JP2007320280A - Flow channel configured body and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a configuration capable of preventing a sample liquid from leaking out of a channel by avoiding the generation of a non-adhered part in the vicinity of the channel in a flow channel configured body having the channel formed on contact planes between two resin molded members and a method of manufacturing the same. <P>SOLUTION: When manufacturing the flow channel configured body 1, junction of a first resin formed member 2 to a second resin formed member 3 results in formation of a channel 5 by closing a channel forming groove 21 with the second resin formed member 3, and communication of a penetrated hole 32 for injecting the sample liquid to the channel 5. Though eject pin impressions are formed as recessions 28, 38 in the first resin formed member 2 and second resin formed member 3, bubbles do not remain because air in the recessions 28, 38 escapes to the outside through a deaerating groove 35 when in junction. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flow path structure in which a flow path is formed on a joint surface of a resin molded member, and a manufacturing method thereof.

  In recent years, a flow path structure having a fine flow path formed therein has been proposed, and such a flow path structure is used as a biochip in fields such as biochemistry and medicine, for example. The biochip is for analyzing a test liquid by optically observing the test liquid introduced into the flow path.

  In manufacturing such a flow path structure, for example, a first bonding surface in which fine flow path forming grooves are formed in the first resin molding member, and a second bonding of the second resin molding member. The method of joining the surfaces is employed, but as the joining method, a joining method using an adhesive, a joining method in which a resin molded member is heated and melted to melt the joined surface, and ultrasonic vibration is applied to the resin molded member For example, a bonding method in which pressure is applied while melting the bonding surface is used.

Also proposed is a method called solvent bonding in which a first resin molding member and a second resin molding member are joined by applying pressure with a solvent interposed between the first joining surface and the second joining surface. (For example, refer to Patent Document 1).
JP 2003-118000 A

  However, when the resin molded member is joined, bubbles are likely to remain in the joining region, and the remaining of such bubbles generates a non-joined portion in the vicinity of the flow path and causes the sample liquid to leak from the flow path. .

  In view of the above problems, an object of the present invention is to prevent the occurrence of a non-adhesive portion in the vicinity of the flow path in the flow path structure in which the flow path is formed on the joint surface between the resin molded members and the manufacturing method thereof. Thus, an object of the present invention is to provide a configuration capable of preventing leakage of the sample liquid from the flow path.

  In order to solve the above-described problem, in the present invention, the first joint surface of the first resin molded member and the second joint surface of the second resin molded member are joined, and the first joint surface and the In the flow path structure in which the flow path forming groove is formed in at least one of the second bonding surfaces, a recess is formed in at least one of the first bonding surface and the second bonding surface, At least one of the first resin molded member and the second resin molded member is formed with a deaeration passage for communicating the recess with the outside.

  In the present invention, when molding a resin molded member, even when a depression due to the contact of the eject pin is generated, the air accumulated in the depression escapes to the outside through the deaeration passage. Therefore, bubbles do not enter the bonding area between the first bonding surface and the second bonding surface. Accordingly, it is possible to prevent bubbles from remaining in the bonding region, and thus it is possible to prevent the occurrence of non-bonded portions due to the remaining bubbles. Therefore, no non-bonded portion is generated in the vicinity of the flow path, so that leakage of the sample liquid from the flow path can be prevented.

  In this invention, the said deaeration channel | path can be comprised by the groove | channel formed in at least one of the said 1st joining surface and the said 2nd joining surface.

  In this invention, you may comprise the said deaeration channel | path by the through-hole formed in at least one of the said 1st resin molding member and the said 2nd resin molding member.

  In another form of this invention, the 1st joining surface of the 1st resin molding member and the 2nd joining surface of the 2nd resin molding member are joined, The 1st joining surface and the 2nd joining In the flow path structure in which the flow path forming groove is formed in at least one of the surfaces, a recess is formed in at least one of the first joint surface side and the second joint surface side, and the first In each of the resin molded member and the second resin molded member, the first joint surface side and the second joint surface side are areas where the depressions are avoided, and the first joint surface and the second joint surface are formed. It is characterized by being a joining region with the joining surface.

  In the present invention, when the resin molded member is molded, the resin molded members are joined to each other in a region where the recess is avoided even when a recess is generated in the portion where the eject pin is in contact. Accordingly, since air in the recess does not enter the joining region between the first joining surface and the second joining surface, it is possible to prevent bubbles from remaining in the joining region, which results from the remaining bubbles. Generation | occurrence | production of a non-joining part can be prevented. Therefore, no non-bonded portion is generated in the vicinity of the flow path, so that leakage of the sample liquid from the flow path can be prevented.

