JP2007273601A - Ceramic sheet laminate cutting method, ceramic electronic component manufacturing method using the same and cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic sheet laminate cutting method high in cutting accuracy and cutting efficiency, a cutting device, and a ceramic electronic component manufacturing method using the cutting method. <P>SOLUTION: A ceramic sheet laminated body 100 is composed so that a plurality of cutting marks are formed on the end face at regular intervals, and internal electrodes are exposed on the four side faces. An inspection part 10 images the cutting marks and the internal electrodes so as to calculate a distance between a cutting position passing through a middle point between the internal electrodes adjacent to each other and each cutting mark as a relative cutting position. A cutting part 50 calculates a gravity center of each cutting mark by imaging each cutting mark so as to cut the ceramic sheet laminated body 100 at the cutting position corresponding to the relative cutting position calculated by the inspection part 10 and the calculated gravity center. It is possible to execute parallel processing of inspection and cutting while improving the cutting accuracy, since it is required to image only the cutting marks during cutting. Consequently, it achieves high work efficiency. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for cutting a ceramic sheet laminate, a cutting apparatus for performing the cutting method, and a method for manufacturing a ceramic electronic component using the cutting method.

A ceramic electronic component is manufactured through a process of cutting a ceramic sheet laminate in which ceramic sheets and internal electrodes are alternately laminated to form external electrodes. When manufacturing such a ceramic electronic component, first, the internal electrodes are exposed on both side surfaces that are orthogonal to the lamination direction of the ceramic sheet laminate and are opposed to each other, and the position of the internal electrodes is monitored with a camera. A predetermined position is cut with a cutting blade that moves up and down in the direction. Such a camera for monitoring is provided at a position facing and spaced apart from the side surface (see, for example, Patent Document 1).
JP 2002-184646 A (page 3, FIG. 1)

  However, if the surveillance camera is provided at a position facing the side surface, chips and the like enter the visual field of the surveillance camera at the time of cutting, resulting in an obstacle to image detection, and the accuracy of cutting position detection is reduced, or erroneous cutting There is a problem that is performed.

  Accordingly, the present invention provides a method for cutting a ceramic sheet laminate, a cutting apparatus, and a ceramic electronic using the cutting method, capable of improving the accuracy of detecting the cutting position and efficiently producing a stable quality ceramic electronic component. It aims at providing the manufacturing method of components.

  In order to solve the above-mentioned object, the present invention has internal electrodes and ceramic sheets alternately laminated, and has end faces facing each other in the stacking direction, and first and second side faces that are substantially orthogonal to the end faces and face each other. And a laminate preparation step of preparing a laminate having an electrode exposed portion at which at least a part of the internal electrode is exposed on the first side surface, a mark formation step of forming a plurality of positioning marks on at least one end surface, and positioning A cutting position calculating step for detecting a relative position between the mark and the electrode exposed portion, and calculating a relative cutting position based on the positioning mark according to the detected relative position, and a position of the positioning mark and the calculated relative cutting position The cutting method of the ceramic sheet laminated body which has the cutting process which cut | disconnects a laminated body in the cutting position according to these is provided.

  According to the above method, first, the relative position between the positioning mark and the cutting position is calculated, and when cutting the laminated body, the cutting is performed at the cutting position corresponding to the relative position with reference to the positioning mark, so that the cutting can be performed with high accuracy. . Moreover, since the relative position calculation and the cutting can be performed in parallel, the manufacturing time can be shortened, and the productivity can be improved.

  Here, the positioning marks are provided at equal intervals along the first side that forms the boundary between the end surface and the first side surface, and at equal intervals along the second side that forms the boundary between the end surface and the second side surface. It is preferable.

  According to such a configuration, it is possible to determine the cutting positions in association with each other based on the positioning marks on both sides of the two opposite sides of the end face at the time of cutting, so that the cutting can be performed with higher accuracy.

  Moreover, it is preferable that the electrode exposure part is exposed in the 1st side surface and the 2nd side surface at substantially equal intervals along the 1st side and the 2nd side. According to such a configuration, the cutting position can be easily determined based on the positioning mark.

  Further, the cutting step may include a display position detecting step for detecting the display position of the positioning mark, and a cutting execution step for cutting the laminate at a cutting position corresponding to the relative cutting position with the detected display position as a reference. preferable.

