JP2007260859A - Manufacturing method of display substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a color filter to prevent sticking of glass cullet on a surface of a substrate caused in chamfering in cutting the display substrate. <P>SOLUTION: This manufacturing method of the display substrate 1 has: a cutting process to cut the glass substrate 1 on which a resin film is formed; and a chamfering process to chamfer a cutting surface by polishing while covering a whole surface of the substrate with water by supplying water to the surface on the side of the cut glass substrate 1 on which the resin film is formed. The method also has a plasma processing process to expose the whole surface on the side of the glass substrate on which the resin film is formed to atmospheric plasma in an atmospheric pressure or the neighborhood of the atmospheric pressure. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a display substrate used in a liquid crystal display device, and relates to a method for manufacturing an array substrate or a color filter substrate, and more particularly to a method for chamfering a substrate.

  A liquid crystal display device is a display device in which an array substrate and a color filter substrate are held at regular intervals and liquid crystal is sealed between the two substrates, and has advantages such as thinness, light weight, and low power consumption. Used in the field.

  In the manufacturing process of display substrates such as array substrates or color filter substrates, productivity is improved by adopting the method of forming one or more screens on a single substrate and finally cutting them into predetermined dimensions. I am trying.

  In this case, the substrate is generally cut by using a super steel alloy or diamond cutter on the substrate, applying a predetermined pressure to the cutter and running on the substrate, and inserting a scribe line (cutting guide groove). Then, after a crack with a predetermined depth is generated in the vertical direction of the substrate, the substrate is bent along the scribe line by applying bending stress to the substrate by bending the substrate or by pressing the substrate, such as hitting the substrate. A scribe break method is performed.

  Next, the chamfering of the display substrate is performed using a grinding tool such as a grindstone in an appropriate form under water injection conditions. Water injection during chamfering is performed for the purpose of cooling and washing off foreign matters such as glass cullet, and is usually performed by, for example, performing a water shower on the processed surface.

  Next, wet cleaning is performed for the purpose of removing foreign substances adhering to the substrate.

  However, in the above manufacturing method, in the chamfering process, the glass cullet generated by grinding the cut surface of the glass with a grindstone or the like has a very small size of 100 μm or less, and the surface of the cullet is specular. Therefore, when a mirror-like surface comes into contact with the surface of the substrate, particularly the resin film surface, it adheres very firmly and is difficult to remove in subsequent wet cleaning. Therefore, if the glass cullet is in the display area, it may cause a common short when pasting with the opposite substrate, and if it is in the frame area of the display area, it may cause a seal failure, In addition, even in a portion outside the display area, the transfer roll or rubbing roll may be scratched during alignment film printing, rubbing, or seal printing, thereby causing problems.

  In order to solve this problem, a method (for example, Patent Document 1) is disclosed in which a protective film for processing is formed on the surface of a substrate using a polyvinyl alcohol resin or the like before the cutting step.

  However, in the method of forming the protective film for processing as described above, even if the protective film is removed, residues of the protective film for processing remain on the surface of the substrate, resulting in poor surface contamination or a liquid crystal display device. In addition, there is a problem that the residue is dissolved in the liquid crystal in the liquid crystal display device, adversely affecting the liquid crystal characteristics and causing unevenness in the image. In addition, there is a problem in that productivity decreases because a process for applying a protective film for processing and a process for removing the protective film after chamfering are increased.

  In addition, in order to avoid the problem when the protective film for processing is formed, glass cullet generated in a chamfering process under water injection conditions is subjected to brush cleaning during wet cleaning after the chamfering process (for example, Patent Document 2) is disclosed.

  However, in the method of removing the glass cullet by brush cleaning, it is possible to remove the glass cullet attached on the transparent conductive film, but the glass cullet fixed on the resin film cannot be completely removed. was there.

  Also, in the chamfering device, a line-shaped portion is provided in a direction parallel to the dividing line, a plurality of discharge ports and slits for discharging water are formed on the upper portion of the line, and water is supplied to the substrate surface to supply the substrate surface. A method of forming a water film to prevent the glass cullet from sticking is disclosed (for example, Patent Document 3).

  However, if the contact angle of water is high on the surface of the resin film, water will be repelled, so a water film cannot always be stably formed on the entire surface of the substrate, preventing cullet sticking. There was a problem that could not.

