JP2007327799A - Energization test system of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an energization test device which is free from accumulating static electricity for solving the problem that the energization testing board is electrified if the static electricity is stored with static electricity, the electronic component is insulation broken by the electrostatic discharge (ESD) at the time of attaching/releasing to/from the socket, where the performance test for the electronic components is performed in the thermostatic chamber under high and/or low temperatue while mounting the electronic components on the energization test board. <P>SOLUTION: The energization test board is provided while being in contact with an insertion opening so as to seal the communication of air, and comprising a sealing part which is in contact with the inserting port of the thermostatic chamber is conductive, and a socket part supported by the tip of the sealing part and mounting a plurality of electronic components. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor device and an energization test apparatus for performing a performance confirmation test in a high-temperature and low-temperature atmosphere in a thermostatic chamber by mounting an electronic component having a circuit configuration such as a resistor or a capacitor component on the semiconductor device on an energization board. In particular, the present invention relates to a current-carrying test apparatus for an electronic component including a current-carrying board having a configuration that suppresses dielectric breakdown of the electronic component due to electrostatic discharge of the current-carrying board.

  A performance test of an electronic component including a semiconductor device is usually performed in a thermostatic chamber at a high or low temperature after the electronic component is mounted on a socket of a dedicated board. When an electronic component is mounted on or removed from the socket, if the current-carrying board is charged, the electronic component may be broken down by electrostatic discharge (ESD) or may be potentially damaged.

  Until recently, electronic components including conventional semiconductor devices have a relatively strong dielectric strength, and thus electrostatic discharge (ESD) problems that occur when an electronic component is attached to and detached from a current-carrying board have not been significant. However, with the miniaturization and high integration of semiconductor devices over the past few years, the dielectric breakdown phenomenon due to ESD during the attachment / detachment work has become significant. As a result of earnestly pursuing the mechanism by which the energizing board is charged, the inventor is in contact with the resin-sealed portion of the energizing board and the energizing board insertion port of the thermostat described in detail later when the energizing board is attached to or detached from the thermostat. As a result, it was found that contact frictional charge was generated, and ESD was generated in an electronic component provided on the current-carrying board by induction charging from the contact frictional charge. There is an urgent need to develop an electrical component testing apparatus that prevents dielectric breakdown due to ESD when the electronic component is attached to and detached from the socket due to such charging.

  In order to prevent dielectric breakdown due to electrostatic discharge (ESD), as a conventional burn-in method for a semiconductor device, a plurality of pattern wirings provided on a substrate of a burn-in board corresponding to a plurality of electrodes of the semiconductor device, and a plurality of pattern wirings Corresponding to the process of electrically connecting a plurality of terminals that are short-circuited and grounded to each other, and a plurality of pattern wirings of the burn-in board and a plurality of terminals of the connector The process of attaching the semiconductor device to the socket provided on the substrate and electrically connected to the plurality of pattern wirings after removing charges charged on the substrate by connecting, and the plurality of pattern wirings on the burn-in board A process of performing burn-in of a semiconductor device after separating a plurality of terminals of a connector is disclosed (for example, Patent Document 1).

JP-A-2005-024334

  However, the burn-in method disclosed in Patent Document 1 is based on the technical idea of removing the electric charge charged on the substrate of the burn-in board by electrically connecting the pattern wiring on the substrate and the short-circuit connector terminal. The semiconductor device is mounted on the socket after the electric charge charged on the substrate is removed to the ground end. However, this Patent Document 1 only describes the burn-in test of one semiconductor device. This method is not applicable to a mass production system in which semiconductor devices are burned in at the same time. Further, there is no description about the electric resistance of the substrate material, and there is a problem that the charged electric charge does not always escape to the ground depending on the material and dimensions of the substrate.

  The present invention has been made to solve the above-described problems, and eliminates static electricity caused by frictional charging caused by contact between the energization board sealing portion and the energization board insertion port of the thermostatic bath. Provided is an electronic component energization test apparatus capable of

  The present invention is an electronic component energization test apparatus in which an energization board loaded with electronic components is mounted in a thermostatic bath for testing, and the energization board is installed in the thermostatic bath so as to seal the ventilation into and out of the thermostatic bath. A sealing portion that is provided in contact with the insertion port and that is in contact with the insertion port of the thermostatic chamber is electrically conductive, and a socket portion that is supported by the tip of the sealing portion and on which a plurality of electronic components are mounted. It is equipped with.

