JP2007311258A - Alloy manufacturing method and flat cable manufacturing method - Google Patents

Alloy manufacturing method and flat cable manufacturing method Download PDF

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JP2007311258A
JP2007311258A JP2006140758A JP2006140758A JP2007311258A JP 2007311258 A JP2007311258 A JP 2007311258A JP 2006140758 A JP2006140758 A JP 2006140758A JP 2006140758 A JP2006140758 A JP 2006140758A JP 2007311258 A JP2007311258 A JP 2007311258A
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tin
plated copper
manufacturing
flat cable
coil
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JP4640260B2 (en
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Hironori Matsumoto
浩典 松本
Shinji Hiroto
慎治 広戸
Toshinori Yoshiba
利紀 吉羽
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Sumitomo Electric Industries Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an alloy manufacturing method and a flat cable manufacturing method preventing the formation of whiskers by forming an optimum alloy layer. <P>SOLUTION: Tinned copper filaments 10 are allowed to pass through above a coil 12 to which high frequency voltage is applied to generate the magnetic field. An induction current is thereby generated to the tinned copper filaments 10 to generate heat, and the tinned copper filaments 10 can be heated with sharp rising to form an alloy layer 11. Temperature can be regulated by regulating the feed speed of the tinned copper filaments 10, adjusting a distance between the coil 12 and the tinned copper filaments 10 because of non-contact, or the like in addition to high frequency voltage control. At this time, since the tinned copper filaments 10 are heated to a temperature slightly lower than the fusing point of tin, the occurrence of tin accumulation is suppressed while forming the alloy layer 11. The formation of whiskers can thereby be suppressed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は合金の製造方法およびフラットケーブルの製造方法に係り、例えば錫メッキ銅を合金化する合金の製造方法および電子機器等に用いられる多心のフラットケーブルの製造方法に関するものである。   The present invention relates to a method for producing an alloy and a method for producing a flat cable, for example, a method for producing an alloy for alloying tin-plated copper, and a method for producing a multi-core flat cable used in an electronic device or the like.

近年、電子機器の小型化、軽量化に伴い、これらに搭載される電子部品、配線用部品等の小型化が進んでいる。特に、電気配線のための配線部材は、限られたスペースで高密度の配線が可能なものが要望されている。このような配線部材としては、可撓性の回路基板や平型導体を用いたフラットケーブル、また、これらの接続に用いられる電気コネクタ等がある。これらの配線部材は、多数の電気導体が高密度に配され互いに電気的に絶縁されるとともに、良好な電気接続の保証が求められている。   In recent years, with the reduction in size and weight of electronic devices, downsizing of electronic components, wiring components, and the like mounted thereon has progressed. In particular, wiring members for electrical wiring are required to be capable of high-density wiring in a limited space. Examples of such wiring members include a flexible circuit board, a flat cable using a flat conductor, and an electrical connector used for connecting these. These wiring members are required to have a large number of electrical conductors arranged at high density and electrically insulated from each other and to ensure good electrical connection.

これらの配線部材の電気導体には、通常、導電率がよく、延性に富み、適度な強度を有し、他の金属によるメッキが容易な銅が用いられている。この銅を用いた配線部材には、一般に、耐腐食性、半田付け性を目的として錫メッキが施されている。錫メッキは、通常、電気メッキにより形成されるが、この電気錫メッキの表面に針状結晶体（以下、「ウィスカ」という。）が発生することが知られている。   For the electrical conductors of these wiring members, copper is usually used which has good electrical conductivity, is rich in ductility, has an appropriate strength, and can be easily plated with other metals. The wiring member using copper is generally tin-plated for the purpose of corrosion resistance and solderability. Tin plating is usually formed by electroplating, and it is known that acicular crystals (hereinafter referred to as “whiskers”) are generated on the surface of the electrotin plating.

特に、銅系の金属材料に錫メッキをすると、銅原子が錫メッキ膜中に拡散して、銅−錫金属間化合物を作る。この金属間化合物は、錫と結晶構造が異なり、格子間距離に歪ができるため、錫メッキ膜中に圧縮応力が生じる。この圧縮応力がウィスカ成長の駆動力となるので、銅系材料上に錫メッキを施した場合には、ウィスカが発生しやすいとも言われている。例えば、図５に示すような、平角の錫メッキ銅線１０１を上下フィルム１０２、１０３によってラミネートしたフラットケーブル１００においてウィスカ１０４が発生すると、錫メッキ銅線１０１間を電気的に短絡する原因となるため、今までに種々の改善策が提案されている。   In particular, when tin plating is performed on a copper-based metal material, copper atoms diffuse into the tin plating film to form a copper-tin intermetallic compound. Since this intermetallic compound has a crystal structure different from that of tin and can be distorted in the interstitial distance, compressive stress is generated in the tin plating film. Since this compressive stress becomes a driving force for whisker growth, it is said that whisker is likely to occur when tin plating is applied to a copper-based material. For example, when a whisker 104 is generated in a flat cable 100 in which a flat rectangular tin-plated copper wire 101 is laminated with upper and lower films 102 and 103 as shown in FIG. 5, it causes a short circuit between the tin-plated copper wires 101. Therefore, various improvement measures have been proposed so far.

