JP2007322732A - Display apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a substrate from generating warpage, at and after attaching the substrate to a support frame of the driving substrate of a display apparatus. <P>SOLUTION: The lengthy driving substrate, connected to a display panel via a flexible circuit material, is held by holding materials which are arranged to project from the display side surface of the support frame of the display panel, the rear surface or the circumferential surface of the display panel; the holding materials are made into U-shaped frames, surrounding the driving substrate in the short side direction crossing the long side direction of the driving substrate at right angles or made into L-shaped frames, arranged so as to surround both the sides in the short side direction of the driving substrate; and the driving substrate is held slidable, in the longitudinal direction between the holding materials and the supporting frame. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a display device, and more particularly to a positioning and holding structure for a support frame of a driving substrate made of a source substrate and / or a gate substrate connected to a display panel via a flexible circuit material.

Conventionally, a display panel of a liquid crystal display device generally controls liquid crystal alignment by sealing a liquid crystal between an array substrate made of a glass substrate provided with a transparent electrode and a color filter substrate, and applying a driving voltage to the transparent electrode. Yes.
In the display panel shown in FIG. 14 disclosed in Japanese Patent Laid-Open No. 10-274743 (Patent Document 1) and the like, the array substrate 1 of the display panel is connected to the source substrate 4 via the flexible circuit members 2 and 3 made of a flat harness. The driving substrates including the gate substrate 5 are connected to each other, and these driving substrates are fixed to the support frame 6 with bolts B so as to be along the peripheral edge of the display panel.

  However, in some cases, a dimensional error may occur between the distance between the through holes for inserting the bolts provided in the drive board and the distance between the bolt holes provided in the support frame 6. When bolted and fixed to 6, the center portion of the drive substrate is warped upward by forcibly aligning the through hole and the bolt hole. In this state, as shown in FIG. 15, when the bezel 7 that constitutes the outer frame of the display device is covered, the drive substrate comes into contact with the metal bezel 7 that covers the upper portion and becomes conductive. A problem that the mounted electronic component 8 is damaged is likely to occur.

  In many cases, the drive substrate and the support frame 6 are formed of materials having different coefficients of thermal expansion. In this case, the drive substrate expands more than the support frame due to an increase in ambient temperature during use. As a result, the center of the drive substrate is warped and the drive substrate is likely to come into contact with the bezel 7 as described above.

Japanese Patent Application Laid-Open No. 10-249443

  The present invention has been made in view of the above problems, and an object of the present invention is to prevent the substrate from being warped during and after the drive substrate is attached to the support frame.

In order to solve the above-mentioned problems, the present invention provides a driving substrate connected to a display panel via a flexible circuit material, protruding from the display-side surface, the non-display-side back surface, or the outer peripheral surface of the display panel support frame. Is held by the holding material,
The drive board is long in the length direction along the length direction of the support frame and short in the width direction perpendicular to the length direction,
The holding material is a U-shaped frame surrounding the driving substrate in the width direction or an L-shaped frame arranged so as to surround both sides of the driving substrate in the width direction, and the holding material and the support frame are arranged between the holding material and the support frame. A display device is provided in which a driving substrate is slidably held in a longitudinal direction.

The driving substrate held on the support frame by the holding material is a source substrate or / and a gate substrate, or a source / control integrated substrate having both functions of the source substrate and the gate substrate.
Specifically, when the holding material is a U-shaped frame that surrounds the drive substrate in the width direction, a gap that allows movement between the both end surfaces of the drive substrate in the width direction and both side frames of the U-shaped frame is provided. The width of the both sides of the U-shaped frame is slightly larger than the thickness of the drive board, and the center connection frame of the U-shaped frame and the outside of the drive board A gap is also formed between the side surfaces and the extension in the thickness direction of the drive substrate can be absorbed.
When the holding material is an L-shaped frame, a pair is arranged so as to surround both ends of the holding material in the width direction. In the case of this L-shaped frame, as in the case of the U-shaped frame, a slight gap is provided between the end surface in the width direction of the driving substrate and the outer surface so that the driving substrate can be moved in the longitudinal direction. At the same time, the elongation in the width direction (short direction) and the thickness direction can be absorbed.
Since one end in the width direction of the drive substrate is connected to the display panel via the flexible circuit board and positioned, an L-shaped frame may be disposed so as to surround only the distal end side on the other end side. However, it is preferable that both sides of the drive substrate in the width direction are held by the L-shaped frame in that the drive substrate can be held without being inclined and contact with the bezel can be reliably prevented.

