JP2007324366A - Storage container, and storage method of interlayer paper and semiconductor wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the storage container and the storage method of an interlayer paper and a semiconductor wafer, which can prevent slippage of rotation between the semiconductor wafer and the interlayer paper during semiconductor wafer transport. <P>SOLUTION: A protrusion 16 is provided, which can be interfolded toward interior from its perimeter, when a semiconductor wafer 13 is superimposed on an interlayer paper 14. When piling up the semiconductor wafer 13 via the interlayer paper 14, by folding the protrusion 16 of the interlayer paper according to the perimeter of the semiconductor wafer 13, by the protrusion 16 of the interlayer paper, the contact area between the semiconductor wafer 13 and the interlayer paper 14 can be increased, by making it possible to prevent slippage of rotation of the both during storage container transport. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an interlayer paper mainly used for transporting and storing a disk-shaped semiconductor wafer, a semiconductor wafer storage container, and a storage method.

In recent years, globalization has also progressed in the semiconductor manufacturing field, and the transportation of semiconductor wafers not only in Japan but also overseas has become active.
Generally, semiconductor wafer stacking type storage containers with good storage efficiency are often used for transporting semiconductor wafers.

  In this storage container, for example, as disclosed in Patent Document 1, a semiconductor wafer is stacked on an inner bottom surface of a bottomed cylindrical or box-shaped storage container body via an interlayer paper or sponge, and further, By interposing a sponge between the inner surface of the storage container main body, the semiconductor wafer is prevented from cracking or chipping due to impact or vibration during transportation. Such conventional interlayer paper, semiconductor wafer storage container and storage method will be described with reference to FIG.

  FIG. 6A is a plan view for explaining the configuration of a conventional interlayer paper, and FIG. 6B is a diagram for explaining a conventional semiconductor wafer storage container and storage method using a bottomed cylindrical storage container. FIG. 5 is a perspective view of the semiconductor wafer stored in the storage container via the interlayer paper.

  As shown in FIG. 6A, the interlayer paper 14 is set to be the same size or slightly larger than the outer shape of the semiconductor wafer 13, and when the semiconductor wafer 13 is stacked in the storage container main body 11, the surface of the wafer is scratched. Prevents you from shaking.

Next, a conventional method for storing a semiconductor wafer in a storage container will be described.
As shown in FIG. 6B, a shock absorbing sponge 15 is accommodated on the inner bottom surface of the bottomed cylindrical storage container body 11, and a plurality of (for example, 25 or 50) semiconductor wafers are provided thereon. Each of the sheets 13 is stored through the interlayer paper 14 with the surface thereof facing down. Finally, the sponges 15 are stacked, and the upper lid 12 is stacked thereon.

This storage method increases the storage efficiency of the semiconductor wafer.
Special table 2005-508805 gazette

  However, in the conventional semiconductor wafer storage container and its storage method, as shown in FIG. 6C, the semiconductor wafer 13 and the interlayer paper 14 stored by vibration during transportation are rotated together. Further, at this time, a rotation amount shift occurs between the relatively heavy semiconductor wafer 13 and the light interlayer paper 14, and the interlayer paper 14 is rubbed on the surface of the semiconductor wafer 13. There was a problem that the surface was scraped off by friction and adhered to the surface of the semiconductor wafer 13 as a foreign matter or a scratch was generated.

  Further, even if the semiconductor wafer 13 having the same outer size is not subjected to the back surface grinding, the thickness is large, that is, the weight is large, and the outer peripheral portion is chamfered without standing, so that the inner surface of the storage container body 11 is chamfered. The coefficient of friction between them is small and it is easy to rotate during transportation.

  In particular, in recent years, the diameter of the semiconductor wafer 13 has been increased (production shift from 200 mm diameter to 300 mm diameter), and the weight difference between the semiconductor wafer 13 and the interlayer paper 14 has increased, and this problem has become prominent.

