JP2007299603A - Image display device - Google Patents

Image display device Download PDF

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JP2007299603A
JP2007299603A JP2006125908A JP2006125908A JP2007299603A JP 2007299603 A JP2007299603 A JP 2007299603A JP 2006125908 A JP2006125908 A JP 2006125908A JP 2006125908 A JP2006125908 A JP 2006125908A JP 2007299603 A JP2007299603 A JP 2007299603A
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sealing plate
organic layer
display device
recess
image display
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Hiroyuki Endo
広行 遠藤
Michio Arai
三千男 荒井
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TDK Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an image display device having a sealing plate reinforced excellently by a reinforcement member. <P>SOLUTION: The image display device 10 is provided with an organic EL panel 20. The organic EL panel 20 has a positive electrode, an organic layer, a negative electrode, a sealing plate 25, and a reinforcement member 26. The sealing plate 25 is provided with a cavity portion 25a of which the plane shape and the cross-section shape are formed in nearly square form. Furthermore, the reinforcement member 26 is formed in a rib-form and is arranged on the upper side of the sealing plate 25 so as to be opposed to the two opposed sides of the cavity portion 25a of the sealing plate 25. By this reinforcement member 26, the sealing plate 25 is reinforced excellently, thereby occurrence of cracks or the like is suppressed well. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、画像表示装置に関し、特に有機EL(electroluminescence)表示装置に関する。   The present invention relates to an image display device, and more particularly to an organic EL (electroluminescence) display device.

従来、画像表示装置、特に有機EL(electroluminescence)表示装置は、基板上に形成された陽極と、発光機能を有する有機層と、陽極と対向するように有機層上に形成された陰極とから構成され、有機層に陽極と陰極を介して電圧を印加することによって、有機層を発光させている。   2. Description of the Related Art Conventionally, an image display device, particularly an organic EL (electroluminescence) display device, includes an anode formed on a substrate, an organic layer having a light emitting function, and a cathode formed on the organic layer so as to face the anode. The organic layer is caused to emit light by applying a voltage to the organic layer via the anode and the cathode.

しかし、有機EL素子は、水分に耐性がなく、外気に露出されることで有機層が酸化する、陰極が酸化することにより発光機能を失うという問題がある。   However, the organic EL element has a problem that it is not resistant to moisture, and the organic layer is oxidized when exposed to the outside air, and the light emitting function is lost when the cathode is oxidized.

そこで、従来有機ELディスプレイでは、例えば基板と対向するように封止板(対向基板)を配置させ、封止板を基板に貼り合わせることによって外気から遮断する構成を採っている(例えば、特許文献1)。
特開2003−272834号公報
Therefore, in the conventional organic EL display, for example, a sealing plate (opposing substrate) is disposed so as to face the substrate, and the sealing plate is bonded to the substrate to be shielded from the outside air (for example, Patent Documents). 1).
JP 2003-272834 A

ところで、基板と封止板とを貼り合わせ外気から遮断する構成では、封止板が薄い場合、又は封止板内に薄い領域が存在すると、封止板に亀裂が生ずるという問題がある。封止板に亀裂が生ずると、外気からの遮断機能が低下し、有機層の酸化、陰極の酸化により発光機能が低下する問題が生ずる。   By the way, in the structure which bonds a board | substrate and a sealing plate and interrupts | blocks from external air, when a sealing plate is thin or when a thin area | region exists in a sealing plate, there exists a problem that a crack arises in a sealing plate. When a crack occurs in the sealing plate, the function of blocking from the outside air is lowered, and there is a problem that the light emitting function is lowered due to oxidation of the organic layer and oxidation of the cathode.

そこで、封止板に亀裂が生じないよう、補強部材によって良好に補強された封止板を備える画像表示装置が求められている。   Therefore, there is a demand for an image display device including a sealing plate that is well reinforced by a reinforcing member so that the sealing plate does not crack.

本発明は、上述した実情に鑑みてなされたものであって、補強部材によって良好に補強された封止板を備える画像表示装置を提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and an object thereof is to provide an image display device including a sealing plate that is favorably reinforced by a reinforcing member.

上記目的を達成するため、本発明の第1の観点にかかる画像表示装置は、
絶縁性を有する基板と、
前記基板上に形成された第1の電極と、
前記第1の電極上に形成され、発光機能を有する有機層と、
前記有機層上に形成された第2の電極と、
前記第1の電極と前記有機層と前記第2の電極とを封止するための窪部が一方の主面に形成され、該一方の主面が前記基板に対向するように前記基板上に設置された封止板と、
を備え、
前記有機層は、前記第1の電極と前記第2の電極とが対向する領域に発光領域を備え、
前記封止板の他方の主面上に、少なくとも前記有機層の前記発光領域と対向しない領域を備えるように、且つ前記封止板の前記窪部の縁の少なくとも一部と対向するように設置された補強部材を更に備えることを特徴とする。
このように、封止板の他方の主面上に補強部材を設置することにより、封止板に亀裂が生じ、有機層等が外気に曝されることを防ぐことができる。また、有機層の少なくとも発光領域と対向しない領域に補強部材が設置されるため、封止板側から発光光を取り出す場合、補強部材は発光光を遮らず、更に封止板側から発光素子にレーザリペアを施す際も補強部材はレーザを遮ることがない。更に封止板全面に補強部材を形成しないため、製造コストを抑えることができる。
In order to achieve the above object, an image display device according to a first aspect of the present invention provides:
An insulating substrate;
A first electrode formed on the substrate;
An organic layer formed on the first electrode and having a light emitting function;
A second electrode formed on the organic layer;
A recess for sealing the first electrode, the organic layer, and the second electrode is formed on one main surface, and the one main surface is formed on the substrate so as to face the substrate. An installed sealing plate;
With
The organic layer includes a light emitting region in a region where the first electrode and the second electrode face each other,
Installed on the other main surface of the sealing plate so as to have at least a region not facing the light emitting region of the organic layer and to face at least a part of the edge of the recess of the sealing plate It is further characterized by further comprising a reinforcing member.
Thus, by installing the reinforcing member on the other main surface of the sealing plate, it is possible to prevent the sealing plate from being cracked and exposing the organic layer or the like to the outside air. In addition, since the reinforcing member is installed at least in a region not facing the light emitting region of the organic layer, when the emitted light is taken out from the sealing plate side, the reinforcing member does not block the emitted light, and further from the sealing plate side to the light emitting element. Even when laser repair is performed, the reinforcing member does not block the laser. Furthermore, since the reinforcing member is not formed on the entire surface of the sealing plate, the manufacturing cost can be reduced.

