JP2007272010A - Manufacturing method for liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid crystal display device that facilitates transfer formation and simplifies manufacturing processes. <P>SOLUTION: In the manufacturing method for the liquid crystal display device that performs multi-unit manufacture by cutting a plurality of display regions 3 formed between an array substrate 41 and a color filter substrate 42, a transfer material 24 is applied to a position nearby both a pair of transfer electrodes 23 between adjacent display regions 3 and when the array substrate 41 and color filter substrate 42 are stuck together, the applied transfer material 24 is spread to both the transfer electrodes 23. When the display areas are cut, the transfer material 24 on the transfer electrodes are divided to form transfer parts nearby the display areas 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method for manufacturing a liquid crystal display device.

In recent years, production of relatively small liquid crystal display devices used for mobile phones, digital still cameras, and the like has been active. When manufacturing such a small liquid crystal display device, since the display area is very small compared to the area of the glass substrate used as a material, a manufacturing method in which a large number of liquid crystal display devices are cut at the same time by cutting the glass substrate is generally used. Is.

Further, in order to obtain electrical continuity between the drive element substrate having terminals and drive elements and the color filter substrate having a common electrode and a color filter with respect to the liquid crystal display device, silver paste or the like is formed on the electrodes on the drive element substrate. A technique is disclosed in which a conductive structure is applied to form a transfer structure sandwiched between common electrodes on the surface of a color filter substrate (see Patent Document 1).

JP 2000-89247 A

However, when the conventional method is used, the transfer portion is formed by applying a transfer material to the electrode one by one with a syringe needle. When such a method is used in the multi-chamfer manufacturing method used in small liquid crystal display devices, the number of coatings increases and the processing time increases dramatically as the number of multi-chamfers per substrate increases. When the number of times of application increases, the processing time per substrate itself becomes longer, and there are problems in manufacturing such as taking time and effort to adjust the syringe to improve the application state of the transfer material at each application point.

The present invention has been made in order to solve the above-described problems, and in particular, a method for manufacturing a liquid crystal display device that can reduce the number of coatings in transfer formation and simplify the manufacturing process without increasing new processes. The purpose is to provide.

In a method of manufacturing a liquid crystal display device that performs multi-face drawing by cutting a plurality of display areas formed between a pair of substrates, both of the pair of transfer electrodes arranged opposite to each other on the substrate between the adjacent display areas A conductive material is applied to a position close to the substrate, and the pair of substrates are bonded to spread the applied conductive material to both the transfer electrodes, and the conductive material on the transfer electrode is divided when the display area is cut. A transfer portion is formed in the vicinity of the display area.

According to the present invention, a conductive material is applied to a position close to both of a pair of adjacent transfer electrodes, the applied conductive material is spread to both of the transfer electrodes, and the conductive material on the transfer electrode is divided. By forming the transfer portion, the number of times of applying the conductive material in the transfer forming process can be reduced and the manufacturing process can be simplified.

Embodiment 1.
1 and 2 are diagrams for explaining the configuration of the liquid crystal display device according to the first embodiment. FIG. 1A is a schematic plan view of the entire liquid crystal display device, and FIG. FIG. 2 is a schematic cross-sectional view taken along the line A-B in FIG. 1A. In the drawing, the film configuration and the like are simplified.

As shown in FIGS. 1 and 2, a pair of transparent substrates, glass substrates 1 and 2, are arranged with a space therebetween, and the glass substrate 1 and the glass substrate 2 surround a display region 3 for displaying an image. It is bonded together by a sealing material 4 formed in a frame shape. Further, the liquid crystal 5 is injected into a space surrounded by the sealing material 4 between the glass substrates 1 and 2, and the injection port of the liquid crystal 5 provided in the sealing material 4 is sealed with the sealing material 6. Here, glass is used as the material of the transparent substrate, but other materials such as transparent plastic and quartz may be used as long as they are transparent.

In the display region 3 described above, the upper surface of the glass substrate 1 facing the liquid crystal 5 has a driving element 7 such as a TFT (Thin Film Transistor), a gate wiring 8 and a source wiring 9 for supplying a signal to the driving element 7, glass The insulating film 10 composed of a multilayer covering the substrate 1, the protective film 11 composed of an organic insulating film that protects the driving element 7, and the liquid crystal 5 is driven by a voltage that is electrically connected to the driving element 7 and supplied from the driving element 7. Pixel electrodes 12 and the like are formed (the glass substrate 1 described above and the structure formed on the upper surface of the glass substrate 1 are collectively referred to as a terminal substrate 13).

On the other hand, on the upper surface of the glass substrate 2 facing the liquid crystal 5, a common electrode 14 made of a transparent conductive film such as an ITO (Indium Tin Oxide) film, an overcoat film 15 serving as a protective film, a color filter 16, The light shielding layer 17 and the like are formed, and the liquid crystal 5 can be driven by applying a voltage between the common electrode 14 and the pixel electrode 12 described above (the configuration formed on the glass substrate 2 and the upper surface of the glass substrate 2 described above). Are collectively referred to as a counter substrate 18). An alignment film (not shown) for aligning the liquid crystal 5 is formed on the surfaces of the terminal substrate 13 and the counter substrate 18 that are in contact with the liquid crystal 5.

In addition, in the terminal region 19 protruding from the counter substrate 18 at the end of the terminal substrate 13, a signal made of a transparent conductive film such as an ITO film on the upper surface of the terminal substrate 13 on the same side as the drive element 7 is provided. An input terminal 20 is formed. A control board 21 on which a driving IC (Integrated Circuit) or the like is mounted is mounted on the terminal 20 with an FPC (Flexible Printed Circuit) 22 or the like. Further, the terminal 20 is connected to the gate wiring 8 or the source wiring 9 by wiring (not shown), and an input signal can be transmitted to the gate wiring 8 or the source wiring 9.