  Accordingly, the present invention provides an interlayer paper, a semiconductor wafer storage container, and a semiconductor that can prevent a rotation deviation between the semiconductor wafer and the interlayer paper during transportation of the semiconductor wafer or can suppress the rotation of the semiconductor wafer itself in the storage container. The object is to provide a method for storing a wafer.

  In order to achieve the above-mentioned object, the interlayer paper of the present invention has a convex portion that can be folded inward from the outer periphery when the semiconductor wafers are stacked, The storage device and the storage method are characterized in that when the semiconductor wafers are stacked via the interlayer paper, the convex portions of the interlayer paper are bent along the outer periphery of the semiconductor wafer. The convex portion of the interlayer paper increases the contact area between the semiconductor wafer and the interlayer paper, and prevents the rotation of both during transport of the storage container.

  Further, the interlayer paper of the present invention is characterized in that a part of the outer peripheral portion is provided with a notch or a cut in accordance with the shape of the orientation flat of the semiconductor wafer. When the sheets are stacked via the interlayer paper, a notch provided in a part of the outer peripheral portion of the interlayer paper is bent in accordance with a notch or an orientation flat of the outer peripheral portion of the semiconductor wafer. The notch provided in a part of the outer peripheral portion of the interlayer paper prevents the rotation of the two during rotation of the storage container.

  In addition, the interlayer paper of the present invention is characterized in that a part thereof is cut out to form a slit or the like, and the semiconductor wafer storage device and storage method of the present invention stack the semiconductor wafers via the interlayer paper. It is characterized by. Since a part of the inside of the interlayer paper is cut off, the frictional resistance between the semiconductor wafer and the interlayer paper is increased, and the rotation of both during the storage container transportation is prevented.

  The semiconductor wafer storage apparatus and storage method according to the present invention is characterized in that a buffer paper having a bellows-like fold is inserted between the inner surface of the storage container main body and the outer periphery of the semiconductor wafer when the semiconductor wafer is stored. The frictional resistance between the inner surface of the storage container main body and the semiconductor wafer is increased by the bellows-shaped buffer paper, and the rotation of the semiconductor wafer itself during transport of the storage container is suppressed.

  Further, the semiconductor wafer storage container of the present invention has a convex portion that matches the notch or orientation flat shape of the semiconductor wafer on a part of the inner surface of the storage container body, and the semiconductor wafer notch or part of the inner surface of the interlayer paper. The semiconductor wafer storage method of the present invention is characterized in that a notch or orientation flat of the semiconductor wafer and the interlayer paper are provided on the convex portion of the storage container body when the semiconductor wafer is stored. It is characterized by matching notches. As a result, rotation of the semiconductor wafer itself during transport of the storage container is suppressed.

  According to the present invention, it is possible to prevent the rotation of the rotation amount of the semiconductor wafer and the interlayer paper stored due to vibration or the like during transportation of the semiconductor wafer or to suppress the rotation of the semiconductor wafer itself in the storage container, and thus to the semiconductor wafer surface. It is possible to suppress adhesion of debris of the interlayer paper to the surface of the semiconductor wafer and scratches on the surface of the semiconductor wafer due to interlayer paper rubbing.

  This eliminates the need for a cleaning process on the surface of the semiconductor wafer after transportation, thereby simplifying the manufacturing process and improving the manufacturing yield and reliability when the semiconductor wafer is separated into semiconductor devices.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same components as those of the conventional semiconductor wafer storage container shown in FIG.
[Embodiment 1]
FIGS. 1A and 1B are plan views for explaining the configuration of the interlayer paper according to Embodiment 1 of the present invention. FIG. 1C is a perspective view for explaining the storage container and the storage method of the semiconductor wafer according to Embodiment 1 of the present invention using a bottomed cylindrical storage container. The form accommodated in a storage container via is shown.