前記封止板に形成された前記窪部の平面形状は略方形であり、
前記突起部は、前記封止板に形成された前記窪部の底面の縁の対向する2辺に対向するように前記封止板の他方の主面上に設置されてもよい。
このように補強部材を突起部のみから構成し、突起部を窪部の底面の縁の対向する2辺に対向するように設置することによって封止板に亀裂が生ずることを良好に防ぐことができる。
The planar shape of the recess formed in the sealing plate is substantially square,
The protrusion may be provided on the other main surface of the sealing plate so as to face two opposite sides of the bottom edge of the recess formed in the sealing plate.
In this way, it is possible to satisfactorily prevent the sealing plate from being cracked by configuring the reinforcing member only from the projecting portion and installing the projecting portion so as to face the two opposite sides of the bottom surface of the recess. it can.

前記封止板に形成された前記窪部の平面形状は略方形であり、
前記突起部は、枠状に形成され、前記封止板に形成された前記窪部の底面の縁に対向するように前記封止板の他方の主面上に設置されてもよい。
このように補強部材を突起部のみから構成し、突起部を枠状に形成し、窪部の底面の縁に対向するように設置することによって封止板に亀裂が生ずることを良好に防ぐことができる。
The planar shape of the recess formed in the sealing plate is substantially square,
The protrusion may be formed in a frame shape and installed on the other main surface of the sealing plate so as to face the edge of the bottom surface of the recess formed in the sealing plate.
In this way, the reinforcing member is composed only of the projecting portion, the projecting portion is formed in a frame shape, and the crack is formed in the sealing plate by preventing the sealing plate from being cracked by installing it so as to face the edge of the bottom surface of the recess. Can do.

前記封止板に形成された前記窪部の平面形状及び断面形状は略方形であり、
前記突起部は、前記封止板に形成された前記窪部の底面の四角それぞれに対向するように前記封止板の他方の主面上に設置されてもよい。
このように補強部材を突起部のみから構成し、突起部を前記窪部の底面の四角それぞれに対向するように設置することによって封止板に亀裂が生ずることを良好に防ぐことができる。
The planar shape and the cross-sectional shape of the recess formed in the sealing plate are substantially square,
The protrusion may be disposed on the other main surface of the sealing plate so as to face each of the squares on the bottom surface of the recess formed in the sealing plate.
Thus, by forming the reinforcing member only from the projecting portion and installing the projecting portion so as to face each of the squares of the bottom surface of the recess, it is possible to satisfactorily prevent the sealing plate from being cracked.

前記封止板に形成された窪部の底面の縁は応力の集中を緩和するように曲面に形成されてもよい。
このように窪部の底面の縁を曲面に形成することにより、さらに良好に封止板に亀裂が生ずることを防ぐことができる。
The bottom edge of the recess formed in the sealing plate may be formed in a curved surface so as to reduce stress concentration.
By forming the edge of the bottom surface of the recess in a curved surface in this manner, it is possible to prevent the sealing plate from being cracked more satisfactorily.

前記封止板に形成された前記窪部の底面の縁は、応力の集中を緩和するように階段状に形成されてもよい。
このように窪部の底面の縁を階段状に形成することにより、さらに良好に封止板に亀裂が生ずることを防ぐことができる。
An edge of the bottom surface of the recess formed in the sealing plate may be formed in a step shape so as to relieve stress concentration.
Thus, by forming the edge of the bottom face of the recess in a step shape, it is possible to prevent the sealing plate from being cracked more satisfactorily.

本発明によれば、補強部材を封止板上に形成することによって、良好な強度を有する封止板を備える画像表示装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, an image display apparatus provided with the sealing board which has favorable intensity | strength can be provided by forming a reinforcement member on a sealing board.

本発明の実施の形態に係る画像表示装置について、図を用いて説明する。本実施の形態では、画像表示装置として有機EL(electroluminescence)ディスプレイを例に挙げて説明する。   An image display apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, an organic EL (electroluminescence) display will be described as an example of the image display device.

本発明の実施の形態に係る画像表示装置10を図1〜図3に示す。図1は画像表示装置10を示す平面図である。図2(a)は陽極22及び陰極24の配置を示す図であり、図2(b)は、有機ELパネル20の一部を示す断面図である。また、図3(a)は封止板25及び補強部材26を特に示す平面図であり、図3(b)は図3(a)に示すA−A線断面図である。   An image display apparatus 10 according to an embodiment of the present invention is shown in FIGS. FIG. 1 is a plan view showing the image display device 10. FIG. 2A is a view showing the arrangement of the anode 22 and the cathode 24, and FIG. 2B is a cross-sectional view showing a part of the organic EL panel 20. 3A is a plan view specifically showing the sealing plate 25 and the reinforcing member 26, and FIG. 3B is a cross-sectional view taken along line AA shown in FIG. 3A.

