JP2007304388A - Electro-optical device, color filter substrate and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device, a color filter substrate and an electronic apparatus in which a module can be designed without considering the thickness of active components constituting a power supply circuit. <P>SOLUTION: The electro-optical device 1 includes a first substrate 11 having a pixel unit where a plurality of pixels are arranged in a matrix, a second substrate 12 disposed facing the first substrate 11, and an electro-optical substance 13 held between the first substrate 11 and the second substrate 12, wherein the device is further equipped with a power supply circuit 16 that generates a predetermined voltage and supplies the generated voltage to each unit, and the second substrate 12 is provided with a passive element 20 constituting the power supply circuit 16. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an electro-optical device, a color filter substrate, and an electronic apparatus that display predetermined information.

Conventionally, a liquid crystal display device that displays an image is known. The liquid crystal display device includes, for example, an electro-optical device having a liquid crystal panel and a drive circuit that drives the liquid crystal panel, and a light source unit such as a backlight that emits light from the back side of the liquid crystal panel.

The drive circuit also includes a power supply circuit that generates various predetermined voltages based on an input reference voltage, a liquid crystal controller that performs signal processing based on an externally input signal, and an instruction from the liquid crystal controller Thus, it comprises a horizontal drive circuit that outputs an externally input video signal to the liquid crystal panel, and a vertical drive circuit that outputs a scan pulse to the liquid crystal panel based on an instruction from the liquid crystal controller.

In the case of an active matrix type liquid crystal panel, a thin film transistor (TFT, thin film transistor) is provided at each intersection of a plurality of signal lines and scanning lines arranged orthogonal to each other.
Electro-optics such as liquid crystal via an alignment film between an array substrate having a pixel portion in which pixel electrodes are arranged via r) and a counter substrate on which a counter electrode facing the array substrate is formed. The material is sandwiched.

The electro-optical device includes a power supply circuit that generates a predetermined voltage and supplies the generated voltage to each unit of the device. The power supply circuit is composed of a plurality of passive elements such as C and R and active elements such as switching elements.
JP 2002-175034 A

Recently, there has been a request for downsizing of modules, and various techniques have been proposed to meet the request (see, for example, Patent Document 1).

However, since the passive elements constituting the power supply circuit require a relatively large space, the space around the pixel portion (hereinafter referred to as the frame width) is enlarged if it is simply arranged on the substrate constituting the liquid crystal panel. There is a problem that becomes.

On the other hand, the passive elements that make up the power circuit are flexible boards (TCP, Tape Carrier Package).
) When placed on top, the entire module becomes thick due to the height of the passive elements,
It becomes difficult to meet the demand for compactness.

Accordingly, the present invention provides an electro-optical device, a color filter substrate, and an electronic device that form a passive element constituting a power supply circuit on the substrate of the liquid crystal panel without enlarging the frame width of the substrate constituting the liquid crystal panel. The purpose is to do.

The electro-optical device of the present invention includes a first substrate having a pixel portion in which a plurality of pixels are arranged in a matrix, a second substrate disposed to face the first substrate, and the first substrate Substrate and the second
An electro-optical device comprising an electro-optical material sandwiched between the second substrate, a power supply circuit that generates a predetermined voltage and supplies the generated voltage to each unit, and the second substrate includes: A passive element constituting the power supply circuit is provided.

According to such an invention, since the passive element constituting the power supply circuit is provided on the second substrate, the passive element is not provided on the flexible substrate. Therefore, the module design can be performed without considering the thickness of the member. In addition, since the passive element is not provided on the first substrate, the frame width of the first substrate is not increased.

In the electro-optical device according to the aspect of the invention, it is preferable that an active element constituting the power supply circuit is provided on the first substrate.

According to this invention, since the passive element of the power supply circuit is provided on the second substrate side and the active element is provided on the first substrate side, the components of the power supply circuit are not provided on the flexible substrate. The module design can be advanced without considering this, and the components of the power supply circuit are distributed in a balanced manner between the first board and the second board, so that the free space on both boards can be used effectively. Can do.

