JP2007270230A - Surface treatment apparatus and optical element forming mold - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface treatment apparatus capable of precisely and reliably treating the surface of a body to be treated and enhancing treating ability, and to provide an optical element forming mold which is surface-treated by the surface treatment apparatus. <P>SOLUTION: The surface treatment apparatus 1 comprises: a vacuum chamber (vacuum vessel) 2; a vapor deposition source 10 which comprises a target connected with a trigger electrode via a cylindrical insulation material and an arc electrode of inducing arc discharge around the target and discharges a plasma 8 containing target ions generated by the arc discharge to the top end direction of the target; a support stand 12 for placing an optical element forming mold raw material (the body to be treated) 11 thereon; a deflection part 13 for deflecting an advancing direction of the plasma 8 discharged from the vapor deposition source 10 so that the advancing direction of the plasma 8 becomes the center axial line C direction near the support stand 12; and a shielding plate 20 which is arranged between the deposition source 10 and the support stand 12 and has an opening part 20A formed only on a transport path of the plasma 8 deflected by the deflection part 13. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a surface treatment apparatus and an optical element molding die.

  When surface treatment is performed on a surface treatment device having a solid arc plasma source including a target, electrically neutral droplets and scattered particles that travel straight without being affected by the magnetic field along with the plasma are generated by the arc discharge. To do. When these scatter to the surface of the object to be processed, it causes defects on the surface of the object to be processed.

Therefore, in order to restrict the arrival of droplets and scattered particles to the surface of the object to be processed, a ring-shaped or coil-shaped magnet is arranged in the vacuum vessel, and a deflection magnetic field is applied between the solid arc plasma source and the object to be processed. An apparatus is disclosed (for example, refer to Patent Document 1). In this apparatus, only the plasma is guided to the object to be processed by the deflection magnetic field, while the droplets and scattered particles can be excluded from the plasma transport path to prevent reaching the object to be processed.
JP 2004-225107 A

  However, in the conventional technology, in the case of a refractory metal droplet, the solidification of the surface starts from the moment it is generated and scattered, and the surface is already solidified when it collides with the inner wall of the vacuum vessel or the magnetic field induction magnet. , It will be reflected again in the container without sticking. At this time, some of the scattered particles that are reflected change the path in the direction of the object to be processed, and these may adhere to the surface of the object to be processed. In that case, a microscopic defect occurs in the film formed on the surface of the object to be processed. In particular, in the case of a heat-resistant film, a corrosion-resistant film, and an optical mirror film, there is a possibility that the function is deteriorated. Further, when the object to be processed is placed outside the plasma transport path, the scattered particles may collide with the surface as described above, so that only the object to be processed can be put into the vacuum vessel. Therefore, the surface treatment cannot be performed continuously, and the production efficiency cannot be improved.

  The present invention has been made in view of the above circumstances, a surface processing apparatus capable of processing the surface of an object to be processed with high accuracy and reliability, and capable of enhancing the processing capability, and an optical surface processed by the surface processing apparatus. An object is to provide an element molding die.

The present invention employs the following means in order to solve the above problems.
A surface treatment apparatus according to the present invention includes a target connected to a trigger electrode through an insulator, an arc electrode for inducing arc discharge around the target, and plasma containing target ions generated by the arc discharge The normal line of the surface on which the deposition source that emits the target toward the tip of the target and the surface on which the target ion reaches the target ion is inclined with respect to the plasma emission direction in the vicinity of the deposition source. A support table, a deflecting unit for deflecting the traveling direction of the plasma emitted from the deposition source so as to be substantially normal to the surface of the support table in the vicinity of the support table, the deposition source and the support And a shielding plate having an opening formed only on a plasma transport path deflected by the deflecting unit. .

  According to the present invention, plasma is inserted through the opening of the shielding plate, while scattered particles such as droplets scattered off the plasma transport path can be reflected, and it is preferable that the scattered particles reach the object to be processed. Can be regulated. Further, even if the plasma transport path becomes unstable, most of the plasma hits the shielding plate instead of the vacuum container, so that contamination of the vacuum container can be reduced.

  Further, the surface treatment apparatus according to the present invention is the surface treatment apparatus, wherein the object to be treated after the surface treatment is retracted from the plasma transport path, and is more distal to the deposition source than the shielding plate. And a replacement device for moving the object to be processed before the surface treatment disposed on the side and at a position deviated from the plasma transport path onto the plasma transport path.

