JP2007262260A5 - - Google Patents
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- Publication number
- JP2007262260A5 JP2007262260A5 JP2006090064A JP2006090064A JP2007262260A5 JP 2007262260 A5 JP2007262260 A5 JP 2007262260A5 JP 2006090064 A JP2006090064 A JP 2006090064A JP 2006090064 A JP2006090064 A JP 2006090064A JP 2007262260 A5 JP2007262260 A5 JP 2007262260A5
- Authority
- JP
- Japan
- Prior art keywords
- diisocyanate
- polyol
- isocyanate group
- modified products
- containing urethane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005862 polyol Polymers 0.000 description 4
- 150000003077 polyols Chemical group 0.000 description 4
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 3
- 229920001228 Polyisocyanate Polymers 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229920001451 Polypropylene glycol Polymers 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N Hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N Isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N oxane Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- -1 polytetramethylene Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
(B)成分の末端イソシアネート基含有ウレタンプレポリマーは、ポリエーテルポリオール、ポリエステルポリオール等のポリオール、好ましくはポリエーテルポリオールにNCO/OH当量比が1以上、一般には1.2〜10のポリイソシアネートとを反応させることによって得られる。耐水性にすぐれたポリエーテルポリオールとしては、ポリエチレングリコール(PEG)、ポリプロピレングリコール(PPG)、これらのエチレンオキサイド変性物またはアミン変性物、ポリテトラメチレングリコール(PTMG)等が代表的な例として挙げられ、またポリイソシアネート、好ましくは脂肪族ポリイソシアネートとしては、1,4-テトラメチレンジイソシアネート、1,6-ヘキサメチレンジイソシアネート(HDI)、水素添加MDI(4,4′-ジシクロヘキシルメタンジイソシアネート)、イソホロンジイソシアネート、リジンジイソシアネート等が代表的な例として挙げられる。これら両者間の反応は、プレポリマー法によって行われるが、実際には市販品である末端イソシアネート基含有ウレタンプレポリマーをそのまま用いることができる。 The (B) component terminal isocyanate group-containing urethane prepolymer is a polyol such as polyether polyol or polyester polyol, preferably a polyether polyol reacted with a polyisocyanate having an NCO / OH equivalent ratio of 1 or more, generally 1.2 to 10. To obtain. Representative examples of polyether polyols with excellent water resistance include polyethylene glycol (PEG), polypropylene glycol (PPG), these ethylene oxide modified products or amine modified products, polytetramethylene glycol (PTMG), and the like. and polyisocyanates, as is preferably an aliphatic polyisocyanate, 1,4-tetramethylene diisocyanate, 1,6-hexamethylene diisocyanate (HDI), hydrogenated MDI (4,4'-di-cyclohexyl diisocyanate), isophorone diisocyanate A typical example is lysine diisocyanate. The reaction between the two is carried out by a prepolymer method, but a terminal isocyanate group-containing urethane prepolymer which is actually a commercial product can be used as it is.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006090064A JP4952017B2 (en) | 2006-03-29 | 2006-03-29 | Adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006090064A JP4952017B2 (en) | 2006-03-29 | 2006-03-29 | Adhesive composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007262260A JP2007262260A (en) | 2007-10-11 |
| JP2007262260A5 true JP2007262260A5 (en) | 2009-07-16 |
| JP4952017B2 JP4952017B2 (en) | 2012-06-13 |
Family
ID=38635549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006090064A Expired - Fee Related JP4952017B2 (en) | 2006-03-29 | 2006-03-29 | Adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4952017B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5874928B2 (en) * | 2012-11-29 | 2016-03-02 | トヨタ自動車株式会社 | Fuel cell stack |
| CN111574951B (en) * | 2020-06-11 | 2021-04-13 | 北京高盟新材料股份有限公司 | Self-skinning modified polyurethane thermosetting sealant composition and preparation method thereof |
| WO2023115264A1 (en) * | 2021-12-20 | 2023-06-29 | 东莞新能源科技有限公司 | Conductive adhesive, electrochemical device, and electronic device |
| JPWO2023167052A1 (en) * | 2022-03-01 | 2023-09-07 | ||
| EP4361190A1 (en) * | 2022-10-26 | 2024-05-01 | Sika Technology AG | Wide temperature window thermosetting polyurethane compositions |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6262878A (en) * | 1985-09-12 | 1987-03-19 | Toagosei Chem Ind Co Ltd | Adhesive composition |
| JP3364314B2 (en) * | 1994-03-31 | 2003-01-08 | サンスター技研株式会社 | Heat-curable urethane composition |
| JPH0832230A (en) * | 1994-07-18 | 1996-02-02 | Tokai Rubber Ind Ltd | Flexible printed circuit board, wiring board and adhesive composition used for them |
| JPH08183829A (en) * | 1994-12-28 | 1996-07-16 | Takeda Chem Ind Ltd | Polyurethane adhesive composition |
| JP2000143940A (en) * | 1998-11-09 | 2000-05-26 | Nippon Kayaku Co Ltd | Solid epoxy resin composition |
| JP2002305212A (en) * | 2001-04-05 | 2002-10-18 | Toshiba Chem Corp | Mounting paste for semiconductor |
| JP4512316B2 (en) * | 2003-01-09 | 2010-07-28 | 内山工業株式会社 | Adhesive composition |
| JP4486801B2 (en) * | 2003-10-02 | 2010-06-23 | 内山工業株式会社 | Adhesive composition |
| JP4274072B2 (en) * | 2004-07-27 | 2009-06-03 | パナソニック電工株式会社 | memory card |
-
2006
- 2006-03-29 JP JP2006090064A patent/JP4952017B2/en not_active Expired - Fee Related
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