In addition, by enlarging the water supply during chamfering, it is possible to prevent tearing of the water film due to repelling on the resin film and cover the substrate surface with a water film. Since pure water is used, there is a problem that the load on the apparatus, environment, and economy is increased.
JP-A-6-273617 JP 10-239509 A JP 2005-153059 A

  An object of this invention is to provide the manufacturing method of the color filter which prevents the adhesion of the glass cullet to the surface of the board | substrate which generate | occur | produces in the chamfering process at the time of the cutting of a display board | substrate.

In order to solve the above problems, the display substrate of the present invention has the following configuration.
(1) A cutting step of cutting the glass substrate on which the resin film is formed, and then supplying water to the surface of the cut glass substrate on which the resin film is formed to cover the entire surface of the substrate with water. In a method for manufacturing a display substrate having a chamfering process for chamfering by polishing, the entire surface of the glass substrate on which the resin film is formed before the chamfering process is converted into atmospheric pressure plasma generated under atmospheric pressure or near atmospheric pressure. A method for producing a display substrate, comprising a plasma treatment step of exposing.
(2) The display substrate according to (1), wherein in the chamfering step, water supply is started over the entire surface of the cut glass substrate on which the resin film is formed before polishing. Manufacturing method.
(3) The method for producing a display substrate according to (1) or (2), wherein the supply amount of water is 1000 to 3000 cm ³ / m ² per cut glass substrate.
(4) The method for producing a display substrate according to any one of (1) to (3), wherein the water supply method is a method of supplying mist-like water.

  In the chamfering process, a water film is formed on the entire surface of the display substrate under water injection conditions to prevent the glass cullet generated in the chamfering process from coming into direct contact with the surface of the substrate and to fix it. A method of manufacturing a display substrate that can be prevented can be provided.

  The present invention relates to a method for manufacturing a display substrate such as an array substrate or a color filter substrate having at least a resin layer on the substrate, wherein the substrate is cut and the cut surface is chamfered under water injection conditions. A method for producing a color filter, characterized in that a water film is always stably formed on the entire surface of the display substrate on which the resin film is formed during processing.

  In the present invention, a glass cullet generated during chamfering is formed on the entire surface of the display substrate during chamfering processing, that is, the entire surface on which the resin film is formed. By preventing contact with the surface, it is possible to prevent the glass cullet from sticking to the color filter surface.

  In the present invention, the surface treatment is performed by exposing the resin film on the surface of the substrate to atmospheric pressure plasma before the chamfering step.

  Unlike the conventional plasma generator, the atmospheric pressure plasma used in the present invention does not require a vacuum device because it is discharged under atmospheric pressure, and can be used in an open system. Continuous processing by in-line equipment is possible. Further, in order to supply the excited active species directly to the substrate, the surface treatment can be performed at a much higher speed.

The treatment method using atmospheric pressure plasma is not particularly limited, but a plasma is generated by applying a DC high voltage, a high frequency voltage or a pulse voltage to the supplied gas, and the gas excited by the plasma is supplied to the object to be processed. Treat by exposing to the surface. The gas supplied at this time is preferably an inert gas or a mixed gas of an inert gas and a reactive gas in order to stabilize the discharge. As the processing gas for generating plasma in the present invention, helium, argon, neon, krypton, nitrogen, or the like can be used as an inert gas, but helium or argon is considered in view of discharge stability and economy. Alternatively, it is preferable to use nitrogen. As the reaction gas, an optimum gas such as oxygen, air, CO ₂ , or CF ₄ can be arbitrarily selected depending on a material to be processed, a surface state, and a plasma discharge state. For example, when the surface of the resin layer is treated, although not limited, it is preferable to select a reaction gas such as oxygen or air so that oxygen radicals are contained in the plasma in order to perform the treatment at high speed. Of course, in this invention, it can also process only with an inert gas or only a reactive gas.

  Although it does not specifically limit as a pressure under atmospheric pressure in this invention, or atmospheric pressure vicinity, Preferably it is the range of 96-106 kPa.

  In the present invention, the atmospheric pressure and the vicinity of the atmospheric pressure means that the external pressure is completely shut off by a chamber, etc. It is the pressure of the range which does not need to produce. For example, it is also preferable in the present invention to install an exhaust fan or a blower fan for removing the gas used in the process or particles generated by the process in the vicinity of the substrate that is subjected to the plasma process in the atmospheric pressure, and the pressure at that time Is a pressure near atmospheric pressure.