Further, the above-described terminal 20 is also electrically connected to a transfer electrode 23 provided outside the sealing material 4 on the terminal substrate 13 by wiring (not shown). The transfer electrode 23 is electrically connected to the common electrode 14 on the counter substrate 18 via a transfer material 24 that is a conductive material to form a transfer portion. By this transfer part, the signal inputted from the terminal 20 on the terminal substrate 13 is transmitted to the common electrode 14 on the opposite substrate 18 which is opposed to drive the liquid crystal 5.

As for the transfer portion of the liquid crystal display device according to the first embodiment, as shown in the enlarged view of the transfer portion in FIG. 1B, the step portion 25 that surrounds the periphery of the transfer electrode 23 and is opened in the substrate end direction. It has. Further, the step portion 25 is formed by the protective film 11 made of an organic insulating film of 3 μm, and has a structure in which the protective film 11 is removed from the transfer portion to the end portion of the terminal substrate 13.

Further, regarding the configuration of the terminal substrate 13, the insulating film 10 uses an appropriate combination of insulating films such as a silicon nitride film or a silicon oxide film. Although it is simplified in the drawing, there is actually an insulating film constituting the insulating film 10 between the layers of the driving element 7. As the pixel electrode 12, a liquid crystal display device is a transparent conductive film such as an ITO film, a metal film having a high reflectance on the surface, or a combination of both appropriately according to the type of transmission type, reflection type, semi-transmission type, etc. Is used. As the metal film having a high reflectance on the surface, Al, Ag, an alloy film containing them as a main component, or a multilayer film including at least one layer of the alloy film as a component is effective.

As described above, the liquid crystal display device of the first embodiment is configured. Although a backlight unit is arranged in a transmissive or transflective liquid crystal display device, a general white light type may be used in the first embodiment, and it may not be used like a reflective liquid crystal display device. Therefore, the illustration is omitted here. Further, in the liquid crystal display device, it is common to dispose polarizing plates on the outer sides of the terminal substrate 13 and the counter substrate 18, but in the first embodiment, it is not necessary to use a special one. The description is omitted, not shown.

Next, a manufacturing process of the above-described liquid crystal display device will be described. First, as a process for manufacturing the terminal substrate 13, a manufacturing method using an amorphous silicon TFT as the drive element 7 will be described as an example with reference to FIG. In the figure, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

As shown in FIG. 3A, a wiring material mainly composed of Cr, Al, Mo, Ti or the like is used on the glass substrate 1, and the display region 3 includes a gate electrode 26 and the terminal region 19 includes a terminal. A transfer pad 28 is formed on the pad 27 and the transfer portion. Subsequently, an insulating film 29 made of a silicon nitride film or the like, an amorphous silicon film that is an active layer of a TFT, or the like is formed, and silicon is patterned into an island shape to form a TFT channel 30.

Subsequently, as shown in FIG. 3B, a contact hole 31 and a contact hole 32 are formed corresponding to the terminal pad 27 and the transfer pad 28, and further, the source wiring and the source / drain electrode 33 are formed of Mo, Cr, It is formed by using a metal film mainly composed of Ti or the like or a laminated film of these and a metal film mainly composed of Al. At the same time, the terminal pad 34 and the transfer pad 35 are formed.

Further, as shown in FIG. 3C, an insulating film 36 made of an organic insulating film or a laminated film of a silicon nitride film and an organic insulating film is formed. Openings are formed in portions of the insulating film 36 corresponding to the pixel portion, terminal portion, and transfer portion, contact holes 37 and 38 are formed in the pixel portion and terminal portion, and a step portion 25 is formed in the transfer portion. Finally, the reflection part 39 of the pixel electrode 12 is formed with a metal film having a high surface reflectance, and the transmission part 40, the terminal 20 and the transfer electrode 23 of the pixel electrode 12 are formed with an ITO film, whereby the terminal substrate 13 is formed. Complete.

2 corresponds to the active element 7 made of amorphous silicon TFT by the gate electrode 26, the insulating film 29, the channel 30, the source / drain electrode 33, etc., and a part of the insulating film 29 and the insulating film 36. Thus, the insulating film 10 and the protective film 11 made of an organic insulating film are constituted by a part of the insulating film 36.

The reason why the organic insulating film is used as the insulating film 36 is that a thick insulating film can be formed relatively easily by a method such as spin coating. By forming an insulating film having a thickness of 1 μm or more rather than using a silicon nitride film or the like of about several hundred nm, the parasitic capacitance generated between the layers can be reduced. Therefore, it is possible to dispose the source wiring / source / drain electrode 33 and the pixel electrode 12 so as to overlap with each other, and a liquid crystal display device with a high aperture ratio and low power consumption can be obtained. Further, a step of 1 μm or more can be easily formed as the step portion 25.

Here, since the transflective liquid crystal display device has been described, the pixel electrode 12 is configured to have both the reflective portion and the transparent portion. In the case of a transmissive liquid crystal display device, it has a configuration having only a transmissive portion, and in the case of a reflective liquid crystal display device, it has a configuration having only a reflective portion.

Next, the cell assembly process of the liquid crystal display device will be described with reference to FIG. The terminal board 13 was prepared in the form of an array board 41 that can take a plurality of terminal boards 13 in accordance with the manufacturing method described above. As for the counter substrate 18 on which the color filter 16 is formed, a color filter substrate 42 that can take a plurality of counter substrates 18 in the same manner as the array substrate 41 is used, but a general material is used. The description of the manufacturing process is omitted. In the drawing, the film configuration and the like are simplified, and only one terminal substrate 13 and counter substrate 18 are shown, and the others are omitted.

