JP2007304355A - Functional element, negative photosensitive resin composition used in the same and method for manufacturing functional element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition used in a functional element in which two bases placed opposite to each other are bonded together by way of a structure obtained from the negative photosensitive resin composition, the negative photosensitive resin composition being excellent in pattern resolution and in adhesiveness of the structure to the bases. <P>SOLUTION: In the functional element in which a second base is pressure-bonded onto a first base by way of a patterned structure provided by photolithography to bond the two bases together, a resin composition for forming the structure is the negative photosensitive resin composition comprising (A) an acrylic monomer, (B) a hydrogenated product of an alkali-soluble polymer obtained by copolymerizing an unsaturated carboxylic acid and another unsaturated compound or an alkali-soluble phenolic resin, (C) a photopolymerization initiator and (D) an epoxy compound. Such a negative photosensitive resin composition has excellent pattern resolution and excels also in adhesiveness to the opposite bases. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component using a photosensitive resin composition and a method for producing the same. More specifically, the present invention relates to a functional element useful as a liquid crystal display element, a negative photosensitive resin composition used in the production thereof, and a method for producing a functional element using the negative photosensitive resin composition.

The greatest feature of the photosensitive resin composition is that an arbitrary fine pattern can be formed on a substrate (or a substrate, hereinafter the same) using a photolithographic technique. Examples thereof include a solder resist for protecting the surface of a circuit board and a resist for MEMS (Micro Electro Mechanical System) for creating a fine structure sensor. In recent years, not only can a photolithographic pattern be formed on a single substrate, but also a photolithographic pattern using a photosensitive composition can be bonded to the opposite substrate to form a gap between both substrates. Methods have been proposed for use for supporting or securing purposes. Examples thereof include a method for connecting electrode pads formed on an integrated circuit element (Patent Document 1), a method for bonding a circuit board (Patent Document 2), a method for manufacturing a semiconductor package (Patent Document 3), and a method for manufacturing a liquid crystal element ( Patent document 4) etc. are mentioned. Further, in Patent Document 5, improvement of adhesiveness is examined for the above-described use using a positive photosensitive resin composition.
Japanese Patent No. 3050345 Japanese Patent No. 2660943 JP 2003-347357 A Japanese Patent Laid-Open No. 2004-163459 JP 2005-181976 A

However, when a conventionally known photosensitive resin composition is used for the adhesive application, it has been pointed out that a problem remains in the adhesive performance, and Patent Document 5 discloses that the positive photosensitive resin composition has an adhesive property. Although examination has been carried out, the resolution of the photosensitive resin composition shows only a resolution of about 40 μm and has not been sufficiently studied.
Thus, the present situation is that examination of the negative photosensitive resin composition for the said application excellent in adhesiveness and also in the resolution is not fully made | formed.

  The present invention provides a functional element in which two substrates arranged opposite to each other are bonded via a structure obtained from a negative photosensitive resin composition, and has excellent pattern resolution and It aims at providing the negative photosensitive resin composition excellent also in adhesiveness.

As a result of intensive studies to solve the above problems, the present inventors have found that a negative photosensitive resin composition having a specific composition solves the above problems, and completed the present invention. It is a thing. That is, the present invention
(1) Forming the structure in a functional element in which the second substrate is bonded by bonding the second substrate through a patterned structure provided by photolithography on the first substrate. (A) Acrylic monomer, (B) Hydrogenated product of alkali-soluble polymer or alkali-soluble phenol resin obtained by copolymerizing unsaturated carboxylic acid and other unsaturated compound, (C) The functional element, which is a negative photosensitive resin composition containing a photopolymerization initiator and (D) an epoxy compound,
(2) The functional element according to (1), wherein the negative photosensitive resin composition further contains a solvent,
(3) The component (B) in the negative photosensitive resin composition is an alkali-soluble polymer obtained by copolymerizing methacrylic acid, methyl methacrylate and -n-butyl methacrylate (1) or (2 ) Functional element according to
(4) The functional element according to (3), wherein a molar blending ratio of methacrylic acid which is a constituent component of the alkali-soluble polymer obtained by copolymerization is 10 mol% to 60 mol%,
(5) The functional element according to any one of (1) to (4), wherein the softening point of the epoxy compound (D) in the negative photosensitive resin composition is 40 ° C to 110 ° C,
(6) (D) The epoxy compound is a polycondensate of 2,2-bis (hydroxymethyl) -1-butanol and 1,2-epoxy-4-vinylcyclohexane or an epoxy compound represented by the following formula (1): A functional element according to (5),

(7) The proportion of the (D) epoxy compound in the total amount of (A), (B), (C) and (D) in the negative photosensitive resin composition is 5% to 50% by weight. The functional element according to any one of (1) to (6),
(8) A hydrogenated product of an alkali-soluble polymer or an alkali-soluble phenol resin obtained by copolymerizing (A) an acrylic monomer, (B) an unsaturated carboxylic acid and another unsaturated compound on the first substrate, ( C) A structure is provided by photolithography using a negative photosensitive resin composition containing a photopolymerization initiator and (D) an epoxy compound, and then a second substrate is pressure-bonded onto the structure. A method of manufacturing a functional element in which two substrates are integrated,
(9) The manufacturing method according to (8), wherein the functional element is a liquid crystal display element,
(10) (A) an acrylic monomer, (B) a hydrogenated product of an alkali-soluble polymer or an alkali-soluble phenol resin obtained by copolymerizing an unsaturated carboxylic acid and another unsaturated compound, (C) a photopolymerization initiator And (D) a resin composition containing an epoxy compound, wherein two substrates are bonded by pressing a second substrate via a patterned structure provided on the first substrate by photolithography. A negative-type photosensitive resin composition for forming the structure, which is used to create a functional element having a bonded structure,
(11) The negative photosensitive resin composition according to (10), wherein the negative photosensitive resin composition further contains a solvent,
(12) The component (B) in the negative photosensitive resin composition is an alkali-soluble polymer obtained by copolymerizing methacrylic acid, methyl methacrylate and -n-butyl methacrylate (10) or (11 ) Negative photosensitive resin composition according to
(13) The negative photosensitive resin composition according to (12), wherein the molar blending ratio of methacrylic acid which is a constituent component of the alkali-soluble polymer obtained by copolymerization is 10 mol% to 60 mol%,
(14) The negative photosensitive resin composition according to any one of (10) to (13), wherein the softening point of the epoxy compound (D) in the negative photosensitive resin composition is 40 ° C. to 110 ° C. ,
(15) (D) The epoxy compound is a polycondensate of 2,2-bis (hydroxymethyl) -1-butanol and 1,2-epoxy-4-vinylcyclohexane or an epoxy compound represented by the above formula (1). A negative photosensitive resin composition according to (14),
(16) The proportion of the (D) epoxy compound in the total amount of (A), (B), (C) and (D) in the negative photosensitive resin composition is 5% to 50% by weight. The negative photosensitive resin composition according to any one of (10) to (15),
About.

  Since the functional element using the negative photosensitive resin composition of the present invention has high resolution and excellent adhesion to the substrate, it is a liquid crystal display element, plasma display element, electronic circuit element, optical semiconductor element (light receiving element, light emitting element). It is useful as a functional element such as an element, a CMOS, a CCD chip, etc.), or a MEMS creation element.

