JP2007305782A - Printed circuit board, and surface layout of heat dissipation metal thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of increasing the heat dissipation effect of a printed circuit board. <P>SOLUTION: In the printed circuit board 1 and the surface layout of a heat dissipation metal thereof, the surface of a copper foil layer is covered with insulation coating 12. Solder layers 13 and 14 on the surface of the copper foil layer uncovered by the insulation coating 12 dissipates heat and facilitates the conduction of a current in the crosswise shape or in the shape of "#". <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a printed circuit board and its heat dissipating metal surface layout, and in particular, through a soldering furnace to form protruding solder at bare copper locations on the printed circuit board to increase the heat dissipating area. The present invention relates to a printed circuit board.

To increase the heat dissipation effect of a printed circuit board (PCB), most printed circuit boards add heat dissipation holes, electroplate metal films, or place a metal mass on the back side of the printed circuit board Alternatively, heat dissipation paste is coated directly onto the printed circuit board to dissipate heat.
Referring to FIGS. 1 and 2 for a printed circuit board 1a that uses copper foil to dissipate heat, the printed circuit board 1a includes an insulating substrate 10a, copper plated onto the substrate 10a to dissipate heat. A layer of the foil 11a and an insulating coating 12a coated on the surface of the copper foil 11a are provided. In order to maximize the heat dissipation effect in a limited area of the copper foil 11a, the part 120a of the insulation coating is usually removed, and as a result, the originally covered copper foil 11a is exposed to the outside, and the bare copper portion 110a is formed and solder 13a is deposited on the bare copper portion 110a by a soldering furnace, so that a strong amount of solder has a certain amount of solder to increase the exposed surface area to dissipate heat. To form a protruding thickness.

Referring to FIG. 3 together, the removal of the insulation coating 120a is usually done using a layout that is elongated and spaced in one direction. Although this type of arrangement can avoid an extremely large area of the bare copper portion 110a and can provide a uniform protrusion of the solder 13a, it is still free of aggregation and adhesion along the longitudinal direction. It is even and therefore thicker in the middle and thinner on both sides. This kind of phenomenon is caused by uneven adhesion between the center and both sides, and uneven aggregation of the solder when liquid solder is deposited on the copper foil, so that more solder 13a The solder is insufficiently provided for the natural formation of protrusions on both sides, gathered towards the center. The relative surface area is smaller and the cross-sectional shape of the solder 13a along the longitudinal direction is uneven, which adversely affects current conduction.
In view of the above description, the inventors of the present invention have designed possible solutions to effectively overcome the above-mentioned drawbacks.

In view of the aforementioned shortcomings of the prior art, the inventors of the present invention have conducted experiments and modifications based on years of related industry experience and finally printed according to the present invention to overcome the shortcomings of the prior art. The circuit board and its heat dissipation metal surface layout were designed.
The present invention overcomes the deficiencies of the prior art by providing a printed circuit board and its heat dissipating metal surface layout that interleaves bare copper portions or solder shapes or designs for uniform solder agglomeration. Therefore, the solder can be evenly deposited on the bare copper surface, achieving a larger and consistent cross-sectional shape, effectively increasing the surface area of the protruding solder and conducting current. Can be easily.
The present invention provides a printed circuit board comprising a substrate, a heat dissipation layer and an adhesion layer disposed on the surface of the substrate.

The adhesion layer further includes a plurality of adhesion bars that are alternately disposed in the first direction and the second direction and are deposited on the surface of the heat dissipating layer to form a protruding surface.
The present invention provides a heat dissipating metal surface layout for a printed circuit board, and the printed circuit board includes a metal heat dissipating layer and an insulating coating uniformly coated on the heat dissipating layer, the surface heat not covered by the insulating coating. The diffusion layer forms an exposed metal surface, and the metal surface is alternately disposed in the first direction and the second direction.

The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings. However, the drawings are provided for reference and illustration only and are not intended to limit the scope of the present invention.
Referring to FIGS. 4 and 6, respectively, for a schematic plan view of the present invention and a cross-sectional view of line 6-6 illustrated in FIG. 4, the present invention provides a printed circuit board and its heat dissipating metal surface layout. The printed circuit board 1 includes a substrate 10 made of an insulating material and a heat dissipation layer 11 disposed on the surface of the substrate 10. The heat dissipating layer 11 can be made of copper foil or other heat conducting metal, and an insulating coating 12 is coated on the surface of the heat dissipating layer 11.
Although the insulation coating 12 is dispersed into blocks on the surface heat dissipation layer 11, the manufacturing process of the present invention first coats the entire surface of the heat dissipation layer 11 on the surface of the heat dissipation layer 11, and then The excess insulation coating 12 is removed, so that a part of the surface of the heat dissipation layer 11 can be exposed to the outside, and finally a block of the insulation coating 12 is created as shown in FIG. The For the portion of the surface of the heat dissipating layer 11 that is not covered by the insulating coating 12, an exposed metal surface 110 is formed, and this type of metal surface 110 is commonly referred to as bare copper.

