JP2007300024A - Shield structure, and attaching method of shield cover - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable to firmly attach a shield cover on a circuit board. <P>SOLUTION: A groove 4S for a shield cover reaching from the front surface to the rear surface of a circuit board 2 is formed on an end surface of the circuit board 2. An attaching claw 10 entering from the front surface side of the circuit board 2 into the groove 4S for the shield cover is provided on the shield cover 3, and a folding line 20 is formed on a position where the tip of the attaching claw 10 is inclined inward, the attaching claw 10. In a process of attaching the shield cover 3 onto the circuit board 2; the attaching claw 10 of the shield cover 3 is allowed to enter into the groove 4S for the shield cover of the circuit board 2, a pressurizing tool is inserted into the groove 4S for the shield cover from a side opposite to the entering side of the attaching claw 10, and a tip of the attaching claw 10 is pressed inward and pressed on the groove surface of the groove 4S for the shield cover to hold and fix the shield cover 3 on the circuit board 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a shield structure that shields an electric circuit formed on a circuit board by covering the surface side of the circuit board with a shield cover, and a method for attaching the shield cover.

  FIG. 3 (a) shows an example of an electronic component having a shield structure in a schematic perspective view, FIG. 3 (b) shows a schematic exploded view of the electronic component in FIG. 3 (a), FIG. 3C is a schematic cross-sectional view taken along the line AA in FIG. The electronic component shown in FIG. 3A has a circuit board 2 and a shield cover 3, and the shield structure 1 of the electronic component has the surface side of the circuit board 2 covered by the shield cover 3. The electric circuit (not shown) formed on the circuit board 2 is covered and shielded. That is, components (not shown) are mounted on the circuit board 2 and a conductor pattern or the like (not shown) is formed, and an electric circuit is configured by the components or the conductor pattern or the like. Further, a plurality of groove portions 4 reaching the back surface from the front surface of the circuit substrate 2 are formed on the end surface of the circuit substrate 2, and end surface electrodes 5 are formed on the inner wall surfaces of the respective groove portions 4. Further, connection electrodes 6 are formed on the edge of the substrate surface of the circuit board 2 so as to be electrically connected to the end surface electrodes 5 of the grooves 4 in a one-to-one correspondence.

  The shield cover 3 is composed of a conductor plate. The shield cover 3 includes a cover surface 7 that covers the surface of the circuit board 2 and a peripheral wall that extends from the peripheral end of the cover surface 7 toward the circuit board 2 side. Part 8. In the example shown in FIGS. 3A and 3B, the cover surface 7 has a rectangular shape, and side walls are formed to extend from the four rectangular sides of the cover surface 7 toward the circuit board 2, respectively. A peripheral wall portion 8 is constituted by two side wall portions. A mounting claw portion 10 is provided on each side wall portion of the peripheral wall portion 8. The arrangement position of each attachment nail | claw part 10 is a position according to the formation position of the groove part 4 each predetermined and corresponding individually. As shown in FIG. 3 (c), an inwardly convex bent portion 11 is formed on the attachment claw portion 10 at a position on the way from the tip to the base side, and is attached by the bent portion 11. The nail | claw part 10 has the form which the front-end | tip has faced the outer side. The attachment claw portion 10 is configured to individually enter the corresponding groove portion 4 from the surface side of the circuit board 2 and the bent portion 11 elastically presses the inner wall surface of the groove portion 4, and is formed at a facing position. The shield cover 3 is held on the circuit board 2 in such a manner that the circuit board 2 is sandwiched together with the mounting claws 10.

  In the example shown in FIGS. 3 (a) and 3 (b), a conductor bonding material 12 such as solder is filled in the groove 4 (4S) in which the mounting claw 10 is inserted and disposed. The end surface electrode 5 of the groove portion 4 (4S) in which the mounting claw portion 10 is disposed is connected to the ground formed on the circuit board 2, and the shield cover 3 includes the mounting claw portion 10 and the end surface electrode. 5 is connected to the ground of the circuit board 2 by the contact between the contact claw 5 and the attachment claw 10 via the conductor bonding material 12 and the end face electrode 5.

