JP2007299117A - Security ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a security IC tag which can surely and easily be broken down, can be obtained inexpensively and is high in security with respect to the IC tag in which an antenna and an IC chip are mounted on a base material. <P>SOLUTION: An IC chip 41 is flip-flop mounted on an antenna substrate 30 on which a cutoff line 31 for parting base materials is formed between mounting pads 21b of a base material 11 on which an antenna 21a, mounting pad 21b and mounting pad 21b are formed, and resin-packaged by sealing resin 51 so that a security IC tag 100 can be manufactured. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a security IC tag used for an RFID tag, a non-contact type IC card, and the like, and more particularly, to a security IC tag with improved security used for a non-contact type IC tag of a radio frequency identification (RF-ID) media. .

Conventional RF-ID media having a small antenna include an RFID tag and a non-contact IC card. These perform non-contact communication with the reader / writer side using a specific frequency band.
Recent RF-ID media forming methods tend to employ an interposer method, rather than mounting an IC chip directly on an antenna.
This method uses an interposer in which an antenna and connection electrodes are formed on a base substrate, and further an IC chip is mounted.

A method for manufacturing a conventional interposer IC tag will be described.
FIGS. 10A to 10C are schematic configuration sectional views showing an example of the manufacturing process of the IC chip mounting interposer, FIG. 11A is a schematic top view showing an example of the antenna substrate, and FIG. ) Shows a schematic top view showing an example of an interposer IC tag.
The interposer IC tag 300 includes an IC chip mounting interposer 230 and an antenna substrate 250.

First, a method for manufacturing an IC chip mounting interposer will be described.
First, a base substrate 110 with a conductor layer is prepared by processing a copper-clad laminate in which a copper layer or the like is formed on a base substrate 111 to form a conductor layer 121 (see FIG. 10A).
Next, a resist layer is formed on the conductor layer 121 by a method such as laminating a dry film, and a series of patterning processes such as pattern exposure and development are performed, so that the connection electrode 121a and the mounting electrode 121b for mounting an IC chip are formed. Is formed (see FIG. 10B).

  Next, the IC chip 141 is mounted on the mounting electrode 121b by face-down bonding or the like, and the IC chip 141 is mounted on the mounting electrode 121b of the base substrate 111 processed to a predetermined size, thereby forming the connection electrode 121a. The obtained IC chip mounting interposer 230 is obtained (see FIG. 10C).

Next, a method for manufacturing the antenna substrate will be described.
The conductor layer on the base substrate 112 is subjected to patterning processing to produce an antenna substrate 250 on which the antenna portion 150 and the connection terminal 152 made of the conductor pattern 151 are formed (see FIG. 11A).

A method for manufacturing an interposer IC tag using the IC chip mounting interposer 230 and the antenna substrate 250 will be described.
First, a conductive adhesive is applied on the connection terminal 152 of the antenna substrate 250, and the connection terminal 152 of the antenna substrate 250 and the connection electrode 121a of the IC chip mounting interposer 230 are overlaid so as to be pressed. Then, the conductive adhesive is cured by heating, the IC chip mounting interposer 230 and the antenna substrate 250 are joined, and then an insulating adhesive is applied to the entire surface, whereby the interposer IC tag 300 can be obtained ( (Refer FIG.11 (b)).

  Such an interposer IC tag is used by being attached to an object a such as a product through an insulating adhesive. However, it is possible to peel off the attached IC tag integrally from the object a and attach the IC tag to the object b such as another product, so that the object b appears on the object a. There is a problem that things are done.

  As a method of dealing with such problems, when the interposer IC tag attached to the object is peeled off from the object, the IC chip mounting interposer remains attached to the object and the IC tag is destroyed. As a result, by adjusting the adhesive strength of the adhesive used to create the interposer IC tag and the adhesive to be attached to the object, the IC tag is attached to another object. Therefore, an interposer type IC tag with improved security has been proposed (see, for example, Patent Document 1).

However, the technique for destroying the IC tag by adjusting the adhesive strength of the adhesive has the following problems.
First, there is a possibility that the IC tag may be destroyed by adjusting only the adhesive strength of the adhesive. The certainty is low.
Second, it is difficult to set the adhesive strength of the adhesive to an appropriate value. Implementation is not easy.
Thirdly, in order to mix the adhesive strength of the adhesive to an appropriate one, a great amount of costs are generated and the production cost of the IC tag is raised.
JP 2003-44809 A

  The present invention has been devised in view of the above problems, and can be reliably and easily destroyed in an IC tag in which an antenna and an IC chip are mounted on a base substrate, and can be realized at low cost. An object is to provide a high security IC tag.

  In order to achieve the above object in the present invention, first, in claim 1, there is provided an IC tag in which an IC chip is mounted on a base substrate on which an antenna and at least two mounting pads are formed. The security IC tag is characterized in that a base substrate cutting line is provided on the base substrate between the pads.