  As a plasma exposure method, a direct method in which the substrate is directly transferred into the plasma and plasma processing is performed, and active species generated in the plasma generation unit are gasified to a substrate disposed at a position where the plasma is not exposed. Any of the indirect methods in which the guidance process is performed can be suitably employed. In the former direct method, if there is a protrusion on the surface of the substrate, or if metal is present inside or on the surface, for example, when the light shielding layer is made of chrome, a strong plasma is generated partially. There is a risk that variations occur in the processing range, and electrical damage such as discharge traces may occur on the substrate surface. However, since both physical effects such as sputtering by plasma and chemical effects by radicals in plasma can be used effectively, this condition can be achieved by controlling the discharge state and achieving stable discharge conditions. It can be suitably used as a surface treatment in the invention.

  On the other hand, when the plasma processing is performed by the latter indirect method, the distance between the substrate and the plasma is important. Since the active species generated by the plasma have a lifetime, if the distance between the substrate and the plasma is too large, the processing capability is significantly reduced. Therefore, there is a certain restriction on the distance relationship between the substrate and the plasma, and the distance between the plasma and the substrate is preferably within 30 mm, more preferably within 10 mm. However, it is difficult to be damaged by plasma, and it is possible to carry out partial and selective processing by using a substrate transfer facility such as an XY stage. It can be preferably used.

  The plasma treatment in the present invention can reduce the water contact angle on the resin film of the display substrate. The conditions for the plasma treatment are not particularly limited, but the state of the surface treatment can be adjusted by the flow rate of the gas to be supplied, the gap distance between the plasma and the substrate, the exposure time of the substrate to the plasma, and the like. The water contact angle on the resin film of the substrate is not particularly limited, but if the contact angle is high, the water repels on the substrate surface and it is difficult to form a water film on the entire surface of the substrate. A lower angle is preferred. A contact angle of 30 ° or less is more preferable because a water film can be easily formed and stably maintained.

Although the water pouring conditions in the chamfering process in the present invention are not particularly limited, water is sprayed on the surface of the color filter substrate by a shower or the like. For example, as shown in FIG. 1, by spraying the entire surface of the substrate with a shower or the like during chamfering, a film can be formed on the surface of the substrate and the grindstone can be cooled. Moreover, it is more preferable to form a water film by spraying water before polishing. More preferably, as shown in FIG. 2, it is more preferable to arrange the water supply units in a line in a direction perpendicular to the cut surface from the viewpoint of increasing the amount of water used. Although the supply amount of water is not particularly limited, it is preferably 1000 to 3000 cm ³ / m ² per cut substrate. If it is too little, it will not reach the entire surface of the substrate, and a water film cannot be formed.If a large amount of water is supplied, a water film can be formed, but from the viewpoint of facilities, environment and economy. It is not preferable. The method for supplying water is not particularly limited, and any method such as a shower shape from a discharge port or a curtain shape from a slit may be used. The method of spraying water on the surface of the substrate in a mist form is less likely to disturb the film when supplying water to the formed film compared to methods such as showering, and the water film is efficiently applied to the surface of the substrate. Since it can be stably formed, the chamfering process of the chamfering process in the present invention is not particularly limited, but is performed using a grinding tool such as a grindstone in an appropriate form. Although the chamfering conditions are not particularly limited, the peripheral speed of the grindstone is preferably 500 to 1000 m / min, and the speed at which the glass substrate is applied to the grindstone and the substrate is fed is preferably 1 to 5 m / min. When it is too fast, shell-like cracks are generated on the processed surface, a lot of glass cullet is generated, and the product becomes defective. When it is too slow, there is a problem that productivity is lowered.

  An example of the manufacturing method of the color filter in this invention is shown in FIG. In the present invention, a black photosensitive resin 12 is applied on a substrate 11 and heated and temporarily cured (see FIG. 3A), and then exposed and developed in a photolithography process (see FIG. 3B). Then, the film is heated and fully cured to form a predetermined black matrix layer (see FIG. 3C). Next, after applying the red photosensitive resin 14, and heating and heating in the same manner and pre-curing (see FIG. 3 (d)), exposure and development are performed in a photolithography process (see FIG. 3 (e)), It heats and hardens | cures and forms a predetermined | prescribed red colored layer (refer FIG.3 (f)). Similarly, after forming colored layers of green and blue (see FIG. 3G), a protective layer resin is applied, heated and fully cured to form the protective layer 17 (see FIG. 3H). ). Further, if necessary, the transparent electrode layer 18 is formed by a sputtering method using a metal mask having a predetermined pattern (see FIG. 3I).

