JP2007294784A - Lead-wire holding hole, and working method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead-wire holding hole whereby the stress applied to a lead wire is so reduced as to prevent its disconnection when mounting it on a substrate. <P>SOLUTION: In a working method of the lead-wire holding hole, a circular hole for inserting a lead wire thereinto is provided near the lateral side of the substrate, and a skirt-form opening portion is formed in the edge portion of the lateral side of the substrate in overlapping with the circular hole. The lead-wire holding hole is made to have a narrowed segment in this overlapping portion to hold the lead wire in a sandwiching way, and moreover, the lead-wire holding hole is constituted to insert the lead wire into the circular hole from the opening portion. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a lead wire holding hole when soldering a lead wire to a printed circuit board and a method of processing the holding hole.

Conventionally, as a means of mounting lead wires on a printed circuit board, a round hole is formed in the substrate, the lead wire is inserted in a vertical shape and soldered from the back side, or the lead wire is placed on the surface of the substrate, and this position Various mounting means are employed such as a method of soldering with, and further forming a round hole in the substrate and inserting a lead wire from the back side of the round hole to solder the surface of the substrate.
JP 2003-115676 A Japanese Utility Model Publication No. 7-3179

  In such a lead wire mounting method, since the solder portion and the lead wire are integrated, the stress applied to the lead wire is concentrated on the joint portion, so that the wire tends to be disconnected. Further, when mounting the lead wire by inserting the lead wire into the round hole and bending the lead wire, stress is applied to the lead wire itself and there is a risk of disconnection at this portion.

  In view of this point, the inventor has arrived at the present invention as a result of repeating various trial manufactures on the shape of the holding hole of the lead wire to the substrate and the operation procedure of the lead wire thereby, and the present invention is shown in FIG. By making the shape of the lead wire holding hole as shown, the stress applied to the lead wire is reduced, and by making the shape of the holding hole special, the operation procedure of the lead wire is also made easy without burden Is.

  The holding hole of the present invention has a lead wire by providing a round hole (1) for inserting a lead wire, a hook-shaped opening (2) for inserting the lead wire, and a constricted portion (3) for sandwiching and closing the lead wire R. In addition to ensuring the retention of R, it succeeded in reducing the disconnection of the lead wire R after mounting by reducing the stress applied to the lead wire.

  The present invention is capable of reliably holding a lead wire without applying excessive stress to the lead wire during mounting, is easy in soldering operation, and can be processed even when forming a holding hole. Can be a simple process, so that it has an excellent effect of being safer and more secure than the conventional substrate formation.

As shown in FIG. 1, the lead wire holding hole provided in the substrate of the present invention is a holding hole through which the lead wire R passes, and the lead wire R insertion port (2) opened in a bowl shape with a round hole (1). And a narrowed portion (3) formed thereby.
For this reason, the round hole (1) is referred to as the head (1) in the embodiment, the narrow portion (3) is referred to as the neck (3) throughout the text, and the divergent bowl-shaped opening is simply the opening (2). And

  The holding hole has such a shape, and the lead wire R is placed on the holding hole of the substrate as shown in FIG. 2, and the tip of the lead wire with the core is soldered B. Then, the lead wire R is inserted from the opening (2) side, press-fitted into the neck (3) portion, and the lead wire R is placed in the head (1) portion to complete the mounting. In this way, the circuit board is completed without bending the lead wire R for mounting on the board.

Therefore, as described in claim 4, with reference to FIG. 4, the shape and size of the holding hole is when the width of the neck (3) is A and the width of the opening (2) into which the lead wire is inserted is B. ,
Lead wire core diameter <A <Lead wire sheath diameter Lead wire sheath diameter <B
By doing so, the lead wire R can be easily inserted into the opening (2) with respect to the substrate, is in close contact with the head (1) of the holding hole, and is clamped and fixed by the neck (3).

(Example 1) This example is an example of claims 1, 2 and 4, and the lead wire holding hole of the present invention inserts the lead wire R into the substrate A as shown in FIG. The head (1) is formed from a bowl-shaped opening (2) into which the lead wire R is inserted, and a neck (3) that forms a constricted portion in between.

  In forming this holding hole, referring to FIG. 1, a lead wire insertion head (1) is formed by drilling, and this head (1) is a gold having an angled blade from the substrate A end side. The neck portion (3) is formed by punching the top portion of the chevron blade with a die punch so as to come into contact with the head (1) formed by drilling to form a collar-shaped opening (2).