画像表示装置10は、図1に示すように有機ELパネル20と、陽極引き出し配線31と、陽極用IC(Integrated Circuit)32と、陽極用TCP(テープキャリアパッケージ)33と、陰極引き出し配線34と、陰極用IC35と、陰極用TCP36と、を備える。   As shown in FIG. 1, the image display device 10 includes an organic EL panel 20, an anode lead-out wiring 31, an anode IC (Integrated Circuit) 32, an anode TCP (tape carrier package) 33, and a cathode lead-out wiring 34. The cathode IC 35 and the cathode TCP 36 are provided.

有機ELパネル20は、図1及び図2に示すように基板21と、陽極22と、有機層23と、陰極24と、封止板25と、補強部材26と、を備える。なお、本実施の形態の画像表示装置10では、有機ELパネル20の発光光は基板21側から取り出す場合を例に挙げて説明する。   As shown in FIGS. 1 and 2, the organic EL panel 20 includes a substrate 21, an anode 22, an organic layer 23, a cathode 24, a sealing plate 25, and a reinforcing member 26. In the image display device 10 of the present embodiment, the case where the light emitted from the organic EL panel 20 is extracted from the substrate 21 side will be described as an example.

基板21は、有機層23からの発光光を十分に取り出すことができるように、透光性を備える材質、例えばガラス、石英、樹脂等から構成される。また、基板21上には陽極22が形成されている。なお、陽極22と基板21との間に偏光フィルタ、R(Red)G(Green)B(Blue)のカラーフィルタ、保護膜等を形成することによって発光色の制御を行ってもよい。   The substrate 21 is made of a translucent material such as glass, quartz, resin, or the like so that the emitted light from the organic layer 23 can be sufficiently extracted. An anode 22 is formed on the substrate 21. Note that the emission color may be controlled by forming a polarizing filter, a color filter of R (Red) G (Green) B (Blue), a protective film, or the like between the anode 22 and the substrate 21.

陽極22は、導電材料から構成され、更に本実施の形態では基板21側から有機層23の発光光を取り出すため透光性を備えることが好ましい。例えば陽極22は、錫ドープ酸化インジウム(ITO)、亜鉛ドープ酸化インジウム(IZO)、SnO、ドーパントをドープしたポリピロール等の材料から形成されるのが好ましく、特にITOから形成されるのが好ましい。また、陽極22は、図2(a)に示すように線状(長尺棒状)に形成され、基板21上で互いに平行となるように複数本配置されている。また、陽極22の配線の低抵抗化のため、補助配線を形成することも可能である。また、陽極22の周囲には、陽極22のエッジを被覆する絶縁層(図示せず)が形成されている。 The anode 22 is made of a conductive material. In the present embodiment, the anode 22 preferably has a light-transmitting property in order to extract emitted light from the organic layer 23 from the substrate 21 side. For example, the anode 22 is preferably formed of a material such as tin-doped indium oxide (ITO), zinc-doped indium oxide (IZO), SnO 2 , or dopant-doped polypyrrole, and particularly preferably formed of ITO. Further, as shown in FIG. 2A, the anodes 22 are formed in a linear shape (long bar shape), and a plurality of anodes 22 are arranged on the substrate 21 so as to be parallel to each other. Also, auxiliary wiring can be formed to reduce the resistance of the wiring of the anode 22. An insulating layer (not shown) that covers the edge of the anode 22 is formed around the anode 22.

有機層23は、図2(b)に示すように陽極22上に形成され、少なくともホールおよび電子の注入機能、付加的にそれらの輸送機能、ホールと電子の再結合により励起子を生成させる発光層としての機能を有する。有機層には、少なくとも発光機能を有する化合物である蛍光性物質あるいはリン光性物質が含有されている。蛍光性物質としては、例えば、トリス(8−キノリノラト)アルミニウム(Alq)等の金属錯体色素を用いることができる。これに加え、あるいはこれに替え、キナクリドン、クマリン、ルブレン、スチリル系色素、その他テトラフェニルブタジエン、アントラセン、ペリレン、コロネン、12−フタロペリノン誘導体等を用いることもできる。 The organic layer 23 is formed on the anode 22 as shown in FIG. 2B, and emits excitons by at least a hole and electron injection function, additionally their transport function, and recombination of holes and electrons. It functions as a layer. The organic layer contains at least a fluorescent substance or a phosphorescent substance which is a compound having a light emitting function. As the fluorescent substance, for example, a metal complex dye such as tris (8-quinolinolato) aluminum (Alq 3 ) can be used. In addition to this, or in place of this, quinacridone, coumarin, rubrene, styryl dyes, tetraphenylbutadiene, anthracene, perylene, coronene, 12-phthaloperinone derivatives and the like can also be used.