  In the example shown in FIGS. 3A and 3B, some of the grooves 4 (4S) of the plurality of grooves 4 formed on the end surface of the circuit board 2 are provided with the mounting claws as described above. It forms a shield cover groove in which the portion 10 is disposed. The end face electrode 5 formed on the inner wall surface of the remaining groove 4 (4P) is electrically connected to the electric circuit of the circuit board 2 and is formed with an external connection electrode for electrically connecting the electric circuit to the outside. The groove 4P is formed as an external connection groove.

  The shield structure 1 shown in FIG. 3A is configured as described above. An electronic component having such a shield structure 1 is, for example, as shown in the perspective view of FIG. 4A and the cross-sectional view of FIG. 4B (the cross-sectional view of the BB portion of FIG. 4A). In addition, the back surface of the circuit board 2 is arranged so as to follow the mother board M to be mounted, for example, and is joined to the mother board M via the conductor joining material 13 such as solder formed in the external connection groove portion 4P of the circuit board 2. (Implementation) can be.

  The electronic component having the shield structure 1 described above can be manufactured as follows. For example, as shown in FIG. 5, a parent substrate 14 in which an electric circuit is formed by providing components, conductor patterns, and connection electrodes 6 in each of a plurality of electronic component forming regions 15 set in advance is manufactured. On the boundary line 16 of the electronic component forming region 15 in the parent substrate 14, through holes 17 that enter both sides of the adjacent electronic component forming region 15 are formed. An electrode (end face electrode) is formed on the inner wall surface of the through-hole 17.

  Thereafter, a separately manufactured shield cover 3 is attached to each electronic component forming region 15 of the parent substrate 14. In the process of attaching the shield cover 3, each attachment claw portion 10 of the shield cover 3 is made to enter a predetermined corresponding through hole 17, and the bent portion 11 of the attachment claw portion 10 is inserted into the inner wall surface of the through hole 17. The shield cover 3 is held and fixed to the parent substrate 14 by being pressed by an elastic force.

  Thereafter, the parent substrate 14 is separated and divided for each electronic component forming region 15. In this way, an electronic component having the shield structure 1 can be manufactured.

JP 2005-228969 A

  By the way, in order to bend the attachment claw portion 10 so as to form the bent portion 11 in the attachment claw portion 10 of the shield cover 3, the attachment claw portion 10 has a certain length due to processing problems. is necessary. For this reason, the following problems occur. That is, in recent years, electronic components may be required to be thinner. If the circuit board 2 is thinned according to the requirement, it is difficult to shorten the mounting claw portion 10 according to the thinness of the circuit board 2 due to problems in bending processing. There is a possibility that a problem may occur in that the claw portion 10 is too long and the tip end side of the mounting claw portion 10 protrudes to the back side of the circuit board 2. If the mounting claw portion 10 protrudes to the back side of the circuit board 2, for example, when the electronic component is mounted on the mother board M or the like as shown in FIGS. For example, a part of the electronic component is lifted from the mother board M and the electronic component is inclined by the mounting claw portion 10 that has come out. In this case, the floating part of the electronic component cannot be bonded to the mother board M by the conductor bonding material 13, which may cause a mounting defect problem.

  Therefore, in order to prevent such a problem, for example, without attaching the bent portion 11 to the mounting claw portion 10, the mounting claw portion 10 having a length corresponding to the thinness of the circuit board 2 remains straight. Is arranged in the shield cover groove 4S, and is fixed to the end surface electrode 5 on the inner wall surface of the shield cover groove 4S only by the conductor bonding material 12. However, in that case, there is a problem that the shield cover 3 may fall from the circuit board 2 when the inverted reflow process is performed. In other words, the upside down reflow process means that the top of the mother board M is used to mount the parts on the back side of the mother board M on which the electronic parts are mounted on the front side as shown in FIG. In this process, the mother substrate M is heated in a reflow furnace in the reverse orientation. When this upside down reflow process is performed, if the mounting claw portion 10 that is straight is joined and fixed to the shield cover groove portion 4S of the circuit board 2 only by the conductor joining material 12, the reflow furnace is heated. When the conductor bonding material 12 is melted, due to the weight of the shield cover 3, the bonding state between the mounting claw portion 10 and the shield cover groove portion 4 </ b> S by the conductor bonding material 12 is canceled, and the shield cover 3 becomes the circuit board 2. The problem of falling from the side occurs.