  In the present invention, at least one of the first resin molded member and the second resin molded member is chamfered at an edge located at an outer peripheral edge of a joint region between the first joint surface and the second joint surface. It is preferable that processing has been performed. Such a configuration can be applied regardless of whether or not there is a depression on the bonding surface side.

  That is, in still another embodiment of the present invention, the first joint surface of the first resin molded member and the second joint surface of the second resin molded member are joined, and the first joint surface and the first joint surface are joined. In the flow path structure in which the flow path forming groove is formed in at least one of the two bonding surfaces, the first bonding surface and the at least one of the first resin molded member and the second resin molded member The edge part located in the outer periphery of a joining area | region with a 2nd joining surface is chamfered, It is characterized by the above-mentioned.

  In this invention, since the edge part of the resin molding member located in the outer periphery of the joining area | region of a 1st joining surface and a 2nd joining surface is given, the 1st joining surface and the 2nd Air bubbles that tend to remain in the joint area with the joint surface are easily released to the outside. In particular, when adhesive or solvent bonding is used to join resin molded members, the adhesive is more likely to solidify or evaporate on the outer peripheral side of the bonding area than the inside, and the bonding can be done in a short time. Air bubbles are likely to remain inside after completion, but if chamfering is performed so that a large amount of adhesive or solvent accumulates on the outer peripheral side of the joining region between the resin molded members, joining at this part is delayed. be able to. Therefore, since it becomes easy to discharge | release a bubble from an inner side, it can prevent that a bubble remains in a joining area | region. Therefore, it is possible to prevent the occurrence of a non-joined portion due to residual bubbles, and no non-joined portion is generated in the vicinity of the flow channel, so that leakage of the sample liquid from the flow channel can be prevented.

  In the present invention, the flow path forming groove is configured to have a width dimension of 500 μm or less, for example. In the present invention, the flow path forming groove is configured to have a depth dimension of 500 μm or less, for example.

  In the flow path structure manufacturing method according to the present invention, the first resin molding member and the second resin in a state where a solvent is interposed between the first joint surface and the second joint surface. It is preferable to press and join the molded members. According to such a method, compared with a bonding method using an adhesive or a bonding method in which a bonding surface is melted, when the flow path forming groove is fine, for example, the width dimension of the flow path forming groove is 500 μm. Even in the following cases or when the depth dimension of the flow path forming groove is 500 μm or less, the problem that the flow path is crushed can be avoided.

  According to the present invention, it is possible to prevent bubbles from remaining in the bonding region between the first bonding surface and the second bonding surface, thereby preventing the occurrence of non-bonded portions due to the remaining bubbles. Can do. Therefore, no non-bonded portion is generated in the vicinity of the flow path, so that leakage of the sample liquid from the flow path can be prevented.

  Hereinafter, a flow path structure to which the present invention is applied will be described with reference to the drawings.

[Embodiment 1]
1 (A) and 1 (B) are a plan view and a cross-sectional view taken along the line AA ′ of the flow path structure according to Embodiment 1 of the present invention, respectively.

  A flow path structure 1 shown in FIGS. 1A and 1B constitutes a flow path structural member used for a biochip or the like, and has a two-dimensional or three-dimensional flow path 5 (hollow portion) inside. ) Is configured. Moreover, the flow path structure 1 can optically detect a specific substance contained in the test liquid by allowing the test liquid to pass through the flow path 5 formed inside.

  The flow path structure 1 in this embodiment is obtained by joining a first resin molded member 2 and a second resin molded member 3 formed by molding an acrylic resin into a plate shape. That is, a fine flow path forming groove 21 for forming the flow path 5 is formed on the bonding surface 20 (first bonding surface) of the first resin molded member 2, and the second resin molded member 3 has A through hole 32 used as a test solution inlet is formed, and when the first resin molded member 2 and the second resin molded member 3 are joined, the upper side of the flow path forming groove 21 is the second. The flow path 5 is formed by being blocked by the resin molding member 3, and the through hole 32 communicates with the flow path 5. Here, the flow path forming groove 21 is fine and has, for example, a width dimension of 500 μm or less and a depth dimension of 500 μm or less. In this embodiment, the first resin molded member 2 and the second resin molded member 3 are the same size, and the flow path structure 1 is configured in a state of being completely overlapped with each other, so that the entire surface thereof is a bonding region. It is.

