JP2007277419A - Damping adhesive composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a damping adhesive composition having a high damping property and an excellent adhesive property. <P>SOLUTION: This adhesive composition is characterized by compounding 100 pts.wt. of a resin substrate with 0.1 to 30 pts.wt. of a plate-like filler having an aspect ratio of ≥10 and a thickness of ≤100 nm. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a vibration-damping pressure-sensitive adhesive composition excellent in adhesiveness and vibration-damping properties.

  In recent years, vibrations and noises generated from automobiles, factories, air conditioning facilities, etc. have become social problems, and countermeasures are strongly desired. As a countermeasure, for example, a vibration-damping material that absorbs vibration is attached to a structure or equipment that is a source of vibration by using a vibration-damping adhesive, or other structures or equipment that are a source of vibration. A method of adhering these members with a vibration-damping adhesive is used.

  In general, the vibration damping property of a resin material is represented by a loss factor. The loss factor is a parameter indicating the degree to which vibration energy from the outside is converted into heat energy by internal friction. It is known that the loss coefficient shows a peak at a certain constant temperature, and that it is most effective when used near this peak temperature. However, the vibration-damping pressure-sensitive adhesive is required to maintain not only vibration damping properties but also a strong adhesive force in a vibration environment. Here, since the pressure-sensitive adhesive having a peak loss coefficient at room temperature has a low glass transition temperature, there is generally a problem that the cohesive force is small and the adhesive force to the substrate is weak. On the other hand, a pressure-sensitive adhesive having strong adhesive strength at room temperature generally has a problem that vibration damping properties are not good because of its high glass transition temperature. Therefore, many studies have been made to obtain a pressure-sensitive adhesive composition having high vibration damping properties and excellent adhesiveness.

  For example, it has been proposed to contain an active ingredient that increases the amount of dipole moment in an adhesive (Patent Document 1). However, there is a problem that the active ingredient is crystallized and easily peels off, or bleeds on the surface to reduce the adhesive strength. In addition, due to the influence of the additive, there is a problem that the peak temperature of the tangent loss increases and the adhesive strength decreases.

  Further, a method has been proposed in which a compound having a total of two or more hydroxyphenyl groups and / or substituted hydroxyphenyl groups is added to an adhesive to shift the peak temperature of the loss coefficient to -15 to 10 ° C (patent) Reference 2). However, the peak temperature of the loss coefficient is not normal temperature, and the vibration damping property and the adhesive strength are not sufficient.

On the other hand, from the viewpoint of environmental hygiene, a water-based pressure-sensitive adhesive is used instead of a solvent-based pressure-sensitive adhesive. However, compared to solvent-based pressure-sensitive adhesives, there is a problem that it is difficult to achieve both terminal peelability, holding power, and constant load peelability. On the other hand, for example, a method of adding inorganic particles that are bonded to a silane monomer while copolymerizing a silane monomer has been proposed (Patent Document 3). There is a problem that the wettability is deteriorated and the adhesion to the substrate is lowered. Also, although a method using a primer containing fine particles has been proposed (Patent Document 4), there is a problem that the number of steps of applying a primer increases.
WO99 / 64535 pamphlet JP 2003-165965 A JP 2002-241725 A JP 2000-265134 A

  As described above, the present situation is that a pressure-sensitive adhesive composition having both high vibration damping properties and excellent adhesiveness has not been obtained. Therefore, an object of the present invention is to provide a vibration-damping pressure-sensitive adhesive composition having high vibration damping properties and excellent adhesiveness.

  As a result of intensive studies to solve the above problems, the present inventors can obtain a pressure-sensitive adhesive composition excellent in vibration damping properties and adhesiveness by adding a plate-like filler having a specific aspect ratio. As a result, the present invention has been completed. That is, the vibration-damping adhesive composition of the present invention comprises 0.1 to 30 parts by weight of a plate-like filler having an aspect ratio of 10 or more and a thickness of 100 nm or less, based on 100 parts by weight of the resin base. It is what.