Hereinafter, the present invention will be described in detail.
The functional element of the present invention is obtained by pressure-bonding the second substrate and bonding the two substrates through a patterned structure provided by photolithography on the first substrate, and Hydrogenation of alkali-soluble polymer or alkali-soluble phenol resin obtained by copolymerizing (A) acrylic monomer, (B) unsaturated carboxylic acid and other unsaturated compound as resin composition for forming said structure Product, (C) a photopolymerization initiator, and (D) a negative photosensitive resin composition containing an epoxy compound.
The negative photosensitive resin composition used in the present invention comprises (A) an acrylic monomer, (B) an alkali-soluble polymer or an alkali-soluble phenol resin obtained by copolymerizing an unsaturated carboxylic acid and another unsaturated compound. (C) a photopolymerization initiator and (D) an epoxy compound. These components are described below.

  (A) As the acrylic monomer, a monomer having a (meth) acryl group and having a polymerizable property is used without limitation, and can be arbitrarily selected from those usually used as a photosensitive resin composition. . Specific examples of acrylic monomers that can be used include, for example, 2-acryloyloxyethyl-2-hydroxypropyl phthalate, 2-methacryloyloxyethyl-2-hydroxypropyl phthalate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, Diethylene glycol monoethyl ether acrylate, diethylene glycol monoethyl ether methacrylate, isobornyl acrylate, isobornyl methacrylate, 3-methoxybutyl acrylate, 3-methoxybutyl methacrylate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, diethylene glycol di Methacrylate, tetraethylene glycol diacrylate, Raethylene glycol dimethacrylate, bisphenoxyethanol full orange acrylate, bisphenoxyethanol full orange methacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, 1,9-nonanediol diacrylate, 1,9-nonane Diol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipenta Erythritol hexaacrylate DOO, dipentaerythritol hexa methacrylate, tri (2-acryloyloxyethyl) phosphate, tri (2-methacryloyloxyethyl) phosphate and the like. These are KAYARAD TC-110S, TC-120S, HDDA, HX-220, R-604, TMPTA, DPHA, DPHA-40H, DPCA-20, DPCA-30, DPCA-60, DPCA-120 (Nippon Kayaku ( Etc.), etc., and can be easily obtained from the market as Viscoat 260, 312, 335HP, 295, 300, 360, GPT, 3PA, 400 (Osaka Organic Chemical Co., Ltd.).

Of these acrylic monomers, (meth) acrylic acid esters having three or more (meth) acrylic groups are preferred, and in particular, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol, tetraacrylate, dipenta Preferred examples include erythritol pentaacrylate and dipentaerythritol hexaacrylate.
These acrylic monomers can be used alone or in combination of two or more.

  Considering developability and adhesiveness, the proportion of these (A) acrylic monomers in the total amount of (A), (B), (C) and (D) is 5% to 70% by weight. Preferably there is. If it is less than 5% or exceeds 70%, the developability in the photolithography process may be inferior.

As the component (B), an alkali-soluble resin component is used. In the present invention, a hydrogenated product of an alkali-soluble polymer or an alkali-soluble phenol resin obtained by copolymerizing an unsaturated carboxylic acid and another unsaturated compound. Is used.
The unsaturated carboxylic acid in the alkali-soluble polymer obtained by copolymerizing the unsaturated carboxylic acid as the component (B) and other unsaturated compound is an aliphatic compound having 1 to 2 carboxyl groups or its anhydride Things can be used without restriction. Specific examples of the unsaturated carboxylic acid that can be used include monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, and benzyl methacrylic acid, and dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, and itaconic acid. And anhydrides of these dicarboxylic acids.

  The “other unsaturated compound” in the alkali-soluble polymer obtained by copolymerizing the unsaturated carboxylic acid of component (B) with other unsaturated compounds includes esters of ethylenically unsaturated carboxylic acid, vinyl Aromatic compounds and conjugated diene compounds can be used. Specific examples of “other unsaturated compounds” that can be used include, for example, alkyl acrylates such as methyl acrylate and i-propyl acrylate; methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, and methacrylic acid. Methacrylic acid alkyl esters such as sec-butyl and t-butyl methacrylate; cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricycloacrylate [5.2.1.02,6] decan-8-yl, acrylic acid 2- (tricyclo [5.2.1.02,6] decan-8-yloxy) ethyl, alicyclic esters of acrylic acid such as isobornyl acrylate; cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, methacrylic acid Tricyclo [5.2.1.02,6] decane-8- , Alicyclic esters of methacrylic acid such as 2- (tricyclo [5.2.1.02,6] decan-8-yloxy) ethyl methacrylate, isobornyl methacrylate; phenyl acrylate, benzyl acrylate, etc. Aryl esters or aralkyl esters of acrylic acid; aryl esters or aralkyl esters of methacrylic acid such as phenyl methacrylate and benzyl methacrylate; dicarboxylic acid dialkyl esters such as diethyl maleate, diethyl fumarate and diethyl itaconate; methacrylic acid Methacrylic acid hydroxyalkyl esters such as 2-hydroxyethyl and 2-hydroxypropyl methacrylate; tetrahydrofurfuryl methacrylate, tetrahydrofuryl methacrylate, tetrahydrofupyran-2-methyl Unsaturated hetero five- and six-membered methacrylic acid esters containing one oxygen atom such as tacrylate; vinyl aromatic compounds such as styrene, α-methyl styrene, m-methyl styrene, p-methyl styrene, p-methoxy styrene; 1 Conjugated diene compounds such as 1,3-butadiene, isoprene and 2,3-dimethyl-1,3-butadiene.

These alkali-soluble polymers can be easily obtained by radically polymerizing “other unsaturated compounds” in the presence of a polymerization initiator in a solvent in the same manner as the unsaturated carboxylic acids exemplified above. Can be manufactured. Specific examples of the polymerization initiator that can be used in this case include, for example, 2,2′-azobisisobutyronitrile, 2,2′-azobis- (2,4-dimethylvaleronitrile), and 2,2′-. Azobis- (4-methoxy-2,4-dimethylvaleronitrile), 4,4′-azobis (4-cyanovaleric acid), dimethyl 2,2′-azobis (2-methylpropionate), 2,2 ′ -Azo compounds such as azobis (4-methoxy-2,4-dimethylvaleronitrile); organic peroxidation such as benzoyl peroxide, lauroyl peroxide, t-butylperoxypivalate, 1,1-bis (t-butylperoxy) cyclohexane Thing; hydrogen peroxide etc. can be mentioned. Moreover, when using a peroxide as a radical polymerization initiator, it is good also as a redox type initiator using a reducing agent together. These radical polymerization initiators can be used alone or in admixture of two or more.
In the above, unsaturated carboxylic acid and "other unsaturated compound" can be used individually or in combination of 2 types or more, respectively.

  As the alkali-soluble polymer obtained by copolymerizing these unsaturated carboxylic acids and other unsaturated compounds, among the combinations of the above unsaturated carboxylic acids and other unsaturated compounds, the developability of the photolithographic process and In view of adhesiveness, an alkali-soluble polymer obtained by using methacrylic acid as the unsaturated carboxylic acid and methyl methacrylate and n-butyl methacrylate as the “other unsaturated compound” is particularly preferable. In addition, the (B) alkali-soluble polymer preferably has a weight average molecular weight of about 5,000 to 50,000 by GPC (gel permeation chromatography) in consideration of solubility in the solvent and adhesiveness. Furthermore, the molar blending ratio of the unsaturated carboxylic acid in the alkali-soluble polymer is preferably 10 mol% to 60 mol%. When the blending ratio of the unsaturated carboxylic acids in the alkali-soluble polymer is less than 10 mol% or more than 60%, the developability in the photolithography process may be inferior.