Further, the second substrate provided in the electro-optical device of the present invention is red (R), green (G).
And a color filter in which blue (B) pixels are periodically arranged, a light-shielding portion is formed on the boundary between the pixels and outside the outermost peripheral pixel used for display, and the power supply circuit is provided on the light-shielding portion. It is preferable that a passive element to be formed is formed.

According to this invention, since the passive element of the power supply circuit is provided on the second substrate side and the active element is provided on the first substrate side, the components of the power supply circuit are not provided on the flexible substrate. The module design can be advanced without considering this, and the components of the power supply circuit are distributed in a balanced manner between the first board and the second board, so that the free space on both boards can be used effectively. Can do.

Further, in the second substrate provided in the electro-optical device of the present invention, the light shielding portion is formed of a predetermined metal material, a predetermined dielectric material is formed on the light shielding portion, and the dielectric It is preferable that the passive element is configured by forming a predetermined metal material on the body material.

For example, when an active element such as a switching element is formed on a substrate, a Si film needs to be formed. However, when a passive element is formed, it is not always necessary to form a Si film.
Therefore, according to the present invention, a process for forming a passive element can be easily added. Further, according to the present invention, since the passive element is formed above the light shielding portion, it is not necessary to increase the frame width accompanying the formation of the passive element. Moreover, according to this invention, a light-shielding part can be utilized as a part of passive element.

In the second substrate provided in the electro-optical device of the present invention, the light shielding portion is formed of a predetermined resin material, and a predetermined metal material is formed on the light shielding portion, and the metal material Preferably, the passive element is configured by forming a predetermined dielectric material on the top of the substrate and forming a predetermined metal material on the top of the dielectric material.

For example, when an active element such as a switching element is formed on a substrate, a Si film needs to be formed. However, when a passive element is formed, it is not always necessary to form a Si film.
Therefore, according to the present invention, a process for forming a passive element can be easily added. Further, according to the present invention, since the passive element is formed above the light shielding portion, it is not necessary to increase the frame width accompanying the formation of the passive element.

In the electro-optical device according to the aspect of the invention, a conduction portion for electrically conducting the passive element and the active element is provided between the first substrate and the second substrate. It is preferable.

According to the present invention, a passive element and an active element of a power supply circuit that are not arranged on the same substrate can be electrically connected, and have the same function as a conventional electro-optical device arranged on the same substrate. And the frame width of the substrate is not increased in the plane direction.

The color filter substrate of the present invention is arranged to face an array substrate having a pixel portion in which a plurality of pixels are arranged in a matrix, and constitutes a color filter by periodically arranging pixels emitting different colors. In the color filter substrate having a light-shielding portion between the pixels and sandwiching the electro-optic material between the counter substrate, a power supply circuit that generates a predetermined voltage and supplies the generated voltage to each portion is configured. A passive element is provided at an arbitrary place.

According to the present invention, the passive element that constitutes the power supply circuit is provided at an arbitrary place on the color filter substrate, and the module is not provided with the passive element on the flexible substrate. The design can be advanced.

In the color filter substrate of the present invention, the light shielding part is formed of a predetermined metal material, a predetermined dielectric material is formed on the light shielding part, and a predetermined metal material is formed on the dielectric material. It is preferable that the passive element is configured by forming.

For example, when an active element such as a switching element is formed on a substrate, it is necessary to form a Si film. However, when a passive element is formed, it is not always necessary to form a Si film.
Therefore, according to the present invention, a process for forming a passive element can be easily added. Further, according to the present invention, since the passive element is formed using the light shielding portion, it is possible to suppress an increase in the frame width accompanying the formation of the passive element. In addition, according to the present invention, the passive element that constitutes the power supply circuit is provided at an arbitrary place on the color filter substrate, and the passive element is not provided on the flexible substrate. The module design can be advanced without any problems.

In the color filter substrate of the present invention, the light shielding part is formed of a predetermined resin material, a predetermined metal material is formed on the light shielding part, and a predetermined dielectric material is formed on the metal material. Preferably, the passive element is formed by forming a predetermined metal material on the dielectric material.