  Moreover, 0.1-20 weight part of coupling agents can also be mix | blended with 100 weight part of resin bases with the adhesive composition of this invention.

  Moreover, 0.3-30 weight part of spherical fillers with an average particle diameter of 100 nm or less can also be mix | blended with 100 weight part of resin bases with the adhesive composition of this invention.

  The pressure-sensitive adhesive composition of the present invention may also contain 0.1 to 10 parts by weight of resin particles having an average particle size of 1 μm or less with respect to 100 parts by weight of the resin base.

  Moreover, acrylic resin can be used for the resin base in the adhesive composition of this invention.

  Moreover, a plate-shaped filler, a layered clay mineral, and / or scale-like silica can be used for the adhesive composition of this invention. Furthermore, at least one selected from the group consisting of hydrotalcite, kaolin, halloysite, talc, mica, sericite, smectite, and vermiculite can be used as the layered clay mineral.

  According to the present invention, by using a composition comprising 0.1 to 30 parts by weight of a plate-like filler having an aspect ratio of 10 or more and a thickness of 100 nm or less with respect to 100 parts by weight of the resin base, 0.1 or more at room temperature. Thus, a vibration-damping pressure-sensitive adhesive composition having a high vibration-damping property having a loss factor, excellent adhesiveness, and excellent heat resistance can be obtained. The pressure-sensitive adhesive composition of the present invention can be applied to both water-based pressure-sensitive adhesives and solvent-based pressure-sensitive adhesives. The following effects can be obtained particularly when applied to a water-based pressure-sensitive adhesive. That is, it is possible to achieve both terminal peelability, holding power, and constant load peelability. In the case of water-based pressure-sensitive adhesives, conventionally, it was necessary to prepare a pressure-sensitive adhesive composition for each base material, but by using the pressure-sensitive adhesive composition of the present invention, it is not necessary to prepare a composition for each base material. Can do.

Hereinafter, embodiments of the present invention will be described in detail.
The vibration-damping adhesive composition of the present invention comprises 0.1 to 30 parts by weight of a plate-like filler having an aspect ratio of 10 or more and a thickness of 100 nm or less with respect to 100 parts by weight of a resin base.

  As the resin base, conventionally known pressure-sensitive adhesive resins such as acrylic resins, rubber resins, ethylene vinyl acetate resins, and natural rubber resins can be used. An acrylic resin is preferable. The acrylic resin is not particularly limited, and a known acrylic resin used for a solvent-soluble type, a water-dispersed type or a solvent-dispersed emulsion type, and an ultraviolet curable adhesive may be used. it can. The main monomers constituting the acrylic resin include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate. , T-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, etc. Acid alkyl ester monomers, hydroxyl group-containing (meth) acrylic monomers such as 2-hydroxyethyl (meth) acrylate, ethylenically unsaturated carboxylic acid monomers such as (meth) acrylic acid, dimethylaminoethyl Amino group-containing (meth) acrylic monomers such as (meth) acrylate, amide group-containing acrylic monomers such as (meth) acrylamide, and acrylic One or more nitrile group-containing (meth) acrylic monomers such as rhonitrile can be listed.

  Further, α-, β-ethylenically unsaturated carboxylic acids such as maleic acid, itaconic acid, crotonic acid, fumaric acid, sulfonic acid-containing vinyl monomers such as styrene sulfonic acid and vinyl sulfonic acid, or acids such as maleic anhydride Monomers such as anhydrides can also be copolymerized.

  Furthermore, a monomer that forms a urethane bond or a silicon-containing monomer can be copolymerized. As the monomer having a urethane bond, hexamethylene diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, isophorone diisocyanate, dicyclohexylhetane diisocyanate, or the like can be used. Silicon-containing monomers include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltributoxysilane, (meth) acryloyloxymethyltrimethoxysilane, (meth) acryloyloxyethyltrimethoxysilane , (Meth) acryloyloxypropyltrimethoxysilane, (meth) acryloyloxypropyltriethoxysilane, (meth) acryloyloxyethyltriethoxysilane, (meth) acryloyloxypropyltributoxysilane, and the like. Species or two or more can be used.