  The second resin molded member 3 is formed with a through hole 33 for injecting a solvent at the time of joining. Although FIG. 1 shows an example in which one through hole 33 is formed, a plurality of through holes 33 may be formed. Further, the through hole 32 for introducing the test solution may be used for solvent injection.

  Since the first resin molding member 2 and the second resin molding member 3 are formed by resin molding, the bonding surface 20 of the first resin molding member 2 and the bonding surface 30 of the second resin molding member 3 are formed. In the (second bonding surface), in each of the four corners, depressions 28, 38 (in the places where the eject pins contacted when the first resin molded member 2 and the second resin molded member 3 are taken out from the mold) Eject pin marks) are formed. In the present embodiment, the recesses 28 and 38 are formed at positions where the first resin molded member 2 and the second resin molded member 3 are overlapped with each other.

  Since such cavities 28 and 38 cause bubbles to remain at the time of joining, which will be described later, in the present embodiment, formation positions of the plurality of dents 28 and 38 are formed on the joint surface 30 of the second resin molded member 3. A deaeration groove 35 (a deaeration passage) is formed so as to pass through, and the deaeration groove 35 reaches the outer peripheral edge of the joint surface 30 of the second resin molding member 3. Such a deaeration groove 35 can be formed by forming a protrusion on the mold when the first resin molding member 2 and the second resin molding member 3 are formed by resin molding. It can be formed by secondary processing such as cutting after forming the first resin molded member 2 and the second resin molded member 3 by molding.

  In order to manufacture the flow path structure 1 using the resin molded members 2 and 3 configured as described above, first, the first resin molded member 2 and the second resin are formed such that the joint surfaces 20 and 30 overlap each other. The molded member 3 is overlapped. As a result, the depressions 28 and 38 and the deaeration groove 35 are covered with the joint surface 20 of the first resin molding member 2 at the lower side, but the deaeration groove 35 is formed on the joint surface 30 of the second resin molding member 3. Since it reaches the outer peripheral edge, the recesses 28 and 38 communicate with the outside through the deaeration groove 35.

  Next, a solvent such as propyl alcohol is injected from the through hole 33. As a result, the solvent spreads thinly between the joint surfaces 20 and 30.

  Next, the first resin molded member 2 and the second resin molded member 3 are pressurized while heating the first resin molded member 2 and the second resin molded member 3 to about 60 ° C., for example. The first resin molded member 2 and the second resin molded member 3 are solvent-bonded to obtain the flow path structure 1.

  When the flow path structure 1 is manufactured by such a method, the air accumulated in the recesses 28 and 38 escapes to the outside through the deaeration groove 35 (deaeration passage), so that bubbles enter the joining region. There is no. Accordingly, it is possible to prevent bubbles from remaining in the bonding region, and thus it is possible to prevent the occurrence of non-bonded portions due to the remaining bubbles. Therefore, no non-joined portion is generated in the vicinity of the flow path 5, and thus leakage of the sample liquid from the flow path can be prevented. Further, in this embodiment, since the solvent bonding is adopted, even if the flow path forming groove 21 is fine as compared with the bonding method using an adhesive or the bonding method for melting the bonding surface, the flow path 5 is The problem of being crushed can be avoided.

[Embodiment 2]
2A and 2B are a plan view and a BB ′ cross-sectional view, respectively, of a flow path structure according to Embodiment 2 of the present invention.

  Even in the flow path structure 1 shown in FIGS. 2A and 2B, the flow path forming body 21 that forms the flow path 5 is formed on the joint surface 20 of the first resin molding member 2. The resin molded member 3 is formed with a through-hole 32 used as a test solution introduction port or the like. When the first resin molded member 2 and the second resin molded member 3 are joined, a flow path forming groove is formed. The upper part of 21 is blocked by the second resin molding member 3 to form the flow path 5, and the through hole 32 communicates with the flow path 5. Here, the flow path forming groove 21 is fine and has, for example, a width dimension of 500 μm or less and a depth dimension of 500 μm or less. In this embodiment, the first resin molded member 2 and the second resin molded member 3 are the same size, and the flow path structure 1 is configured in a state of being completely overlapped with each other, so that the entire surface thereof is a bonding region. It is.

  Also in this embodiment, the bonding surface 20 of the first resin molding member 2 and the bonding surface 30 of the second resin molding member 3 are provided with depressions 28 and 38 (ejects) at the respective four corners by contact of the eject pins. Pin marks) are formed. In the present embodiment, the recesses 28 and 38 are formed at positions where the first resin molded member 2 and the second resin molded member 3 are overlapped with each other.