  According to such a method, it is sufficient that only the positioning mark can be detected at the time of cutting. Since the detection of the positioning mark is easier than the detection of the electrode exposed portion, the cutting position can be easily determined and cut in a short time. In addition, since the cutting position is determined in advance, the cutting accuracy can be improved.

  Moreover, this invention provides the manufacturing method of the ceramic electronic component which has the cutting method of the said ceramic sheet laminated body. According to the method for manufacturing a ceramic electronic component having the above-described method for cutting the ceramic sheet laminate, a suitable ceramic electronic component having the above-described effects can be manufactured.

  The present invention also includes internal electrodes and ceramic sheets that are alternately stacked, and have end faces facing each other in the stacking direction, and first and second side faces that are substantially orthogonal to the end faces and face each other. The side surface has an electrode exposure part from which a part of the internal electrode is exposed, and at least one of the end surfaces is a first position where the position of the positioning mark is detected as a first position of the laminate in which a plurality of positioning marks are formed. 1 detection unit, an electrode detection unit that detects the position of the electrode exposure unit as the second position, a cutting position determination unit that determines a relative cutting position based on the first position and the second position, and a positioning mark at the time of cutting Provided is a ceramic sheet laminate cutting apparatus having a second detection unit that detects a position as a third position, and a cutting unit that cuts the laminate at a cutting position corresponding to a relative cutting position with reference to the third position. The That.

  According to such a configuration, the relative position is calculated in advance based on the detection positions of the first detection unit and the electrode detection unit, and relative to the position of the positioning mark detected by the second detection unit when the stacked body is cut. Since cutting is performed at a cutting position corresponding to the position, cutting can be performed with high accuracy.

  Here, the cutting apparatus includes a first stage having a first detection unit and the electrode detection unit, and a second stage having a second detection unit and the cutting unit and separated from the first stage. preferable.

  According to such a configuration, it becomes possible to perform the detection and cutting of the relative position in parallel, the manufacturing time can be shortened, and the productivity can be improved.

  According to the present invention, it is possible to provide a method for cutting a ceramic sheet laminate with good cutting accuracy and high manufacturing efficiency, a cutting apparatus, and a method for manufacturing a ceramic electronic component using the cutting method.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. FIGS. 1-10 is a figure which shows the cutting method and cutting apparatus of the ceramic sheet laminated body by one embodiment of this invention. In the figure, substantially the same parts are denoted by the same reference numerals, and redundant description is omitted. In the following description, terms such as “upper” and “lower” are used for convenience based on the state shown in the drawings.

  As shown in FIG. 1B, the ceramic sheet laminate 100 according to the present embodiment has a substantially rectangular parallelepiped shape in which a plurality of ceramic sheets 120 and internal electrodes described later are alternately laminated. The ceramic sheet laminate 100 is cut at a plurality of cutting positions 123 and cutting positions 125 that are substantially orthogonal to each other to form a plurality of rectangular parallelepiped chip elements 130.

  As shown in FIG. 2, for example, a chip-like element 130 serving as a capacitor is formed by alternately stacking ceramic sheets 121 and internal electrodes 142. The ceramic sheet 121 is a substantially rectangular sheet obtained by cutting the ceramic sheet 120 (FIG. 1B) at cutting positions 123 and 125. The internal electrode 142 is formed of a conductor, and is laminated so that four sides are shorter than the ceramic sheet 121, respectively, and one side overlaps one side of the ceramic sheet 121. A ceramic electronic component 135 is formed by forming external electrodes 133 (FIG. 1D) in the vicinity of a pair of opposite side surfaces of such a chip-like element 130 (FIG. 1C).

  Here, an outline of a manufacturing method of the ceramic electronic component 135 manufactured by the process including the cutting method of the ceramic sheet laminate 100 according to the present embodiment will be described with reference to FIG. First, a ceramic sheet 120 is prepared (Step 101), and a plurality of sheets are laminated so as to sandwich an internal electrode (not shown) every other sheet (Step 102). By pressing the laminated material (step 103), the ceramic sheet laminated body 100 is formed. As the ceramic sheet 120, for example, a sheet obtained by applying a paint obtained by mixing a ceramic dielectric powder to a PET (polyethylene terephthalate) sheet can be used. The internal electrode can be formed by, for example, applying an electrode paste on the ceramic sheet 120 by screen printing in advance.