  Although the glass substrate used in the present invention is not particularly limited, a glass having high light transmittance, excellent mechanical strength and dimensionality can be used, and soda glass, alkali-free glass, borosilicate glass, quartz glass, and the like can be used. Is preferred.

  The resin layer used in the present invention is not particularly limited, and a material that does not soften, decompose, or color even when annealed at 180 ° C. or higher can be used. Epoxy resin, urethane resin, urea resin, acrylic resin, polyvinyl Alcohol resins, melamine resins, polyamide resins, polyamideimide resins, polyimide resins, tetrafluoroethylene resins, silicone resins, and mixtures thereof are preferably used. Among these, a polyimide resin, an acrylic resin or an epoxy resin excellent in heat resistance and adhesion is preferable.

  Although it does not specifically limit as a resin layer used by this invention, The thing which disperse | distributed the pigment | dye in resin can be used, and a light shielding layer and a colored layer can be formed. Examples of pigments that can be used include, but are not limited to, pigments and dyes such as black, red, orange, yellow, green, blue, and purple.

  The protective layer used in the present invention is intended to improve the flatness of the display area, improve the display characteristics, and prevent contamination of the liquid crystal layer by pigments and organic substances used in the light shielding layer and the colored layer. It is formed on the entire surface of the substrate using a transparent resin, or is formed so as to selectively cover only the light shielding layer and the colored layer.

  The material of the protective layer used in the present invention is not particularly limited. Epoxy resin, polyimide resin, silicone resin obtained by condensation polymerization of organosilane, imide obtained by condensation polymerization of organosilane and a compound having an imide group Modified silicone resin, epoxy resin, acrylic resin, urethane resin, urea resin, polyvinyl alcohol resin, melamine resin, polyamide resin, polyamideimide resin, polyester resin, polyolefin resin, gelatin and the like are used. Among them, it is preferable to use a resin that has resistance to heating and organic solvents in the subsequent process of manufacturing a liquid crystal display device, and is transparent and has no color. From this point, a polyimide resin, an acrylic resin, an epoxy System resins are preferably used.

  The material of the transparent electrode layer used in the present invention is not particularly limited. For example, as a transparent electrode layer formed on a color filter made of an organic polymer layer, indium oxide, tin oxide, zinc oxide, indium oxide and tin oxide can be used. A mixture (hereinafter referred to as ITO), a simple substance or a mixture of gold, silver, copper, aluminum, palladium, platinum, or the like, or a laminate having a thickness of 10 to 5000 angstroms is preferably used.

  The cutting method in the present invention is not particularly limited, and a predetermined pressure is applied to the cutter to run on the substrate, and a scribe line (cutting guide groove) is inserted to generate a crack having a predetermined depth in the vertical direction of the substrate. After that, a scribe break method or the like is performed by applying a bending stress to the substrate to divide it along the scribe line by a method of bending the substrate or a method of pressurizing the substrate such as tapping the substrate. As the cutter, a diamond tool, a foil tip or the like is used, and a foil tip is preferably used. A foil chip made of a super steel alloy, which is relatively inexpensive, is preferably used, but a diamond chip or a sintered diamond may be used.

  Examples of the present invention will be described below, but the present invention is not limited thereto.

Example 1
A black pigment made of carbon black, a polyamic acid, and a solvent were mixed with stirring to obtain a black paste. The non-photosensitive black paste thus obtained was spin-coated on a transparent substrate having a length of 620 mm, a width of 750 mm, and a thickness of 0.5 mm made of non-alkali glass (manufactured by Nippon Electric Glass Co., Ltd., OA-10). . Then, it heated at 110 degreeC for 15 minutes, and temporarily hardened, and obtained the polyimide precursor film | membrane with a film thickness of 1.5 micrometers. A positive photoresist (OFP-800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) was spin-coated on this film and dried by heating at 80 ° C. for 20 minutes to obtain a resist film having a thickness of 1.0 μm. Next, after UV exposure through a photomask, unnecessary portions of the photoresist and polyimide precursor film were removed by etching using a developer composed of a 2.4% by weight aqueous solution of tetramethylammonium hydroxide, and the remaining photo The resist was removed with methyl celsorb acetate. This was heated at 300 ° C. for 30 minutes and fully cured to form a light shielding layer having a predetermined shape.