なお、有機層23は、電子注入輸送層やホール注入輸送層を備えていてもよい。ホール注入輸送層は、ホール注入電極からのホールの注入を容易にする機能、ホールを安定に輸送する機能、付加的に電子の輸送を妨げる機能を有し、電子注入輸送層は、電子注入電極からの電子の注入を容易にする機能、電子を安定に輸送する機能、付加的にホールの輸送を妨げる機能を有するものであり、これらの層は、発光層へ注入されるホールや電子を増大・閉じ込めさせ、再結合領域を最適化させ、発光効率を改善する。また、有機層は、これらの発光層、電子注入輸送層、ホール注入輸送層のいずれかを兼ねたものを用いてもよく、例えば、発光層と電子注入輸送層とを兼ねたものである場合、トリス(8−キノリノラト)アルミニウム(Alq)等を使用することが好ましい。 The organic layer 23 may include an electron injection / transport layer or a hole injection / transport layer. The hole injecting and transporting layer has a function of facilitating the injection of holes from the hole injecting electrode, a function of stably transporting holes, and a function of additionally hindering the transport of electrons. Has the function of facilitating the injection of electrons, the function of stably transporting electrons, and the function of additionally hindering the transport of holes. These layers increase the number of holes and electrons injected into the light-emitting layer. • Confine, optimize recombination area, and improve luminous efficiency. Further, the organic layer may be used as one of these light emitting layer, electron injecting and transporting layer, and hole injecting and transporting layer. For example, when the organic layer serves as both the light emitting layer and the electron injecting and transporting layer , Tris (8-quinolinolato) aluminum (Alq 3 ) or the like is preferably used.

陰極24は、図2(b)に示すように有機層23上に形成される。陰極24は、例えば、Li、Na、K等のアルカリ金属、Mg、Ca、Sr、Ba等のアルカリ土類金属、La、Ce等の希土類金属、Al、In、Ag、Au、Sn、Zn、Zr等の少なくとも1種を用いて形成される。なお、基板21側からのみ光を導出する構成では、陰極24は透光性を備えるように形成される必要はないが、封止板側からも光を導出する構成では陰極24も透光性を有する必要があり、この場合、陰極24は透光性を有する材料から形成され、もしくは金属等を用いて透光性を備えるよう薄く形成される。また、陰極24は、図2(a)に示すように、線状(長尺棒状)に形成され、基板21上で陽極と直交するとともに互いに平行となるように複数本配置されている。また、陰極24は、一般に抵抗加熱蒸着法、誘導加熱蒸着法、電子ビーム蒸着法、スパッタ法あるいはイオンプレーティング法によって有機層上に形成される。なお、隣り合う陰極24の間には絶縁材料から形成された陰極分離体(図示せず)が形成される。   The cathode 24 is formed on the organic layer 23 as shown in FIG. The cathode 24 includes, for example, alkali metals such as Li, Na, and K, alkaline earth metals such as Mg, Ca, Sr, and Ba, rare earth metals such as La and Ce, Al, In, Ag, Au, Sn, Zn, It is formed using at least one kind such as Zr. In the configuration in which light is derived only from the substrate 21 side, the cathode 24 does not have to be formed to have translucency, but in the configuration in which light is also derived from the sealing plate side, the cathode 24 is also translucent. In this case, the cathode 24 is made of a light-transmitting material, or is thinly formed to have a light-transmitting property using a metal or the like. Further, as shown in FIG. 2A, the cathodes 24 are formed in a linear shape (long bar shape), and a plurality of cathodes 24 are arranged on the substrate 21 so as to be orthogonal to the anodes and parallel to each other. The cathode 24 is generally formed on the organic layer by resistance heating vapor deposition, induction heating vapor deposition, electron beam vapor deposition, sputtering, or ion plating. A cathode separator (not shown) made of an insulating material is formed between the adjacent cathodes 24.

封止板(対向基板)25は、基板21上に接着層(図示せず)を介して貼り付けられる。封止板25は、図3(a)に示すように略方形の平面形状を備える。また、封止板25は、陽極22、有機層23、陰極24を封止するため、図3(b)に示すように封止板25の中心領域に窪部25aが形成されている。窪部25aは、平面形状及び断面形状が略方形に形成される。このように封止板25は窪部25aが形成され、図3(a)及び(b)に示すように周辺領域に厚く形成され接着層を介して基板21上に貼り付けられる接着領域と、薄く形成され有機層23、陰極24等と対向する封止領域とに分けられる。封止板25は、このように厚く形成された接着領域と薄く形成された封止領域とを備えるため、接着領域と封止領域との境界、つまり窪部25aの底面の縁に相当する領域に応力が集中しやすい、特に4つの角部に応力が集中しやすい傾向にある。本実施の形態では、後述するように、封止板25の上面に補強部材26が設置されることによって、封止板25に生ずる亀裂を良好に抑制することができる。従って、陽極22、有機層23、陰極24は封止板25によって、良好に外部環境から保護される。   The sealing plate (counter substrate) 25 is attached to the substrate 21 via an adhesive layer (not shown). The sealing plate 25 has a substantially square planar shape as shown in FIG. In addition, the sealing plate 25 has a recess 25a formed in the central region of the sealing plate 25 as shown in FIG. 3B in order to seal the anode 22, the organic layer 23, and the cathode 24. The recess 25a is formed in a substantially square shape in plan and cross section. In this way, the sealing plate 25 is formed with a recess 25a, and as shown in FIGS. 3 (a) and 3 (b), an adhesive region formed thick on the peripheral region and attached onto the substrate 21 via an adhesive layer; It is divided into a sealing region which is formed thin and faces the organic layer 23, the cathode 24 and the like. Since the sealing plate 25 includes the adhesive region formed thick and the sealing region formed thin, a region corresponding to the boundary between the adhesive region and the sealing region, that is, the edge of the bottom surface of the recess 25a. The stress tends to concentrate on the four corners, in particular. In the present embodiment, as will be described later, by installing the reinforcing member 26 on the upper surface of the sealing plate 25, it is possible to satisfactorily suppress cracks generated in the sealing plate 25. Therefore, the anode 22, the organic layer 23, and the cathode 24 are well protected from the external environment by the sealing plate 25.