  As described above, the lead wire holding hole of the present invention can prevent damage to the blade at the top of the chevron of the punch die by two steps of drilling and punching, and is suitable for mounting the lead wire R on the substrate A. It is mounted as shown in the procedure of Fig. 2a, b, and c. B is a solder land. The upper stage a in the figure shows a plan view of each, and the lower stage b shows a cross-sectional view of each XX. Fig. 2A is a diagram showing a state where the lead wire R is not yet attached to the substrate A, and Fig. 2B is a diagram showing an unprocessed state of the lead wire R which is centered at the tip of the lead wire R and soldered B. The figure is shown. C. The lead wire R is inserted from the opening (2), pushed into the neck (3), and fitted into the head (1). As shown in the drawing, the lead wire holding hole of the present invention is shown. When the lead wire R is mounted on the substrate A by using the lead wire, the lead wire can be mounted in such a manner that the lead wire is not forcibly bent or bent and is not stressed.

Example 2 This example corresponds to claim 3 and is an example in which a lead wire is mounted inside the substrate A. The formation of the lead wire holding hole will be described in order. Referring to FIG. 5A, a round hole (1) for inserting a lead wire is formed at a proper position on the substrate A by a drill. A large hole D for inserting a lead wire is formed near the round hole (1). In forming the large hole D, as shown in the drawing, a die punch having a chevron blade on the side surface of the punch is polymerized so that the top of the chevron blade of the punch is in contact with the round hole, and punching is performed. A hole for holding the lead wire R is formed inside the substrate A by forming a bowl-shaped opening in the round hole for inserting the lead wire. Therefore, the lead wire holding hole is formed with a head (1), a neck (3), and a bowl-shaped opening (2). (Equivalent to Figure C)

5 is a plan view in which the tip of the lead wire R is soldered B and the lead wire R is mounted in the holding hole, and the same figure is a sectional view taken along the line XX. Referring to FIGS. 5D and 5E, the mounting of the lead wire R will be described. The tip of the lead wire R is peeled from the lower side of the large hole D and the tip of the lead wire R is soldered. Is pushed into the neck (3) through the opening (2) and placed in the head (1) to complete as shown in the figure.

(Example 3) This example relates to claim 4, and the size and shape of the lead wire holding hole is that of a constricted portion formed by a round hole (1) and a die punch having a chevron shape with reference to FIG. When the width A and the width of the lead wire insertion opening formed at the end of the board are B, the lead wire core diameter <A <the lead wire sheath diameter, and the lead wire sheath diameter <B
By doing so, the lead wire R can be smoothly inserted from the opening (2), and can be stored in the round hole (1) which becomes the head while being pushed firmly into the narrowed portion (3) which becomes the neck. Therefore, the lead wire R can be reliably held without excessive resistance from the outside.

(Example 4) This example relates to claim 5 showing a method of processing a holding hole using two lead wires R and mounting a lead wire on a substrate, and refer to FIGS. 3 and 4. FIG.
Referring to FIG. 3, a double-headed holding hole will be described. Two round holes for inserting lead wires are provided adjacent to the side of the substrate A by drilling. Then, the top of the angled blades of the two round holes (1), (1) is formed by a die punch having an angled blade from the substrate end of the two adjacent circular holes (1), (1). A punched opening (2) is formed by punching so as to hit the joined portion. In this case, as shown in the drawing, a narrowed portion (neck) is formed at a portion where the angled blade and the two round holes are in contact with each other, so that two twin heads (1), a neck (3), and a bowl-shaped opening (2 ) To complete the lead wire holding hole.

  The composite lead wire mounting using the holding holes having the two double heads (1) will be described with reference to FIG. FIG. 4B is a plan view in which the composite lead wire holding hole provided with the double heads (1) and (1) is provided in the substrate A, and the solder land is shown on the double head. B shows a plan view of the composite lead wire R centered, soldered B, and placed on the substrate A. C shows one lead wire R inserted into one of the two head holes, and the neck Through (3), the opening (2) is extended downward, and the other lead wire R is similarly extended from the opening (2) through the neck (3) to complete the mounting.