  As described above, it is preferable that a necessary gap is provided between the driving substrate and the holding material. However, when the holding material is formed of an elastic material, the outer surface of the driving substrate and the inner surface of the holding material are provided. You may make it contact. Thus, if the holding material is formed of an elastic material, even if the driving substrate and the holding material are in contact, the holding material can follow the expansion of the driving substrate when the driving substrate is thermally expanded. It is possible to prevent warping of the driving substrate.

  According to the above configuration, the drive substrate is not fixed to the support frame by bolting, but the drive substrate is held in the width direction with respect to the support frame by the holding material, while the drive substrate has a large elongation when the drive substrate is thermally expanded. It is slidable in the longitudinal direction. Therefore, when the temperature in the display device rises, the drive substrate can be thermally expanded in the longitudinal direction, so that the drive substrate does not warp, and other members such as a bezel disposed opposite to the drive substrate By preventing the interference, the drive substrate can be prevented from conducting with other members and the electronic components on the drive substrate can be prevented from being damaged.

In this way, even if the drive substrate is thermally expanded larger than the support frame due to an increase in the ambient temperature, the drive substrate and the support frame are designed to absorb the expansion due to the thermal expansion. There is no need to use a material with a small difference.
In addition, since the warpage of the drive substrate due to thermal expansion can be prevented, the distance between the drive substrate attached to the support frame and other members such as a bezel that covers the drive substrate can be reduced, and the display device can be reduced in size or thickness. can do.
Furthermore, according to the above configuration, there is no need to provide a bolt hole for fixing the driving board to the support frame, a conductor pattern can be formed on the entire surface of the driving board, and a high-density circuit design can be achieved. , Can increase the degree of design freedom.

The holding material holds at least both sides of the drive board in the longitudinal direction, and both holding materials are the U-shaped frame or L-shaped frame, or one is a U-shaped frame and the other is L-shaped. It is good also as a frame.
In any of the above-described configurations, the driving substrate can be securely positioned and held at a required place without being fixed to the support frame, and the elongation of the driving substrate during thermal expansion can be absorbed.

The holding material may be fixed separately from the support frame via an adhesive, or may be press-fitted and fixed to a mounting portion provided on the support frame at the frame fixing side tip of the holding material.
According to the above configuration, when the holding material is a U-shaped frame, after the driving substrate is disposed at a required position of the support frame, the holding material is fixed to the support frame so as to straddle the width direction of the driving substrate. The drive substrate can be positioned and held only at a required location.
On the other hand, when the holding material is an L-shaped frame, the L-shaped frame that holds the front end side of the drive board is fixed to the support frame first, and the other end side is held after the drive board is disposed. In this way, the L-shaped frame may be fixed to the support frame.
In the case of using a pair of L-shaped frames that hold both sides in the width direction, it is not arranged so as to straddle the drive board, so that interference between the holding material and the electronic components mounted on the drive board can be reliably prevented. .

When the holding material is an L-shaped frame, it may be provided integrally with the support frame. That is, the L-shaped frame may be cut and raised from the support frame, or when the support frame is a resin molded product, it can be integrally formed.
When the holding member is provided integrally with the support frame in this way, the drive board mounting member can be eliminated and the mounting workability can be improved.

