JP2007291461A - Holder for vapor deposition - Google Patents

Holder for vapor deposition Download PDF

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JP2007291461A
JP2007291461A JP2006122004A JP2006122004A JP2007291461A JP 2007291461 A JP2007291461 A JP 2007291461A JP 2006122004 A JP2006122004 A JP 2006122004A JP 2006122004 A JP2006122004 A JP 2006122004A JP 2007291461 A JP2007291461 A JP 2007291461A
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vapor deposition
rod
mask
folder
jig
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JP4795842B2 (en
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Makoto Komuro
真 小室
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Nippon Yakin Kogyo Co Ltd
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Nippon Yakin Kogyo Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a holder for vapor deposition, which prevents a mask for the vapor deposition from changing a projection angle to make a vapor depositing material uniformly deposit on the surface to be vapor-deposited. <P>SOLUTION: The holder 100 for vapor deposition, which is used for fixing a mask for the vapor deposition, adopts a structure having a rod-shaped member jointed with a spigot structure. The spigot structure is, for instance, a mating structure formed of a salient 103b and a recess 102a, and preferably is an interference fit structure. The holder 100 is also provided with an expansion and contraction tracking mechanism in which threaded holes of four corners for fixing the holder to a pedestal have the shapes of circular holes and long holes in combination, and a fixed portion to the pedestal follows the two-dimensional thermal deformation of the holder for the vapor deposition. The holder for the vapor deposition, which has adopted the structures, can inhibit the holder from deteriorating its flatness due to thermal deformation, and also inhibit the mask for the vapor deposition from changing the projection angle of the mask for the vapor deposition. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、被蒸着部材に対して蒸着マスクを固定する蒸着用治具に係り、蒸着工程時の昇温に起因する変形を抑えることができる構成に関する。   The present invention relates to a vapor deposition jig for fixing a vapor deposition mask to a member to be vapor-deposited, and relates to a configuration that can suppress deformation due to temperature rise during a vapor deposition process.

例えばＥＬディスプレイに利用さえるＥＬ材料は、被蒸着部材の表面に真空蒸着により形成される。この真空蒸着の工程においては、被蒸着部材の上に蒸着マスクが枠状の部材によって固定される。そして、蒸着マスクを介して、減圧雰囲気中において加熱蒸発させたＥＬ材料を被蒸着部材上に堆積させることで、ＥＬ材料の薄膜層を形成する。   For example, an EL material that can be used in an EL display is formed on the surface of a member to be deposited by vacuum deposition. In this vacuum deposition process, a deposition mask is fixed on the deposition target member by a frame-shaped member. Then, a thin film layer of the EL material is formed by depositing the EL material heated and evaporated in a reduced pressure atmosphere on the deposition target member through the vapor deposition mask.

上述したＥＬ材料の真空蒸着は、蒸着源が３５０℃程度以上に加熱され、被蒸着面の温度は一時的に１００℃前後になる。蒸着マスクおよび蒸着マスクを固定する枠状の部材は金属製であるので、蒸着工程を繰り返すことで、上記の熱の影響により、徐々に変形する。この結果、蒸着マスクの投影角に変化が発生する。蒸着マスクの投影角に変化が生じると、蒸着材料の均一な定着が望めなくなる。蒸着材料の不均一な定着は、ＥＬディスプレイの表示における輝度ムラや色ムラの要因となるので好ましくない。   In the vacuum deposition of the EL material described above, the deposition source is heated to about 350 ° C. or higher, and the temperature of the deposition surface temporarily becomes around 100 ° C. Since the vapor deposition mask and the frame-shaped member that fixes the vapor deposition mask are made of metal, the deposition process is repeated, and the frame is gradually deformed by the influence of the heat. As a result, a change occurs in the projection angle of the vapor deposition mask. If the projection angle of the vapor deposition mask changes, uniform fixation of the vapor deposition material cannot be expected. Uneven fixing of the vapor deposition material is not preferable because it causes luminance unevenness and color unevenness in the display of the EL display.

これらの問題に関連して、特許文献１や特許文献２に記載された技術が提案されている。特許文献１には、撓み防止部材を用いることで、蒸着マスクおよび取り付け枠の密着度を高める技術について記載されている。特許文献２には、蒸着マスクを磁性材料によって構成し、この蒸着マスクの一辺部を被蒸着部材に固定し、全体をシートマグネットによって固定する構成が記載されている。特許文献２に記載の構成によれば、蒸着マスクが被蒸着面の面形状に倣って変形し、蒸着マスクの被蒸着面への密着性を改善することができるとされている。   In relation to these problems, techniques described in Patent Document 1 and Patent Document 2 have been proposed. Patent Document 1 describes a technique for increasing the degree of adhesion between a vapor deposition mask and a mounting frame by using a deflection preventing member. Patent Document 2 describes a configuration in which a vapor deposition mask is made of a magnetic material, one side of the vapor deposition mask is fixed to a vapor deposition member, and the whole is fixed by a sheet magnet. According to the configuration described in Patent Document 2, the deposition mask is deformed following the surface shape of the deposition surface, and the adhesion of the deposition mask to the deposition surface can be improved.

特開２００４−２３２０５０号公報JP 2004-232050 A 特開２００２−１０５６２２号公報JP 2002-105622 A

ところで、本発明者らの研究によれば、上述した蒸着マスクの投影角に変化が発生する主な要因は、刻々と変化する真空蒸着装置内部の熱的環境の影響により、蒸着マスクおよびそれを取り付ける枠構造の部材に変形（熱変形）が発生する点にある。特許文献１に記載されている技術は、剛性を高めることで、部材の変形を防止しようとするものであるが、装置内部の蓄熱の度合が進むと、剛性のみで枠部材の変形を抑えることができなくなる。また、特許文献２に記載の技術は、蒸着マスクの被蒸着部材や取り付け枠への密着性を高めるもので、蒸着マスクを固定する部材の変形が抑えられる訳ではない。このため、蒸着マスクの投影角の変化を抑える効果は十分ではない。   By the way, according to the study by the present inventors, the main cause of the change in the projection angle of the above-described deposition mask is that the deposition mask and the deposition mask are affected by the influence of the thermal environment inside the vacuum deposition apparatus that changes every moment. This is in that deformation (thermal deformation) occurs in the member of the frame structure to be attached. The technique described in Patent Document 1 tries to prevent the deformation of the member by increasing the rigidity. However, when the degree of heat storage inside the apparatus proceeds, the deformation of the frame member is suppressed only by the rigidity. Can not be. In addition, the technique described in Patent Document 2 improves the adhesion of the vapor deposition mask to the vapor deposition member and the mounting frame, and does not suppress deformation of the member that fixes the vapor deposition mask. For this reason, the effect which suppresses the change of the projection angle of a vapor deposition mask is not enough.

また、これら技術の有効性が限定的である理由として、蒸着マスクを取り付けるための枠状の部材の製造方法を挙げることができる。すなわち、蒸着マスクを固定する枠状の部材は、その開口部をフライス加工などの切削加工手段を用いて形成する必要があるが、その際に加工時の歪や素材の残留応力が発生する。この加工時の歪や素材の残留応力は、蒸着の際の温度上昇時に枠部材の変形を助長する要因となる。   Further, the reason why the effectiveness of these techniques is limited can be a method of manufacturing a frame-shaped member for attaching a vapor deposition mask. That is, the frame-shaped member that fixes the vapor deposition mask needs to have its opening formed by a cutting means such as milling, but at that time, distortion during processing and residual stress of the material are generated. The distortion during processing and the residual stress of the material are factors that promote the deformation of the frame member when the temperature rises during vapor deposition.

そこで本発明は、上述した問題点を解決し、蒸着マスクの投影角に変化が生じないようにすることで、蒸着材料の均一な定着を行うことができる技術を提供することを目的とする。   In view of the above, an object of the present invention is to solve the above-described problems and provide a technique capable of uniformly fixing a vapor deposition material by preventing a change in the projection angle of the vapor deposition mask.