  As shown in FIG. 1A, the interlayer paper 14 has substantially the same outer size as the semiconductor wafer 13, and has a plurality of convex portions 16 (two in this case) on the outer peripheral portion. The convex portion 16 has a length sufficient to be folded up from the outer periphery to the inside of the semiconductor wafer 13 when the semiconductor wafer 13 is placed thereon. In addition, the quantity and shape of the convex part 16 of the interlayer paper 14 are not limited as shown to Fig.1 (a) (b).

Next, a method for housing a semiconductor wafer in the first embodiment will be described.
As shown in FIG. 1 (c), a shock absorbing sponge 15 is accommodated on the inner bottom surface of a bottomed cylindrical storage container body 11, and a plurality of (for example, 25 or 50) semiconductor wafers are provided thereon. Each of the sheets 13 is stored through the interlayer paper 14 with the surface thereof facing down. At that time, the convex portion 16 of the interlayer paper 14 protruding from the outer periphery of the semiconductor wafer 13 is folded inward with the semiconductor wafer 13 superimposed thereon. Finally, the sponge 15 is stacked, and the upper lid 12 is further stacked thereon.

As described above, the convex portion 16 is provided on the outer peripheral portion of the interlayer paper 14, and the convex portion 16 of the interlayer paper 14 is bent inward along the outer periphery of the semiconductor wafer 13 when the semiconductor wafer 13 is accommodated. It is possible to increase the contact area between the two and the rotation of both containers during transport of the storage container. Therefore, it is possible to suppress the residue of the interlayer paper 14 from being attached to the surface of the semiconductor wafer 13 or the surface of the semiconductor wafer 13 from being damaged by rubbing the surface of the semiconductor wafer 13. This eliminates the need for a cleaning process on the surface of the semiconductor wafer 13 after transportation, thereby simplifying the manufacturing process and improving the manufacturing yield and reliability when the semiconductor wafer 13 is separated into semiconductor devices. realizable.
[Embodiment 2]
FIG. 2A is a plan view and a front view for explaining the configuration of the interlayer paper according to Embodiment 2 of the present invention. FIG. 2 (b) is a perspective view for explaining a semiconductor wafer storage container and storage method in Embodiment 2 of the present invention using a bottomed cylindrical storage container. The form stored in the storage container is shown.

  As shown in FIG. 2A, the interlayer paper 14 has substantially the same outer size as that of the semiconductor wafer 13, and a cut 21 is provided in a part of the outer peripheral portion. The position of the notch 21 is set to a dimension that can be folded upward from the notch 22 of the semiconductor wafer 13 when the semiconductor wafer 13 is placed thereon. The notch 21 of the interlayer paper 14 may be any shape and size that can be folded upward from the notch 22 of the semiconductor wafer 13 in accordance with the shape of the notch 22 of the semiconductor wafer 13 as shown in FIG. It is not limited to things.

Next, a method for housing a semiconductor wafer in the second embodiment will be described.
As shown in FIG. 2B, a shock absorbing sponge 15 is accommodated on the inner bottom surface of the bottomed cylindrical storage container body 11, and a plurality of (for example, 25 or 50) semiconductor wafers are provided thereon. Each of the sheets 13 is stored with the notch 21 folded through the interlayer paper 14. At that time, the notch 22 and the notched portion 21 of the interlayer paper 14 are aligned with each other in a state where the semiconductor wafer 13 is overlaid. Finally, the sponge 15 is stacked, and the upper lid 12 is further stacked thereon.

