JP2007299920A - Electronic equipment and board unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain electronic equipment equipped with a reinforced printed circuit board. <P>SOLUTION: The electronic equipment 1 comprises: a case 4, a printed circuit board 21 having a portion 21a whose width narrows gradually while being accommodated in the case 4, and a structure 22 for wiring boards attached to the portion 21a where the width of the printed circuit board 21 narrows gradually. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic device having a printed circuit board and a board unit, and more particularly to a reinforcing structure for a printed circuit board.

  For example, an electronic device of a portable computer includes a printed circuit board in a housing. In recent years, electronic devices tend to be further reduced in size and thickness. For this reason, printed circuit boards often have shapes that are intricately cut out due to the arrangement of units in the housing and restrictions on the appearance of the equipment.

  A printed circuit board cut into such a complicated shape may have, for example, a part where the width is narrow and the mechanical strength is weakened. If the printed circuit board has a weak portion, when physical stress is applied to the printed circuit board, the wiring pattern of the portion may be disconnected or a connection failure of the mounted circuit component may occur.

For example, a printed circuit board is provided in which mechanical strength is improved by a solder layer (see, for example, Patent Document 1). In the printed circuit board described in Patent Document 1, a part or all of the solder resistance layer on the conductive pattern in a weak strength portion is removed, and a solder layer is formed on the exposed conductor pattern. The solder layer improves the strength of the printed circuit board.
JP-A-8-298357

  For example, as described in Patent Document 1, the strength of the printed circuit board can be supplemented by providing a solder layer on the printed circuit board. However, solder itself is not a material having such a high strength. For this reason, when the strength required for the printed circuit board is large, there is a possibility that the strength required by the printed circuit board cannot be achieved by the reinforcement by the solder layer.

  The objective of this invention is obtaining the electronic device and board | substrate unit provided with the reinforced printed circuit board.

  In order to achieve the above object, an electronic apparatus according to an aspect of the present invention includes a housing, a printed circuit board that is housed in the housing and has a portion with a reduced width, and the width of the printed circuit board. And a wiring board structure attached to a portion where the width of the wiring board narrows.

  In order to achieve the above object, a board unit according to one aspect of the present invention includes a printed circuit board having a portion with a reduced width, and a wiring board structure attached to the portion with the reduced width of the printed circuit board. It has.

  According to these configurations, the printed circuit board is reinforced by the wiring board structure, and the mechanical strength of the printed circuit board is improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings applied to a portable computer.
1 to 7 disclose a portable computer 1 as an electronic apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the portable computer 1 includes a main body 2 and a display unit 3.

The main body 2 includes a box-shaped housing 4. The housing 4 has an upper wall 4a, a peripheral wall 4b, and a bottom wall (not shown). The housing 4 accommodates the substrate unit 5.
The display unit 3 includes a display housing 7 and a liquid crystal display panel 8 accommodated in the display housing 7. The liquid crystal display panel 8 has a display screen 8a. The display screen 8 a is exposed to the outside of the display housing 7 through the opening 7 a on the front surface of the display housing 7.

  The display unit 3 is supported by a rear end portion of the housing 4 via a hinge device. Therefore, the display unit 3 is rotatable between a closed position where the display unit 3 is tilted so as to cover the upper wall 4a from above and an open position where the display unit 3 stands so as to expose the upper wall 4a.

  As shown in FIG. 2, the main body 2 is mounted with, for example, a substrate unit 5, a cooling fan 11, cooling fins 12, and a battery unit 13. The board unit 5 includes a printed circuit board 21 and a wiring board structure 22. The wiring board structure 22 is an example of a reinforcing member that reinforces the printed circuit board 21.

  The printed circuit board 21 has a size over the entire width of the housing 4, for example. For example, the printed circuit board 21 is cut away so as to avoid the cooling fan 11, the cooling fins 12, and the battery unit 13, and is disposed so as to avoid the units 11, 12, and 13.

  Therefore, as shown in FIG. 2, the printed circuit board 21 according to the present embodiment is narrowed, for example, between the cooling fan 11 and the battery unit 13, and the width of the board is narrower than other portions. It has a narrow portion 21a. The narrow width portion 21a is an example of a portion where the mechanical strength of the printed circuit board 21 is weaker than other portions. The cooling fan 11 or the like is an example of an element that causes the printed circuit board 21 to form the narrow portion 21a. The printed circuit board 21 has the narrow portion 21a due to, for example, restrictions on the appearance of the device or other factors. You may do it.

