JP2007322728A - Display apparatus - Google Patents

Display apparatus Download PDF

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JP2007322728A
JP2007322728A JP2006152575A JP2006152575A JP2007322728A JP 2007322728 A JP2007322728 A JP 2007322728A JP 2006152575 A JP2006152575 A JP 2006152575A JP 2006152575 A JP2006152575 A JP 2006152575A JP 2007322728 A JP2007322728 A JP 2007322728A
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screw
support frame
drive board
substrate
mounting hole
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Tomotsugu Koyama
智嗣 小山
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Sharp Corp
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Sharp Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent a driving substrate from warping when attaching and after attaching the driving substrate of a display apparatus to a supporting frame. <P>SOLUTION: The driving substrate connected to a display panel via a flexible circuit material is held on an outer peripheral surface, a display side circumferential part, or a rear surface of non-display side of the supporting frame of the display panel using screws; the screws fix their axial parts by inserting the tip parts of the axial parts into fitting parts prepared in the supporting frame through fitting holes in the driving substrate; while the height of the axial parts projecting from the supporting frame is made higher than the plate thickness of the driving substrate, to provide clearances between the heads of the screws and the driving substrate, the outer diameters of the axial parts of the screws are made smaller than the inner diameters of the fitting holes in the driving substrate, to provide clearances by loosely fitting; and thus the driving substrate held by the screws is made movable due to the clearances. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、表示装置に関し、詳しくは、表示パネルにフレキシブル回路材を介して接続されたソース基板あるいは/およびゲート基板等からなる駆動基板の支持フレームへの位置決め保持構造に関する。   The present invention relates to a display device, and more particularly to a positioning and holding structure for a support frame of a driving substrate made of a source substrate and / or a gate substrate connected to a display panel via a flexible circuit material.

従来、液晶表示装置の表示パネルは、一般に透明電極を設けたガラス基板からなるアレイ基板とカラーフィルタ基板間に液晶を封止し、透明電極に駆動電圧を加えることにより液晶の配列を制御している。
特開平10−274943号公報(特許文献1)等に開示されている図11に示す表示パネルでは、表示パネルのアレイ基板1にフレキシブル回路材2、3を介してソース基板4とゲート基板5からなる駆動基板をそれぞれ接続しており、これら駆動基板を表示パネルの周縁に沿うようにして支持フレーム6にビスBにより固定している。
Conventionally, a display panel of a liquid crystal display device generally controls liquid crystal alignment by sealing a liquid crystal between an array substrate made of a glass substrate provided with a transparent electrode and a color filter substrate, and applying a driving voltage to the transparent electrode. Yes.
In the display panel shown in FIG. 11 disclosed in Japanese Patent Laid-Open No. 10-274493 (Patent Document 1) and the like, the source substrate 4 and the gate substrate 5 are connected to the array substrate 1 of the display panel via the flexible circuit members 2 and 3. These drive substrates are connected to each other, and these drive substrates are fixed to the support frame 6 with screws B along the periphery of the display panel.

しかしながら、前記駆動基板に設けたビス挿通用の貫通孔の間隔と支持フレーム6に設けたボルト孔の間隔に寸法誤差が生じてしまう場合があり、それにもかかわらず、駆動基板を無理に支持フレーム6にビス締め固定すると、貫通孔とボルト孔を無理に位置合わせすることにより駆動基板の中央部が上方に反る現象が生じる。この状態で、図15に示すように、表示装置の外枠を構成するベゼル7を被せると、駆動基板が上方に被せた金属製のベゼル7と接触して導通したり、駆動基板に実装した電子部品8が損傷する問題が生じやすい。   However, there may be a dimensional error between the distance between the through holes for screw insertion provided in the drive board and the distance between the bolt holes provided in the support frame 6. When screwing and fixing to 6, the through hole and the bolt hole are forcibly aligned to cause a phenomenon in which the central portion of the drive substrate warps upward. In this state, as shown in FIG. 15, when the bezel 7 constituting the outer frame of the display device is covered, the driving substrate comes into contact with the metal bezel 7 that covers the upper portion, and is electrically connected or mounted on the driving substrate. The problem that the electronic component 8 is damaged tends to occur.

そこで、前記駆動基板の取付穴のうち、一方の取付穴を駆動基板の長手方向を長軸方向とした楕円形状あるいは長円形状として、駆動基板の取付穴間の間隔と支持フレームのネジ穴間の間隔との寸法誤差を吸収しているものがある。
しかしながら、先に楕円形状あるいは長円形状の取付穴側を支持フレームにネジ締め固定してしまうと、真円形状の取付穴と支持フレームのネジ穴がズレてしまうおそれがあり、この状態でネジ締めを行うと、前記と同様、駆動基板の長手方向の中央部が上方に反ってしまう。
Therefore, among the mounting holes of the drive board, one of the mounting holes has an elliptical or oval shape with the longitudinal direction of the drive board as the major axis direction, and the interval between the mounting holes of the drive board and the screw holes of the support frame Some of them absorb the dimensional error with the interval.
However, if the oval or oval mounting hole side is first screwed and fixed to the support frame, the perfect mounting hole and the screw hole of the support frame may be misaligned. When tightening is performed, the center portion in the longitudinal direction of the drive substrate warps upward as described above.

また、駆動基板と支持フレーム6とは熱膨張率が相違する素材で形成されている場合が多く、その場合には、使用時において雰囲気温度の上昇で駆動基板が支持フレームよりも熱膨張して大きく伸び、その結果、駆動基板の中央が反って、前記と同様に駆動基板がベゼル7と接触する問題が生じやすい。   In many cases, the drive substrate and the support frame 6 are formed of materials having different coefficients of thermal expansion. In this case, the drive substrate expands more than the support frame due to an increase in ambient temperature during use. As a result, the center of the drive substrate is warped and the drive substrate is likely to come into contact with the bezel 7 as described above.