Alignment films (FIG. 4) are separately provided on the surface of the array substrate 41 and the color filter substrate 42 shown in FIG. 4A (on the array substrate 41, the upper surface side in the figure, and on the color filter substrate 42, the lower surface side in the figure). (Not shown). Thereafter, as shown in FIG. 4A, the sealing material 4 which is a paste-like resin is applied to the surface of the array substrate 41 by a dispensing method using a nozzle or a screen printing method. Here, a screen printing method having a high processing capability is used when a large number of liquid crystal display devices are manufactured from a single glass substrate, such as when a small liquid crystal display device is manufactured.

Further, a transfer material 24 made of a conductive material is applied to the array substrate 41 in the vicinity of the transfer electrode 23. A silver paste is generally used as the conductive material. However, a small liquid crystal display device may be used outdoors, and an external force is often applied to the cell during use. Since silver paste is relatively easy to peel off, reliability problems are likely to occur. Accordingly, a paste material in which a spherical resin coated with a conductor such as gold or silver is dispersed in a sealant is used here as a conductive material that is unlikely to peel off. Further, although not shown, a step of dispersing a spacer material for determining the distance between the substrates is also performed.

Thereafter, as shown in FIG. 4B, these two substrates are overlapped and bonded together by applying heat and pressure and adhering with the sealing material 4. At this time, the transfer material 24 is crushed between the array substrate 41 and the color filter substrate 42 and spread on the transfer electrode 23. As a result, the transfer material 24 is in close contact with the surfaces of the transfer electrode 23 and the common electrode 17, whereby the transfer electrode 23 and the common electrode 14 are electrically connected. Thereby, conduction between the color filter substrate 42 and the array substrate 41 can be established. In the figure, only one display area 3 is shown and the others are omitted, but the display area 3 is formed so that a plurality of display areas 3 can be obtained.

Subsequently, as shown in FIG. 4C, the substrate is cut between the plurality of display regions 3, the liquid crystal 5 is injected, the injection port portion is sealed, and the cell 43 is formed.

Finally, as shown in FIG. 1, a control board 21 is mounted on the terminal 20, and a polarizing plate (not shown), a backlight unit (not shown) as a light source, etc. are arranged outside the cell 43 as necessary. Thus, the liquid crystal display device is completed.

Next, the transfer coating process in the first embodiment will be described in detail with reference to FIGS. Here, FIG. 5 is a schematic diagram showing the transfer coating apparatus used in the first embodiment. 6 is a schematic perspective view in the vicinity of the application position showing the application state, FIG. 7 is a schematic plan view showing the arrangement of the display area 3 and the application position on the array substrate 41, and FIG. 8 is a detailed position at the application position. It is the plane schematic diagram which showed the relationship.

As shown in FIG. 5, the array substrate 41 is processed by a transfer coating apparatus. In the drawing, a large number of display areas 3 are shown on the surface of the array substrate 41. The transfer coating apparatus includes a stage 44 on which an array substrate 41 to be processed is placed, a syringe 45 filled with a transfer material 24, a dot head 46 to which the syringe 45 is attached, a tube 47 connected to the syringe 45, and a syringe 47 through the tube 47. And a pressure applying unit 48 for applying pressure.

The application position of the transfer material 24 can be controlled by moving the stage while the substrate is placed in the X and Y directions in the figure. The syringe 45 has a needle at the tip like the syringe, and the paste-like transfer material 24 in the syringe is pushed out of the needle tip by the pressure of the applied air. Further, the dot head 46 moves up and down in the Z direction so that the needle of the syringe 45 is brought close to the surface of the array substrate 41, so that the transfer material 24 pushed out from the needle tip can be applied to the surface of the array substrate 41. The pressure application unit 48 is connected to the syringe 45 by a tube 47 and can apply pressure to the syringe 45 by sending air into the tube 47. The magnitude of the pressure to be applied, the timing of application, and the like can be controlled. In this apparatus, the application position is controlled only by the operation of the stage 44. However, a method in which the dot head 46 can be moved in the X direction may be used, and this method facilitates the application operation earlier.

Next, the application position on the surface of the array substrate 41 will be described with reference to FIGS. As shown in the schematic perspective view of FIG. 6, in two adjacent terminal boards 13a and 13b, a recess 49 surrounded by a step 25 is formed around the display area 3a and the display area 3b. ing. In a state where the transfer electrode is housed in the recess 49, the transfer material 24 is applied near the center of the recess 49. In the drawing, the transfer electrode is omitted, and only the rectangular step portion 25 surrounding the transfer electrode and the application position of the transfer material 24 are shown.

  A method for arranging the application positions of the terminal substrate 13, the display region 3, and the transfer material 24 on the array substrate 41 when the liquid crystal display device is multifaceted will be specifically described with reference to the schematic plan view of FIG. . As shown in the figure, the terminal boards 13 are arranged in the vertical and horizontal directions so that the terminal area 19 comes above the display area 3 in the figure. By arranging in this way, the transfer portions of the adjacent terminal boards 13 are arranged close to each other so as to be easily formed simultaneously. One stepped portion 25 is arranged so as to cover both of the adjacent terminal boards 13. Further, at the end of the arrangement of the terminal boards 13, the step portions 25 are arranged so that one end of the rectangle covers the terminal board 13 as shown in the figure. Further, the transfer material 24 was applied near the center of the rectangular step 25 as shown in the figure.

