JP2007294555A - Adhesive film and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive film which can prevent damages, etc. on a semiconductor component when manufacturing a semiconductor package, etc., and to provide a semiconductor device using the same. <P>SOLUTION: The adhesive tape is used to join the semiconductor component and a substrate, and consists of a resin composition containing thermosetting resin. The adhesive film has an elastic modulus of 30 MPa or above at 175&deg;C after curing. The semiconductor device uses the adhesive tape to join the semiconductor component and the substrate. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to an adhesive film and a semiconductor device.

  Along with the downsizing and thinning of electronic devices, semiconductor packages mounted on a substrate at a high density are used as semiconductor elements used for these devices. Usually, such a semiconductor package is obtained through a bonding process using an adhesive film between a semiconductor element and a substrate, a wire bonding process between the semiconductor element and the substrate, and a sealing process for sealing the semiconductor element with a sealing resin. (For example, refer to Patent Document 1).

  Here, the adhesive film used is required to have a function of bonding a semiconductor element and a substrate, a function of embedding unevenness of the substrate, and the like. In the conventional adhesive film, the adhesive film softens and embeds the irregularities of the substrate by heating in the step of sealing the sealing resin.

  However, when the conventional adhesive film is used, the filler contained in the sealing resin in the sealing process damages the semiconductor element, or when the semiconductor element is formed in multiple stages, the filler is not present between the semiconductor elements. There was a case of being caught.

JP 2003-60127 A

An object of the present invention is to provide an adhesive film capable of preventing damage to a semiconductor component or the like when manufacturing a semiconductor package or the like.
Another object of the present invention is to provide a semiconductor device using the adhesive film described above.

Such an object is achieved by the present invention described in the following (1) to (9).
(1) An adhesive film that is used when a semiconductor component and a substrate or a semiconductor component and a semiconductor component are bonded, and is composed of a resin composition containing a thermosetting resin, and is 175 after the adhesive film is cured. An adhesive film having an elastic modulus at 30 ° C. of 30 MPa or more.
(2) The adhesive film according to (1), wherein the content of the thermosetting resin is 30 to 60% by weight of the entire resin composition.
(3) The adhesive film according to (1) or (2), wherein the thermosetting resin contains an epoxy resin.
(4) The adhesive film according to any one of (1) to (3), wherein the resin composition further includes a curing agent.
(5) The adhesive film according to any one of (1) to (4), wherein the resin composition further contains a curing catalyst.
(6) The adhesive film according to (5), wherein the curing catalyst includes an imidazole compound.
(7) The adhesive film according to (5) or (6), wherein the melting catalyst has a melting point of 150 ° C. or higher.
(8) The adhesive film according to any one of (1) to (7), wherein the adhesive film after heat treatment at 120 ° C. for 1 hour has an elastic modulus at 175 ° C. of 5.0 MPa or more.
(9) A semiconductor device, wherein the semiconductor component and the substrate are bonded using the adhesive film according to any one of (1) to (8).

  ADVANTAGE OF THE INVENTION According to this invention, when manufacturing a semiconductor package etc., the adhesive film which can prevent damage etc. of a semiconductor component can be obtained.

Hereinafter, the adhesive film and the semiconductor device of the present invention will be described in detail.
The adhesive film of the present invention is an adhesive film that is used when bonding a semiconductor component and a substrate or a semiconductor component and a semiconductor component, and is composed of a resin composition containing a thermosetting resin, and curing the adhesive film After that, the elastic modulus at 175 ° C. is 30 MPa or more.
Moreover, the semiconductor device of this invention has joined the said semiconductor component and the board | substrate using the adhesive film as described above, The semiconductor device characterized by the above-mentioned.