Next, the hydrogenated product of the alkali-soluble phenol resin as the component (B) is, for example, a condensation reaction product of phenols and aldehydes, a condensation reaction product of phenols and ketones, a vinylphenol polymer, or the like. Obtained by partially nuclear hydrogenation of the alkali-soluble phenol resin.
Examples of phenols that can be used here include phenol, cresol, xylenol, resorcinol, etc., and aldehydes such as formaldehyde and acetaldehyde, and ketones such as acetone and methyl ethyl ketone. Examples of the monomer of the polymer include o-hydroxystyrene, p-hydroxystyrene, m-hydroxystyrene, 3-methyl-4-hydroxystyrene, 3-ethyl-4-hydroxystyrene, and α-methylstyrenes thereof. Etc. are mentioned as preferable examples. The vinylphenol polymer used in the present invention may be a copolymer of the above styrenes and a copolymerizable monomer such as (meth) acrylic acid or meth) acrylic acid ester.

The condensation reaction, polymerization reaction and copolymerization reaction using these monomers can be carried out according to conventional methods. In addition, hydrogenation is preferably performed so that the hydrogenation rate is usually 1 to 70%, preferably 3 to 40%, and when the hydrogenation rate exceeds 70%, the solubility in alkali becomes poor. On the other hand, when the hydrogenation rate is less than 1%, the performance as an alkali-soluble phenol resin is inferior, which is not preferable.
In the present invention, a hydrogenated product of a homopolymer of hydroxystyrenes is preferable, and a hydrogenated product of a homopolymer of p-hydroxystyrene is particularly preferable. The hydrogenated p-hydroxystyrene homopolymer can be produced by a conventional method as described above (for example, see JP-A-2-103048), but PHM-C (partially hydrogenated polyvinylphenol, Maruzen Petrochemical Co., Ltd.)

  The proportion of the component (B) (alkali-soluble polymer) in the total amount of (A), (B), (C) and (D) is preferably 10% to 70% by weight, and further has resolution. And considering the subsequent adhesiveness, 20% to 60% is more preferable.

(C) As a photoinitiator, the functional compound which starts polymerization by light irradiation can be used without a restriction | limiting. Specific examples of the photopolymerization initiator that can be used include, for example, benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether; acetophenone, 2,2-diethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2-methyl-phenylpropan-1-one, diethoxyacetophenone, 1-hydroxyhexylphenyl ketone, 2-methyl-1 -[4- (Methylthio) phenyl] -2-morpholinopropan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethyl Amino-1- (4-mo Acetophenones such as forinophenyl) -butane-1,2-dimethylamino-2- (4-methyl-benzyl) -1- (4-morpholin-4-yl-phenyl) -butan-1-one; Anthraquinones such as ethyl anthraquinone, 2-tertiary butyl anthraquinone, 2-chloroanthraquinone, 2-amylanthraquinone; thioxanthones such as 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone; acetophenone dimethyl ketal Ketones such as benzyldimethyl ketal; benzophenones such as benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide and 4,4′-bismethylaminobenzophenone; 2,4,6-trimethylbenzoyldiphenylphos Examples thereof include phosphine oxides such as fin oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide. Among these, for example, Irgacure 907 (2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, manufactured by Ciba Specialty Chemicals) can be obtained as a commercial product.
These can be used alone or in combination of two or more.
(C) The proportion of the photopolymerization initiator in the total amount of (A), (B), (C) and (D) is usually 0.5% to 30% by weight, preferably 1% to 10%.

  (D) As the epoxy compound, a compound having an epoxy group is used. Examples of epoxy compounds that can be used include, for example, polyfunctional epoxy compounds that are glycidyl ethers of polyphenol compounds, polyfunctional epoxy compounds that are glycidyl ethers of various novolak resins, alicyclic polyfunctional epoxy compounds, aliphatic Examples thereof include polyfunctional epoxy compounds, heterocyclic polyfunctional epoxy compounds, glycidyl ester polyfunctional epoxy compounds, glycidyl amine polyfunctional epoxy compounds, and polyfunctional epoxy compounds obtained by glycidylation of halogenated phenols.

Specific examples of the above various epoxy compounds include the following.
First, as a polyfunctional epoxy compound which is a glycidyl etherified product of a polyphenol compound, 2- [4- (2,3-hydroxyphenyl) -2- [4- [1,1-bis [4- (2,3 -Hydroxy) phenyl] ethyl] phenyl] propane, bisphenol A, bisphenol F, bisphenol S, 4,4'-biphenol, tetramethyl bisphenol A, dimethyl bisphenol A, tetramethyl bisphenol F, dimethyl bisphenol F, tetramethyl bisphenol S, Dimethylbisphenol S, tetramethyl-4,4′-biphenol, dimethyl-4,4′-biphenol, 1- (4-hydroxyphenyl) -2- [4- (1,1-bis- (4-hydroxyphenyl) Ethyl) phenyl] propane, 2,2′-methylene-bi (4-methyl-6-tert-butylphenol), 4,4′-butylidene-bis (3-methyl-6-tert-butylphenol), trishydroxyphenylmethane, resorcinol, hydroquinone, pyrogallol, phloroglicinol, diisopropyl Polyfunctional epoxy compounds that are glycidyl etherified products of phenols having a redene skeleton, phenols having a fluorene skeleton such as 1,1-di-4-hydroxyphenylfluorene, polyphenol compounds such as phenolized polybutadiene, and allylated phenols Can be mentioned.

  Next, polyfunctional epoxy compounds which are glycidyl etherification products of various novolak resins include phenols, cresols, ethylphenols, butylphenols, octylphenols, bisphenols such as bisphenol A, bisphenol F and bisphenol S, naphthols, etc. Glycidyl etherified products of various novolac resins such as novolak resins made from various phenols, xylylene skeleton-containing phenol novolak resins, dicyclopentadiene skeleton-containing phenol novolak resins, biphenyl skeleton-containing phenol novolak resins, fluorene skeleton-containing phenol novolak resins, etc. It is done.

Furthermore, as other alicyclic polyfunctional epoxy compounds, alicyclic polyfunctional epoxy compounds having an aliphatic ring skeleton such as cyclohexane, and aliphatic polyfunctional epoxy compounds as 1,4-butanediol, 1,6-hexane. Glycidyl ethers of polyhydric alcohols such as diol, polyethylene glycol and pentaerythritol, heterocyclic polyfunctional epoxy compounds include heterocyclic polyfunctional epoxy compounds having heterocyclic rings such as isocyanuric rings and hydantoin rings, glycidyl ester epoxy compounds As epoxy compounds composed of carboxylic acid esters such as hexahydrophthalic acid diglycidyl ester, and glycidylamine polyfunctional epoxy compounds as glycidylated epoxy compounds and halogenated phenols such as aniline and toluidine. Examples of sidylated epoxy compounds include halogenated phenols such as brominated bisphenol A, brominated bisphenol F, brominated bisphenol S, brominated phenol novolac, brominated cresol novolak, chlorinated bisphenol S, and chlorinated bisphenol A. The epoxy compound etc. which were made into each are mentioned.
These epoxy compounds can be used alone or in combination of two or more.