  According to a second aspect of the present invention, there is provided the security IC tag according to the first aspect, wherein the mounting method of the IC chip is flip chip mounting.

  Furthermore, in claim 3, the security IC tag according to claim 1, wherein the mounting method of the IC chip is W / B (wire bond) connection.

In the security IC tag of the present invention, since the base substrate dividing cut line is provided in the base substrate between the mounting pads of the IC chip, the base substrate is always divided from the center of the IC tag / antenna so that the IC Tag can be destroyed (cannot communicate).
Moreover, the process of forming the cutting line for parting can be realized easily and inexpensively.

By using the flip chip mounting method for mounting the IC chip, the bonding strength between the IC chip and the mounting pad is limited (because it is not a very strong bonding method), so that the breakage is further facilitated.

  By using W / B bonding as the mounting of the IC chip, the bonding strength is further limited as compared with the flip chip mounting, so that the breakage becomes easier.

Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a schematic configuration schematic diagram showing an embodiment of a security IC tag according to the present invention according to claims 1 and 2.
FIG. 2 is a schematic configuration schematic diagram showing an embodiment of the security IC tag of the present invention according to claims 1 and 3.
As shown in FIG. 1, the security IC tag 100 of the present invention has a base substrate dividing cut line 31 formed between the mounting pads 21b of the base substrate 11 on which the antenna 21a, the mounting pads 21b, and the mounting pads 21b are formed. An IC chip 41 is flip-chip mounted on the antenna substrate 30 and is resin-packaged with a sealing resin 51.
Since the base substrate cutting line 31 is formed between the mounting pads 21b of the base substrate 11, the base substrate is always cut from the center of the IC tag / antenna, and the IC tag is surely destroyed (communication failure). To be in a possible state).

In the security IC tag 200 of the present invention, as shown in FIG. 2, a base substrate dividing cut line 31 is formed between the mounting pads 21b of the base substrate 11 on which the antenna 21a, the mounting pads 21b, and the mounting pads 21b are formed. The IC chip 41 is mounted on the antenna substrate 30 in a W / B (wire bond) manner and packaged with a sealing resin 52.
Since the base substrate cutting line 31 is formed between the mounting pads 21b of the base substrate 11, the base substrate is always cut from the center of the IC tag / antenna, and the IC tag is surely destroyed (communication failure). To be in a possible state).

Hereinafter, usage examples of the security IC tag will be described.
For example, as shown in FIG. 6, the security IC tag is pasted so as to straddle a stub used for an admission ticket, and the cut line on the security IC tag overlaps with the cut line on the admission ticket. It is installed as follows.
This admission ticket uses the RFID function of the security IC tag affixed to judge whether admission is possible by non-contact communication, and the admission procedure is to chop off the stubs in the same way as the conventional admission ticket. To do.

  When the stub is cut into pieces, the cut line on the tag and the cut line on the admission ticket overlap so that the tag is divided along with the stub as shown in FIG. By being destroyed, subsequent illegal reading can be prevented and security can be maintained.

  Further, for example, as shown in FIGS. 8A and 8B, the security IC tag is pasted so as to straddle the end of the lid of the packing box or the envelope, and the tear line of the security IC tag is It is installed so as to overlap the edge of the lid that must be removed when unpacking and opening.

As shown in FIGS. 9 (a) and 9 (b), these packing boxes and envelopes are always broken and broken by the tag tear lines when attempting to unpack them. Using the RFID function, it is possible to determine whether or not the package has been opened by non-contact communication.
That is, it can be determined whether or not the contents of the packaging box and the envelope are illegal.

Hereinafter, a method for producing the security IC tag of the present invention will be described.
3A, 3B, 3D, and 3F are schematic cross-sectional views showing a part of the manufacturing process of the antenna substrate, and FIGS. 3C and 3E are diagrams of the manufacturing process of the antenna substrate. It is a schematic top view which shows a part.
First, a copper-clad laminate 10 in which a conductor layer 21 is formed by laminating a copper foil or the like on a base substrate 11 made of glass epoxy, polyester resin, polyimide resin or the like is prepared (see FIGS. 3A and 3B). ).

Next, a photosensitive layer is formed by a method such as laminating a photosensitive dry film on the copper clad laminate 10, and a resist pattern is formed by performing patterning processing such as pattern exposure and development.
Further, the conductor layer 21 is etched using the resist pattern as an etching mask, and the resist pattern is peeled off to form the antenna pattern 21a and the mounting pad 21b at predetermined positions on the base substrate 11 (FIGS. 3C and 3C). d)).
3C is a schematic top view of the base substrate 11 on which the antenna pattern 21a and the mounting pad 21b are formed, and FIG. 3D is a base substrate obtained by cutting (c) along the line AA ′. 11 schematically shows cross sections.