  The ceramic sheet laminate 100 is cut and separated at a plurality of cutting positions 123 and 125, for example, with the internal electrodes exposed on the side surfaces (step 104). The end surface is polished to give roundness (step 105). Subsequently, the polished chip-like element 130 is fired (step 106). When fired, since the internal electrode having a large firing shrinkage rate enters the inside of the dielectric layer, the internal electrode is exposed by polishing again with the abrasive by the pulling barrel (step 107). After drying, external electrodes are applied to predetermined portions (step 108) and baked (step 109). Finally, a plating process is performed (step 110) so as to ensure electrical connection at the time of mounting, and the ceramic electronic component 135 is manufactured.

  Hereinafter, the cutting apparatus and cutting method of the ceramic sheet laminate will be described in detail. First, the cutting device will be described. As shown in FIG. 3, the cutting device 1 for the ceramic sheet laminate 100 includes an inspection unit 10 and a cutting unit 50 connected to the inspection unit 10 through a communication line 30. The inspection unit 10 detects a position of a positioning mark (described later) formed on one end surface in the stacking direction of the ceramic sheet laminate 100 and a position of an internal electrode exposed on the side surface of the ceramic sheet laminate 100 to detect relative positions. Determine the cutting position. The cutting unit 50 determines a cutting position for cutting the ceramic sheet laminated body 100 from the relative cutting position determined by the inspection unit 10 and the position of the positioning mark detected by the cutting unit 50, and performs cutting.

  The inspection unit 10 includes an inspection table 11 on which the ceramic sheet laminate 100 is fixed and placed by suction or the like. The inspection table 11 can be rotated and translated on a plane on which the ceramic sheet laminate 100 is placed. In the vicinity of the inspection table 11, mark recognition cameras 15, 17 and side recognition cameras 19, 21 are arranged. The mark recognition cameras 15 and 17 image a positioning mark (described later) formed on the ceramic sheet laminate 100. The side recognition cameras 19 and 21 image internal electrodes on a pair of side surfaces facing each other of the ceramic sheet laminate 100. The mark recognition cameras 15 and 17 and the side recognition cameras 19 and 21 are respectively connected to the inspection unit image processing device 13 and send the captured image information to the inspection unit image processing device 13.

  The inspection unit image processing device 13 takes in image information from the mark recognition cameras 15 and 17 and the side recognition cameras 19 and 21, analyzes the position of the positioning mark and the position of the internal electrode from the image information, and performs positioning. A cutting position based on the mark position, that is, a relative cutting position is calculated. The inspection unit image processing device 13 is connected to the cutting unit image processing device 53 of the cutting unit 50, and sends the calculated relative cutting position to the cutting unit image processing device 53.

  The cutting unit 50 is provided with a cutting table 51 on which the ceramic sheet laminate 100 is fixed and placed by suction or the like. The cutting table 51 can be rotated and translated on a plane substantially orthogonal to the stacking direction of the ceramic sheet laminate 100. In the vicinity of the cutting table 51, mark recognition cameras 55 and 57 are arranged. The mark recognition cameras 55 and 57 image the positioning marks formed on the end surface in the stacking direction of the ceramic sheet stack 100. At this time, the mark recognition cameras 55 and 57 are arranged so as to take an image of the ceramic sheet laminate 100 from obliquely upward so as not to obstruct the operation of the cutting blade. The mark recognition cameras 55 and 57 are connected to the cutting unit image processing device 53, and send captured image information to the cutting unit image processing device 53.

  The cutting unit image processing device 53 takes in the image information from the mark recognition cameras 55 and 57 and analyzes the position of the positioning mark, and the relative cutting position input from the inspection unit image processing device 13 and the analyzed position of the positioning mark. The cutting position is determined from the position.

  Next, a method for cutting the ceramic sheet laminate will be described. In the inspection process, as shown in FIG. 4, first, the ceramic sheet laminate 100 is supplied to the inspection table 11 (step 201), and the inspection is started (step 202). In the ceramic sheet laminate 100, when the internal electrode is not exposed on the side surface, a four-sided ear cutting operation is performed to cut off the four side surfaces by a predetermined thickness to expose the internal electrode (step 203). .

