JP2007281024A5 - - Google Patents

Claims (9)

Nozzle portion for picking up and picking up electronic components including solder ball electrodes, flux unit in which solder ball electrodes provided on the picked-up electronic components are immersed, and surface of the electronic components on which the solder ball electrodes are provided An illumination unit that illuminates a surface, a luminance detection unit that detects a luminance of the surface of the electronic component on which the solder ball electrode is provided, and a predetermined threshold value for the luminance of the solder ball electrode detected by the luminance detection unit An electronic component mounting apparatus having a control unit that performs control for determining a flux transfer defect when the height is higher. A nozzle unit that picks up and picks up an electronic component including a solder ball electrode, a flux unit in which a solder ball electrode provided on the picked-up electronic component is immersed, and a variable gate height, and the electronic component An illumination unit that illuminates the surface provided with the solder ball electrode, a luminance detection unit that images the surface of the electronic component provided with the solder ball electrode and detects luminance, and the solder ball electrode detected by the luminance detection unit An electronic component mounting apparatus having a control unit that performs determination control of a flux transfer failure when the luminance of the light is higher than a predetermined threshold. The electronic component mounting apparatus according to claim 1, wherein irradiation intensity of the illumination unit is changeable. The control unit notifies the operator to change the gate height of the flux unit or to change the gate height when the flux transfer failure occurs at a predetermined frequency or higher. Item 3. The electronic component mounting apparatus according to Item 2. A step of adsorbing and picking an electronic component having a solder ball electrode; a step of immersing a solder ball electrode provided on the adsorbed electronic component in a flux unit; and transferring a flux; and a solder of the adsorbed electronic component Illuminating the surface on which the ball electrode is provided, imaging the surface of the attracted electronic component on which the solder ball electrode is provided, detecting the luminance, and the detected luminance of the solder ball electrode is predetermined. An electronic component mounting method including a step of determining and controlling a flux transfer defect when the value is higher than a threshold value. A step of adsorbing and picking an electronic component having a solder ball electrode; a step of immersing a solder ball electrode provided on the adsorbed electronic component in a flux unit; and transferring a flux; and a solder of the adsorbed electronic component Illuminating the surface on which the ball electrode is provided; imaging the surface on which the solder ball electrode of the adsorbed electronic component is provided; and detecting the brightness; and the detected brightness of the solder ball electrode is predetermined. An electronic component mounting method comprising: determining and controlling a flux transfer failure when higher than a threshold value; and changing a gate height of the flux unit when a flux transfer failure occurs more than a predetermined frequency. A step of adsorbing and picking an electronic component having a solder ball electrode; a step of immersing a solder ball electrode provided on the adsorbed electronic component in a flux unit; and transferring a flux; and a solder of the adsorbed electronic component Illuminating the surface on which the ball electrode is provided, imaging the surface of the attracted electronic component on which the solder ball electrode is provided, detecting the luminance, and the detected luminance of the solder ball electrode is predetermined. An electronic component mounting method comprising the steps of: determining and controlling a flux transfer failure when higher than a threshold; and notifying that the gate height of the flux unit is changed when a flux transfer failure occurs more than a predetermined frequency . A step of immersing a solder ball electrode provided on the electronic component in a flux unit to transfer the flux; a step of illuminating a surface of the electronic component on which the solder ball electrode is provided; and a solder ball electrode of the electronic component. And detecting the brightness by picking up the surface, and when the detected brightness of the solder ball electrode is higher than a predetermined threshold, the electronic component is not mounted, and the brightness of all the detected solder ball electrodes And mounting the electronic component if it is equal to or less than a predetermined threshold. The electronic device by which the electronic component was mounted by the mounting method of any one of Claims 5 thru | or 8.