(Example 5) This example is an example of mounting the multi-axis cable shown in claim 6 on the board A, and FIG. The lead wire R is exposed by peeling the outer shell (11) on the tip side of the lead wire R, and the core wire (12) is exposed by peeling the skin of each lead wire R.
In the embodiment, the holding hole of the lead wire R is formed on the substrate A of the multiaxial cable in which such a large number of lead wires R are bundled.
In the figure, first, a large number of circular holes (1) for inserting lead wires are opened in an annular shape with respect to the substrate A by drilling. A large hole (15) for inserting the multi-axis cable (10) is opened at the center of the group of round holes (1), and punching is used for the opening. The blade used for punching is a circular blade, and a large number of chevron blades are provided on the circular peripheral surface, and the top of the chevron blade is in contact with each of the annular round holes (1) and polymerized. To cut.

  The multi-axis cable (10) holding hole formed thereby is shown in the plan view of FIG. According to this plan view, a multi-axis cable (10) is inserted into the central large hole, and this multi-axis cable (10) has a large number of lead wires R shown in FIG. Are separated radially and directed to each holding hole one by one. B is a solder land, which is fixed by soldering the tip of each lead wire R, inserted through the opening (2), press-fitted into the neck (3) of the constriction, and inserted into the head (1). Be paid.

  As described above, the holding hole for the substrate A of the lead wire according to the present invention is a two-step operation of drilling and punching, and the processing step is two steps, but the holding of the lead wire is easy and impossible. Since it is easy to mount because it is not bent or inserted into a hole, it is possible to use it for a long period of time with fewer accidents of disconnection during use of electrical equipment.

  In the lead wire holding hole of the present invention, even when some device is attached to the other end of the lead wire R in mounting, it is not a step of inserting the lead wire R into the hole in soldering, Since it is inserted from the opening (2), there is also an advantage that mounting is possible without any obstacles.

Basic lead wire holding hole and molding drawing Illustration of mounting procedure on board Process drawing of double-headed holding hole Illustration of holding hole shape Another example of lead wire holding hole Mounting explanation of multiple lead wires Example of lead wire holding hole of multi-axis cable

Explanation of symbols

1 round hole (head)
2 Stenosis (neck)
3 Hook-shaped opening 10 Multi-axis cable 11 Multi-axis cable sheath 12 Core wire A Printed circuit board B Soldering

Claims (6)

  It is characterized in that a round hole for lead wire insertion is provided near the side of the board, and the round hole is overlapped with the round hole on the board side edge of the round hole to provide a bowl-shaped opening to form a lead wire insertion port. Lead wire holding hole.   A round hole for inserting a lead wire is formed near the side of the substrate by drilling, and punched from the end of the substrate so that the top of the angled blade is in contact with the circular hole and overlaps with a die punch having an angled blade A method for processing a lead wire holding hole, characterized in that a bowl-shaped opening is formed by processing.   A round hole for inserting a lead wire is formed in the substrate by drilling, and a large hole D is formed near the round hole. The large hole D is formed by punching and forming a mold punch having a chevron blade on the side so that the top of the chevron punch is in contact with the round hole, and forming a bowl-shaped opening in the round hole. A method for processing a lead wire holding hole. The size and shape of the lead wire holding hole is as follows. When the width of the neck portion of the holding hole formed by the die punch having a round hole and an angled blade is A, and the width of the lead wire insertion opening formed at the substrate end is B,
Lead wire core diameter <A <lead wire outer sheath diameter and lead wire outer sheath diameter <B
Lead wire holding hole characterized by   Two round holes for inserting lead wires are provided adjacent to each other on the side of the substrate by drilling, and the top of the chevron blade is formed by a die punch having a chevron blade from the substrate end of the two round holes. A method for processing a holding hole for a composite lead wire, wherein a punched opening is formed so as to hit a joint of two round holes to form a bowl-shaped opening. A large number of round holes for lead wire insertion are formed in the inside of the board in an annular shape, and a circular hole for inserting a multi-axis cable is provided at the center of the numerous circular holes provided in the annular shape. The punch of the angled blade is punched by a die punch provided with a blade and polymerized in contact with the circular hole provided in the ring shape to form a bowl-shaped opening in each round hole, and the core wire of the multiaxial cable A method of processing a lead wire holding hole of a multi-axis cable, wherein each lead wire forming the wire is inserted and held.

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