  Here, as shown in FIG. 5, the stacking direction of the ceramic sheet laminate 100 placed on the inspection table 11 is defined as the z direction, and the two directions orthogonal to the z direction are defined as the x direction and the y direction. A target mark 143 and a cutting mark 145 that are positioning marks are provided on one end surface 151 in the z direction of the ceramic sheet laminate 100. In the example of FIG. 5, a total of four target marks 143 are provided at four corner portions of the end surface 151. A total of 32 cut marks 145 are provided along the four sides 157, 159, 161, and 163 of the end surface 151 at equal intervals.

  On the side surface 153 and a side surface (not shown) opposite to the side surface 153, the internal electrodes 141 are exposed in a plurality of stages in the z direction and at substantially equal intervals in the x direction. Similarly, on the side surface 154 and the side surface 155 facing the side surface 154, although not shown, the internal electrodes 141 are exposed in a plurality of stages in the z direction and at substantially equal intervals in the y direction. Here, the internal electrode 141 has, for example, a rectangular shape in the xy plane, and the portion exposed to the side surface is substantially the same as the width in the x direction or y direction of the internal electrode 142 shown by the chip-like element 130 in FIG. Have a width of The internal electrodes 141 are dummy electrodes provided at substantially equal intervals along the four sides 157, 159, 161, and 163 of the ceramic sheet laminate 100 at positions corresponding to the internal electrodes 142. That is, the ceramic sheet laminate 100 is provided with an internal electrode 141 that is a dummy electrode for cutting and an internal electrode 142 in the chip-like element 130 as internal electrodes.

  The mark recognition cameras 15 and 17 are spaced apart and provided above the end surface 151 side of the ceramic sheet laminate 100. Here, since the case of calculating the cutting position in the x direction in FIG. 5 is shown, the mark recognition camera 15 is arranged substantially vertically above the side 163 so as to detect the mark along the side 163, and the mark recognition camera 15 is recognized. The camera 17 is disposed substantially vertically above the side 159 so as to detect a mark along the side 159. The side recognition camera 19 is provided in the vicinity of the side surface 154 so as to detect the internal electrode 141 on the side surface 154. The side recognition camera 21 is provided in the vicinity of the side surface 155 so as to detect the internal electrode 141 on the side surface 155.

  Returning to FIG. 4, the ceramic sheet laminate 100 is positioned by the target mark 143 (FIG. 5) (step 204). At this time, the mark recognition cameras 15 and 17 (FIG. 5) capture the target mark 143 and send the image information to the inspection unit image processing device 13, and the inspection unit image processing device 13 analyzes the image information, and the target mark The barycentric position of 143 is detected, and the inspection table 11 is rotated or translated to adjust the position of the ceramic sheet laminate 100.

  When the position adjustment of the ceramic sheet laminate 100 is completed, the inspection table 11 is moved so that the ceramic sheet laminate 100 is arranged at the first inspection position in the first direction (step 205). The first inspection position in the first direction refers to, for example, the mark recognition camera 15 taking an image of the vicinity of the cut mark 145c on one end side in the y direction of the cut marks 145 arranged along the side 163, and the mark recognition camera 17 , Of the cutting marks 145 arranged along the side 159, the vicinity of the cutting mark 145a near one end in the y direction can be imaged.

  At this position, the mark recognition cameras 15 and 17 image the vicinity of the cutting mark 145, the side recognition camera 19 images the internal electrode 141 of the side surface 154, the side recognition camera 21 images the internal electrode 141 of the side surface 155, The obtained image information is sent to the inspection unit image processing apparatus 13 (step 206).

  For example, as shown in a perspective view of a part of the ceramic sheet laminate 100 placed on the inspection table 11 (FIG. 3) in FIG. 6, the vicinity of the cutting mark 145a is imaged by the mark recognition camera 17, and the side recognition camera 21 is used. The vicinity of the internal electrodes 141b and 141c is imaged. Here, since all the internal electrodes 141a are dummy electrodes in the x direction along the side 157, no cutting is performed here. The inspection unit image processing device 13 analyzes the image information input from the mark recognition camera 17 and calculates the center of gravity 147a of the cut mark 145a. Further, by analyzing the image information input from the side recognition camera 21, the distance D3 between the one end L1 of the internal electrode 141b closest to the internal electrode 141c and the one end L2 of the internal electrode 141c closest to the internal electrode 141b is calculated. An intermediate point M1 between L1 and L2 is specified.