本発明の蒸着用治具は、被蒸着部材に蒸着マスクを固定するためのものであって、炭素鋼よりも線膨張係数が低い材質の複数の棒状部材と、前記複数の棒状部材を接合するインロー構造とを備えていることを特徴とする。   The vapor deposition jig of the present invention is for fixing a vapor deposition mask to a member to be vapor-deposited, and joins the plurality of rod-shaped members made of a material having a lower linear expansion coefficient than carbon steel and the plurality of rod-shaped members. And an inlay structure.

本発明によれば、棒状部材を利用するので、部材自体に加えられる切削加工の加工量が少なくて済む。このため、従来技術のように、開口部を切削加工により形成する場合に発生する歪や素材の残留応力を小さくすることができる。したがって、蒸着工程において、これら歪や残留応力に起因する変形を抑えることができ、治具全体において生じる変形を小さく抑えることができる。また、インロー構造により接合することで、棒状部材同士の接合構造であっても、一体物と同様な強度を確保することができ、熱変形時において部分的に歪みが集中し難い構造とすることができる。また、炭素鋼よりも線膨張係数の低い材質とすることで、熱による膨張収縮を抑えることができる。   According to the present invention, since a rod-shaped member is used, the amount of machining applied to the member itself can be reduced. For this reason, it is possible to reduce the distortion and the residual stress of the material generated when the opening is formed by cutting as in the prior art. Therefore, in the vapor deposition process, deformation due to these strains and residual stresses can be suppressed, and the deformation generated in the entire jig can be suppressed to a small level. In addition, by joining with an inlay structure, even if it is a joining structure between rod-like members, the same strength as an integral object can be secured, and a structure in which strain is not easily concentrated partially during thermal deformation Can do. Further, by using a material having a lower linear expansion coefficient than carbon steel, expansion and contraction due to heat can be suppressed.

接合の方法としては、接着剤を用いた接合、機械接合、あるいは溶接接合を利用することができる。接着剤を用いる方法には、接合工程において、接合部に熱や歪を与えることがない優位性がある。なお接着剤を利用する場合、温度上昇時に配合成分の蒸発による汚染や接着力の低下が懸念されるので、揮発成分の少ない耐熱性の接着剤（例えば、耐熱性の無機系接着剤等）が好適である。機械接合というのは、ねじ、ボルト、リベット等による接合である。機械接合を採用する場合には、ネジ頭等の突起に対する配慮が必要である。溶接接合としては、入熱面積の小さいレーザー溶接やマイクロプラズマ溶接などが適している。また、完全固着を計る方法として、部分溶け込み溶接（ナメ付け）も好ましい。   As a joining method, joining using an adhesive, mechanical joining, or welding joining can be used. The method using an adhesive has the advantage of not giving heat or strain to the joint in the joining step. In addition, when using an adhesive, there is concern about contamination due to evaporation of the blended components and a decrease in adhesive strength when the temperature rises. Therefore, a heat-resistant adhesive with a small amount of volatile components (for example, a heat-resistant inorganic adhesive) is used. Is preferred. Mechanical joining is joining with screws, bolts, rivets and the like. When employing mechanical joining, it is necessary to consider protrusions such as screw heads. As the welding joint, laser welding or microplasma welding with a small heat input area is suitable. Further, as a method for measuring complete fixation, partial penetration welding (sling) is also preferable.

本発明において、インロー構造が、締り嵌め構造を備えていることが望ましい。この態様によれば、各棒状部材同士をより一体にすることができ、熱による変形を最小限に抑えることができる。   In the present invention, it is desirable that the spigot structure has an interference fit structure. According to this aspect, the rod-shaped members can be integrated with each other, and deformation due to heat can be minimized.

本発明の蒸着用治具において、当該蒸着用治具を台座に対して変位可能な状態で固定する伸縮追従機構を備えていることが望ましい。伸縮追従機構により、蒸着用治具の被蒸着面に平行な方向における変形がある程度許容される。そのため、治具が反ったり波打ったりする変形を抑えることができ、熱変形により蒸着用治具の平坦性が乱れることを抑えることができる。これにより、蒸着マスクの平坦性を確保することができ、蒸着材料を被蒸着面に均一に堆積することができる。   The vapor deposition jig of the present invention preferably includes an expansion / contraction tracking mechanism that fixes the vapor deposition jig in a displaceable state with respect to the pedestal. By the expansion / contraction follow-up mechanism, deformation in a direction parallel to the deposition surface of the evaporation jig is allowed to some extent. Therefore, the deformation | transformation which a jig | tool warps or waves can be suppressed, and it can suppress that the flatness of the jig | tool for vapor deposition is disturb | confused by thermal deformation. Thereby, the flatness of a vapor deposition mask can be ensured and vapor deposition material can be uniformly deposited on a vapor deposition surface.

伸縮追従機構としては、当該蒸着用治具の台座に対する固定を、長孔を介したビスによって行う可動支持構造を挙げることができる。この可動支持構造によれば、ビスが長孔内をスライドすることが可能となるので、台座に固定した状態における蒸着用治具の２次元的な熱変形が許容される。その他の可動支持構造としては、変形可能なピンにより台座に対して当該蒸着用治具を支持させ、このピンの変形によって蒸着用治具の熱変形に従った可動を行う構成を挙げることができる。   Examples of the expansion / contraction follower mechanism include a movable support structure in which the vapor deposition jig is fixed to the pedestal with a screw through a long hole. According to this movable support structure, since the screw can slide in the long hole, two-dimensional thermal deformation of the evaporation jig in a state of being fixed to the pedestal is allowed. Examples of other movable support structures include a structure in which the vapor deposition jig is supported on the pedestal by a deformable pin, and the movement according to the thermal deformation of the vapor deposition jig is performed by deformation of the pin. .

本発明において、蒸着用治具を構成する棒状部材に複数の孔を形成することで、伸縮緩衝機構を構成することが望ましい。この伸縮緩衝機構によれば、複数の孔が設けられていることで、蒸着用治具内における温度分布に大きな勾配が生じないようにすることができる。また孔の部分において熱応力が緩衝され、部分的な応力の集中を防ぐことができる。これにより、治具全体の変形を抑えることができる。また、複数の孔が形成されることによる治具の重量軽減効果を得ることができる。   In the present invention, it is desirable to form the expansion / contraction buffering mechanism by forming a plurality of holes in the rod-shaped member constituting the vapor deposition jig. According to this expansion / contraction buffering mechanism, it is possible to prevent a large gradient from occurring in the temperature distribution in the evaporation jig by providing the plurality of holes. Further, thermal stress is buffered at the hole portion, and partial concentration of stress can be prevented. Thereby, the deformation | transformation of the whole jig | tool can be suppressed. Moreover, the weight reduction effect of the jig | tool by forming a some hole can be acquired.

本発明の蒸着用治具において、棒状部材に蒸着マスクの熱変形を吸収するマスク伸縮緩衝用溝が設けられていることが望ましい。この態様によれば、蒸着マスクの熱変形が溝の断面構造の変形により吸収される。このため、蒸着マスクの熱変形による蒸着マスクの平坦性の悪化を抑えることができる。   In the vapor deposition jig of the present invention, it is desirable that the rod-like member is provided with a mask expansion / contraction buffer groove that absorbs thermal deformation of the vapor deposition mask. According to this aspect, the thermal deformation of the vapor deposition mask is absorbed by the deformation of the cross-sectional structure of the groove. For this reason, deterioration of the flatness of the vapor deposition mask due to thermal deformation of the vapor deposition mask can be suppressed.