  The present invention has been made to solve the above problems, and its purpose is to firmly attach the shield cover to the circuit board while suppressing the occurrence of problems due to the thinning of the circuit board and the upside down reflow process. It is to provide a shield structure and a method for attaching a shield cover.

In order to achieve the above object, the present invention has the following configuration as means for solving the above problems. That is, the shield structure of the present invention is
In the shield structure that shields the electrical circuit formed on the circuit board by covering the surface side of the circuit board with a shield cover,
A shield cover groove extending from the front surface to the back surface of the circuit board is extended and formed on the end surface of the circuit board.
The shield cover is provided with an attachment claw portion that enters the shield cover groove portion from the surface side of the circuit board, and the attachment claw portion includes a tip portion of the attachment claw portion as a groove surface of the shield cover groove portion. A fold line portion is formed to incline inwardly toward, and the mounting claw portion is bent at the position of the fold line portion and the tip portion is inclined inward,
The tip of the mounting claw part presses the groove surface of the shield cover groove part, and the shield cover is held and fixed to the circuit board.

Moreover, the method of attaching the shield cover of the present invention is as follows:
A method of attaching a shield cover to the circuit board having a shield structure for covering an electric circuit formed on the circuit board by covering the surface side of the circuit board with a shield cover,
The end surface of the circuit board is formed with a groove for a shield cover that extends from the front surface of the circuit board to the back surface, and the shield cover is provided with a mounting claw portion that enters the groove for the shield cover from the front surface side of the circuit board. In the mounting claw part, a broken line part is formed at a position where the tip part is inclined inward,
The shield cover mounting claw portion is allowed to enter the shield cover groove portion of the circuit board in a non-contact state with a clearance from the groove surface of the groove portion, and then from the opposite side of the mounting claw portion on the entry side. Insert the pressing tool into the shield cover groove, push the tip of the attachment claw inward, bend it inward at the fold line, and press the tip of the attachment claw against the groove surface of the shield cover groove. The shield cover is held and fixed to the circuit board.

  According to the present invention, the attachment claw portion is formed with the broken line portion for inclining the tip end portion of the attachment claw portion inward toward the groove surface of the shield cover groove portion of the circuit board. The claw portion is bent at the position of the broken line portion, the tip portion is inclined inward, and the tip portion of the mounting claw portion presses the groove surface of the shield cover groove portion, and the shield cover is held and fixed to the circuit board. It was set as the composition. In the method of attaching the shield cover according to the present invention, in order to hold and fix the shield cover to the circuit board as described above, in the step of attaching the shield cover to the circuit board, the claw part for attaching the shield cover is the groove part for the shield cover of the circuit board. Then, the pressing tool is inserted into the groove portion for the shield cover from the side opposite to the entering direction of the mounting claw portion. Then, the attachment claw is pushed inward with the pressing tool, and the tip of the attachment claw is bent inward at the position of the fold line portion previously formed on the attachment claw, so that the attachment claw The tip is pressed against the groove surface of the groove for the shield cover, and the shield cover is held and fixed to the circuit board.

  In this invention, after the claw portion for attaching the shield cover is inserted into the groove portion for the shield cover of the circuit board, the attachment claw portion is pushed and bent by the pressing tool, and the shield cover is held on the circuit board by the attachment claw portion. It is fixed. By using this technique, the shield cover can be held and fixed to the circuit board by simply and firmly pressing the tip of the attachment claw against the groove surface of the shield cover groove even if the attachment claw is shortened. .

  In other words, it is possible to shorten the mounting claw part while maintaining the holding and fixing force of the shield cover with respect to the circuit board. Thus, it is possible to cope with the thinning of the circuit board while preventing the problem that the shield cover falls from the circuit board in the upside down reflow process and the problem that the mounting claw part protrudes from the back side of the circuit board.

  Embodiments according to the present invention will be described below with reference to the drawings. In the description of the embodiment described below, the same components as those of the shield structure in FIG. 4A are denoted by the same reference numerals, and duplicate descriptions of the common portions are omitted.