例えば、特許文献１には、錫メッキ導体を圧延または伸線した後に、温度２３２℃〜３５０℃で０．５秒〜３秒熱処理することにより、フラットケーブルにおけるウィスカの発生を抑えることが示されている。また、特許文献２には、ウィスカの発生を抑えるために、錫メッキ材を１８０℃〜錫の融点温度の範囲内の所定温度まで、昇温速度５℃〜１００℃／秒で急速加熱し、所定温度に１８０秒以内の間保持して熱処理することが示されている。
特開２００１−７３１８６号公報 特公昭６２−３２３９号公報 For example, Patent Document 1 shows that after rolling or drawing a tin-plated conductor, heat treatment is performed at a temperature of 232 ° C. to 350 ° C. for 0.5 seconds to 3 seconds to suppress whisker generation in the flat cable. ing. Patent Document 2 discloses that in order to suppress the occurrence of whiskers, the tin plating material is rapidly heated to a predetermined temperature within the range of 180 ° C. to the melting point temperature of tin at a heating rate of 5 ° C. to 100 ° C./second, It is shown that the heat treatment is performed while maintaining the predetermined temperature within 180 seconds.
JP 2001-73186 A Japanese Examined Patent Publication No. 62-3239

ところで、銅導体からなる平角導体を備えたフレキシブルなフラットケーブルを製造するためには、圧延した平角導体を熱処理して軟化させて良好な可撓性を確保する必要があり、このため、平角導体に通電してジュール熱を発生させて加熱する通電アニールを行っている。
しかし、この通電アニールは、温度を細かく制御することができないため、銅導体に形成された錫メッキが溶けだして長さ方向に移動してしまい、錫メッキの厚さにばらつきが生じてしまう。 By the way, in order to manufacture a flexible flat cable having a flat conductor made of a copper conductor, it is necessary to heat and soften the rolled flat conductor to ensure good flexibility. Is energized to generate Joule heat and heat.
However, in this energization annealing, since the temperature cannot be finely controlled, the tin plating formed on the copper conductor starts to melt and moves in the length direction, resulting in variations in the thickness of the tin plating.

そして、このように錫メッキの厚さにばらつきが生じると、特許文献１、２のようなウィスカの低減のための熱処理を行ったとしても、錫メッキの厚さが厚くなった部分にコネクタ端子が当たることにより、ウィスカが成長して短絡が発生するなどの不具合が生じてしまう。また、錫メッキの厚さが薄くなった部分では、コネクタ端子との接続信頼性が低下してしまうという不都合がある。   And when variation in the thickness of the tin plating occurs in this way, even if the heat treatment for reducing whiskers as in Patent Documents 1 and 2 is performed, the connector terminal is formed in the portion where the thickness of the tin plating is increased. As a result, the whisker grows and a short circuit occurs. Further, in the portion where the thickness of the tin plating is reduced, there is a disadvantage that the connection reliability with the connector terminal is lowered.

例えば、特許文献１に記載の熱処理では、錫の融点以上で加熱を行うために、溶融した錫が移動して錫メッキの厚さにばらつきが生じやすい。
また、特許文献２に記載の熱処理では、基材の銅を軟化させるものではなく、良好な可撓性を有するフラットケーブルの導体を形成する際の熱処理として適していない。 For example, in the heat treatment described in Patent Document 1, since heating is performed at a temperature equal to or higher than the melting point of tin, molten tin moves and the thickness of tin plating tends to vary.
Further, the heat treatment described in Patent Document 2 does not soften the copper of the base material, and is not suitable as a heat treatment when forming a flat cable conductor having good flexibility.

本発明の目的は、最適な合金層を形成することによりウィスカの発生を防止することができる合金の製造方法およびフラットケーブルの製造方法を提供することにある。   The objective of this invention is providing the manufacturing method of the alloy which can prevent generation | occurrence | production of a whisker by forming an optimal alloy layer, and the manufacturing method of a flat cable.

前述した目的を達成するために、本発明にかかる合金の製造方法は、錫メッキ銅線条体に錫銅合金層を形成する合金の製造方法であって、前記錫メッキ銅線条体を高周波電圧が印加されたコイル上を通過させて、前記錫メッキ銅線条体に誘導電流を発生させることにより発熱させて前記錫銅合金層を形成することにある。   In order to achieve the above-described object, an alloy manufacturing method according to the present invention is an alloy manufacturing method for forming a tin-copper alloy layer on a tin-plated copper wire, and the tin-plated copper wire is a high-frequency wave. The tin-copper alloy layer is formed by passing heat over a coil to which a voltage is applied and generating an induced current in the tin-plated copper wire to generate heat.