  As shown in FIG. 3, a first conductor layer 24 is formed on the surface of the narrow portion 21a. The first conductor layer 24 is exposed to the outside of the printed circuit board 21. An example of the first conductor layer 24 is, for example, a copper foil.

  As shown in FIG. 2, the printed circuit board 21 has a first area 25 connected to one end of the narrow portion 21a and a second area 26 connected to the other end of the narrow portion 21a. The first area 25 is located, for example, in the center of the housing 4, and is mounted with a control circuit component 27 that controls the portable computer 1, for example. An example of the control circuit component 27 is a CPU, for example. The circuit component mounted in the first area 25 is not limited to the control circuit component 27, and other circuit components may be mounted.

  On the other hand, the second area 26 is located at the peripheral edge in the housing 4 and is mounted with an external insertion / extraction component 28 such as an I / O connector. The external insertion / extraction component 28 is exposed to the outside of the housing 4 through the opening 4c of the housing 4 so that the user can freely attach and detach a cable, for example. The external insertion / extraction component 28 is an example of a component mounted on the second area 26, and may be, for example, a connector that is not exposed to the outside of the housing 4 or other circuit components.

Next, the wiring board structure 22 will be described in detail with reference to FIGS. 4 to 6.
As shown in FIGS. 4 and 5, an example of the wiring board structure 22 includes an insulating substrate 31 serving as a main body of the member, and a second conductor layer 32 formed on the lower surface of the insulating substrate 31. The second conductor layer 32 is exposed to the outside of the wiring board structure 22. The second conductor layer 32 is provided corresponding to the position and shape of the first conductor layer 24 of the printed circuit board 21. An example of the second conductor layer 32 has substantially the same outer shape as that of the first conductor layer 24.

  An example of the insulating substrate 31 is formed by impregnating a base material such as glass cloth or paper with an insulating phenol resin, epoxy resin, polyimide, BT resin, or the like. An example of the second conductor layer 32 is, for example, a copper foil. That is, the wiring board structure 22 is made of a material used for manufacturing a general printed wiring board.

  An example of the wiring board structure 22 is formed by using a scrap material discarded when the printed circuit board 21 is manufactured. That is, as shown in FIG. 6, the printed circuit board 21 is usually formed by cutting out a necessary substrate shape from a laminated board 35 which is formed in a rectangular shape and provided with a reference hole 34. For example, from the laminated board 35 shown in FIG. 6, the printed circuit board 21 according to the present embodiment and another printed circuit board 36 are cut out. The remaining portion from which the printed circuit boards 21 and 36 are cut out is a member discarded as an end material. As shown in FIG. 6, the wiring board structure 22 according to the present embodiment is further cut out from the end material.

  That is, the wiring board structure 22 according to the present embodiment is manufactured together in the process of manufacturing the printed circuit board 21. The wiring board structure 22 is formed through the same manufacturing process as the printed circuit board 21, for example, an inner layer creating process, a laminating process, a plating process, and a solder resist forming process.

  Therefore, an example of the wiring board structure 22 is formed of the same base material and the same insulating material as the insulating substrate 37 used for manufacturing the printed circuit board 21. Therefore, the wiring board structure 22 has the same or approximate thermal expansion coefficient as that of the printed circuit board 21. An example of the wiring board structure 22 has substantially the same thickness as the printed circuit board 21.

  The wiring board structure 22 is not necessarily cut out from the same laminated board as the printed circuit board 21. The wiring board structure 22 may be cut out from an end material produced when manufacturing another printed circuit board, or may be manufactured using the wiring board structure 22 as a main component. The wiring board structure 22 may have, for example, an inner layer pattern inside the insulating substrate 31.

  Solder 41 is applied to the first conductor layer 24 of the printed circuit board 21 together with pads and the like provided on the printed circuit board 21 by printing, for example. An example of the solder 41 is cream solder. As shown in FIG. 3, a wiring board structure 22 is placed on the narrow portion 21 a of the printed circuit board 21. Specifically, the second conductor layer 32 of the wiring board structure 22 is overlaid on the first conductor layer 24 on which the solder 41 is printed.