  In the present embodiment, the second resin molded member 3 is formed with a through hole 36 (a deaeration passage) that reaches the recess 38. Such a through hole 36 can be formed by forming pin-shaped protrusions on the mold when the first resin molded member 2 and the second resin molded member 3 are formed by resin molding. The first resin molding member 2 and the second resin molding member 3 can be formed by drilling (secondary processing) after forming.

  In order to manufacture the flow path structure 1 using the resin molded members 2 and 3 configured as described above, first, the first resin molded member 2 and the second resin are formed such that the joint surfaces 20 and 30 overlap each other. The molded member 3 is overlapped. As a result, the depressions 28 and 38 are covered with the joint surface 20 of the first resin molding member 2 at the bottom, but the depressions 28 and 38 are formed in the second resin molding member 3 because the through holes 36 are formed. Is in communication with the outside through a through hole 36.

  Next, a solvent such as propyl alcohol is injected from the through hole 33. As a result, the solvent spreads thinly between the joint surfaces 20 and 30.

  Next, the first resin molded member 2 and the second resin molded member 3 are pressurized while heating the first resin molded member 2 and the second resin molded member 3 to about 60 ° C., for example. The first resin molded member 2 and the second resin molded member 3 are solvent-bonded to obtain the flow path structure 1.

  When the flow path structure 1 is manufactured by such a method, the air accumulated in the recesses 28 and 38 escapes to the outside through the through hole 36 (deaeration passage), so that bubbles may enter the joining region. Absent. Accordingly, it is possible to prevent bubbles from remaining in the bonding region, and thus it is possible to prevent the occurrence of non-bonded portions due to the remaining bubbles. Therefore, since no non-joined portion is generated in the vicinity of the flow path 5, the same effects as in the first embodiment can be obtained, such as prevention of leakage of the sample liquid from the flow path.

[Embodiment 3]
3A, 3B, and 3C are respectively a plan view of a flow path structure according to Embodiment 3 of the present invention, a cross-sectional view thereof taken along the line C-C ', and an enlarged outer peripheral edge of the joining region. FIG.

  3A and 3B, as in the first and second embodiments, the fine channel that forms the channel 5 on the joint surface 20 of the first resin molding member 2 is also used. The formation groove 21 is formed, and the second resin molded member 3 is formed with a through-hole 32 used as a test solution introduction port or the like, and the first resin molded member 2 and the second resin molded member 3 are formed. Are joined to the second resin molding member 3 to form the flow path 5 and the through hole 32 communicates with the flow path 5. Here, the flow path forming groove 21 is fine and has, for example, a width dimension of 500 μm or less and a depth dimension of 500 μm or less. Also in this embodiment, the bonding surface 20 of the first resin molding member 2 and the bonding surface 30 of the second resin molding member 3 are provided with depressions 28 and 38 (ejects) at the respective four corners by contact of the eject pins. Pin marks) are formed. In the present embodiment, the recesses 28 and 38 are formed at positions where the first resin molded member 2 and the second resin molded member 3 are overlapped with each other.

  Here, a deaeration groove 35 (a deaeration passage) is formed on the joint surface 30 of the second resin molding member 3 so as to pass through the formation positions of the plurality of depressions 28 and 38. The second resin molding member 3 reaches the outer peripheral edge of the joint surface 30.

  Moreover, in this form, as shown in FIG.3 (C), in the 1st resin molding member 2 and the 2nd resin molding member 3, the edge part located in the outer periphery of a joining area | region is given, Tapered surfaces 27 and 37 are formed. In this embodiment, the first resin molded member 2 and the second resin molded member 3 are the same size, and the flow path structure 1 is configured in a state of being completely overlapped with each other, so that the entire surface thereof is a bonding region. It is. Therefore, the entire outer peripheral edges of the first resin molded member 2 and the second resin molded member 3 are chamfered to form tapered surfaces 27 and 37. Such taper surfaces 27 and 37 can be formed by tapering the entrance angle of the mold when the first resin molded member 2 and the second resin molded member 3 are formed by resin molding. It can be formed by secondary processing after forming the first resin molded member 2 and the second resin molded member 3 by resin molding.

  In order to manufacture the flow path structure 1 using the resin molded members 2 and 3 configured as described above, first, the first resin molded member 2 and the second resin are formed such that the joint surfaces 20 and 30 overlap each other. The molded member 3 is overlapped. As a result, the depressions 28 and 38 and the deaeration groove 35 are covered with the joint surface 20 of the first resin molding member 2 at the lower side, but the deaeration groove 35 is formed on the joint surface 30 of the second resin molding member 3. Since it reaches the outer peripheral edge, the recesses 28 and 38 communicate with the outside through the deaeration groove 35. Moreover, the clearance gap formed between the 1st resin molding member 2 and the 2nd resin molding member 3 by the taper surfaces 27 and 37 is opened large toward the outer side.