Among the various epoxy compounds described above, in consideration of the resolution at the time of photolithography and the subsequent adhesiveness, an epoxy compound that is solid at room temperature is preferable, and the softening point is 40 ° C to 110 ° C.
An epoxy compound is preferred. Epoxy compounds that exhibit a liquid state at room temperature tend to have poor adhesion, and among epoxy compounds that are solid at room temperature, those having a softening point exceeding 110 ° C. are likely to remain in the photolithographic process and have poor developability. Tend.

  Among epoxy compounds having a softening point of 40 ° C. to 110 ° C. (solid at room temperature), a polyfunctional epoxy compound represented by the following formula (1), which is a glycidyl etherified product of a polyphenol compound, also has an aliphatic ring skeleton. Among cyclic polyfunctional epoxy compounds, a polycondensate of 2,2-bis (hydroxymethyl) -1-butanol and 1,2-epoxy-4-vinylcyclohexane can be exemplified as a particularly preferable epoxy compound. The epoxy compound represented by the following formula (1) is easily available as a commercial product, for example, NC6000 (manufactured by Nippon Kayaku), VG-3101L (manufactured by Mitsui Chemicals), or the like.

  The proportion of these (D) epoxy compounds in the total amount of (A), (B), (C) and (D) is preferably 5% to 50% by weight, and further, photolithography Considering the developability in the process and the subsequent adhesiveness, the weight ratio is more preferably 5% to 40%.

In a preferred embodiment, the negative photosensitive resin composition used in the present invention is a negative photosensitive resin by dissolving each of the above components together with a solvent appropriately selected from the solvents described below. It is prepared as a solution of the resin composition.
Specific examples of the solvent that can be used here include alcohols such as methanol, ethanol, propanol, and butanol, preferably lower alcohols having 1 to 4 carbon atoms, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol. Glycol ethers such as monobutyl ether, propylene glycol monomethyl ether, 3-methoxybutanol and 3-methyl-3-methoxybutanol, preferably a C 1-4 lower ether of alkylene glycol having 1 to 4 carbon atoms, ethylene glycol mono Ethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methyl Alkylene glycol ether acetates such as xylbutyl acetate, 3-methyl-3-methoxybutyl acetate, ethyl ethoxypropiolate, preferably lower ether acetates having 1 to 4 carbon atoms of alkylene glycols having 1 to 4 carbon atoms, toluene, Aromatic hydrocarbons such as xylene, ketones such as methyl ethyl ketone, cyclohexanone, cyclopentanone, 4-hydroxy-4-methyl-2-pentanone, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, 2-hydroxy-2 -Methyl methyl propionate, ethyl 2-hydroxy-2-methyl propionate, methyl hydroxyacetate, ethyl hydroxyacetate, butyl hydroxyacetate, methyl lactate, ethyl lactate, butyl lactate, methyl 3-hydroxypropionate, 3-hydroxy Ethyl propionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, propyl 2-hydroxy-3-methylbutanoate, ethyl methoxyacetate, propyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, ethoxyacetic acid Butyl, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate Butyl 2-ethoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, 3-ethoxypropionate Carbons optionally substituted by esters such as methyl onate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, preferably hydroxy groups and lower alkyl groups having 1 to 4 carbon atoms Examples thereof include alkyl esters of 1 to 4 carbon atoms of fatty acids of 2 to 4 and ethers such as tetrahydrofuran.

  Among these solvents, the solubility in each of the components ((A), (B), (C) and (D)), the chemical stability of the solvent itself, the change with time of concentration due to volatilization is small, the human body In consideration of toxicity to propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, etc., alkylene ethers having 2 to 3 carbon atoms, lower ether acetates having 1 to 4 carbon atoms, propylene glycol monomethyl Ether, 3-methoxybutanol, 3-methyl-3-methoxybutanol, esters and the like are preferably selected.

  In the present invention, as the film thickness of the structure, a range of usually 1 μm to 50 μm (film thickness after curing of the negative photosensitive resin composition) is frequently used. The film thickness varies depending on the conditions such as the types (A), (B), (C) and (D) and the mixing ratio, the types and mixing ratios of other additives described below, or the coating method (described later). Therefore, it is preferable to set these conditions so that the film thickness of the structure is in the above range.

  In the present invention, in preparing the negative photosensitive resin composition solution, in addition to the components (A), (B), (C) and (D), the solvent, and if necessary, (D) Curing agents, curing accelerators, sensitizers, coupling agents, surfactants, reactive fillers with epoxy compounds, inorganic fillers such as silica, alumina, talc, calcium carbonate, barium sulfate, antioxidants, light stabilizers In addition, additives such as a moisture resistance improver, a thixotropy imparting agent, an antifoaming agent, other various resins, a tackifier, an antistatic agent, a lubricant, and an ultraviolet absorber can also be blended.

  Examples of the curing agent that is reactive with the epoxy compound include an acid anhydride curing agent, an imidazole curing agent, a carboxylic acid curing agent, an amine curing agent, a hydrazide curing agent, and a phenol curing agent. . These can be mixed and used within a range that does not adversely affect the developability of the photolithography process and the subsequent adhesiveness.

  Examples of the acid anhydride curing agent include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol trimellitic anhydride, biphenyltetracarboxylic anhydride. Aromatic carboxylic anhydrides such as azelaic acid, sebacic acid, dodecanedioic acid, etc .; tetrahydrophthalic anhydride, hexahydrophthalic anhydride, nadetic acid anhydride, het acid anhydride, Examples include alicyclic carboxylic acid anhydrides such as highmic acid anhydrides.

  Examples of the imidazole curing agent include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1 -Benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2′-methylimidazole ( 1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2′-undecylimidazole (1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2′-ethyl, 4- Methylimidazole (1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2 ′ -Methylimidazole (1 ')) ethyl-s-triazine isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2: 3 adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxy Various imidazoles of methylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, and imidazoles and phthalic acid, isophthalic acid, Terephthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, maleic acid, salts with polyvalent carboxylic acids such as succinic acid, amides such as dicyandiamide, 1,8-diaza-bicyclo (5.4.0) undecene-7 Diaza compounds and their pheno , Salts with the polyvalent carboxylic acids or phosphinic acids, tetrabutylammonium bromide, cetyltrimethylammonium bromide, ammonium salts such as trioctylmethylammonium bromide, phosphines such as triphenylphosphine, tetraphenylphosphonium tetraphenylborate, Examples include phenols such as 2,4,6-trisaminomethylphenol, and various compounds such as amine adducts.

  Examples of the carboxylic acid-based curing agent include aliphatic polycarboxylic acids having 2 to 22 carbon atoms such as succinic acid, adipic acid, azelaic acid, and sebacic acid; phthalic acid, isophthalic acid, terephthalic acid, 1,2,4- Aromatic polycarboxylic acids such as benzenetricarboxylic acid, 1,2,4,5-benzenetetracarboxylic acid, naphthalenedi (or tetra) carboxylic acid; fats such as tetrahydrophthalic acid, hexahydrophthalic acid, and methylhexahydrophthalic acid And cyclic polycarboxylic acid.

  Examples of the amine curing agent include diaminodiphenylmethane, 4,4′-diamino-3,3′-diethyldiphenylmethane, diaminodiphenylsulfone, diaminodiphenyl ether, p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 1 , 5-diaminonaphthalene, m-xylylenediamine and other aromatic amines; ethylenediamine, diethylenediamine, isophoronediamine, bis (4-amino-3-methyldicyclohexyl) methane, polyetherdiamine and other aliphatic amines; dicyandiamide, Examples thereof include guanidines such as 1- (o-tolyl) biguanide.