  The wiring board structure 22 is subjected to a reflow process together with other circuit components placed on the pads of the printed circuit board 21. That is, the solder 41 applied to the first conductor layer 24 is melted, and the first and second conductor layers 24 and 32 are joined to each other via the solder 41. In other words, the wiring board structure 22 is soldered to the printed circuit board 21 via the second conductor layer 32.

  Accordingly, as shown in FIG. 7, the wiring board structure 22 is fixed to the narrow portion 21 a of the printed circuit board 21. The wiring board structure 22 reinforces the mechanical strength of the narrow portion 21 a of the printed circuit board 21.

  Note that the wiring board structure 22 is not necessarily bonded in the reflow process, and may be appropriately soldered after the printed circuit board 21 is manufactured. The method of joining the wiring board structure 22 to the printed circuit board 21 is not limited to soldering, and may be, for example, a double-sided tape, an adhesive, or screwing.

Next, the operation of the portable computer 1 will be described.
For example, physical stress is applied to the narrow width portion 21a of the printed circuit board 21 at the time of device manufacture or when a cable or the like is inserted into or removed from the external insertion / extraction component 28. In addition, the portable computer 1 is often carried because of its structure, and stress is applied to the narrow width portion 21a of the printed circuit board 21 due to vibration accompanying the carrying.

  In the portable computer 1 according to this embodiment, the printed circuit board 21 is reinforced by the wiring board structure 22. That is, the mechanical strength of the narrow width portion 21a having a low strength in the printed circuit board 21 is reinforced. Therefore, even if some physical stress is applied to the printed circuit board 21, disconnection of the wiring pattern of the printed circuit board 21 and poor contact of the mounted circuit components are unlikely to occur.

  According to the portable computer 1 and the board unit 5 having such a configuration, the printed circuit board 21 is reinforced by the wiring board structure 22 and the mechanical strength of the printed circuit board 21 is improved. That is, the narrow portion 21 a of the printed circuit board 21 is reinforced by the wiring board structure 22. Since this wiring board structure 22 includes an insulating substrate 31 having, for example, a base material and an insulating member, the mechanical strength is higher than that of, for example, reinforcement by a single solder. Therefore, even if the strength required for the printed circuit board 21 is somewhat large, the strength can be sufficiently reached by the reinforcement by the wiring board structure 22.

  This is particularly effective for the printed circuit board 21 in which the control circuit component 27 is mounted in one area 25 connected to the narrow width portion 21a and the external insertion / removal component 28 is mounted in the other area 26 connected to the narrow width portion 21a. . That is, the external insertion / extraction component 28 is most susceptible to a load from the outside accompanying the insertion / extraction of the cable. When the narrow-width portion 21a connected to the area 26 where the external insertion / extraction component 28 is mounted is reinforced by the wiring board structure 22, the reliability of the board unit 5 is further improved.

  The wiring board structure 22 according to the present embodiment is manufactured from the end material produced in the printed circuit board 21 during manufacturing. That is, the wiring board structure 22 is created by effectively utilizing the members that are normally discarded. Therefore, the time and cost required to manufacture the wiring board structure 22 are hardly required. Furthermore, since the scrap material is effectively used, the amount of waste can be reduced and the burden on the environment can be reduced.

  For example, when a reinforcing member that reinforces the printed circuit board 21 is made of metal or solder, when the temperature of the board unit 5 rises, the printed circuit board 21 is affected by the difference in thermal expansion coefficient between the reinforcing member and the printed circuit board 21. Stress is added. On the other hand, the wiring board structure 22 according to the present embodiment is formed of the same material as the printed circuit board 21 and has the same or almost the same thermal expansion coefficient as the printed circuit board 21. Therefore, even if the printed circuit board 21 is thermally expanded, the wiring board structure 22 is also thermally expanded by substantially the same amount as the printed circuit board 21, so that almost no stress is applied to the printed circuit board 21. This further suppresses the disconnection of the wiring pattern of the printed circuit board 21 and the bonding failure of the mounted circuit components, and contributes to the improvement of the reliability of the board unit 5 and the portable computer 1.