特開平10−274943号公報Japanese Patent Application Laid-Open No. 10-249443

本発明は前記問題に鑑みてなされたものであり、表示装置の駆動基板の支持フレームへの取付時および取付後において、前記駆動基板に反りが生じるのを防止することを課題としている。   The present invention has been made in view of the above problems, and an object of the present invention is to prevent the drive substrate from being warped during and after the drive substrate is attached to the support frame.

前記課題を解決するため、本発明は、表示パネルにフレキシブル回路材を介して接続された駆動基板を、前記表示パネルの支持フレームの外周面、表示側周縁部あるいは反表示側の裏面にビスを用いて保持しており、
前記ビスは軸部を前記駆動基板の取付穴を通して、該軸部の先端部を前記支持フレームに設けた取付部に挿入固定し、該支持フレームより突出する軸部の高さを前記駆動基板の板厚よりも大としてビスの頭部と駆動基板との間に隙間を設けていると共に、前記ビスの軸部の外径は前記駆動基板の取付穴の内径よりも小径として遊嵌させて隙間を設け、該ビスにより保持される前記駆動基板が前記隙間により移動可能とされていることを特徴とする表示装置を提供している。
In order to solve the above-mentioned problems, the present invention provides a driving substrate connected to a display panel through a flexible circuit material, and screws on the outer peripheral surface, the display-side peripheral portion or the non-display-side back surface of the support frame of the display panel. Using and holding
The screw inserts and fixes the shaft portion through the mounting hole of the drive board, the tip portion of the shaft section to the mounting portion provided on the support frame, and the height of the shaft portion protruding from the support frame is set to the height of the drive board. A gap is provided between the screw head and the drive board so as to be larger than the plate thickness, and the outer diameter of the screw shaft is loosely fitted to be smaller than the inner diameter of the mounting hole of the drive board. The display device is characterized in that the drive substrate held by the screw is movable through the gap.

前記ビスで支持フレームに保持される駆動基板は、ソース基板あるいは/およびゲート基板、または、ソース基板の機能とゲート基板の機能を共に備えたソース・コントロール一体型基板からなる。
前記構成によれば、ビスの頭部と軸部とを駆動基板の取付穴との間に隙間をあけて駆動基板を支持フレームに保持しているため、駆動基板は前記隙間に相当する寸法だけ支持フレームに対して移動可能となる。よって、駆動基板の他の取付穴を支持フレーム側の取付部に一致させてビスを通して支持フレームへ取り付ける作業時に、駆動基板を若干移動させて取付穴と支持フレームの取付部とを位置合わせすることができる。これにより、位置ズレした状態で駆動基板が支持フレームに取り付けられた場合に生じていた駆動基板の反りを防止でき、これにより、駆動基板とベゼル等の外部の他部材との干渉を防止することができる。
The driving substrate held on the support frame by the screws is a source substrate or / and a gate substrate, or a source / control integrated substrate having both functions of the source substrate and the gate substrate.
According to the above configuration, since the drive board is held by the support frame with a gap between the screw head and the shaft portion between the mounting hole of the drive board, the drive board has a dimension corresponding to the gap. It becomes movable with respect to the support frame. Therefore, align the mounting hole with the mounting part of the support frame by moving the driving board slightly when aligning the other mounting holes of the driving board with the mounting part on the support frame side and attaching to the support frame through screws. Can do. As a result, it is possible to prevent warping of the drive board that occurs when the drive board is attached to the support frame in a misaligned state, thereby preventing interference between the drive board and other external members such as a bezel. Can do.

また、雰囲気温度の上昇で駆動基板が支持フレームよりも大きく熱膨張して伸びが生じても、熱膨張による伸びを隙間で吸収できる構成としているため、駆動基板と支持フレームとを熱膨張率の差が少ない素材を用いて形成する必要がなくなる。
また、熱膨張による駆動基板の前記反りの発生を防止できるため、支持フレームに取り付ける駆動基板と、該駆動基板を覆うベゼル等の他部材との間隔を小さくでき、表示装置を小型化あるいは薄型化することができる。
なお、駆動基板の熱膨張率に応じて前記隙間の大きさは相違する。
In addition, even if the drive substrate is thermally expanded larger than the support frame due to an increase in ambient temperature, the drive substrate and the support frame have a coefficient of thermal expansion because the elongation due to the thermal expansion can be absorbed by the gap. There is no need to use a material with a small difference.
In addition, since the warpage of the drive substrate due to thermal expansion can be prevented, the distance between the drive substrate attached to the support frame and other members such as a bezel that covers the drive substrate can be reduced, and the display device can be reduced in size or thickness. can do.
Note that the size of the gap varies depending on the thermal expansion coefficient of the drive substrate.

前記ビスの軸部は2段形状とし、前記支持フレームに取付部に挿入固定する先端部を小径ネジ部とすると共に、前記支持フレームより突出するビス頭部側を大径部とし、
前記支持フレームの取付部はネジ穴とし、該ネジ穴に前記小径ネジ部をネジ締め固定し、該小径ネジ部と大径部との間の段差面を前記支持フレームの表面に当接固定していることが好ましい。
The shaft portion of the screw has a two-stage shape, a tip portion inserted and fixed to the mounting portion in the support frame is a small diameter screw portion, and a screw head side protruding from the support frame is a large diameter portion,
The mounting portion of the support frame is a screw hole, and the small diameter screw portion is screwed and fixed to the screw hole, and the step surface between the small diameter screw portion and the large diameter portion is contacted and fixed to the surface of the support frame. It is preferable.