  On the other hand, the mark recognition camera 15 (FIG. 5) images the vicinity of the cut mark 145c, and the side recognition camera 19 images the internal electrode 141 portion (not shown) of the side surface 154, and the inspection unit image processing device 13 (FIG. 5). Send to 3). The inspection unit image processing apparatus 13 calculates the center of gravity 147c of the cutting mark 145c and the intermediate point M2 (FIG. 5) between the internal electrodes 141 that face the internal electrodes 141b and 141c and are adjacent to each other. A plane passing through the intermediate points M1 and M2 and substantially perpendicular to the side 159 is the cutting position 123a. Further, the inspection unit image processing apparatus 13 calculates the distance between the center of gravity 147a and the cutting position 123a, and sets the calculated value as the relative cutting position D1. Similarly, the distance between the center of gravity 147c and the cutting position 123a is calculated and set as a relative cutting position D4.

  Subsequently, the inspection table 11 (FIG. 3) is moved in the y direction shown in FIG. 5 at a predetermined pitch such as the interval between adjacent internal electrodes 141 exposed in the y direction (step 208). When the calculation for the number of inspection internal electrodes has not been completed (step 209: NO), the process returns to step 206, and the internal electrode 141c (FIG. 6) and the internal electrode 141d are also closest to the internal electrode 141d of the internal electrode 141c. A distance between one end and one end of the internal electrode 141d closest to the internal electrode 141c is calculated to identify the intermediate point M3. Similarly, an intermediate point M4 (not shown) is calculated for the side surface 154 side, and a cutting position 123b that passes through the intermediate points M3 and M4 and is substantially perpendicular to the side 159 is calculated. Further, the inspection unit image processing apparatus 13 calculates the distance between the gravity center position 147a and the cutting position 123b, and sets the calculated value as the relative cutting position D2. The processing for calculating the relative cutting position is similarly performed on the side surface 154 side. Hereinafter, relative cutting positions are sequentially calculated in the first direction along the sides 159 and 163.

  As described above, when the calculation of the relative cutting position is completed for all the internal electrodes 141 exposed on the side surfaces 154 and 155, the inspection table 11 is rotated by 90 degrees (step 210). After the rotation, for example, the side recognition camera 19 images the side surface 153, and the side recognition camera 21 images the side surface (not shown) facing the side surface 157. At this time, similarly to the process in the first direction, the inspection table 11 is moved so that the ceramic sheet laminate 100 is arranged at the first inspection position in the second direction (step 211). At the first inspection position in the second direction, the mark recognition camera 17 images the vicinity of the cut mark 145d, and the side recognition camera 21 images the internal electrode 141. Further, the mark recognition camera 15 images the vicinity of the cut mark 145e, and the side recognition camera 19 images the internal electrode 141 (step 212).

  The inspection unit image processing device 13 analyzes the captured image information, calculates a cutting position 125 passing through the midpoint between the adjacent internal electrodes 141, and determines the center of gravity of the cutting mark 145d and the cutting mark 145e and the cutting position 125. The relative cutting position is calculated from (step 213). Subsequently, the inspection table 11 is moved in the y direction at a predetermined pitch such as the interval between adjacent internal electrodes 141 exposed in the y direction (step 214). Thereafter, the processing from step 212 to step 214 is performed for all the internal electrodes 141 in the second direction, and the relative cutting positions for the number of inspections are calculated (step 215).

  When the above processing is performed for the first direction and the second direction and the calculation of the relative cutting position is completed, the calculated relative cutting position is sent as cutting data to the inspection unit 50 (step 216). Moreover, the ceramic sheet laminated body 100 is conveyed from the inspection table 11 of the inspection unit 10 to the cutting table 51 of the cutting unit 50 (step 218).

  Next, the cutting process will be described. As shown in FIG. 7, first, cutting data sent from the inspection unit 10 (FIG. 3) is acquired (step 231). On the other hand, when the ceramic sheet laminate 100 for which the cutting position has been calculated is supplied from the inspection unit 10, it is fixedly placed on the cutting table 51 by suction or the like (step 232). Cutting is started in this state (step 233).