  Specific examples of hydrazide-based curing agents include carbodihydrazide, oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, glutaric acid dihydrazide, adipic acid dihydrazide, pimelic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide hydrazide Dihydrazide, hexadecane dihydrazide, terephthalic acid dihydrazide, isophthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 4,4′-bisbenzenedihydrazide, 1,4-naphthoic acid dihydrazide, 2,6-pyridinedihydrazide, 1,4 -Cyclohexane dihydrazide, tartaric acid dihydrazide, malic acid dihydrazide, iminodiacetic acid dihydrazide, N, N'-hexamethylenebissemicarbazide, itaconic acid dihydra Dihydrazide compounds such as de; Piromeritsuto acid trihydrazide, ethylenediaminetetraacetic acid tetrahydrazide, polyfunctional hydrazide compounds such as 1,2,4-benzenetricarboxylic hydrazide.

  Specific examples of the phenolic curing agent include bisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, tetramethylbisphenol A, dimethylbisphenol A, tetramethylbisphenol F, dimethylbisphenol F, tetramethylbisphenol S, Dimethylbisphenol S, tetramethyl-4,4′-biphenol, dimethyl-4,4′-biphenylphenol, 1- (4-hydroxyphenyl) -2- [4- (1,1-bis- (4-hydroxyphenyl) ) Ethyl) phenyl] propane, 2,2′-methylene-bis (4-methyl-6-tert-butylphenol), 4,4′-butylidene-bis (3-methyl-6-tert-butylphenol), trishydroxyphenyl Methane, resorcino , Hydroquinone, pyrogallol, phenols having a diisopropylidene skeleton, phenols having a fluorene skeleton such as 1,1-di-4-hydroxyphenylfluorene, phenolated polybutadiene, phenol, cresols, ethylphenols, butylphenols, Novolak resin, xylylene skeleton-containing phenol novolak resin, dicyclopentadiene skeleton-containing phenol novolak resin, biphenyl skeleton-containing phenol novolak resin, fluorene skeleton Various novolak resins such as a phenol novolac resin containing phenol and a phenol novolac resin containing furan skeleton are listed.

  In the above, when (D) a curing agent that is reactive with the epoxy compound is added, considering the reactivity with the (D) epoxy compound, an equivalent ratio of 0.4 to 1.5, preferably 0.6 to It is preferable to use in the range of 1.2. If the amount used is outside this range, curing failure may occur.

  As the curing agent, a compound that is reactive with the epoxy compound (D) is used. When a curing agent is added, it is preferable to use as the curing accelerator a compound that functions as a catalyst that accelerates the reaction of (D) the curing agent that exhibits reactivity with the epoxy compound. Examples of such curing accelerators include imidazole curing accelerators, phosphines, tertiary amines, metal compounds such as tin octylate, and quaternary phosphonium salts.

  Specific examples of the curing accelerator that can be used include, for example, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, and 1-benzyl-2. -Phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2 '-Methylimidazole (1')) ethyl-s-triazine, 2,4-diamino-6 (2'-undecylimidazole (1 ')) ethyl-s-triazine, 2,4-diamino-6 (2' -Ethyl, 4-methylimidazole (1 ')) ethyl-s-triazine, 2,4-diamino 6 (2′-methylimidazole (1 ′)) ethyl-s-triazine isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2: 3 adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3 , 5-dihydroxymethylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, imidazole, 2-ethyl-4-methyl-imidazole, 1-cyanoethyl-2-ethyl-4-methyl-imidazole, 1-cyanoethyl-2-methyl-imidazole, 1-benzyl-2-ethyl-imidazole, 1-cyanoethyl-2-phenyl-4,5-di- (cyano Various imidazoles of ethoxymethyl) -imidazole And salts of these imidazoles with polyvalent carboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, maleic acid and succinic acid, amides such as dicyandiamide, 1,8-diaza Diaza compounds such as bicyclo (5.4.0) undecene-7 and their phenols, salts with the above polyvalent carboxylic acids or phosphinic acids, tetrabutyl ammonium bromide, cetyl trimethyl ammonium bromide, trioctyl methyl ammonium bromide And phosphines such as triphenylphosphine and tetraphenylphosphonium tetraphenylborate, phenols such as 2,4,6-trisaminomethylphenol, and amine adducts. May be used in combination. Among these curing accelerators, liquid imidazole compounds are preferable, and specifically, imidazole, 2-ethyl-4-methyl-imidazole, 1-cyanoethyl-2-ethyl-4-methyl-imidazole, 1-benzyl-2- Methyl-imidazole, 1-cyanoethyl-2-methyl-imidazole, 1-benzyl-2-ethyl-imidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-phenyl-4,5-di- (cyanoethoxy Methyl) -imidazole, 1,8-diaza-bicyclo (5.4.0) undecene-7 and the like can be preferably used. Among them, for example, 1B2PZ (manufactured by 1-benzyl-2-phenylimidazole Shikoku Kasei) can be obtained as a commercial product.

  These curing accelerators are generally used in an amount of 0.1 to 5 parts by weight, preferably 0.3 to 4 parts by weight, per 100 parts by weight of the (D) epoxy compound.

When a sensitizer is used, for example, N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl 4-dimethylaminobenzoate, tritylamine, triethanolamine, etc. Secondary amines are used, and these can be used alone or in combination of two or more. Among these, for example, DETX-S (aminobenzoic acid sensitizer manufactured by Nippon Kayaku) can be obtained as a commercial product.
These sensitizers are 0.05 to 15 parts by weight, preferably 0.5 to 10 parts by weight, based on 100 parts by weight of (A) acrylic monomer.

Examples of the coupling agent include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltri Methoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxy Silane, vinyltrimethoxysilane, N- (2- (vinylbenzylamino) ethyl) 3-aminopropyltrimethoxysilane hydrochloride, 3-methacryloxypropyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropi Silane coupling agents such as trimethoxysilane, isopropyl (N-ethylaminoethylamino) titanate, isopropyl triisostearoyl titanate, titanium di (dioctyl pyrophosphate) oxyacetate, tetraisopropyl di (dioctyl phosphite) titanate, neo Titanium coupling agents such as alkoxytri (p-N- (β-aminoethyl) aminophenyl) titanate, Zr-acetylacetonate, Zr-methacrylate, Zr-propionate, neoalkoxyzirconate, neoalkoxytrisneodecanoyl Zirconate, Neoalkoxytris (dodecanoyl) benzenesulfonyl zirconate, Neoalkoxytris (ethylenediaminoethyl) zirconate, Neoalkoxytris (m-aminophenyl) Zirconate, ammonium zirconium carbonate, Al-acetylacetonate, Al-methacrylate, Al-propionate and other zirconium, or aluminum coupling agents are used as necessary. By using a coupling agent, the adhesiveness with a base material improves and the cured film excellent in moisture resistance reliability is obtained.
The amount of these coupling agents used is 0.1 to 5 parts by weight, preferably 0.5 to 3 parts by weight, based on 100 parts by weight of the total amount of (A), (B), (C) and (D). Part.

  The surfactant can be used as necessary for the purpose of improving the coating suitability of the negative photosensitive resin composition. Examples of surfactants that can be used include silicon surfactants and fluorine surfactants, and Megafac F-470 (manufactured by Dainippon Ink & Chemicals, Inc.) is available as a commercial product. The addition amount is 0.01 to 1 part by weight, preferably 0.05 to 0.8 part by weight, with respect to 100 parts by weight of the total amount of (A), (B), (C) and (D). It is.