  For example, when the wiring board structure 22 can be soldered to the printed circuit board 21, for example, a joining member such as a screw or a double-sided tape can be omitted. In particular, if the wiring board structure 22 can be joined to the printed circuit board 21 together with other circuit components in a reflow process, the mounting process itself of the wiring board structure 22 can be omitted. . This contributes to improvement in manufacturability of the substrate unit 5 and the portable computer 1.

  When the wiring board structure 22 is fixed to the printed circuit board 21 by, for example, screwing or adhesive, the first and second conductor layers 24 and 32 do not need to be formed, and the wiring board structure. 22 may be composed of only the insulating substrate 31. For example, as shown in FIG. 8, the wiring board structure 22 formed of, for example, an insulating substrate 31 is attached to the printed circuit board 21 with a double-sided tape 43 as an example of an adhesive. A similar reinforcing effect can be obtained by such a wiring board structure 22.

  Next, a portable computer 51 as an electronic apparatus according to a second embodiment of the present invention will be described with reference to FIGS. In addition, the structure which has the same function as the portable computer 1 which concerns on 1st Embodiment attaches | subjects the same code | symbol, and abbreviate | omits the description.

  As shown in FIG. 9, the housing 4 of the portable computer 51 accommodates the board unit 52. The board unit 52 includes a printed circuit board 53 and a wiring board structure 54. The first conductor layer 24 of the printed circuit board 53 is divided into a plurality of divided pieces 24a spaced apart from each other along the longitudinal direction thereof.

  The wiring board structure 54 is an example of a reinforcing member that reinforces the printed circuit board 53.

The wiring board structure 54 includes the insulating substrate 31 and the second conductor layer 32. An example of the wiring board structure 54 is cut out from an end material generated when the printed circuit board 53 is manufactured. As shown in FIG. 10, the second conductor layer 32 of the wiring board structure 54 is divided into a plurality of separated pieces 32a spaced apart from each other along the longitudinal direction thereof. The second conductor layer 32 is divided so as to correspond to the first conductor layer 24. The solder 41 is joined to the separated first and second conductor layers 24 and 32, respectively. That is, the solder 41 is also applied in a plurality of divided pieces 41a.

  According to the portable computer 51 and the board unit 52 having such a configuration, the printed circuit board 53 is reinforced by the wiring board structure 54, and the mechanical strength of the printed circuit board 53 is improved. That is, for the same reason as the substrate unit 5 according to the first embodiment, the strength and reliability of the printed circuit board 53 is improved by the wiring board structure 54. Further, the wiring board structure 54 is low in manufacturing cost.

  Further, when the substrate unit 52 has the configuration as in the present embodiment, the reliability of the substrate unit 52 is further improved. That is, the solder 41 and the printed circuit board 53 have different coefficients of thermal expansion. The solder 41 and the wiring board structure 54 have different coefficients of thermal expansion.

  For example, when the solder 41 is also divided into the divided pieces 41a as in the present embodiment, the amount of the solder 41 can be reduced without significantly reducing the bonding strength. Thereby, when the board unit 52 is thermally expanded, the stress applied from the solder 41 to the printed circuit board 53 can be reduced. Further, the gap between the divided pieces 24a of the plurality of first conductor layers 24 and the gap between the divided pieces 32a of the plurality of second conductor layers 32 are separated from each other by the printed circuit board 53 or the structure for a wiring board. Since it functions as a buffer portion that alleviates the difference in thermal expansion coefficient between the solder 54 and the solder 41, the reliability of the board unit 52 and the portable computer 51 is further improved.

  Next, a portable computer 61 as an electronic apparatus according to the third embodiment of the present invention will be described with reference to FIGS. In addition, the structure which has the same function as the portable computers 1 and 51 which concern on 1st and 2nd embodiment attaches | subjects the same code | symbol, and abbreviate | omits the description.

  As shown in FIG. 11, the housing 4 of the portable computer 61 accommodates the board unit 62. The board unit 62 includes a printed circuit board 53 and a wiring board structure 63. The wiring board structure 63 is an example of a reinforcing member that reinforces the printed circuit board 53. The wiring board structure 63 includes an insulating substrate 31 and a second conductor layer 32. An example of the wiring board structure 63 is cut out from an end material generated when the printed circuit board 53 is manufactured.