First, the adhesive film will be described.
As illustrated in FIG. 1, the adhesive film 1 is used when joining the substrate 2 and the semiconductor component 3.
The adhesive film 1 is comprised with the resin composition containing a thermosetting resin. Thereby, it is excellent in adhesiveness and heat resistance after hardening.
Examples of the thermosetting resins include phenol novolac resins, cresol novolac resins, novolac type phenol resins such as bisphenol A novolac resins, phenol resins such as resol phenol resins, bisphenol type epoxies such as bisphenol A epoxy resins and bisphenol F epoxy resins. Resin, novolak epoxy resin, cresol novolak epoxy resin, etc., novolak epoxy resin, biphenyl type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, alkyl-modified triphenolmethane type epoxy resin, triazine nucleus-containing epoxy resin, di Epoxy resins such as cyclopentadiene-modified phenolic epoxy resins, resins with triazine rings such as urea (urea) resins and melamine resins, unsaturated Riesuteru resins, bismaleimide resins, polyurethane resins, diallyl phthalate resins, silicone resins, resins having a benzoxazine ring, cyanate ester resins, and the like. These may be used singly or in admixture. Among these, an epoxy resin is preferable. Thereby, heat resistance and adhesiveness can be improved more.

  The epoxy resin is not particularly limited, but a crystalline epoxy resin is preferable. Examples of such crystalline epoxy resins include those having a rigid structure such as a biphenyl skeleton, a bisphenol skeleton, and a stilbene skeleton in the main chain and having a relatively low molecular weight. The reason why the crystalline epoxy resin is preferable is that it is a solid that is crystallized at room temperature, but rapidly melts into a low-viscosity liquid in a temperature range above the melting point. Thereby, the initial adhesion at the time of joining the semiconductor component and the substrate can be further improved.

Although melting | fusing point of the said crystalline epoxy resin is not specifically limited, 50-150 degreeC is preferable and especially 60-140 degreeC is preferable. When the melting point is within the above range, particularly low-temperature adhesion can be improved.
The melting point can be evaluated by using, for example, a differential scanning calorimeter at the apex temperature of the endothermic peak of crystal melting that is heated from room temperature at a heating rate of 5 ° C./min.

  Although content of the said thermosetting resin is not specifically limited, 30 to 60 weight% of the whole said resin composition is preferable, and 40 to 50 weight% is especially preferable. If the content is less than the lower limit, the effect of improving the elastic modulus of the adhesive film 1 after curing may be reduced, and if the content exceeds the upper limit, the effect of improving the film forming ability may be reduced. Furthermore, when the content is within the above range, the initial embedding property between the substrate 2 and the semiconductor element 3 (initial embedding property with respect to the unevenness of the substrate) can be further improved.

It is preferable that the resin composition further contains a curing agent (in particular, when the thermosetting resin is an epoxy resin, a phenolic curing agent).
Examples of the curing agent include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylylenediamine (MXDA), diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA), and diaminodiphenylsulfone. (DDS) and other aromatic polyamines, dicyandiamide (DICY), amine-based curing agents such as polyamine compounds containing organic acid dihydrazide, etc., hexahydrophthalic anhydride (HHPA), alicyclics such as methyltetrahydrophthalic anhydride (MTHPA) Acid anhydride curing agents such as acid anhydride (liquid acid anhydride), trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), benzophenone tetracarboxylic acid (BTDA), etc., phenol Phenol such as resin System curing agents. Among these, a phenolic curing agent is preferable, and specifically, bis (4-hydroxy-3,5-dimethylphenyl) methane (common name: tetramethylbisphenol F), 4,4′-sulfonyldiphenol, 4,4′- Isopropylidene diphenol (commonly called bisphenol A), bis (4-hydroxyphenyl) methane, bis (2-hydroxyphenyl) methane, (2-hydroxyphenyl) (4-hydroxyphenyl) methane and bis (4-hydroxy) Bisphenols such as three mixtures of phenyl) methane, bis (2-hydroxyphenyl) methane, and (2-hydroxyphenyl) (4-hydroxyphenyl) methane (for example, bisphenol FD manufactured by Honshu Chemical Industry Co., Ltd.) , 1,2-benzenediol, 1,3-benzenediol Dihydroxybenzenes such as 1,4-benzenediol, trihydroxybenzenes such as 1,2,4-benzenetriol, various isomers of dihydroxynaphthalenes such as 1,6-dihydroxynaphthalene, 2,2′-biphenol, Examples of the compound include various isomers of biphenols such as 4,4′-biphenol.