補強部材26は、図1及び図3(a)及び(b)に示すように、封止板25の窪部25aの対向する2辺と対向するように、封止板25の上面の2カ所に設置される。補強部材26は、平面形状及び断面形状が略方形に形成される。補強部材26は、封止板25の対向する2辺とほぼ同じ長さを備え、平行に設置される。上述したように、封止板25は、窪部25aの底面の縁近傍に応力が集中しやすいため、封止板25を介して窪部25aの底面の縁と対向するように補強部材26を配置することにより、封止板25を良好に補強することができる。このように補強部材26によって封止板25は良好に補強され、封止板25に生ずる亀裂を良好に抑制することができる。また、本実施の形態では有機層23からの発光光は基板21側から取り出す構成を例に挙げているが、画像表示装置10を形成する工程では、封止板25側からレーザリペアを施す場合があるため、補強部材26は少なくとも有機層23の発光領域と対向しない領域を備えるように設置される。なお、補強部材26の有機層23と対向しない領域は、外光からの反射を防止するために着色されてもよい。又、補強部材26の材質は特に限定はされないが、薄くても強度が大きい金属を含む部材が好ましい。補強部材26の厚みも特に限定はされないが、好ましくは0.1〜1.0mmであり、より好ましくは0.2〜0.7mmである。なぜなら補強部材26の厚みが薄いと十分な強度が得られず、厚みが厚すぎるとコストが高くなり、又パネル全体の厚みが増加するので、パネル設置スペースを確保する必要が生じてしまうためである。   As shown in FIGS. 1 and 3A and 3B, the reinforcing member 26 is provided at two locations on the upper surface of the sealing plate 25 so as to face two opposing sides of the recess 25a of the sealing plate 25. Installed. The reinforcing member 26 has a planar shape and a cross-sectional shape that are substantially square. The reinforcing member 26 has substantially the same length as the two opposing sides of the sealing plate 25 and is installed in parallel. As described above, since the sealing plate 25 tends to concentrate stress in the vicinity of the edge of the bottom surface of the recess 25a, the reinforcing member 26 is provided so as to face the edge of the bottom surface of the recess 25a via the sealing plate 25. By arrange | positioning, the sealing board 25 can be reinforced favorably. In this manner, the sealing plate 25 is reinforced favorably by the reinforcing member 26, and cracks generated in the sealing plate 25 can be well suppressed. In the present embodiment, the configuration in which the emitted light from the organic layer 23 is extracted from the substrate 21 side is taken as an example. However, in the process of forming the image display device 10, laser repair is performed from the sealing plate 25 side. Therefore, the reinforcing member 26 is installed so as to have at least a region that does not face the light emitting region of the organic layer 23. In addition, the area | region which does not oppose the organic layer 23 of the reinforcement member 26 may be colored in order to prevent reflection from external light. Further, the material of the reinforcing member 26 is not particularly limited, but a member including a metal having a high strength even though it is thin is preferable. The thickness of the reinforcing member 26 is not particularly limited, but is preferably 0.1 to 1.0 mm, and more preferably 0.2 to 0.7 mm. This is because if the thickness of the reinforcing member 26 is thin, sufficient strength cannot be obtained, and if the thickness is too thick, the cost increases and the thickness of the entire panel increases, so that it is necessary to secure a panel installation space. is there.

陽極引き出し配線31は、基板21上に形成される。また、陽極引き出し配線31は、線状(長尺棒状)に形成され、基板21上で互いに平行となるように複数本配置されている。陽極引き出し配線31の他端は陽極用TCP33の下面に接続され、陽極用IC32に電気的に接続される。   The anode lead wiring 31 is formed on the substrate 21. Further, the anode lead-out wiring 31 is formed in a linear shape (long bar shape), and a plurality of anode wirings 31 are arranged on the substrate 21 so as to be parallel to each other. The other end of the anode lead-out wiring 31 is connected to the lower surface of the anode TCP 33 and is electrically connected to the anode IC 32.

陽極用TCP33は、例えば有機材料を含んで形成された折り曲げ可能なフィルム状物からなり、図1及び図2(a)に示すように陽極22を駆動させる陽極用IC32が実装されている。陽極用IC32は、例えばTAB(Tape Automated Bonding)法によって、陽極用TCP33上に実装されている。なお、陽極用TCP33は、基板の非表示領域、つまり陽極、有機層、陰極が形成されていない領域に設置される。   The anode TCP 33 is made of, for example, a foldable film formed containing an organic material, and an anode IC 32 for driving the anode 22 is mounted as shown in FIGS. 1 and 2A. The anode IC 32 is mounted on the anode TCP 33 by, for example, a TAB (Tape Automated Bonding) method. The anode TCP 33 is installed in a non-display area of the substrate, that is, an area where the anode, the organic layer, and the cathode are not formed.

陰極引き出し配線34は、基板21上に形成される。陰極引き出し配線34は、線状(長尺棒状)に形成され、基板21上で互いに平行となるように複数本配置されている。陰極引き出し配線34の他端は、陰極用TCP36の下面に接続され、陰極用IC35に電気的に接続される。   The cathode lead wiring 34 is formed on the substrate 21. The cathode lead wires 34 are formed in a linear shape (long bar shape), and a plurality of cathode lead wires 34 are arranged on the substrate 21 so as to be parallel to each other. The other end of the cathode lead-out wiring 34 is connected to the lower surface of the cathode TCP 36 and is electrically connected to the cathode IC 35.