For example, when an active element such as a switching element is formed on a substrate, it is necessary to form a Si film. However, when a passive element is formed, it is not always necessary to form a Si film.
Therefore, according to the present invention, a process for forming a passive element can be easily added. Further, according to the present invention, since the passive element is formed using the light shielding portion, it is possible to suppress an increase in the frame width accompanying the formation of the passive element. In addition, according to the present invention, the passive element that constitutes the power supply circuit is provided at an arbitrary place on the color filter substrate, and the passive element is not provided on the flexible substrate. The module design can be advanced without any problems.

Furthermore, an electronic apparatus according to the present invention includes the above-described electro-optical device.
According to the present invention, there are effects similar to those described above.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, an electro-optical device that employs an active matrix driving method will be described. However, the present invention is not limited to the active matrix type.

As shown in FIG. 1A, an electro-optical device 1 according to the present invention includes a first substrate (hereinafter referred to as an array substrate) 11 having a pixel portion 10 in which a plurality of pixels are arranged in a matrix. A second substrate (hereinafter referred to as a counter substrate) 12 having a plurality of color filters (CF, Color Filter) disposed opposite to the array substrate 11 and provided corresponding to the pixel unit 10; And an electro-optical material 13 such as liquid crystal sandwiched between the substrate 11 and the counter substrate 12.

Here, the configuration of the array substrate 11 and the counter substrate 12 will be described in detail with reference to FIG. As shown in FIG. 2, the array substrate 11 includes a plurality of scanning lines 110 provided at predetermined intervals, a plurality of data lines 120 provided substantially at right intervals to the scanning lines 110, and a plurality of data lines 120. Capacitor lines 140 provided substantially alternately and in parallel with the scanning lines 110 are provided. In FIG. 2, the scanning lines 110A, 110B, and 110C are sequentially arranged from the top of the scanning lines 110, and the data lines 12 are displayed.
Data lines 120A and 120B are set in order from the left among 0.

In addition, a pixel 150 is provided at an intersection between each scanning line 110 and each data line 120. The pixel 150 includes a TFT (Thin Film Transistor) 151 and a pixel electrode 1.
And a storage capacitor 153 having one end connected to the pixel electrode 155 and the other end connected to the capacitor line 140.

The scanning line 110 is connected to the gate of the TFT 151, the data line 120 is connected to the source of the TFT 151, and the pixel electrode 155 and the storage capacitor 153 are connected to the drain of the TFT 151. The TFT 151 intermittently connects the data line 120 to the pixel electrode 155 and the storage capacitor 153 according to the selection voltage from the scanning line 110. Specifically, when a selection voltage is applied to the scanning line 110, the data line 120, the pixel electrode 155, and the storage capacitor 15 are stored.
3 is made conductive.

A common electrode 156 is formed on the counter substrate 12 so as to face the pixel electrode 155, and the common electrode 156 is connected to the common line 130. The common line 130 is arranged on the array substrate 11 side.

Further, as shown in FIG. 1B, the electro-optical device 1 includes a vertical driving circuit (hereinafter referred to as a scanning line driving circuit) 14 that selects each pixel of the pixel unit 10 in units of rows, and a scanning line driving circuit. A predetermined voltage is applied to a horizontal drive circuit (hereinafter referred to as a data line drive circuit) 15 that supplies an image signal to each pixel in the row selected by 14, the scanning line drive circuit 14, and the data line drive circuit 15. A power supply circuit 16 to be supplied and a timing control signal (T) for generating a predetermined timing control signal and supplying the generated timing control signal to the scanning line driving circuit 14 and the data line driving circuit 15
/ C) section 17 and a flexible substrate (TCP, Tape Carrier Package) 18 for inputting / outputting signals corresponding to scanning line 110 and data line 120, respectively.

The scanning line driving circuit 14 applies a selection voltage for turning on / off the above-described TFT 151 to each scanning line 1.
10 is supplied in a line sequential manner. For example, when a control signal is supplied to a certain scanning line 110, all the TFTs 151 connected to the scanning line 110 are turned on, and all the pixels related to the scanning line 110 are selected.