  In the present invention, even if the object to be processed is disposed at a position deviated from the plasma transport path on the distal side of the shielding plate with respect to the vapor deposition source, the shielding plate is scattered by scattered particles such as plasma and droplets. Can be suppressed. Therefore, it can suppress that the to-be-processed object before a process is contaminated with scattering particles, such as a plasma and a droplet.

  Further, the surface treatment apparatus according to the present invention is the surface treatment apparatus, wherein the replacement device is disposed adjacent to the vacuum container via a pressure adjusting unit for maintaining the pressure in the vacuum container. A first storage chamber for waiting for the object to be processed before processing; and a pressure regulating unit for maintaining the pressure in the vacuum container; And a second storage chamber for storing the object to be processed.

  The present invention moves the object to be processed between the first storage chamber, the vacuum container, and the second storage chamber even when the object to be processed is stored in the first storage chamber different from the vacuum container. Thus, continuous processing can be performed on a plurality of objects to be processed without opening the vacuum container itself to the atmosphere. Therefore, it is possible to more suitably suppress scattering particles such as droplets that are scattered from the plasma transport path and reach the object to be processed.

  The surface treatment apparatus according to the present invention is the surface treatment apparatus, further comprising a bias power supply unit that applies a bias voltage to the object to be processed. According to the present invention, charged target ions contained in plasma can be implanted from the surface of the object to be processed into the inside, and the adhesion strength can be improved.

  The mold for molding an optical element according to the present invention is manufactured from an object to be processed which has been surface-treated by the surface treatment apparatus according to the present invention. Since the present invention is surface-treated by the surface treatment apparatus according to the present invention, microscopic surface defects due to droplets, scattered particles, and the like are suitably suppressed, and a surface with high density and high adhesion strength can be obtained.

  ADVANTAGE OF THE INVENTION According to this invention, the surface of a to-be-processed object can be processed with high precision and certainty, and processing capacity can be improved.

A first embodiment according to the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the surface treatment apparatus 1 according to this embodiment includes a vacuum chamber (vacuum container) 2, a target 6 connected to a trigger electrode 5 via a cylindrical insulator 3, and An evaporation source 10 that has an arc electrode 7 that induces arc discharge around the target 6, emits plasma 8 containing target ions generated by the arc discharge in the direction of the tip 6 a of the target 6, and an optical element molding die base material A support base 12 on which the (target object) 11 is placed, and a deflection unit 13 for deflecting the traveling direction of the plasma 8 emitted from the vapor deposition source 10 so as to be in the direction of the central axis C in the vicinity of the support base 12. It has.

  A vacuum exhaust system (not shown), a trigger power source 15, and an arc power source 16 that adjust the interior from atmospheric pressure to a predetermined pressure are connected to the outside of the vacuum chamber 2.

The target 6 is made of, for example, rod-shaped iridium.
The trigger electrode 5 and the arc electrode 7 are connected to the anode side of the trigger power source 15 and the arc power source 16, respectively, and the target 6 is connected to the cathode side of the trigger power source 15 and the arc power source 16. The arc power supply 16 is wired with a capacitor (not shown) in a state where electricity is stored. The arc electrode 7 and the target 6 are not electrically connected.

  The arc electrode 7 is a cylindrical stainless steel member, and the target 6 is inserted therein. The arc electrode 7 is formed to a length capable of shielding the target 6 from the optical element molding die base material 11 placed on the support base 12. The tip 7a side of the arc electrode 7 protrudes from the tip 6a of the target 6, while the distal side of the support base 12 is cut out into a semicylindrical shape and opened.

  The deflecting unit 13 includes a ring-shaped magnet 17 and an iron L-shaped yoke 18 that adjusts the direction of the lines of magnetic force generated from the magnet 17. The magnet 17 is disposed on one side 18 </ b> A of the L-shaped yoke 18 so that the magnetic pole is in the axial direction of the target 6. The vapor deposition source 10 is arranged inward in the radial direction of the magnet 17 on the one side portion 18A.