  The pressure-sensitive adhesive composition of the present invention is not particularly limited, and can be used for a solvent-based pressure-sensitive adhesive or a water-based pressure-sensitive adhesive, but is preferably used for a water-based pressure-sensitive adhesive, particularly a water-dispersed pressure-sensitive adhesive. This is because a solvent is not used, which is preferable in terms of environmental hygiene and has excellent solvent resistance. The water-dispersed pressure-sensitive adhesive can be produced, for example, by the following method.

For the production of the pressure-sensitive adhesive composition of the present invention, known emulsion polymerization methods such as batch emulsion polymerization, monomer-drop polymerization, and emulsion-monomer drop polymerization can be used.
As the radical production initiator used in the emulsion polymerization, those used in usual emulsion polymerization can be used. For example, organic peroxides such as benzoyl peroxide, t-butyl hydroperoxide, cumene hydroperoxide, azobiscyanovaleric acid, azobisisobutyronitrile, azobis (2,4-dimethyl) valeronitrile, 2,2 Organic azo compounds such as' -azobis (2-methylpropionamidine) dihydrochloride, inorganic water-soluble radical initiators such as potassium persulfate, ammonium persulfate, sodium persulfate, hydrogen peroxide, and these persulfates or In addition, a known redox initiator using a combination of a metal ion such as peroxide and iron ion and a reducing agent such as sodium pyrosulfite and L-ascorbic acid can also be used.

  Furthermore, a chain transfer agent can be added to adjust the molecular weight of the polymer particles as necessary. Examples thereof include alkyl mercaptans such as lauryl mercaptan, n-butyl mercaptan, t-butyl mercaptan, octyl mercaptan, n-dodecyl mercaptan, and α-methylstyrene dimer.

  Examples of the emulsifier used in emulsion polymerization include anionic emulsifiers such as sodium alkylallylsulfone succinate, sodium alkylbenzene sulfonate, sodium lauryl sulfate, sodium dioctyl sulfosuccinate, or ammonium salt, ethylene Reactive emulsifiers having ionic unsaturated double bonds, nonionic emulsifiers such as polyoxyethylene alkyl ethers, polyoxyethylene-polyoxypropylene block copolymers, cationic surfactants, amphoteric surfactants, etc. be able to. Further, water-soluble polymers such as polyvinyl alcohol and hydroxyethyl cellulose, and protective colloids such as water-soluble oligomers can also be used.

  Moreover, it is preferable that content of the polymer particle in the composition of this invention exists in the range of 40 to 60 weight% in solid content.

  In addition, it is preferable from the viewpoint of stability that the pH of the resin composition is adjusted in a neutral to alkaline range from 6.5 to 11.0 after the completion of the polymerization. As the neutralizing agent, ammonia, trimethylamine, propylamine, diethylamine, morpholine, dimethylethanol, triethanolamine and other amines, sodium hydroxide, potassium hydroxide and the like can be used.

  The plate-like filler used in the present invention is required to have an aspect ratio defined by (filler major axis / filler thickness) of 10 or more and a filler thickness of 100 nm or less, more preferably an aspect ratio. The ratio is 100 or more. Although details are not clear, the plate-like filler can improve the vibration damping property of the pressure-sensitive adhesive without impairing the adhesive property of the pressure-sensitive adhesive. Here, the plate-like filler includes a plate-like, flaky, and flaky filler. Preferable plate-like fillers used in the present invention include layered clay minerals and / or scaly silica. More preferably, it is a layered clay mineral, and at least one selected from the group consisting of hydrotalcite, kaolin, halloysite, talc, mica, sericite, smectite, and vermiculite can be used. Here, the smectite includes montmorillonite, saponite, beidellite, nontronite, and hectorite. More preferred is mica, particularly swellable mica.