  An electrical component energization test apparatus according to the present invention is provided on an energization board on which an electronic component is mounted so as to be in contact with an insertion port of a thermostat so as to seal the ventilation into and out of the thermostat, and the thermostat is inserted. An ESD when removing an electronic component from the socket because the portion that contacts the mouth is provided with a conductive sealing portion and a socket portion that is supported by the tip of the sealing portion and on which a plurality of electronic components are mounted. In such a case, it is possible to prevent the dielectric breakdown of the electronic components and to improve the yield as a result.

Embodiment 1 FIG.
Hereinafter, the first embodiment will be described with reference to the drawings.
FIG. 1A is an explanatory view showing a cross section of an electrical component current test apparatus 100, and FIG. 1B is a plan explanatory view thereof.
As shown in FIG. 1A, an electronic component current test apparatus 100 includes a thermostatic chamber 1 and an energization board 200 attached to the insertion port 2 of the thermostatic chamber 1. As shown in FIG. 1 (b), the energization board 200 is in contact with the insertion port 2, and a sealing portion 5 formed of a conductive resin that seals ventilation into and out of the thermostat 1, and a rear portion of the sealing portion 5 And a handle 7 formed of a conductive material electrically connected to the sealing portion 5 and further supported by the tip of the sealing portion 5 and a semiconductor device, A socket portion 4 on which a plurality of electronic components 3 each composed of a resistor or a capacitor can be mounted on the semiconductor device, a terminal of the electronic component 3 provided on the socket portion 4, and an electronic component characteristic evaluation device (not shown) are electrically connected. Insulating cable 8 to be connected is used as a component.

An electronic component energization and electrical property evaluation test using the electronic component energization test apparatus 100 having the above-described configuration and a mechanism of static electricity generation before and after that will be described.
The electronic components 3 are arranged in the socket portion 4 of the energization board 200 and the electrical characteristics are measured in the energization test apparatus 100. In order to perform the acceleration test, the energization test apparatus 100 has a function that allows the temperature-controlled bath 1 to change in temperature from −40 ° C. to around 200 ° C. In order to maintain the temperature of the thermostat 1 with high accuracy and improve workability, the energization test apparatus 100 is connected to the outside air by attaching the sealing portion 5 of the energization board 200 in close contact with the insertion port 2. The ventilation is sealed.

  The electricity board 200 can be attached to and detached from the thermostat 1 by inserting / removing the current carrying board 200 through the insertion port 2 of the thermostat 1. Here, in a state where the energization board 200 is attached to the thermostat 1, the sealing portion 5 is in close contact with the insertion port 2. Therefore, when the energization board 200 is detached from the thermostat 1, the sealing portion 5 and the insertion port 2 are separated. By friction, they are triboelectrically charged to different polarities.

The state of occurrence of electrostatic discharge will be described with reference to FIG.
FIG. 2 is an image diagram illustrating electrostatic discharge when the electronic component 3 to be inspected is installed in the socket part 4 of the energization board 200. Although the present invention is provided with a structure that is not charged, here, description will be made in the state of being temporarily charged (FIG. 2).
The encapsulating part 5 of the energizing board 200 taken out from the thermostat 1 is in a charged state due to friction with the insertion slot 2.
The energizing board 200 is placed on the work table 14 and the grounded worker 9 uses the tweezers 13 to install the electronic component 3 in the socket 4 of the energizing board 200. At this time, the electronic component 3 includes the tweezers 13, the human body. 9. Grounded via wrist strap 10. At this time, if the sealing portion 5 is kept charged, when the electronic component 3 is installed in the socket portion 4 by dielectric charging, electrostatic discharge may occur through the tweezers 13 and the electronic component 3 may be destroyed. is there.
In addition, although the above described the case where the electronic component 3 was mounted on the socket part 4 after the unloaded energization board 200 of the electronic component 3 was taken out from the thermostat 1, the energized electrical property test was completed in the thermostat 1 Similarly, when the electronic component 3 is taken out from the socket portion 4, electrostatic discharge occurs.
Although the electronic component 3 is grasped using the tweezers 13, the electronic component 3 is a small component having a diameter of about 2 mm. Depending on the size of the electronic component 3, the tweezers 13 is made of metal.

The above has described the mechanism of electrostatic discharge (ESD) generation.
However, as shown in FIG. 3, the energizing board 200 constituting the electronic device energizing apparatus 100 having the configuration according to the first embodiment has the sealing portion 5 formed of the conductive resin 50. Even when the sealing portion 5 is charged by contact friction with the insertion opening 2 when taken out from the tank 1, the surface of the conductive resin 50 is immediately discharged. Therefore, occurrence of ESD in the electronic component 3 is suppressed.

