature information code to the multiplex unit in the second test mode. And
The temperature information output device for a semiconductor device according to claim 13, further comprising: a decoding unit that decodes a code output from the multiplexing unit and outputs the decoded code as the temperature control code. The selection signal is
25. The temperature information output apparatus for a semiconductor device according to claim 24, wherein the temperature information output apparatus is active during the first test mode and inactive during the second test mode. A first step of changing and outputting the potential level of the first voltage in response to a value sensed to change the temperature;
A second step of comparing the potential level of the first voltage with the potential level of the second voltage, and increasing or decreasing a digital code value set in response to the value to output as an adjustment code;
In response to the adjustment code, a third step of generating a maximum variation voltage having a potential level at which the second voltage can vary to a maximum and a minimum variation voltage having a potential level at which the second voltage can vary to a minimum;
And a fourth step of varying the potential level of the second voltage so that the potential level of the second voltage becomes equal to the potential level of the first voltage according to the maximum variation voltage and the minimum variation voltage. A method for outputting temperature information of a semiconductor device. Between the first step and the second step,
27. The method according to claim 26, further comprising determining and outputting an initial potential level of the second voltage in response to a code obtained by decoding the set temperature code.   28. The method according to claim 27, wherein the second to fourth steps are repeated until the first voltage and the second voltage are at the same potential level.

Images