In this way, the notch 21 is provided in the outer peripheral portion of the interlayer paper 14, the notch 21 of the interlayer paper 14 is bent when the semiconductor wafer is stored, and is aligned with the notch 22 in the outer peripheral portion of the semiconductor wafer. Misalignment can be prevented. Therefore, it is possible to suppress the residue of the interlayer paper 14 from being attached to the surface of the semiconductor wafer 13 or the surface of the semiconductor wafer 13 from being damaged by rubbing the surface of the semiconductor wafer 13. This eliminates the need for a cleaning process on the surface of the semiconductor wafer 13 after transportation, thereby simplifying the manufacturing process and improving the manufacturing yield and reliability when the semiconductor wafer 13 is separated into semiconductor devices. realizable.
[Embodiment 3]
3 (a) and 3 (b) are plan views for explaining the configuration of the interlayer paper according to Embodiment 3 of the present invention. FIG. 3C is a perspective view for explaining the semiconductor wafer storage container and storage method in Embodiment 3 of the present invention using a bottomed cylindrical storage container. The semiconductor wafer is interposed between the interlayer papers. The form stored in the storage container is shown.

  As shown in FIG. 3A, the interlayer paper 14 has substantially the same outer size as the semiconductor wafer 13, and a part of the inner paper 14 is cut out in a slit shape to form a slit 31. In this case, the slit 31 is set to a size, shape, and position so as not to impair the function as the interlayer paper 14 such as tearing or bending. Moreover, when the shape of the slit 31 of the interlayer paper 14 is laminated, it is necessary to consider that the surface of the semiconductor wafer 13 does not contact the back surface of the lower semiconductor wafer 13. The slit shape of the interlayer paper 14 shown in FIG. 3 (a) may be a lattice shape or a mesh shape as shown in FIG. 3 (b).

Next, a method for housing a semiconductor wafer in the third embodiment will be described.
As shown in FIG. 3 (c), a shock absorbing sponge 15 is accommodated on the inner bottom surface of the bottomed cylindrical storage container body 11, and a plurality of (for example, 25 or 50) semiconductor wafers are provided thereon. Each of the sheets 13 is stored through the interlayer paper 14 with the surface thereof facing down. Finally, the sponge 15 is stacked and the upper lid 12 is stacked thereon.

In this way, a part of the interior of the interlayer paper 14 is cut into a slit shape to form the slit 31 and the semiconductor wafer 13 is stacked, so that the frictional resistance between the semiconductor wafer 13 and the interlayer paper 14 can be increased. In addition, it is possible to prevent the rotation of the two during the storage container transportation. Therefore, it is possible to suppress the residue of the interlayer paper 14 from being attached to the surface of the semiconductor wafer 13 or the surface of the semiconductor wafer 13 from being damaged by rubbing the surface of the semiconductor wafer 13. This eliminates the need for a cleaning process on the surface of the semiconductor wafer 13 after transportation, thereby simplifying the manufacturing process and improving the manufacturing yield and reliability when the semiconductor wafer 13 is separated into semiconductor devices. realizable.
[Embodiment 4]
FIG. 4A is a plan view and a perspective view for explaining the configuration of the buffer paper in Embodiment 4 of the present invention. FIG. 4B is a perspective view for explaining a semiconductor wafer storage container and storage method in Embodiment 4 of the present invention using a bottomed cylindrical storage container. The semiconductor wafer is interposed between interlayer papers. The form stored in the storage container is shown. FIG. 4C is a plan view showing a configuration in which the buffer paper in Embodiment 4 of the present invention is provided in the storage container.

As shown in FIG. 4A, the shock-absorbing paper 41 is bent in a bellows shape, and has a length substantially equal to the outer peripheral length of the semiconductor wafer 13 after the folding.
Next, a method for housing a semiconductor wafer in the fourth embodiment will be described.

  As shown in FIG. 4B, a shock absorbing sponge 15 is accommodated on the inner bottom surface of the bottomed cylindrical storage container body 11, and a plurality of (for example, 25 or 50) semiconductor wafers are provided thereon. Each of the sheets 13 is stored through the interlayer paper 14 with the surface thereof facing down. At this time, as shown in FIG. 4C, the buffer paper 41 is stored in the gap between the outer peripheral portion of the semiconductor wafer 13 and the storage container body 11. At this time, the end portion 42 of the buffer paper 41 is accommodated so as to be aligned with the notch 22 of the semiconductor wafer 13. Finally, the sponge 15 is stacked and the upper lid 12 is stacked thereon. Note that the end portion 42 of the buffer paper 41 does not necessarily need to be stored so as to be aligned with the notch 22, and the bent portion of the buffer paper 41 may be stored so as to be aligned with the notch 22.