Next, the positional relationship between the transfer electrode 23 and the step portion 25 will be described with reference to the schematic plan view of FIG. As shown in FIG. 8, one transfer electrode 23a, 23b is disposed at each of both ends of the rectangular longitudinal direction with respect to the rectangular step portion 25, and each of the transfer electrodes 23a, 23b is a step portion. 25 is housed in a recessed portion 49 formed by 25. One transfer pad 35a, 35b in a region slightly smaller than the transfer electrodes 23a, 23b is also formed. Here, the transfer electrodes 23a and 23b and the transfer pads 35a and 35b correspond to the two adjacent terminal boards 13a and 13b in FIG. The applied transfer material 24 is indicated by a dotted line near the center of the step portion 25. As a result, the transfer material 24 is applied across both the transfer electrodes 23a and 23b to be formed.

The transfer material 24 applied as described above functions by being crushed between the array substrate 41 and the color filter substrate 42. Next, how the crushing transfer unit functions will be described in detail with reference to the drawings. Here, FIG. 9 is a schematic plan view for explaining the positional relationship when the sealing material 4 and the transfer material 24 are applied and crushed, and FIG. 9A is formed on the color filter substrate 42. FIG. 9B is a plan view showing the arrangement of the transfer material 24 formed on the array substrate 41, and FIG. 9C is a plan view showing the arrangement of the color filter substrate 42 and the array substrate 41. FIG. It is a top view which shows arrangement | positioning in the state put together. In (a) and (b), the positional relationship with the opposing substrates at the time of bonding (in (a), the position of the step portion 25 and the position of the transfer material 24 on the array substrate 41, and in (b), the color filter The positions of the sealing material 4 and the dummy seal 50 on the substrate 42) are indicated by dotted lines.

Thus, the sealing material 4 and the dummy seal 50 are arranged so as to surround the step portion 25. The transfer material 24 applied in the vicinity of the center of the stepped portion 25 spreads in a region surrounded by the stepped portion 25 when crushed as shown in FIG. 9C. The step portion 25, the seal material 4 around the step portion, and the dummy seal 50 all have an effect of preventing the transfer material 24 from spreading to a region other than the region surrounded by the step portion 25. As a result, the applied transfer material 24 spreads to an unintended region, causes a short circuit between the substrates, and does not spread sufficiently in the region surrounded by the step portion 25 and does not function as a transfer portion. Can be prevented. The dummy seal 50 is simultaneously formed by screen printing in which the sealing material 4 is formed of the same material as the sealing material 4.

Even when the dummy seal 50 is not formed, the step portion 25 serves as a bank, and therefore has an effect of preventing the transfer material 24 from spreading unnecessarily to some extent. However, since the dummy seal 50 has the effect of spreading inward in the step and pushing back the transfer material 24, it is possible to reliably prevent unnecessary spreading. Even when the step portion 25 is not formed, unnecessary spread is prevented to some extent by the arrangement of the dummy seal 50 and the seal material 4. However, the stepped portion 25 is formed in the shape of the first embodiment, and further, the stepped portion 25 having a thickness of 3 μm or more is formed by using an organic insulating film capable of relatively easily increasing the film thickness. Can be prevented.

  Subsequently, FIG. 10 is a schematic plan view illustrating a state at the time of cutting near the transfer portion. As shown in this figure, the transfer electrode 23 and the transfer material 24 are divided by cutting the substrate between the display area 3a and the display area 3b, and the transfer portions (transfer electrodes 23a, 23b) of the two liquid crystal display devices are divided. And transfer material 24a, 24b).

In the first embodiment described above, the transfer portions of two liquid crystal display devices can be formed at the same time without particularly adding new processes. As a result, the number of coatings of the transfer material 24 can be reduced and the manufacturing process can be simplified. In addition, the processing capacity of the transfer process of the transfer material 24 can be improved to nearly twice, and the manufacturing cost of the liquid crystal display device can be reduced. Further, since the structure around the transfer electrode 23 is optimized, the applied transfer material 24 spreads to an unintended region, causing a short circuit between the substrates, and in a region sufficiently surrounded by the step portion 25. Inconveniences such as not functioning as a transfer unit by not spreading do not occur.

Further, in the first embodiment, as shown in FIG. 8, two transfer electrodes 23a and 23b and two transfer pads 35a and 35b are formed, which correspond to the two adjacent terminal substrates 13a and 13b in FIG. Explained the case. However, it is not necessary to be limited to such a shape, and it may be formed in one pattern in which the transfer electrodes 23 are connected as shown in the schematic plan view of FIG. Since it is finally divided into two terminal boards 13a, 13b, the rectangular longitudinal end portions of the rectangular stepped portion 25 become transfer electrodes 23a, 23b of the respective terminal boards 13a, 13b. . Similarly, as shown in FIG. 11B, the transfer pad 35 may also be formed in a single connected pattern.

  Further, in the first embodiment, as shown in FIG. 7, the display device provided with two transfer portions in the corner portion opposite to the terminal region 19 with respect to one display device has been described. Furthermore, in a small liquid crystal display device, it is difficult for a display problem to occur even if the resistance of conduction at the transfer portion is high. Therefore, it is possible to design a display device having one transfer portion for one display device. It is. A modification is shown in the schematic plan view showing the arrangement of the display area 3 and the terminal area 19 on the array substrate 41 in FIG. In such a case, as shown in the drawing, the transfer material 24 can be applied every other row between the adjacent terminal substrates 13. In this case, two types of display devices in which the position of the transfer part is different from the position of the terminal region 19 are manufactured. However, it can be used as the same product as long as the specifications required for display quality can be satisfied. Even if manufactured in such an arrangement, the transfer portions of the two liquid crystal display devices can be formed simultaneously, and the same effect as in the first embodiment can be obtained.

