JP2006251607A - Manufacturing method of color filter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a color filter which removes the residuals, without increasing the number of steps or damaging the resin layer. <P>SOLUTION: This manufacturing method is for a color filter which has at least a resin layer on the substrate, and removes the residuals on the surface of the substrate 11, by exposing them to the plasma generated in the atomospheric pressure or at a pressure close to the atomospheric pressure. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate used in a liquid crystal display device, and more particularly to a method for manufacturing a color filter used for colorizing a liquid crystal display device.

  An example of a method for producing a color filter for a color liquid crystal display device is shown below. FIG. 2 shows a process diagram. A black resin paste 12 in which a black pigment or the like is dispersed is applied on a transparent substrate 11, and is heated and temporarily cured (see FIG. 2A). Next, UV light 32 is exposed using a photomask 31 in the exposure (see FIG. 2B). After the exposure, development, rinsing, and drying steps are performed (see FIG. 2C). Thereafter, it is heated again to be fully cured to form a light shielding layer (see FIG. 2D). Next, in order to form a colored layer of Red 14 (red), Green 15 (green), and Blue 16 (blue), the steps of FIGS. 2A to 2D are repeated for each color (see FIG. 2E). Then, if necessary, after forming a protective layer 17 mainly for the purpose of planarization (see FIG. 2 (f)), a transparent electrode layer 18 is formed as needed (see FIG. 2 (g)). An example of a color liquid crystal display device is shown in FIG. The obtained color filter substrate 19 and the pixel electrode substrate 20 opposed to the pixel electrode substrate 20 are kept at a predetermined interval, the peripheral portion is sealed with a sealing material 21, and the liquid crystal 22 is enclosed therein to form a liquid crystal display device. .

  However, in the above-described color filter manufacturing method, in the photolithography process, when the colored resin applied on the substrate is exposed and developed with a developing solution to form a pattern, the residue 13 (see FIG. 2 (c)) remains. Although this residue can be removed to some extent by washing or the like, it is very difficult to completely remove it, and it remains very thin on the substrate surface. And when this residue forms a resin layer or a transparent electrode layer such as a colored layer or a protective layer of another color or a transparent electrode layer in a subsequent process, or seals it with a counter substrate and a sealing material, those layers or sealing material This causes poor adhesion between the substrate and the substrate, and causes film peeling. In particular, in the liquid crystal display device, there is a problem that the reliability of the display device is lowered due to poor adhesion between the resin layer, the transparent electrode layer or the sealing material, and the substrate.

  Also, in the liquid crystal display device in which the transparent electrode layer of the color filter is patterned and the driving driver is directly mounted on the color filter, the transparent electrode layer may be peeled off due to poor adhesion between the resin layer or the transparent electrode layer and the substrate, There was a problem that became a fatal defect such as poor contact with the mounting part.

  To solve this problem, ozone is generated by irradiating ultraviolet rays, the residue on the surface of the substrate reacts with ozone, and the residue is removed (for example, Patent Document 1) or the cleaning process is performed with a brush. A method of physically removing with a brush (for example, Patent Document 2), cleaning with a cleaning liquid irradiated with ultrasonic waves in the cleaning step and / or cleaning with pure water irradiated with ultrasonic waves and removal (For example, Patent Document 3) or a method of removing the residue by reacting the activated active species with the residue by exposing the substrate surface to plasma generated under atmospheric pressure in the post-cleaning process (for example, Patent Document 4) is disclosed.

However, in the former method of removing residues with ultraviolet rays, it is necessary to irradiate ultraviolet rays for a long time in order to completely remove the residues, and in this case, there is a problem that the pixels are also damaged. Further, in the case of removing in the latter cleaning step, there is a problem that the cleaning step needs to be passed for removing the residue, and there is a problem that the number of steps is increased, and the pixel is damaged similarly to the former. there were.
JP-A-5-224015 JP 2001-108822 A JP 2003-75626 A JP 2002-282807 A

  An object of this invention is to provide the manufacturing method of the color filter which can remove a residue, without damaging a resin layer, without increasing the number of processes in order to remove a residue.