Although content of the said hardening | curing agent (especially phenol type hardening | curing agent) is not specifically limited, 15 to 40 weight% of the whole said resin composition is preferable, and 20 to 30 weight% is especially preferable. If the content is less than the lower limit, the effect of improving the heat resistance may be reduced, and if the content exceeds the upper limit, the storage stability may be reduced. In addition, when using a phenol resin as a phenol type hardening | curing agent, this phenol resin does not make it a thermosetting resin, but evaluates content.
In addition, when the thermosetting resin is an epoxy resin, it can be determined by calculating the equivalent ratio of the epoxy equivalent and the curing agent. The epoxy equivalent of the epoxy resin and the equivalent of the functional group of the curing agent (for example, phenol resin) If present, the ratio of hydroxyl equivalent) is preferably 0.5 to 1.5, particularly preferably 0.7 to 1.3. When the content is less than the lower limit value, the storage stability may be lowered, and when the content exceeds the upper limit value, the effect of improving the heat resistance may be lowered.

The resin composition is not particularly limited, but preferably further contains a curing catalyst. Thereby, the sclerosis | hardenability of an adhesive film can be improved.
Examples of the curing catalyst include amine catalysts such as imidazoles and 1,8-diazabicyclo (5,4,0) undecene, phosphorus catalysts such as triphenylphosphine, and the like. Of these, imidazoles are preferred. Thereby, especially quick curability and preservability can be made compatible.
Examples of the imidazoles include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2- Phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ′)]-Ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4′methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 -[2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2- Phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl-s- Examples include triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, 2,4-diamino-6-methacryloyloxyethyl-s-triazine isocyanuric acid adduct, and the like. Among these, 2-phenyl-4,5-dihydroxymethylimidazole or 2-phenyl-4-methyl-5-hydroxymethylimidazole is preferable. Thereby, the storage stability can be particularly improved.

The melting point of the curing catalyst is not particularly limited, but is preferably 150 ° C. or higher, and particularly preferably 160 to 230 ° C. When the melting point is within the above range, the balance between embedding property and curability at the time of initial bonding between the semiconductor element and the substrate is excellent.
Examples of the curing catalyst having a melting point of 150 ° C. or higher include 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole.

  Although content of the said curing catalyst is not specifically limited, 0.01-30 weight part is preferable with respect to 100 weight part of the said thermosetting resins, and 0.5-10 weight part is especially preferable. If the content is less than the lower limit, the curability may be insufficient, and if the content exceeds the upper limit, the storage stability may decrease.

  Although the average particle diameter of the said curing catalyst is not specifically limited, It is preferable that it is 10 micrometers or less, and it is especially preferable that it is 1-5 micrometers. When the average particle size is within the above range, the reactivity of the curing catalyst is particularly excellent.

The resin composition is not particularly limited, but preferably further includes a thermoplastic resin. Thereby, the film formation ability of an adhesive film can be improved.
Examples of the thermoplastic resin include polyimide resins such as polyimide resins and polyetherimide resins, polyamide resins such as polyamide resins and polyamideimide resins, and acrylic resins. Among these, acrylic resins are preferable. Since the acrylic resin has a low glass transition temperature, the initial adhesion of the adhesive film can be further improved.

The acrylic resin means acrylic acid and derivatives thereof, and specifically, acrylic acid esters such as acrylic acid, methacrylic acid, methyl acrylate, and ethyl acrylate, and methacrylate esters such as methyl methacrylate and ethyl methacrylate. , Polymers such as acrylonitrile and acrylamide, and copolymers with other monomers.
Of the acrylic resins, acrylic resins (particularly acrylic ester copolymers) having a compound (copolymerization monomer component) having an epoxy group, a hydroxyl group, a carboxyl group, a nitrile group, and the like are preferable. Thereby, the adhesiveness to adherends, such as a semiconductor element, can be improved more. Specific examples of the compound having a functional group include glycidyl methacrylate having a glycidyl ether group, hydroxy methacrylate having a hydroxyl group, carboxy methacrylate having a carboxyl group, and acrylonitrile having a nitrile group.

  The content of the compound having a functional group is not particularly limited, but is preferably 0.5 to 40% by weight, particularly preferably 5 to 30% by weight, based on the entire acrylic resin. When the content is less than the lower limit, the effect of improving the adhesion may be reduced, and when the content exceeds the upper limit, the adhesive force is too strong and the effect of improving the workability may be reduced.