The data line driving circuit 15 supplies an image signal to each data line 120 and turns on the TFT 1 in the on state.
The image data is sequentially written to the pixel electrode 155 of the pixel 150 via the pixel 51. Here, the data line driving circuit 15 uses the voltage of the common electrode 156 as a reference voltage, positive writing for supplying an image signal to the data line 120 at a voltage higher than the voltage of the common electrode 156, and the common electrode 156.
The negative polarity writing for supplying the image signal to the data line 120 at a voltage lower than the negative voltage is alternately performed.

In order to prevent the liquid crystal from burning, the data line driving circuit 15 is driven by, for example, a 1H inversion driving method that alternately performs positive polarity writing or negative polarity writing for each horizontal line using an AC voltage.

The power supply circuit 16 employs, for example, a charge pump system that uses a capacitor to increase or decrease the voltage, generates a predetermined voltage based on the voltage supplied from the outside, and generates the generated voltage. This is supplied to the scanning line driving circuit 14 and the data line driving circuit 15. The power supply circuit 16 includes a passive element 20 such as a capacitor and a resistor, and an active element 21 such as a transistor.

Further, the passive element 20 and the active element 21 of the power supply circuit 16 are allocated to the array substrate 11 and the counter substrate 12, respectively.

<First embodiment>
Here, it will be specifically described how the passive elements 20 and the active elements 21 of the power supply circuit 16 are allocated to the array substrate 11 and the counter substrate 12. In the following, a case of using a technology (COG, Chip On Glass) for directly mounting an element on a glass substrate and a case of a technology (SOG, System On Glass) for mounting a system configuration on a glass substrate will be described. FIG. 3A shows a conventional configuration example in the case of COG (a driver IC 30 incorporating an active element constituting a power supply circuit is mounted on a glass substrate,
FIG. 4 shows the passive elements constituting the power supply circuit are arranged on the flexible substrate 18.
(A) shows a conventional configuration example in the case of using SOG (the active element constituting the power supply circuit is mounted on the glass substrate, and the passive element constituting the power supply circuit is arranged on the flexible substrate 18). .

In the case of COG, as shown in FIGS. 3B and 3C, the passive element 20 of the power supply circuit 16 is arranged in an empty space of the counter substrate 12. 3B is a top view of the electro-optical device 1 viewed from the counter substrate 12, and FIG. 3C is a cross-sectional view of the electro-optical device 1. Further, the counter substrate 12 has a smaller surface area than the array substrate 11. In addition, FIG.
, (B) indicates the edge of the counter substrate 12.

Therefore, according to the present invention, by providing the passive element 20 of the power supply circuit 16 on the counter substrate 12 side, it is not necessary to provide the passive element on the flexible substrate 18 as in the prior art, so the thickness of the member is taken into consideration. The module design can proceed without any problem, and the components of the power supply circuit 16 are divided and arranged in a balanced manner on the array substrate 11 and the counter substrate 12, so that the free space on both substrates can be used effectively.

In the case of such a configuration, a conducting part 100 is provided for electrically conducting the passive element 20 and the driver IC. The conductive portion 100 can have the same structure as the conductive portion for connecting the array substrate 11 and the counter substrate 12.

In addition, the array substrate 11 and the counter substrate 12 are bonded to each other by a seal member 101 in order to seal the electro-optical material 13. Further, the conducting portion 100 may be configured integrally with the sealing member 101 by mixing a conducting material into the sealing member 101. Moreover, when the conductive material is not mixed in the seal member, the conductive member may be separately provided so as not to be integrated with the seal member.

With such a configuration, the passive element 20 of the power supply circuit 16 that is not arranged on the same substrate can be electrically connected to the driver IC, and the conventional electro-optic that is arranged on the same substrate. The same function as the apparatus can be exhibited, and the frame width of the substrate is not increased in the plane direction.