  FIG. 1A is a schematic perspective view showing an electronic component having a shield structure according to this embodiment. FIG. 1B is a schematic exploded view of the electronic component shown in FIG. FIG. 1 (c) shows a schematic cross-sectional view of the α-α portion of FIG. 1 (a). In this embodiment, the attachment claw portion 10 is formed with a broken line portion 20, and the attachment claw portion 10 is bent at the position of the broken line portion 20, and the tip end portion is inclined inward, and the attachment claw The tip of the portion 10 presses the groove surface of the shield cover groove 4S. The shield cover is held and fixed to the circuit board 2 by this pressing force.

  In this embodiment, the broken line portion 20 of the attachment claw portion 10 is for inclining the distal end side of the attachment claw portion 10 inward toward the groove surface of the shield cover groove portion 4S. For example, as shown in the schematic cross-sectional view of FIG. 1D, the broken line portion 20 is configured by a notch, and is a portion where the attachment claw portion 10 is easily bent at a predetermined position. .

  The other configuration of the shield structure of this embodiment is the same as that of the shield structure of FIG. In order to obtain a unique configuration of the shield structure of this embodiment, for example, the shield cover 3 can be attached to the circuit board 2 as shown below.

  For example, as shown in FIG. 5, the shield cover 3 is arranged in each electronic component forming region 15 (circuit board 2) of the parent substrate 14 in which the circuit boards 2 (electronic component forming regions 15) are collectively formed. At this time, the broken line portion 20 is formed in advance on the attachment claw portion 10 of the shield cover 3, and the attachment claw portion 10 is not spaced from the inner wall surface of the through-hole 17 serving as the shield cover groove portion 4S. The shield cover 3 is positioned and arranged in each of the electronic component forming regions 15 of the parent substrate 14 by entering the through hole 17 in an open and non-contact state. The attachment claw portion 10 may be inserted into the through-hole 17 in a straight state in which only the broken line portion 20 is formed. Alternatively, the attachment claw portion 10 of the shield cover 3 may be inserted into the parent substrate 14. Before entering the through-hole 17, as shown in FIG. 2A, the mounting claw portion is subjected to preliminary processing in which the mounting claw portion 10 is bent inward at the position of the broken line portion 20. 10 may be inserted into the through-hole 17.

  After the attachment claw portion 10 of the shield cover 3 has entered the through-hole 17, as shown in the cross-sectional view of FIG. 2 (b), for example, like a pin from the opposite side of the attachment claw portion 10 to the entry side. A proper pressing tool 21 is inserted into the through hole 17. Then, the attachment claw 10 is pushed by the pressing tool 21, the attachment claw 10 is bent inward toward the inner wall surface of the through-hole 17 at the position of the broken line portion 20, and the tip of the attachment claw 10 is passed through the through-hole. Press against the inner wall of 17 and crimp. Thus, the shield cover 3 is held and fixed to each electronic component forming region 15 (circuit board 2) of the parent board 14 by caulking and deforming the tip side of the mounting claw part 10 in this manner. Thereafter, the main substrate 14 is separated and divided for each electronic component forming region 15 (circuit board 2), and the electronic component having the shield structure 1 peculiar to this embodiment can be cut out from the parent substrate 14.

  In addition, this invention is not limited to the form of this embodiment, Various embodiment can be taken. For example, in this embodiment, the circuit board 2 has a rectangular shape, but the shape of the circuit board 2 is not limited to a rectangular shape. Further, the cover surface 7 of the shield cover 3 has a rectangular shape, but the shape of the cover surface 7 is not limited to a rectangular shape, and for example, the shape of the circuit board 2 is a shape other than a rectangular shape. In this case, the cover surface 7 may have a shape other than the rectangular shape according to the shape of the circuit board 2.