  The support 12 is formed in a substantially disk shape, and is on the path of magnetic lines of force formed by the L-shaped yoke 18 so that the central axis C is inclined with respect to the emission direction P of the plasma 8 in the vicinity of the vapor deposition source 10. It is arranged on the other side 18B of the position. In the present embodiment, the emission direction P of the plasma 8 from the vapor deposition source 10 and the central axis C are substantially orthogonal. On the surface of the support 12 on the side of the vapor deposition source 10, an optical element is formed at a predetermined interval on the concentric circle around the central axis C and at a predetermined distance from the central axis C and radially outward. A plurality of mold base materials 11 can be placed (two in the figure).

  Between the vapor deposition source 10 and the support 12, a shielding plate 20 having an opening 20 </ b> A formed only on the transport path of the plasma 8 deflected by the deflecting unit 13 extends from the wall surface of the vacuum chamber 2 to an L-shaped yoke. 18 extends along one side 18B to the vicinity of the other side 18A. The size of the opening 20A is substantially the same as the diameter of the plasma 8 at the position where the shielding plate 20 is disposed. Therefore, other than the optical element molding die base material 11 to be processed is disposed at a position away from the transport path of the plasma 8 on the distal side of the shielding plate 20 with respect to the vapor deposition source 10. The shielding plate 20 is made of a nonmagnetic material and is configured not to be affected by the magnetic force of the deflection unit 13.

  The support base 12 is rotated about the central axis C via the shaft 21 to retract the optical element molding base material 11 after the surface treatment from the transport path of the plasma 8 and before the surface treatment. A moving part (replacement device) 22 for moving the optical element molding die base material 11 on the transport path of the plasma 8 is connected. The moving unit 22 is also configured to swing the support base 12 in a biaxial direction perpendicular to the direction of the central axis C of the support base 12 with respect to the target 6 during processing. The moving unit 22 includes a support base swinging drive system (not shown) and a stepping motor for rotating the support base.

Next, the operation of the surface treatment apparatus 1 according to this embodiment will be described.
First, a plurality of optical element molding die base materials 11 for surface treatment are mounted on the support base 12. After the inside of the vacuum chamber 2 is evacuated by the evacuation system, the stepping motor or the like of the moving unit 22 is driven to rotate the support base 12 around the central axis C together with the shaft 21. Then, the optical element molding base material 11 to be processed is moved to the position of the opening 20 </ b> A of the shielding plate 20. Note that the order of evacuation and rotation of the support base 12 may be reversed.

  In this state, a high voltage pulse voltage is applied between the trigger electrode 5 and the target 6 by the trigger power supply 15. At this time, creeping discharge is instantaneously generated at the tip of the insulator 3, current flows between the trigger electrode 5 and the target 6 protruding from the insulator 3, and an arc spot A is generated on the surface of the target 6. .

  When the plasma of the target 6 is slightly generated from the arc spot A, an electric circuit is formed between the target 6 and the arc electrode 7, and arc discharge is generated between the arc electrode 7 and the target 6. Then, electricity stored in a capacitor (not shown) wired to the arc power source 16 is instantaneously discharged from the arc electrode 7 to the target 6, an arc current flows in the axial direction of the target 6, and plasma 8 is generated. At this time, since the arc electrode 7 covers substantially the entire circumferential surface of the target 6, arc discharge is likely to occur evenly from the entire circumferential surface of the target 6. Accordingly, the plasma 8 is uniformly generated from the target 6.

  The generated plasma 8 is subjected to electromagnetic force on the tip 6a side of the target 6 by a magnetic field generated by a current flowing through the target 6, and the plasma 8 moves at a speed and is emitted from the vapor deposition source 10 in the P direction. The transport path of the plasma 8 is deflected from the emission direction P in the direction of the central axis C of the support 12 by the magnetic field. Then, it passes through the opening 20 </ b> A of the shielding plate 20 and is guided to the optical element molding die base material 11.

  On the other hand, the droplets are also scattered linearly from the target 6 by arc discharge. Of these, those scattered in the direction of the support base 12 are blocked by the arc electrode 7 and are attached thereto or reflected in the opening direction of the arc electrode 7. Since these are electrically neutral, they are not affected by the magnetic field by the deflecting unit 13. Therefore, it deviates from the transport path of the plasma 8 and collides with and adheres to the inner wall surface of the vacuum chamber 2.

  Here, some of the scattered particles including droplets solidified during the scattering and fragments of the target 6 are reflected without adhering to the wall surface of the vacuum chamber 2. At this time, it proceeds toward the support base 12 depending on the reflection direction. However, such scattered particles collide with a region other than the opening 20 </ b> A of the shielding plate 20 and are reflected again toward the wall surface of the vacuum chamber 2.