  Next, a solvent such as propyl alcohol is injected from the through hole 33. As a result, the solvent spreads thinly between the joint surfaces 20 and 30. Further, in the gap between the first resin molded member 2 and the second resin molded member 3, a large amount of solvent accumulates at the outer peripheral edge.

  Next, the first resin molded member 2 and the second resin molded member 3 are pressurized while heating the first resin molded member 2 and the second resin molded member 3 to about 60 ° C., for example. The first resin molded member 2 and the second resin molded member 3 are solvent-bonded to obtain the flow path structure 1.

  When the flow path structure 1 is manufactured by such a method, the air accumulated in the recesses 28 and 38 escapes to the outside through the through hole 36 (deaeration passage), so that bubbles may enter the joining region. Absent. Therefore, since bubbles can be prevented from remaining in the joining region, the same effects as those of the first and second embodiments can be achieved, such as the generation of non-joined portions due to the remaining bubbles.

  In addition, a wide gap between the first resin molded member 2 and the second resin molded member 3 at the outer peripheral edge is formed by the tapered surfaces 27 and 37 from the outer peripheral edge to the inner side. For this reason, it is easy to discharge | release the bubble which tends to remain between the 1st resin molding member 2 and the 2nd resin molding member 3 outside. Further, in this embodiment, since the solvent adhesion is used for joining the first resin molded member 2 and the second resin molded member 3, the evaporation of the solvent is more likely to occur on the outer peripheral side of the joining region compared to the inner side. Although the joining is easy to complete, in this embodiment, since a large amount of solvent is accumulated on the outer peripheral side of the joining region due to the formation of the tapered surfaces 27 and 37, the joining at this part can be delayed. Therefore, since it is easy to discharge | release a bubble from an inner side, it can prevent that a bubble remains in a joining area | region. Therefore, it is possible to prevent the occurrence of a non-joined portion due to residual bubbles, so that no non-joined portion is generated in the vicinity of the flow channel 5, so that leakage of the sample liquid from the flow channel 5 can be prevented. . Furthermore, even if protrusions such as burrs are generated on the outer peripheral edges of the first resin molded member 2 and the second resin molded member 3 after the resin molding, such protrusions can be removed, so that bubbles are formed in the joining region. Can be prevented, and the occurrence of non-joined portions due to the remaining of bubbles in the vicinity of the flow path 5 can be prevented.

  Note that the chamfering described in this embodiment can also be applied to the second embodiment.

[Embodiment 4]
4 (A) and 4 (B) are a plan view and a DD ′ cross-sectional view, respectively, of a flow path structure according to Embodiment 4 of the present invention.

  4A and 4B, the flow channel structure 1 shown in FIGS. 4A and 4B also has a fine flow channel forming groove that forms the flow channel 5 on the joint surface 20 of the first resin molding member 2, as in the first embodiment. 21 is formed, and the second resin molded member 3 is formed with a through-hole 32 used as a test solution introduction port or the like, and the first resin molded member 2 and the second resin molded member 3 are connected to each other. When joined, the upper part of the flow path forming groove 21 is closed by the second resin molding member 3 to form the flow path 5, and the through hole 32 communicates with the flow path 5. Here, the flow path forming groove 21 is fine and has, for example, a width dimension of 500 μm or less and a depth dimension of 500 μm or less.

  Also in this embodiment, depressions 28 and 38 (eject pin marks) are formed on the joining surface 20 of the first resin molding member 2 and the joining surface 30 of the second resin molding member 3 at locations where the eject pins contact. However, in this embodiment, depressions 28 and 38 are formed at three corners among the four corners of the joint surface 20 of the first resin molding member 2 and the joint surface 30 of the second resin molding member 3. Yes.

  Here, the first resin molding member 2 and the second resin molding member 3 are not completely overlapped, and the recesses 28 and 38 remain open. That is, in this embodiment, the first resin molded member 2 and the second resin molded member 3 are shifted in the diagonal direction including the corners where the recesses 28 and 38 are not formed. Remains open.