  First, the cutting blade is calibrated before actually cutting (step 234). The calibration of the cutting blade is performed in order to prevent a positioning error in attaching or detaching the cutting blade, and a reduction in cutting accuracy due to irregular deformation of the cutting blade due to heat from the cutting table 51 or changes in air temperature. As shown in FIG. 8, the cutting trace 179 is lightly attached to an arbitrary position on the surface 151 (FIG. 5) of the ceramic sheet laminate 100 placed on the cutting table 51 (FIG. 3). Image processing range windows 173 and 177 are set in the camera visual fields 171 and 175 by the mark recognition cameras 55 and 57 with respect to the cut mark 179. As described above, a plurality of windows are set for the cut marks 179 in order to prevent erroneous detection, and image processing is performed on each of the windows. Preferably, the position of the cutting blade is imaged from both ends of the cutting trace 179, and the cutting unit image processing device 53 performs image processing, and the inclination and positional deviation of the cutting trace 179 with respect to the ceramic sheet laminate 100 are used as cutting blade calibration data. calculate.

  Subsequently, the ceramic sheet laminate 100 is positioned by the target mark 143 (FIG. 8) (step 235). That is, the mark recognition cameras 55 and 57 (FIG. 8) capture the target mark 143 and send the image information to the cutting unit image processing device 53. The cutting unit image processing device 53 analyzes the image information, and the target mark 143 is analyzed. The position of the center of gravity is detected. The cutting unit image processing device 53 rotates or translates the cutting table 51 using the detected center-of-gravity position and the above-described cutting blade calibration data, thereby detecting the deviation during conveyance from the inspection table 11 and the positional deviation of the cutting blade 181. The position of the ceramic sheet laminate 100 is adjusted to correct.

  When the position adjustment of the ceramic sheet laminate 100 is finished, the cutting table 51 is moved so that the cutting blade 181 is disposed in the vicinity of the cutting position 123a that is the first cutting position in the first direction, as shown in FIG. Step 236). At this position, the mark recognition camera 57 images the vicinity of the cutting mark 145a, the mark recognition camera 55 images the vicinity of the cutting mark 145c (step 237), and sends the image information to the cutting unit image processing device 53. The cutting unit image processing device 53 calculates the center of gravity 183a of the cutting mark 145a and the center of gravity 183c of the cutting mark 145c based on the image information (step 238).

  The cutting unit image processing device 53 (FIG. 3) includes cutting data indicating the relative cutting positions D1 and D4 input from the inspection unit 10, and data on the gravity center positions of the cutting marks 145a and 145c calculated by the cutting unit image processing device 53. Based on this, the cutting position 123a is calculated (step 239). The cutting table 51 is translated and rotated so that the cutting blade 181 is disposed at the cutting position 123a for correction (step 240), and cutting is executed (step 241). When the calculation regarding the number of internal electrodes for the number of inspections has not been completed (step 242: NO), the process returns to step 237, and the cutting table is arranged so that the cutting blade 181 is arranged at the next cutting position 123b as shown in FIG. 51, the cutting position 123b is calculated based on the image captured by the mark recognition cameras 55 and 57 and the cutting data from the inspection unit 10, and the cutting is executed. Similar processing is repeated until the number of cuts in the first direction is completed (step 242).

  When the processing for the number of cuts is completed (step 242: YES), the cutting table 51 is rotated 90 degrees (step 243), and the imaging position that is the first cutting position in the second direction, for example, the mark recognition cameras 55 and 57 are displayed. The cutting table 51 is further moved to a position where the cutting marks 145 arranged along the sides 157 and 161 are imaged (step 244). Similar to the processing in the second direction in the inspection table 11, for example, the cutting mark 145e is imaged by the mark recognition camera 55, the cutting mark 145d is imaged by the mark recognition camera 57, and the image information is sent to the cutting unit image processing device 53 ( Step 245). The cutting unit image processing device 53 calculates the center of gravity of the cutting marks 145e and 145d based on the image information (step 246). The cutting unit image processing device 53 uses the cutting data indicating the relative cutting position input from the inspection unit 10 and the data of the center of gravity positions of the cutting marks 145e and 145d calculated by the cutting unit image processing device 53. 125 (FIG. 9) is calculated (step 247). The cutting table 151 is translated and rotated so that the cutting blade 181 is disposed at the cutting position 125 for correction (step 248), and cutting is executed (step 249). Until the number of cuts is completed, the cutting table 51 is moved in the second direction at a predetermined pitch, and the processing from step 245 to step 249 is repeated. Through the above processing, the ceramic sheet laminate 100 is cut into the chip elements 130 (step 250).