前記構成によれば、前記ビスの軸部に設けた段差面が支持フレームの表面に当接する位置までネジ締めすると、それ以上はネジ締めすることができない。よって、ネジ締めの深さを考慮しなくても、締め付け可能な位置までネジ締めするとビス頭部の下面と前記駆動基板の上面との間に確実に隙間が設けられ、ネジ締め作業を容易にすることができる。
なお、ビスの軸部の先端小径部の外周面にネジを設けない一方、支持フレーム側の取付部を凹状の溝とし、該溝の内径をビス軸部の先端小径部の外径と同等程度として、支持フレームの凹状の溝内に圧入固定してもよい。
According to the said structure, if the level | step difference surface provided in the axial part of the said screw | screw is tightened to the position which contact | abuts the surface of a support frame, it cannot be screwed any more. Therefore, even if the screw tightening depth is not taken into consideration, when the screw is tightened to the position where it can be tightened, a gap is surely provided between the lower surface of the screw head and the upper surface of the drive board, thereby facilitating the screw tightening operation. can do.
In addition, while the screw is not provided on the outer peripheral surface of the small end portion of the screw shaft portion, the mounting portion on the support frame side is a concave groove, and the inner diameter of the groove is about the same as the outer diameter of the small end portion of the screw shaft portion. As such, it may be press-fitted and fixed in the concave groove of the support frame.

前記ビス軸部に遊嵌する前記駆動基板の取付穴は、長尺な前記駆動基板の長手方向を大とした楕円あるいは長円としていることが好ましい。
前記駆動基板は長手方向に大きく熱膨張するため、ビスの軸部と駆動基板の取付穴との隙間を前記駆動基板の長手方向に大きく設けておくと、該隙間により駆動基板と支持フレームの熱膨張の差を十分に吸収することができる。
It is preferable that the mounting hole of the drive board that is loosely fitted to the screw shaft portion is an ellipse or an ellipse having a large longitudinal direction of the long drive board.
Since the drive board thermally expands greatly in the longitudinal direction, if a gap between the screw shaft and the mounting hole of the drive board is provided in the longitudinal direction of the drive board, the gap between the drive board and the support frame is heated by the gap. The difference in expansion can be sufficiently absorbed.

長尺な前記駆動基板の少なくとも長手方向両側に設ける取付穴を含め全ての取付穴を前記ビスの軸部に遊嵌する前記取付穴としていることが好ましい。   It is preferable that all the mounting holes including the mounting holes provided at least on both sides in the longitudinal direction of the long drive substrate are the mounting holes that are loosely fitted to the shaft portions of the screws.

また、長尺な前記駆動基板の長手方向の一側に前記取付穴を設けて、前記ビスの軸部に遊嵌している一方、前記駆動基板の長手方向の他側では前記駆動基板に設けた取付穴にビスを通して駆動基板を前記支持フレームに締結固定してもよい。
この場合、駆動基板を支持フレームに取り付ける際、前記他側のビスを支持フレームに締結固定した後に、ビスを駆動基板の取付穴に遊嵌して取り付けると、位置ずれの発生を防止できる。
よって、駆動基板を支持フレームにビスを介して取り付ける際に駆動基板の反りを防止できると共に、熱膨張時の伸びも隙間により吸収できる。さらに、一方側ではビスを支持フレームに締結固定していることで、駆動基板の位置決め保持をより確実に行うことができる。
Further, the mounting hole is provided on one side in the longitudinal direction of the long drive board and is loosely fitted to the shaft portion of the screw, while the other side in the longitudinal direction of the drive board is provided on the drive board. The drive board may be fastened and fixed to the support frame through a screw through the mounting hole.
In this case, when the drive board is attached to the support frame, if the screw on the other side is fastened and fixed to the support frame and then the screw is loosely fitted into the attachment hole of the drive board, the occurrence of misalignment can be prevented.
Therefore, when the drive board is attached to the support frame via the screws, warpage of the drive board can be prevented, and elongation during thermal expansion can be absorbed by the gap. Furthermore, the screw is fastened and fixed to the support frame on one side, so that the positioning and holding of the drive board can be performed more reliably.

前述したように、本発明によれば、ビズにより駆動基板を支持フレームに移動可能に保持しているため、駆動基板の熱膨張率が支持フレームの熱膨張率よりも大きく、伸びが発生した場合に、ビスの軸部および頭部と駆動基板の取付穴との間の隙間により、駆動基板の熱膨張による伸びを吸収でき、駆動基板に反りが発生するのを防止できる。
また、駆動基板を支持フレームへビスを用いて取り付ける作業時、駆動基板を移動させて駆動基板の取付穴と支持フレームの取付部とを位置合わせすることができる。これにより、位置ズレした駆動基板の取付穴と支持フレームの取付部に無理にビスを通してネジ締めすることによって生じていた駆動基板の反りを防止でき、駆動基板とベゼル等の外部の他部材との干渉を防止することができる。
As described above, according to the present invention, since the drive substrate is movably held by the support frame by the biz, when the thermal expansion coefficient of the drive substrate is larger than the thermal expansion coefficient of the support frame, elongation occurs. In addition, the space between the screw shaft and the head and the mounting hole of the drive board can absorb the elongation due to the thermal expansion of the drive board, and can prevent the drive board from warping.
In addition, when the drive board is attached to the support frame using screws, the drive board can be moved to align the mounting hole of the drive board with the attachment portion of the support frame. As a result, it is possible to prevent the warpage of the drive board caused by forcibly screwing the screw into the mounting hole of the drive board and the mounting portion of the support frame through screws, and between the drive board and other external members such as the bezel. Interference can be prevented.

本発明の実施形態を図面を参照して説明する。
図1乃至図4は、本発明の第1実施形態を示す。
本発明の表示装置は液晶表示装置からなり、表示パネルはガラス基板からなるアレイ基板とカラーフィルタ基板13の間に液晶を封止しており、アレイ基板を複数のソース線11とゲート線12を直交させて配線して薄膜トランジスタを設けたTFT基板10としている。
Embodiments of the present invention will be described with reference to the drawings.
1 to 4 show a first embodiment of the present invention.
The display device of the present invention includes a liquid crystal display device, and the display panel has a liquid crystal sealed between an array substrate made of a glass substrate and a color filter substrate 13, and the array substrate includes a plurality of source lines 11 and gate lines 12. The TFT substrate 10 is provided with thin film transistors arranged in a perpendicular manner.