  Another modification is shown in a schematic plan view showing the arrangement of the display area 3 and the terminal area 19 on the array substrate 41 in FIG. In this way, it is possible to design a display device in which two transfer portions are installed on one side with respect to the position of the terminal region 19. In such a case, as described with reference to FIG. 12, two types of display devices in which the position of the transfer portion is different from the position of the terminal region 19 may be manufactured. Here, as shown in FIG. 13, each terminal substrate 13 is arranged on the array substrate 41 alternately with the terminal region 19 coming above the display region 3 and the one coming below the display region 3 in the figure. When arranged in this way, the transfer parts of the adjacent terminal boards 13 are arranged close to each other so that it is easy to form at the same time, and manufacturing is performed so that the position of the transfer part matches the position of the terminal region 19 in all display devices. Can do. Even if manufactured in such an arrangement, the transfer portions of the two liquid crystal display devices can be formed simultaneously, and the same effect as in the first embodiment can be obtained.

In the first embodiment described above, the dummy seal 50 that prevents the transfer material 24 from spreading is disposed in the vicinity of the transfer electrode 23 so as to surround the step portion 25. This is because the transfer material 24 is most effectively spread in the region surrounded by the stepped portion 25. If the transfer material 24 is in the vicinity of the transfer electrode 23, the transfer material 24 spreads to an unintended region even if applied to other positions. There is an effect such as preventing.

Embodiment 2.
In the first embodiment, the transfer material 24 applied in the vicinity of the center of the concave portion 49 surrounded by the rectangular step portion 25 is expanded in the concave portion 49 only by crushing between the substrates. If it does not sufficiently extend onto the transfer electrodes 23 at both ends, a required resistance value may not be obtained in a display device or the like having a strict resistance value, resulting in a defective product. Therefore, a second embodiment in which the transfer material 24 is surely expanded onto the transfer electrodes 23 on both sides will be described.

  In the second embodiment, only the method for forming the dummy seal 50 is different from that in the first embodiment. Except for this change, the manufacturing method and structure are the same as those in the first embodiment, and thus the description thereof is omitted.

Here, FIG. 14 is a schematic plan view for explaining the positional relationship when the sealing material 4, the dummy seal 50, and the transfer material 24 are applied and crushed in the second embodiment, and FIG. ) Is a plan view showing the arrangement of the sealing material 4 formed on the color filter substrate 42, FIG. 14B is a plan view showing the arrangement of the transfer material 24 formed on the array substrate 41, and FIG. 14C. FIG. 4 is a plan view showing an arrangement in a state where the color filter substrate 42 and the array substrate 41 are bonded together. In (a) and (b), the positional relationship with the opposing substrates at the time of bonding (in (a), the position of the step portion 25 and the position of the transfer material 24 on the array substrate 41, and in (b), the color filter The positions of the sealing material 4 and the dummy seal 50 on the substrate 42) are indicated by dotted lines.

14A and 14B, the sealing material 4 and the dummy seal 50 are arranged so as to surround the stepped portion 25. Further, unlike the first embodiment, a dummy seal 50 is additionally arranged near the boundary between two adjacent terminal boards 13 so as to cross the rectangular stepped portion 25.

As shown in FIG. 14C, the transfer material 24 applied near the center of the stepped portion 25 spreads into a region surrounded by the stepped portion 25 when crushed. As in the first embodiment, the step portion 25, the seal material 4 around the step portion, and the dummy seal 50 all have an effect of preventing the transfer material 24 from spreading to a region other than the region surrounded by the step portion 25. . Further, the dummy seal 50 additionally arranged in the second embodiment is arranged between two finally formed transfer electrodes 23 so as to overlap the application position of the transfer material 24, and the terminal is formed by being crushed. It spreads from near the boundary of the substrate 13. At this time, the transfer material 24 is pushed out from the central portion toward the left and right transfer electrodes 23 in the region surrounded by the step portion 25. In this manner, the transfer material 24 can be reliably expanded in the region surrounded by the step portion 25. Subsequently, the transfer electrode 23 and the transfer material 24 are divided by cutting the substrate in the same manner as in the first embodiment, and can function as respective transfer portions of the two liquid crystal display devices.

  In the second embodiment described above, the transfer portions of the two liquid crystal display devices can be formed at the same time, and the same effects as those of the first embodiment can be obtained. The material 24 can be reliably expanded.

Embodiment 3.
A third embodiment will be described, which is a method in which the transfer material 24 is surely spread over the transfer electrodes 23 on both sides by a method different from the method described in the second embodiment. In the third embodiment, only the coating method of the transfer material 24 is different from that in the first embodiment. Except for this change, the manufacturing method and structure are the same as those in the first embodiment, and thus the description thereof is omitted.

When the transfer coating apparatus as shown in FIG. 5 described in the first embodiment is used, the applied transfer material 24 has a circular coating shape as shown in the plan view of FIG. However, in the third embodiment, the application shape of the transfer material 24 is flattened from a circle in a horizontal cross section with the array substrate 41 to be applied. Furthermore, the flat direction is flattened in the direction of the two transfer electrodes 23 to be finally formed.

  Several methods that can apply the transfer material 24 to such a flat shape are conceivable, which will be described in turn below. A first method will be described with reference to a schematic diagram showing a method for applying the transfer material 24 in FIG. As shown in the schematic perspective view of FIG. 15A, the syringe 45 has an elliptical cross section at the tip. Application is performed by setting the syringe 45 to the array substrate 41 so that the longitudinal direction of the elliptical shape of the needle coincides with the longitudinal direction of the rectangle surrounded by the stepped portion 25 to be applied. When application is performed in this manner, the applied transfer material 24 becomes elliptical as shown in the schematic plan view of FIG. Further, the flattened direction is finally flattened in the direction of the two transfer electrodes 23 formed at both ends of the rectangle surrounded by the step portion 25.