  When the number of cuts is completed (step 250: YES), the ceramic sheet laminate 100 is discharged from the cutting table 51 (step 251), and the process proceeds to the water barrel process of step 105 (FIG. 1A) (step 252). At this time, since the chip-shaped element including any of the four sides 157, 159, 161, 163 includes the internal electrode 141 that is a dummy electrode, the size is smaller than that of other chip-shaped elements including only the internal electrode 142. May be big. Therefore, it is preferable to select the size of the element by performing a process such as passing through a sieve having a predetermined size.

  As described above in detail, according to the cutting method and cutting apparatus for the ceramic sheet laminate 100, it is not necessary to directly observe the internal electrode 141 at the time of cutting, and based on the cutting data while imaging only the cutting mark 145. Cutting can be done. Therefore, cutting accuracy can be improved. Further, the cutting mark 145 is easier to detect than the internal electrode 141, and it is possible to perform cutting more reliably and accurately.

  The cutting unit 50 does not need a camera for imaging the internal electrode 141, and only needs to be able to image only the end surface 151. Therefore, the camera need not be arranged near the side surface of the ceramic sheet laminate 100. Therefore, there is no concern that chips or the like adhere to the camera and the sharpness of the image is lowered, which adversely affects the determination of the cutting position. Furthermore, with such a configuration, the ceramic sheet laminate 100 can be fixed from the side surface, and cutting can be performed with higher accuracy.

  In addition, since the cutting data is calculated by the inspection unit 10 and the cutting is performed by the cutting unit 50, the calculation of the cutting data and the cutting can be performed in parallel. Therefore, production efficiency can be improved.

  Before the cutting is performed, the cutting blade 181 is calibrated in the cutting unit 50, so that it is possible to prevent the cutting accuracy from being deteriorated due to irregular deformation of the cutting blade 181 due to heat from the cutting table 51 or changes in the air temperature. it can.

  Furthermore, by forming the external electrode 133 on the chip-like element 130 manufactured by the cutting method and cutting apparatus for the ceramic sheet laminate, it is possible to manufacture the ceramic electronic component 135 that exhibits the above-described functions and effects.

  In addition, the cutting method and cutting apparatus of the ceramic sheet laminated body of the present invention are not limited to the above-described embodiments, and various modifications and improvements can be made within the scope described in the claims.

  For example, instead of the capacitor shown in FIG. 2, for example, a coil component can be formed as shown in FIG. The chip-like coil 330 is formed by appropriately laminating a cut ceramic sheet 121 and a sheet 317 on which a coil winding pattern 313a made of an electrodeposition plating film 315, a through-hole pattern 313b, a lead pattern 313c, etc. are formed on the ceramic sheet 121. Is formed. In addition, inductors, varistors, thermistors, or composite parts thereof can be formed by changing the electrode pattern.

  Further, the form and number of the target mark 143 and the cutting mark 145 are not limited to the above-described embodiment, and other forms and numbers may be used.

  When calculating the relative cutting position of the cutting position 123b, it was calculated as the distance from the cutting mark 145a. However, it may be calculated as the distance from the cutting mark 145b, and the reference cutting mark may be appropriately selected. Is possible.

  As for the method of calculating the cutting position by imaging the cutting mark 145 and the internal electrode 141, in the above method, the relative cutting position with respect to the cutting mark 145 is calculated for each cutting point. Cutting data is calculated for many ceramic sheet laminates 100 obtained, and the calculated cutting data is statistically processed to obtain a standard value of the relative cutting position. For example, the cutting is automatically performed at regular pitch intervals according to the standard value. For example, the processing steps can be modified.

  The method and apparatus for cutting a ceramic sheet laminate of the present invention can be applied to the production of ceramic electronic components and the like.