  In this way, only the clean plasma 8 passes through the opening 20A of the shielding plate 20 and reaches the optical element molding die base material 11. Here, for example, when the optical element molding base material 11 has a diameter of 20 mm, the plasma 8 on the optical element molding base material 11 has a diameter of about 10 mm, which is about half the diameter of the optical element molding base material 11. It has been adjusted to be. Therefore, while the plasma 8 reaches, the support base swinging drive system of the moving unit 22 is driven to swing the support base 12 biaxially in the plane direction, and the plasma 8 is formed on the optical element molding die base material 11. Adjust to reach the entire surface uniformly. On the other hand, the surface of the other optical element molding base material 11 mounted on the support base 12 when it is mounted on the support base 12 is restricted by the shielding plate 20 from flying plasma 8 or scattered particles. Is maintained.

  Next, the stepping motor for rotating the support base of the moving unit 22 is driven to rotate the support base 12 around the shaft 21. Then, the processed optical element molding base material 11 is retracted from the transport path of the plasma 8, and another optical element molding base material 11 mounted on the support base 12 is moved onto the transport path of the plasma 8. To do. In this way, the above-described treatment is repeated to continuously process the optical element molding die base material 11 mounted on the support base 12. After the processing of all the optical element molding die base materials 11 mounted on the support base 12 is completed, the vacuum chamber 2 is opened to the atmosphere, and the processed optical element molding base material 11 is taken out of the support base 12. Thus, as shown in FIG. 3, the optical element molding die 23 on which the film body 23A is formed is manufactured.

  According to the surface treatment apparatus 1, among the droplets and scattered particles contained in the plasma 8, the particles scattered in the direction of the support base 12 can collide with the arc electrode 7 and be reflected in a direction different from the support base 12. it can. In addition, the plasma 8 is inserted through the opening 20A of the shielding plate 20 by the shielding plate 20, while the droplets are reflected from the wall surface of the vacuum chamber 2 and are separated from the transport path of the plasma 8 and scattered in the direction of the support 12. The scattered particles can be reflected again by the shielding plate 20, and it is possible to suitably restrict the scattered particles from reaching the optical element molding die base material 11.

  Furthermore, even if the transport path of the plasma 8 becomes unstable, most of the plasma 8 hits the shielding plate 20 instead of the vacuum chamber 2, so that contamination of the vacuum chamber 2 can be reduced. Therefore, microscopic surface defects due to droplets and scattered particles on the surface of the optical element molding base material 11 are suitably suppressed, and a surface with high density, high adhesion strength, and extremely few defects can be obtained with high accuracy. It can be processed reliably.

  Further, even if the pre-processed optical element molding base material 11 is disposed at a position deviated from the transport path of the plasma 8 farther than the shielding plate 20 with respect to the vapor deposition source 10, these surfaces remain the plasma 8. And contamination by scattered particles such as droplets can be suppressed. Accordingly, it is possible to continuously perform the processing of the plurality of optical element molding die base materials 11 while maintaining the vacuum in the vacuum chamber 2.

  Further, according to the optical element molding die 23 obtained as a result, microscopic surface defects due to droplets and scattered particles are suitably suppressed, so that highly accurate and highly durable molding can be performed.

Next, a second embodiment will be described with reference to FIG.
In addition, the same code | symbol is attached | subjected to the component similar to 1st Embodiment mentioned above, and description is abbreviate | omitted.
The difference between the second embodiment and the first embodiment is that the surface treatment device 24 according to this embodiment serves as a replacement device 25 for a gate valve (pressure-regulating unit) for maintaining the pressure in the vacuum chamber 26. 1) A first storage chamber 28 that is arranged adjacent to the vacuum chamber 26 via 27A and waits for the optical element molding die base material 11 before processing, and a vacuum via a gate valve (pressure adjusting unit) 27B. The second storage chamber 30 is disposed adjacent to the chamber 26 and stores the processed optical element molding die base material 11.

  In the first storage chamber 28, a first moving mechanism 31 for sending the optical element molding die base material 11 into the vacuum chamber 26 and mounting it on the support 12, and a vacuum exhaust capable of evacuating the first storage chamber 28. A device 32 is connected. In the second storage chamber 30, a second moving mechanism 33 that receives the processed optical element molding die base material 11 from the support 12 and extracts it from the vacuum chamber 26, and a vacuum exhaust device 32 similar to the first storage chamber 28. And are connected.