  Next, a second method will be described with reference to a schematic diagram showing a method for applying the transfer material 24 in FIG. As shown in the schematic perspective view of FIG. 16A, the tip of the syringe 45 is inclined with respect to the array substrate 41 from the vertical direction. Application is performed by setting the syringe 45 on the array substrate 41 so that the direction in which the needle is inclined coincides with the longitudinal direction of the rectangle surrounded by the stepped portion 25 to be applied. The coating operation is performed vertically with respect to the array substrate 41 as indicated by arrows in the figure. When the application is performed in this manner, the applied transfer material 24 is flattened in the longitudinal direction of the rectangle surrounded by the step portions 25 as shown in the schematic plan view of FIG. This is because the transfer material 24 wraps around the side of the inclined needle and is applied.

FIG. 17 is a schematic perspective view showing a method for applying the transfer material 24 with the syringe 45 itself inclined. Even in such a case, the state in which the needles are inclined from the vertical direction with respect to the array substrate 41 is not changed, so that the applied transfer material 24 has the same shape as that in FIG.

  Next, a third method will be described with reference to a schematic diagram showing a method for applying the transfer material 24 in FIG. As shown in the schematic perspective view of FIG. 18A, the syringe 45 is inclined from the vertical direction with respect to the array substrate 41. Application is performed by setting the syringe 45 to the array substrate 41 so that the inclined direction coincides with the longitudinal direction of the rectangle surrounded by the stepped portion 25 to be applied. The coating operation is moved up and down in parallel with the direction in which the syringe 45 is inclined as shown by the arrows in the figure. When the application is performed in this manner, the applied transfer material 24 is flattened in the longitudinal direction of the rectangle surrounded by the step portion 25 as shown in the schematic plan view of FIG.

Such a shape can be explained as follows. Since the transfer material 24 is paste-like, it has viscosity. Therefore, as shown in FIG. 18A, when the syringe needle is separated from the array substrate 41, the transfer material 24 extends upward. When the operation direction is perpendicular to the substrate, the extended transfer material 24 returns directly below, so that the coating shape is circular. However, when the operation is in an oblique direction, the extended transfer material 24 adheres to the substrate so as to fall sideways, and thus has a flat shape as shown in FIG.

Further, as shown in the schematic perspective view showing the method of applying the transfer material 24 in FIG. 19, the syringe 45 itself can be perpendicular to the array substrate 41 and only the operation direction can be inclined from the vertical direction. Even in such a case, the transfer material 24 extends obliquely with respect to the array substrate 41. As a result, the applied transfer material 24 has the same shape as in FIG.

In any of the methods described above, the transfer material 24 can be applied flatly in the direction of the two adjacent transfer electrodes 23. When the transfer material 24 is formed in this way, it is close to the rectangular shape of the region surrounded by the step portion 25 as compared with a case where the transfer material 24 is applied in a circular shape. For this reason, when being crushed between the array substrate 41 and the color filter substrate 42, the transfer material 24 is surely spread over the transfer electrodes 23 on both sides. The reason why the transfer material 24 is applied so as to flatten in the direction of the two transfer electrodes 23 is to spread the region in the region surrounded by the stepped portion 25 most effectively. By flattening and applying, the transfer material 24 is surely spread on the transfer electrode 23.

  In the third embodiment described above, the effect that the transfer portions of the two liquid crystal display devices can be formed simultaneously as in the first embodiment is obtained, and the step portion 25 is surrounded as in the second embodiment. It becomes possible to reliably spread the transfer material 24 on the transfer electrode 23 in the region.

Embodiment 4.
In the first embodiment, a method has been described in which the transfer portions of two liquid crystal display devices can be formed at the same time, and the throughput of the transfer material 24 is improved. Next, Embodiment 4 will be described, which is a method capable of simultaneously forming the transfer portions of four liquid crystal display devices that are further effective in improving the processing capability.

  In the fourth embodiment, the shape of the stepped portion 25, the formation position of the dummy seal 50, the application position of the transfer material 24, and the like are different from those of the first embodiment, but the manufacturing method and structure are the same as those of the first embodiment except for this change. Since it is the same as 1, the description is omitted.

The arrangement of the display area 3 and the terminal area 19 on the array substrate 41 in the fourth embodiment is shown in the schematic plan view of FIG. As shown in the drawing, each terminal board 13 has a transfer portion arranged so as to come to a corner portion of the end portion opposite to the end portion where the terminal region 19 is arranged with respect to the display region 3. Further, the terminal board 13 is arranged such that the position of the terminal region 19 changes for each row. By arranging in this way, the four terminal boards 13 that are close to each other are arranged close to each other so that the transfer portions can be easily formed simultaneously. In the drawing, the transfer electrode 23 is omitted for the transfer portion, and only the rectangular step portion 25 surrounding the transfer electrode 23 and the application position of the transfer material 24 are shown. The step portions 25 are arranged one by one so as to cover the four terminal boards 13 that are close to each other. Further, at the end of the arrangement of the terminal boards 13, the stepped portions 25 are arranged so that one end of the quadrangular area is over the terminal board 13 as shown in the figure. The application position of the transfer material 24 was set near the center of the rectangular step portion 25 as shown in the figure.