In order to solve the above problems, the color filter of the present invention has the following configuration.
(1) In a method for manufacturing a color filter having at least a resin layer on a substrate, wherein the resin is applied on the substrate, exposed and developed in a photolithography process, and patterned to manufacture a color filter. A method for producing a color filter, comprising: removing a residue on a surface of a substrate by exposing the substrate surface to atmospheric pressure plasma generated at or near atmospheric pressure after patterning.
(2) The resin is a photosensitive resin material, and the treatment for removing the residue by exposure to the atmospheric pressure plasma is performed before the step of heating and main-curing after pattern formation. The manufacturing method of the color filter of description.
(3) The method for producing a color filter as described in (2) above, wherein the resin is a negative photosensitive material.
(4) The color filter according to any one of (1) to (3), wherein the color filter has a patterned protective layer, and the surface of the non-formation region of the protective layer is a substrate. Production method.

  The present invention provides another color formed in the next process by removing the residue on the surface of the substrate without increasing the number of processes and damaging the pixels by plasma generated at or near atmospheric pressure. It is possible to provide a color filter that can enhance the adhesion of the resin layer, the protective layer, and the transparent electrode layer, and prevent film peeling.

  The present invention relates to a method for producing a color filter having at least a resin layer on a substrate, wherein the resin is coated on the substrate, exposed and developed in a photolithography process, and patterned to produce a color filter. The method for producing a color filter is characterized in that after the patterning, the surface residue is removed by exposing the substrate surface to atmospheric pressure plasma generated under atmospheric pressure or near atmospheric pressure.

  The present invention does not require a washing step for removing the residue, and the residue can be removed without increasing the number of steps.

  The present invention generates excited active species by performing plasma discharge under atmospheric pressure or near atmospheric pressure, and decomposes the residue by reaction between the excited active species and the residue. The excited active species is a resin. It affects only the surface layer of the layer and hardly damages the resin layer.

  An example of the manufacturing method of the color filter in this invention is shown in FIG. In the present invention, the resin 12 is applied on the substrate 11 and heated and temporarily cured (see FIG. 1 (a)), then exposed and developed in a photolithography process (see FIG. 1 (b)) and heated. And is hardened to form a pattern (see FIG. 1C). Then, the residue is removed by exposure to atmospheric pressure plasma 52 (see FIG. 1D). In this case, the residue 13 generated in the development process can be decomposed and removed by the excited active species generated by the atmospheric pressure plasma. Further, in the main curing step, a residue that is sublimated by heat and adheres again to the substrate surface, that is, a so-called fired residue, can be similarly decomposed and removed by the excited active species. As another example, after applying a resin and exposing and developing a temporarily dried substrate in a photolithography process, the substrate is exposed to atmospheric pressure plasma to remove residues (see FIG. 1 (e)). Then, it is heated and fully cured to form a pattern (see FIG. 1 (f)). In this case, the residue generated in the development step is exposed to plasma before the main curing that is heated and heat-cured, and thus can be easily decomposed and removed as compared with after the main curing. If the resin material is a negative photosensitive material, the resin layer of the pattern portion is photocured by exposure, whereas the residue on the substrate surface is not photocured, so the residue is the resin layer. Compared to, the chemical bonding force is weak and is easily decomposed by atmospheric pressure plasma. Therefore, the residue can be removed more effectively without damaging the resin layer which is a pixel.

  The substrate used in the present invention is not particularly limited, but glass having high light transmittance, excellent mechanical strength and dimensional stability is optimal, and soda glass, alkali-free glass, borosilicate glass, quartz glass, and the like are preferable. It is. In addition, a plastic plate such as a polyimide resin, an acrylic resin, a polyester resin, or a polycarbonate resin, a film wound up in a roll shape, or the like can be used. Metal, wood, paper, etc. can also be used. Although not particularly limited, it is preferable to select a material that is not easily damaged by atmospheric pressure plasma treatment, such as glass or metal.