Next, the operation of the surface treatment apparatus 24 according to this embodiment will be described.
First, the gate valve 27 </ b> A is closed while the first storage chamber 28 is at atmospheric pressure, and the optical element molding base material 11 before processing is attached to the first moving mechanism 31. Next, the inside of the vacuum chamber 26 is evacuated by an evacuation system, and the inside of the first storage chamber 28 is also evacuated by the evacuation device 32 until the pressure is substantially the same.

  Subsequently, the first moving mechanism 31 is driven, the gate valve 27A is opened, the optical element molding die base material 11 before processing is fed into the vacuum chamber 26 through the gate valve 27A, and is mounted on the support base 12. To do. After the mounting, the first moving mechanism 31 is stopped and the gate valve 27A is closed. Thereafter, the same treatment as in the first embodiment is performed, and the surface treatment is performed by the same action.

  After the processing is completed, instead of opening the vacuum chamber 26 to the atmosphere, the inside of the second storage chamber 30 is evacuated by the vacuum exhaust device 32 until the pressure is almost the same as that in the vacuum chamber 26. Then, the second moving mechanism 33 is driven, the gate valve 27B is opened, and the processed optical element molding die base material 11 is removed from the support base 12. Thereafter, the optical element molding die base material 11 is moved into the second storage chamber 30, the gate valve 27B is closed, and the second moving mechanism 33 is stopped. Thus, the processed optical element molding die base material 11 is stored in the second storage chamber 30. When taking out, the second storage chamber 30 is opened to the atmosphere.

  According to the surface treatment device 24, the optical element molding base material 11 is moved between the first storage chamber 28, the vacuum chamber 26, and the second storage chamber 30, so that the vacuum chamber 26 itself needs to be opened to the atmosphere. Therefore, continuous processing can be performed on the plurality of optical element molding die base materials 11.

Next, a third embodiment will be described with reference to FIGS.
In addition, the same code | symbol is attached | subjected to the component similar to other embodiment mentioned above, and description is abbreviate | omitted.
The difference between the third embodiment and the first embodiment is that the surface treatment apparatus 35 according to the present embodiment is connected to the support base 12 via a feedthrough 36 as shown in FIG. The bias power supply unit 37 that applies a negative bias voltage to the molding die base material 11 is provided.

  The bias power source unit 37 is controlled by a computer (not shown) to detect that arc discharge has occurred between the target 6 and the arc electrode 7 and to apply a bias voltage to the optical element molding base material 11. . This bias voltage is pulsed.

Next, the operation of the surface treatment apparatus 35 according to this embodiment will be described.
By the same operation as in the first embodiment, an arc discharge is caused between the target 6 and the arc electrode 7 to generate the plasma 8 from the vapor deposition source 10. A pulsed bias voltage is applied from the bias power supply unit 37 each time the plasma 8 is generated. At this time, since the plasma ions are positively charged, the iridium ions are easily extracted from the plasma 8 and injected into the optical element molding base material 11.

  At this time, a gradient composition in which the iridium concentration gradually changes can be obtained by gradually changing the bias voltage. In this way, as shown in FIG. 6, an optical element molding die 41 in which the protective film 40 made of an iridium alloy is formed on the inclined layer 38 made of iridium is obtained.

  According to this surface treatment apparatus 35, by applying a negative bias voltage, clean plasma 8 particles that do not contain scattered particles or the like are injected not only into the surface of the optical element molding base material 11 but also into the inside thereof. Can do. At this time, since the bias voltage from the bias power supply unit 37 is pulsed, the particles of the plasma 8 can be further accelerated and collided with the optical element molding base material 11 to perform a desired surface treatment.

  Further, according to the optical element molding die 41 obtained as a result, molding with higher accuracy and higher durability can be performed.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the above embodiment, the target 6 has a rod shape, but may have a pellet shape, a linear shape, or a cylindrical shape. Further, the target may be not only iridium but also noble metals such as gold, platinum, ruthenium, rhodium and palladium, or carbon. The shape of the arc electrode is not limited to a cylindrical shape, and may be an elliptical shape or a polygonal shape.