  In order to manufacture the flow path structure 1 using the resin molded members 2 and 3 configured as described above, first, the first resin molded member 2 and the second resin are formed such that the joint surfaces 20 and 30 overlap each other. The molded member 3 is overlapped. In that case, the 1st resin molding member 2 and the 2nd resin molding member 3 are shifted to a diagonal direction, and all the hollows 28 and 38 are made into an open state.

  Next, a solvent such as propyl alcohol is injected from the through hole 33. As a result, the solvent spreads thinly between the joint surfaces 20 and 30.

  Next, the first resin molded member 2 and the second resin molded member 3 are pressurized while heating the first resin molded member 2 and the second resin molded member 3 to about 60 ° C., for example. The first resin molded member 2 and the second resin molded member 3 are solvent-bonded to obtain the flow path structure 1.

  As described above, in this embodiment, in the first resin molded member 2 and the second resin molded member 3, a region where the depressions 28 and 38 are avoided on the side of the bonding surfaces 20 and 30 is used as a bonding region. For this reason, since the air in the depressions 28 and 38 does not enter the joining region, it is possible to prevent bubbles from remaining in the joining region, and to prevent the occurrence of non-joined portions due to the remaining bubbles. Can do. Therefore, no non-bonded portion is generated in the vicinity of the flow path 5, so that leakage of the sample liquid from the flow path 5 can be prevented. Further, when it is necessary to form electrode terminals or the like in the first resin molded member 2 and the second resin molded member 3, the electrode terminals are formed in the first resin molded member 2 and the second overhanging region. For example, a flexible wiring board can be easily connected.

  Note that the chamfering described in the third embodiment can also be applied to this embodiment. That is, also in this embodiment, chamfering may be applied to the edge portion located on the outer peripheral edge of the joining region in the first resin molded member 2 and the second resin molded member 3.

[Embodiment 5]
5A, 5B, and 5C are respectively a plan view of a flow channel structure according to Embodiment 5 of the present invention, an EE ′ cross-sectional view thereof, and an outer peripheral edge of the joining region. FIG.

  The chamfering process described in the third embodiment may be employed regardless of whether there is a depression on the joint surface or a deaeration measure against the depression as in this embodiment.

  5A and 5B, as in the first and second embodiments, a fine flow path that forms the flow path 5 on the joint surface 20 of the first resin molding member 2 is also used. A formation groove 21 is formed, and the second resin molding member 3 is formed with a circular through hole 32 used as a test solution introduction port or the like, and the first resin molding member 2 and the second resin molding are formed. When the member 3 is joined, the flow path forming groove 21 is closed by the second resin molding member 3 to form the flow path 5, and the through hole 32 communicates with the flow path 5. Here, the flow path forming groove 21 is fine and has, for example, a width dimension of 500 μm or less and a depth dimension of 500 μm or less.

  Moreover, in this form, as shown in FIG.5 (C), in the 1st resin molding member 2 and the 2nd resin molding member 3, the edge part located in the outer periphery of a joining area | region is given, Tapered surfaces 27 and 37 are formed. In this embodiment, the first resin molded member 2 and the second resin molded member 3 are the same size, and the flow path structure 1 is configured in a state of being completely overlapped with each other, so that the entire surface thereof is a bonding region. It is. Accordingly, the entire outer periphery of the first resin molded member 2 and the second resin molded member 3 is chamfered to form tapered surfaces 27 and 37.

  In order to manufacture the flow path structure 1 using the resin molded members 2 and 3 configured as described above, first, the first resin molded member 2 and the second resin are formed such that the joint surfaces 20 and 30 overlap each other. The molded member 3 is overlapped.

  Next, a solvent such as propyl alcohol is injected from the through hole 33. As a result, the solvent spreads thinly between the joint surfaces 20 and 30. Further, a large amount of solvent is accumulated at the outer peripheral edge between the first resin molded member 2 and the second resin molded member 3.

  Next, the first resin molded member 2 and the second resin molded member 3 are pressurized while heating the first resin molded member 2 and the second resin molded member 3 to about 60 ° C., for example. The first resin molded member 2 and the second resin molded member 3 are solvent-bonded to obtain the flow path structure 1.