  When the sealing portion 5 formed of the conductive resin 50 is taken out from the insertion port 2 of the thermostatic chamber 1, static electricity due to frictional charging is immediately removed, and the surface of the conductive resin 50 does not become a high potential. Possible reasons are as follows. The first reason is that an object with low electrical resistance, such as a metal or a conductive material, spreads the charged charge uniformly so that the metal or the conductive material instantaneously becomes equipotential even if static electricity occurs. is there. Further, if there is a path through which the charged charge can move as much as possible, static electricity is gradually relieved through this path. In this system, the charge generated in the conductive sealing portion 5 spreads uniformly on the equipotential surface, and also spreads to a constant temperature bath or a conductive material (such as a handle or a human body) having a low electrical resistance. The potential does not increase.

  The second reason is that when the electric field around the charged object is increased, discharge is generated and the charged charge is relaxed. In this system, when the conductive sealing part 5 leaves the thermostat 1, corona discharge occurs, and the charged charge on the surface of the conductive sealing part 5 may easily escape into the air. When the sealing portion 5 is an insulator, the charged charge remains in place after the discharge. However, when the surface of the sealing portion 5 is made of a conductive material, almost all the charged charges are relaxed. For this reason, it is considered that static electricity generated by a conductive material that is not grounded is discharged into the air instantaneously or discharged through a grounding path. In addition, it is clear from the fact that it is difficult to actually measure the charged charges generated on the surface of the conductive material because it is very difficult to maintain the charged charges generated on the surface of the conductive material. It is.

Thus, since the sealing part 5 which formed the part which contact | connects the insertion port 2 of the thermostat 1 with the conductive resin 50 was provided, the static electricity which generate | occur | produced on the surface of the sealing part 5 does not accumulate | store, and an electronic component ESD does not occur when 3 is removed from the socket 4, and the dielectric breakdown of the electronic component 3 can be prevented, thereby improving the yield. It is desirable to use an electrostatic diffusion material having a resistance value of 10 ¹⁰ Ω · m or less as the conductive material 50 of the sealing portion 5. For example, a Teflon (registered trademark) material containing carbon or a polyethylene material is applied.

Embodiment 2. FIG.
Next, the structure of the sealing portion 5a of the energization board 200 according to Embodiment 2 will be described with reference to FIG.
The sealing portion 5a is formed of a non-conductive resin material 51 such as urethane, Teflon (registered trademark), polyethylene, and the like, and is in contact with the insertion port 2 of the thermostatic bath 1 in a metal such as copper or aluminum. A thin plate 11 is provided. The thickness of the metal thin plate is 0.05 mm or more to ensure wear resistance. By adopting the sealing portion 5a having such a configuration, an inexpensive resin material can be used and the thin metal plate 11 is provided, so that ESD occurs in the electronic component 3 as described in the first embodiment. Absent.

Embodiment 3 FIG.
The third embodiment includes a sealing portion 5b as shown in FIG. That is, it is formed of a non-conductive resin material 51 similar to that of the second embodiment, and at least a portion of the surface that is in contact with the insertion port 2 of the thermostatic chamber 1 is covered with the conductive heat-shrinkable tube 52. .
By adopting such a configuration, an inexpensive resin material can be used and the conductive heat-shrinkable tube 52 is provided, so that ESD does not occur in the electronic component 3 as described in the first embodiment.

Embodiment 4 FIG.
The fourth embodiment includes a sealing portion 5c having either a conductive resin material 50 or a non-conductive resin material 51 as shown in FIG. That is, the resin material of the sealing portion 5c is made of the same material as the non-conductive resin material such as urethane, Teflon (registered trademark), polyethylene, or the like, or the conductive resin material containing carbon, which is used for the insertion port 2 of the thermostatic chamber 1. Used to form.
Thus, since the insertion port 2 and the sealing portion 5c are made of the same material, the electrical characteristics are the same, and static electricity due to contact charging or frictional charging is unlikely to occur.
Further, instead of using the same material as described above, materials of the order closer to the charged column may be combined. For example, if polyethylene is applied to the insertion slot 2, the use of polypropylene or vinyl chloride from the charged train shown in FIG. 7 for the sealing portion 5c reduces the generation of static electricity and causes ESD to the electronic component 3. Absent.