  Next, using the above-mentioned negative photosensitive resin composition, the second substrate is pressure-bonded through a patterned structure provided on the first substrate by photolithography technology to form both substrates. A method for manufacturing a functional element to which is bonded will be described based on an example of the functional element shown in FIG.

  In the method for producing a functional element of the present invention, the substrate that can be used is not particularly limited, and the substrate shape is not particularly limited as long as a structure can be constructed using a negative photosensitive resin composition. Alternatively, it may be a part of a part or the like. Examples of materials that can be used as the base material (reference numeral 1 in FIG. 1) include glass substrates, plastic film substrates, electrical and electronic circuit substrates, component substrates for semiconductor devices, semiconductor wafer substrates, and MEMS creation substrates. Examples thereof include materials and other component base materials.

Examples of the glass substrate include a non-alkali glass substrate for a display represented by a liquid crystal display device, a plasma display device, a cathode ray tube, and the like.
As a plastic film substrate, for example, a single plastic film such as a polyimide film, a polyester film, a polyether sulfone film, a polycarbonate film, a cycloolefin film, other retardation films, a diffusion film, an antireflection film, etc. Examples include plastic films.
Examples of the electric / electronic circuit substrate include commonly used glass epoxy electric circuit boards and flexible circuit boards.
Examples of the component base material for a semiconductor device include a device mounted with a semiconductor chip and a component base material for a semiconductor device mounted with an optical semiconductor element (light receiving element, light emitting element, CMOS, CCD, etc.).
As the semiconductor wafer substrate, for example, a Si wafer substrate or the like is shown, and the semiconductor wafer substrate can be applied to a semiconductor substrate in a semiconductor manufacturing process.
Examples of the MEMS creation substrate or other component substrate include a biochip-related substrate represented by a separation valve, an inkjet head component substrate, and the like.

The negative photosensitive resin composition (reference numeral 2 in FIG. 1) used in the present invention is applied as a solution on the first substrate, usually by spin coating, but is particularly limited as a coating method. Instead, it is appropriately selected according to the substrate to be applied, parts, etc., and application methods such as roll coating, spraying, curtain coating, slit coating, bar coating, and ink jet can be used.
The film thickness of the structure is not particularly limited. For example, the thickness of the structure is adjusted to 1 μm to 50 μm, preferably 1 μm to 30 μm, and the concentration of the negative photosensitive resin composition solution is adjusted. The coating method can be used.

  Next, as the drying conditions after coating on the first substrate, it is necessary to select the optimum conditions depending on the blending ratio of each component in the negative photosensitive composition solution and the type of solvent. Pre-bake at 125 ° C. to remove the solvent. The drying time is preferably adjusted to a time at which tack does not occur on the surface when pre-baking is completed.

  Next, it is irradiated with an exposure machine through a predetermined pattern mask (reference numeral 3 in FIG. 1), developed with an alkali developer to remove unnecessary portions (uncured portions), and then dried on the first substrate. The provided structure can be obtained.

  The radiation used for exposure is not particularly limited, and it is preferable to use a light source in the absorption wavelength region of the photopolymerization initiator. For example, visible light, ultraviolet light, or the like can be used. A wavelength range of 190 nm to 440 nm is preferable, and an ultraviolet ray of 365 nm is particularly preferable. Moreover, as irradiation energy, 50-1000 mJ is preferable.

The exposure method is not particularly limited to these, but known direct contact exposure or proximity exposure can be applied.
The developing method is not particularly limited, and it is carried out by a method known per se using a developer that can remove the uncured portion. Specific examples of the developer that can be used include, for example, inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate and ammonia, aliphatic primary amines such as ethylamine and n-propylamine, diethylamine and di- aliphatic secondary amines such as n-propylamine, aliphatic tertiary amines such as trimethylamine, methyldiethylamine, dimethylethylamine and triethylamine, alicyclic tertiary amines such as N-methylpiperidine and N-methylpyrrolidine, An aqueous solution of an alkaline compound such as an aromatic tertiary amine such as pyridine or quinoline or a quaternary ammonium salt such as tetramethylammonium hydroxide or tetraethylammonium hydroxide can be used. A surfactant may be added as appropriate to the aqueous solution of the alkaline compound. As the concentration of the developer, usually 0.1% by weight to 5% by weight can be employed.

The developing method may be any of publicly known paddle development, dip development, shower development, etc., and the development time is usually about 10 to 600 seconds at room temperature. After development, after a washing step, it can be air dried with compressed air or compressed nitrogen.
In this manner, an arbitrary structure (reference numeral 4 in FIG. 1) can be formed according to the pattern mask used on the first substrate using the negative photosensitive resin composition.

  Next, a process of bonding a second substrate (reference numeral 5 in FIG. 1) on the structure provided on the first substrate and bonding the two substrates will be described. Usually, the second substrate is pressure-bonded in a state where a structure is formed on the first substrate, and then both substrates or one substrate is heated to bond both substrates. Regarding this step, it is preferable to appropriately change the pressure bonding method and the heating method of both substrates depending on the types of the substrates.

For example, when pressure bonding / bonding glass substrates, place the first substrate with the structure on a heated hot plate, immediately bond the second substrate, and let the substrate stand by heating. Is possible. It is also possible to place the second base in advance on the first base on which the structure is formed, and to perform pressure bonding through a subsequent heating step. These are performed under atmospheric pressure or reduced pressure as necessary depending on the function of the functional element.
As the temperature in the heating step, a temperature at which sufficient adhesiveness is developed in consideration of the reactivity of the epoxy compound (D) is appropriately selected. For example, in the case of a solid epoxy compound, the adhesiveness is usually expressed by heating and bonding in the range of 100 ° C to 200 ° C. In consideration of the deformation of the structure during heating, it is more preferable to bond at a heating temperature of 160 ° C. or less.

  Further, when the plastic film substrates are bonded / bonded to each other, the second substrate film can be bonded to the first substrate film on which the structure has been prepared using a roll laminating apparatus. As a heating process, it is possible to make it adhere | attach by applying heat to both bases immediately after bonding. Also, it is possible to heat the first base film and the second base film immediately before bonding and perform the pressure bonding and the heating step almost simultaneously. In the heating step, a temperature range that does not damage the substrate film is preferable, and it is necessary to determine the type of the substrate film and control the heating step (heating temperature, holding time). These are performed under atmospheric pressure or reduced pressure depending on the function of the functional element.

  The above description is an example of a functional element in which two substrates are bonded via a structure. The second substrate is provided on the second substrate in accordance with the above, and the third substrate is provided on the second substrate. It is also possible to manufacture a functional element having a multilayer structure by adhering.

  In this way, the first base plate and the second base plate provided with an arbitrary structure according to the pattern mask are appropriately bonded and bonded / bonded via the structure by pressing / bonding. Functional elements can be formed. In the present invention, a liquid crystal display element is particularly preferable as a functional element.

When the functional element of the present invention is applied to a liquid crystal display element, it is prepared, for example, as follows (see FIG. 2).
First, according to the above-described method, a structure (reference numeral 4 in FIG. 2) is provided on the first base (reference numeral 1 in FIG. 2), and a second base (with reference numeral 6 in FIG. 2) is applied ( 2 is pressure-bonded, then liquid crystal is injected from a liquid crystal inlet (reference numeral 7 in FIG. 2), and the inlet is sealed to obtain the liquid crystal display element of the present invention. In the liquid crystal display element of the present invention, the structure prepared from the negative photosensitive resin composition provides a function of bonding both substrates and a gap for holding a certain amount of liquid crystal between the substrates. It also has a function of a spacer for the purpose.

