JP2007262013A5 - - Google Patents

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Publication number
JP2007262013A5
JP2007262013A5 JP2006090758A JP2006090758A JP2007262013A5 JP 2007262013 A5 JP2007262013 A5 JP 2007262013A5 JP 2006090758 A JP2006090758 A JP 2006090758A JP 2006090758 A JP2006090758 A JP 2006090758A JP 2007262013 A5 JP2007262013 A5 JP 2007262013A5
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JP
Japan
Prior art keywords
phenolic hydroxyl
molecule
hydroxyl groups
production method
hydroxyaromatic compound
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JP2006090758A
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Japanese (ja)
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JP4259536B2 (en
JP2007262013A (en
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Priority claimed from JP2006090758A external-priority patent/JP4259536B2/en
Priority to JP2006090758A priority Critical patent/JP4259536B2/en
Priority to US12/280,941 priority patent/US20090088535A1/en
Priority to EP06822769A priority patent/EP1992655B9/en
Priority to KR1020087022275A priority patent/KR100975846B1/en
Priority to PCT/JP2006/321840 priority patent/WO2007099670A1/en
Priority to CN2006800532986A priority patent/CN101384642B/en
Priority to MYPI20083324A priority patent/MY154545A/en
Priority to TW095141102A priority patent/TWI399390B/en
Publication of JP2007262013A publication Critical patent/JP2007262013A/en
Publication of JP2007262013A5 publication Critical patent/JP2007262013A5/ja
Publication of JP4259536B2 publication Critical patent/JP4259536B2/en
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Claims (12)

フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）を、塩基性触媒（Ｂ）の存在下に脱水縮合反応させることを特徴とするポリアリーレンエーテル構造を有するフェノール樹脂の製造方法。 A phenol resin having a polyarylene ether structure, wherein a polyhydric hydroxy aromatic compound (A) having two or more phenolic hydroxyl groups in one molecule is subjected to a dehydration condensation reaction in the presence of a basic catalyst (B). Manufacturing method. 前記フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）が、フェノール性水酸基が結合している芳香核において該フェノール性水酸基に隣接する位置に配向性を有するものである請求項１記載の製造方法。 The polyvalent hydroxyaromatic compound (A) having two or more phenolic hydroxyl groups in one molecule has orientation at a position adjacent to the phenolic hydroxyl group in an aromatic nucleus to which the phenolic hydroxyl group is bonded. The manufacturing method according to claim 1. 前記フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）が、ジヒドロキシナフタレン類である請求項１又は２記載の製造方法。 The production method according to claim 1 or 2, wherein the polyvalent hydroxyaromatic compound (A) having two or more phenolic hydroxyl groups in one molecule is dihydroxynaphthalene. 前記フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）が、ジヒドロキシベンゼン類である請求項１又は２記載の製造方法。 The production method according to claim 1 or 2, wherein the polyvalent hydroxyaromatic compound (A) having two or more phenolic hydroxyl groups in one molecule is a dihydroxybenzene. 前記フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）が、ジヒドロキシナフタレン類とジヒドロキシベンゼン類との混合物である請求項１記載の製造方法。 The production method according to claim 1 , wherein the polyvalent hydroxyaromatic compound (A) having two or more phenolic hydroxyl groups in one molecule is a mixture of dihydroxynaphthalenes and dihydroxybenzenes . 前記脱水縮合反応を、１００〜３００℃の温度条件下に行う請求項１〜５の何れか１つに記載の製造方法。 The production method according to claim 1, wherein the dehydration condensation reaction is performed under a temperature condition of 100 to 300 ° C. フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）を、塩基性触媒（Ｂ）の存在下に脱水縮合反応させることを特徴とするポリアリーレンエーテル構造を有するフェノール樹脂を製造する工程と、
前記工程で得られたフェノール樹脂を、（メチル）エピハロヒドリンと反応させる工程と
を備えることを特徴とするポリアリーレンエーテル構造を有するエポキシ樹脂の製造方法。 A phenol resin having a polyarylene ether structure, wherein a polyhydric hydroxy aromatic compound (A) having two or more phenolic hydroxyl groups in one molecule is subjected to a dehydration condensation reaction in the presence of a basic catalyst (B). Manufacturing process,
Reacting the phenol resin obtained in the step with (methyl) epihalohydrin ;
A process for producing an epoxy resin having a polyarylene ether structure, comprising: 前記フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）が、フェノール性水酸基が結合している芳香核において該フェノール性水酸基に隣接する位置に配向性を有するものである請求項７記載の製造方法。The polyvalent hydroxyaromatic compound (A) having two or more phenolic hydroxyl groups in one molecule has orientation at a position adjacent to the phenolic hydroxyl group in an aromatic nucleus to which the phenolic hydroxyl group is bonded. The manufacturing method according to claim 7. 前記フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）が、ジヒドロキシナフタレン類である請求項７記載の製造方法。The production method according to claim 7, wherein the polyvalent hydroxyaromatic compound (A) having two or more phenolic hydroxyl groups in one molecule is dihydroxynaphthalene. 前記フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）が、ジヒドロキシベンゼン類である請求項７記載の製造方法。The production method according to claim 7, wherein the polyvalent hydroxyaromatic compound (A) having two or more phenolic hydroxyl groups in one molecule is a dihydroxybenzene. 前記フェノール性水酸基を１分子中に２つ以上有する多価ヒドロキシ芳香族化合物（Ａ）が、ジヒドロキシナフタレン類とジヒドロキシベンゼン類との混合物である請求項７記載の製造方法。The production method according to claim 7, wherein the polyvalent hydroxyaromatic compound (A) having two or more phenolic hydroxyl groups in one molecule is a mixture of dihydroxynaphthalenes and dihydroxybenzenes. 前記脱水縮合反応を、１００〜３００℃の温度条件下に行う請求項１〜５の何れか１つに記載の製造方法。The production method according to claim 1, wherein the dehydration condensation reaction is performed under a temperature condition of 100 to 300 ° C.
JP2006090758A 2006-02-28 2006-03-29 Method for producing phenol resin and method for producing epoxy resin Active JP4259536B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2006090758A JP4259536B2 (en) 2006-03-29 2006-03-29 Method for producing phenol resin and method for producing epoxy resin
MYPI20083324A MY154545A (en) 2006-02-28 2006-11-01 Method of producing phenol resin and method of producing epoxy resin
EP06822769A EP1992655B9 (en) 2006-02-28 2006-11-01 Method of producing phenol resin and method of producing epoxy resin
KR1020087022275A KR100975846B1 (en) 2006-02-28 2006-11-01 Process for producing phenol resin and process for producing epoxy resin
PCT/JP2006/321840 WO2007099670A1 (en) 2006-02-28 2006-11-01 Process for producing phenolic resin and process for producing epoxy resin
CN2006800532986A CN101384642B (en) 2006-02-28 2006-11-01 Process for producing phenolic resin and process for producing epoxy resin
US12/280,941 US20090088535A1 (en) 2006-02-28 2006-11-01 Method of producing phenol resin and method of producing epoxy resin
TW095141102A TWI399390B (en) 2006-02-28 2006-11-07 Method of producing phenol resin and method of producing epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006090758A JP4259536B2 (en) 2006-03-29 2006-03-29 Method for producing phenol resin and method for producing epoxy resin

Publications (3)

Publication Number Publication Date
JP2007262013A JP2007262013A (en) 2007-10-11
JP2007262013A5 true JP2007262013A5 (en) 2008-07-24
JP4259536B2 JP4259536B2 (en) 2009-04-30

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JP2006090758A Active JP4259536B2 (en) 2006-02-28 2006-03-29 Method for producing phenol resin and method for producing epoxy resin