Thus, by storing the bellows-shaped buffer paper 41 in the gap between the outer peripheral portion of the semiconductor wafer 13 and the storage container main body 11, the inner surface of the storage container main body 11, and between the semiconductor wafer 13 and the interlayer paper 14 are stored. The frictional resistance can be increased, and the rotation of the semiconductor wafer 13 and the interlayer paper 14 themselves during transport of the storage container can be suppressed. Therefore, it is possible to suppress the residue of the interlayer paper 14 from being attached to the surface of the semiconductor wafer 13 or the surface of the semiconductor wafer 13 from being damaged by rubbing the surface of the semiconductor wafer 13. This eliminates the need for a cleaning process on the surface of the semiconductor wafer 13 after transportation, thereby simplifying the manufacturing process and improving the manufacturing yield and reliability when the semiconductor wafer 13 is separated into semiconductor devices. realizable.
[Embodiment 5]
FIG. 5 (a) is a plan view and perspective view for explaining the configuration of the storage container main body according to Embodiment 5 of the present invention, and FIG. 5 (b) is a plan view of the interlayer paper, and FIG. ) Is a perspective view of the storage container body. FIG. 5D is a perspective view for explaining a semiconductor wafer storage container and storage method in Embodiment 5 of the present invention using a bottomed cylindrical storage container. The semiconductor wafer is interposed between interlayer papers. The form stored in the storage container is shown.

  As shown in FIG. 5A, an inner surface convex portion (protrusion) 52 that matches the shape of the notch 22 of the semiconductor wafer 13 is provided on a part of the inner surface of the storage container body 11. Further, as shown in FIG. 5B, a notch 51 is provided on the outer peripheral portion of the interlayer paper 14 in accordance with the shape of the notch 22 of the semiconductor wafer.

Next, a method for housing a semiconductor wafer in the fifth embodiment will be described.
As shown in FIG. 5 (d), a shock absorbing sponge 15 is accommodated on the inner bottom surface of a bottomed cylindrical storage container body 11, and a plurality of (for example, 25 or 50) semiconductor wafers are accommodated thereon. Each of the sheets 13 is stored through the interlayer paper 14 with the surface thereof facing down. At that time, the notch 22 of the semiconductor wafer 13 and the notch 51 of the interlayer paper 14 are stored so as to fit the inner surface convex portion 52 of the storage container body 11. Finally, the sponge 15 is stacked and the upper lid 12 is stacked thereon.

  As described above, the inner convex portion 52 is provided in the storage container body 11, the notch 51 is provided in a part of the inner surface of the interlayer paper 14, and the notch 22 of the semiconductor wafer 13 and the notch of the interlayer paper 14 are provided in the storage container body 11. By storing 51 so as to fit the inner surface convex portion 52 of the storage container main body 11, rotation of the semiconductor wafer 13 and the interlayer paper 14 themselves during transport of the storage container can be suppressed. Therefore, it is possible to suppress the residue of the interlayer paper 14 from being attached to the surface of the semiconductor wafer 13 or the surface of the semiconductor wafer 13 from being damaged by rubbing the surface of the semiconductor wafer 13. This eliminates the need for a cleaning process on the surface of the semiconductor wafer 13 after transportation, thereby simplifying the manufacturing process and improving the manufacturing yield and reliability when the semiconductor wafer 13 is separated into semiconductor devices. realizable.

  In the first to fifth embodiments, as the material for the interlayer paper 14 and the buffer paper 41, for example, a plastic sheet such as paper or polyethylene is used. Moreover, as a storage container (storage container main body 11 and upper lid 12), for example, a container made of polypropylene is used. In the first to fifth embodiments, the outer shape of the interlayer paper 14 is substantially the same as the outer shape of the semiconductor wafer 13, but may have a slightly larger outer shape (however, the storage container body 11). It is limited to the size that can be stored in).