  The functional element of the present invention has high resolution and excellent adhesion to the substrate. Therefore, it is useful as a liquid crystal display element, a plasma display element, an electronic circuit element, an optical semiconductor element (light receiving element, light emitting element, CMOS, CCD chip, etc.), an element for producing MEMS, and the like.

  Next, although the functional element of this invention is demonstrated in detail based on an Example, this invention is not limited to these Examples. In the following, “%” and “part” mean “% by weight” and “part by weight”, respectively, unless otherwise specified.

Examples 1 to 3
Preparation of negative photosensitive resin composition solution (A) DPHA as an acrylic monomer, (B) B-1 below as an alkali-soluble polymer obtained by copolymerizing an unsaturated carboxylic acid and another unsaturated compound In addition, as a hydrogenated alkali-soluble phenol resin, the following B-2 is used: (C) Irgacure 907 as a photopolymerization initiator, (D) NC6000 as an epoxy compound (a) represented by the following formula (1) In addition, as an epoxy compound (a), a polycondensate of 2,2-bis (hydroxymethyl) -1-butanol and 1,2-epoxy-4-vinylcyclohexane is used as another additive, and is reactive with the epoxy compound. H-1 (phenol novolac resin) as a curing agent showing 1B2PZ (1-benzyl-2-phenylimidazole) as a curing accelerator Table 1 shows Megafac F-470 (fluorine surfactant) as a surfactant, DETX-S (thioxanthone sensitizer) as a sensitizer, and propylene glycol monomethyl ether acetate (PGMEA) as a solvent. After blending according to the indicated parts by weight, it was dissolved to obtain a negative photosensitive resin composition.

Table 1 (Composition table, units are parts)
Example 1 Example 2 Example 3
(A) DPHA 33 35 55
(B)
B-1 34 32-
B-2 − − 45
(C) Irgacure 907 2.5 2.5 2.5
(D) Epoxy compound (A) 21.1 (A) 18.7 (A) 11.52
Curing agent 9.0 10.9-
Curing accelerator 0.21 0.37 0.12
Surfactant 0.55 0.1 0.58
Sensitizer 1.2 1.2 1.2
Solvent 112.06 124.12 141.68

(note)
(A) DPHA (dipentaerythritol hexaacrylate (acrylic monomer) manufactured by Nippon Kayaku)
(B)
B-1: a copolymer having a molar mixing ratio of methacrylic acid: methyl methacrylate: n-butyl methacrylate = 18: 54: 28 (mol%), and having a weight average molecular weight of 20000 by GPC analysis used.
B-2; PHM-C (partially hydrogenated polyvinylphenol, manufactured by Maruzen Petrochemical Co., Ltd., weight average molecular weight 5500, hydrogenation rate 11.8%)
(C) Irgacure 907 (Photoinitiator Ciba Specialty Chemicals)
(D) Epoxy compound (a);
(Epoxy compound represented by the following formula (1) NC6000, softening point 63 ° C, epoxy equivalent 222 manufactured by Nippon Kayaku)

Epoxy compound (a); (polycondensate of 2,2-bis (hydroxymethyl) -1-butanol and 1,2-epoxy-4-vinylcyclohexane, softening point 77 ° C., epoxy equivalent 181)
Curing agent: H1 (phenol novolac resin, phenol equivalent 105, manufactured by Meiwa Kasei)
Curing accelerator: 1B2PZ (1-benzyl-2-phenylimidazole, manufactured by Shikoku Chemicals)
Surfactant: Megafac F-470 (Fluorine-based surfactant, Dainippon Ink & Chemicals, Inc.)
Sensitizer: DETX-S (thioxanthone sensitizer manufactured by Nippon Kayaku)
Solvent: Propylene glycol monomethyl ether acetate

Examples 4-6
○ Creation of functional element Using the solutions of the respective negative photosensitive resin compositions obtained in Examples 1 to 3, non-alkali glass was used as the first substrate according to the coating conditions shown in Table 2, and FIG. The functional elements (Examples 4 to 6) of the present invention were obtained by the steps shown in (2nd substrate = non-alkali glass), respectively.

Table 2 (Coating conditions)
Example 4 Example 5 Example 6
(Note) (Example 1) (Example 2) (Example 3)
Coating method Spin coating method Spin coating method Spin coating method Pre-baking conditions 100 ° C. × 180 seconds 100 ° C. × 180 seconds 100 ° C. × 180 seconds Film thickness after curing 6.6 μm 6.1 μm 6.3 μm
UV irradiation energy 300mJ 300mJ 500mJ
Exposure method Direct contact Direct contact Direct contact development method Shower development Shower development Dip development development conditions 25 ° C 40 seconds 25 ° C 40 seconds 25 ° C 30 seconds

  Note: Example number of the corresponding negative photosensitive resin composition used is shown.

  As for the developer, for Example 4 or Example 5, Kaya Miller DVL-T50D (Aqueous developer made by Nippon Kayaku with tetramethylammonium hydroxide and surfactant as main components) is used. Tetramethylammonium hydroxide 2.38% aqueous solution was used.

Next, evaluation of adhesiveness and resolution of the negative photosensitive resin composition of the present invention will be described.
○ Adhesive evaluation (Creation process of first base for adhesive evaluation)
Each negative resin composition solution obtained in Examples 1 to 3 was applied onto a 60 mm square, 0.7 mm thick non-alkali glass substrate (borosilicate glass) using a spin coating method. Thereafter, prebaking was performed on a hot plate at 100 ° C. for 180 seconds. The coating film thus obtained was exposed in an air atmosphere without a pattern mask under the condition that the ultraviolet irradiation energy at 365 nm was 300 mJ. Thereafter, shower development was performed at 25 ° C. for 40 seconds with the Kaya mirror DVL-T50D, and then washed with running water and air-dried. However, Example 3 was developed with a 2.38% aqueous solution of tetramethylammonium hydroxide (25 ° C. × 30 seconds dip development), washed with running water, and air-dried.

(Creation of adhesive evaluation element)
Ten non-alkali glass (borosilicate glass) chips of 1.75 mm square were placed on the first base obtained as described above at equal intervals (see FIG. 3). Thereafter, the first substrate on which the second substrate is mounted is placed on a hot plate heated to 150 ° C., a glass substrate similar to the base material of the first substrate is placed on the second substrate, and further thereon 5 weights of 100 g were placed on the plate and allowed to stand for 30 minutes. After leaving for 30 minutes, the pressure-bonding glass substrate placed on the second substrate and the weight were removed, and the first substrate to which the second substrate chip was bonded was removed from the hot plate. In this way, a functional element for adhesion evaluation could be obtained. Such operation was performed about the negative photosensitive resin composition of Example 1- Example 3, and the three functional elements for adhesion evaluation (Example 7- Example 9) were obtained.

(Adhesion evaluation)
The adhesion of each functional element for adhesion evaluation obtained above was measured as follows. For adhesion evaluation, a bond tester (SS-30W manufactured by Seishin Shoji Co., Ltd.) was used. Each functional element was installed on the evaluation table of the bond tester, and the resistance force was measured by applying an external force from the lateral direction (see FIG. 4). The results are shown in Table 3. Each adhesion evaluation functional element (Example 7 to Example 9) obtained using the negative photosensitive resin composition (Example 1 to Example 3) exhibited excellent adhesiveness. That is, it was confirmed that by using the negative photosensitive resin composition of the present invention, a functional element exhibiting excellent adhesion with the counter substrate can be obtained.