  Next, a non-photosensitive red paste composed of polyamic acid, a red pigment, and a solvent was spin-coated and then heated at 110 ° C. for 15 minutes to be temporarily cured to obtain a polyimide precursor film having a thickness of 1.5 μm. A positive photoresist was spin-coated on this film, and a 1.0 μm-thick resist film was obtained by heating and drying at 80 ° C. for 20 minutes. Next, after UV exposure through a photomask, unnecessary portions of the photoresist and polyimide precursor film were removed by etching using a developer composed of an aqueous solution of 2.4% by weight of tetramethylammonium hydroxide, and remained. The photoresist was removed with methyl celsorb acetate. This was heated at 300 ° C. for 30 minutes and fully cured to obtain a red colored patterning layer having a predetermined shape. Similarly, each of the green coloring patterning layer and the blue coloring patterning layer was formed.

  Further, an acrylic photosensitive protective material (manufactured by JSR, Optmer NN525) was spin-coated and then heated at 90 ° C. for 15 minutes to be temporarily cured to obtain an acrylic film having a thickness of 3.0 μm. Next, after UV exposure through a photomask, the unnecessary portion of the acrylic film was etched away using a developer comprising an aqueous solution of 0.3% by weight of tetramethylammonium hydroxide, and then heated at 240 ° C. for 30 minutes, The film was fully cured to obtain a protective layer having a predetermined shape.

  Next, atmospheric pressure plasma treatment was performed on the surface of the color filter substrate to obtain a water contact angle of 30 ° or less on the resin film of the substrate. The atmospheric pressure plasma generator was processed using an atmospheric pressure plasma cleaning device manufactured by E-Square Corporation. For the treatment, a mixed gas of nitrogen gas and air was used, supplied at a flow rate of 200 liters / minute and 150 milliliters / minute, respectively, and a power of 1.5 kW was supplied at a high frequency to generate plasma. The substrate was transferred under the plasma at a transfer speed of 2 m / min, and the substrate surface was exposed to plasma for processing. The water contact angle is defined as the angle formed by a straight line connecting one substrate contact portion and the apex in the vertical cross section of the water droplet formed on the substrate surface and dropping on the substrate surface. It obtained by the sum of the angle similarly calculated | required in a board | substrate contact part.

  Thereafter, a scribe line was formed by a foil tip made of a super steel alloy in a cutting step, bending stress was applied to the substrate, and the color filter was cut to a size of 350 mm in length and 300 mm in width.

Next, a water supply unit having a shower discharge port is provided in a region 10 cm before and after the chamfering grindstone, water is sprayed at a shower flow rate of 10 l / min, and 5 l / min of water is used for cooling around the chamfering grindstone. Using a diamond wheel (Noritake Super Abrasive Co., Ltd.) as a chamfering grindstone under the conditions of spraying, rotate it at a peripheral speed of 900 m / min, and turn the color filter substrate so that the feed direction is 350 mm. A chamfering process in a 350 mm direction was carried out under the condition of a feed rate of 3 m / min, and R chamfering was performed to produce a color filter substrate. Under the above conditions, the amount of water supplied per substrate was 11000 cm ³ / m ² . The amount of water supplied is the amount of water supplied from the shower section between the time when the front end of the substrate approaches the shower section and the time when the rear end of the substrate comes out of the shower section. Specifically, since the feed direction is 350 mm, the passing time immediately below the shower is 7 seconds, and 1.2 l of water is supplied to the substrate. In consideration of the area of the substrate, it is 11000 cm ³ / m ² per unit area m ² .

  A water film was formed on the entire surface of the substrate before polishing, and the water film was stably maintained even during chamfering, and the film was not disturbed by water repelling or the like.

  Further, similarly, the color filter substrate was prepared by placing on the surface plate so that the feeding direction was 300 mm and chamfering in the 300 mm direction.

  As a result of the surface protrusion inspection of the 10 color filter substrates thus obtained with a protrusion inspection machine, no glass cullet adhered to the surface of the color filter substrate was detected, and a good color filter was gotten.