陰極用TCP36は、例えば有機材料を含んで形成された折り曲げ可能なフィルム状物からなる。陰極用TCP36上には、例えばTAB法によって陰極24を駆動させる陰極用IC35が実装されている。なお、陰極用TCP36も陽極用TCP33と同様に基板の非表示領域上に設置される。   The cathode TCP 36 is made of a foldable film formed, for example, containing an organic material. On the cathode TCP 36, for example, a cathode IC 35 for driving the cathode 24 by the TAB method is mounted. The cathode TCP 36 is also installed on the non-display area of the substrate in the same manner as the anode TCP 33.

上述した構成を採る画像表示装置10は、窪部25aの底面の縁と対向するように補強部材26が設置されることによって、封止板25は良好に補強され、封止板25に亀裂が生ずることを良好に抑制することができる。従って、本実施の形態によれば外気の影響を遮断し、良好な動作をする画像表示装置10を提供することができる。   In the image display device 10 adopting the above-described configuration, the sealing member 25 is reinforced favorably and the sealing plate 25 is cracked by installing the reinforcing member 26 so as to face the edge of the bottom surface of the recess 25a. It can suppress well occurring. Therefore, according to the present embodiment, it is possible to provide the image display device 10 that blocks the influence of outside air and performs a satisfactory operation.

本発明は上述した実施の形態に限られず、様々な変形及び応用が可能である。
例えば、上述した実施の形態では、補強部材26は、平面形状及び断面形状が略方形に形成され、窪部25aの底面の縁の対向する2辺と対向するように封止板25上に設置される構成を例に挙げて説明したが、これに限られない。例えば、図4(a)及び(b)に示す補強部材56のように、枠状に形成されてもよい。補強部材56は上述したように封止板25は窪部25aの底面の縁近傍に応力が集中しやすいため、補強部材56は、窪部25aの縁、つまり封止板25の接着領域と封止領域とに対向する領域に設置される。また、補強部材56は、少なくとも有機層23の発光領域と対向しない領域を備えるように設置される。
The present invention is not limited to the above-described embodiments, and various modifications and applications are possible.
For example, in the above-described embodiment, the reinforcing member 26 is formed on the sealing plate 25 so that the planar shape and the cross-sectional shape are formed in a substantially square shape and are opposed to the two opposite sides of the bottom edge of the recess 25a. However, the present invention is not limited to this. For example, the reinforcing member 56 shown in FIGS. 4A and 4B may be formed in a frame shape. As described above, the reinforcing member 56 seals the sealing plate 25 in the vicinity of the edge of the bottom surface of the recessed portion 25a. Therefore, the reinforcing member 56 seals the edge of the recessed portion 25a, that is, the adhesion region of the sealing plate 25. It is installed in the area facing the stop area. The reinforcing member 56 is installed so as to have at least a region that does not face the light emitting region of the organic layer 23.

また、窪部25aの各辺に対応するように形成される場合に限らず、図5(a)及び(b)に示すように補強部材66は、封止板25内で特に応力が集中すると考えられる窪部25aの4つの角に対応する領域に設置されてもよい。   Further, the reinforcing member 66 is not limited to being formed so as to correspond to each side of the recess 25a, and the reinforcing member 66 is particularly stressed in the sealing plate 25 as shown in FIGS. 5 (a) and 5 (b). You may install in the area | region corresponding to four corners of the recessed part 25a which can be considered.

また、上述した実施の形態では、封止板25の窪部25aは平面形状が略方形、断面形状も略方形に形成される場合を例に挙げて説明したが、これに限られない。例えば図6(a)及び(b)に示すように、窪部25bの縁を曲面に形成することも可能である。また、図7(a)及び(b)に示すように、窪部25cの縁を階段状に形成することもできる。このように窪部の縁を曲面、もしくは階段状に形成することによって、窪部の縁に生ずる応力の集中を更に緩和することができ、補強部材による封止板の補強をさらに向上させることができる。また、窪部25aの平面形状も略方形に限られず、円形、楕円形、多角形等であってもよい。   In the above-described embodiment, the case where the recess 25a of the sealing plate 25 is formed in a substantially square shape and a sectional shape in a substantially square shape has been described as an example. However, the present invention is not limited thereto. For example, as shown in FIGS. 6A and 6B, the edge of the recess 25b can be formed in a curved surface. Moreover, as shown to Fig.7 (a) and (b), the edge of the recessed part 25c can also be formed in step shape. By forming the edge of the recess in a curved surface or stepped shape in this way, the concentration of stress generated at the edge of the recess can be further reduced, and the reinforcement of the sealing plate by the reinforcing member can be further improved. it can. The planar shape of the recess 25a is not limited to a substantially square shape, and may be a circle, an ellipse, a polygon, or the like.

また、図8(a)及び(b)に示すように、補強部材76はハニカム状に形成されてもよい。ハニカム状に形成することにより、封止板25を補強するだけでなく放熱性を向上させる効果を付与することもできる。なお、補強部材76をハニカム状に形成する場合は、ハニカムの孔と有機ELパネル20の発光領域が対向するように、つまりハニカムによって有機ELパネル20からの発光光の導出が妨げられないように設置される。また、補強部材76は封止板側25側からなされるレーザリペア等の処理を妨げられないように設置される。   Further, as shown in FIGS. 8A and 8B, the reinforcing member 76 may be formed in a honeycomb shape. By forming in a honeycomb shape, not only the sealing plate 25 can be reinforced, but also the effect of improving heat dissipation can be imparted. When the reinforcing member 76 is formed in a honeycomb shape, the honeycomb holes and the light emitting area of the organic EL panel 20 face each other, that is, the honeycomb does not hinder the emission of light emitted from the organic EL panel 20. Installed. Further, the reinforcing member 76 is installed so as not to hinder processing such as laser repair performed from the sealing plate side 25 side.