TFT基板10の周縁には、図3に示すように、可撓性を有するフィルム基板からなる複数のフレキシブル回路材20、24を介してソース基板30とゲート基板31からなる駆動基板を取り付けている。
フレキシブル回路材20はフィルム基板21に配線22とドライバIC23を備え、配線22を介してTFT基板10のソース線11とソース基板30の導体パターン32とを接続している。
同様に、フレキシブル回路材24もフィルム基板25に配線26とドライバIC27を備え、配線26を介してTFT基板10のゲート線12とゲート基板31の導体パターンとを接続している。
As shown in FIG. 3, a driving substrate composed of a source substrate 30 and a gate substrate 31 is attached to the periphery of the TFT substrate 10 via a plurality of flexible circuit materials 20 and 24 composed of a flexible film substrate. .
The flexible circuit material 20 includes a wiring 22 and a driver IC 23 on the film substrate 21, and connects the source line 11 of the TFT substrate 10 and the conductor pattern 32 of the source substrate 30 via the wiring 22.
Similarly, the flexible circuit material 24 is also provided with a wiring 26 and a driver IC 27 on the film substrate 25, and the gate line 12 of the TFT substrate 10 and the conductor pattern of the gate substrate 31 are connected via the wiring 26.

前記ソース基板30とゲート基板31は共にエポキシ樹脂製のプリント基板からなり、TFT基板10の周縁に取り付けた支持フレーム40はアルミニウム、鉄、ポリカボネードなどから形成しており、本実施形態ではアルミニウムで形成している。該支持フレーム40に前記ソース基板30、ゲート基板31をビス50を用いて位置決め保持している。前記ソース基板30及びゲート基板31を構成するエポキシ樹脂の熱膨張率は16ppm/℃、支持フレーム40を構成するアルミニウム、鉄、ポリカボネードの熱膨張率は、それぞれ23.8ppm/℃、11.8ppm/℃、70ppm/℃である。   Both the source substrate 30 and the gate substrate 31 are made of an epoxy resin printed substrate, and the support frame 40 attached to the peripheral edge of the TFT substrate 10 is made of aluminum, iron, polycarbonate, or the like. In this embodiment, it is made of aluminum. is doing. The source substrate 30 and the gate substrate 31 are positioned and held on the support frame 40 using screws 50. The thermal expansion coefficients of the epoxy resin constituting the source substrate 30 and the gate substrate 31 are 16 ppm / ° C., and the thermal expansion coefficients of aluminum, iron, and polycarbonate constituting the support frame 40 are 23.8 ppm / ° C. and 11.8 ppm / ° C., respectively. ° C and 70 ppm / ° C.

前記ソース基板30とゲート基板31の保持構造は同様のため、以下に、ソース基板30の保持構造について説明する。
ソース基板30はエポキシ樹脂からなる絶縁基板上に導体パターン32を設け、該導体パターン上にコンデンサ、抵抗、ダイオード等の電子部品33を実装したプリント基板からなる。ソース基板30は本実施形態では前記支持フレーム40の長さ方向に沿った長さ方向Xが長尺であると共に該長さ方向Xと直交方向する幅方向Yが短尺であり長方形状としている。なお、長さ方向の一部に幅方向が相違する部分を有する場合等の異形となっている場合もあるが、いずれのソース基板においても、長さ方向Xが大で幅方向Yが小さくなっている。
Since the holding structure of the source substrate 30 and the gate substrate 31 is the same, the holding structure of the source substrate 30 will be described below.
The source substrate 30 is a printed circuit board in which a conductor pattern 32 is provided on an insulating substrate made of epoxy resin, and an electronic component 33 such as a capacitor, resistor, or diode is mounted on the conductor pattern. In this embodiment, the source substrate 30 has a long length in the length direction X along the length direction of the support frame 40 and a short length in the width direction Y perpendicular to the length direction X, and has a rectangular shape. In some cases, the length direction X is large and the width direction Y is small in any of the source substrates. ing.

ソース基板30の長尺方向Xの両側にビス50を通すための真円形状の取付穴30aを設けている。
前記ソース基板30の取付穴30aに通すビス50は、図2に示すように、ビスの軸部50aを2段形状として段差面50a−1を設け、ビスの頭部50b側を大径部50a−2、先端側を小径ネジ部50a−3としている。大径部50a−2は、その外径R1をソース基板30の取付穴30aの内径R2よりも小径とし、軸線方向の高さL1をソース基板30の板厚L2よりも大としている。なお、ビスの頭部50bの径は取付穴30aの内径R2よりも大としている。
On both sides of the source substrate 30 in the longitudinal direction X, a perfect circular mounting hole 30a for passing the screw 50 is provided.
As shown in FIG. 2, the screw 50 passing through the mounting hole 30a of the source substrate 30 has a screw shaft portion 50a having a two-step shape and is provided with a step surface 50a-1, and the screw head portion 50b side is connected to the large diameter portion 50a. -2, The tip side is made into the small diameter screw part 50a-3. The large-diameter portion 50 a-2 has an outer diameter R 1 that is smaller than an inner diameter R 2 of the mounting hole 30 a of the source substrate 30, and an axial height L 1 that is greater than the plate thickness L 2 of the source substrate 30. The screw head 50b has a diameter larger than the inner diameter R2 of the mounting hole 30a.