  When the flow path structure 1 is manufactured by such a method, the outer peripheral edge between the first resin molded member 2 and the second resin molded member 3 is slightly inward from the outer peripheral edge by the tapered surfaces 27 and 37. A wide gap is invading. For this reason, it is easy to discharge | release the bubble which remains on the outer peripheral side between the 1st resin molding member 2 and the 2nd resin molding member 3 outside. Further, in this embodiment, since the solvent adhesion is used for joining the first resin molded member 2 and the second resin molded member 3, the evaporation of the solvent is more likely to occur on the outer peripheral side of the joining region compared to the inner side. Although the joining is easy to complete, in this embodiment, since a large amount of solvent is accumulated on the outer peripheral side of the joining region due to the formation of the tapered surfaces 27 and 37, the joining at this part can be delayed. Therefore, since it is easy to discharge | release a bubble from an inner side, it can prevent that a bubble remains in a joining area | region. Therefore, it is possible to prevent the occurrence of a non-joined portion due to residual bubbles, so that no non-joined portion is generated in the vicinity of the flow channel 5, so that leakage of the sample liquid from the flow channel 5 can be prevented. . Furthermore, even if protrusions such as burrs are generated on the outer peripheral edges of the first resin molded member 2 and the second resin molded member 3 after the resin molding, such protrusions can be removed, so that bubbles are formed in the joining region. Can be prevented, and the occurrence of non-joined portions due to the remaining of bubbles in the vicinity of the flow path 5 can be prevented.

[Example of evaluation results]
(Example 1 / Embodiment 1)
In this example, acrylic resin plates were used as the first resin molded member 2 and the second resin molded member 3. A through hole 32 was formed in the second resin molded member 3, and a flow path forming groove 21 having a width of 200 μm and a depth of 200 μm was formed in the first resin molded member 2. The through hole 32 and the flow path forming groove 21 are overlapped with each other when the first resin molded member 2 and the second resin molded member 3 are overlapped. Arrange so that. Further, in the vicinity of the corners of the first resin molded member 2 and the second resin molded member 3, recesses 28 and 38 (φ1.5 mm, depth 30 μm) which are eject pin marks are formed. The resin molded member 3 was formed with a deaeration groove 35 that communicates the depressions 28 and 38 with the outside with a cutting blade. In this example, the end portions of the first resin molded member 2 and the second resin molded member 3 are not subjected to C chamfering.

  Next, in the bonding step, 2-propanol is injected as a solvent between the bonding surface of the first resin molding member 2 and the bonding surface of the second resin molding member 3, and then pressurized at about 50 kPa, It was left at 60 ° C. for a certain time.

(Example 2 / Embodiment 2)
In the present embodiment, the flow path forming groove 21 formed in the first resin molded member 2 has a width of 300 μm and a depth of 300 μm. Further, in the vicinity of the corners of the first resin molded member 2 and the second resin molded member 3, recesses 28 and 38 (φ1.5 mm, depth 30 μm) which are eject pin marks are formed. The resin molded member 3 was formed with a deaeration groove 35 that communicates the depressions 28 and 38 with the outside with a cutting blade. In this example, the end portions of the first resin molded member 2 and the second resin molded member 3 are not subjected to C chamfering. In this example, since the depth of the flow path forming groove 21 is deeper than that of the first embodiment, the pressure applied so as not to generate cracks is set to about 10 kPa, and the pressure applied is lower than that of the first embodiment. Other configurations in the first resin molded member 2 and the second resin molded member 3 and other conditions in the joining step are the same as those in the first embodiment.

(Example 3 / Embodiment 3)
In the present embodiment, the flow path forming groove 21 formed in the first resin molded member 2 has a width of 300 μm and a depth of 300 μm. Further, in the vicinity of the corners of the first resin molded member 2 and the second resin molded member 3, recesses 28 and 38 (φ1.5 mm, depth 30 μm) which are eject pin marks are formed. The resin molded member 3 was formed with a deaeration groove 35 that communicates the depressions 28 and 38 with the outside with a cutting blade. Further, C chamfered portions (tapered surfaces 27 and 37) were formed at the end portions of the first resin molded member 2 and the second resin molded member 3 over a width of about 0.3 mm. In this example, since the depth of the flow path forming groove 21 is deeper than that of the first embodiment, the pressure applied so as not to generate cracks is set to about 10 kPa, and the pressure applied is lower than that of the first embodiment. Other configurations in the first resin molded member 2 and the second resin molded member 3 and other conditions in the joining step are the same as those in the first and second embodiments.

(Comparative example)
The conditions of this example are the same as the conditions of Example 1, except that the deaeration groove 35 is omitted, and the other conditions are the same as those of Example 1.

(Evaluation results)
In the above comparative example, a non-adhered portion due to the remaining bubbles was generated at the end, and liquid leakage in the flow path 5 was confirmed. On the other hand, in each of the above Examples 1 to 3, unlike the comparative example, there was no occurrence of a non-adhered portion due to residual bubbles, and no liquid leakage occurred in the flow path 5. In Example 2, bubbles were slightly left at the end as much as the pressing force was lower than that in Example 1, but no liquid leakage occurred in the flow path 5. In contrast, in Example 3, the pressing force was lower than that in Example 1, but unlike Example 2, no bubbles remained at the ends.