Table 3 Measurement results of adhesion
Example 7 Example 8 Example 9
(Note) (Example 1) (Example 2) (Example 3)
Adhesive strength (MPa) 20.7 22.3 20.9

  Note: Example number of the corresponding negative photosensitive resin composition used is shown.

○ Resolution evaluation In evaluating the resolution of the structure formed on the first substrate, the first substrate is exposed through a predetermined mask, and the structures of φ10 μm, φ20 μm and φ30 μm (resolution) The first substrate for evaluation) was prepared, and the shapes of these structures were evaluated by observing them with an optical microscope.

(Process for creating the first base for resolution evaluation)
Each negative resin composition solution obtained in Examples 1 to 3 was applied onto a 60 mm square, 0.7 mm thick non-alkali glass substrate (borosilicate glass) using a spin coating method. Thereafter, prebaking was performed on a hot plate at 100 ° C. for 180 seconds. Using a predetermined pattern mask on the film thus obtained, exposure was performed under the condition of an exposure illuminance of 300 mJ at 365 nm in an air atmosphere by a direct exposure method. Then, after carrying out a development process at 25 ° C. for 40 seconds with the Kaya mirror DVL-T50D, it was washed with running water and air-dried. However, Example 3 was developed with a 2.38% aqueous solution of tetramethylammonium hydroxide (25 ° C. × 30 seconds dip development), washed with running water, and air-dried. The film thickness after curing at this time was 6.6 μm. Thus, using the negative photosensitive resin composition (Examples 1 to 3), three first substrates for evaluation of resolution (Examples 10 to 12) were obtained.

(Resolution evaluation by microscopic observation)
About the 1st base | substrate obtained above, the shape of the columnar pattern (structure) of (phi) 10micrometer, (phi) 20micrometer, and (phi) 30micrometer was observed using the optical microscope. The results are shown in Table 4. Each of the first substrates for resolution evaluation (Examples 10 to 12) obtained using the negative photosensitive resin composition (Examples 1 to 3) has a sharp cylindrical structure. Could be observed. That is, it was confirmed that by using the negative photosensitive resin composition of the present invention, a structure showing excellent pattern resolution can be obtained.

Table 4 Evaluation results of resolution
Example 10 Example 11
(Note) (Example 1) (Example 2)
φ10μm Observing a sharp cylindrical structure φ20μm Observing a sharp cylindrical structure φ30μm Observing a sharp cylindrical structure Observing a sharp cylindrical structure
Example 12
(Example 3)
φ10μm A sharp cylindrical structure is observed
φ20μm Observing a sharp cylindrical structure
φ30μm Observation of a sharp cylindrical structure

  Note: Example number of the corresponding negative photosensitive resin composition used is shown.

  As is apparent from the results of Tables 3 and 4, the negative photosensitive resin composition of the present invention is useful because it gives a structure excellent in both adhesive strength and resolution, and by using this, it is excellent in use. A functional element can be obtained.

Is a schematic diagram of the steps in the production of the functional element of the present invention, Is a schematic diagram of a liquid crystal display element to which the functional element of the present invention is applied, Is a schematic diagram of a substrate provided with an adhesive glass chip, Respectively shows the schematic of a bond tester.

Explanation of symbols

1-4, 1-11 mean the following.
DESCRIPTION OF SYMBOLS 1 1st base | substrate 2 Negative photosensitive resin composition coating layer 3 Pattern mask 4 Structure 5 2nd base | substrate 6 Sealant layer 7 Liquid crystal inlet 8 Liquid crystal 9 Glass chip 10 Scratch 11 Evaluation stand of bond tester

Claims (16)

In a functional element in which a second substrate is pressure-bonded and two substrates are bonded to each other via a patterned structure provided by photolithography on the first substrate, the structure is formed. The resin composition is (A) an acrylic monomer, (B) an alkali-soluble polymer obtained by copolymerizing an unsaturated carboxylic acid and another unsaturated compound, or a hydrogenated product of an alkali-soluble phenol resin, and (C) photopolymerization initiation. A negative photosensitive resin composition containing an agent and (D) an epoxy compound. The functional element according to claim 1, wherein the negative photosensitive resin composition further contains a solvent. The component (B) in the negative photosensitive resin composition is an alkali-soluble polymer obtained by copolymerizing methacrylic acid, methyl methacrylate and -n-butyl methacrylate. Functional elements. The functional element according to claim 3, wherein a molar blending ratio of methacrylic acid which is a constituent component of the alkali-soluble polymer obtained by copolymerization is 10 mol% to 60 mol%. The functional element according to any one of claims 1 to 4, wherein the softening point of the (D) epoxy compound in the negative photosensitive resin composition is 40 ° C to 110 ° C. (D) The epoxy compound is a polycondensate of 2,2-bis (hydroxymethyl) -1-butanol and 1,2-epoxy-4-vinylcyclohexane or an epoxy compound represented by the following formula (1): 5. The functional element according to 5.

The proportion of the (D) epoxy compound in the negative photosensitive resin composition in the total amount of (A), (B), (C) and (D) is 5% to 50% by weight. The functional element as described in any one of Claims 1 thru | or 6. (A) an acrylic monomer, (B) a hydrogenated product of an alkali-soluble polymer or an alkali-soluble phenol resin obtained by copolymerizing an unsaturated carboxylic acid and another unsaturated compound on the first substrate, (C) light 2. A structure in which a structure is provided by photolithography using a negative photosensitive resin composition containing a polymerization initiator and (D) an epoxy compound, and then a second substrate is pressure-bonded onto the structure. Method of manufacturing a functional element with integrated substrate The manufacturing method according to claim 8, wherein the functional element is a liquid crystal display element. (A) acrylic monomer, (B) hydrogenated product of alkali-soluble polymer or alkali-soluble phenol resin obtained by copolymerizing unsaturated carboxylic acid and other unsaturated compound, (C) photopolymerization initiator and (D ) A resin composition containing an epoxy compound, wherein the two substrates are bonded to each other through a patterned structure provided by photolithography on the first substrate. A negative photosensitive resin composition for forming the structure, which is used in preparing a functional element. The negative photosensitive resin composition according to claim 10, wherein the negative photosensitive resin composition further contains a solvent. The component (B) in the negative photosensitive resin composition is an alkali-soluble polymer obtained by copolymerizing methacrylic acid, methyl methacrylate and -n-butyl methacrylate. Negative photosensitive resin composition. The negative photosensitive resin composition according to claim 12, wherein a molar blending ratio of methacrylic acid which is a constituent component of the alkali-soluble polymer obtained by copolymerization is 10 mol% to 60 mol%. The negative photosensitive resin composition according to any one of claims 10 to 13, wherein a softening point of the epoxy compound (D) in the negative photosensitive resin composition is 40 ° C to 110 ° C. (D) The epoxy compound is a polycondensate of 2,2-bis (hydroxymethyl) -1-butanol and 1,2-epoxy-4-vinylcyclohexane or an epoxy compound represented by the above formula (1). The negative photosensitive resin composition of 14. The proportion of the (D) epoxy compound in the negative photosensitive resin composition in the total amount of (A), (B), (C) and (D) is 5% to 50% by weight. The negative photosensitive resin composition as described in any one of Claims 10 thru | or 15.

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