Example 2
In the same manner as in Example 1, a black matrix layer, a red / green / blue colored layer, and a protective layer were formed on a glass substrate, and then the atmospheric pressure plasma treatment was performed on the surface of the color filter substrate. Next, a scribe line was formed by a foil chip made of super steel alloy in a cutting process, bending stress was applied to the substrate, and the color filter was divided into a size of 350 mm in length and 300 mm in width.

After that, a water supply unit having a shower in a line shape in a direction perpendicular to the cut surface of the color filter substrate is provided at a position 20 cm before the chamfering grindstone, and water is sprayed at a shower flow rate of 2 l / min. While spraying 5 l / min of water around the grindstone for cooling, chamfering in the direction of 350 mm was performed in the same manner as in Example 1 and R chamfering was performed to prepare a color filter substrate. Under the above conditions, the amount of water supplied per substrate was 2200 cm ³ / m ² . Specifically, since the feed direction is 350 mm, the passing time immediately below the shower is 7 seconds, and 0.2 l of water is supplied to the substrate. The 2200 cm ³ / ^{m 2} in consideration of unit area ^{m 2} per the area of the substrate. A water film was formed on the entire surface of the substrate before polishing, and the water film was stably formed even during chamfering, and the film was not disturbed by water repelling or the like. Similarly, chamfering in the 300 mm direction was performed to prepare a color filter substrate.

  As a result of the surface foreign matter inspection of the 10 color filter substrates obtained in this manner using a protrusion inspection machine, no glass cullet adhered to the surface of the color filter substrate was detected, and a good color filter was gotten.

Example 3
In the same manner as in Example 1, a black matrix layer, a red / green / blue colored layer, and a protective layer were formed on a glass substrate, and then the atmospheric pressure plasma treatment was performed on the surface of the color filter substrate. Next, a scribe line was formed by a foil chip made of super steel alloy in a cutting process, bending stress was applied to the substrate, and the color filter was divided into a size of 350 mm in length and 300 mm in width.

Thereafter, a water supply unit having a sprayer in a line shape in a direction perpendicular to the cut surface of the color filter substrate is provided at a position 20 cm before the chamfering grindstone, and water is sprayed in a mist form at a spray rate of 1 l / min. While spraying 5 l / min of water around the chamfering grindstone for cooling, chamfering in the 350 mm direction was performed in the same manner as in Example 1, and R chamfering was performed to produce a color filter substrate. Approximately 90% of the sprayed mist-like water reached the substrate and contributed to the formation of a water film. Under the above conditions, the amount of water supplied per substrate was 1000 cm ³ / m ² . Specifically, since the feed direction is 350 mm, the passing time immediately below the shower is 7 seconds, and 90% of the sprayed mist reaches the substrate, so that 0.1 l of water is supplied to the substrate. . The 1000 cm ³ / ^{m 2} in consideration of unit area ^{m 2} per the area of the substrate. A water film was formed on the entire surface of the substrate before polishing, and the water film was stably formed even during chamfering, and the film was not disturbed by water repelling or the like. Further, as compared with the case where water is supplied by a shower, the film is not disturbed at the moment when water comes into contact with the substrate, and the film is formed more stably. Similarly, chamfering in the 300 mm direction was performed to prepare a color filter substrate.

  As a result of the surface foreign matter inspection of the 10 color filter substrates obtained in this manner using a protrusion inspection machine, no glass cullet adhered to the surface of the color filter substrate was detected, and a good color filter was gotten.

Comparative Example 1
In the same manner as in Example 1, a black matrix layer, a red / green / blue colored layer, and a protective layer are formed on a glass substrate, a scribe line is formed in the cutting step, and the color filter is cut to a length of 350 mm. A color filter having a width of 300 mm was produced.

Next, under the same water injection conditions as in Example 1, chamfering in the 350 mm direction was performed, and R chamfering was performed. The amount of water supplied per substrate was 11000 cm ³ / m ² . Specifically, since the feed direction is 350 mm, the passing time immediately below the shower is 7 seconds, and 1.2 l of water is supplied to the substrate. In consideration of the area of the substrate, it is 11000 cm ³ / m ² per unit area m ² . On the resin film, water repelled, moved on the substrate as droplets, dropped from the substrate, and a water film was not stably formed on the entire surface of the color filter. The water contact angle on the color filter surface before the chamfering process was 80 °. Similarly, chamfering in the 300 mm direction was performed to prepare a color filter substrate.

  Thereafter, brush cleaning was performed by wet cleaning to produce a color filter substrate.