一方、支持フレーム40の外周面には、前記ソース基板30の取付穴30aと対向位置にネジ穴40aを設けている。該ネジ穴40aは前記ビス50の小径ネジ部50a−3を螺嵌する大きさとしており、支持フレーム40を貫通させずに凹状に設けている。
なお、ビス50の先端側を小径ネジ部とせず、ネジを設けていない小径部とする一方、支持フレーム40側のネジ穴40aにかえて、前記小径部を圧入固定する内径を有する円形溝としてもよい。
On the other hand, a screw hole 40 a is provided on the outer peripheral surface of the support frame 40 at a position opposite to the mounting hole 30 a of the source substrate 30. The screw hole 40a is sized to screw the small diameter screw portion 50a-3 of the screw 50, and is provided in a concave shape without penetrating the support frame 40.
The tip end side of the screw 50 is not a small-diameter screw portion and is a small-diameter portion not provided with a screw. On the other hand, instead of the screw hole 40a on the support frame 40 side, a circular groove having an inner diameter for press-fitting the small-diameter portion is used. Also good.

前記ソース基板30を支持フレーム40に取り付ける際には、図1及び図4に示すように、TFT基板10とソース基板30を連結しているフレキシブル回路材20をTFT基板10の外縁に沿って90度折り曲げて、ソース基板30を支持フレーム40の外周面に沿わせている。このとき、支持フレーム40に設けたネジ穴40aとソース基板30の取付穴30aが対向配置される。   When the source substrate 30 is attached to the support frame 40, the flexible circuit material 20 connecting the TFT substrate 10 and the source substrate 30 is moved along the outer edge of the TFT substrate 10 as shown in FIGS. 1 and 4. The source substrate 30 is aligned with the outer peripheral surface of the support frame 40. At this time, the screw holes 40a provided in the support frame 40 and the mounting holes 30a of the source substrate 30 are arranged to face each other.

図2(A)に示すように、ソース基板30の取付穴30aにビス50のビス軸部50aを通し、ビス軸部50aの段差面50a−1が支持フレーム40の表面に当接するまでビス50の小径ネジ部50a−3を支持フレーム40のネジ穴40aに締め付けている。
この状態で、ビス50の軸部50aの大径部50a−2の外周面とソース基板30の取付穴30aの内周面との間に隙間S1が設けられて遊嵌されると共に、ビスの頭部50bの下面とソース基板30の上面との間にも隙間S2が設けられる。
その後、液晶表示装置の外枠を構成するベゼル41を表示パネルの前面側周縁および支持フレーム40の外周面に被せるように取り付け、図2(B)に示すようにベゼル41の外周面41bでソース基板30を覆っている。
As shown in FIG. 2A, the screw shaft portion 50a of the screw 50 is passed through the mounting hole 30a of the source substrate 30, and the screw 50 is moved until the stepped surface 50a-1 of the screw shaft portion 50a contacts the surface of the support frame 40. The small diameter screw portion 50 a-3 is fastened to the screw hole 40 a of the support frame 40.
In this state, a clearance S1 is provided between the outer peripheral surface of the large-diameter portion 50a-2 of the shaft portion 50a of the screw 50 and the inner peripheral surface of the mounting hole 30a of the source substrate 30, and is loosely fitted. A gap S <b> 2 is also provided between the lower surface of the head 50 b and the upper surface of the source substrate 30.
After that, a bezel 41 constituting the outer frame of the liquid crystal display device is attached so as to cover the front side peripheral edge of the display panel and the outer peripheral surface of the support frame 40, and the source is formed on the outer peripheral surface 41 b of the bezel 41 as shown in FIG. The substrate 30 is covered.

前記構成によれば、ソース基板30及びゲート基板31からなる駆動基板を支持フレーム40にネジ締めしたビス50の頭部50bの下面と駆動基板の上面との間に隙間S2を存在するため、駆動基板は支持フレーム40に強固に固定されない。
よって、一方側のみビズ50でネジ締めした状態で、ネジ締めしていない側の取付穴30aと支持フレーム40のネジ穴40aが位置ズレしていても、先にネジ締めした側のビスの軸部50aの外周面と取付穴30aの内周面との間に設けた隙間S1の範囲内で基板30、31を支持フレーム40に対して移動させて、取付穴30aとネジ穴40aを位置合わせしてネジ締めすることができる。これにより、位置ズレした基板30、31の取付穴30aと支持フレーム40のネジ穴40aに無理にビス50を通してネジ締めすることによる基板30、31の反りを防止でき、基板30、31とベゼル41との干渉をなくし、基板30、31がベゼル41と導通したり基板上の電子部品33が損傷するのを防止することができる。
According to the above-described configuration, the gap S2 exists between the lower surface of the head 50b of the screw 50 in which the driving substrate including the source substrate 30 and the gate substrate 31 is screwed to the support frame 40, and the upper surface of the driving substrate. The substrate is not firmly fixed to the support frame 40.
Therefore, even if only one side is screwed with the bis 50 and the mounting hole 30a on the unscrewed side and the screw hole 40a on the support frame 40 are misaligned, the screw shaft on the side screwed first The mounting holes 30a and the screw holes 40a are aligned by moving the substrates 30 and 31 with respect to the support frame 40 within a gap S1 provided between the outer peripheral surface of the portion 50a and the inner peripheral surface of the mounting hole 30a. And can be screwed. Accordingly, the warpage of the substrates 30 and 31 caused by forcibly screwing the mounting holes 30a of the substrates 30 and 31 and the screw holes 40a of the support frame 40 through the screws 50 can be prevented. Can be prevented, and the substrates 30 and 31 can be prevented from conducting with the bezel 41 and the electronic components 33 on the substrate can be prevented from being damaged.