  The resin layer used in the present invention is not particularly limited, and a material that does not soften, decompose, or color even when annealed at 180 ° C. or higher can be used. Epoxy resin, urethane resin, urea resin, acrylic resin, polyresin Vinyl alcohol resin, melamine resin, polyamide resin, polyamideimide resin, polyimide resin, tetrafluoroethylene resin, silicone resin and mixtures thereof are preferably used. Among these, a polyimide resin, an acrylic resin or an epoxy resin excellent in heat resistance and adhesion is preferable. In addition, the resin layer used in the present invention may be either photosensitive or non-photosensitive, and a photosensitive material is particularly preferably used.

  Although it does not specifically limit as a resin layer used by this invention, The thing which disperse | distributed the pigment | dye in resin can be used, and a light shielding layer and a colored layer can be formed. Examples of pigments that can be used include, but are not limited to, pigments and dyes such as black, red, orange, yellow, green, blue, and purple.

  The protective layer used in the present invention is intended to improve the flatness of the display area, improve the display characteristics, and prevent contamination of the liquid crystal layer by pigments and organic substances used in the light shielding layer and the colored layer. It is formed on the entire surface of the substrate using a transparent resin, or is formed so as to selectively cover only the light shielding layer and the colored layer.

  The material of the protective layer used in the present invention is not particularly limited. Epoxy resin, polyimide resin, silicone resin obtained by condensation polymerization of organosilane, imide obtained by condensation polymerization of organosilane and a compound having an imide group Modified silicone resin, epoxy resin, acrylic resin, urethane resin, urea resin, polyvinyl alcohol resin, melamine resin, polyamide resin, polyamideimide resin, polyester resin, polyolefin resin, gelatin and the like are used. Among them, it is preferable to use a resin that has resistance to heating and organic solvents in the subsequent process of manufacturing a liquid crystal display device, and is transparent and has no color. From this point, a polyimide resin, an acrylic resin, an epoxy System resins are preferably used.

  In the present invention, in particular, a protective layer is selectively formed, a seal portion to be bonded to the opposing pixel electrode substrate using a sealing material is set as a non-protective layer formation region, and a seal portion is provided directly on the substrate to improve adhesion. It is suitably used for a color filter to be improved. Similarly, the mounting portion connecting the liquid crystal panel and the drive driver is used as a non-protective layer forming region, and the mounting portion is provided directly on the substrate, and is suitably used for a color filter that improves adhesion.

  The material of the transparent electrode layer used in the present invention is not particularly limited. For example, as a transparent electrode layer formed on a color filter made of an organic polymer layer, indium oxide, tin oxide, zinc oxide, indium oxide and tin oxide can be used. A mixture (hereinafter referred to as ITO), a simple substance or a mixture of gold, silver, copper, aluminum, palladium, platinum, or the like, or a laminate having a thickness of 10 to 5000 angstroms is preferably used.

  Unlike the conventional plasma generator, the atmospheric pressure plasma used in the present invention does not require a vacuum device because it is discharged under atmospheric pressure, and can be used in an open system. Continuous processing by in-line equipment is possible. Further, in order to supply the excited active species directly to the substrate, the surface treatment can be performed at a much higher speed.

  In addition, since the plasma generated under atmospheric pressure has a short mean free path and small diffusion, it is possible to treat only the substrate surface and hardly cause physical and electrical damage to the substrate itself. As a result, the damage to the substrate to be processed is small compared to the plasma generated under reduced pressure, and it is possible to partially and selectively process only the part to be processed. Can be most suitably used as a surface treatment that does not damage the surface.