  As shown in FIGS. 12 and 13, the wiring board structure 63 is provided at the edge of the insulating substrate 31, extends from the upper surface of the insulating substrate 31 toward the printed circuit board 53, and reaches the printed circuit board 53. 64. For example, a plurality of grooves 64 are provided. A conductor layer 65 is formed on the inner surface of each of the plurality of grooves 64. The groove 64 and the conductor layer 65 are formed, for example, by forming a plated through hole in the laminate 35 used for manufacturing the printed circuit board 53 and cutting the through hole in the middle. That is, an example of the groove 64 and the conductor layer 65 is a plated through hole provided at the edge.

  Solder 41 is applied to the first conductor layer 24 of the printed circuit board 53. When the wiring board structure 63 is placed on the first conductor layer 24 and reflow processing is performed, the solder 41 melts and rises along the groove 64 to the inside of the wiring board structure 63 by the surface tension. To do. Thereby, the solder 41 forms a solder fillet as shown in FIG. A part of the solder 41 is joined to the second conductor layer 32 on the lower surface of the wiring board structure 63. Another part of the solder 41 is joined to the conductor layer 65 on the inner surface of the groove 64. Thereby, the solder 41 has a three-dimensional joint surface with respect to the wiring board structure 63.

  According to the portable computer 61 and the board unit 62 having such a configuration, the printed circuit board 53 is reinforced by the wiring board structure 63, and the mechanical strength of the printed circuit board 53 is improved. That is, for the same reason as the substrate unit 5 according to the first embodiment, the strength and reliability of the printed circuit board 53 is improved by the wiring board structure 63. Further, the wiring board structure 63 is low in manufacturing cost.

  Furthermore, in the board unit 62 according to this embodiment, the solder 41 is also bonded to the conductor layer 65 on the inner surface of the groove 64 of the wiring board structure 63. Thereby, the bonding area of the solder 41 to the wiring board structure 63 is increased, and the bonding strength between the two is increased. Further, when the solder 41 is three-dimensionally bonded to the wiring board structure 63, for example, the shear strength between the two becomes large.

    Next, a portable computer 71 as an electronic apparatus according to the fourth embodiment of the present invention will be described with reference to FIG. In addition, the structure which has the same function as the portable computer 1,51,61 which concerns on 1st thru | or 3rd embodiment attaches | subjects the same code | symbol, and abbreviate | omits the description.

  As shown in FIG. 14, the housing 4 of the portable computer 71 houses a board unit 72. The board unit 72 includes a printed circuit board 53 and a wiring board structure 73. The wiring board structure 73 is an example of a reinforcing member that reinforces the printed circuit board 53. The wiring board structure 73 includes an insulating substrate 31 and a second conductor layer 32. An example of the wiring board structure 73 is cut out from an end material generated when the printed circuit board 53 is manufactured.

  The wiring board structure 73 has a through hole 74 extending from the upper surface of the insulating substrate 31 toward the printed circuit board 53 and reaching the printed circuit board 53. A conductor layer 65 is formed on the inner surface of the through hole 74. That is, an example of the through hole 74 and the conductor layer 65 is a plated through hole.

  A fraction 41 a of solder 41 is applied to the fraction 24 a of the first conductor layer 24 of the printed circuit board 53. When the wiring board structure 73 is placed on the first conductor layer 24 and the reflow process is performed, the solder 41 is melted, and the surface tension extends along the through hole 74 to the inside of the wiring board structure 73. To rise. A part of the solder 41 is joined to the segment 32 a of the second conductor layer 32 formed on the lower surface of the wiring board structure 73. Another part of the solder 41 is joined to the conductor layer 65 on the inner surface of the through hole 74. Thereby, the solder 41 has a three-dimensional joint surface with respect to the wiring board structure 73.

  According to the portable computer 71 and the board unit 72 having such a configuration, the printed circuit board 53 is reinforced by the wiring board structure 73, and the mechanical strength of the printed circuit board 53 is improved. That is, for the same reason as the board unit 5 according to the first embodiment, the strength and reliability of the printed circuit board 53 is improved by the wiring board structure 73. Further, the wiring board structure 73 is low in manufacturing cost. Furthermore, for the same reason as the board unit 62 according to the third embodiment, the bonding strength between the wiring board structure 73 and the printed circuit board 53 is increased.

