JP2007258626A - Power module - Google Patents

Power module Download PDF

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Publication number
JP2007258626A
JP2007258626A JP2006084436A JP2006084436A JP2007258626A JP 2007258626 A JP2007258626 A JP 2007258626A JP 2006084436 A JP2006084436 A JP 2006084436A JP 2006084436 A JP2006084436 A JP 2006084436A JP 2007258626 A JP2007258626 A JP 2007258626A
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Japan
Prior art keywords
circuit board
power module
metal substrate
signal line
metal
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Withdrawn
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JP2006084436A
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Japanese (ja)
Inventor
Shigeru Kishi
繁 岸
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Hitachi Appliances Inc
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Hitachi Appliances Inc
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Priority to JP2006084436A priority Critical patent/JP2007258626A/en
Publication of JP2007258626A publication Critical patent/JP2007258626A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that a power module of a conventional structure requires a case forming an outline and a metal substrate area can not be effectively utilized, thereby increasing costs especially regarding a structure for attaching a metal substrate portion and a circuit board portion in association with a power module. <P>SOLUTION: An independent type power line connection terminal comprising a circuit board attaching part is soldered to a metal substrate, the circuit board is fixed thereto and connected by a signal line via a connector soldered to the metal substrate and the circuit board, so that a case forming the outline can be obviated, thereby providing an inexpensive power module. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明はパワーモジュールに係り、特に金属基板部と回路基板部との取り付け構造に関する。   The present invention relates to a power module, and more particularly, to a structure for attaching a metal substrate part and a circuit board part.

公知技術として、半導体素子と平滑コンデンサとを有するインバータ回路において、配線パターンが形成されこの半導体素子が搭載された金属基板と、この金属基板に搭載され外郭を形成するケースと、配線パターンを成形樹脂でインサート成形して前記平滑コンデンサ搭載し、成形基板と前記ケースに設けられた成形基板取り付け端子にネジで取り付けると共に電気的に接続させてインバータ回路を構成するパワーモジュールがある。   As a known technique, in an inverter circuit having a semiconductor element and a smoothing capacitor, a wiring board is formed and a metal substrate on which the semiconductor element is mounted, a case mounted on the metal board to form an outer shell, and the wiring pattern is molded resin. There is a power module in which an inverter circuit is formed by insert molding and mounting the smoothing capacitor, and attaching and electrically connecting to a molded substrate and a molded substrate mounting terminal provided on the case with screws.

公知技術による無刷子電動機の駆動装置の例として特許第3649133号がある。   Japanese Patent No. 3649133 is an example of a driving device for a brushless motor according to a known technique.

特許第3649133号Japanese Patent No. 3649133

上記従来技術を用いたパワーモジュールは外郭を形成するケースを必要とする。また、電力線接続用端子を外郭を形成するケースに組み付けて金属基板に半田付けしているため、電力線接続時の応力を緩和する特殊な形状を必要とする。また、成形基板をケースに設けられた成形基板取り付け端子にネジで取り付けるため、ネジの緩みによる接続不良の可能性がある。また、回路基板を金属基板に半田付けするため、半田付けするリードを特殊な形状にする必要があり、また、両面基板あるいは多層基板が必須であり、さらに、回路基板の下に位置する金属基板に部品を搭載することができない。   The power module using the above prior art requires a case for forming an outer shell. Further, since the power line connection terminal is assembled to the case forming the outer shell and soldered to the metal substrate, a special shape is required to relieve stress when the power line is connected. Further, since the molded substrate is attached to the molded substrate mounting terminal provided in the case with a screw, there is a possibility of connection failure due to looseness of the screw. In addition, since the circuit board is soldered to the metal board, the lead to be soldered must have a special shape, and a double-sided board or a multilayer board is essential, and the metal board located under the circuit board Parts cannot be mounted on.

この構造のパワーモジュールは外郭を形成するケースが必要となり、また、金属基板面積の有効利用ができずコストアップを招いている。   The power module having this structure requires a case for forming an outer shell, and the metal substrate area cannot be effectively used, resulting in an increase in cost.

