JP2007273904A - Method for manufacturing camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a camera module whose hermetic property is not hurt between a frame and a wiring board by a stress during cutting. <P>SOLUTION: The method includes, at least, a solid imaging element loading step in which a solid imaging device is mounted corresponding to the wiring board on an assembly board formed with a plurality of wiring boards in a shape of a matrix; a frame loading step in which a frame is loaded and fixed by overlaying the solid imaging device on the wiring board of the assembly board; a partitioning step separating into each camera module by cutting according to a cut-off line established in accordance with the wiring board, before performing the partition step; a step which applies a stiffening component to a position which adjoins the cut-off line, and surrounds the fixing part of the frame and the wiring board for reinforcing the above fixing part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a camera module using a CCD, a CMOS, or the like.

  So far, camera modules using a solid-state imaging device such as a CCD or CMOS have been proposed in which the solid-state imaging device is accommodated in a sealed frame of a lens barrel.

  As a manufacturing method of the camera module, for example, there is a manufacturing method in which a solid-state imaging device and a frame are mounted on a wiring board having a plurality of product areas, and the wiring board is cut and divided into individual product areas. (See Patent Document 1)

  FIG. 4 is a top view of a collective substrate on which a solid-state imaging device and electronic components are mounted. FIG. 5 is a top view of the collective substrate on which the frame is mounted. A conventional method for manufacturing a camera module will be described with reference to the drawings. Reference numeral 2 denotes a collective substrate in which a plurality of wiring substrates 1 are formed in a matrix. A solid-state imaging device 3 is mounted on each wiring substrate 1 of the collective substrate 2. The solid-state imaging device 3 is electrically connected to the wiring board 1 by a gold wire (not shown) or the like. An electronic component 5 is mounted on the wiring board 1. The electronic component 5 is, for example, a connector or a chip capacitor.

  Subsequently, the frame body 4 is mounted and fixed so as to cover each solid-state imaging device 3. The frame body 4 includes an optical member support portion and a solid-state image sensor housing portion, and an optical element such as a filter is placed and fixed in an opening through which imaging light from the optical member is transmitted. The frame body 4 is fixed to the wiring board 1 by using a sealing agent in order to provide airtightness. As the sealant, for example, an ultraviolet curable resin or a thermosetting resin can be selected. By curing the sealing agent and integrating the frame body 4 and the wiring board 1, a camera module assembly board is completed.

The collective substrate 2 is cut by a cutting line 9 set (assumed) in advance to be divided into individual wiring boards 1 using a cutting device such as a dry dicer or a wet dicer, and divided into individual camera modules. To do.
JP 2005-101711 A

  However, as the size of the camera module product is reduced, the area of the fixed portion between the frame 4 and the wiring board 1 is reduced. Therefore, a plurality of camera modules formed on the collective board 2 are connected to each wiring. When cutting into the board | substrate 1, the malfunction which the airtightness of the fixing | fixed part of the said frame 4 and the said wiring board 1 is impaired by the stress at the time of a cutting | disconnection arises.

  FIG. 6 is a partial cross-sectional view of a fixing portion in which airtightness according to the prior art is impaired. Like the A part shown in figure, the sealing agent of a fixing | fixed part may peel off by the stress at the time of a cutting | disconnection. If it becomes such a state, the airtightness of a fixing | fixed part (sealing part) will be impaired, and the dust and the water | moisture content at the time of cutting will enter in the said frame 4, and will adhere to the said solid-state image sensor 3. FIG. The adhering dust or the like appears as black spots or spots on the photographed image, which deteriorates the product quality as a camera module.

  An object of the present invention is to provide a method of manufacturing a camera module in which the airtightness between the frame and the wiring board is not impaired by the stress when the collective board is cut into individual wiring boards.

  At least a solid-state image sensor mounting step for mounting a solid-state image sensor corresponding to the wiring board on a collective board in which a plurality of wiring boards are formed in a matrix, and the solid-state imaging on the wiring board of the collective board A method for manufacturing a camera module, comprising: a frame body mounting step for mounting and fixing a frame body so as to cover an element; and a dividing step for cutting the frame body along a cutting line set in accordance with the wiring board and dividing the camera body into individual camera modules. And before the said division | segmentation process, the process which apply | coats the reinforcement member for reinforcing the said fixing | fixed part in the location which is the periphery of the fixing | fixed part of the said frame and the said wiring board and adjoins the said cutting line is provided. A manufacturing method of the camera module.

  Since there is a step of applying a reinforcing member for reinforcing the fixing portion at a location adjacent to the cutting line and around the fixing portion of the frame and the wiring board, to the fixing portion of the stress at the time of cutting It is possible to suppress the propagation of air and maintain the airtightness of the frame and the wiring board.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram for explaining a method of manufacturing a camera module according to the present invention, and is a partial top view of a collective substrate. 2A and 2B are views for explaining a method of manufacturing a camera module according to the present invention. FIG. 2A is a cross-sectional view schematically showing a cut state, and FIG. 2B is a cross-sectional view after cutting. FIG. 3 is an enlarged cross-sectional view of a cutting portion for explaining a method for manufacturing a camera module according to the present invention. 4 and 5 described in the background art are also related to the manufacturing method of the camera module of the present invention, and are used together.