  As a result of performing surface protrusion inspection of the obtained 10 color filters with a protrusion inspection machine, 2.5 pieces / sheet of 10 to 50 μm glass cullet were detected, and the glass cullet was not completely removed.

Comparative Example 2
In the same manner as in Example 1, a black matrix layer, a red / green / blue colored layer, and a protective layer are formed on a glass substrate, a scribe line is formed in the cutting step, and the color filter is cut to a length of 350 mm. A color filter having a width of 300 mm was produced.

Next, under the same water injection conditions as in Example 2, chamfering in the 350 mm direction was performed, and R chamfering was performed. The amount of water supplied per substrate was 2200 cm ³ / m ² . Specifically, since the feed direction is 350 mm, the passing time immediately below the shower is 7 seconds, and 0.2 l of water is supplied to the substrate. The 2200 cm ³ / ^{m 2} in consideration of unit area ^{m 2} per the area of the substrate. On the resin film, the water repelled, and when it passed the shower part, the water almost dropped, and the water film was hardly formed on the color filter surface. The water contact angle on the color filter surface before the chamfering process was 80 °. Similarly, chamfering in the 300 mm direction was performed to prepare a color filter substrate.

  Thereafter, brush cleaning was performed by wet cleaning to produce a color filter substrate.

  As a result of surface protrusion inspection of the obtained 10 color filters with a protrusion inspection machine, 10 or more glass cullet of 10 to 50 μm was detected, and the glass cullet was not completely removed.

Comparative Example 3
In the same manner as in Example 1, a black matrix layer, a red / green / blue colored layer, and a protective layer are formed on a glass substrate, a scribe line is formed in the cutting step, and the color filter is cut to a length of 350 mm. A color filter having a width of 300 mm was produced.

Next, under the same water injection conditions as in Example 3, chamfering in the 350 mm direction was performed, and R chamfering was performed. The amount of water supplied per substrate was 1000 cm ³ / m ² . Specifically, since the feed direction is 350 mm, the passing time immediately below the shower is 7 seconds, and 90% of the sprayed mist reaches the substrate, so that 0.1 l of water is supplied to the substrate. . The 1000 cm ³ / ^{m 2} in consideration of unit area ^{m 2} per the area of the substrate. On the resin film, after the mist-like water has landed on the surface of the substrate, if a certain amount of water accumulates, it drops into water droplets and drops, and a water film is almost formed on the color filter surface during chamfering. There wasn't. The water contact angle on the color filter surface before the chamfering process was 80 °. Similarly, chamfering in the 300 mm direction was performed to prepare a color filter substrate.

  Thereafter, brush cleaning was performed by wet cleaning to produce a color filter substrate.

  As a result of surface protrusion inspection of the obtained 10 color filters with a protrusion inspection machine, 10 or more glass cullet of 10 to 50 μm was detected, and the glass cullet was not completely removed.

It is a top view which shows an example of a structure of the water supply part of the chamfering process concerning this invention. It is a top view which shows an example of a structure of the water supply part of the chamfering process concerning this invention. It is process drawing which shows an example of the manufacturing method of the color filter concerning this invention.

Explanation of symbols

1: Color filter 2: Chamfering grindstone 3: Water supply pipe 101: Substrate 102: Light shielding layer 103: Red layer 104: Green layer 105: Blue layer 106: Protective layer 107: Transparent electrode layer 301: Photomask 302: Ultraviolet

Claims (4)

A cutting step of cutting the glass substrate on which the resin film is formed, and then supplying the water to the surface of the cut glass substrate on which the resin film is formed so that the entire surface of the substrate is covered with water and the cut surface is chamfered by polishing. In a method of manufacturing a display substrate having a chamfering process, a plasma treatment in which the entire surface of the glass substrate on which the resin film is formed is exposed to atmospheric pressure plasma generated at or near atmospheric pressure before the chamfering process. A process for producing a display substrate, comprising a step. 2. The method for manufacturing a display substrate according to claim 1, wherein, in the chamfering step, polishing is performed after water supply is started over the entire surface of the cut glass substrate on which the resin film is formed. The method for producing a display substrate according to claim 1, wherein the water supply amount is 1000 to 3000 cm ³ / m ² per cut glass substrate. The method for manufacturing a display substrate according to claim 1, wherein the method for supplying water is a method for supplying mist-like water.

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