Next, the antenna substrate 30 in which the base substrate dividing cut line 31 is formed in the substantially central portion between the mounting pads 21b of the base substrate 11 on which the antenna pattern 21a and the mounting pads 21b are formed is manufactured (FIG. 3E). And (f)).
FIG. 3E shows a schematic top view of the antenna substrate 30, and FIG. 3F shows a schematic cross section of the antenna substrate 30 taken along the line AA ′.
The base substrate cutting line 31 can be machined perforation, laser drilling, etching, or the like. Laser drilling is preferred from the processing accuracy and processing time.

Next, an IC chip is mounted on the antenna substrate 30 on which the antenna pattern 21a, the mounting pad 21b, and the base substrate cutting line 31 are formed, and a security IC tag is manufactured.
First, the mounting pad 21b of the antenna substrate 30 on which the antenna pattern 21a, the mounting pad 21b, and the base substrate dividing cut line 31 are formed and the bump formed on the IC chip 41 are connected by face-down bonding to perform flip chip mounting. (See FIG. 4 (a)).
Further, the security IC tag 100 of the present invention is obtained by resin packaging with the sealing resin 51 (see FIG. 4B).

Next, the mounting pad 21b of the antenna substrate 30 on which the antenna pattern 21a, the mounting pad 21b, and the base substrate dividing cutting line 31 are formed and the bump 42 formed on the IC chip 41 are connected to the W / B (wire Bond) connection (see FIG. 5A).
Further, the security IC tag 200 of the present invention is obtained by resin packaging with the sealing resin 52 (see FIG. 5B).

As described above, the security IC tag of the present invention is provided with the base substrate dividing cut line 31 on the base substrate between the mounting pads of the IC chip. It is divided, and the IC tag can be surely destroyed (to make it impossible to communicate).
Moreover, the process of forming the cutting line for parting can be realized easily and inexpensively.

  By using the flip chip mounting method for mounting the IC chip, the bonding strength between the IC chip and the mounting pad is limited (because it is not a very strong bonding method), so that the breakage is further facilitated.

  By using W / B bonding as the mounting of the IC chip, the bonding strength is further limited as compared with the flip chip mounting, so that the breakage becomes easier.

It is a schematic structure schematic diagram showing one embodiment of the security IC tag of the present invention. It is a schematic structure schematic diagram which shows the other Example of the security IC tag of this invention. (A), (b), (d) and (f) are typical structure sectional views showing a part of manufacturing process of an antenna substrate. (C) And (e) is a schematic top view which shows a part of manufacturing process of an antenna board | substrate. (A) And (b) is typical structure sectional drawing which shows an example of the process of producing a security IC tag by flip-chip mounting an IC chip on an antenna substrate. (A) And (b) is typical structure sectional drawing which shows an example of the process which manufactures a security IC tag by mounting an IC chip on an antenna substrate W / B (wire bond). It is a model perspective view which shows one Example of the admission ticket which provided the security IC tag of this invention. It is a model perspective view which shows the state of the half ticket which cut the entrance ticket provided with the security IC tag of this invention, and the security IC tag was cut off from the tear line. (A) is a model perspective view which shows one Example of the packaging box which provided the security IC tag of this invention. (B) is a schematic perspective view which shows one Example of the envelope which provided the security IC tag of this invention. (A) is a model perspective view which shows the state of the packaging box which unpacked the cover of the packaging box which provided the security IC tag of this invention, and the security IC tag was parted from the tear line. (B) is a model perspective view which shows the state of the envelope which opened the envelope which provided the security IC tag of this invention, and the security IC tag was parted from the tear line. (A)-(c) is typical structure sectional drawing which shows an example of the production process of IC chip interposer. (A) is a schematic plan schematic diagram which shows the structural example of an antenna board | substrate. (B) is a schematic plan view showing an example of an IC tag produced by mounting an IC chip interposer on an antenna substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Copper-clad laminate 11, 12, 111, 112 ... Base base material 21, 121 ... Conductor layer 21a ... Antenna 21b ... Mounting pad 30 ... Antenna substrate 31 ... Base base material cutting line 41 141 IC chip 51 Sealing resin 100 200 Security IC tag 110 Base layer with conductor layer 121a Connection electrode 121b Mounting electrode 150 Antenna portion 151 Conductor pattern 152 …… Connection terminal 230 …… IC chip mounting interposer 250 …… Antenna substrate 300 …… Interposer IC tag

Claims (3)

  An IC tag in which an IC chip is mounted on a base substrate on which an antenna and at least two mounting pads are formed, characterized in that a base substrate cutting line is provided on the base substrate between the mounting pads. Security IC tag to do.   The security IC tag according to claim 1, wherein the IC chip mounting method is flip chip mounting.   The security IC tag according to claim 1, wherein the mounting method of the IC chip is W / B (wire bond) connection.

Images