また、封止板25の窪部25aの底面に乾燥剤を設置してもよい。窪部25aの底面に更に凹状の領域を設け、乾燥剤を設置する場合は、封止板25の厚みが特に薄くなることから、この領域に対向するように補強部材26を配置させるとよい。このように、封止板25の窪部25aに乾燥剤を設ける場合、適宜封止部材を設置する領域を調節する。   A desiccant may be installed on the bottom surface of the recess 25a of the sealing plate 25. When a concave region is further provided on the bottom surface of the recess 25a and the desiccant is installed, the thickness of the sealing plate 25 is particularly thin. Therefore, the reinforcing member 26 may be disposed so as to face this region. Thus, when providing a desiccant in the recessed part 25a of the sealing board 25, the area | region which installs a sealing member is adjusted suitably.

また、上述した実施の形態では、基板21側から発光光を取り出す構成を例に挙げて説明したが、これに限られず対向基板側(封止板側)から取り出す構成を採ることもできる。この場合、封止板25上に設置される補強部材26は、有機層23からの発光光の導出を妨げないよう少なくとも有機層23の発光領域とは対向しない領域を備えるように設置される。このように、有機層23の少なくとも発光領域と対向しない領域を備えるように補強部材26を配置することにより、封止板25側から発光光を取り出す場合であっても、補強部材は発光光の導出を妨げず、基板21側から発光光を取り出す場合であっても、レーザリペア等の工程の妨げにならない。   In the above-described embodiment, the configuration in which emitted light is extracted from the substrate 21 side has been described as an example. However, the configuration is not limited thereto, and a configuration in which the emitted light is extracted from the counter substrate side (sealing plate side) can also be employed. In this case, the reinforcing member 26 installed on the sealing plate 25 is installed so as to include at least a region that does not face the light emitting region of the organic layer 23 so as not to prevent the emission of the light emitted from the organic layer 23. Thus, even if it is a case where emitted light is taken out from the sealing board 25 side by arrange | positioning the reinforcement member 26 so that it may be provided with the area | region which does not oppose at least the light emission area | region of the organic layer 23, a reinforcement member is light emission light. Even when the emitted light is taken out from the substrate 21 side without preventing the lead-out, the process such as laser repair is not hindered.

また、対向基板側から発光光を取り出す場合、基板21としては不透明な材料から基板を形成することができる。例えば、アルミナ等のセラミックス、ステンレス等の金属シートに表面酸化などによって絶縁処理を施したもの、熱硬化性樹脂、熱可塑性樹脂などを用いることができる。なお、対向基板側から光を取り出す場合も、安価なガラス基板を用いると製造コストが低下して好ましい。   In the case where emitted light is extracted from the counter substrate side, the substrate 21 can be formed of an opaque material. For example, ceramics such as alumina, metal sheets such as stainless steel that have been subjected to insulation treatment by surface oxidation, thermosetting resins, thermoplastic resins, and the like can be used. Note that when light is extracted from the counter substrate side, it is preferable to use an inexpensive glass substrate because the manufacturing cost is reduced.

なお、対向基板側(陰極24側)から光を取り出す場合には、陰極24は、例えばアルカリ金属、アルカリ土類金属希土類金属等の金属、可視光に対して透過性を有する材料から形成される。金属等を用いる場合、陰極24は透光性を備えるよう、100nm以下に形成されることが好ましく、より好ましくは40nm以下に形成されると良い。又、可視光に対して透過性を有する材料としては、ITO、IZO、ZnO-Alなどの導電性を有する材料が挙げられる。又、これらの金属と透過性を有する材料を組み合わせて、陰極24を形成しても良い。   In the case where light is extracted from the counter substrate side (cathode 24 side), the cathode 24 is formed of, for example, a metal such as an alkali metal or an alkaline earth metal rare earth metal, or a material that transmits visible light. . When using a metal or the like, the cathode 24 is preferably formed to be 100 nm or less, more preferably 40 nm or less so as to have translucency. Examples of the material having transparency to visible light include conductive materials such as ITO, IZO, and ZnO—Al. Further, the cathode 24 may be formed by combining these metals and a material having permeability.

本発明の実施の形態に係る画像表示装置を模式的に示す平面図である。1 is a plan view schematically showing an image display device according to an embodiment of the present invention. (a)は本発明の実施の形態に係る画像表示装置の電極の配置を模式的に示す平面図である。(b)は画像表示装置を構成する有機ELパネルの断面図である。(A) is a top view which shows typically arrangement | positioning of the electrode of the image display apparatus which concerns on embodiment of this invention. (B) is sectional drawing of the organic electroluminescent panel which comprises an image display apparatus. (a)は図1に示す画像表示装置の封止板と補強部材とを模式的に示す平面図である。(b)は、図3(a)のA−A線断面図である。(A) is a top view which shows typically the sealing board and reinforcement member of an image display apparatus which are shown in FIG. (B) is the sectional view on the AA line of Fig.3 (a). (a)は補強部材の変形例を模式的に示す平面図である。(b)は、図4(a)のB−B線断面図である。(A) is a top view which shows typically the modification of a reinforcement member. (B) is the BB sectional drawing of Fig.4 (a). (a)は補強部材の変形例を模式的に示す平面図である。(b)は、図5(a)のC−C線断面図である。(A) is a top view which shows typically the modification of a reinforcement member. (B) is CC sectional view taken on the line of Fig.5 (a). (a)は封止板の変形例を模式的に示す平面図である。(b)は図6(a)のD−D線断面図である。(A) is a top view which shows the modification of a sealing board typically. (B) is the DD sectional view taken on the line of Fig.6 (a). (a)は封止板の変形例を模式的に示す平面図である。(b)は図7(a)のE−E線断面図である。(A) is a top view which shows the modification of a sealing board typically. (B) is the EE sectional view taken on the line of Fig.7 (a). (a)は補強部材の変形例を模式的に示す平面図である。(b)は、図8(a)のF−F線断面図である。(A) is a top view which shows typically the modification of a reinforcement member. (B) is the FF sectional view taken on the line of Fig.8 (a).