このように構成された合金の製造方法においては、錫メッキ銅線条体を高周波電圧が印加されたコイルの上方を通過させることにより、錫メッキ銅線条体に誘導電流を発生させて発熱させるので、急峻な立ち上がりで錫メッキ銅線条体を加熱することができ、合金層を形成することができる。また、温度の調整は、高周波電圧の制御のみならず、錫メッキ銅線条体の送り速度の調整、コイルと錫メッキ銅線条体との距離の調整等により行うことができる。   In the alloy manufacturing method configured as described above, a tin-plated copper wire is passed over a coil to which a high-frequency voltage is applied, thereby generating an induced current in the tin-plated copper wire and generating heat. Therefore, the tin-plated copper filament can be heated with a steep rise, and an alloy layer can be formed. The temperature can be adjusted not only by controlling the high-frequency voltage but also by adjusting the feed rate of the tin-plated copper wire, adjusting the distance between the coil and the tin-plated copper wire.

また、本発明にかかる合金の製造方法では、前記錫メッキ銅線条体を錫の融点よりも低い温度で加熱することが望ましい。この場合、合金層を形成するとともに錫だまりの発生を抑えるので、ウィスカの発生をさらに抑えることができる。   Moreover, in the manufacturing method of the alloy concerning this invention, it is desirable to heat the said tin plating copper filament at the temperature lower than melting | fusing point of tin. In this case, since the alloy layer is formed and the generation of tin pool is suppressed, the generation of whiskers can be further suppressed.

また、本発明にかかるフラットケーブルの製造方法は、複数本の錫メッキ銅線条体を一つの面上に供給して配列し、配列された前記複数本の錫メッキ銅線条体を高周波電圧が印加されたコイル上を通過させて、前記錫メッキ銅線条体に誘導電流を発生させることにより発熱させて錫銅合金層を有する錫メッキ銅線条体を形成し、前記錫メッキ銅線条体を絶縁樹脂で被覆することにある。   Further, the flat cable manufacturing method according to the present invention supplies and arranges a plurality of tin-plated copper filaments on one surface, and arranges the arranged tin-plated copper filaments at a high frequency voltage. The tin-plated copper wire has a tin-copper alloy layer having a tin-copper alloy layer by generating an induced current in the tin-plated copper wire and generating an induction current. It is to coat the strip with an insulating resin.

このように構成されたフラットケーブルの製造方法においては、一つの面上に供給されて配列された複数本の錫メッキ銅線条体を、高周波電圧が印加されたコイルの上方を通過させることにより、錫メッキ銅線条体に誘導電流を発生させて発熱させるので、急峻な立ち上がりで錫メッキ銅線条体を加熱することができ、合金層を形成することができる。このとき、温度の調整は、高周波電圧の制御や錫メッキ銅線条体の送り速度等により行うことができる。また、コイルと錫メッキ銅線条体との距離を調整することでも温度調整を行うことができる。その後、整列された複数本の錫メッキ銅線条体を絶縁樹脂で被覆してフラットケーブルを製造する。   In the flat cable manufacturing method configured as described above, a plurality of tin-plated copper wires supplied and arranged on one surface are passed over a coil to which a high-frequency voltage is applied. Since an induction current is generated in the tin-plated copper wire body to generate heat, the tin-plated copper wire body can be heated with a steep rise and an alloy layer can be formed. At this time, the temperature can be adjusted by controlling the high-frequency voltage, the feed rate of the tin-plated copper wire, or the like. The temperature can also be adjusted by adjusting the distance between the coil and the tin-plated copper wire. Thereafter, a flat cable is manufactured by covering a plurality of aligned tin-plated copper wires with an insulating resin.

また、本発明にかかるフラットケーブルの製造方法では、前記錫メッキ銅線条体を錫の融点よりも低い温度で加熱することが望ましい。この場合、合金層を形成するとともに錫だまりの発生を抑えるので、ウィスカの発生をさらに抑えることができる。   In the flat cable manufacturing method according to the present invention, it is desirable to heat the tin-plated copper wire at a temperature lower than the melting point of tin. In this case, since the alloy layer is formed and the generation of tin pool is suppressed, the generation of whiskers can be further suppressed.

本発明によれば、錫メッキ銅線条体を高周波電圧が印加されたコイルの上方を通過させることにより、錫メッキ銅線条体に誘導電流を発生させて発熱させるので、極短時間のうちに錫メッキ銅線条体を錫銅合金が形成される温度にまで昇温することができ、合金層形成の効率がよい。また、コイルの上方を通過した錫メッキ銅線条体を絶縁樹脂で被覆してフラットケーブルとする場合には、錫銅合金が形成される温度にまで錫メッキ銅線条体を昇温する時間が極短いので、線速を上げてフラットケーブルの生産効率を上げることができる。   According to the present invention, the tin-plated copper wire is caused to generate heat by generating an induction current in the tin-plated copper wire by passing over the coil to which the high-frequency voltage is applied. In addition, the tin-plated copper wire can be heated to a temperature at which the tin-copper alloy is formed, and the efficiency of forming the alloy layer is good. In addition, in the case where a tin-plated copper wire passed over the coil is covered with an insulating resin to form a flat cable, the time for raising the temperature of the tin-plated copper wire to a temperature at which a tin-copper alloy is formed Is extremely short, so the production speed of flat cables can be increased by increasing the line speed.