  The addition amount of the plate-like filler is 0.3 to 30 parts by weight, more preferably 1 to 10 parts by weight with respect to 100 parts by weight of the resin base. This is because if the amount is less than 0.3 parts by weight, the vibration damping property is not sufficient, and if it exceeds 30 parts by weight, the adhesive strength is reduced.

  The layered clay mineral includes a hydrophilic type having a good affinity for water and a lipophilic type having a good affinity for a solvent in which organic molecules or organic ions are intercalated between layers. A hydrophilic type can be used for the water-dispersed pressure-sensitive adhesive, and a lipophilic type can be used for the solvent-dispersed pressure-sensitive adhesive.

  In addition to the plate-like filler, a spherical filler having a diameter of 100 nm or less or resin fine particles having a diameter of 1 μm or less can also be added. By using the plate-like filler together, vibration damping can be further improved. Although the details are not clear, the combination of the plate-like filler and the spherical filler produced the effect of promoting the absorption of vibration energy by generating an antiphase with respect to the force and shifting the phase of the vibration wave. Conceivable.

  Examples of the spherical filler having a diameter of 100 nm or less include silica, alumina, zirconia, calcium carbonate, titanium oxide, zinc oxide, calcium silicate, barium titanate, ferrite, and carbon black. More preferably, it is silica. The addition amount of the spherical filler is 0.3 to 30 parts by weight, more preferably 3 to 15 parts by weight with respect to 100 parts by weight of the resin base. The ratio of the plate-like filler is 0.5 to 50 (weight ratio) of spherical filler / plate-like filler, more preferably 0.5 to 5.

  In addition, resin fine particles having a diameter of 1 μm or less include silicone rubber fine particles, silicone resin particles, polyethylene fine particles, polypropylene fine particles, polyvinyl chloride fine particles, polymethyl methacrylate fine particles, poly n-butyl acrylate fine particles, crosslinked polystyrene fine particles, nylon fine particles, Examples thereof include melamine resin fine particles, polyurethane resin fine particles, polyvinyl acetate fine particles, polystyrene-vinyl acetate copolymer fine particles, polyester fine particles, and hollow polymers thereof. Preferably, it is a hollow particle of a methyl methacrylate-acrylonitrile copolymer. The addition amount of the resin fine particles is 0.1 to 30 parts by weight, and more preferably 0.1 to 5 parts by weight with respect to 100 parts by weight of the resin base. Further, the ratio of the plate filler to the resin particle / plate filler is 0.01 to 30 (weight ratio), more preferably 0.01 to 5.

Furthermore, a coupling agent can be added for the purpose of promoting the bonding between the resin base and the filler and improving the adhesion between the resin base and the adherend substrate. This coupling agent includes silane, titanate and aluminate coupling agents. As silane coupling agents, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 1,2-epoxy-4- (2-trimethoxysilylethyl) cyclohexane, 1,2-epoxy 2-alkoxy-4- (1-methyl-2-trimethoxysilylethyl) cyclohexane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and other epoxyalkoxysilanes, N-2 (aminoethyl) 3- Aminoalkoxysilanes such as aminopropylmethyldimethoxysilane, 3-ureidopropyltrimethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis (triethoxysilylpropyl) Tetrasulfide, 3-isocyanatopropyltriethoxysilane, vinylate It can be used ethoxy silane. Moreover, as a titanate coupling agent or an aluminate coupling agent, for example, Plenact (trade name: manufactured by Ajinomoto Co., Inc.) can be used. A preferred coupling agent is 3-glycidoxypropyltriethoxysilane. The addition amount of the coupling agent is 0.001 to 10 parts by weight, more preferably 0.01 to 2 parts by weight with respect to 100 parts by weight of the total amount of the resin base and the filler.
In addition, although a coupling agent can also be previously mix | blended with an adhesive composition, it is preferable to mix and use for an adhesive composition immediately before use of an adhesive. This is because the adhesion to the substrate can be improved without impairing the wettability to the substrate.