The treatment method using atmospheric pressure plasma is not particularly limited, but a plasma is generated by applying a DC high voltage, a high frequency voltage or a pulse voltage to the supplied gas, and the gas excited by the plasma is supplied to the object to be processed. Treat by exposing to the surface. The gas supplied at this time is preferably an inert gas or a mixed gas of an inert gas and a reactive gas in order to stabilize the discharge. As the processing gas for generating plasma in the present invention, helium, argon, neon, krypton, nitrogen, or the like can be used as an inert gas, but helium or argon is considered in view of discharge stability and economy. Alternatively, it is preferable to use nitrogen. As the reaction gas, an optimum gas such as oxygen, air, CO ₂ , or CF ₄ can be arbitrarily selected depending on a material to be processed, a surface state, and a plasma discharge state. For example, when the surface of the resin layer is treated, although not limited, it is preferable to select a reaction gas such as oxygen or air so that oxygen radicals are contained in the plasma in order to perform the treatment at high speed. Of course, in this invention, it can also process only with an inert gas or only a reactive gas.

  Although it does not specifically limit as a pressure under atmospheric pressure in this invention, or atmospheric pressure vicinity, Preferably it is the range of 96-106 kPa.

  In the present invention, the atmospheric pressure and the vicinity of the atmospheric pressure means that the external pressure is completely shut off by a chamber, etc. It is the pressure of the range which does not need to produce. For example, it is also preferable in the present invention to install an exhaust fan or a blower fan for removing the gas used in the process or particles generated by the process in the vicinity of the substrate that is subjected to the plasma process in the atmospheric pressure, and the pressure at that time Is a pressure near atmospheric pressure.

  As a plasma exposure method, a direct method in which the substrate is directly transferred into the plasma and plasma processing is performed, and active species generated in the plasma generation unit are gasified to a substrate disposed at a position where the plasma is not exposed. Any of the indirect methods in which the guidance process is performed can be suitably employed. In the former direct method, if there is a protrusion on the surface of the substrate, or if metal is present inside or on the surface, for example, when the light shielding layer is made of chrome, a strong plasma is generated partially. There is a risk that variations occur in the processing range, and electrical damage such as discharge traces may occur on the substrate surface. However, since both physical effects such as sputtering by plasma and chemical effects by radicals in plasma can be used effectively, this condition can be achieved by controlling the discharge state and achieving stable discharge conditions. It can be suitably used as a surface treatment in the invention.

  On the other hand, when the plasma processing is performed by the latter indirect method, the distance between the substrate and the plasma is important. Since the active species generated by the plasma have a lifetime, if the distance between the substrate and the plasma is too large, the processing capability is significantly reduced. Therefore, there is a certain restriction on the distance relationship between the substrate and the plasma, and the distance between the plasma and the substrate is preferably within 30 mm, more preferably within 10 mm. However, it is difficult to be damaged by plasma, and it is possible to carry out partial and selective processing by using a substrate transfer facility such as an XY stage. It can be preferably used.

  Examples of the present invention will be described below, but the present invention is not limited thereto.

Example 1
A black pigment made of carbon black, a polyamic acid, and a solvent were mixed with stirring to obtain a black paste. The non-photosensitive black paste thus obtained was spin-coated on a transparent substrate having a length of 400 mm, a width of 500 mm, and a thickness of 0.5 mm made of non-alkali glass (manufactured by Nippon Electric Glass Co., Ltd., OA-10). . Then, it heated at 110 degreeC for 15 minutes, and temporarily hardened, and obtained the polyimide precursor film | membrane with a film thickness of 1.5 micrometers. A positive photoresist (OFP-800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) was spin-coated on this film and dried by heating at 80 ° C. for 20 minutes to obtain a resist film having a thickness of 1.0 μm. Next, after UV exposure through a photomask, unnecessary portions of the photoresist and polyimide precursor film were removed by etching using a developer composed of a 2.4% by weight aqueous solution of tetramethylammonium hydroxide, and the remaining photo The resist was removed with methyl celsorb acetate. This was heated at 300 ° C. for 30 minutes to be fully cured, and then the surface of the substrate was subjected to atmospheric pressure plasma treatment to remove the residue, thereby forming a light shielding layer having a predetermined shape. The atmospheric pressure plasma generator was processed in-line by using an atmospheric pressure plasma cleaning device manufactured by E-Square Corporation. For the treatment, a mixed gas of nitrogen gas and air was used, supplied at a flow rate of 200 liters / minute and 150 milliliters / minute, respectively, and a power of 1.5 kW was supplied at a high frequency to generate plasma. The substrate was transferred under the plasma at a transfer speed of 2 m / min, and the substrate surface was exposed to plasma for processing.