以下、本発明に係る実施形態を図面に基づいて詳細に説明する。
図１は本発明の第１実施形態に係る合金の製造方法を示す斜視図であり、図１（Ａ）はコイルが単円の場合を示す斜視図、図１（Ｂ）はコイルが多重円の場合を示す斜視図、図２（Ａ）は合金層が形成された錫メッキ銅線条体の断面図、図２（Ｂ）は従来のメッキ層の断面図である。 DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view showing a manufacturing method of an alloy according to the first embodiment of the present invention. FIG. 1 (A) is a perspective view showing a case where a coil is a single circle, and FIG. FIG. 2A is a cross-sectional view of a tin-plated copper filament having an alloy layer formed thereon, and FIG. 2B is a cross-sectional view of a conventional plated layer.

図１（Ａ）および（Ｂ）に示すように、本発明の一実施形態である合金の製造方法では、錫メッキ銅線条体１０に錫銅合金層１１（図２（Ａ）参照）を形成するために、錫メッキ銅線条体１０を高周波電圧が印加され磁界が生じたコイル１２上を通過させて、錫メッキ銅線条体１０に誘導電流を発生させることにより発熱させて錫銅合金層１１を形成する。
なお、コイル１２には、錫メッキ銅線条体１０を錫の融点よりも僅かに低い温度、例えば２３０℃程度まで加熱する磁力を発生させるように高周波電圧を印加する。 As shown in FIGS. 1A and 1B, in the method for producing an alloy according to an embodiment of the present invention, a tin-copper alloy layer 11 (see FIG. 2A) is formed on a tin-plated copper wire body 10. In order to form the tin-plated copper wire 10, the tin-plated copper wire 10 is passed over the coil 12 where a high-frequency voltage is applied and a magnetic field is generated. The alloy layer 11 is formed.
A high frequency voltage is applied to the coil 12 so as to generate a magnetic force that heats the tin-plated copper wire 10 to a temperature slightly lower than the melting point of tin, for example, about 230 ° C.

コイル１２は、図１（Ａ）に示すような単円（一重）でもよいが、その他、磁場分布を均一にするためには、図１（Ｂ）に示すような多重円のものがよい。また、コイル１２を形成する材料は、冷却構造を有する。例えば、冷媒を流すことのできる銅パイプ（例えば直径数ｍｍ）が使用可能である。磁場を整えるためにフェライト等を使用すると、誘導電流の発生効率が上がる。   The coil 12 may be a single circle (single) as shown in FIG. 1A, but in addition, in order to make the magnetic field distribution uniform, a multiple circle as shown in FIG. 1B is preferable. The material forming the coil 12 has a cooling structure. For example, a copper pipe (for example, several mm in diameter) through which a coolant can flow can be used. When ferrite or the like is used to adjust the magnetic field, the induction current generation efficiency is increased.

また、錫メッキ銅線条体１０を一定の温度以下に抑えるためには、コイルが発生する磁束を制御する。磁束を制御するために、コイルに印加される高周波電圧を制御する。その他、錫メッキ銅線条体１０の送り速度等を調整することにより制御することが可能である。また、錫メッキ銅線条体１０とコイル１２とは非接触なので、錫メッキ銅線条体１０とコイル１２との距離を調整することでも温度調整できる。また、これらを同時に制御することも可能である。   Further, in order to keep the tin-plated copper wire body 10 below a certain temperature, the magnetic flux generated by the coil is controlled. In order to control the magnetic flux, the high frequency voltage applied to the coil is controlled. In addition, it is possible to control by adjusting the feed rate of the tin-plated copper wire body 10 and the like. Further, since the tin-plated copper filament 10 and the coil 12 are not in contact with each other, the temperature can also be adjusted by adjusting the distance between the tin-plated copper filament 10 and the coil 12. It is also possible to control these simultaneously.