It is a figure which shows the manufacturing method of the ceramic electronic component by one embodiment of this invention, (a) is a flowchart which shows a manufacturing method, (b) is a conceptual perspective view which shows manufacture of a chip-shaped element, (c) is a chip | tip. FIG. 4D is a schematic diagram showing a ceramic electronic component provided with external electrodes. The disassembled perspective view which shows the structure of the chip-shaped element in the manufacturing method of the ceramic electronic component by one embodiment of this invention. The block diagram which shows the cutting device of the ceramic sheet laminated body by one embodiment of this invention. The flowchart which shows the test process of the ceramic sheet laminated body in the manufacturing method of the ceramic electronic component by one embodiment of this invention. Schematic explaining the inspection process of the ceramic sheet laminated body in the manufacturing method of the ceramic electronic component by one embodiment of this invention. The schematic partial perspective view explaining the inspection process of the ceramic sheet laminated body in the manufacturing method of the ceramic electronic component by one embodiment of this invention. The flowchart which shows the cutting process of the ceramic sheet laminated body in the manufacturing method of the ceramic electronic component by one embodiment of this invention. Schematic which shows the calibration method of the cutting blade in the manufacturing method of the ceramic electronic component by one embodiment of this invention. The schematic partial perspective view explaining the cutting process of the ceramic sheet laminated body in the manufacturing method of the ceramic electronic component by one embodiment of this invention. The schematic fragmentary sectional view explaining the cutting process of the ceramic sheet laminated body in the manufacturing method of the ceramic electronic component by one embodiment of this invention. The disassembled perspective view which shows the structure of the chip-shaped element in the manufacturing method of the ceramic electronic component by the modification of one embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cutting apparatus of ceramic sheet laminated body 10 Inspection part 11 Inspection table 13 Inspection part Image processing apparatus 15, 17, 55, 57 Mark recognition camera 19, 21 Side recognition camera 30 Communication line 51 Cutting table 53 Cutting part image processing apparatus 100 Ceramic Sheet laminate 120 Ceramic sheet 123, 125 Cutting position 145 Cutting mark 147 Center of gravity D1 Relative cutting position

Claims (7)

The internal electrodes and the ceramic sheets are alternately stacked, and have end faces facing each other in the stacking direction, and first and second side faces that are substantially orthogonal to the end faces and face each other, and at least the first side face includes the first side face and the second side face. A laminate preparation step of preparing a laminate having an electrode exposed portion where a part of the internal electrode is exposed,
A mark forming step of forming a plurality of positioning marks on at least one of the end faces;
A cutting position calculating step of detecting a relative position between the positioning mark and the electrode exposed portion, and calculating a relative cutting position based on the positioning mark according to the detected relative position;
A cutting method of a ceramic sheet laminate, comprising: a cutting step of cutting the laminate at a cutting position corresponding to the position of the positioning mark and the calculated relative cutting position.   The positioning marks are provided at equal intervals along a first side that forms a boundary between the end surface and the first side surface, and are equally spaced along a second side that forms a boundary between the end surface and the second side surface. The method for cutting a ceramic sheet laminate according to claim 1, wherein the ceramic sheet laminate is cut.   3. The ceramic sheet laminate according to claim 2, wherein the electrode exposed portions are exposed on the first side surface and the second side surface at substantially equal intervals along the first side and the second side. Cutting method. The cutting step includes
A display position detecting step for detecting the display position of the positioning mark;
The ceramic sheet laminate according to claim 1, further comprising a cutting execution step of cutting the laminate at a cutting position corresponding to the relative cutting position with the detected display position as a reference. Cutting method.   A method for producing a ceramic electronic component comprising the method for cutting a ceramic sheet laminate according to any one of claims 1 to 4. The internal electrodes and the ceramic sheets are alternately stacked, and have end faces facing each other in the stacking direction, and first and second side faces that are substantially orthogonal to the end faces and face each other, and at least the first side face includes the first side face and the second side face. First detection for detecting a position of a positioning mark of a stacked body having an electrode exposed portion where a part of the internal electrode is exposed and having a plurality of positioning marks formed on at least one of the end faces. And
An electrode detector that detects the position of the electrode exposed portion as a second position;
A cutting position determining unit that determines a relative cutting position based on the first position and the second position;
A second detector that detects the position of the positioning mark at the time of cutting as a third position;
A ceramic sheet laminate cutting apparatus comprising: a cutting section that cuts the laminate at a cutting position corresponding to the relative cutting position with respect to the third position. A first stage comprising the first detector and the electrode detector;
The apparatus for cutting a ceramic sheet laminate according to claim 6, further comprising a second stage provided with the second detection unit and the cutting unit and separated from the first stage.

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