上記の課題は、金属基板に回路基板取り付け部を設けた自立式の電力線接続用端子を半田付けし、これに回路基板を固定し、金属基板と回路基板を信号線で接続する構造とすることにより達成される。   The above problem is to solder a self-supporting power line connection terminal provided with a circuit board mounting portion on a metal board, fix the circuit board to this, and connect the metal board and the circuit board with signal lines. Is achieved.

本発明を適用することにより、外郭を形成するケースが不要にできるため、安価なパワーモジュールを提供することが可能となる。   By applying the present invention, the case for forming the outer shell can be made unnecessary, so that an inexpensive power module can be provided.

図1は本発明による実施例の構造説明図である。1は金属板、2は絶縁層、3は配線パターンで、以上で金属基板を構成する。4は電力線接続用端子、5は回路基板、6および7は信号線接続用コネクタ、8は信号線、9は回路部品、10はスイッチング素子(図示せず)であり、以上でパワーモジュールを構成している。   FIG. 1 is an explanatory view of the structure of an embodiment according to the present invention. 1 is a metal plate, 2 is an insulating layer, 3 is a wiring pattern, and the metal substrate is constituted as described above. 4 is a power line connecting terminal, 5 is a circuit board, 6 and 7 are signal line connecting connectors, 8 is a signal line, 9 is a circuit component, and 10 is a switching element (not shown). is doing.

スイッチング素子10等の主回路部品、信号線接続用コネクタおよび電力線接続用端子は主回路を構成する配線パターン3上にリフロー工程により半田付けされる。主回路電流は主回路電線を電力線接続用端子に接続することにより流れる。本発明によれば、主回路電流は電力線接続用端子から金属基板上の配線パターンに直接流れるため、制御回路に影響を与える電流が流れない特徴がある。   The main circuit components such as the switching element 10, the signal line connecting connector, and the power line connecting terminal are soldered on the wiring pattern 3 constituting the main circuit by a reflow process. The main circuit current flows by connecting the main circuit wire to the power line connection terminal. According to the present invention, since the main circuit current flows directly from the power line connection terminal to the wiring pattern on the metal substrate, there is a feature that current that affects the control circuit does not flow.

図2に電力線接続用端子の説明図を示す。電力線接続用端子上部には電力線を接続するための平板端子11を具備している。同様に、回路基板を固定するための突起部12を具備している。回路基板挿入後にこの突起部を折り曲げる、あるいは捻ることにより回路基板を固定することができる。電力線接続用端子の下部には金属基板に半田付けするために折り曲げた半田付け部13を有する。自立式の電力線接続用端子の半田付け部は外側に設けることも可能である。この場合、端子の自立安定性が向上する。また、図4に示すように回路基板を電力線接続用端子にネジ止めする構造も可能である。それぞれの取り付け構造を図3、図5に示す。   FIG. 2 is an explanatory diagram of the power line connection terminal. A flat plate terminal 11 for connecting a power line is provided above the power line connection terminal. Similarly, a projection 12 for fixing the circuit board is provided. The circuit board can be fixed by bending or twisting the protrusion after the circuit board is inserted. A soldering portion 13 bent for soldering to a metal substrate is provided below the power line connection terminal. The soldering portion of the self-supporting power line connection terminal can be provided outside. In this case, the self-supporting stability of the terminal is improved. Moreover, as shown in FIG. 4, the structure which screws a circuit board to the terminal for power line connection is also possible. Each attachment structure is shown in FIGS.