炭素鋼よりも線膨張係数の低い材質としては、Ｓｉ：０．００１〜０．３重量％、Ｍｎ：０．０１〜０．５重量％、Ｎｉ：３０〜４５重量％、Ａｌ：０．００５重量％以下を含有し、残部が実質的にＦｅおよび不可避的不純物よりなる合金が望ましい。この組成範囲の合金は、蒸着工程の雰囲気温度による変形が小さい。このため、当該合金を蒸着用治具に利用することで、蒸着材料の均一な蒸着を行うことができる。なお、蒸着用治具に加えて、蒸着マスクもこの合金で構成することが望ましい。蒸着用治具と蒸着マスクを同じ材質とすることで、線膨張係数の違いに起因する平坦性の悪化を防止することができる。   Materials having a lower linear expansion coefficient than carbon steel include Si: 0.001 to 0.3% by weight, Mn: 0.01 to 0.5% by weight, Ni: 30 to 45% by weight, Al: 0.005. An alloy containing not more than% by weight and the balance being substantially composed of Fe and inevitable impurities is desirable. An alloy having this composition range has a small deformation due to the atmospheric temperature in the vapor deposition process. For this reason, uniform vapor deposition of a vapor deposition material can be performed by using the said alloy for the jig | tool for vapor deposition. In addition to the vapor deposition jig, the vapor deposition mask is preferably made of this alloy. By using the same material for the vapor deposition jig and the vapor deposition mask, it is possible to prevent deterioration in flatness due to a difference in linear expansion coefficient.

本発明によれば、蒸着用治具の変形が抑えられるので、蒸着マスクの投影角に変化が生じないようにすることができる。このため、蒸着材料の均一な定着を行うことができる。   According to the present invention, since the deformation of the evaporation jig can be suppressed, the projection angle of the evaporation mask can be prevented from changing. For this reason, the vapor deposition material can be uniformly fixed.

（１）第１の実施形態
（実施形態の構成）
図１は、本発明の蒸着用治具の構成を利用した蒸着用フォルダの分解状態を示す上面図である。図２は、それを組み立てた状態を示す上面図である。図１および図２に示す蒸着用フォルダ１００には、蒸着マスクが固定される。また、蒸着用フォルダ１００を利用して台座に被蒸着フィルムが固定される。 (1) First embodiment (configuration of the embodiment)
FIG. 1 is a top view showing an exploded state of a deposition folder using the configuration of the deposition jig of the present invention. FIG. 2 is a top view showing the assembled state. A vapor deposition mask is fixed to the vapor deposition folder 100 shown in FIGS. In addition, the vapor deposition film is fixed to the pedestal using the vapor deposition folder 100.

まず、蒸着用フォルダ１００の構造について説明する。図１および図２には、対称な構造を有する一対の棒状枠部材１０１および１０２が示されている。この棒状枠部材１０１および１０２に対して、一対の棒状枠部材１０３および１０４がインロー構造により接合される。そして、これら棒状枠部材１０１〜１０４によって、矩形の枠構造が組み上げられる。   First, the structure of the evaporation folder 100 will be described. 1 and 2 show a pair of rod-shaped frame members 101 and 102 having a symmetrical structure. A pair of rod-shaped frame members 103 and 104 are joined to the rod-shaped frame members 101 and 102 by an inlay structure. And the rectangular frame structure is assembled by these rod-shaped frame members 101-104.

棒状枠部材１０３の両端には、凸部１０３ａおよび１０３ｂが設けられ、棒状枠部材１０４の両端に凸部１０４ａおよび１０４ｂが設けられている。一方において、棒状枠部材１０１の一方の端部近くには、凸部１０３ａに嵌る形状の凹部１０１ａが形成され、他方の端部近くには、凸部１０４ａに嵌る形状の凹部１０１ｂが形成されている。また、棒状枠部材１０２の一方の端部近くには、凸部１０３ｂに嵌る形状の凹部１０２ａが形成され、他方の端部近くには、凸部１０４ｂに嵌る形状の凹部１０２ｂが形成されている。これら凸部が凹部に嵌り込むことでインロー構造の接合が行われる。   Convex portions 103 a and 103 b are provided at both ends of the rod-shaped frame member 103, and convex portions 104 a and 104 b are provided at both ends of the rod-shaped frame member 104. On the other hand, a concave portion 101a shaped to fit the convex portion 103a is formed near one end of the rod-shaped frame member 101, and a concave portion 101b shaped to fit the convex portion 104a is formed near the other end. Yes. Further, a concave portion 102a shaped to fit the convex portion 103b is formed near one end portion of the rod-shaped frame member 102, and a concave portion 102b shaped to fit the convex portion 104b is formed near the other end portion. . By fitting these convex portions into the concave portions, the spigot structure is joined.

また、棒状枠部材１０１の中央には、凹部１０１ｃが形成され、そこに棒状仕切り部材１０５の端部１０５ａが嵌る。棒状仕切り部材１０５の他方の端部１０５ｂは、直交して配置される棒状仕切り部材１０７の中央に形成された凹部１０７ａに嵌る。また、凹部１０７ａの反対側に形成された凹部１０７ｂに棒状仕切り部材１０６の端部１０６ｂが嵌る。棒状仕切り部材１０６のもう一つの端部１０６ａは、棒状枠部材１０２の中央に形成された凹部１０２ｃに嵌る。そして、棒状仕切り部材１０７の一方の端部１０７ｃは、棒状枠部材１０３の中央に形成された凹部１０３ｃに嵌り、他方の端部１０７ｄは、棒状枠部材１０４の中央に形成された凹部１０４ｃに嵌る。これら各嵌め合いの部分は、きつい嵌め合い公差で設計されており、縛り嵌め構造となっている。すなわち、凸部の寸法は、対応する凹部の寸法より僅かに大きく設定されている。また、各接合部分は、溶接によって固定されている。   Moreover, the recessed part 101c is formed in the center of the rod-shaped frame member 101, and the edge part 105a of the rod-shaped partition member 105 fits there. The other end portion 105b of the rod-shaped partition member 105 is fitted into a recess 107a formed at the center of the rod-shaped partition member 107 arranged orthogonally. Further, the end portion 106b of the rod-shaped partition member 106 is fitted into the concave portion 107b formed on the opposite side of the concave portion 107a. Another end portion 106 a of the rod-shaped partition member 106 is fitted into a recess 102 c formed at the center of the rod-shaped frame member 102. One end 107 c of the rod-shaped partition member 107 fits into a recess 103 c formed at the center of the rod-shaped frame member 103, and the other end 107 d fits into a recess 104 c formed at the center of the rod-shaped frame member 104. . Each of these fitting portions is designed with tight fitting tolerances and has a tight fitting structure. That is, the dimension of the convex part is set slightly larger than the dimension of the corresponding concave part. Moreover, each joining part is being fixed by welding.

こうして、図２に示すように、棒状枠部材１０１、１０２、１０３および１０４によって枠構造が形成され、その内側が、棒状仕切り部材１０５、１０６および１０７によって構成される十字の仕切りによって４つに仕切られた蒸着用フォルダ１００が構成されている。また、蒸着用フォルダ１００の四隅には、蒸着用フォルダを図示しない台座に固定するためのネジ孔１０８が形成されている。   In this way, as shown in FIG. 2, a frame structure is formed by the rod-shaped frame members 101, 102, 103, and 104, and the inside is divided into four by a cross-shaped partition constituted by the rod-shaped partition members 105, 106, and 107. The vapor deposition folder 100 is configured. Further, screw holes 108 for fixing the deposition folder to a pedestal (not shown) are formed at the four corners of the deposition folder 100.