符号の説明Explanation of symbols

10 画像表示装置
20 有機ELパネル
21 基板
22 陽極
23 有機層
24 陰極
25 封止板
26 補強部材
31 陽極引き出し配線
32 陽極用IC
33 陽極用TCP
34 陰極引き出し配線
35 陰極用IC
36 陰極用TCP
DESCRIPTION OF SYMBOLS 10 Image display apparatus 20 Organic EL panel 21 Substrate 22 Anode 23 Organic layer 24 Cathode 25 Sealing plate 26 Reinforcing member 31 Anode lead-out wiring 32 IC for anode
33 Anode TCP
34 Cathode extraction wiring 35 IC for cathode
36 TCP for cathode

Claims (6)

絶縁性を有する基板と、
前記基板上に形成された第1の電極と、
前記第1の電極上に形成され、発光機能を有する有機層と、
前記有機層上に形成された第2の電極と、
前記第1の電極と前記有機層と前記第2の電極とを封止するための窪部が一方の主面に形成され、該一方の主面が前記基板に対向するように前記基板上に設置された封止板と、
を備え、
前記有機層は、前記第1の電極と前記第2の電極とが対向する領域に発光領域を備え、
前記封止板の他方の主面上に、少なくとも前記有機層の前記発光領域と対向しない領域を備えるように、且つ前記封止板の前記窪部の縁の少なくとも一部と対向するように設置された補強部材を更に備えることを特徴とする画像表示装置。
An insulating substrate;
A first electrode formed on the substrate;
An organic layer formed on the first electrode and having a light emitting function;
A second electrode formed on the organic layer;
A recess for sealing the first electrode, the organic layer, and the second electrode is formed on one main surface, and the one main surface is formed on the substrate so as to face the substrate. An installed sealing plate;
With
The organic layer includes a light emitting region in a region where the first electrode and the second electrode face each other,
Installed on the other main surface of the sealing plate so as to have at least a region not facing the light emitting region of the organic layer and to face at least a part of the edge of the recess of the sealing plate An image display device further comprising a reinforcing member.
前記封止板に形成された前記窪部の平面形状は略方形であり、
前記補強部材は、前記封止板に形成された前記窪部の底面の縁の対向する2辺に対向するように前記封止板の他方の主面上に設置されることを特徴とする請求項1に記載の画像表示装置。
The planar shape of the recess formed in the sealing plate is substantially square,
The reinforcing member is installed on the other main surface of the sealing plate so as to face two opposite sides of the edge of the bottom surface of the recess formed in the sealing plate. Item 4. The image display device according to Item 1.
前記封止板に形成された前記窪部の平面形状は略方形であり、
前記補強部材は、枠状に形成され、前記封止板に形成された前記窪部の底面の縁に対向するように前記封止板の他方の主面上に設置されることを特徴とする請求項1に記載の画像表示装置。
The planar shape of the recess formed in the sealing plate is substantially square,
The reinforcing member is formed in a frame shape, and is installed on the other main surface of the sealing plate so as to face an edge of a bottom surface of the recess formed in the sealing plate. The image display device according to claim 1.
前記封止板に形成された前記窪部の平面形状及び断面形状は略方形であり、
前記補強部材は、前記封止板に形成された前記窪部の底面の四角それぞれに対向するように前記封止板の他方の主面上に設置されることを特徴とする請求項1に記載の画像表示装置。
The planar shape and the cross-sectional shape of the recess formed in the sealing plate are substantially square,
The said reinforcement member is installed on the other main surface of the said sealing board so that each square of the bottom face of the said recessed part formed in the said sealing board may be opposed. Image display device.
前記封止板に形成された窪部の底面の縁は応力の集中を緩和するように曲面に形成されることを特徴とする請求項1乃至4のいずれか1項に記載の画像表示装置。   5. The image display device according to claim 1, wherein an edge of a bottom surface of the recess formed in the sealing plate is formed in a curved surface so as to relieve stress concentration. 前記封止板に形成された前記窪部の底面の縁は、応力の集中を緩和するように階段状に形成されることを特徴とする請求項1乃至4のいずれか1項に記載の画像表示装置。   5. The image according to claim 1, wherein an edge of a bottom surface of the recess formed in the sealing plate is formed in a step shape so as to relieve stress concentration. Display device.
JP2006125908A 2006-04-28 2006-04-28 Image display device Withdrawn JP2007299603A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8476828B2 (en) 2009-06-24 2013-07-02 Seiko Epson Corporation Electro-optical device, electronic device, and illumination apparatus including a panel having an electro-optical layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8476828B2 (en) 2009-06-24 2013-07-02 Seiko Epson Corporation Electro-optical device, electronic device, and illumination apparatus including a panel having an electro-optical layer

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