また、基板30、31を支持フレーム40をビズ50で取り付けた後においても、ビスの頭部50bの下面と基板30、31の上面との間に隙間S2を設けて基板30、31を支持フレーム40に固定していないため、基板30、31の取付穴30aの内周面と支持フレーム40に固定したビス50のビス軸部50aとが干渉するまでは基板30、31が熱膨張しても反りが発生しない。即ち、基板30、31と支持フレーム40の熱膨張率の差をビス軸部50aの外周面と取付穴30aの内周面との間に設けた隙間S1で吸収でき、基板30、31が反るのを防止することができる。
なお、本実施形態では、基板30、31の長手方向の両側にのみビス挿通用の取付穴30aを設けているが、基板30、31が長尺な場合には、長手方向の中央位置にも取付穴を設けてもよい。
Further, even after the substrates 30 and 31 are attached to the support frame 40 with the biz 50, a gap S2 is provided between the lower surface of the screw head 50b and the upper surfaces of the substrates 30 and 31, thereby supporting the substrates 30 and 31 with the support frame. Since the inner peripheral surfaces of the mounting holes 30a of the substrates 30 and 31 and the screw shaft portions 50a of the screws 50 fixed to the support frame 40 interfere with each other, the substrates 30 and 31 are thermally expanded. No warping occurs. That is, the difference in thermal expansion coefficient between the substrates 30 and 31 and the support frame 40 can be absorbed by the gap S1 provided between the outer peripheral surface of the screw shaft portion 50a and the inner peripheral surface of the mounting hole 30a. Can be prevented.
In this embodiment, the screw insertion holes 30a are provided only on both sides of the substrates 30 and 31 in the longitudinal direction. However, when the substrates 30 and 31 are long, the mounting holes 30a are also located at the center in the longitudinal direction. A mounting hole may be provided.

また、本実施形態では駆動基板をソース基板とゲート基板としているが、ソース基板の機能とゲート基板の機能を共に備えたソース・コントロール一体型基板としてもよい。
さらに、本実施形態では、TFT基板10とソース基板30を連結するフレキシブル回路材20を支持フレーム40の外周面側に折り曲げてソース基板30を支持フレーム40の外周面上に配置しているが、図5(A)に示すように、フレキシブル回路材20を折り曲げずにソース基板30を支持フレーム40の表示側の表面に配置してもよい。さらに、図5(B)に示すように、フレキシブル回路材20を支持フレーム50の裏面側の外端に沿って折り返して支持フレーム40の反表示側の裏面に配置してもよい。
In this embodiment, the drive substrate is a source substrate and a gate substrate, but a source / control integrated substrate having both the function of the source substrate and the function of the gate substrate may be used.
Furthermore, in this embodiment, the flexible circuit material 20 that connects the TFT substrate 10 and the source substrate 30 is bent to the outer peripheral surface side of the support frame 40 and the source substrate 30 is disposed on the outer peripheral surface of the support frame 40. As shown in FIG. 5A, the source substrate 30 may be arranged on the display side surface of the support frame 40 without bending the flexible circuit material 20. Furthermore, as shown in FIG. 5B, the flexible circuit material 20 may be folded back along the outer edge on the back surface side of the support frame 50 and disposed on the back surface on the opposite side of the support frame 40.

図6及び図7は、本発明の第2実施形態を示す。
本実施形態では、ソース基板30に設ける取付穴30bを、ソース基板30の長尺方向Xを長軸方向とした長円形状としている。取付穴30bの長軸方向の径をビス軸部50aの大径部50a−2の径よりも大幅に大径とする一方、取付穴30bの短軸方向Yの径をビス軸部50aの大径部50a−2の径よりも若干大径としている。
よって、ソース基板30を支持フレーム40にビス50を介して取り付けた状態で、図7(A)に示すように、ビスの軸部50aに対してソース基板30の長尺方向Xに大きな隙間S1が設けられる。一方、取付穴30bの短軸方向Yの長さはビスの軸部50aの径より若干大きくしているだけであり、図7(B)に示すように、ビスの軸部50aに対してソース基板30の短尺方向Yにはビスの軸部50aの外周面と取付穴30bの内周面との間に大きな隙間を設けていない。
6 and 7 show a second embodiment of the present invention.
In the present embodiment, the mounting hole 30b provided in the source substrate 30 has an oval shape in which the longitudinal direction X of the source substrate 30 is the major axis direction. The diameter of the mounting hole 30b in the major axis direction is made significantly larger than the diameter of the large diameter part 50a-2 of the screw shaft part 50a, while the diameter of the mounting hole 30b in the short axis direction Y is larger than that of the screw shaft part 50a. The diameter is slightly larger than the diameter of the diameter portion 50a-2.
Therefore, with the source substrate 30 attached to the support frame 40 via the screws 50, as shown in FIG. 7A, a large gap S1 in the longitudinal direction X of the source substrate 30 with respect to the screw shaft portion 50a. Is provided. On the other hand, the length in the minor axis direction Y of the mounting hole 30b is only slightly larger than the diameter of the screw shaft portion 50a, and as shown in FIG. In the short direction Y of the substrate 30, no large gap is provided between the outer peripheral surface of the screw shaft portion 50a and the inner peripheral surface of the mounting hole 30b.

前記構成によれば、熱膨張量が大きいソース基板30の長尺方向Xにソース基板30を移動可能とする一方、短尺方向Yにはほとんど移動しないようにしているため、ソース基板30の反りを防止しながらガタつきも防止することができる。
なお、他の構成及び作用効果は第1実施形態と同様のため、同一の符号を付して説明を省略する。
また、本実施形態では、ソース基板30の取付穴30bを長円形状としているが、図8に示すように、ソース基板30の長尺方向を長軸方向とした楕円形状としてもよい。
According to the above configuration, since the source substrate 30 can be moved in the longitudinal direction X of the source substrate 30 having a large thermal expansion amount, but is hardly moved in the short direction Y, the warping of the source substrate 30 is prevented. While preventing, it can also prevent rattling.
In addition, since another structure and an effect are the same as that of 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.
Further, in the present embodiment, the mounting hole 30b of the source substrate 30 has an elliptical shape, but as shown in FIG. 8, it may have an elliptical shape with the long direction of the source substrate 30 as the major axis direction.