Here, FIG. 21 is a schematic plan view for explaining the positional relationship when the sealing material 4 and the transfer material 24 are applied and crushed in the fourth embodiment, and FIG. 21 is a plan view showing the arrangement of the sealing material 4 formed on the substrate 42, FIG. 21B is a plan view showing the arrangement of the transfer material 24 formed on the array substrate 41, and FIG. 21C is a color filter substrate. 4 is a plan view showing an arrangement in a state where 42 and an array substrate 41 are bonded together. In (a) and (b), the positional relationship with the opposing substrates at the time of bonding (in (a), the position of the step portion 25 and the position of the transfer material 24 on the array substrate 41, and in (b), the color filter The position of the sealing material 4 on the substrate 42) is indicated by a dotted line.

21A and 21B, the sealing material 4 is disposed so as to surround the step portion 25. The transfer material 24 applied in the vicinity of the center of the step portion 25 spreads in the region surrounded by the step portion 25 when crushed as shown in FIG. Similar to the first embodiment, the step portion 25 and the seal material 4 around the step portion have an effect of preventing the region from expanding to a region other than the region surrounded by the step portion 25. Subsequently, the transfer electrode 23 and the transfer material 24 are divided by cutting the substrate in the same manner as in the first embodiment, and can function as transfer portions of the four liquid crystal display devices.

In the fourth embodiment described above, the transfer portions of four liquid crystal display devices can be formed at the same time without adding new processes. As a result, the number of coatings of the transfer material 24 can be reduced and the manufacturing process can be simplified. Further, the processing capacity of the process can be improved to nearly four times, and the manufacturing cost of the liquid crystal display device can be reduced. Further, since the structure around the transfer electrode 23 is optimized, the applied transfer material 24 spreads to an unintended region, causing a short circuit between the substrates, and in a region sufficiently surrounded by the step portion 25. Inconveniences such as not functioning as a transfer unit by not spreading do not occur.

Embodiment 5.
In the fourth embodiment, since the step portion 25 and the seal material 4 around the step portion have an effect of preventing the transfer material 24 from spreading outside the region surrounded by the step portion 25, the step portion 25 is installed in the first embodiment. The dummy seal 50 having the role of preventing such spread was not arranged. However, even if the dummy seal 50 having the effect of reliably expanding the transfer material 24 in the region surrounded by the step portion 25 described in the second embodiment is added to the fourth embodiment, it is effective. Next, a fifth embodiment in which the effect of expanding the transfer material 24 is improved will be described.

  In the fifth embodiment, only the method for forming the dummy seal 50 and the shape of the stepped portion 25 are different from those in the fourth embodiment, but the manufacturing method and structure are the same as those in the fourth embodiment except for this change. Description is omitted.

Here, FIG. 22 is a schematic plan view for explaining the positional relationship when the seal material 4, the dummy seal 50, and the transfer material 24 are applied and crushed in the fifth embodiment, and FIG. ) Is a plan view showing the arrangement of the sealing material 4 formed on the color filter substrate 42, FIG. 22B is a plan view showing the arrangement of the transfer material 24 formed on the array substrate 41, and FIG. FIG. 4 is a plan view showing an arrangement in a state where the color filter substrate 42 and the array substrate 41 are bonded together. In (a) and (b), the positional relationship with the opposing substrates at the time of bonding (in (a), the position of the step portion 25 and the position of the transfer material 24 on the array substrate 41, and in (b), the color filter The positions of the sealing material 4 and the dummy seal 50 on the substrate 42) are indicated by dotted lines.

First, the step portion 25 is changed from that of the fourth embodiment so that the transfer material 24 can easily spread in the direction of the four transfer portions. As shown in FIGS. 22 (a) and 22 (b), the shape is an oblique cross formed by combining two rectangles whose longitudinal directions coincide with the directions of the four transfer portions. In addition, the dummy seal 50 is arranged in a cross shape so that the oblique cross-shaped step portion 25 is divided into four near the boundary between the terminal boards 13.

The transfer material 24 applied in the vicinity of the center of the stepped portion 25 spreads in a region surrounded by the stepped portion 25 when crushed as shown in FIG. As in the fourth embodiment, both the step portion 25 and the seal material 4 around the step portion have an effect of preventing spreading to a region other than the region surrounded by the step portion 25. Further, by changing the shape of the stepped portion 25, the effect of leading from the center portion toward the four end portions of the oblique cross shape increases. Further, the dummy seal 50 additionally arranged in the fifth embodiment is arranged so as to overlap the application position of the transfer material 24 between the four transfer electrodes 23 to be finally formed. It spreads from near the boundary of the terminal board 13. At this time, the transfer material 24 is pushed out from the central portion in the direction of each of the four oblique cross-shaped ends, that is, in the direction of the transfer electrode 23 in the region surrounded by the step portion 25. In this manner, the transfer material 24 can be reliably expanded in the region surrounded by the step portion 25.

  In the fifth embodiment described above, the effect that the transfer portions of four liquid crystal display devices can be formed simultaneously as in the fourth embodiment is obtained, and the step portion 25 is surrounded as in the second embodiment. It is possible to reliably spread the transfer material 24 in the region.

In Embodiment 1-5 demonstrated above, it apply | coated so that it might straddle over any transfer electrode 23 formed by apply | coating the transfer material 24 to the center part of the area | region enclosed by the level | step-difference part 25. . This is because the transfer material 24 is most effectively spread within the region surrounded by the stepped portion 25, and may be applied to other positions as long as it is close to the transfer electrode 23.

As described above, Embodiments 1 to 5 have been described using TFTs using an amorphous silicon film as an active layer as an example of the drive element 7. The driving element 7 includes a TFT using a polysilicon film as an active layer, and further a thin film diode. The driving element 7 includes all elements capable of actively controlling signals. The liquid crystal display device using these drive elements 7 also has the same effect if it has a transfer portion that electrically connects the electrodes on the terminal substrate 13 and the electrodes on the counter substrate 18.