  Furthermore, although the deflection unit 13 includes the magnet 17 and the L-shaped yoke 18 and deflects the transport path of the plasma 8 by a magnetic field, it may be a yoke or an electromagnet having an angle other than 90 degrees. Further, an electric field may be generated instead of a magnetic field, and the plasma path may be deflected by this electromagnetic force.

  Moreover, in the said 1st Embodiment, although the support stand 12 shall be able to mount | wear with the optical element shaping | molding die base material 11 before a process, as shown in FIG. 7, for the optical element shaping | molding before a process A plurality of mold base materials 11 are arranged at positions separated from the opening 20A and at positions farther than the shielding plate 20 with respect to the vapor deposition source 10, and only the mold base material 11 for optical element molding to be processed is supported. A surface treatment device 46 mounted on the table 45 may be used. In this case, if the optical element molding die base material 11 after processing and the optical element molding die base material 11 before processing can be sequentially replaced in a vacuum chamber, continuous processing can be performed.

  In the second embodiment, the plurality of unprocessed optical element molding base materials 11 are mounted on the support 12 in the vacuum chamber 26. However, the optical element molding base material 11 to be processed is used. It is also possible to carry out the processing by attaching only to the support base.

  In the third embodiment, conditions such as the waveform of the bias voltage may be freely set according to the purpose of the processing. For example, a waveform obtained by alternately mixing a positive voltage and a negative voltage, You may reduce the speed | rate of the plasma ion attracted by making a voltage into a positive low voltage.

1 is a schematic configuration diagram illustrating a surface treatment apparatus according to a first embodiment of the present invention. It is a schematic block diagram which shows the vapor deposition source of the surface treatment apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the optical element shaping | molding die obtained by the surface treatment apparatus concerning the 1st Embodiment of this invention. It is a schematic block diagram which shows the surface treatment apparatus which concerns on the 2nd Embodiment of this invention. It is a schematic block diagram which shows the surface treatment apparatus which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the optical element shaping | molding die obtained by the surface treatment apparatus which concerns on the 3rd Embodiment of this invention. It is a schematic block diagram which shows the modification of the surface treatment apparatus which concerns on the 1st Embodiment of this invention.

Explanation of symbols

1, 24, 35, 46 Surface treatment equipment 2, 26 Vacuum chamber (vacuum container)
DESCRIPTION OF SYMBOLS 3 Insulator 5 Trigger electrode 6 Target 7 Arc electrode 8 Plasma 10 Deposition source 11 Optical element shaping | molding base material (to-be-processed object)
12, 45 Support base 13 Deflection part 20 Shield plate 22 Moving part (replacement device)
23, 41 Optical element molding die 25 Replacement device 27 Gate valve (pressure adjusting unit)
28 First Storage Room 30 Second Storage Room 37 Bias Power Supply Unit

Claims (5)

A target connected to the trigger electrode via an insulator; and an arc electrode for inducing arc discharge around the target, and emitting plasma including target ions generated by the arc discharge toward the tip of the target A deposition source;
A support base arranged such that a normal line of a surface on which the target object to which the target ions reach is placed is inclined with respect to the plasma emission direction in the vicinity of the vapor deposition source;
A deflection unit that deflects the traveling direction of the plasma emitted from the vapor deposition source so as to be in a substantially normal direction of the surface of the support table in the vicinity of the support table;
The vacuum vessel includes a shielding plate disposed between the vapor deposition source and the support base and having an opening formed only on a plasma transport path deflected by the deflecting unit. Surface treatment equipment.   The surface treatment is performed by retracting the object to be treated after the surface treatment from the transport path of the plasma and distant from the shielding plate and at a position away from the transport path of the plasma with respect to the vapor deposition source. The surface treatment apparatus according to claim 1, further comprising an exchange device that moves the previous object to be treated on the transport path of the plasma. The replacement device is
A first storage chamber arranged adjacent to the vacuum vessel via a pressure regulating unit for maintaining the pressure in the vacuum vessel, and waiting for the object to be processed before processing;
A second storage chamber that is disposed adjacent to the vacuum container via a pressure regulating unit for maintaining the pressure in the vacuum container and stores the processed object after processing; The surface treatment apparatus according to claim 2.   The surface treatment apparatus according to claim 1, further comprising a bias power supply unit that applies a bias voltage to the object to be processed. An optical element molding die, which is manufactured from an object to be surface-treated by the surface treatment apparatus according to any one of claims 1 to 4.

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