In the case of SOG, as shown in FIGS. 4B and 4C, the passive element 20 of the power supply circuit 16 is disposed in an empty space of the counter substrate 12, and the active element 21 of the power supply circuit 16 is Arranged in an empty space of the array substrate 11. 4B is a top view of the electro-optical device 1 viewed from the counter substrate 12, and FIG. 4C is a cross-sectional view of the electro-optical device 1. Further, the counter substrate 12 has a smaller surface area than the array substrate 11. In addition, FIG.
A line A shown in b) indicates an edge of the counter substrate 12.

Therefore, according to the present invention, by providing the passive element 20 of the power supply circuit 16 on the counter substrate 12 side, it is not necessary to provide the passive element on the flexible substrate 18 as in the prior art, so the thickness of the member is taken into consideration. The module design can proceed without any problem, and the components of the power supply circuit 16 are divided and arranged in a balanced manner on the array substrate 11 and the counter substrate 12, so that the free space on both substrates can be used effectively.

In the case of such a configuration, a conducting part 100 for electrically conducting the passive element 20 and the active element 21 is provided.

In addition, the array substrate 11 and the counter substrate 12 are bonded to each other by a seal member 101 in order to seal the electro-optical material 13. The conductive portion 100 may be configured integrally with the seal member 101 by mixing a conductive material in the seal member. Moreover, when not using the sealing agent which does not mix a conduction | electrical_connection material, it is not necessary to comprise integrally with a sealing member by providing a conduction | electrical_connection part separately.

By adopting such a configuration, the passive element 20 and the active element 21 of the power supply circuit 16 that are not arranged on the same substrate can be electrically connected to each other, and the conventional electricity arranged on the same substrate can be obtained. The same function as the optical device can be exhibited, and the frame width of the substrate is not increased in the plane direction.

<Second embodiment>
In addition, the counter substrate 12 according to the present invention is provided with a color filter 200 in which small pixels that are separately applied to red (R), green (G), and blue (B) are periodically arranged. Coloring is performed by the light emitted from the light passing through each color pixel.

Further, since color mixing occurs at the boundary of each pixel and the contrast is lowered, the boundary of each pixel is shielded by a light shielding unit 201 such as a black matrix (BM, Black Matrix) material to improve display properties. Further, in order to prevent the backlight light from leaking from the outside of the effective display area and improve the display performance, a light shielding portion is also provided outside the effective display area.

Further, as a black matrix material, for example, a metal chromium film (Cr) is used for reasons such as light shielding properties, ease of manufacture, and corrosion resistance. In addition, the metal chromium film
Since there is a problem that the light shielding property is good but the reflectance is high and the display property is impaired, a method of providing a chromium oxide film (CrO ₂ ) or the like on the glass surface side to form a laminated film and a low reflection structure is employed. .
A resin material may be used as the black matrix material.

In the counter substrate 12 according to the present invention, the passive element 20 for forming the power supply circuit 16 is formed above the light shielding portion 201.

Here, an example in the case of forming a capacitor will be described. In the following example, the counter substrate 12A has a light shielding portion 201 of chromium oxide film (CrO ₂ ) 202 / metal film (for example, Cr
) 203 / Chromium oxide film (CrO ₂ ) 204 and the color filter 2
It is assumed that an insulating film 205 is formed on 00.

As shown in FIG. 5A, the counter substrate 12A includes an insulating film 205, a chromium oxide film (CrO _2).
) An ITO film (ITO, Indium Tin Oxide) 206 is formed on the surfaces of 204 and the metal film 203. That is, using the metal film 203 as one electrode and the ITO film 206 as the other electrode,
A capacitor (passive element 20) is formed by sandwiching a chromium oxide film (CrO ₂ ) 204 between both electrodes (X in FIG. 5A).

Further, as shown in FIG. 5B, the counter substrate 12 </ b> A forms an ITO film 206 on the surfaces of the planarization film (for example, formed of an insulating film) 205 and the metal film 203. That is, with the metal film 203 as one electrode and the ITO film 206 as the other electrode, a chromium oxide film (CrO ₂ ) 204 and a planarizing film (for example, a resin film) 205 are sandwiched between the two electrodes. (Passive element 20) is formed (X in FIG. 5B).