各棒状部材は、それぞれ同じ材質であり、Ｓｉ、Ｍｎ、Ｎｉ、Ａｌを含み、残部が実質的にＦｅおよび不可避的不純物からなる合金により構成される。この合金は、炭素鋼よりも線膨張係数の低いアンバー合金とすることが望ましい。この合金におけるＳｉ、Ｍｎ、Ｎｉ、Ａｌの好適な組成の例を下記表１に示す。表１における数値の単位は、重量％である。また、表１には、不可避的不純物であるＣの割合も示されている。なお、表１に示す化学組成の例において、最も優れているのは、サンプル２の組成である。熱変形を極力抑えるためには、Ａｌの含有量を０．００５重量％以下に抑えることが望ましい。   Each rod-shaped member is made of the same material, and includes Si, Mn, Ni, and Al, and the balance is made of an alloy that substantially consists of Fe and inevitable impurities. This alloy is preferably an amber alloy having a lower coefficient of linear expansion than carbon steel. Examples of suitable compositions of Si, Mn, Ni and Al in this alloy are shown in Table 1 below. The unit of numerical values in Table 1 is% by weight. Table 1 also shows the proportion of C that is an inevitable impurity. In the example of chemical composition shown in Table 1, the composition of sample 2 is the most excellent. In order to suppress thermal deformation as much as possible, it is desirable to suppress the Al content to 0.005% by weight or less.

Figure 2007291461
Figure 2007291461

各棒状部材は、基本的にフラットバー形状であり、その基本断面形状は扁平な矩形となっている。棒状仕切り部材１０５には、断面形状が凹型で、部材の延在方向に延びたマスク伸縮緩衝用溝１０５ｃが形成されている。棒状仕切り部材１０６にも同様な構造のマスク伸縮緩衝用溝１０６ｃが形成され、棒状仕切り部材１０７にも同様な構造のマスク伸縮緩衝用溝１０７ｅが形成されている。また、この棒状仕切り部材に形成されたマスク伸縮緩衝用溝から延長する形で、各棒状枠部材に、マスク伸縮緩衝用溝１０１ｄ、１０２ｄ、１０３ｄおよび１０４ｄが形成されている。各棒状部材は、フラットバー構造に限定されず、断面形状が六角等の多角形状、円形状、楕円形状等のものを利用することができる。   Each bar-like member is basically a flat bar shape, and its basic cross-sectional shape is a flat rectangle. The rod-shaped partition member 105 is formed with a mask expansion / contraction buffering groove 105c having a concave cross-sectional shape and extending in the extending direction of the member. A mask expansion / contraction buffering groove 106c having a similar structure is formed in the rod-shaped partition member 106, and a mask expansion / contraction buffering groove 107e having a similar structure is formed in the rod-shaped partitioning member 107. Further, mask expansion / contraction buffering grooves 101d, 102d, 103d, and 104d are formed in the respective rod-shaped frame members so as to extend from the mask expansion / contraction buffering grooves formed in the rod-shaped partition member. Each bar-shaped member is not limited to a flat bar structure, and a cross-sectional shape such as a polygonal shape such as a hexagon, a circular shape, or an elliptical shape can be used.

（実施形態の製造方法）
以下、図１および図２に示す蒸着用フォルダ１００の製造方法の一例を説明する。まず、棒状仕切り部材１０５と１０６を棒状仕切り部材１０７に接合する。この際、凹部１０７ａおよび１０７ｂの部分を加熱した状態において、そこに棒状仕切り部材１０５の端部１０５ｂと、棒状仕切り部材１０６の端部１０６ｂをそれぞれ圧入し嵌め込む。そして、加熱した部分を冷却することで、締り嵌めによるインロー構造の接合が行われる。こうして、棒状仕切り部材１０５、１０６および１０７を接合した十字型の仕切り部材が得られる。 (Manufacturing method of embodiment)
Hereinafter, an example of the manufacturing method of the evaporation folder 100 shown in FIGS. 1 and 2 will be described. First, the rod-shaped partition members 105 and 106 are joined to the rod-shaped partition member 107. At this time, in a state where the concave portions 107a and 107b are heated, the end portion 105b of the rod-shaped partition member 105 and the end portion 106b of the rod-shaped partition member 106 are respectively press-fitted and fitted therein. Then, by cooling the heated portion, the spigot structure is joined by an interference fit. In this way, a cross-shaped partition member in which the rod-shaped partition members 105, 106 and 107 are joined is obtained.

また、別に棒状枠部材１０１、１０２、１０３および１０４を接合し、枠構造を得る。すなわち、棒状枠部材１０１の凹部１０１ａと１０１ｂの部分に、棒状枠部材１０３の凸部１０３ａと棒状枠部材１０４の凸部１０４ａを嵌め込み、その部分を接着剤または、入熱を極力低減したマイクロプラズマ、レーザー、ＴＩＧ(Tungsten Inert Gas Welding)等の溶接機を用いて、接合部の接着剤接合の場合は接合面全面を、溶接の場合は接合面表層を、変形がなきよう接合する。次に、棒状枠部材１０２の凹部１０２ａと１０２ｂの部分に棒状枠部材１０３の凸部１０３ｂと棒状枠部材１０４の凸部１０４ｂを嵌め込み、溶接その他の方法により接合を行う。こうして、棒状枠部材１０１、１０２、１０３および１０４を溶接、その他の方法により接合した枠型の構造を得る。   Separately, the rod-shaped frame members 101, 102, 103 and 104 are joined to obtain a frame structure. That is, the projection 103a of the rod-shaped frame member 103 and the projection 104a of the rod-shaped frame member 104 are fitted into the concave portions 101a and 101b of the rod-shaped frame member 101, and the adhesive or the microplasma that reduces heat input as much as possible. Using a welding machine such as a laser or TIG (Tungsten Inert Gas Welding), the entire joint surface is joined without deformation and the entire joint surface is joined in the case of adhesive bonding at the joint, and the joint surface surface layer is joined in the case of welding. Next, the convex portions 103b of the rod-shaped frame member 103 and the convex portions 104b of the rod-shaped frame member 104 are fitted into the concave portions 102a and 102b of the rod-shaped frame member 102, and are joined by welding or other methods. In this way, a frame-type structure in which the rod-shaped frame members 101, 102, 103 and 104 are joined by welding or other methods is obtained.

そして、棒状枠部材１０１、１０２、１０３および１０４を接合した矩形形状の枠構造の開口部に、棒状仕切り部材１０５、１０６および１０７を接合した十字型の仕切り部材を嵌め込み接合する。この際、凹部１０１ｃ、１０２ｃ、１０３ｃおよび１０４ｃの部分を加熱し、凹部１０１ｃに端部１０５ａを、凹部１０３ｃに端部１０７ｃを、凹部１０４ｃに端部１０７ｄを、凹部１０２ｃに端部１０６ａをそれぞれ嵌め込む。そして、図２に示す接合状態を得る。   Then, a cross-shaped partition member in which the rod-like partition members 105, 106, and 107 are joined is fitted into and joined to the opening of the rectangular frame structure in which the rod-like frame members 101, 102, 103, and 104 are joined. At this time, the concave portions 101c, 102c, 103c and 104c are heated, and the end portion 105a is fitted into the concave portion 101c, the end portion 107c is fitted into the concave portion 103c, the end portion 107d is fitted into the concave portion 104c, and the end portion 106a is fitted into the concave portion 102c. Include. And the joining state shown in FIG. 2 is obtained.

（蒸着工程）
以下、図１および２に示す蒸着用フォルダを用いた蒸着工程の一例を説明する。図３は、図２に示す蒸着用フォルダ１００に固定される蒸着マスクを示す正面図である。図３に示す蒸着マスク２００は、蒸着用フォルダ１００と同じ材質であり、枠状の縁部２０１とその内側の蒸着材料通過部２０２を備えている。蒸着材料通過部２０２は、パンチングメタルと同様な構造であり、多数の円形の孔が形成された構造とされている。このようなマスクの構造とすることで、被蒸着面に対する蒸着状態の均一性を高めている。 (Deposition process)
Hereinafter, an example of the vapor deposition process using the vapor deposition folder shown in FIGS. 1 and 2 will be described. FIG. 3 is a front view showing a vapor deposition mask fixed to the vapor deposition folder 100 shown in FIG. The vapor deposition mask 200 shown in FIG. 3 is made of the same material as the vapor deposition folder 100 and includes a frame-shaped edge portion 201 and a vapor deposition material passage portion 202 inside thereof. The vapor deposition material passage portion 202 has the same structure as punching metal, and has a structure in which a large number of circular holes are formed. By adopting such a mask structure, the uniformity of the deposition state with respect to the deposition surface is enhanced.