The present invention primarily forms a layout of metal surfaces 110 that are alternately arranged in a first direction 13 and a second direction 14. In the preferred embodiment shown in FIG. 4, the so-called first direction 13 is the longitudinal direction, the second direction 14 is the lateral direction, and thus an included angle α of 90 ° is the first and second Formed between directions 13, 14 and the two directions intersect perpendicularly to each other, and the layout of metal surface 110 is in the shape of a cross or “#”. In FIG. 8, the first and second directions 13, 14 can cross diagonally. 9, the included angle α between the first and second directions 13, 14 can also be 30 °, 45 ° or 60 °, and the embodiment illustrated in FIG. 9 has an included angle of 60 °. .

Reference is made to FIGS. Since a slightly wider and smaller area can be provided at each intersection in the first and second directions, the liquid solder can therefore be applied to the metal surface when the printed circuit board 1 of the present invention passes through the soldering furnace. In the process of adhering to 110, it can be collected in the middle of this small area. As a result, the solder agglomeration is uniform instead of being collected at the same location or center, so that an adhesion layer made of solder is formed on the metal surface 110. The adhesion layer also forms a solid solder bar along the first and second directions 13, 14, so that each solder provides a larger protruding area to facilitate heat dissipation and current conduction and Have a more uniform surface.
With the foregoing structure, a printed circuit board and its heat dissipating metal surface layout according to the present invention can be achieved.

In summarizing the above description, the present invention has been submitted to the Patent and Trademark Office for the purpose of examining and granting patent rights in this application to enhance performance over the normal structure and to further comply with patent application requirements and corresponding patent rights. The
The present invention is illustrated with reference to preferred embodiments and is not intended to limit the patent scope of the invention. Various substitutions and modifications are suggested in the foregoing description and others will occur to those skilled in the art. Accordingly, all such substitutions and modifications are intended to be included within the scope of the present invention as set forth in the appended claims.

The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, will best be understood by reference to the following detailed description of the invention, which sets forth specific illustrative embodiments of the invention, together with the accompanying drawings.

1 is a schematic plan view of a conventional printed circuit board. Sectional drawing of the line 2-2 illustrated in FIG. Sectional drawing of the line 3-3 shown in FIG. 2, and the schematic of a solder aggregation direction. 1 is a schematic plan view of the present invention. The enlarged view of the part A illustrated in FIG. Sectional drawing of the line 6-6 illustrated in FIG. The schematic diagram of the solder aggregation direction according to this invention. FIG. 3 is a schematic view of a part of another preferred embodiment of the present invention. FIG. 3 is a schematic diagram of a part of a further preferred embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a: Printed circuit board 2-2,3-3,6-6: Section 10: Board | substrate 10a, 11a: Insulating board 11: Heat-dissipation layer 12, 12a: Insulation coating 13: 1st direction 13a: Solder 14 : Second direction 110: Metal surface 110a: Bare copper part 120a: Part of insulation coating A: Part of substrate α: Inclusion angle

Claims (14)

A substrate,
A heat dissipating layer disposed on the surface of the substrate;
An attachment layer comprising a plurality of solid attachment bars alternately disposed in a first direction and a second direction and attached onto the surface of the heat dissipating layer to form a protruding surface;
A printed circuit board comprising:
The printed circuit board according to claim 1, wherein the heat dissipation layer is a copper foil.
The printed circuit board according to claim 1, wherein the adhesion layer is made of solder.
The printed circuit board according to claim 2, wherein the adhesion layer is made of solder.
The printed circuit board according to claim 1, wherein the first direction of the adhesion bar is a longitudinal direction, and the second direction of the adhesion bar is a lateral direction.
The printed circuit board of claim 1, wherein the first and second directions of the adhesion bar intersect each other perpendicularly.
The printed circuit board according to claim 1, wherein the first and second directions of the adhesion bar cross each other obliquely.
The printed circuit board of claim 1, wherein the first and second directions of the attachment bar form an included angle of 30 °, 45 °, 60 °, or 90 °.
A heat dissipating metal surface layout of a printed circuit board comprising a metal heat dissipating layer disposed on the printed circuit board; and an overlying insulating coating on the surface of the heat dissipating layer;
The surface of the heat dissipating layer not covered by the insulating coating forms a bare metal surface, and the bare metal surface is defined by alternating crossing in a first direction and a second direction A heat dissipating metal surface layout of a printed circuit board, characterized in that
The heat dissipation metal surface layout of a printed circuit board according to claim 9, wherein the heat dissipation layer is a copper foil.
10. The heat dissipating metal surface layout of a printed circuit board according to claim 9, wherein the first direction is a longitudinal direction and the second direction is a lateral direction.
The heat dissipation metal surface layout of a printed circuit board according to claim 9, wherein the first and second directions intersect perpendicularly to each other.
The heat dissipating metal surface layout of a printed circuit board according to claim 9, wherein the first and second directions intersect with each other obliquely.
The heat dissipating metal surface layout of a printed circuit board according to claim 9, wherein the first and second directions form an included angle of 30 °, 45 °, 60 °, or 90 °.

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