  Next, a portable computer 81 as an electronic apparatus according to a fifth embodiment of the invention will be described with reference to FIGS. 15 and 16. In addition, the structure which has the same function as the portable computer 1,51,61 which concerns on 1st thru | or 3rd embodiment attaches | subjects the same code | symbol, and abbreviate | omits the description.

  As shown in FIG. 15, the housing 4 of the portable computer 81 houses a board unit 82. The board unit 82 includes a printed circuit board 53 and a wiring board structure 83. The wiring board structure 83 is an example of a reinforcing member that reinforces the printed circuit board 53. The wiring board structure 83 includes an insulating substrate 31 and a second conductor layer 32. An example of the wiring board structure 83 has a segment 32a of the second conductor layer 32 on the lower surface thereof. An example of the wiring board structure 83 is cut out from an end material generated when the printed circuit board 53 is manufactured.

  As shown in FIG. 16, the wiring board structure 83 includes a wiring pattern 84 formed on the insulating substrate 31. The wiring pattern 84 is electrically connected to the conductor layer 65 formed in the groove 64 located on the left side in FIG. 16, for example. The wiring pattern 84 is electrically connected to the printed circuit board 53 through the conductor layer 65, and exchanges signals with the printed circuit board 53, for example. That is, it can be said that an example of the wiring board structure 83 is a printed wiring board.

  For example, three circuit components 85 and a connector 86 are mounted on the insulating substrate 31 of the wiring board structure 83. The circuit components 85 are electrically connected to the wiring patterns 84, respectively. The circuit component 85 is electrically connected to the electric circuit of the printed circuit board 53 via the wiring pattern 84. In other words, an example of the wiring board structure 83 is a printed circuit board.

  As shown in FIG. 15, the housing 4 accommodates, for example, another printed circuit board 87. For example, a cable 88 connected to another printed circuit board 87 is inserted into the connector 86. That is, the printed circuit board 53 is electrically connected to another printed circuit board 87 through the wiring board structure 83.

  According to the portable computer 81 and the board unit 82 having such a configuration, the printed circuit board 53 is reinforced by the wiring board structure 83, and the mechanical strength of the printed circuit board 53 is improved. That is, for the same reason as the board unit 5 according to the first embodiment, the strength and reliability of the printed circuit board 53 is improved by the wiring board structure 83. Further, the wiring board structure 83 is low in manufacturing cost.

  Furthermore, by providing the wiring pattern 84 and the circuit component 85 on the wiring board structure 83, the board area of the printed circuit board 53 can be used effectively. That is, the mounting efficiency of the printed circuit board 53 can be increased by making the surface of the wiring board structure 83 part of the mounting area of the printed circuit board 53.

  For example, the wiring pattern 84 and the circuit component 85 may be provided on the wiring board structure 73 having the through holes 74 according to the fourth embodiment. For example, the wiring board structure 83 having the groove 64 according to the present embodiment can be provided with the wiring pattern 84 and the circuit component 85 using the central portion of the insulating substrate 31. That is, according to the wiring board structure 83 in which the grooves 64 are formed, the wiring patterns 84 and the circuit components 85 can be provided at a higher density than the wiring board structure 73 in which the through holes 74 are formed.

  The method for connecting the wiring pattern 84 to the printed circuit board 53 is not limited to the method via the conductor layer 65 provided in the groove 64. For example, as indicated by a two-dot chain line in FIG. 15, a cable 88 connected to a connector 89 electrically mounted on the printed circuit board 53 may be connected to the connector 86 of the wiring board structure 83. As a result, the circuit component 85 is electrically connected to the printed circuit board 53 via the connectors 86 and 89 and the cable 88. That is, the wiring pattern 84 and the circuit component 85 can be provided even in the wiring board structure that does not have the groove 64.

  Next, a portable computer 91 as an electronic apparatus according to a sixth embodiment of the present invention will be described with reference to FIGS. In addition, the structure which has the same function as the portable computer 1,51,61,71,81 which concerns on 1st thru | or 5th Embodiment attaches | subjects the same code | symbol, and abbreviate | omits the description.

  As shown in FIG. 17, the housing 4 of the portable computer 91 accommodates a board unit 92. The board unit 92 includes a printed circuit board 93 and a wiring board structure 94. The wiring board structure 94 is an example of a reinforcing member that reinforces the printed circuit board 93. The wiring board structure 94 includes an insulating substrate 31 and a second conductor layer 32. An example of the wiring board structure 94 has a segment 32a of the second conductor layer 32 on the lower surface thereof. An example of the wiring board structure 94 is cut out from an end material generated when the printed circuit board 93 is manufactured.