図２（Ａ）には、本発明に係る合金の製造方法によって合金化した錫メッキ銅線条体１０Ｂの断面が示されている。すなわち、図２（Ｂ）に示すように、合金化前の錫メッキ銅線条体１０Ａにおいては、３層構造のＣｕ３Ｓｎ／Ｃｕ６Ｓｎ５／Ｓｎのメッキ層においてＳｕＣｕ合金形成は不十分である。一方、図２（Ａ）に示すように、本発明を適用した錫メッキ銅線条体１０では、コイル１２の上を通過させて加熱することにより、合金層１１が厚くなってＳｕ層が薄くなっている。 FIG. 2A shows a cross section of a tin-plated copper wire 10B alloyed by the alloy manufacturing method according to the present invention. That is, as shown in FIG. 2 (B), in the tin-plated copper wire 10A before alloying, the formation of the SuCu alloy is insufficient in the Cu 3 Sn / Cu 6 Sn 5 / Sn plating layer having a three-layer structure. It is. On the other hand, as shown in FIG. 2A, in the tin-plated copper wire body 10 to which the present invention is applied, the alloy layer 11 is thickened and the Su layer is thinned by passing the coil 12 and heating it. It has become.

以上、前述した合金の製造方法によれば、錫メッキ銅線条体１０を高周波電圧が印加され磁界が生じたコイル１２の上方を通過させることにより、錫メッキ銅線条体１０に誘導電流を発生させて発熱させるので、急峻な立ち上がりで錫メッキ銅線条体１０を加熱することができ、錫メッキ銅線条体が合金層１１を形成するのに必要な温度となるまでの時間が極短い。このとき、錫メッキ銅線条体１０を錫の融点より若干低い温度（例えば２３０℃）に加熱するようにするので、合金層１１を形成するとともに、錫だまりの発生を抑えて錫層を薄く（例えば、０．１μｍ以下）して、ウィスカの発生を抑えることができる。   As described above, according to the alloy manufacturing method described above, an induction current is applied to the tin-plated copper wire 10 by passing the tin-plated copper wire 10 above the coil 12 where a high-frequency voltage is applied and a magnetic field is generated. Since it is generated to generate heat, the tin-plated copper filament 10 can be heated with a steep rise, and the time until the tin-plated copper filament becomes a temperature necessary to form the alloy layer 11 is extremely high. short. At this time, since the tin-plated copper filaments 10 are heated to a temperature slightly lower than the melting point of tin (for example, 230 ° C.), the alloy layer 11 is formed and the tin layer is made thin by suppressing the occurrence of tin accumulation. (For example, 0.1 μm or less), the generation of whiskers can be suppressed.

次に、本発明の実施形態に係るフラットケーブルの製造方法について説明する。
図３はフラットケーブルの断面図であり、図４は本発明に係るフラットケーブルの製造方法を実施するための製造装置の一例を示す構成図である。なお、合金の製造方法において前述した図１および図２における部位と共通する部位には同じ符号を付して、重複する説明を省略することとする。
本発明に係るフラットケーブルの製造方法では、図３に示すように、複数本（例えば６０心）の錫メッキ銅線条体１０を一つの面上に供給して配列し、配列された複数本の錫メッキ銅線条体１０を高周波電圧が印加され磁界が生じたコイル１２上を通過させて、錫メッキ銅線条体１０に誘導電流を発生させることにより発熱させて錫銅合金層を有する錫メッキ銅線条体１０を形成する。その後、錫メッキ銅線条体１０を絶縁樹脂で被覆してフラットケーブル３０を製造するものである。錫メッキ銅線条体を絶縁樹脂で被覆するのは、図４に示したように、絶縁フィルム１３ａ、１３ｂで上下に挟んでローラ２５で絶縁フィルム１３ａ、１３ｂを加熱・加圧しながら圧着して、錫メッキ銅線条体１０をラミネートする方法がある。この他に絶縁樹脂を押出被覆することもできる。 Next, the manufacturing method of the flat cable which concerns on embodiment of this invention is demonstrated.
FIG. 3 is a cross-sectional view of a flat cable, and FIG. 4 is a configuration diagram showing an example of a manufacturing apparatus for carrying out the flat cable manufacturing method according to the present invention. In the alloy manufacturing method, the same reference numerals are given to the portions common to the portions in FIGS. 1 and 2 described above, and the duplicate description will be omitted.
In the flat cable manufacturing method according to the present invention, as shown in FIG. 3, a plurality of (for example, 60 cores) tin-plated copper filaments 10 are supplied and arranged on one surface, and a plurality of arranged The tin-plated copper wire body 10 is passed through the coil 12 where a high frequency voltage is applied and a magnetic field is generated, and an induction current is generated in the tin-plated copper wire body 10 to generate heat and to have a tin-copper alloy layer. A tin-plated copper wire 10 is formed. Then, the flat cable 30 is manufactured by covering the tin-plated copper wire body 10 with an insulating resin. As shown in FIG. 4, the tin-plated copper wire is covered with the insulating films 13a and 13b by pressing the insulating films 13a and 13b with a roller 25 while being heated and pressurized. There is a method of laminating the tin-plated copper wire body 10. In addition, an insulating resin can be extrusion coated.