  Furthermore, a crosslinking agent can be added as necessary. Examples of the crosslinking agent include polyisocyanates such as tolylene diisocyanate and dicyclohexylmethane diisocyanate, aziridines, metal chelate compounds, and epoxy compounds. The holding power and heat resistance of the adhesive can be increased. In addition, it is preferable to add a crosslinking agent just after application | coating and after adding a coupling agent.

  The pressure-sensitive adhesive composition of the present invention can be used as a one-component curable pressure-sensitive adhesive or a two-component curable pressure-sensitive adhesive. When used as a two-component curable pressure-sensitive adhesive, it can be composed of a liquid A containing at least one monomer constituting the acrylic resin and a liquid B containing a curing agent. As the curing agent, for example, a water-soluble or water-dispersible epoxy curing agent or isocyanate curing agent can be used.

  A known additive, for example, a colorant, an antioxidant, an ultraviolet absorber, a plasticizer, a flame retardant, and the like can be added to the pressure-sensitive adhesive composition of the present invention as necessary.

  The loss factor of the pressure-sensitive adhesive composition of the present invention can be measured using a known method such as a mechanical impedance method. The loss coefficient at normal temperature (23 ° C.) is such that the value at 300 Hz in the mechanical impedance method is 0.1 or more, more preferably 0.11 or more.

  The pressure-sensitive adhesive composition of the present invention is held on the adherend substrates by coating or spraying, and the adherend substrates are pressure-bonded to each other, or the adherent substrate is pressure-bonded to another substrate, while being dried or ultraviolet-rayed. It can be used by being cured by irradiation to form an adhesive layer. The substrate to be bonded is not particularly limited, and it can be used for various parts such as automobile parts, home appliances, precision equipment, construction machinery, structures, polyethylene and urethane foam, gypsum board, wallpaper, and adhesive tape substrates. It can be applied to.

EXAMPLES Hereinafter, although this invention is demonstrated further in detail using an Example, this invention is not limited to these Examples.
(Sample preparation)
Using a 5.5 mil doctor blade, the adhesive composition was applied onto release paper and dried. The film thickness was adjusted to 50 to 55 microns by dry. After drying, the pressure-sensitive adhesive film was bonded to the substrate. A polyethylene foam (Softlon, manufactured by Sekisui Chemical Co., Ltd.), which is relatively difficult to adhere, was used as the substrate. It was passed through a 10 kg roll in an atmosphere of 23 ° C. and 65% RH. After curing for 2 days, it was affixed to a polypropylene plate and the adhesive properties were measured.

(Measurement of adhesive properties)
(1) The peel was measured with a sample having a size of (25 × 150 mm) at 23 ° C.
(2) The holding force was observed by suspending a 500 g weight at 23 ° C. for 60 minutes. The size of the bonding surface was 25 × 100 mm.
(3) The 90 ° C. constant load peel force was observed at 23 ° C. for 60 minutes by hanging a 500 g weight. The size of the bonding surface was 25 × 100 mm.
(4) Thermal creep resistance was measured under a temperature rising condition of 3 ° C./5 minutes by hanging a weight of 310 g. The size of the bonding surface was 25 × 25 mm.
(5) The bending test was observed for 1 hour in an environment of 80 ° C. × 95% RH. The size of the bonding surface was 40 × 30 mm.
(6) The curved surface sticking test was observed for 24 hours in an environment of 80 ° C. × 95% RH. The size of the bonding surface was 25 × 120 mm, and the curved surface was 60 mmφ.
In addition, the terminal peeling property was evaluated by a bending adhesion test and a curved surface adhesion test.

(Vibration evaluation)
Damping performance is 23 ° C at 300 Hz using a loss factor measuring device (3550) manufactured by B & K, using a vinyl chloride sheet (manufactured by High Pressure Gas Industry Co., Ltd.) on an aluminum plate with various adhesives and cantilever method. The loss factor was measured. The size of the aluminum plate is 10 x 150 x 1 mm, and the bonded surface is 10 x 130 mm.