  The glass transition temperature of the thermoplastic resin is not particularly limited, but is preferably −25 to 120 ° C., more preferably −20 to 60 ° C., and most preferably −10 to 50 ° C. When the glass transition temperature is less than the lower limit value, the adhesive strength of the adhesive film for a semiconductor may be increased and workability may be reduced. When the glass transition temperature exceeds the upper limit value, the effect of improving the low temperature adhesive property may be reduced.

  The weight average molecular weight of the thermoplastic resin (particularly acrylic resin) is not particularly limited, but is preferably 100,000 or more, particularly preferably 150,000 to 1,000,000. When the weight average molecular weight is within the above range, the film forming property of the adhesive film for a semiconductor can be improved.

  Although content of the said thermoplastic resin is not specifically limited, 10 to 30 weight% of the whole said resin composition is preferable, and 15 to 25 weight% is especially preferable. If the content is less than the lower limit, the effect of improving the film forming ability may be reduced, and if the content exceeds the upper limit, the effect of improving the initial adhesion may be reduced.

The resin composition is not particularly limited, but preferably further includes a coupling agent. Thereby, the adhesiveness of resin, a to-be-adhered body, and a resin interface can be improved more.
Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent. Of these, silane coupling agents are preferred. Thereby, heat resistance can be improved more.

  Examples of the silane coupling agent include vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycol. Sidoxypropylmethyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N- Examples include phenyl-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane.

  Although content of the said coupling agent is not specifically limited, 0.01-10 weight part is preferable with respect to 100 weight part of the said thermosetting resins, and 0.5-10 weight part is especially preferable. If the content is less than the lower limit, the effect of adhesion may be insufficient, and if it exceeds the upper limit, it may cause outgassing or voids.

Such a resin composition is dissolved in a solvent such as methyl ethyl ketone, acetone, toluene, dimethylformaldehyde, etc. to make a varnish, and then applied to a carrier film using a comma coater, die coater, gravure coater, etc. The adhesive film 1 can be obtained by drying.
Although the thickness of the adhesive film 1 is not specifically limited, 3-100 micrometers is preferable and 5-70 micrometers is especially preferable. When the thickness is within the above range, it is particularly easy to control the thickness accuracy.

The elastic modulus at 175 ° C. after the adhesive film 1 is cured is 30 MPa or more. Thereby, it can prevent that a semiconductor element is damaged with the filler contained in sealing resin in a sealing process. More specifically, the elastic modulus at 175 ° C. after the adhesive film 1 is cured is preferably 40 Mpa or more, and particularly preferably 45 Mpa or more.
The elastic modulus at 175 ° C. after curing of the conventional adhesive film was about 12 MPa. With such an elastic modulus, the elastic modulus (elastic modulus at the sealing temperature) of the adhesive film in the sealing process (that is, before the adhesive film is finally cured) in the process of manufacturing the semiconductor package is low. (For example, less than 5 MPa). Therefore, it is considered that the adhesive film is easily deformed in the sealing process, and the semiconductor element may be damaged due to the penetration of the filler contained in the sealing resin.
On the other hand, in the adhesive film 1 of the present invention, the elastic modulus at 175 ° C. after curing (elastic modulus at the sealing temperature) is 30 MPa or more. Therefore, the elastic modulus of the adhesive film 1 in the sealing step can be made relatively high (for example, 5 MPa or more). For this reason, it is considered that the filler contained in the sealing resin can be prevented from entering without the adhesive film 1 being deformed or the like in the sealing step.
The elastic modulus at 175 ° C. is, for example, by using a dynamic viscoelastic device manufactured by Seiko Instruments Inc., preliminarily treating the film adhesive at 175 ° C. × 2 hours, and then raising the temperature 3 ° C./min. The dynamic viscoelasticity was measured at a frequency of 10 Hz, and the storage elastic modulus at 175 ° C. was measured.

Thus, as a method of setting the elastic modulus at 175 ° C. after curing the adhesive film 1 to 30 MPa or more, for example, a method of preparing a large content of the thermosetting resin in the resin composition, a filler Examples thereof include a method of adding and a method using a resin having a high elastic modulus. Among these, a method of preparing a large content of the thermosetting resin in the resin composition is preferable. Thereby, it is excellent in initial adhesiveness and can prevent the semiconductor element from being damaged in the sealing process.
Here, after the adhesive film 1 is cured, for example, after being treated at 170 to 200 ° C. for 1 to 4 hours, specifically, the total curing heating value obtained by measuring the adhesive film 1 with a differential calorimeter. This refers to the case where the heat generation of 90 to 100% is completed.