In addition, as the first to fifth embodiments, the liquid crystal display device having the drive element 7 has been described as an example. However, the terminal substrate 13 is also used when the drive element 7 is not specially provided, such as a passive liquid crystal display device. In the case of having a transfer portion that electrically connects the upper electrode and the electrode on the counter substrate 18, all the same effects are obtained.

As a modification of the first to fifth embodiments, a common electrode 14 provided on the counter substrate 18 is installed on the terminal substrate 13 side, and a horizontal electric field is applied to the liquid crystal 5 in the horizontal direction between the pixel electrode 12. Also in the case of a liquid crystal display device using the method, as in the case of a type in which the counter substrate 18 is also provided with an electrode, a transfer unit that electrically connects the electrode on the terminal substrate 13 and the electrode on the counter substrate 18 is provided. All have the same effect.

FIG. 2 is a schematic plan view showing the entire liquid crystal display device according to Embodiment 1 of the present invention and a schematic perspective view in the vicinity of a transfer portion. It is the cross-sectional schematic diagram which showed the liquid crystal display device in Embodiment 1 of this invention. It is a cross-sectional schematic diagram which shows the manufacturing process of the terminal substrate of the liquid crystal display device in Embodiment 1 of this invention. It is a cross-sectional schematic diagram which shows the cell assembly process of the liquid crystal display device in Embodiment 1 of this invention. It is a schematic diagram which shows the transfer coating apparatus used in Embodiment 1 of this invention. It is a perspective schematic diagram of the application position vicinity in Embodiment 1 of this invention. It is a plane schematic diagram which shows arrangement | positioning of the display area and application | coating position on the array substrate of Embodiment 1 of this invention. It is a plane schematic diagram of the application position vicinity in Embodiment 1 of this invention. It is a plane schematic diagram which shows the positional relationship at the time of application | coating and crushing of the sealing material and transfer material in Embodiment 1 of this invention. It is a plane schematic diagram explaining the mode at the time of the cutting | disconnection of the transfer part vicinity in Embodiment 1 of this invention. It is a schematic plan view of the vicinity of the application position in a modification of the first embodiment of the present invention. It is a plane schematic diagram which shows arrangement | positioning of the display area and terminal area on an array board | substrate in the modification of Embodiment 1 of this invention. It is a plane schematic diagram which shows arrangement | positioning of the display area and terminal area on an array board | substrate in the modification of Embodiment 1 of this invention. It is a plane schematic diagram which shows the positional relationship at the time of application | coating and crushing of the sealing material and transfer material in Embodiment 2 of this invention. It is a schematic diagram which shows the coating method of the transfer material in Embodiment 3 of this invention. It is a schematic diagram which shows the coating method of the transfer material in Embodiment 3 of this invention. It is a schematic diagram which shows the coating method of the transfer material in Embodiment 3 of this invention. It is a schematic diagram which shows the coating method of the transfer material in Embodiment 3 of this invention. It is a schematic diagram which shows the coating method of the transfer material in Embodiment 3 of this invention. It is a plane schematic diagram which shows arrangement | positioning of the display area and terminal area on an array board | substrate in Embodiment 4 of this invention. It is a plane schematic diagram which shows the positional relationship at the time of application | coating and crushing of the sealing material and transfer material in Embodiment 4 of this invention. It is a plane schematic diagram which shows the positional relationship at the time of application | coating and crushing of the sealing material and transfer material in Embodiment 5 of this invention.

Explanation of symbols

3 Display area, 23 Transfer electrode, 24 Transfer material, 41 Array substrate, 42 Color filter substrate, 49 Recess, 50 Dummy seal.

Claims (8)

In a method of manufacturing a liquid crystal display device that performs multi-face drawing by cutting a plurality of display areas formed between a pair of substrates, both of the pair of transfer electrodes arranged opposite to each other on the substrate between the adjacent display areas A step of applying a conductive material to a position close to the substrate, a step of spreading the applied conductive material to both of the transfer electrodes by bonding the pair of substrates, and a step on the transfer electrode when cutting between the display regions And a step of dividing the conductive material and forming transfer portions in the vicinity of the display region. The method for manufacturing a liquid crystal display device according to claim 1, wherein the conductive material is applied in a state where the pair of transfer electrodes is housed in the recess formed in the substrate. 3. The method for manufacturing a liquid crystal display device according to claim 1, wherein a dummy seal that prevents the conductive material from spreading is provided in the vicinity of the pair of transfer electrodes. The method for manufacturing a liquid crystal display device according to claim 1, wherein the conductive material is applied flatly to at least one of the pair of transfer electrodes. In a method of manufacturing a liquid crystal display device that performs multi-face drawing by cutting a plurality of display areas formed between a pair of substrates, four of the four opposingly arranged substrates are surrounded by the four adjacent display areas. A step of applying a conductive material to a position close to all of the transfer electrodes; a step of spreading the applied conductive material to all of the four transfer electrodes by bonding the pair of substrates; and between the display regions And a step of dividing the conductive material on the transfer electrode into four parts at the time of cutting and forming transfer portions in the vicinity of the display region. 6. The method of manufacturing a liquid crystal display device according to claim 5, wherein the conductive material is applied in a state where all of the four transfer electrodes are accommodated in the recess formed in the substrate. The method for manufacturing a liquid crystal display device according to claim 1, wherein a dummy seal is provided at a position where the conductive material is applied. The method for manufacturing a liquid crystal display device according to claim 1, wherein a conductive material is applied across any transfer electrode.

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