JP2007321177A5 - - Google Patents
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- Publication number
- JP2007321177A5 JP2007321177A5 JP2006150084A JP2006150084A JP2007321177A5 JP 2007321177 A5 JP2007321177 A5 JP 2007321177A5 JP 2006150084 A JP2006150084 A JP 2006150084A JP 2006150084 A JP2006150084 A JP 2006150084A JP 2007321177 A5 JP2007321177 A5 JP 2007321177A5
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- alloy
- thickness
- intermediate plating
- alloy intermediate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims 13
- 239000010410 layer Substances 0.000 claims 11
- 229910017755 Cu-Sn Inorganic materials 0.000 claims 5
- 229910017927 Cu—Sn Inorganic materials 0.000 claims 5
- 229910045601 alloy Inorganic materials 0.000 claims 5
- 239000000956 alloy Substances 0.000 claims 5
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims 2
- 210000003135 Vibrissae Anatomy 0.000 claims 2
- 239000011247 coating layer Substances 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
Claims (2)
The coating layer consists of a Ni or Ni alloy base plating layer, a 0.3 μm or less Cu intermediate plating layer, a Cu—Sn alloy intermediate plating layer, and a surface Sn plating layer from the material side. -Sn alloy intermediate plating layer thickness is 1 to 1.3 times the Cu-Sn alloy intermediate plating layer thickness before heating. Excellent whisker resistance and good solderability. Sn plating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006150084A JP4602285B2 (en) | 2006-05-30 | 2006-05-30 | Copper alloy reflow Sn plating material excellent in whisker resistance and electronic component using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006150084A JP4602285B2 (en) | 2006-05-30 | 2006-05-30 | Copper alloy reflow Sn plating material excellent in whisker resistance and electronic component using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007321177A JP2007321177A (en) | 2007-12-13 |
| JP2007321177A5 true JP2007321177A5 (en) | 2010-05-13 |
| JP4602285B2 JP4602285B2 (en) | 2010-12-22 |
Family
ID=38854252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006150084A Active JP4602285B2 (en) | 2006-05-30 | 2006-05-30 | Copper alloy reflow Sn plating material excellent in whisker resistance and electronic component using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4602285B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5621570B2 (en) * | 2010-03-30 | 2014-11-12 | 三菱マテリアル株式会社 | Conductive material with Sn plating and manufacturing method thereof |
| JP5637965B2 (en) * | 2011-10-20 | 2014-12-10 | 株式会社神戸製鋼所 | Aluminum strip for lead frame and lead frame strip |
| JP7155312B2 (en) * | 2021-02-22 | 2022-10-18 | Ｊｘ金属株式会社 | Plating materials for electronic parts and electronic parts |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2975246B2 (en) * | 1993-12-08 | 1999-11-10 | 古河電気工業株式会社 | Sn-plated wire for electrical contact and method of manufacturing the same |
| JP4090483B2 (en) * | 2001-07-31 | 2008-05-28 | 株式会社神戸製鋼所 | Conductive connection parts |
| JP4090302B2 (en) * | 2001-07-31 | 2008-05-28 | 株式会社神戸製鋼所 | Conductive material plate for forming connecting parts |
| JP3880877B2 (en) * | 2002-03-29 | 2007-02-14 | Ｄｏｗａホールディングス株式会社 | Plated copper or copper alloy and method for producing the same |
-
2006
- 2006-05-30 JP JP2006150084A patent/JP4602285B2/en active Active
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