  Further, the elastic modulus at 175 ° C. of the adhesive film 1 after heat-treating the adhesive film 1 at 120 ° C. for 1 hour is not particularly limited, but is preferably 5.0 MPa or more, particularly 6.0 to 8.0 MPa. It is preferable that Thereby, the initial adhesiveness of the adhesive film 1 can be improved.

  Such an adhesive film 1 can be bonded to, for example, a dicing film and used as a die attach dicing film.

Next, the semiconductor device 10 of the present invention will be described.
As shown in FIG. 1, a semiconductor component 3 and a substrate 2 that are bonded via an adhesive film 1 are used.
As the substrate 2, for example, a substrate in which glass fiber is impregnated with an epoxy resin, a polyimide substrate, a bismaleimide-triazine resin substrate, or the like can be used.

  The bonding condition between the semiconductor element 3 and the substrate 2 is not particularly limited, but the bonding is performed between the semiconductor component 3 and the substrate 2 through the adhesive film 1 at a temperature of 80 to 200 ° C. for a time of 0.1 to 30 seconds. It is preferable. Thereafter, as shown in FIG. 2, the semiconductor component 3 and the substrate 2 are electrically connected by the bonding wire 4, and the semiconductor component 3 is sealed by the sealing material 5. Thereby, a semiconductor device having excellent connection reliability can be obtained.

In the above-described embodiment, the example in which the semiconductor element 3 and the substrate 2 are bonded with the adhesive film 1 has been described. However, the present invention is not limited to this, and the semiconductor element 3 and the semiconductor element 3 are bonded. It can also be used.
Furthermore, in the above-described embodiment, an example in which the semiconductor element 3 and the substrate 2 are bonded once has been described.

EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example and a comparative example, this invention is not limited to this.
First, the Example and comparative example of an adhesive film are demonstrated.

Example 1
1. Preparation of Adhesive Film Resin Varnish Acrylic ester copolymer (ethyl acrylate-acrylonitrile-glycidyl methacrylate-N, N dimethylacrylamide copolymer, manufactured by Nagase ChemteX Corporation, SG-80HDR, Tg as thermoplastic resin (A) : 10.degree. C., weight average molecular weight: 350,000) 19.92% by weight, curable resin as epoxy resin (EOCN-1020-80 (orthocresol novolac type epoxy resin), epoxy equivalent 200 g / eq, Nippon Kayaku ( 19.32 wt%, NC6000 (epoxy equivalent 200 g / eq, Nippon Kayaku Co., Ltd.) 29.08 wt%, liquid phenolic compound (MEH-8000H, hydroxyl equivalent 141 g / OH group) as a curing agent Manufactured by Meiwa Kasei Co., Ltd.) 21.91% by weight, solid pheno Resin (PR-HF-3, hydroxyl group equivalent 104 g / OH group, manufactured by Sumitomo Bakelite Co., Ltd.) 9.36% by weight, imidazole compound (2P4MHZ-PW, Shikoku Chemical Industry Co., Ltd.) as a curing accelerator (E) 0.15% by weight of γ-glycidoxypropyltrimethoxysilane (KBM403E, manufactured by Shin-Etsu Chemical Co., Ltd.) as a coupling agent was dissolved in methyl ethyl ketone (MEK) to obtain a resin solid content of 49 % Resin varnish was obtained.

2. Manufacture of adhesive film After applying the above-mentioned resin varnish to a polyethylene terephthalate film (Mitsubishi Chemical Polyester Film Co., Ltd., product number MRX50, thickness 50 μm) as the base film (I) using a comma coater, 90 The film was dried at 5 ° C. for 5 minutes to obtain an adhesive film having a thickness of 25 μm.
In addition, the elastic modulus in 175 degreeC after processing the obtained adhesive film (no base film) at 120 degreeC for 1 hour was 10 MPa.
In addition, after the obtained adhesive film (without the base film) was cured (after heat treatment at 175 ° C. × 2 hours), the elastic modulus at 175 ° C. was 45 MPa.
Here, the elastic modulus is a temperature increase of 3 ° C./min after performing the above-described treatment on the film adhesive in advance using a dynamic viscoelastic device manufactured by Seiko Instruments Inc. The dynamic viscoelasticity was measured at a frequency of 10 Hz, and the storage elastic modulus at 175 ° C. was measured.