In the counter substrate 12A, the resistance (passive element 20) is formed by patterning the metal film 203 into a predetermined shape.

Therefore, for example, when the active element 21 such as the switching element is formed on the substrate, it is necessary to form the Si film. However, when the passive element 20 is formed, it is not necessary to form the Si film. Therefore, according to the present invention, a process for forming the passive element 20 can be easily added. Further, according to the present invention, since the passive element 20 is formed using a part of the light shielding portion 201, an increase in the frame width accompanying the formation of the passive element 20 can be suppressed. Further, according to the present invention, the passive element 20 constituting the power supply circuit 16 is provided at an arbitrary location on the counter substrate 12A, and the passive element 20 is not provided on the flexible substrate 18. The module design can be advanced without considering the above.

An example in which the light shielding portion 201 is formed of a predetermined resin material and the insulating film 210 is formed on the color filter 200 will be described. Counter substrate 12
6B, a metal layer 211 is formed between the light shielding part 201 and the counter substrate 12B, and an ITO film 212 is formed on the surfaces of the insulating film 210 and the light shielding part 201, as shown in FIG. That is, with the metal layer 211 as one electrode and the ITO film 212 as the other electrode, the light shielding portion 201 is sandwiched between the two electrodes to form a capacitor (passive element 20) (see FIG. 6A). Y).

Further, as shown in FIG. 6B, the counter substrate 12 </ b> B has a metal layer 211 formed between the light shielding portion 201 and the counter substrate 12, and is formed on a planarizing film (for example, formed of an insulating film) 210. Then, an ITO film 212 is formed. That is, the metal layer 211 is used as one electrode and the ITO film 21 is used.
A capacitor (passive element 20) is formed by sandwiching the light shielding portion 201 and the insulating film 210 between the two electrodes, with 2 being the other electrode (Y in FIG. 6B).

In the counter substrate 12B, a resistor (passive element 20) is formed by patterning the metal layer into a predetermined shape.

Therefore, for example, when the active element 21 such as the switching element is formed on the substrate, it is necessary to form the Si film. However, when the passive element 20 is formed, it is not necessary to form the Si film. Therefore, according to the present invention, a process for forming the passive element 20 can be easily added. Since the passive element 20 is formed using a part of the light shielding portion 201, an increase in the frame width due to the formation of the passive element 20 can be suppressed. Further, according to the present invention, the passive element 20 constituting the power supply circuit 16 is provided at an arbitrary location on the counter substrate 12A, and the passive element 20 is not provided on the flexible substrate 18. The module design can be advanced without considering the above.

In the above-described embodiment, the present invention is applied to the electro-optical device 1 using liquid crystal. However, the present invention is not limited to this, and can also be applied to an electro-optical device using an electro-optical material other than liquid crystal. An electro-optical material is a material whose optical characteristics such as transmittance and luminance change when an electric signal (current signal or voltage signal) is supplied. For example, the present invention can be applied to various electro-optical devices such as a display panel using an OLED element such as an organic EL (Electro-Luminescent) or a light-emitting polymer as an electro-optical material as in the above embodiment.

<Electronic equipment>
Next, an electrical apparatus to which the above-described electro-optical device 1 according to the invention is applied will be described.
FIG. 7 shows a configuration of a mobile phone to which the electro-optical device 1 is applied. A cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and the electro-optical device 1 as a display unit. In the cellular phone 3000, the screen displayed on the electro-optical device 1 is scrolled by operating the scroll button 3002.

In addition to the cellular phone 3000, the electronic apparatus to which the electro-optical device 1 is applied includes a personal computer, an information portable terminal, a digital still camera, a liquid crystal television, a viewfinder type, a monitor direct view type video tape recorder, a car navigation system. Device, pager,
Examples include electronic notebooks, calculators, word processors, workstations, videophones, POS terminals, and devices equipped with touch panels. The electro-optical device described above can be applied as a display unit of these various electronic devices.