[Other embodiments]
Although the flow path structure 1 of the said form is comprised by superimposing the two resin molding members 2 and 3, also in the flow path structure comprised by superimposing a plurality of resin molding members, The present invention can be applied.

  In the flow path structure 1 of the above-described form, acrylic resin is used as the resin molding members 2 and 3, but polycarbonate resin and acrylonitrile / butadiene / styrene resin may be used.

  Examples of the solvent used in the above form include alcohols, ketones, and hydrocarbon solvents.

  Although the flow path structure 1 of the said form joins the two resin molding members 2 and 3 using a solvent, the resin molding members 2 and 3 are closely_contact | adhered and heated and pressurized without using a solvent. The present invention can also be applied to a flow path structure that joins resin molded members together.

  In the above embodiment, the recesses 28 and 38 are eject pin marks that extrude the resin molded member during the mold release step of releasing the resin molded member from the mold, but the recesses 28 and 38 other than the eject pin marks are formed. It can also be applied when

(A), (B) is the top view of the flow-path structure based on Embodiment 1 of this invention, respectively, and its AA 'sectional drawing. (A), (B) is the top view of the flow-path structure based on Embodiment 2 of this invention, respectively, and its BB 'sectional drawing. (A), (B), (C) is an enlarged plan view of the flow path structure according to Embodiment 3 of the present invention, its C-C 'cross-sectional view, and the outer peripheral edge of the joining region. It is sectional drawing. (A), (B) is the top view of the flow-path structure based on Embodiment 4 of this invention, respectively, and its DD 'sectional drawing. (A), (B), (C) is an enlarged plan view of the flow path structure according to Embodiment 5 of the present invention, its EE ′ cross-sectional view, and the outer peripheral edge of the joining region. It is sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flow path structure body 2 1st resin molding member 3 2nd resin molding member 5 Flow path 20, 30 Joint surface 21 Flow path formation groove | channel 27, 37 Tapered surface 28, 38 Indentation 32 Through-hole 33 for test solution injection | pouring Through hole 35 for solvent injection Deaeration groove 36 Through hole for deaeration

Claims (9)

The first joint surface of the first resin molding member and the second joint surface of the second resin molding member are joined, and a flow path is formed on at least one of the first joint surface and the second joint surface In the flow path structure in which the groove is formed,
A recess is formed in at least one of the first joint surface and the second joint surface,
At least one of the first resin molding member and the second resin molding member is formed with a deaeration passage that allows the depression to communicate with the outside. In claim 1,
The deaeration passage is formed by a groove formed in at least one of the first joint surface and the second joint surface. In claim 1,
The deaeration passage is formed by a through hole formed in at least one of the first resin molding member and the second resin molding member. The first joint surface of the first resin molding member and the second joint surface of the second resin molding member are joined, and a flow path is formed on at least one of the first joint surface and the second joint surface In the flow path structure in which the groove is formed,
A depression is formed in at least one of the first joint surface side and the second joint surface side,
In each of the first resin molding member and the second resin molding member, a region avoiding the dent in the first joint surface side and the second joint surface side is the first joint surface. A flow path structure, characterized in that the flow path structure is a bonding region with the second bonding surface. In any of claims 1 to 4,
A chamfering process is performed on an edge located at an outer peripheral edge of a joining region between the first joining surface and the second joining surface at least one of the first resin molding member and the second resin molding member. A flow path structure characterized by comprising: The first joint surface of the first resin molding member and the second joint surface of the second resin molding member are joined, and a flow path is formed on at least one of the first joint surface and the second joint surface In the flow path structure in which the groove is formed,
A chamfering process is performed on an edge located at an outer peripheral edge of a joining region between the first joining surface and the second joining surface at least one of the first resin molding member and the second resin molding member. A flow path structure characterized by comprising: In any one of Claims 1 thru | or 6.
The flow path forming body, wherein the flow path forming groove has a width dimension of 500 μm or less. In claim 7,
The flow path formation body, wherein the flow path forming groove has a depth dimension of 500 μm or less. In the manufacturing method of the channel composition object according to any one of claims 1 to 8,
The first resin molding member and the second resin molding member are pressed and joined in a state where a solvent is interposed between the first joining surface and the second joining surface. A method for producing a flow path structure.

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