  As described above, according to the present invention, the drive substrate connected to the display panel is not fixed to the support frame by bolting, but the drive substrate is placed in the short direction and the plate with respect to the support frame by the holding material. While being positioned and held in the thickness direction, the drive substrate is slidable in the long direction where the drive substrate is largely thermally expanded. Therefore, when the temperature in the display device rises, the drive substrate can be thermally expanded in the longitudinal direction, so that the drive substrate does not warp, and other members such as a bezel disposed opposite to the drive substrate By preventing the interference, the drive substrate can be prevented from conducting with other members and the electronic components on the drive substrate can be prevented from being damaged.

Embodiments of the present invention will be described with reference to the drawings.
1 to 4 show a first embodiment of the present invention.
The display device of the present invention includes a liquid crystal display device, and the display panel has a liquid crystal sealed between an array substrate made of a glass substrate and a color filter substrate 13, and the array substrate includes a plurality of source lines 11 and gate lines 12. The TFT substrate 10 is provided with thin film transistors arranged in a perpendicular manner.

As shown in FIG. 3, a driving substrate composed of a source substrate 30 and a gate substrate 31 is attached to the periphery of the TFT substrate 10 via a plurality of flexible circuit materials 20 and 24 composed of a flexible film substrate. .
The flexible circuit material 20 includes a wiring 22 and a driver IC 23 on the film substrate 21, and connects the source line 11 of the TFT substrate 10 and the conductor pattern 32 of the source substrate 30 via the wiring 22.
Similarly, the flexible circuit material 24 is also provided with a wiring 26 and a driver IC 27 on the film substrate 25, and the gate line 12 of the TFT substrate 10 and the conductor pattern of the gate substrate 31 are connected via the wiring 26.

  Both the source substrate 30 and the gate substrate 31 are made of an epoxy resin printed substrate, and the support frame 40 attached to the peripheral edge of the TFT substrate 10 is made of aluminum, iron, polycarbonate, or the like. In this embodiment, it is made of aluminum. is doing. The source substrate 30 and the gate substrate 31 are positioned and held on the support frame 40 by using a holding material 50. The thermal expansion coefficients of the epoxy resin constituting the source substrate 30 and the gate substrate 31 are 16 ppm / ° C., and the thermal expansion coefficients of aluminum, iron, and polycarbonate constituting the support frame 40 are 23.8 ppm / ° C. and 11.8 ppm / ° C., respectively. ° C and 70 ppm / ° C.

Since the holding structure of the source substrate 30 and the gate substrate 31 is the same, the holding structure of the source substrate 30 will be described below.
The source substrate 30 is a printed circuit board in which a conductor pattern 32 is provided on an insulating substrate made of epoxy resin, and an electronic component 33 such as a capacitor, resistor, or diode is mounted on the conductor pattern. In this embodiment, the source substrate 30 has a long length in the length direction X along the length direction of the support frame 40 and a short length in the width direction Y perpendicular to the length direction X, and has a rectangular shape. In some cases, the length direction X is large and the width direction Y is small in any of the source substrates. ing.

  The source substrate 30 is attached to the TFT substrate 10 via the plurality of flexible circuit members 20 by being attached at intervals in the longitudinal direction X. As shown in FIG. 1, these flexible circuit members 20 are bent along the outer edge of the support frame 40, the source substrate 30 is disposed along the outer peripheral surface of the support frame 40, and the source substrate is formed by a pair of left and right holding members 50. Positioning and holding both side portions in the longitudinal direction X of 30 are held.

As shown in FIGS. 1 and 2B, the holding member 50 is formed of a U-shaped frame including both side frames 50a and a central connecting frame 50b. The end surfaces (upper and lower end surfaces in FIG. 1) 30a and 30a of the source substrate 30 in the width direction Y are held from both outsides by the both side frames 50a, and the outer side surface 30b of the source substrate 30 is held from the outside by the central connection frame 50b. is doing.
The length of the both side frames 50a is slightly larger than the plate thickness of the source substrate 30, a gap is provided between the outer surface 30b and the central connection frame 50b, and the dimension between the both side frames 50a is set to the size of the source substrate 30. A gap is also provided between the end surface 30a of the source substrate and both side frames 50a, which is slightly larger than the dimension in the short direction.
The ends of the holding frame 50 on the frame fixing side of both side portions 50a are tapered so that they can be press-fitted into the through holes 40a provided in the support frame 40.