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JP4968434B2 (en) * 2006-04-28 2012-07-04 川崎化成工業株式会社 4,4'-Oxybi-1-naphthol compound, production method thereof and photosensitizer containing the same
JP5277844B2 (en) * 2008-09-30 2013-08-28 三菱マテリアル株式会社 Conductive ink composition and solar cell module formed using the composition
JP5353163B2 (en) * 2008-09-30 2013-11-27 三菱マテリアル株式会社 Conductive ink composition and solar cell in which collector electrode is formed using the composition
JP5120520B2 (en) * 2010-07-02 2013-01-16 Ｄｉｃ株式会社 Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, circuit board, and build-up film
JP5457304B2 (en) * 2010-08-26 2014-04-02 新日鉄住金化学株式会社 Phenolic resin, epoxy resin, production method thereof, epoxy resin composition and cured product
US9475761B2 (en) 2012-10-26 2016-10-25 Mitsubishi Gas Chemical Company, Inc. Method for producing cyanogen-halide, cyanate ester compound and method for producing the same, and resin composition
JP5692295B2 (en) * 2013-07-04 2015-04-01 三菱マテリアル株式会社 Method for forming solar cell collector electrode and solar cell module provided with the solar cell
JP6217230B2 (en) * 2013-08-19 2017-10-25 Jsr株式会社 Photosensitive resin composition and resin composition, and method for producing resin film
JP5835528B1 (en) * 2014-01-07 2015-12-24 Dic株式会社 Polyarylene ether resin, method for producing polyarylene ether resin, curable resin material, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film
JP6402968B2 (en) * 2014-03-03 2018-10-10 Dic株式会社 (Meth) acryloyl group-containing resin, method for producing (meth) acryloyl group-containing resin, curable resin material, cured product thereof, and resist material
JP6402967B2 (en) * 2014-03-03 2018-10-10 Dic株式会社 (Meth) acryloyl group-containing resin, method for producing (meth) acryloyl group-containing resin, curable resin material, cured product thereof, and resist material
JP6476558B2 (en) * 2014-03-07 2019-03-06 Dic株式会社 Acid group-containing (meth) acrylate resin, method for producing acid group-containing (meth) acrylate resin, curable resin material, cured product thereof, and resist material
JP6476559B2 (en) * 2014-03-07 2019-03-06 Dic株式会社 Acid group-containing (meth) acrylate resin, method for producing acid group-containing (meth) acrylate resin, curable resin material, cured product thereof, and resist material
JP6497125B2 (en) * 2015-02-25 2019-04-10 Dic株式会社 Polyarylene ether resin, production method of polyarylene ether resin, curable resin material, cured product thereof, semiconductor sealing material, semiconductor device, prepreg, printed circuit board, buildup film, buildup board
WO2017217312A1 (en) * 2016-06-15 2017-12-21 Dic株式会社 Resin composition for resist and resist film
US11767424B2 (en) * 2019-10-25 2023-09-26 Dic Corporation Polyfunctional phenolic resin, polyfunctional epoxy resin, curable resin composition containing these, and cured product thereof

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EP0467826A3 (en) * 1990-06-26 1992-10-07 Ciba-Geigy Ag Linear polymers
JP3374255B2 (en) * 1993-04-28 2003-02-04 新日鐵化学株式会社 Novel epoxy resin, method for producing the same, and epoxy resin composition using the same
JP2003183362A (en) * 2001-12-20 2003-07-03 Hitachi Chem Co Ltd Method for synthesizing polynaphthylene, photosensitive resin composition, method for manufacturing pattern, and electronic part
JP2004027000A (en) * 2002-06-25 2004-01-29 Matsushita Electric Works Ltd Epoxy resin composition, prepreg and laminated sheet
JP2004059714A (en) * 2002-07-29 2004-02-26 Mitsubishi Chemicals Corp Epoxy resin and epoxy resin composition using the same
JP5245199B2 (en) * 2005-03-18 2013-07-24 Ｄｉｃ株式会社 Epoxy resin composition, cured product thereof, novel epoxy resin, production method thereof, and novel phenol resin
JP4285491B2 (en) * 2006-02-28 2009-06-24 Ｄｉｃ株式会社 Epoxy resin composition, cured product thereof, novel epoxy resin, novel phenol resin, and semiconductor sealing material

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