図４は、図３に示す蒸着マスク２００を図２に示す蒸着用フォルダ１００に固定した状態を示す正面図である。図４に示す構造において、蒸着マスク２００は、その縁部２０１および蒸着材料通過部２０２が、蒸着用フォルダ１００に溶接により固定されている。なお、固定の方法としては、溶接以外に、ろう付け、接着剤による接着、さらにこれら接合手段の複数の組み合わせを利用することもできる。   4 is a front view showing a state in which the vapor deposition mask 200 shown in FIG. 3 is fixed to the vapor deposition folder 100 shown in FIG. In the structure shown in FIG. 4, the vapor deposition mask 200 has an edge 201 and a vapor deposition material passage 202 fixed to the vapor deposition folder 100 by welding. As a fixing method, in addition to welding, brazing, adhesion with an adhesive, and a plurality of combinations of these joining means can be used.

図５は、蒸着を行う状態を示す概念図である。図５は、図示省略した蒸着装置内部において、被蒸着フィルム５０１の表面に蒸着を行う様子が概念的に示されている。図５に示すように、被蒸着フィルム５０１は、図２に示す蒸着用フォルダ１００によって台座５０２（試料台）に押し付けられて下向きに固定されている。蒸着用フィルダ１００は、ビス５０３によって台座５０２に固定されている。また、蒸着用フィルダ１００には、図４に示す状態で蒸着マスク２００が固定されている。被蒸着フィルム５０１は、材質が有機樹脂であり、その表面にＥＬ材料が蒸着される。被蒸着フィルム５０１は、他の材料の基板等であってもよい。符号５０４は、蒸発源である。蒸発源５０４には、ＥＬ材料の原料が配置される。   FIG. 5 is a conceptual diagram showing a state in which vapor deposition is performed. FIG. 5 conceptually shows how vapor deposition is performed on the surface of the film to be deposited 501 inside the vapor deposition apparatus (not shown). As shown in FIG. 5, the film to be vapor-deposited 501 is fixed downward by being pressed against the pedestal 502 (sample stage) by the vapor deposition folder 100 shown in FIG. The deposition filter 100 is fixed to the pedestal 502 with screws 503. Further, a vapor deposition mask 200 is fixed to the vapor deposition filter 100 in the state shown in FIG. The film to be deposited 501 is made of an organic resin, and an EL material is deposited on the surface thereof. The deposited film 501 may be a substrate made of other materials. Reference numeral 504 is an evaporation source. In the evaporation source 504, a raw material of EL material is arranged.

図５に示すように、被蒸着フィルム５０１を台座５０２に固定した状態において、雰囲気を減圧にし、蒸発源５０４を加熱する。この際、蒸発したＥＬ材料が矢印５０５によって示されるように雰囲気中に飛び出し、それが蒸着マスク２００を介して、被蒸着フィルム５０１に付着する。こうして、ＥＬ材料の膜が被蒸着フィルム５０１の表面に形成される。蒸発源５０４の加熱方法は、公知の方法、例えば抵抗加熱方式、電子ビーム加熱方式、高周波誘導加熱方式、レーザー加熱方式等から選ばれた方法が利用される。   As shown in FIG. 5, in a state where the film to be deposited 501 is fixed to the pedestal 502, the atmosphere is reduced in pressure and the evaporation source 504 is heated. At this time, the evaporated EL material jumps out into the atmosphere as indicated by an arrow 505, and adheres to the film to be deposited 501 through the vapor deposition mask 200. In this way, a film of EL material is formed on the surface of the film to be deposited 501. As a method for heating the evaporation source 504, a known method such as a resistance heating method, an electron beam heating method, a high frequency induction heating method, a laser heating method, or the like is used.

（作用効果）
図２に示す蒸着用フォルダ１００は、棒状部材により構成されているので、部材自体に加えられる切削加工のような加工の加工量を少なくすることができる。このため、歪や素材の残留応力を小さくすることができ、これら歪や残留応力に起因する熱変形を抑えることができる。また、各部材がインロー構造により接合されているので、全体の一体性を高めることができ、この点も熱変形を抑える上で有用となる。また、アンバー合金によって構成することで、熱による材質自体の膨張収縮を抑えることができる。また蒸着用フォルダ１００のインロー構造を締り嵌め構造とすることで、各棒状部材同士の一体性をより高めることができ、熱による変形を最小限に抑えることができる。 (Function and effect)
Since the evaporation folder 100 shown in FIG. 2 is composed of a rod-shaped member, the amount of processing such as cutting applied to the member itself can be reduced. For this reason, the strain and the residual stress of the material can be reduced, and the thermal deformation caused by the strain and the residual stress can be suppressed. Moreover, since each member is joined by the spigot structure, the whole integrity can be improved, and this point is also useful for suppressing thermal deformation. Moreover, by comprising an amber alloy, the expansion and contraction of the material itself due to heat can be suppressed. Moreover, by making the inlay structure of the deposition folder 100 into an interference fit structure, the integrity of the rod-shaped members can be further increased, and deformation due to heat can be minimized.

また、図１に示すマスク伸縮緩衝用溝１０１ｄ、１０２ｄ、１０３ｄ、１０４ｄ、１０５ｃ、１０６ｃ、および１０７ｅを設けることで、熱変形に伴う蒸着マスク２００（例えば図４参照）の平坦性の悪化を抑えることができる。蒸着マスク２００は、蒸着時の熱により膨張するが、薄い平板構造であるので、内側が十字に仕切られた枠型の蒸着用フォルダ１００と同じように膨張はせず、両者の間の熱変形に微妙な違いがある。この熱変形の微妙な違いは、マスク伸縮緩衝用溝１０１ｄ、１０２ｄ、１０３ｄ、１０４ｄ、１０５ｃ、１０６ｃ、および１０７ｅの凹型の断面構造が変形することで吸収される。これにより、上述の熱変形の違いに起因して蒸着マスク２００に波打つような変形が生じることが抑えられ、その平坦性が確保される。   Further, by providing the mask expansion / contraction buffering grooves 101d, 102d, 103d, 104d, 105c, 106c, and 107e shown in FIG. 1, deterioration of flatness of the vapor deposition mask 200 (see, for example, FIG. 4) due to thermal deformation is suppressed. be able to. Although the vapor deposition mask 200 expands due to heat during vapor deposition, since it has a thin flat plate structure, the vapor deposition mask 200 does not expand in the same manner as the frame-type vapor deposition folder 100 partitioned inside in a cross shape, and thermal deformation between the two. There are subtle differences. This subtle difference in thermal deformation is absorbed by deformation of the concave cross-sectional structure of the mask expansion / contraction buffer grooves 101d, 102d, 103d, 104d, 105c, 106c, and 107e. Thereby, it is suppressed that the wave-like deformation | transformation arises in the vapor deposition mask 200 resulting from the difference of the above-mentioned thermal deformation, and the flatness is ensured.

（２） 第２の実施形態
（構成）
次に、伸縮追従機構を備えた蒸着用フォルダの例を説明する。図６は、伸縮追従機構を備えた蒸着用フォルダの一例を示す概念図である。図６に示す蒸着用フォルダ６００の基本的な構造は、図１および図２に示す蒸着用フォルダ１００と同じである。蒸着用フォルダ６００が蒸着用フォルダ１００と異なるのは、蒸着用フォルダ６００を図示しない台座に固定するためのネジ孔の構造にある。 (2) Second embodiment (configuration)
Next, an example of the evaporation folder provided with the expansion / contraction follow-up mechanism will be described. FIG. 6 is a conceptual diagram showing an example of a deposition folder provided with an expansion / contraction follow-up mechanism. The basic structure of the evaporation folder 600 shown in FIG. 6 is the same as that of the evaporation folder 100 shown in FIGS. The vapor deposition folder 600 is different from the vapor deposition folder 100 in the structure of screw holes for fixing the vapor deposition folder 600 to a pedestal (not shown).