図9は、本発明の第3実施形態を示す。
本実施形態では、ソース基板30の一方の取付穴30aには第1実施形態と同様のビス50を通してネジ締めする一方、他方の取付穴にはビス50よりも大径部の軸線方向の高さが短いビス51をネジ締めしている。詳細には、ビス51の軸部51aに設けた大径部51a−2の軸線方向の高さL1をソース基板30の厚さL2と略同等としており、ビス51の軸部51aを取付穴30aに通して段差面51a−1が支持フレーム表面に当接する位置までネジ締めすると、ビス頭部51bの下面がソース基板30の上面に押し当てられてソース基板30が支持フレーム40に固定される。即ち、本実施形態では、ビス頭部51bの下面とソース基板30の上面との間に隙間を設けていない。
FIG. 9 shows a third embodiment of the present invention.
In this embodiment, one mounting hole 30a of the source substrate 30 is screwed through the same screw 50 as in the first embodiment, while the other mounting hole has a height in the axial direction of a larger diameter portion than the screw 50. Is screwing a short screw 51. Specifically, the axial height L1 of the large diameter portion 51a-2 provided on the shaft 51a of the screw 51 is substantially equal to the thickness L2 of the source substrate 30, and the shaft 51a of the screw 51 is attached to the mounting hole 30a. When the screw is tightened to a position where the step surface 51 a-1 comes into contact with the surface of the support frame, the lower surface of the screw head 51 b is pressed against the upper surface of the source substrate 30, and the source substrate 30 is fixed to the support frame 40. That is, in this embodiment, no gap is provided between the lower surface of the screw head 51 b and the upper surface of the source substrate 30.

前記構成によっても、ソース基板30の支持フレーム40へのネジ締め付け時およびネジ締め付け後においてソース基板30の反りを防止できると共に、ビス51のビス頭部51bでソース基板30を支持フレーム40に固定しているためソース基板30のガタつきを防止することができる。
なお、ビス51を通す取付穴をビス51の大径部51a−2と略同径として、ビス軸部51aの外周面と取付穴の内周面との間に隙間をほとんど設けない構成としてもよい。
Also with the above configuration, the source substrate 30 can be prevented from warping during and after the source substrate 30 is screwed to the support frame 40, and the source substrate 30 is fixed to the support frame 40 with the screw head 51 b of the screw 51. Therefore, the play of the source substrate 30 can be prevented.
The mounting hole through which the screw 51 is passed may be substantially the same diameter as the large-diameter portion 51a-2 of the screw 51, and there may be little gap between the outer peripheral surface of the screw shaft portion 51a and the inner peripheral surface of the mounting hole. Good.

前記いずれの実施形態においてもビスの先端側の小径部はネジ部としているが、ネジを設けずに、支持フレーム側の取付部を小径な凹部として圧入固定しても良いし、ビスの先端をピン状に先鋭化させて支持フレーム側に差し込み固定してもよい。その場合にも、ビスの差し込む部と頭部側との間には段差面を設けて、ビスを位置決めしている。   In any of the above-described embodiments, the small diameter portion on the distal end side of the screw is a screw portion. However, the mounting portion on the support frame side may be press-fitted and fixed as a small diameter concave portion without providing a screw, or the distal end of the screw may be It may be sharpened like a pin and inserted into the support frame and fixed. Even in that case, a step surface is provided between the screw insertion portion and the head side to position the screw.

図10は、本発明の第4実施形態を示す。
本実施形態では、ソース基板30を支持フレーム40にネジ締め保持するビスの形状を前記実施形態と相違させており、ビス52のビスの軸部52aに段差面を設けていない。詳細には、ビス52の軸部52aの軸線方向の高さL3を支持フレーム40のネジ穴40aの深さとソース基板30の厚さの合計L4よりも大とし、かつ、軸部52aの径R3をソース基板30の取付穴30aの径R2よりも小としている。
これにより、ビス52の軸部52aの先端が支持フレーム40のネジ穴40aの底に達するまでネジ締めした状態で、軸部52aの外周面と取付穴30aの内周面との間に隙間S1が設けられると共に、ビスの頭部52bの下面とソース基板30の上面との間に隙間S2が設けられる。
なお、他の構成及び作用効果は第1実施形態と同様のため、同一の符号を付して説明を省略する。
FIG. 10 shows a fourth embodiment of the present invention.
In this embodiment, the shape of the screw for screwing and holding the source substrate 30 to the support frame 40 is different from that of the previous embodiment, and no step surface is provided on the screw shaft portion 52 a of the screw 52. Specifically, the axial height L3 of the shaft portion 52a of the screw 52 is larger than the total L4 of the depth of the screw hole 40a of the support frame 40 and the thickness of the source substrate 30, and the diameter R3 of the shaft portion 52a. Is smaller than the diameter R2 of the mounting hole 30a of the source substrate 30.
Thus, with the screw 52 tightened until the tip of the shaft portion 52a of the screw 52 reaches the bottom of the screw hole 40a of the support frame 40, the gap S1 is formed between the outer peripheral surface of the shaft portion 52a and the inner peripheral surface of the mounting hole 30a. And a gap S <b> 2 is provided between the lower surface of the screw head 52 b and the upper surface of the source substrate 30.
In addition, since another structure and an effect are the same as that of 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