フラットケーブル３０の断面として、幅０．３ｍｍ、厚さ０．０３５ｍｍの平角型の錫メッキ銅線条体１０を、０．２ｍｍの間隔で６０本配列したものを例示することができる。
コイル１２は、錫メッキ銅線条体１０を錫の融点よりも僅かに低い温度（例えば、２３０℃）まで加熱する電力が供給されている。なお、コイル１２の形状や温度調整等に付いては、合金の製造方法において説明したものと同様であるが、コイル１２の直径は、上記の寸法のフラットケーブル（６０本の導体の幅が３０ｍｍ）だと、６０ｍｍ程度が望ましい。 As a cross section of the flat cable 30, there can be exemplified one in which 60 square-shaped tin-plated copper wires 10 having a width of 0.3 mm and a thickness of 0.035 mm are arranged at intervals of 0.2 mm.
The coil 12 is supplied with electric power for heating the tin-plated copper filament 10 to a temperature slightly lower than the melting point of tin (for example, 230 ° C.). The shape of the coil 12 and the temperature adjustment are the same as those described in the alloy manufacturing method, but the diameter of the coil 12 is a flat cable having the above dimensions (the width of 60 conductors is 30 mm). Then, about 60 mm is desirable.

図４に示すように、本発明に係るフラットケーブルの製造方法を実施するフラットケーブルの製造装置２０は、上流側に、平角の錫メッキ銅線条体１０が巻き取られている複数個の銅線条体供給リール２１を有しており、この銅線条体供給リール２１から供給される複数本の錫メッキ銅線条体１０を平面上に並列するローラ２２を有している。ローラ２２の下流側には、錫メッキ銅線条体１０を加熱するコイル１２を有する加熱手段２３が設けられており、ここで錫メッキ銅線条体１０は加熱されて合金層１１を形成する。加熱手段２３の下流側には、並列されて合金層が形成された錫メッキ銅線条体１０の上下に絶縁フィルム１３ａ、１３ｂを供給する一対の絶縁フィルム供給リール２４と、供給された絶縁フィルム２４で錫メッキ銅線条体１０をラミネートする一対のロール２５、２５が設けられている。このロール２５、２５は、絶縁フィルム１３を加熱すると同時に加圧して、上下の絶縁フィルム１３を一体化させる。絶縁フィルム１３がラミネートされて形成されたフラットケーブル３０は、巻取りリール２６に巻き取られる。   As shown in FIG. 4, the flat cable manufacturing apparatus 20 that performs the flat cable manufacturing method according to the present invention includes a plurality of coppers in which a flat tin-plated copper wire 10 is wound on the upstream side. A linear body supply reel 21 is provided, and a plurality of tin-plated copper linear bodies 10 supplied from the copper linear body supply reel 21 are arranged on a plane. On the downstream side of the roller 22, a heating means 23 having a coil 12 for heating the tin-plated copper filament 10 is provided. Here, the tin-plated copper filament 10 is heated to form the alloy layer 11. . On the downstream side of the heating means 23, a pair of insulating film supply reels 24 for supplying the insulating films 13a and 13b to the upper and lower sides of the tin-plated copper wire body 10 in which the alloy layers are formed in parallel, and the supplied insulating film A pair of rolls 25, 25 for laminating the tin-plated copper filament 10 at 24 are provided. These rolls 25, 25 heat and pressurize the insulating film 13 and integrate the upper and lower insulating films 13. The flat cable 30 formed by laminating the insulating film 13 is wound around the take-up reel 26.

以上、前述したフラットケーブルの製造方法によれば、一つの面上に供給されて配列された複数本の錫メッキ銅線条体１０を、高周波電圧が印加され磁界が生じたコイル１２の上方を通過させることにより、錫メッキ銅線条体１０に誘導電流を発生させて発熱させるので、錫メッキ銅線条体１０を急速に加熱することができ、線速を上げても合金層１１を形成することができる。フラットケーブルの製造工程に錫銅合金層形成工程を組み込んで、しかも合金層形成のために余分な時間を必要としない。このとき、錫メッキ銅線条体１０を錫の融点より若干低い温度に加熱するので、合金層１１を形成するとともに錫だまりの発生を抑えて、ウィスカの発生を抑えることができる。   As described above, according to the flat cable manufacturing method described above, the plurality of tin-plated copper filaments 10 supplied and arranged on one surface are placed above the coil 12 where a high frequency voltage is applied and a magnetic field is generated. By passing, an induction current is generated in the tin-plated copper filament 10 to generate heat, so that the tin-plated copper filament 10 can be rapidly heated, and the alloy layer 11 is formed even if the linear velocity is increased. can do. A tin-copper alloy layer forming process is incorporated into the flat cable manufacturing process, and no extra time is required for forming the alloy layer. At this time, since the tin-plated copper filament 10 is heated to a temperature slightly lower than the melting point of tin, the alloy layer 11 can be formed and the occurrence of tin pools can be suppressed, thereby preventing the occurrence of whiskers.