(Example 2)
The same procedure as in Example 1 was performed except that the resin varnish of the adhesive film was mixed as follows.
As the thermoplastic resin (A), an acrylate copolymer (ethyl acrylate-acrylonitrile-glycidyl methacrylate-N, N dimethylacrylamide copolymer, manufactured by Nagase ChemteX Corporation, SG-80HDR, Tg: 10 ° C., weight average (Molecular weight: 350,000) 29.87% by weight and epoxy resin (EOCN-1020-80 (orthocresol novolac type epoxy resin) as epoxy resin), epoxy equivalent 200 g / eq, Nippon Kayaku Co., Ltd.) 93 wt%, NC6000 (epoxy equivalent 200 g / eq, manufactured by Nippon Kayaku Co., Ltd.) 25.49 wt%, liquid phenolic compound (MEH-8000H, hydroxyl equivalent 141 g / OH group, Meiwa Kasei Co., Ltd.) as a curing agent 19.12% by weight, solid phenolic resin (PR-HF-3, water) Group equivalent 104g / OH group, Sumitomo Bakelite Co., Ltd. 8.17% by weight, curing accelerator (E) imidazole compound (2P4MHZ-PW, Shikoku Kasei Kogyo Co., Ltd.) 0.15% by weight, coupling As an agent, 0.26% by weight of γ-glycidoxypropyltrimethoxysilane (KBM403E, manufactured by Shin-Etsu Chemical Co., Ltd.) was dissolved in methyl ethyl ketone (MEK) to obtain a resin varnish having a resin solid content of 49%.
The elastic modulus at 175 after treating the obtained adhesive film at 120 ° C. for 1 hour was 8 MPa.
In addition, the elastic modulus at 175 ° C. after curing the obtained adhesive film (after heat treatment at 175 ° C. × 2 hours) was 30 MPa.

(Example 3)
The procedure of Example 1 was repeated except that the adhesive film resin varnish was blended as follows.
As the thermoplastic resin (A), an acrylate copolymer (ethyl acrylate-acrylonitrile-glycidyl methacrylate-N, N dimethylacrylamide copolymer, manufactured by Nagase ChemteX Corporation, SG-80HDR, Tg: 10 ° C., weight average 19.92% by weight (molecular weight: 350,000) and epoxy resin (EOCN-1020-80 (orthocresol novolac type epoxy resin), epoxy equivalent 200 g / eq, Nippon Kayaku Co., Ltd.) as a curable resin. 32 wt%, NC6000 (epoxy equivalent 200 g / eq, manufactured by Nippon Kayaku Co., Ltd.) 29.08 wt%, liquid phenol compound (MEH-8000H, hydroxyl group equivalent 141 g / OH group, Meiwa Kasei Co., Ltd.) as a curing agent 21.91% by weight, solid phenol resin (PR-HF-3, water) 104 g / OH group equivalent, 9.36% by weight, manufactured by Sumitomo Bakelite Co., Ltd., imidazole compound (2PZ-CN, manufactured by Shikoku Kasei Co., Ltd.) 0.15% by weight as a coupling accelerator (E), coupling As an agent, 0.26% by weight of γ-glycidoxypropyltrimethoxysilane (KBM403E, manufactured by Shin-Etsu Chemical Co., Ltd.) was dissolved in methyl ethyl ketone (MEK) to obtain a resin varnish having a resin solid content of 49%.
The elastic modulus at 175 ° C. after treating the obtained adhesive film at 120 ° C. for 1 hour was 12 MPa.
Moreover, after hardening the obtained adhesive film (after 175 degreeC x 2-hour heat processing), the elasticity modulus in 175 degreeC was 48 MPa.