  As shown in FIG. 18, on the printed circuit board 93, for example, first to fourth wirings 95a, 95b, 95c, and 95d are formed. Further, as shown in FIG. 18, the printed circuit board 93 is formed with first to fourth segment pieces 96 a, 96 b, 96 c, 96 d of the first conductor layer 24. On the other hand, as shown in FIG. 17, the wiring board structure 94 is formed with first to fourth grooves 97a, 97b, 97c, and 97d and fifth to eighth wirings 98a, 98b, 98c, and 98d. ing.

  Here, the relationship between the first wiring 95a, the first segment 96a, the first groove 97a, and the fifth wiring 98a will be described as a representative. As shown in FIG. 18, the first wiring 95a is electrically connected to the first segment 96a. As shown in FIG. 17, the conductor layer 65 of the first groove 97a is electrically connected to the first segment 96a. The fifth wiring 98a is electrically connected to the conductor layer 65 of the first groove 95a. In other words, the same signal as that of the first wiring 95a flows through the fifth wiring 98a. The fifth wiring 98a is a backup wiring for the first wiring 95a.

  According to the portable computer 91 and the board unit 92 having such a configuration, the printed circuit board 93 is reinforced by the wiring board structure 94, and the mechanical strength of the printed circuit board 93 is improved. That is, for the same reason as the board unit 5 according to the first embodiment, the strength and reliability of the printed circuit board 93 are improved by the wiring board structure 94. Further, the wiring board structure 94 is low in manufacturing cost.

  For example, the narrow portion 21 a is a weak portion in the printed circuit board 93 in strength. Therefore, although it is reinforced by the wiring board structure 94, if an excessively large external force is applied, the wirings 95a, 95b, 95c, and 95d of the narrow width portion 21a are not completely disconnected. If the wiring board structure 94 according to this embodiment is used, even if the first to fourth wirings 95a to 95d are disconnected, the fifth and eighth wirings 98a, 98b, 98c, and 98d are the first to The function of the printed circuit board 93 can be maintained by functioning instead of the fourth wirings 95a, 95b, 95c, and 95d. Thereby, the board | substrate unit 92 and the portable computer 91 which aimed at the further improvement of reliability can be obtained.

  Next, a modification of the portable computers 1, 51, 61, 71, 81, 91 according to the first to sixth embodiments will be described with reference to FIG. Each of the board units 5, 52, 62, 72, 82, and 92 of the first to sixth portable computers 1, 51, 61, 71, 81, and 91 is provided with one wiring board structure. The embodiment of the present invention is not limited to this, and as shown in FIG. 19, for example, printed circuit boards 21, 53 and 93 may be provided with wiring board structures on both sides, and a plurality of wiring boards on one side. The structural body may be attached in piles.

  The portable computers 1, 51, 61, 71, 81, 91 according to the first to sixth embodiments have been described above, but the present invention is not limited to these. The components according to the first to sixth embodiments can be applied in appropriate selective combination. The shape of the structure for a wiring board is not limited to a rectangle, and can be appropriately designed according to the mounting conditions of the equipment and the required strength.

  The location to which the wiring board structures 22, 54, 63, 73, 83, 94 are attached is not limited to the narrow width portion 21a of the printed circuit boards 21, 53, 93, but may be a location where it is desired to improve the mechanical strength. The location is not limited.

  The electronic apparatus to which the embodiment of the present invention can be applied is not limited to a portable computer, but can be widely applied to, for example, a mobile phone, a digital camera, a video camera, or a personal digital assistant.