1A and 1B are block diagrams illustrating a configuration of an electro-optical device according to an embodiment of the invention, where FIG. 3A is a cross-sectional view, and FIG. FIG. 2 is a partially enlarged plan view of the electro-optical device shown in FIG. 1. It is a figure which shows the structural example of the electro-optical apparatus formed by COG. It is a figure which shows the structural example of the electro-optical apparatus formed by SOG. 1 is a cross-sectional view illustrating a first embodiment of an electro-optical device according to the invention. FIG. 6 is a cross-sectional view illustrating a second embodiment of the electro-optical device according to the invention. It is a perspective view which shows the structure of the mobile telephone to which the above-mentioned electro-optical apparatus is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electro-optical device, 10 ... Pixel part, 11 ... 1st board | substrate (array substrate), 12, 12A,
12B: second substrate (counter substrate), 13: electro-optical material, 14: vertical drive circuit (scan line drive circuit), 15 ... horizontal drive circuit (data line drive circuit), 16 ... power supply circuit, 17 ... timing Control (T / C) part, 18 ... Flexible substrate (TCP, Tape Carrier Package)
, 20... Passive elements, 21... Active elements, 100... Conducting parts, 101.
10A, 110B, 110C ... scanning line, 120, 120A, 120B ... data line, 130
... Common line, 150 ... Pixel, 151 ... TFT (switching element), 155 ... Pixel electrode,
156: Common electrode, 200: Color filter, 201: Light shielding part, 202, 204 ... Oxide film, 203 ... Metal film, 205, 210 ... Insulating film, 206, 212 ... ITO film

Claims (10)

A first substrate having a pixel portion in which a plurality of pixels are arranged in a matrix, a second substrate disposed opposite to the first substrate, the first substrate, and the second substrate An electro-optic device comprising an electro-optic material sandwiched between
A power supply circuit that generates a predetermined voltage and supplies the generated voltage to each unit;
An electro-optical device, wherein a passive element that constitutes the power supply circuit is provided on the second substrate. The electro-optical device according to claim 1.
An electro-optical device, wherein an active element constituting the power supply circuit is provided on the first substrate. The electro-optical device according to claim 1,
The second substrate has a color filter in which red (R), green (G), and blue (B) pixels are periodically arranged, and shields light on the boundary between the pixels and outside the outermost peripheral pixel used for display. The electro-optical device is characterized in that a passive element constituting the power supply circuit is formed on the light shielding portion. The electro-optical device according to claim 3.
In the second substrate, the light shielding portion is formed of a predetermined metal material, a predetermined dielectric material is formed on the light shielding portion, and a predetermined metal material is formed on the dielectric material. Thus, the passive element is configured. The electro-optical device according to claim 3.
In the second substrate, the light shielding portion is formed of a predetermined resin material, a predetermined metal material is formed on the light shielding portion, a predetermined dielectric material is formed on the metal material,
2. The electro-optical device according to claim 1, wherein the passive element is formed by forming a predetermined metal material on the dielectric material. The electro-optical device according to claim 3,
An electro-optical device, wherein a conductive portion for electrically connecting the passive element and the active element is provided between the first substrate and the second substrate. Arranged facing an array substrate having a pixel portion in which a plurality of pixels are arranged in a matrix,
In a color filter substrate in which pixels emitting different colors are arranged periodically to form a color filter, having a light-shielding portion between the pixels, and sandwiching an electro-optical material with a counter substrate,
A color filter substrate, wherein a passive element that constitutes a power supply circuit that generates a predetermined voltage and supplies the generated voltage to each unit is provided at an arbitrary place. The color filter substrate according to claim 7,
The light shielding portion is formed of a predetermined metal material, a predetermined dielectric material is formed on the light shielding portion, and a predetermined metal material is formed on the dielectric material, whereby the passive element is formed. A color filter substrate characterized by comprising. The color filter substrate according to claim 7,
The light shielding portion is formed of a predetermined resin material, a predetermined metal material is formed on the light shielding portion, a predetermined dielectric material is formed on the metal material, and an upper portion of the dielectric material. A color filter substrate, wherein the passive element is configured by forming a predetermined metal material. An electronic apparatus comprising the electro-optical device according to claim 1.

Images