Example 1.
100 parts by weight of water-dispersible one-component curable adhesive (LL-6000C manufactured by High Pressure Gas Industry Co., Ltd.) and swelling mica as a plate-like filler (Somasif MEB-3 manufactured by Coop Chemical Co., Ltd .: thickness is several nm, aspect ratio The adhesive composition was prepared by adding and mixing 5 parts by weight. Here, the resin base of the one-component curable pressure-sensitive adhesive used is an epoxy-modified butyl acrylate / 2-ethylhexyl acrylate / acrylic acid copolymer emulsion.

Example 2
Add 100 parts by weight of water-dispersible, two-part curable adhesive (LL-6000B, manufactured by High Pressure Gas Industry Co., Ltd.) 0.1 parts by weight of epoxy curing agent and 5 parts by weight of swelling mica (Somasif MEB-3, manufactured by Corp Chemical) -A pressure-sensitive adhesive composition was prepared by mixing. Here, the resin base of the two-component curable pressure-sensitive adhesive used is a butyl acrylate / 2-ethylhexyl acrylate / acrylic acid copolymer emulsion.

Example 3
Add and mix 5 parts by weight of swellable mica (Somasif MEB-3 by Corp Chemical) to 100 parts by weight of one-part curable adhesive containing 0.8% by weight of silicone macromer (LL-6000M manufactured by High Pressure Gas Industry Co., Ltd.) Immediately before coating, 0.5 part by weight of 3-glycidoxypropyltriethoxysilane (KBE-403 manufactured by Shin-Etsu Silicone) was added and mixed to prepare an adhesive composition. Here, the resin base of the one-component curable pressure-sensitive adhesive used is a silicon-modified butyl acrylate / 2-ethylhexyl acrylate / acrylic acid copolymer emulsion.

Example 4
A pressure-sensitive adhesive was prepared by adding and mixing 5 parts by weight of swellable mica (Somasif MEB-3 manufactured by Coop Chemical Co., Ltd.) to 100 parts by weight of a one-component curable pressure-sensitive adhesive (LL-6000C manufactured by High Pressure Gas Industry Co., Ltd.). Furthermore, immediately before coating, 0.5 parts by weight of 3-glycidoxypropyltriethoxysilane (KBE-403 manufactured by Shin-Etsu Silicone) was added to and mixed with the adhesive to prepare an adhesive composition.

Example 5 FIG.
A pressure-sensitive adhesive was prepared by adding and mixing 1 part by weight of swellable mica (Somasif MEB-3 manufactured by Corp Chemical Co., Ltd.) to 100 parts by weight of a one-component curable pressure-sensitive adhesive (LL-6000C manufactured by High Pressure Gas Industry Co., Ltd.). Further, 5 parts by weight of Aerosil 50 (manufactured by Nippon Aerosil Co., Ltd .: average particle size of 30 nm) as a spherical filler was added to and mixed with the adhesive to prepare an adhesive composition.

Example 6
To 100 parts by weight of a one-component curable pressure-sensitive adhesive (LL-6000C manufactured by High Pressure Gas Industry Co., Ltd.), 1 part by weight (Somasif MEB-3 manufactured by Corp Chemical Co.) was added and mixed to prepare a pressure-sensitive adhesive. Furthermore, 0.2 parts by weight of EXPANSEL 551DE (average particle size 30 to 50 μm), which is a microcapsule, was added and mixed as resin fine particles to the adhesive to prepare an adhesive composition.

Comparative Example 1
Only the one-pack curable adhesive (LL-6000C manufactured by High Pressure Gas Industry Co., Ltd.) was used without adding a plate-like filler.