1 is a perspective view of a portable computer according to a first embodiment of the present invention. 1 is a cross-sectional view of a portable computer according to a first embodiment. The perspective view of the board | substrate unit which concerns on 1st Embodiment. Sectional drawing which looked at the structure for wiring boards which concerns on 1st Embodiment from the side. Sectional drawing which looked at the structure for wiring boards which concerns on 1st Embodiment from the downward direction. The top view of the laminated board from which the structure for wiring boards which concerns on 1st Embodiment is cut out. Sectional drawing of the board | substrate unit which concerns on 1st Embodiment. Sectional drawing of the modification of the board | substrate unit which concerns on 1st Embodiment. Sectional drawing of the portable computer which concerns on the 2nd Embodiment of this invention. Sectional drawing of the board | substrate unit which concerns on 2nd Embodiment. Sectional drawing of the portable computer which concerns on the 3rd Embodiment of this invention. The top view of the structure for wiring boards which concerns on 3rd Embodiment. Sectional drawing of the board | substrate unit which concerns on 3rd Embodiment. Sectional drawing of the portable computer which concerns on the 4th Embodiment of this invention. Sectional drawing of the portable computer which concerns on the 5th Embodiment of this invention. The top view of the structure for wiring boards which concerns on 5th Embodiment. Sectional drawing of the portable computer which concerns on the 6th Embodiment of this invention. Sectional drawing of the portable computer which concerns on 6th Embodiment. Sectional drawing of the modification of the board | substrate unit which concerns on 1st thru | or 6th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,51,61,71,81,91 ... Portable computer, 4 ... Case, 5, 52, 62, 72, 82, 92 ... Substrate unit, 21, 53, 93 ... Printed circuit board, 21a ... Narrow part 22, 54, 63, 73, 83, 94 ... wiring board structure, 24 ... first conductor layer, 25 ... first area, 26 ... second area, 27 ... control circuit components, 28 ... external Insertion / extraction component, 31 ... insulating substrate, 32 ... second conductor layer, 41 ... solder, 64 ... groove, 65 ... conductor layer, 74 ... through hole, 84 ... wiring pattern, 85 ... circuit component, 86 ... connector.

Claims (14)

A housing,
A printed circuit board housed in the housing and having a portion with a reduced width;
A structure for a wiring board attached to a portion where the width of the printed circuit board is narrowed;
An electronic apparatus comprising: The electronic device according to claim 1,
The electronic device according to claim 1, wherein the wiring board structure is an insulating substrate. The electronic device according to claim 1,
The wiring board structure includes an insulating member and a conductor layer formed on a surface of the insulating member. The electronic device according to claim 3,
The electronic device according to claim 1, wherein the wiring board structure is joined to the printed circuit board by solder via the conductor layer. The electronic device according to claim 4,
The printed circuit board has an electronic device having another conductive layer on which a solder paste is applied and a conductive layer of the wiring board structure is overlaid on a surface of a portion whose width is narrowed. The electronic device according to claim 4,
The wiring board structure has a through hole that extends toward the printed circuit board and reaches the printed circuit board, and a conductor layer is formed on the inner surface of the through hole. An electronic apparatus characterized by being bonded to a conductor layer on an inner surface of a through hole. The electronic device according to claim 4,
The wiring board structure has a groove provided at an edge thereof and extending toward the printed circuit board and reaching the printed circuit board. A conductor layer is formed on an inner surface of the groove, and the solder An electronic device characterized in that a part is joined to a conductor layer on the inner surface of the groove. The electronic device according to claim 7,
An electronic apparatus, wherein the wiring board structure is provided with a wiring pattern electrically connected to the printed circuit board through a conductor layer on an inner surface of the groove. The electronic device according to claim 3,
The wiring board structure is provided with a connector to which a cable electrically connected to the printed circuit board is connected, and a wiring pattern electrically connected to the printed circuit board is formed. Electronic equipment. The electronic device according to claim 8 or 9,
An electronic apparatus, wherein a circuit component electrically connected to the wiring pattern is mounted on the wiring board structure. The electronic device according to claim 10,
The electronic device is characterized in that the insulating member is formed of the same base material and the same insulating material as the insulating member used for manufacturing the printed circuit board. The electronic device according to claim 11,
A control circuit component is mounted in an area connected to one end of the narrowed portion of the printed circuit board, and a connector exposed to the outside of the casing is connected to the other end of the narrowed portion. An electronic device that is mounted. A housing,
A printed circuit board housed in the housing and having a weak portion,
A structure for a wiring board attached to a portion where the strength of the printed circuit board is weak,
An electronic apparatus comprising: A printed circuit board having a narrowing portion;
A structure for a wiring board attached to a portion where the width of the printed circuit board is narrowed;
A substrate unit comprising:

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