なお、本発明の合金の製造方法およびフラットケーブルの製造方法は、前述した実施形態に限定されるものでなく、適宜な変形，改良等が可能である。
例えば、前述した実施形態においては、コイル１２の形状として円形の場合を例示したが、その他、楕円形、長円形、Ｕ字状等でも可能である。
また、錫メッキ銅線条体１０として、銅の上下一方の面にのみ錫をメッキした場合について説明したが、銅の上下両面に錫メッキした場合もまったく同様に適用することができる。 In addition, the manufacturing method of the alloy of this invention and the manufacturing method of a flat cable are not limited to embodiment mentioned above, A suitable deformation | transformation, improvement, etc. are possible.
For example, in the above-described embodiment, the case where the coil 12 has a circular shape is illustrated, but other shapes such as an ellipse, an oval, a U-shape, and the like are possible.
Moreover, although the case where tin was plated only on one of the upper and lower surfaces of the copper as the tin-plated copper wire body 10 was described, the same can be applied to the case where tin is plated on both the upper and lower surfaces of copper.

なお、コイル１２の上を通過する時間が、合金層１１を形成するのに必要な時間よりも短い場合には、コイル１２を進行方向へ複数個並べて、コイル１２の上にある時間を調整することも可能である。錫銅メッキ線条体を発熱させて錫銅合金層を形成する工程を、錫メッキ銅線条体に樹脂フィルムをラミネートする工程の直前に同一のラインで実施することにより、別に加熱する必要がなく、工程削減による製造コストの低減が実現される。   When the time for passing over the coil 12 is shorter than the time required for forming the alloy layer 11, a plurality of the coils 12 are arranged in the traveling direction, and the time over the coil 12 is adjusted. It is also possible. It is necessary to heat separately by carrying out the process of forming a tin copper alloy layer by heating the tin copper plated filaments in the same line immediately before the step of laminating the resin film on the tin plated copper filaments. Therefore, the manufacturing cost can be reduced by reducing the number of processes.

以上のように、本発明に係る合金の製造方法およびフラットケーブルの製造方法は、錫メッキ銅線条体を高周波電圧が印加され磁界が生じたコイルの上方を通過させることにより、錫メッキ銅線条体に誘導電流を発生させて発熱させるので、急峻な立ち上がりで錫メッキ銅線条体を加熱することができ、合金層を形成することができる。また、錫メッキ銅線条体を錫の融点より若干低い温度に加熱することにより、合金層を形成するとともに錫だまりの発生を抑えて、ウィスカの発生を抑えることができるという効果を有し、錫メッキ銅を合金化する合金の製造方法および電子機器等に用いられる多心のフラットケーブルの製造方法等として有用である。   As described above, the method for producing an alloy and the method for producing a flat cable according to the present invention allow a tin-plated copper wire to pass through a tin-plated copper wire body above a coil in which a high-frequency voltage is applied and a magnetic field is generated. Since an induced current is generated in the strip to generate heat, the tin-plated copper filament can be heated with a steep rise, and an alloy layer can be formed. In addition, by heating the tin-plated copper filament to a temperature slightly lower than the melting point of tin, it has the effect of suppressing the occurrence of whisker by forming an alloy layer and suppressing the occurrence of tin pools, It is useful as a method for producing an alloy for alloying tin-plated copper and a method for producing a multi-core flat cable used in electronic devices and the like.

（Ａ）はコイルが単円の場合を示す斜視図である。 （Ｂ）はコイルが多重円の場合を示す斜視図である。(A) is a perspective view which shows the case where a coil is a single circle. (B) is a perspective view which shows the case where a coil is a multiple circle. （Ａ）は合金層が形成された錫メッキ銅線条体の断面図である。 （Ｂ）は従来のメッキ層の断面図である。(A) is sectional drawing of the tin plating copper wire body in which the alloy layer was formed. (B) is sectional drawing of the conventional plating layer. フラットケーブルの断面図である。It is sectional drawing of a flat cable. 本発明に係るフラットケーブルの製造方法を実施するための製造装置の一例を示す構成図である。It is a block diagram which shows an example of the manufacturing apparatus for enforcing the manufacturing method of the flat cable which concerns on this invention. 従来の錫メッキ銅線条体における問題点を示す断面図である。It is sectional drawing which shows the problem in the conventional tin plating copper wire.