(Comparative Example 1)
The procedure of Example 1 was repeated except that the adhesive film resin varnish was blended as follows.
As the thermoplastic resin (B), an acrylic acid copolymer (ethyl acrylate-butyl acrylate-acrylonitrile-acrylic acid-hydroxyethyl methacrylate copolymer, manufactured by Nagase ChemteX Corporation, SG-708-6DR, Tg: 6 ° C., (Weight average molecular weight: 800,000) 19.92% by weight, and cresol novolac epoxy resin (EOCN-1020-80, epoxy equivalent 200 g / eq, Nippon Kayaku Co., Ltd.) 5.97% by weight as a thermosetting resin And 0.04% by weight of an imidazole compound (2PHZ-PW, manufactured by Shikoku Kasei Kogyo Co., Ltd., average particle size of about 2 μm) as a curing accelerator, and γ-glycidoxypropyltrimethoxysilane (KBM403, 0.20% by weight made by Shin-Etsu Chemical Co., Ltd.).
The elastic modulus at 175 ° C. after treatment of the obtained adhesive film at 120 ° C. for 1 hour was 1 MPa.
Moreover, the elastic modulus at 175 ° C. after curing the obtained adhesive film (after heat treatment at 175 ° C. × 2 hours) was 12 MPa.

The following evaluation was performed about the adhesive film obtained by each Example and the comparative example. The evaluation items are shown together with the contents. The obtained results are shown in Table 1.
1. Heat resistance The heat resistance of the obtained adhesive film was evaluated by the glass transition temperature (Tg) of the cured adhesive film by thermomechanical analysis (TMA).

2. Preservability The preservability of the obtained adhesive film is determined by measuring the heat value of curing after treating the adhesive film at 50 ° C. for 1 day as an accelerated test, and the heat value of curing after storage treatment relative to the initial heat value (mJ / mg). Evaluation was made as a percentage of the amount (mJ / mg). Units%. The closer this value is to 100%, the higher the storage stability. A differential scanning calorimeter (DSC) was used for evaluation of the amount of heat generated by curing.
A: Percentage ratio of curing heat generation amount is 90% or more. O: Percentage ratio of curing heat generation amount is 70% to less than 90%. Δ: Percentage ratio of curing heat generation amount is 50% or more. Is less than 70% x: percentage of the ratio of the heat value of curing is less than 50%

As is clear from Table 1, it was shown that the adhesive films of Examples 1 to 3 had a high glass transition temperature and excellent heat resistance.
Moreover, the adhesive film of Example 2 was particularly excellent in storage stability.

Next, a semiconductor device will be described.
(Example 1a to Example 3a)
(1) Manufacture of adhesive film for semiconductors The adhesive film resin varnish obtained in each Example is a comma coater, and a polyethylene terephthalate film (Mitsubishi Chemical Polyester Film Co., Ltd., product number MRX50) as a base film (I). After application to a thickness of 50 μm, the film was dried at 90 ° C. for 5 minutes to obtain an adhesive film for semiconductor having a thickness of 25 μm.

(2) Production of pressure-sensitive adhesive layer Cleartec CT-H717 (manufactured by Kuraray) was formed as a base film (II) with an extruder to form a film having a thickness of 100 μm, and the surface was subjected to corona treatment. Next, a weight average molecular weight of 500,000 obtained by copolymerizing 50 parts by weight of 2-ethylhexyl acrylate, 10 parts by weight of butyl acrylate, 37 parts by weight of vinyl acetate, and 3 parts by weight of 2-hydroxyethyl methacrylate. The copolymer was peeled and applied to a 38 μm thick polyester film (corresponding to the cover film of the adhesive layer) so that the thickness after drying was 10 μm, and dried at 80 ° C. for 5 minutes. Obtained. Thereafter, this pressure-sensitive adhesive layer was laminated on the corona-treated surface of the base film (II) to obtain a base film (II) and a pressure-sensitive adhesive layer.

(3) Manufacture of semiconductor adhesive film (die attach film with dicing sheet function) Only the film adhesive layer of the above-mentioned semiconductor adhesive film (adhesive film with base film (I)) (part bonded to the wafer) The adhesive film layer of the semiconductor adhesive film and the adhesive layer were bonded so that the cover film was peeled off from the adhesive layer described above. Thereby, the die attach film with a dicing sheet function in which base film (II), an adhesive layer, an adhesive film, and base material (I) were constituted in this order was obtained.