  Next, a non-photosensitive red paste composed of polyamic acid, a red pigment, and a solvent was spin-coated and then heated at 110 ° C. for 15 minutes to be temporarily cured to obtain a polyimide precursor film having a thickness of 1.5 μm. A positive photoresist was spin-coated on this film, and a 1.0 μm-thick resist film was obtained by heating and drying at 80 ° C. for 20 minutes. Next, after UV exposure through a photomask, unnecessary portions of the photoresist and polyimide precursor film were removed by etching using a developer composed of an aqueous solution of 2.4% by weight of tetramethylammonium hydroxide, and remained. The photoresist was removed with methyl celsorb acetate. This was heated at 300 ° C. for 30 minutes and fully cured, and then the substrate surface was subjected to atmospheric pressure plasma treatment to remove the residue, thereby obtaining a red colored patterning layer having a predetermined shape. Similarly, each of the green coloring patterning layer and the blue coloring patterning layer was formed.

  The glass portion of the obtained color filter was subjected to an ethanol wiping test using a wiper (manufactured by Toray Industries, Inc., MK Toray Cloth). The wiping test is a test in which ethanol is immersed in a wiper and wiped several times at a distance of about 10 cm with finger pressure. As a result of the test, good results were obtained that no adhesion of pigment was observed on the wiper and there was no pigment residue.

  Further, an acrylic photosensitive protective material (manufactured by JSR, Optmer NN525) was spin-coated and then heated at 90 ° C. for 15 minutes to be temporarily cured to obtain an acrylic film having a thickness of 3.0 μm. Next, after UV exposure through a photomask, the unnecessary portion of the acrylic film was etched away using a developer comprising an aqueous solution of 0.3% by weight of tetramethylammonium hydroxide, and then heated at 240 ° C. for 30 minutes, After the main curing, an atmospheric pressure plasma treatment was performed to obtain a protective layer having a predetermined shape.

  Further, an ITO film serving as a transparent electrode having a thickness of 140 nm was formed on the entire surface, and then a positive photoresist was spin-coated, followed by heating and drying at 80 ° C. for 20 minutes to obtain a resist film having a thickness of 1.0 μm. Next, UV exposure is performed through a photomask, and unnecessary portions of the photoresist are removed with a 2.4% by weight aqueous solution of tetraammonium hydroxide, and then unnecessary using an etchant composed of a mixture of hydrochloric acid and ferric chloride. After the ITO film of the portion was removed by etching, the remaining photoresist was removed with sodium hydroxide to form a transparent electrode layer having a predetermined shape. In this way, a color filter substrate was produced.

  The transparent electrode layer on the glass part of the obtained color filter substrate had no peeled part and a good pattern was obtained. Further, no peeling was observed in the scratch test of the transparent electrode layer on the glass with a needle, and no peeling was observed in the alkali resistance test immersed in potassium hydroxide at 50 ° C. for 10 minutes. A layer was obtained.

On the other hand, a counter substrate made of a transparent electrode is formed on a glass substrate, an alignment film is formed on both the color filter substrate and the counter substrate, and a rubbing process is performed. Chemical industry: WORLD POCK 780P) was used for sealing and bonding, liquid crystal was injected, and a flexible substrate or the like was mounted on the mounting portion. When the completed liquid crystal display device was subjected to a long-term reliability test, no seal peeling or peeling of the mounting portion was observed, and the seal adhesion strength when a seal material of 1 mm ² was formed on the seal portion was 10 N / mm, and high adhesion The result was obtained. As a long-term reliability test, 60 ° C. × 90% × 1000 h, 80 ° C. × 95% × 500 h, and PCT 100 ° C./4 atm × 24 hours were performed as a moisture resistance test.