図６に示すように、蒸着用フォルダ６００の四隅には、ネジ孔６０１ａ〜６０１ｄが設けられている。ネジ孔６０１ａは、ネジか挿入されるカラー付きワッシャーの外径よりやや大きい内径の円孔である。ネジ孔６０１ｂ、６０１ｃおよび６０１ｄは、蒸着用フォルダ６００の対角線方向に延在した長孔形状を有している。   As shown in FIG. 6, screw holes 601 a to 601 d are provided at the four corners of the evaporation folder 600. The screw hole 601a is a circular hole having an inner diameter slightly larger than the outer diameter of the collared washer into which a screw is inserted. The screw holes 601b, 601c and 601d have a long hole shape extending in the diagonal direction of the evaporation folder 600.

図７は、図６に示す蒸着用フィルダ６００を台座６０２に固定した状態におけるネジ孔６０１ａ付近の状態を示す上面図である。図８は、図７のＡ−Ａ’の線で切った断面構造を示す断面図である。図８に示すように、被蒸着フィルム６０５は、台座６０２に蒸着用フォルダ６００によって押さえ付けられて固定されている。図７には、蒸着用フォルダ６００を台座６０２に固定するためのネジ６０６ａが示されている。ネジによるフォルダ６００の台座６０２への固定は、他のネジ孔６０１ｂ〜６０１ｄにおいても行われている。また、蒸着用フォルダ６００には、蒸着マスク６０３が溶接により固定されている。図８において、符号６０４が溶接部分である。   FIG. 7 is a top view showing a state in the vicinity of the screw hole 601a in a state where the deposition filter 600 shown in FIG. 6 is fixed to the pedestal 602. FIG. FIG. 8 is a cross-sectional view showing a cross-sectional structure taken along the line A-A ′ of FIG. 7. As shown in FIG. 8, the film to be deposited 605 is pressed and fixed to the pedestal 602 by the deposition folder 600. FIG. 7 shows a screw 606 a for fixing the deposition folder 600 to the pedestal 602. The fixing of the folder 600 to the pedestal 602 with screws is also performed in the other screw holes 601b to 601d. A vapor deposition mask 603 is fixed to the vapor deposition folder 600 by welding. In FIG. 8, reference numeral 604 is a welded portion.

図８に示すように、ネジ孔６０１ａには、カラー付ワッシャー６０７ａを介してネジ６０６ａが挿入されている。ネジ孔６０１ａの内径には余裕が確保されており、ネジ６０６ａによる固定点に対して蒸着用フォルダ６００の変位が僅かではあるが許容されるようになっている。ネジ孔６０１ａの形状は、丸形であるので、この変位は、面内において自在な方向に行うことができる。   As shown in FIG. 8, a screw 606a is inserted into the screw hole 601a via a collared washer 607a. A margin is secured in the inner diameter of the screw hole 601a, and a slight displacement of the evaporation folder 600 with respect to the fixing point by the screw 606a is allowed. Since the shape of the screw hole 601a is round, this displacement can be performed in any direction in the plane.

次に図６に示すネジ孔６０１ｂ、６０１ｃおよび６０１ｄの部分における台座への固定構造について説明する。この３箇所における固定構造は、基本的に同じである。以下、ネジ孔６０１ｂの部分における固定構造を代表的に示し説明する。図９は、蒸着用フィルダ６００を台座６０２に固定した状態におけるネジ孔６０１ｂ（図６参照）付近の状態を示す上面図である。図１０は、図９のＢ−Ｂ’の線で切った断面構造を示す断面図である。図１０に示すように、ネジ孔６０１ｂには、カラー付ワッシャー６０７ｂを介してネジ６０６ｂが挿入されている。ネジ孔６０１ｂの長手方向に直交する方向（幅方向）の寸法は、カラー付きワッシャー６０７ｂの円筒部の外径に合わせた寸法になっている。このため、カラー付きワッシャー６０７ｂは、ネジ孔６０１ｂの長手方向へは相対的に動けるが、幅方向へは殆ど動けない。なお、蒸着マスク６０３および被蒸着フィルム６０５については、図７および図８に関して説明したのと同じである。また蒸着時には、図５に示すように被蒸着面を下に向け、ＥＬ材料の蒸着が行われる。また、蒸着用フォルダ６００の製造方法は、第１の実施形態の場合と同じであるので、説明は省略する。   Next, a structure for fixing to the base at the screw holes 601b, 601c and 601d shown in FIG. 6 will be described. The fixing structures at these three locations are basically the same. Hereinafter, the fixing structure at the screw hole 601b will be representatively described. FIG. 9 is a top view showing a state in the vicinity of the screw hole 601b (see FIG. 6) in a state where the deposition filter 600 is fixed to the pedestal 602. FIG. FIG. 10 is a cross-sectional view showing a cross-sectional structure taken along the line B-B ′ of FIG. 9. As shown in FIG. 10, a screw 606b is inserted into the screw hole 601b through a collared washer 607b. The dimension in the direction (width direction) orthogonal to the longitudinal direction of the screw hole 601b is a dimension that matches the outer diameter of the cylindrical portion of the collared washer 607b. For this reason, the washer 607b with a collar can move relatively in the longitudinal direction of the screw hole 601b, but hardly moves in the width direction. Note that the vapor deposition mask 603 and the vapor deposition film 605 are the same as those described with reference to FIGS. At the time of vapor deposition, as shown in FIG. 5, the surface to be vapor-deposited faces down and the EL material is deposited. Further, the manufacturing method of the evaporation folder 600 is the same as that in the first embodiment, and the description thereof is omitted.

このように、蒸着用フォルダを４箇所で台座にネジで固定し、そのうち３箇所を蒸着用フォルダの対角線方向に延在した長孔とする。また、残りの一箇所を円孔（好ましくは、ネジが少し動くことができる拡径された円孔）とする。こうすることで、蒸着用フォルダが熱変形しても、各固定部がその変形に追従し、蒸着用フォルダの２次元的な変形が許容される。このため、蒸着用フォルダの３次元的な変形が抑えられ、蒸着用フォルダの平坦性を保つことができる。   Thus, the folder for vapor deposition is fixed to the pedestal at four locations with screws, and three of them are elongated holes extending in the diagonal direction of the folder for vapor deposition. Further, the remaining one portion is a circular hole (preferably an enlarged circular hole through which the screw can move a little). By doing so, even if the deposition folder is thermally deformed, each fixing portion follows the deformation, and two-dimensional deformation of the deposition folder is allowed. For this reason, the three-dimensional deformation | transformation of the folder for vapor deposition is suppressed, and the flatness of the folder for vapor deposition can be maintained.

なお、ネジの代わりにピンで蒸着用フォルダを台座に固定してもよい。また、固定に利用する孔を蒸着用フォルダではなく台座側に設けてもよい。この場合、蒸着用フォルダ側に台座側の固定用孔に挿入されるピンが配置される。   In addition, you may fix the folder for vapor deposition to a base with a pin instead of a screw. Moreover, you may provide the hole utilized for fixation in the pedestal side instead of the folder for vapor deposition. In this case, a pin inserted into the fixing hole on the pedestal side is disposed on the evaporation folder side.

（作用効果）
図７〜１０に示す蒸着用フォルダ６００の台座６０２への固定構造によれば、蒸着工程において蓄熱が進行し、蒸着用フォルダ６００が膨張しても、台座への固定部分がその変形に追従し動く。そのため、蒸着用フォルダ６００の波打つような変形を抑えることができ、熱変形により蒸着用フォルダ６００の平坦性が損なわれないようにすることができる。 (Function and effect)
According to the structure for fixing the evaporation folder 600 to the pedestal 602 shown in FIGS. 7 to 10, even if heat accumulation proceeds in the evaporation process and the evaporation folder 600 expands, the fixing portion to the pedestal follows the deformation. Move. Therefore, the undulating deformation of the evaporation folder 600 can be suppressed, and the flatness of the evaporation folder 600 can be prevented from being impaired by thermal deformation.