Embodiment 5 FIG.
Next, the structure of the thermostat 1a according to Embodiment 5 is shown. In the first to fourth embodiments, the case where the surface of the sealing portion 5 is made conductive to suppress the accumulation of static electricity has been described. In the present embodiment, the conductive sealing portion 5 is grounded. The case where static electricity is further eliminated will be described.
In FIG. 8, the insertion port 2a of the thermostatic chamber 1a is provided with a grounding setting portion 2b made of a conductive resin or a metallic material at a portion where the sealing portion 5 described in the first to fourth embodiments contacts. In addition, the ground setting unit 2b is grounded.
Since the thermostat 1a is grounded in this way, the thermostat 1a is prevented from being charged due to contact friction with the sealing portion 5 of the energizing board 200, and as a result, the sealing portion 5 is not charged. Therefore, the electronic component energization test apparatus including the thermostat 1a having such a configuration does not cause ESD to the electronic component.
8 shows an example in which the ground setting portion 2b is provided in the outer portion of the insertion port 2a, the ground setting portion 2b may be provided over the entire surface of the portion of the insertion port 2a that is in contact with the sealing portion.

Embodiment 6 FIG.
As shown in FIG. 3, the energizing board 200 constituting the energizing apparatus 100 for an electronic component having the configuration according to the sixth embodiment has a sealing portion 5 formed of a conductive resin 50, and the energizing board 200 is connected to the thermostatic chamber 1. When the sealing portion 5 is charged by contact friction with the insertion port 2 when taking out from the operator, the worker 9 which is the energizing board attaching / detaching functional body works with the handle 7 formed of a conductive material. The charged static electricity escapes to the ground and the sealing portion 5 is not in a charged state. Therefore, occurrence of ESD in the electronic component 3 is suppressed.
It is desirable to use an electrostatic diffusion material having a resistance value of 10 ¹⁰ Ω · m or less as the conductive material 50 of the sealing portion 5. For example, a Teflon (registered trademark) material containing carbon or a polyethylene material is applied.
The energizing board attaching / detaching function body is an example of the worker 9. However, the energizing board attaching / detaching function body may be a robot, and the robot is configured to remove the static electricity charged in the sealing portion 5 and the socket portion 4 connected thereto. When the body comes into contact with the handle 7 for attaching / detaching the energizing board 200, static electricity can be leaked to the ground side. The handle 7 may be a metallic material.

  Embodiments 1 to 6 of the present invention can be used for a current test apparatus for electronic parts including a semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram of an electronic component energization test apparatus according to Embodiment 1 of the present invention; It is a figure explaining the electrostatic discharge of this invention. It is a figure which shows the electricity supply board of Embodiment 1 and Embodiment 6 of this invention. It is a figure which shows the electricity supply board of Embodiment 2 of this invention. It is a figure which shows the electricity supply board of Embodiment 3 of this invention. It is a figure which shows the electricity supply board of Embodiment 4 of this invention. FIG. 6 is a charged row diagram of materials for explaining Embodiment 4 of the present invention. It is explanatory drawing of the electricity supply test apparatus of the electronic component of Embodiment 5 of this invention.

Explanation of symbols

1 temperature chamber, 2 insertion slot, 3 electronic parts, 4 socket part,
5, 5a, 5b, 5c Sealing part, 7 Handle, 9 Current-carrying board attaching / detaching functional body (worker),
50 conductive resin material, 51 non-conductive resin material, 52 conductive heat shrinkable tube,
100 Electronic component energization test equipment, 200 energization board.

Claims (7)

An electronic component energization test device for testing by attaching an energization board carrying electronic components to a thermostatic chamber,
The energization board is provided in contact with the insertion port of the thermostat bath so as to seal the ventilation to the inside and outside of the thermostat bath, and a portion that is in contact with the insertion port of the thermostat bath is conductive. An electronic component energization test apparatus, comprising: a socket portion which is supported at the tip of the sealing portion and mounts a plurality of the electronic components. 2. The electronic component energization test apparatus according to claim 1, wherein the sealing portion is formed of a conductive resin. 2. The metal thin plate is provided in the part which the said sealing part is formed with nonelectroconductive resin, and the part which contact | connects the insertion port of the said thermostat of the said sealing part is characterized by the above-mentioned. Electric parts testing equipment. The said sealing part is formed with a nonelectroconductive resin, and has covered the part which contact | connects the insertion port of the said thermostat of the said sealing part with the electroconductive heat shrinkable tube. Electric parts testing equipment. The material forming the sealing portion is the same material as the material of the portion of the thermostatic chamber that is in contact with the sealing portion, or a material close to a charged column. Item 2. An electrical component electrical testing apparatus according to Item 1. The energization test of the electronic component according to claim 1, wherein a material of a portion of the thermostatic chamber that is in contact with the sealing portion is formed of a conductive resin or a metallic material and is grounded. apparatus. The electron according to any one of claims 1 to 6, wherein when the energizing board is attached to and detached from the thermostat, the static electricity charged in the energizing board is removed by grounding the sealing portion. Electrical test equipment for parts.

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