Comparative Example 2
Aerosil 50 of fine powder silica (manufactured by Nippon Aerosil Co., Ltd .: average particle size) to 100 parts by weight of a one-part curable pressure-sensitive adhesive (LL-6000S, manufactured by High Pressure Gas Industry Co., Ltd.) copolymerized with 1 wt% of 3-methacryloxypropyltriethoxysilane 30 nm) 5 parts by weight were added and mixed to prepare an adhesive composition. Aerosil 50 has an aspect ratio of about 1. Here, the resin base of the one-part curable pressure-sensitive adhesive used is a silane coupling agent / butyl acrylate / 2-ethylhexyl acrylate / acrylic acid copolymer emulsion.

Comparative Example 3
Add and mix 5 parts by weight of non-swellable micro mica (Somasif MK-300 by Corp Chemical Co.) to 100 parts by weight of 1-component curable adhesive (LL-6000C by High Pressure Gas Industry Co., Ltd.). Prepared.

Comparative Example 4
100 parts by weight of one-component curable adhesive (LL-6000C manufactured by High Pressure Gas Industry Co., Ltd.), 5 parts by weight of swellable mica (Somasif MEB-3 manufactured by Corp Chemical Co., Ltd.) and philite 200/7 (Nippon Philite Co., Ltd.) (Product: average particle size 80 μm) 5 parts by weight were added and mixed to prepare an adhesive composition.

Comparative Example 5
Fuji balloon H-30 with 100 parts by weight of one-part curable adhesive (LL-6000C manufactured by High Pressure Gas Industry Co., Ltd.), 5 parts by weight of swellable mica (Somasif MEB-3 manufactured by Coop Chemical Co., Ltd.) and hollow glass particles as resin particles An adhesive was prepared by adding and mixing 5 parts by weight (manufactured by Fuji Silysia Chemical Ltd .: average particle size 40 μm).

Table 1.

Table 2.

Table 3.

As shown in Table 1, in the pressure-sensitive adhesive compositions of Examples 1 to 6, adhesiveness excellent in holding power, constant load peelability, and terminal peelability was obtained. On the other hand, in the case of the conventional adhesive which does not add a filler (comparative example 1), all of holding power, constant load peelability, and terminal peelability were insufficient. Moreover, even if it used the adhesive which copolymerized the silane coupling agent (comparative example 2), the sufficient effect was not able to be acquired. Moreover, even if a filler is added, Comparative Example 3 using non-swellable mica and Comparative Examples 4 and 5 using hollow glass particles have a holding power and a constant load peelability as compared with the case using swellable mica. In addition, a sufficient effect on the terminal peelability could not be obtained. Furthermore, as shown in Table 3, the pressure-sensitive adhesive compositions of Examples 1 to 6 gave a loss factor of 0.11 or more, which was larger than that of the comparative example, and were able to improve vibration damping properties.

Claims (7)

  A vibration-damping pressure-sensitive adhesive composition comprising 0.1 to 30 parts by weight of a plate-like filler having an aspect ratio of 10 or more and a thickness of 100 nm or less with respect to 100 parts by weight of a resin base.   The vibration-damping adhesive composition according to claim 1, wherein 0.1 to 20 parts by weight of a coupling agent is blended with 100 parts by weight of the resin base.   The vibration-damping adhesive composition according to claim 1 or 2, wherein 0.3 to 30 parts by weight of a spherical filler having an average particle size of 100 nm or less is blended with 100 parts by weight of the resin base.   The vibration-damping adhesive composition according to claim 1 or 2, wherein 0.1 to 10 parts by weight of resin particles having an average particle diameter of 1 µm or less are blended with 100 parts by weight of the resin base.   The vibration-damping adhesive composition according to any one of claims 1 to 4, wherein the resin base is an acrylic resin.   The vibration-damping adhesive composition according to any one of claims 1 to 5, wherein the plate-like filler is a layered clay mineral and / or scaly silica. The vibration-damping adhesive composition according to claim 6, wherein the layered clay mineral is at least one selected from the group consisting of hydrotalcite, kaolin, halloysite, talc, mica, sericite, smectite, and vermiculite.