すなわち、蓄熱が進むと蒸着用フォルダ６００は、膨張し主に２次元的に変形しようとする。ネジ孔６０１ｂ〜６０１ｃは、蒸着用フォルダ６００の対角線方向に延在した長孔であるので、この２次元的な変形に伴ってネジがこの長孔内をスライドする。これにより、ネジ孔６０１を中心とした蒸着用フォルダ６００の台座面に平行な方向への変形が許容され、蒸着用フィルダ６００の波打つような変形の発生が抑えられる。そして、蒸着用フォルダ６００の平坦性の悪化を抑えることができる。蒸着用フォルダ６００の平坦性の悪化が抑えられることで、蒸着マスク６０３の投影角の変化が抑えられ、蒸着材料の均一な定着を行うことができる。   That is, as heat storage proceeds, the evaporation folder 600 expands and tends to deform mainly two-dimensionally. Since the screw holes 601b to 601c are long holes extending in the diagonal direction of the deposition folder 600, the screws slide in the long holes along with the two-dimensional deformation. Thereby, the deformation | transformation to the direction parallel to the base surface of the folder 600 for vapor deposition centering on the screw hole 601 is accept | permitted, and generation | occurrence | production of the wavy deformation | transformation of the vapor deposition filter 600 is suppressed. And the deterioration of the flatness of the vapor deposition folder 600 can be suppressed. By suppressing the deterioration of the flatness of the evaporation folder 600, the change in the projection angle of the evaporation mask 603 can be suppressed, and the evaporation material can be fixed uniformly.

（３） 第３の実施形態
次に第２の実施形態において、蒸着用フォルダに伸縮緩衝機構を配置した態様を説明する。図１１は、伸縮緩衝機構を備えた蒸着用フォルダの一例を示す概念図である。図１１に示す蒸着用フォルダ７００は、図６に示す蒸着用フォルダにおいて、棒状枠部材１０１、１０２、１０３および１０４に、表面から裏面に貫通する複数の孔７０１を形成している。この複数の孔７０１以外は、図６に示す構成と同じである。 (3) Third Embodiment Next, in the second embodiment, an aspect in which an expansion / contraction buffer mechanism is arranged in the evaporation folder will be described. FIG. 11 is a conceptual diagram showing an example of a deposition folder provided with an expansion / contraction buffering mechanism. A vapor deposition folder 700 shown in FIG. 11 has a plurality of holes 701 penetrating from the front surface to the back surface in the rod-shaped frame members 101, 102, 103, and 104 in the vapor deposition folder shown in FIG. Except for the plurality of holes 701, the configuration is the same as that shown in FIG.

孔７０１は、その径が、棒状部材の幅の１０〜２５％程度であり、その開口率が１５〜２５％程度であることが望ましい。孔７０１の径が上記の範囲を下回ると、その効果が発揮されず、上記の範囲を上回ると、蒸着用フォルダ７００の強度が低下する。また、開口効率が上記の範囲を下回ると、その効果が発揮されず、上記の範囲を上回ると、蒸着用フォルダ７００の強度が低下する。なお、開口率は、棒状部材の孔７０１が形成されている面の面積に対する孔７０１の総面積の割合、として定義される。   The diameter of the hole 701 is preferably about 10 to 25% of the width of the rod-shaped member, and the opening ratio is preferably about 15 to 25%. If the diameter of the hole 701 is less than the above range, the effect is not exhibited, and if it exceeds the above range, the strength of the evaporation folder 700 is lowered. If the opening efficiency is below the above range, the effect is not exhibited. If the opening efficiency is above the above range, the strength of the vapor deposition folder 700 is reduced. The aperture ratio is defined as the ratio of the total area of the holes 701 to the area of the surface on which the hole 701 of the rod-shaped member is formed.

この態様によれば、蒸着用フォルダ７００の周囲枠部分を構成する棒状部材において、温度分布に大きな勾配が生じないようにすることができる。また孔の部分において熱応力が緩衝され、部分的な応力の集中を防ぐことができる。これにより、蒸着用フォルダ７００全体の変形を抑えることができる。また、複数の孔が形成されることで蒸着用フォルダ７００の重量を軽減することができる。   According to this aspect, it is possible to prevent a large gradient from occurring in the temperature distribution in the rod-shaped member constituting the peripheral frame portion of the vapor deposition folder 700. Further, thermal stress is buffered at the hole portion, and partial concentration of stress can be prevented. Thereby, the deformation | transformation of the folder 700 for vapor deposition can be suppressed. Moreover, the weight of the evaporation folder 700 can be reduced by forming a plurality of holes.

孔７０１の形状は、円に限定されず、楕円や多角形でもよい。また、孔７０１は、裏面側に貫通していなくてもよいが、緩衝効果を最大限発揮させるには、貫通孔であることが好ましい。   The shape of the hole 701 is not limited to a circle, and may be an ellipse or a polygon. Moreover, the hole 701 does not need to penetrate to the back surface side, but is preferably a through hole in order to maximize the buffering effect.

本発明は、蒸着マスクを固定する蒸着用治具に利用することができる。   The present invention can be used for a vapor deposition jig for fixing a vapor deposition mask.

発明を利用した蒸着用フォルダの分解状態を示す分解図である。It is an exploded view which shows the decomposition | disassembly state of the folder for vapor deposition using invention. 発明を利用した蒸着用フィルダを示す上面図である。It is a top view which shows the filter for vapor deposition using invention. 蒸着マスクを示す上面図である。It is a top view which shows a vapor deposition mask. 発明を利用した蒸着用フォルダに蒸着マスクを固定した状態を示す上面図である。It is a top view which shows the state which fixed the vapor deposition mask to the folder for vapor deposition using invention. 蒸着の様子を示す概念図である。It is a conceptual diagram which shows the mode of vapor deposition. 伸縮追従機構を備えた蒸着用フォルダの概要を示す概念図である。It is a conceptual diagram which shows the outline | summary of the folder for vapor deposition provided with the expansion-contraction follow-up mechanism. 図６に示す蒸着用フォルダの台座への固定部分を示す拡大図である。It is an enlarged view which shows the fixing part to the base of the folder for vapor deposition shown in FIG. 図７のＡ−Ａ’の線で切った断面を示す断面図である。FIG. 8 is a cross-sectional view showing a cross section taken along line A-A ′ of FIG. 7. 図６に示す蒸着用フォルダの台座への固定部分を示す拡大図である。It is an enlarged view which shows the fixing part to the base of the folder for vapor deposition shown in FIG. 図９のＢ−Ｂ’の線で切った断面を示す断面図である。FIG. 10 is a cross-sectional view showing a cross section taken along line B-B ′ of FIG. 9. 伸縮緩衝機構を備えた蒸着用フォルダの概要を示す概念図である。It is a conceptual diagram which shows the outline | summary of the folder for vapor deposition provided with the expansion-contraction buffer mechanism.