(4) Manufacturing of semiconductor device The substrate (I) of this die attach film with a dicing sheet function is peeled off, and the adhesive film surface is attached to the back surface of a 5-inch 200 μm wafer at a temperature of 40 ° C. and a pressure of 0.3 MPa. A wafer with a die attach film with a dicing sheet function was obtained.
Thereafter, the wafer was diced (cut) into a size of 5 mm × 5 mm square semiconductor element using a dicing saw at a spindle rotation speed of 30,000 rpm and a cutting speed of 50 mm / sec. Next, the die attach film with a dicing function was pushed up from the back surface, peeled between the base film (II) and the adhesive, and a semiconductor element having an adhesive layer (adhesive film) adhered thereto was obtained. This semiconductor element is pressure-bonded to a bismaleimide-triazine resin substrate (circuit level 5 to 10 μm) coated with a solder resist (manufactured by Taiyo Ink Manufacturing Co., Ltd .: trade name: AUS308) at 130 ° C., 5 N for 1.0 second. After die bonding, heat treatment at 120 ° C. for 1 hour and semi-curing the adhesive film part, sealing with sealing resin EME-G760, heat treatment at 175 ° C. for 2 hours, and sealing resin 10 semiconductor devices were obtained by curing.

(Comparative Example 1a)
The adhesive film was the same as Example 1a except that the adhesive film obtained in Comparative Example 1 was used.

1. Initial embedding property The initial embedding property (circuit filling property) is obtained by applying the semiconductor device before resin sealing obtained in each of the examples and comparative examples into a circuit step on the organic substrate by a scanning ultrasonic flaw detector (SAT). The rate with which the adhesive film for semiconductors was filled was evaluated. Each code is as follows.
A: The filling rate was 90% or more and 100%.
○: The filling rate was 80% or more and less than 90%.
Δ: The filling rate was 40% or more and less than 80%.
X: The filling rate was less than 40%.

2. Low temperature sticking property The 180 degree peel strength after sticking the adhesive film on the back surface of a wafer having a thickness of 550 μm at a temperature of 40 ° C. and a pressure of 0.3 MPa in each example and comparative example was evaluated.
A: The peel strength was 100 N / m or more.
○: The peel strength was 50 N / m or more and less than 100 N / m.
Δ: The peel strength was 30 N / m or more and less than 50 N / m.
X: The peel strength was less than 30 N / m.

3. Presence / absence of mixing crack of filler in semiconductor element After sealing the semiconductor element and the bonding wire with a sealing resin, it was observed with a microscope whether the filler was mixed in the adhesive film by observing the cross section of the semiconductor device. Each code is as follows.
A: Almost no filler was mixed into the adhesive film. X: The filler was mixed into the adhesive film, and some semiconductor elements were cracked.

As is apparent from Table 2, the semiconductor devices obtained in Examples 1a to 3a had almost no cracks in the semiconductor elements.
Moreover, in the semiconductor devices of Examples 1 and 3, the initial embedding property of the adhesive film was particularly excellent.

It is sectional drawing which shows an example of the film for semiconductor mounting typically. It is sectional drawing explaining the manufacturing process of a semiconductor package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adhesive film 2 Board | substrate 3 Semiconductor element 4 Bonding wire 5 Sealing resin 10 Semiconductor device

Claims (9)

An adhesive film that is used when bonding a semiconductor component and a substrate or a semiconductor component and a semiconductor component, and is composed of a resin composition containing a thermosetting resin,
An adhesive film having an elastic modulus at 175 ° C. of 30 MPa or more after the adhesive film is cured.   The adhesive film according to claim 1, wherein the content of the thermosetting resin is 30 to 60% by weight of the entire resin composition.   The adhesive film according to claim 1, wherein the thermosetting resin includes an epoxy resin.   The adhesive film according to claim 1, wherein the resin composition further contains a curing agent.   The adhesive film according to claim 1, wherein the resin composition further contains a curing catalyst.   The adhesive film according to claim 5, wherein the curing catalyst contains an imidazole compound.   The adhesive film according to claim 5 or 6, wherein the curing catalyst has a melting point of 150 ° C or higher.   The adhesive film according to any one of claims 1 to 7, wherein an elastic modulus at 175 ° C of the adhesive film after heat treatment at 120 ° C for 1 hour is 5.0 MPa or more.   A semiconductor device, wherein the semiconductor component and the substrate are bonded using the adhesive film according to claim 1.

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