  In the first to fifth embodiments, the semiconductor wafer 13 stored in the storage container (the storage container body 11 and the upper lid 12) has a notch, but the semiconductor wafer 13 may have an orientation flat. The same effect can be obtained.

  Moreover, in the said Embodiment 1-Embodiment 5, although the storage container main body 11 is made into the cylindrical shape, it is not restricted to a cylindrical shape, It is good also as a square cylinder shape. At this time, it is preferable that an inner wall matching the outer shape of the semiconductor wafer 13 is provided inside the storage container body 11.

  The interlayer paper, the semiconductor wafer storage container and the storage method according to the present invention are rubbed with the interlayer paper during transportation of a relatively heavy wafer having a large diameter (diameter: 300 mm) and the wafer back surface not ground. This is useful for reducing processes and improving reliability after transportation.

(A) (b) is a top view for demonstrating the structure of the interlayer paper in Embodiment 1 of this invention, (c) is bottomed with the storage container and the storage method of the semiconductor wafer in Embodiment 1 of this invention. It is a perspective view for demonstrating using a cylindrical storage container. (A) is a plan view and a front view for explaining a configuration of an interlayer paper in Embodiment 2 of the present invention, and (b) is a bottom view of a semiconductor wafer storage container and storage method in Embodiment 2 of the present invention. It is a perspective view for demonstrating using a cylindrical storage container. (A) (b) is a top view for demonstrating the structure of the interlayer paper in Embodiment 3 of this invention, (c) is bottomed with the storage container and the storage method of the semiconductor wafer in Embodiment 3 of this invention. It is a perspective view for demonstrating using a cylindrical storage container. (A) is a plan view and a perspective view for explaining the configuration of the buffer paper in the fourth embodiment of the present invention, and (b) is a bottom view of the semiconductor wafer storage container and the storage method in the fourth embodiment of the present invention. The perspective view for demonstrating using a cylindrical storage container, (c) is a top view which shows the structure which provided the buffer paper in Embodiment 4 of this invention in the storage container. (A) is a top view for demonstrating the structure of the storage container main body in Embodiment 5 of this invention, a perspective view, (b) is a plane for demonstrating the structure of the interlayer paper in Embodiment 5 of this invention. FIG. 7C is a perspective view for explaining a semiconductor wafer storage container and storage method in Embodiment 5 of the present invention using a bottomed cylindrical storage container. (A) is a top view for demonstrating the structure of the conventional interlayer paper, (b) is a perspective view for demonstrating the storage container and storage method of the conventional semiconductor wafer using a bottomed cylindrical storage container, (C) is a perspective view of the semiconductor wafer and interlayer paper for demonstrating the subject in the conventional semiconductor wafer storage container and the storage method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Storage container body 12 Top cover 13 Semiconductor wafer 14 Interlayer paper 15 Sponge 16 Protrusion part 21 Notch 22 Notch 31 Slit 41 Buffer paper 42 End part 51 Notch 52 Inner surface convex part

Claims (11)