  First, as shown in FIG. 4, the solid-state imaging device 3 is mounted on the wiring substrate 1 of the collective substrate 2 in which a plurality of wiring substrates 1 are formed in a matrix. After mounting the solid-state image sensor 3, the wiring board 1 and the solid-state image sensor 3 are electrically connected by a gold wire (not shown) or the like. In the present embodiment, the electronic component 5 is also mounted on the wiring board 1. The electronic component 5 is, for example, a connector or a chip capacitor.

  Subsequently, the frame body 4 is mounted and fixed so as to cover the solid-state imaging device 3. The frame body 4 is mounted with the optical center of the solid-state imaging device 5 and the optical center of an optical member support portion formed integrally with the frame body 4 aligned. The frame body 4 and the wiring board 1 are fixed using a sealant 6 (ultraviolet curable resin or thermosetting resin). The sealant 6 is cured by UV irradiation, heating, or the like, so that the frame body 4 and the wiring board 1 are integrated.

  The sealing agent 6 can be selected as appropriate. For example, when a hybrid resin such as a photothermosetting type is used, the sealing at the time of main curing is performed by temporarily curing when the frame body 4 is mounted. The mounting position shift of the frame 4 due to the contraction of the agent 6 can be reduced.

  As shown in FIG. 1, after the frame 4 and the wiring board 1 are integrated, the frame 4 and the periphery of the fixing portion of the wiring board 1 and adjacent to the cutting line 9 A reinforcing member 7 for reinforcing the fixed portion is applied and cured. The reinforcing member 7 extends over the side surface of the frame body 4 and the cutting line 9. In the place where the said frame bodies 4 on the said wiring board 1 adjoin, it apply | coats over the both sides | surfaces of the said adjacent frame 4 and the said cutting line 9. FIG. As the reinforcing member 7, the same material as the sealant 6 can be used, and an ultraviolet curable resin or a thermosetting resin can be appropriately selected.

  In addition, the sealing agent 6 used for fixing the frame body 4 and the wiring board 1 is temporarily fixed in a semi-cured state, and after applying the reinforcing member 7, the sealing agent 6 and the reinforcing member 7. May be completely cured simultaneously.

Subsequently, as shown in FIG. 2, the aggregate substrate 2 is divided into individual camera modules using a cutting device such as a dry dicer or a wet dicer. The dicer blade 8 cuts together with the reinforcing member 7 in the cutting line 9. The cutting may be performed from the mounting surface side of the frame body 4 or from the opposite surface side. According to the method for manufacturing a camera module of the present invention, the fixing portion is reinforced, and the airtightness of the frame body 4 and the wiring board 1 can be maintained.
In FIG. 2, reference numeral 10 denotes an optical element such as a filter, which is placed and fixed in an opening through which imaging light from the optical member of the frame 4 is transmitted.

  As shown in FIG. 1, the reinforcing member 7 is not applied to the frame 4 adjacent to the electronic component 5 and the fixing portion of the wiring board 1. Since it is not adjacent, it is not necessary because the stress at the time of cutting is not applied. Even if applied, there is no problem.

  In the case of a camera module of a type in which the electronic component 5 is not mounted, the cutting line 9 is adjacent to the four sides of the frame body 4, so that the frame 4 and the entire periphery of the fixing portion of the wiring board 1 are covered. It is necessary to apply the reinforcing member 7.

FIG. 5 is a diagram for explaining a method of manufacturing a camera module according to the present invention, and is a partial top view of a collective substrate. It is a figure for demonstrating the manufacturing method of the camera module by this invention, (a) is sectional drawing which showed the cutting state typically, (b) is sectional drawing after cutting | disconnection. It is a figure for demonstrating the manufacturing method of the camera module by this invention, and is an expanded sectional view of a cutting part. Top view of a collective board with a solid-state image sensor and electronic components Top view of collective board with frame Partial cross-sectional view of a fixed part in which the airtightness according to the prior art is impaired

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board 2 Collective board 3 Solid-state image sensor 4 Frame body 5 Electronic component 6 Sealant 7 Reinforcement member 8 Blade 9 Cutting line 10 Optical element

Claims (1)

at least,
A solid-state image sensor mounting step of mounting a solid-state image sensor corresponding to the wiring board on a collective substrate in which a plurality of wiring boards are formed in a matrix;
A frame mounting step of mounting and fixing a frame on the wiring board of the collective substrate so as to cover the solid-state imaging device;
A cutting process that is cut according to a cutting line set in accordance with the wiring board and divided into individual camera modules;
A camera module manufacturing method comprising:
Before the dividing step, a step of applying a reinforcing member for reinforcing the fixing portion around the fixing portion of the frame body and the wiring board and adjacent to the cutting line is provided. A method for manufacturing a camera module.

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