  When the source substrate 30 is positioned and held by the support frame 40, first, as shown in FIGS. 1 and 4, the flexible circuit material 20 connecting the TFT substrate 10 and the source substrate 30 is attached to the outer edge of the support frame 40. The source substrate 30 is bent along the required position on the outer peripheral surface of the support frame 40.

Next, as shown in FIG. 2B, the holding frame 50 is arranged in the width direction Y so as to cross the longitudinal direction X of the source substrate 30 and straddle it, and the tips of the both side frames 50a are supported on the support frame 40. The holding member 50 is fixed to the support frame 40 by press-fitting into the through-holes 40a.
At this time, there are gaps between the upper and lower end surfaces 30a of the source substrate 30 and the inner surfaces of the both side frames 50a of the holding member 50, and between the outer side surface 30b of the source substrate 30 and the inner surface of the central connection frame 50b of the holding member 50. In the generated state, the source substrate 30 is sandwiched between the holding member 50 and the outer peripheral surface of the support frame 40.

As described above, the source substrate 30 is positioned and held between the holding frame 50 and the support frame 40, the source substrate 30 is not fixed to the support frame 40, the source substrate 30 is free in the longitudinal direction X, and the width direction The short length direction Y and the thickness direction Z of the source substrate 30 are also held with a slight gap.
However, since the flexible circuit material 20 is connected to the source substrate 30 and the flexible circuit material 20 is fixed to the TFT substrate 10, the movement of the source substrate 30 in the longitudinal direction X is limited in that respect. Yes.

Thereafter, the bezel 41 constituting the outer frame of the liquid crystal display device is attached to the front side and the outer peripheral side of the display panel, and the source substrate 30 is covered with the outer peripheral portion extending to the rear side of the bezel 41 as shown in FIG. ing.
In FIG. 1 and FIG. 2, the conductor pattern of the source substrate 30 and the electronic components mounted on the substrate are not shown.

According to the above-described configuration, the source substrate 30 is not fixed to the support frame 40 by bolting, but the source substrate 30 is arranged in the short direction Y with respect to the support frame 40 by the holding material 50, and the thickness of the source substrate 30. While positioning and maintaining a slight gap in the direction Z, the source substrate 30 is slidable in the longitudinal direction X where the elongation increases when the source substrate 30 thermally expands.
Therefore, when the temperature in the display device rises, the source substrate 30 can freely extend in the longitudinal direction X, so that the warpage in the center portion that occurs when the source substrate 30 is fixed on both sides is generated. Absent. Therefore, interference between the source substrate 30 and the bezel 41 can be prevented, and the source substrate 30 can be prevented from being electrically connected to the bezel 41 and electronic components on the source substrate 30 can be prevented from being damaged due to contact with the bezel.
Further, it is not necessary to provide a through hole for passing a bolt through the source substrate 30, and a conductor pattern can be formed on the entire surface of the source substrate 30, thereby increasing the degree of freedom in design.

In this embodiment, only the both sides of the source substrate 30 in the longitudinal direction X are positioned and held by the holding material 50. However, when the source substrate 30 is long, the central position in the longitudinal direction is also the holding material 50. It may be held with. In addition, the holding member 50 may be disposed between flexible circuit materials that connect the display panel and the source substrate, not limited to both sides of the source substrate 30 in the longitudinal direction X.
In this embodiment, the drive substrate is a source substrate and a gate substrate, but a source / control integrated substrate having both the function of the source substrate and the function of the gate substrate may be used.
Further, in the present embodiment, the flexible circuit material 20 that connects the TFT substrate 10 and the source substrate 30 is bent at the outer edge on the display side of the support frame 40, and the source substrate 30 is disposed on the outer peripheral surface of the support frame 40. As shown in FIG. 5A, the source substrate 30 may be disposed on the display side surface of the support frame 40 without bending the flexible circuit material 20, or as shown in FIG. The circuit material 20 may be further folded at the outer edge on the back side of the support frame 40 and disposed on the back surface of the support frame 40 on the side opposite to the display side.