Example 2
A black pigment made of carbon black, a photopolymerizable acrylic compound, a polymerization initiator, and a solvent were mixed with stirring to obtain an acrylic photosensitive black paste. A black photosensitive acrylic paste was spin-coated on an alkali-free glass, heated at 90 ° C. for 15 minutes, and temporarily dried to obtain an acrylic film having a thickness of 1.5 μm. Next, after ultraviolet exposure through a photomask, an unnecessary portion of the acrylic film was removed by etching using a developer composed of an aqueous solution of 0.3% tetramethylammonium hydroxide. Thereafter, the surface of the substrate was subjected to atmospheric pressure plasma treatment in the same manner as in Example 1. Further, it was heated at 260 ° C. for 30 minutes, and was fully cured to form a light shielding layer having a predetermined shape.

  Furthermore, after spin-coating a photosensitive red paste in which a red pigment is dispersed, it is temporarily dried in the same manner as the black paste to form an acrylic film with a film thickness of 1.5 μm, and exposure and development are performed. After removal, the surface of the substrate was subjected to atmospheric pressure plasma treatment, further heated at 260 ° C. for 30 minutes, and finally cured to obtain a red colored patterning layer having a predetermined shape. Similarly, a green coloring patterning layer and a blue coloring patterning layer were formed.

  Further, an ITO film was formed by mask film formation using a metal mask to obtain a transparent electrode layer having a predetermined shape. In this way, a color filter substrate was produced.

  On the other hand, a driving element substrate composed of a thin film transistor (TFT) element, a scanning line, a signal line, and a transparent electrode was formed to produce a counter substrate. Next, after forming an alignment film on both the color filter substrate and the counter substrate and performing a rubbing treatment, the both substrates are made to face each other, a seal portion is provided on the glass substrate of the color filter, and the seal is bonded. After injecting liquid crystal from the injection port provided in the seal portion, the injection port was sealed. Next, a liquid crystal display device was completed by mounting an IC driver or the like.

When the completed liquid crystal display device was subjected to a long-term reliability test, no peeling of the seal portion was observed, and the seal adhesion strength when a seal material of 1 mm ² was formed on the seal portion was 10 N / mm, indicating a high adhesion result. Obtained.

Example 3
After forming a light-shielding layer and a colored layer on an alkali-free glass in the same manner as in Example 1, an acrylic overcoat material (manufactured by JSR, Optmer SS6917) was spin-coated and then heated and dried at 90 ° C. for 15 minutes. Then, it heated at 240 degreeC for 30 minutes, and obtained the protective layer on the board | substrate whole surface. Then, after forming a transparent electrode layer by mask film formation in the same manner as in Example 2, the alignment film was formed and rubbed, and then the surface of the color filter substrate was subjected to atmospheric pressure plasma treatment and rubbed in the same manner. The liquid crystal display device was completed by sealing and laminating it, facing the drive element substrate provided with the alignment film, and injecting and mounting the liquid crystal.

When the completed liquid crystal display device was subjected to a long-term reliability test, no peeling of the seal portion was observed, and the seal adhesion strength when a seal material of 1 mm ² was formed on the seal portion was 10 N / mm, indicating a high adhesion result. Obtained.

Comparative Example 1
A non-photosensitive black paste is obtained in the same manner as in Example 1 and applied to an alkali-free glass, temporarily dried, formed as a resist film, exposed, developed, and peeled off from the resist film. A light shielding layer was formed. Thereafter, the atmospheric pressure plasma treatment of the substrate surface was not performed, and then a red colored pattern layer was formed using a red paste. Similarly, without performing atmospheric pressure plasma treatment, a green colored patterning layer and a blue colored patterning layer were formed in the next step.

  The glass portion of the obtained color filter was subjected to an ethanol wiping test using a wiper. As a result, pigment adhered to the wiper and a pigment residue remained on the glass surface.