符号の説明Explanation of symbols

１００…蒸着用フォルダ、１０１…棒状枠部材、１０１ｄ…マスク伸縮緩衝用溝、１０２…棒状枠部材、１０２ｄ…マスク伸縮緩衝用溝、１０３…棒状枠部材、１０３ｄ…マスク伸縮緩衝用溝、１０４…棒状枠部材、１０４ｄ…マスク伸縮緩衝用溝、１０５…棒状仕切り部材、１０５ｃ…マスク伸縮緩衝用溝、１０６…棒状仕切り部材、１０６ｃ…マスク伸縮緩衝用溝、１０７…棒状仕切り部材、１０７ｅ…マスク伸縮緩衝用溝、２００…蒸着マスク、５０１…被蒸着フィルム、５０２…台座、６００…蒸着用フォルダ、６０１ａ〜ｃ…ネジ孔、６０２…台座、６０３…蒸着マスク、６０４…溶接箇所、６０５…被蒸着フィルム、６０６ａ…ネジ、６０６ｂ…ネジ、６０７ａ…カラー付ワッシャー、６０７ｂ…カラー付ワッシャー、７００…蒸着用フォルダ、７０１…孔。   DESCRIPTION OF SYMBOLS 100 ... Deposition folder, 101 ... Bar-shaped frame member, 101d ... Mask expansion / contraction buffer groove, 102 ... Bar-shaped frame member, 102d ... Mask expansion / contraction buffer groove, 103 ... Bar-shaped frame member, 103d ... Mask expansion / contraction buffer groove, 104 ... Rod-shaped frame member, 104d ... Mask expansion / contraction buffer groove, 105 ... Bar-shaped partition member, 105c ... Mask expansion / contraction buffer groove, 106 ... Bar-shaped partition member, 106c ... Mask expansion / contraction buffer groove, 107 ... Bar-shaped partition member, 107e ... Mask expansion / contraction Buffer groove, 200 ... deposition mask, 501 ... deposition film, 502 ... pedestal, 600 ... deposition folder, 601a-c ... screw hole, 602 ... pedestal, 603 ... deposition mask, 604 ... welding point, 605 ... deposition. Film, 606a ... Screw, 606b ... Screw, 607a ... Washer with collar, 607b ... Washer with collar, 700 ... Wear folder, 701 ... hole.

Claims (7)

被蒸着部材に蒸着マスクを固定する蒸着用治具であって、
炭素鋼よりも線膨張係数が低い材質の複数の棒状部材と、
前記複数の棒状部材を接合するインロー構造と
を備えていることを特徴とする蒸着用治具。 A vapor deposition jig for fixing a vapor deposition mask to a vapor deposition member,
A plurality of rod-shaped members made of a material having a lower linear expansion coefficient than carbon steel;
And a spigot structure for joining the plurality of rod-shaped members. 前記インロー構造は、締り嵌め構造を有することを特徴とする請求項１に記載の蒸着用治具。   The evaporation jig according to claim 1, wherein the inlay structure has an interference fit structure. 前記蒸着用治具は、当該蒸着用治具を台座に対して変位可能な状態で固定する伸縮追従機構を備えることを特徴とする請求項１または２に記載の蒸着用治具。   The vapor deposition jig according to claim 1, wherein the vapor deposition jig includes an expansion and contraction tracking mechanism that fixes the vapor deposition jig in a displaceable state with respect to the pedestal. 前記伸縮追従機構は、長孔を介したビスによる固定手段を備えることを特徴とする請求項３に記載の蒸着用治具。   The said expansion-contraction follower mechanism is equipped with the fixing means by the bis | screw through a long hole, The jig | tool for vapor deposition of Claim 3 characterized by the above-mentioned. 前記蒸着用治具は、前記棒状部材に形成された複数の孔により構成される伸縮緩衝機構を備えることを特徴とする請求項１〜４のいずれかに記載の蒸着用治具。   The said jig for vapor deposition is equipped with the expansion-contraction buffer mechanism comprised by the some hole formed in the said rod-shaped member, The jig for vapor deposition in any one of Claims 1-4 characterized by the above-mentioned. 前記棒状部材には、蒸着マスクの熱変形を吸収するマスク伸縮緩衝用溝が設けられていることを特徴とする請求項１〜５のいずれかに記載の蒸着用治具。   The vapor deposition jig according to claim 1, wherein the rod-shaped member is provided with a mask expansion / contraction buffer groove that absorbs thermal deformation of the vapor deposition mask. 前記棒状部材は、Ｓｉ：０．００１〜０．３重量％、Ｍｎ：０．０１〜０．５重量％、Ｎｉ：３０〜４５重量％、Ａｌ：０．００５重量％以下を含有し、残部が実質的にＦｅおよび不可避的不純物よりなる合金を構成材料とすることを特徴とする請求項１〜６のいずれかに記載の蒸着用治具。   The rod-like member contains Si: 0.001 to 0.3 wt%, Mn: 0.01 to 0.5 wt%, Ni: 30 to 45 wt%, Al: 0.005 wt% or less, and the balance The vapor deposition jig according to any one of claims 1 to 6, wherein the material is an alloy substantially composed of Fe and inevitable impurities.
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US20110146573A1 (en) * 2009-12-17 2011-06-23 Samsung Mobile Display Co., Ltd. Mask assembly for thin film deposition of flat panel display
US20120325143A1 (en) * 2011-06-21 2012-12-27 Kang Taek-Kyo Mask frame assembly for thin-film deposition
CN103427047A (en) * 2012-05-24 2013-12-04 三星显示有限公司 Mask support frame and mask assembly having the same
JP2015065472A (en) * 2014-12-10 2015-04-09 東京エレクトロン株式会社 Ring-shaped shield member, component thereof, and substrate placement stage equipped with ring-shaped shield member
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CN109119321A (en) * 2017-06-22 2019-01-01 东京毅力科创株式会社 Plasma processing apparatus
US10385441B2 (en) 2015-05-13 2019-08-20 Samsung Display Co., Ltd. Mask frame assembly and manufacturing method of the same
WO2020065829A1 (en) * 2018-09-27 2020-04-02 シャープ株式会社 Vapor deposition mask and manufacturing method for same

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US8343278B2 (en) 2009-02-05 2013-01-01 Samsung Display Co., Ltd Mask assembly and deposition and apparatus for a flat panel display using the same
JP2010180476A (en) * 2009-02-05 2010-08-19 Samsung Mobile Display Co Ltd Mask assembly, and vapor deposition apparatus for flat panel display device using the same
US20110146573A1 (en) * 2009-12-17 2011-06-23 Samsung Mobile Display Co., Ltd. Mask assembly for thin film deposition of flat panel display
US8550032B2 (en) * 2009-12-17 2013-10-08 Samsung Display Co., Ltd. Mask assembly for thin film deposition of flat panel display
US8631761B2 (en) * 2011-06-21 2014-01-21 Samsung Display Co., Ltd. Mask frame assembly for thin-film deposition
US20120325143A1 (en) * 2011-06-21 2012-12-27 Kang Taek-Kyo Mask frame assembly for thin-film deposition
KR101563789B1 (en) 2011-08-26 2015-10-27 도쿄엘렉트론가부시키가이샤 Ring-shaped shield member, components thereof and substrate mounting table comprising ring-shaped shield member
CN103427047A (en) * 2012-05-24 2013-12-04 三星显示有限公司 Mask support frame and mask assembly having the same
JP2015065472A (en) * 2014-12-10 2015-04-09 東京エレクトロン株式会社 Ring-shaped shield member, component thereof, and substrate placement stage equipped with ring-shaped shield member
CN107002219A (en) * 2014-12-10 2017-08-01 应用材料公司 Mask-placement for masking substrate in the processing chamber
US20170342541A1 (en) * 2014-12-10 2017-11-30 Applied Materials, Inc. Mask arrangement for masking a substrate in a processing chamber
US20190301002A1 (en) * 2014-12-10 2019-10-03 Applied Materials, Inc. Mask arrangement for masking a substrate in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a mask arrangement for masking a substrate in a processing chamber
US11718904B2 (en) 2014-12-10 2023-08-08 Applied Materials, Inc. Mask arrangement for masking a substrate in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a mask arrangement for masking a substrate in a processing chamber
US10385441B2 (en) 2015-05-13 2019-08-20 Samsung Display Co., Ltd. Mask frame assembly and manufacturing method of the same
CN109119321A (en) * 2017-06-22 2019-01-01 东京毅力科创株式会社 Plasma processing apparatus
CN109119321B (en) * 2017-06-22 2020-07-07 东京毅力科创株式会社 Plasma processing apparatus
WO2020065829A1 (en) * 2018-09-27 2020-04-02 シャープ株式会社 Vapor deposition mask and manufacturing method for same

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