FIG. 6 shows a second embodiment of the present invention.
In the present embodiment, the shape of the holding material 50 and the method of attaching to the support frame 40 are different from those in the first embodiment.
Specifically, the holding member 50 made of a U-shaped frame according to the present embodiment is provided with a fixing portion 50c so as to protrude laterally on the support frame mounting side of the both side frames 50a. An adhesive 51 is provided on the lower surface of the fixing portion 50 c, and the holding material 50 is fixed to the support frame 40 through the adhesive 51, and the source substrate 30 is positioned and held by the holding material 50.
With this configuration, it is not necessary to provide a mounting portion for fixing the holding material on the support frame 40 side, so that the mounting position of the holding material 50 can be freely set.
In addition, since another structure and an effect are the same as that of 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

FIG. 7 shows a third embodiment of the present invention.
In this embodiment, the shape of the holding material is different from that of the above embodiment, and the holding material 52 of this embodiment is configured by a pair of L-shaped frames that hold the source substrate 30 on both sides in the width direction Y. .
The holding member 52 holds the outer side surface 30b of the source substrate 30 continuously with the vertical frame portion 52a that holds both side end surfaces 30a (upper and lower end surfaces in FIG. 1) of the source substrate 30 and one end of the vertical frame portion 52a. It consists of a horizontal frame part 52b.
The ends of the vertical frame portions 52 a of the holding material 52 are press-fitted into the through holes 40 a of the support frame 40, and the holding material 52 is fixed to the support frame 40.
In the present embodiment, as shown in FIG. 7A, the pair of holding materials 52 are arranged in the longitudinal direction X of the source substrate 30.

According to the above configuration, as in the first embodiment, the warp of the source substrate 30 can be prevented, and the horizontal frame portion 52b of the holding material 52 is not configured to straddle the source substrate 30, so that the electronic component mounted on the source substrate 30 The holding material 52 can be disposed without considering the positional relationship between
In the present embodiment, the holding material 52 is press-fitted and fixed to the support frame 40. However, as in the second embodiment, a fixing portion is provided on the holding material 52 and bonded and fixed to the support frame 40 with an adhesive. Also good.

FIG. 8 shows a modification of the third embodiment.
In this modification, the mounting position of the holding material 52 is different from that of the third embodiment, and the holding material 52 made of an L-shaped frame is arranged in a staggered manner without being provided facing the width direction Y of the source substrate 30. A holding material 52 is provided on one side of the width direction Y of the source substrate 30 on both sides of the length direction X of the source substrate 30, while the holding material 52 is arranged in the width direction at the center of the length direction X of the source substrate 30. Is provided on the other side.
According to the above configuration, since the holding position of the source substrate 30 by the holding material 52 is reduced, the number of the holding materials 52 can be reduced and attachment work can be facilitated.

FIG. 9 shows a fourth embodiment of the present invention.
In the present embodiment, an L-shaped holding material 53 for positioning and holding the front end side in the width direction Y of the source substrate 30 is integrally formed with the support frame 40, while a holding material for positioning and holding the other side is used in the third embodiment. A similar holding member 52 is provided separately from the support frame 40, and the holding member 52 is press-fitted and fixed in the through hole 40 a of the support frame 40.

  When positioning and holding the source substrate 30 on the support frame 40, first, the front end side of the source substrate 30 is inserted into the holding material 53 provided on the support frame 40, and then the holding material 52 is fixed to the support frame 40. Thus, the other side of the source substrate 30 is positioned and held by the holding material 52.

  According to the above configuration, the number of holding members 52 attached to the support frame 40 can be further reduced, and the positioning and holding of the source substrate 30 on the support frame 40 can be facilitated.