  Further, in this embodiment example, all of the four mounting claws 10 provided on the peripheral wall portion 8 of the shield cover 3 have the unique configuration shown in this embodiment example and the groove of the shield cover groove portion 4S of the circuit board 2. The shield cover 3 is held and fixed to the circuit board 2 by pressing the surface, but only a part of the mounting claws 10 among the plurality of mounting claws 10 has the unique configuration shown in this embodiment. May be configured to press the groove surface of the shield cover groove portion 4S of the circuit board 2. For example, in this embodiment, two sets of two mounting claw portions 10 that face each other are provided, and one of the two sets of mounting claw portions 10 is the mounting claw portion 10 of this embodiment. The groove surface of the shield cover groove portion 4S of the circuit board 2 is pressed with the unique configuration shown in the example, and the groove surface of the shield cover groove portion 4S is formed in a form in which the other set of mounting claws 10 remains straight. It is good also as a structure which is not pressing.

  Furthermore, in this embodiment, one mounting claw portion 10 is provided for each side wall portion constituting the peripheral wall portion 8 of the shield cover 3, but the number and arrangement of the mounting claw portions 10 are formed. The position may be appropriately set in consideration of the size and weight of the shield cover 3 and the magnitude of the pressing force (caulking force) of the mounting claw portion 10 against the shield cover groove portion 4S of the circuit board 2. It is.

  Furthermore, in this embodiment example, not only the shield cover groove 4S but also the external connection groove 4P is formed on the end face of the circuit board 2, but the electric circuit of the circuit board 2 can be formed by other means. When it is configured to be electrically connected to the outside, the external connection groove 4P may be omitted.

  Further, the mounting claw portion 10 can be inserted into the shield cover groove portion 4S of the circuit board 2 and can be inserted into the shield cover groove portion 4S as long as the tip side is bent by a pressing tool and can press the groove surface of the shield cover groove portion 4S. The shape of 10 is not limited to the shape shown in this embodiment.

  Further, in this embodiment, the shield cover 3 is attached to each electronic component formation region 15 (circuit board 2) in the state of the parent substrate 14, but the parent substrate 14 is attached to each electronic component formation region 15 (circuit board 2). The shield cover 3 may be attached to the circuit board 2 after being separated and divided every time.

It is a figure for demonstrating the shield structure of this embodiment. It is a figure for demonstrating the process example which attaches the shield cover which comprises the shield structure of this embodiment to a circuit board. It is a figure for demonstrating one example of a conventional shield structure. It is a figure for demonstrating the mounting example of an electronic component with the shield structure of FIG. It is a figure for demonstrating the example of a manufacturing process of the electronic component with the shield structure of FIG.

Explanation of symbols

1 Shield Structure 2 Circuit Board 3 Shield Cover 4 Groove 10 Mounting Claw 20 Broken Line

Claims (2)

In the shield structure that shields the electrical circuit formed on the circuit board by covering the surface side of the circuit board with a shield cover,
A shield cover groove extending from the front surface to the back surface of the circuit board is extended and formed on the end surface of the circuit board.
The shield cover is provided with an attachment claw portion that enters the shield cover groove portion from the surface side of the circuit board, and the attachment claw portion includes a tip portion of the attachment claw portion as a groove surface of the shield cover groove portion. A fold line portion is formed to incline inwardly toward, and the mounting claw portion is bent at the position of the fold line portion and the tip portion is inclined inward,
A shield structure characterized in that the tip of the mounting claw presses the groove surface of the shield cover groove and the shield cover is held and fixed to the circuit board. A method of attaching a shield cover to the circuit board having a shield structure for covering an electric circuit formed on the circuit board by covering the surface side of the circuit board with a shield cover,
The end surface of the circuit board is formed with a groove for a shield cover that extends from the front surface of the circuit board to the back surface, and the shield cover is provided with a mounting claw portion that enters the groove for the shield cover from the front surface side of the circuit board. In the mounting claw part, a broken line part is formed at a position where the tip part is inclined inward,
The shield cover mounting claw is inserted into the shield cover groove of the circuit board in a non-contact state with a gap between the groove surface of the groove, and then from the opposite side of the mounting claw entry side. Insert the pressing tool into the shield cover groove, push the tip of the attachment claw inward, bend it inward at the fold line, and press the tip of the attachment claw against the groove surface of the shield cover groove. A method of attaching a shield cover, comprising holding and fixing the shield cover to a circuit board.

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