When stacking and storing a plurality of semiconductor wafers in a storage container body, the interlayer paper is stacked between each semiconductor wafer,
An interlayer paper having an outer shape that is the same as or slightly larger than the outer shape of the semiconductor wafer, and a convex portion that can be folded inward from the outer peripheral portion of the semiconductor wafer when the semiconductor wafers are stacked. When stacking and storing a plurality of semiconductor wafers provided with notches or orientation flats in the storage container body, the interlayer paper is stacked between the semiconductor wafers,
An interlayer paper having an outer shape that is the same as or slightly larger than the outer shape of the semiconductor wafer, and provided with a notch or an orientation flat according to the shape of the semiconductor wafer in a part of the outer periphery thereof. When stacking and storing a plurality of semiconductor wafers in a storage container body, the interlayer paper is stacked between each semiconductor wafer,
An interlayer paper having an outer shape which is the same as or slightly larger than the outer shape of the semiconductor wafer, and a part of the inside is cut off. A bottomed cylindrical storage container main body is provided, and a plurality of semiconductor wafers are respectively stored in the storage container main body via the interlayer paper according to any one of claims 1 to 3. A semiconductor wafer storage container. A semiconductor wafer storage container for storing a plurality of semiconductor wafers via an interlayer paper in a bottomed cylindrical storage container body,
A semiconductor wafer storage container, wherein a buffer paper having a bellows-like fold is disposed between the inner surface of the storage container body and the outer periphery of the semiconductor wafer. A semiconductor wafer storage container for storing a plurality of semiconductor wafers each provided with a notch or orientation flat in a bottomed cylindrical storage container body via an interlayer paper,
Providing the storage container body with a convex portion that matches the notch or orientation flat shape of the semiconductor wafer on a part of the inner surface thereof,
The interlayer paper has an outer shape that is the same as or slightly larger than the outer shape of the semiconductor wafer, and a notch or notch that matches the shape of the notch or orientation flat of the semiconductor wafer is provided in a part of the outer periphery thereof. Semiconductor wafer storage container. When a plurality of semiconductor wafers are stacked and stored in a storage container body, a semiconductor wafer storage method for stacking interlayer paper between each semiconductor wafer,
The interlayer paper has an outer shape that is the same as or slightly larger than the outer shape of the semiconductor wafer, and has a convex portion on the outer periphery,
A method for housing a semiconductor wafer, comprising: folding a convex portion of an outer peripheral portion of the interlayer paper inward from the outer peripheral portion of the semiconductor wafer when the semiconductor wafers are stacked via the interlayer paper. In a storage container body, when a plurality of semiconductor wafers provided with notches or orientation flats are stacked and stored, a semiconductor wafer storage method for stacking interlayer paper between each semiconductor wafer,
The interlayer paper has an outer shape that is the same as or slightly larger than the outer shape of the semiconductor wafer, and a notch or orientation flat according to the shape of the semiconductor wafer is provided on a part of the outer periphery thereof,
When the semiconductor wafer is overlapped via the interlayer paper, the notch provided in a part of the outer peripheral portion of the interlayer paper is folded, and the folded notch is aligned with the notch or orientation flat of the semiconductor wafer. Semiconductor wafer storage method. When a plurality of semiconductor wafers are stacked and stored in a storage container body, a semiconductor wafer storage method for stacking interlayer paper between each semiconductor wafer,
The interlayer paper has the same or slightly larger outer shape as the semiconductor wafer, and a part of the inner paper is cut off,
A semiconductor wafer storing method, wherein the semiconductor wafers are stacked through an interlayer paper from which a part of the inside is cut. A semiconductor wafer storage method for stacking and storing a plurality of semiconductor wafers in a storage container body,
A semiconductor wafer storage method comprising inserting a buffer paper having a bellows-like fold between the inner surface of the storage container main body and the outer periphery of the semiconductor wafer. In a storage container body, when a plurality of semiconductor wafers provided with notches or orientation flats are stacked and stored, a semiconductor wafer storage method for stacking interlayer paper between each semiconductor wafer,
Providing the storage container body with a convex portion that matches the notch or orientation flat shape of the semiconductor wafer on a part of the inner surface thereof, the interlayer paper has the same or slightly larger outer shape as the semiconductor wafer, And in a part of the outer peripheral portion is provided with a notch that matches the shape of the notch or orientation flat of the semiconductor wafer,
A method for storing a semiconductor wafer, comprising: aligning a notch or orientation flat of the semiconductor wafer and a notch of the interlayer paper with the convex portion of the storage container body when the semiconductor wafer is stacked via the interlayer paper.

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