FIG. 10 shows a fifth embodiment of the present invention.
In the present embodiment, all the L-shaped holding members 53 are integrally formed on the support frame 40, and the source substrate 30 is inserted into the holding member by bending the holding members 53 in the opening direction.
According to the above configuration, a holding member that is separate from the frame 40 is not required, the number of parts can be reduced, and the holding operation of the source substrate 30 can be facilitated.

FIG. 11 shows a sixth embodiment of the present invention.
In the present embodiment, one side of the longitudinal direction X of the source substrate 30 is positioned and held by a U-shaped holding member 50 similar to that in the first embodiment, while the other side is L as in the third embodiment. Positioned and held by a letter-shaped holding material 52.

FIG. 12 shows a seventh embodiment of the present invention.
In the present embodiment, the holding material is formed of an elastic material, and the inner surface of the holding material is brought into contact with the outer surface of the source substrate 30. The holding material of the present embodiment may be a U-shaped holding material 54 as shown in FIG. 12A or an L-shaped holding material 55 as shown in FIG.

  According to the above configuration, the holding material 54 (55) follows the source substrate 30 when the source substrate 30 is thermally expanded in the arrow direction of FIG. Therefore, the source substrate 30 can be prevented from warping without the thermal expansion in the longitudinal direction being suppressed by the holding material 54 (55).

  In any of the embodiments described above, the source substrate is described, but the gate substrate is similarly attached to the support frame. At that time, the source substrate and the gate substrate are preferably positioned and held by the support frame using a holding material in the same form, but need not necessarily be the same form. Further, the present invention can be applied not only to the liquid crystal display device but also to other image display devices.

It is a schematic perspective view which shows the state which positioned and hold | maintained the drive board of 1st Embodiment of this invention to the support frame. The state which positioned and hold | maintained the source substrate to the support frame is shown, (A) is a principal part enlarged view, (B) is the sectional view on the AA line. It is drawing which shows the TFT substrate which attached the source substrate and the gate substrate. It is the schematic which shows the state which fixed the source substrate to the support frame. (A) (B) is drawing which shows the modification of 1st Embodiment. It is drawing which shows 2nd Embodiment of this invention. The state which positioned and hold | maintained the source substrate of 3rd Embodiment of this invention to the support frame is shown, (A) is a principal part enlarged view, (B) is a BB sectional drawing. It is drawing which shows the modification of 3rd Embodiment. It is drawing which shows 4th Embodiment of this invention. It is drawing which shows 5th Embodiment of this invention. It is drawing which shows 6th Embodiment of this invention. (A) (B) is drawing which shows 7th Embodiment of this invention. 2 is a diagram illustrating a state in which a source substrate is thermally expanded. It is drawing which shows a prior art example. It is drawing which shows the conventional problem.

Explanation of symbols

10 TFT substrate 20, 24 Flexible circuit material 30 Source substrate 31 Gate substrate 40 Support frame 40a Through holes 50, 52, 53, 54, 55 Holding material X Long direction Y Short direction (width direction)
Z Thickness direction

Claims (4)

The drive substrate connected to the display panel via a flexible circuit material is held by a holding material protruding from the display side surface of the display panel support frame, the reverse side of the display side or the outer peripheral surface,
The drive board is long in the length direction along the length direction of the support frame and short in the width direction perpendicular to the length direction,
The holding material is a U-shaped frame surrounding the driving substrate in the width direction or an L-shaped frame arranged so as to surround both sides of the driving substrate in the width direction, and the holding material and the support frame are arranged between the holding material and the support frame. A display device characterized in that a drive substrate is slidably held in a longitudinal direction.   The holding material holds at least both sides of the drive board in the longitudinal direction, and both holding materials are the U-shaped frame or L-shaped frame, or one is a U-shaped frame and the other is L-shaped. The display device according to claim 1, wherein the display device is a frame.   The said holding | maintenance material is made into a different body from the said support frame, and it fixes through an adhesive agent, or the frame fixing side front-end | tip of this holding | maintenance material is press-fitted and fixed to the attachment part provided in the support frame. 2. The display device according to 2.   The display device according to claim 1, wherein a holding member for the L-shaped frame is provided integrally with the frame.

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