符号の説明Explanation of symbols

１０ 錫メッキ銅線条体
１１ 錫銅合金層
１２ コイル
１３ 絶縁フィルム
３０ フラットケーブル DESCRIPTION OF SYMBOLS 10 Tin plating copper wire body 11 Tin copper alloy layer 12 Coil 13 Insulation film 30 Flat cable

Claims (4)

錫メッキ銅線条体に錫銅合金層を形成する錫銅合金の製造方法であって、
前記錫メッキ銅線条体を高周波電圧が印加されたコイル上を通過させて、前記錫メッキ銅線条体に誘導電流を発生させることにより発熱させて前記錫銅合金層を形成することを特徴とする合金の製造方法。 A tin-copper alloy manufacturing method for forming a tin-copper alloy layer on a tin-plated copper wire,
The tin-plated copper wire is formed by passing heat through a coil to which a high-frequency voltage is applied and generating an induced current in the tin-plated copper wire to form the tin-copper alloy layer. A method for producing an alloy. 前記錫メッキ銅線条体を錫の融点よりも低い温度に加熱することを特徴とする請求項１に記載の合金の製造方法。   The method for producing an alloy according to claim 1, wherein the tin-plated copper wire is heated to a temperature lower than the melting point of tin. 複数本の錫メッキ銅線条体を一つの面上に供給して配列し、配列された前記複数本の錫メッキ銅線条体を高周波電圧が印加されたコイル上を通過させて、前記錫メッキ銅線条体に誘導電流を発生させることにより発熱させて錫銅合金層を有する錫メッキ銅線条体を形成し、前記錫メッキ銅線条体を絶縁樹脂で被覆することを特徴とするフラットケーブルの製造方法。   Supplying a plurality of tin-plated copper filaments on one surface, arranging the tin-plated copper filaments on a coil to which a high-frequency voltage is applied, A tin-plated copper filament having a tin-copper alloy layer is formed by generating an induction current in the plated copper filament to generate heat, and the tin-plated copper filament is covered with an insulating resin. Flat cable manufacturing method. 前記錫メッキ銅線条体を錫の融点よりも低い温度で加熱することを特徴とする請求項３に記載のフラットケーブルの製造方法。   The method for manufacturing a flat cable according to claim 3, wherein the tin-plated copper wire is heated at a temperature lower than a melting point of tin.
JP2006140758A 2006-05-19 2006-05-19 Flat cable manufacturing method Expired - Fee Related JP4640260B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009197280A (en) * 2008-02-22 2009-09-03 Jst Mfg Co Ltd Heat treating method of plating layer
JP2010126766A (en) * 2008-11-27 2010-06-10 Toyota Motor Corp PLATED BASE MATERIAL HAVING Sn PLATING LAYER AND METHOD OF MANUFACTURING THE SAME
EP2468926A1 (en) * 2010-12-15 2012-06-27 OTB Oberflächentechnik in Berlin GmbH & Co. Method for producing a workpiece made of metal or an alloy of a metal with a coating
JP2012156470A (en) * 2011-01-28 2012-08-16 Nippon Steel Chem Co Ltd Method of manufacturing flexible circuit board

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JPS57126992A (en) * 1981-01-27 1982-08-06 Kobe Steel Ltd Treatment for preventing whisker generation of tin plated material
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JPH02162612A (en) * 1988-12-15 1990-06-22 Sumitomo Electric Ind Ltd Manufacture of conductor for covered wire
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JP2005216749A (en) * 2004-01-30 2005-08-11 Hitachi Cable Ltd Conductor for flat cable, its manufacturing method and flat cable
JP2006127939A (en) * 2004-10-29 2006-05-18 Sumitomo Electric Ind Ltd Electric conductor and its manufacturing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57126992A (en) * 1981-01-27 1982-08-06 Kobe Steel Ltd Treatment for preventing whisker generation of tin plated material
JPS59226194A (en) * 1983-06-06 1984-12-19 Sumitomo Electric Ind Ltd Production of material for electronic parts
JPH02162612A (en) * 1988-12-15 1990-06-22 Sumitomo Electric Ind Ltd Manufacture of conductor for covered wire
JPH0417289A (en) * 1990-05-10 1992-01-22 Fujikura Ltd Metal wire material running and heating apparatus
JPH083713A (en) * 1994-06-14 1996-01-09 Totoku Electric Co Ltd Manufacture of hot-dip coated wire
JP2000345388A (en) * 1999-06-07 2000-12-12 Mitani Shindo Kk Production of reflow tinned plating material
JP2005216749A (en) * 2004-01-30 2005-08-11 Hitachi Cable Ltd Conductor for flat cable, its manufacturing method and flat cable
JP2006127939A (en) * 2004-10-29 2006-05-18 Sumitomo Electric Ind Ltd Electric conductor and its manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009197280A (en) * 2008-02-22 2009-09-03 Jst Mfg Co Ltd Heat treating method of plating layer
JP2010126766A (en) * 2008-11-27 2010-06-10 Toyota Motor Corp PLATED BASE MATERIAL HAVING Sn PLATING LAYER AND METHOD OF MANUFACTURING THE SAME
EP2468926A1 (en) * 2010-12-15 2012-06-27 OTB Oberflächentechnik in Berlin GmbH & Co. Method for producing a workpiece made of metal or an alloy of a metal with a coating
JP2012156470A (en) * 2011-01-28 2012-08-16 Nippon Steel Chem Co Ltd Method of manufacturing flexible circuit board

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