  Furthermore, after obtaining a protective layer of a predetermined shape using a photosensitive protective material made of acrylic, without performing atmospheric pressure plasma treatment of the substrate surface, an ITO film was formed on the entire surface, and by etching, A transparent electrode layer having a predetermined shape was formed. In this way, a color filter substrate was produced.

  In the transparent electrode layer of the glass part of the obtained color filter, a part where peeling occurred in the etching process due to poor adhesion of the ITO film was observed in part. Furthermore, in the scratch test of the transparent electrode on the glass with the needle, peeling of the transparent electrode layer was observed due to scratches, and in the alkali resistance test, the adhesion of the transparent electrode layer due to residues such as lifting of the transparent electrode layer was observed. Defects were seen. In this alkali resistance test, the appearance was evaluated after immersion in 1% NaOH at 80 ° C. for 20 minutes.

Further, an alignment film was formed, rubbed and bonded to the counter substrate, and a liquid crystal display device was completed. When subjected to a long-term reliability test, problems such as display failure due to peeling of the seal and peeling of the mounting portion occurred. When the seal material 1 mm ² was formed on the seal portion, the seal adhesion strength was 10 N / mm or less, resulting in low adhesion.

Comparative Example 2
A photosensitive black paste is obtained in the same manner as in Example 2, applied to non-alkali glass, subjected to temporary drying, exposure, and development, and heated to perform main curing without performing atmospheric pressure plasma treatment on the substrate surface. The light shielding layer having a predetermined shape was formed. Subsequently, similarly, the red colored patterning layer, the green colored patterning layer, and the blue colored patterning layer were formed without performing the atmospheric pressure plasma treatment. Further, after forming a transparent electrode layer in the same manner as in Example 2, the liquid crystal display device was completed facing the drive element substrate.

When the completed liquid crystal display device was subjected to a long-term reliability test, problems such as peeling of the seal occurred. When the seal material 1 mm ² was formed on the seal portion, the seal adhesion strength was 10 N / mm or less, resulting in low adhesion.

Comparative Example 3
In the same manner as in Comparative Example 1, a light shielding layer and a colored layer were formed on an alkali-free glass. Thereafter, a protective layer was formed on the entire surface of the substrate in the same manner as in Example 3, and then a transparent electrode layer was formed. Then, after forming an alignment film and carrying out a rubbing treatment, the liquid crystal display element was completed by facing the driving element substrate having the alignment film similarly rubbed, sticking together, injecting liquid crystal, and mounting. .

When the completed liquid crystal display device was subjected to a long-term reliability test, problems such as peeling of the seal occurred. When the seal material 1 mm ² was formed on the seal portion, the seal adhesion strength was 10 N / mm or less, resulting in low adhesion.

It is process drawing which shows an example of the manufacturing method of the color filter concerning this invention. It is process drawing which shows the reference example of the manufacturing method of the color filter concerning this invention. It is the schematic which shows an example of the liquid crystal display device using the color filter concerning this invention.

Explanation of symbols

11: substrate 12: light shielding layer 13: residue 14: red layer 15: green layer 16: blue layer 17: protective layer 18: transparent electrode layer 19: color filter substrate 20: pixel electrode substrate 21: sealing material 22: liquid crystal 31: Photomask 32: UV light 33: Heating 51: Plasma generator 52: Plasma

Claims (4)

In a method for producing a color filter, in which a resin film is formed on a glass substrate, the resin film is exposed and developed to form a pattern, and then the pattern is heated and cured, the surface of the glass substrate is subjected to atmospheric pressure after the pattern is formed. A method for producing a color filter, wherein the residue on the surface of the glass substrate is removed by exposure to atmospheric pressure plasma generated under or near atmospheric pressure. The resin film is a film obtained by applying a photosensitive resin composition, and a process for removing a residue is performed after patterning of the resin film and before the heat curing. Item 2. A method for producing a color filter according to Item 1. The method for producing a color filter according to claim 2, wherein the photosensitive resin composition contains a negative photosensitive resin. The method for producing a color filter according to claim 1, wherein the resin film is a colored layer and / or a protective layer of a color filter.

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