本発明の第1実施形態の駆動基板を支持フレームに位置決め保持した状態を示す概略斜視図である。It is a schematic perspective view which shows the state which positioned and hold | maintained the drive board of 1st Embodiment of this invention to the support frame. ソース基板の支持フレームへの保持構造を示し、(A)は要部拡大断面図、(B)は概略断面図である。The holding structure to the support frame of a source substrate is shown, (A) is a principal part expanded sectional view, (B) is a schematic sectional drawing. ソース基板とゲート基板を取り付けたTFT基板を示す図面である。It is drawing which shows the TFT substrate which attached the source substrate and the gate substrate. ソース基板を支持フレームに位置決め保持した状態を示す概略図である。It is the schematic which shows the state which positioned and hold | maintained the source substrate to the support frame. (A)(B)は第1実施形態の変形例を示す図面である。(A) (B) is drawing which shows the modification of 1st Embodiment. 第2実施形態のソース基板を示す図面である。It is drawing which shows the source substrate of 2nd Embodiment. ソース基板を支持フレームにネジ締め保持した状態を示し、(A)はソース基板の長尺方向の断面図、(B)は短手方向の断面図である。The state which hold | maintained the source board to the support frame by screwing is shown, (A) is sectional drawing of the elongate direction of a source board, (B) is sectional drawing of a transversal direction. 第2実施形態の変形例のソース基板を示す図面である。It is drawing which shows the source substrate of the modification of 2nd Embodiment. 第3実施形態を示す図面である。It is drawing which shows 3rd Embodiment. 第4実施形態を示す図面である。It is drawing which shows 4th Embodiment. 従来例を示す図面である。It is drawing which shows a prior art example. 従来の問題点を示す図面である。It is drawing which shows the conventional problem.

符号の説明Explanation of symbols

10 TFT基板
30 ソース基板
30a、30b 取付穴
31 ゲート基板
40 支持フレーム
40a ネジ穴
50 ビス
50a 軸部
50a−1 段差面
50a−2 大径部
50a−3 小径ネジ部
50b 頭部
X 長尺方向
Y 短尺方向
10 TFT substrate 30 Source substrate 30a, 30b Mounting hole 31 Gate substrate 40 Support frame 40a Screw hole 50 Screw 50a Shaft portion 50a-1 Stepped surface 50a-2 Large diameter portion 50a-3 Small diameter screw portion 50b Head X Longitudinal direction Y Short direction

Claims (5)

表示パネルにフレキシブル回路材を介して接続された駆動基板を、前記表示パネルの支持フレームの外周面、表示側周縁部あるいは反表示側の裏面にビスを用いて保持しており、
前記ビスは軸部を前記駆動基板の取付穴を通して、該軸部の先端部を前記支持フレームに設けた取付部に挿入固定し、該支持フレームより突出する軸部の高さを前記駆動基板の板厚よりも大としてビスの頭部と駆動基板との間に隙間を設けていると共に、前記ビスの軸部の外径は前記駆動基板の取付穴の内径よりも小径として遊嵌させて隙間を設け、該ビスにより保持される前記駆動基板が前記隙間により移動可能とされていることを特徴とする表示装置。
The drive board connected to the display panel via a flexible circuit material is held using screws on the outer peripheral surface of the support frame of the display panel, the display side peripheral edge or the reverse side of the display side,
The screw inserts and fixes the shaft portion through the mounting hole of the drive board, the tip portion of the shaft section to the mounting portion provided on the support frame, and the height of the shaft portion protruding from the support frame is set to the height of the drive board. A gap is provided between the screw head and the drive board so as to be larger than the plate thickness, and the outer diameter of the screw shaft is loosely fitted to be smaller than the inner diameter of the mounting hole of the drive board. And the drive board held by the screw is movable through the gap.
前記ビスの軸部は2段形状とし、前記支持フレームに取付部に挿入固定する先端部を小径ネジ部とすると共に、前記支持フレームより突出するビス頭部側を大径部とし、
前記支持フレームの取付部はネジ穴とし、該ネジ穴に前記小径ネジ部をネジ締め固定し、該小径ネジ部と大径部との間の段差面を前記支持フレームの表面に当接固定している請求項1に記載の表示装置。
The shaft portion of the screw has a two-stage shape, a tip portion inserted and fixed to the mounting portion in the support frame is a small diameter screw portion, and a screw head side protruding from the support frame is a large diameter portion,
The mounting portion of the support frame is a screw hole, and the small diameter screw portion is screwed and fixed to the screw hole, and the step surface between the small diameter screw portion and the large diameter portion is contacted and fixed to the surface of the support frame. The display device according to claim 1.
前記ビスの軸部に遊嵌する前記駆動基板の取付穴は、長尺な前記駆動基板の長手方向を大とした楕円あるいは長円としている請求項1または請求項2に記載の表示装置。   3. The display device according to claim 1, wherein the mounting hole of the driving board that is loosely fitted to the shaft portion of the screw is an ellipse or an ellipse having a large longitudinal direction of the long driving board. 長尺な前記駆動基板の少なくとも長手方向両側に設ける取付穴を含め全ての取付穴を前記ビス軸部に遊嵌する前記取付穴としている請求項1乃至請求項3のいずれか1項に記載の表示装置。   4. The mounting hole according to claim 1, wherein all mounting holes including mounting holes provided at least on both sides in the longitudinal direction of the long drive board are used as the mounting holes for loosely fitting the screw shaft portions. 5. Display device. 長尺な前記駆動基板の長手方向の一側に前記取付穴を設けて、前記ビスの軸部に遊嵌している一方、前記駆動基板の長手方向の他側では前記駆動基板に設けた取付穴にビスを通して駆動基板を前記支持フレームに締結固定している請求項1乃至請求項3のいずれか1項に記載の表示装置。   The mounting hole is provided on one side in the longitudinal direction of the long drive board and is loosely fitted on the shaft portion of the screw, while the attachment provided on the drive board is provided on the other side in the longitudinal direction of the drive board. The display device according to claim 1, wherein a driving substrate is fastened and fixed to the support frame through a screw through the hole.
JP2006152575A 2006-05-31 2006-05-31 Display apparatus Withdrawn JP2007322728A (en)

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