回路基板5は回路部品9等を搭載して制御回路を構成する。回路基板5は外郭を形成するケースがないので寸法、形状に制約がない。回路規模により部品取り付け構造を選択できる。搭載部品が少なければ片面プリント基板が使用でき、低下価格化を実現できる。
制御回路と主回路はそれぞれにある信号線接続用コネクタ6、7で信号線8を介して接続される。公知技術のように回路基板を無駄になる金属基板部がない。これにより高価な金属基板の面積を小さくでき、安価なパワーモジュールの構造を提供することが可能となる。
The circuit board 5 includes a circuit component 9 and the like, and constitutes a control circuit. Since the circuit board 5 does not have a case for forming an outline, there is no restriction on the size and shape. The component mounting structure can be selected according to the circuit scale. If there are few mounted parts, a single-sided printed circuit board can be used, and a reduction in price can be realized.
The control circuit and the main circuit are connected via the signal line 8 by the signal line connectors 6 and 7 respectively. There is no metal substrate part which wastes a circuit board like a well-known technique. As a result, the area of the expensive metal substrate can be reduced, and an inexpensive power module structure can be provided.

本発明によるパワーモジュールの構造説明図。Structure explanatory drawing of the power module by this invention. 電力線接続用端子の説明図。Explanatory drawing of the terminal for power line connection. 電力線接続用端子の取り付け説明図。Installation explanatory drawing of the terminal for power line connection. 他の電力線接続用端子の説明図。Explanatory drawing of the other power line connection terminal. 他の電力線接続用端子の取り付け説明図。Installation explanatory drawing of the other terminal for power line connection.

符号の説明Explanation of symbols

1…金属板、2…絶縁層、3…配線パターン、4…電力線接続用端子、5…回路基板、6…信号線接続用コネクタ、7…信号線接続用コネクタ、8…信号線、9…回路部品、10…スイッチング素子、11…平板端子、12…突起部、13…半田付け部、14…ネジ穴、15…ネジ。
DESCRIPTION OF SYMBOLS 1 ... Metal plate, 2 ... Insulating layer, 3 ... Wiring pattern, 4 ... Power line connection terminal, 5 ... Circuit board, 6 ... Signal line connection connector, 7 ... Signal line connection connector, 8 ... Signal line, 9 ... Circuit parts, 10 ... switching element, 11 ... flat terminal, 12 ... protrusion, 13 ... soldering part, 14 ... screw hole, 15 ... screw.

Claims (2)

絶縁層張り金属板に金属箔の配線パターンにより回路を形成した金属基板上に、スイッチング素子等の部品、信号線接続用のコネクタおよび自立式の電力線接続用端子を半田付けしてなる金属基板部と、スイッチング素子を制御する回路部品等および信号線接続用のコネクタを半田付けしてなる回路基板部より構成されるパワーモジュールにおいて、該金属基板上に半田付けした電力線接続用端子に回路基板取り付け部を設け、回路基板を電気的には接続しないで機械的にのみ固定し、金属基板上の信号線接続用コネクタと回路基板上の信号線接続用のコネクタを信号線で接続したことを特徴とするパワーモジュール。   A metal substrate part formed by soldering components such as switching elements, connectors for signal line connection, and terminals for self-supporting power line connection on a metal substrate on which a circuit is formed by a metal foil wiring pattern on an insulating layer-clad metal plate And a power module composed of a circuit board portion formed by soldering a circuit component or the like for controlling a switching element and a signal line connecting connector, and mounting the circuit board to a power line connecting terminal soldered on the metal board The circuit board is fixed mechanically without being electrically connected, and the signal line connector on the metal board and the signal line connector on the circuit board are connected by signal lines. And power module. 請求項1に記載のパワーモジュールを具備した電動機の駆動装置。
The drive device of the electric motor which comprised the power module of Claim 1.
JP2006084436A 2006-03-27 2006-03-27 Power module Withdrawn JP2007258626A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006084436A JP2007258626A (en) 2006-03-27 2006-03-27 Power module

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Application Number Priority Date Filing Date Title
JP2006084436A JP2007258626A (en) 2006-03-27 2006-03-27 Power module

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JP2007258626A true JP2007258626A (en) 2007-10-04

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JP2006084436A Withdrawn JP2007258626A (en) 2006-03-27 2006-03-27 Power module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101482326B1 (en) 2012-12-20 2015-01-13 삼성전기주식회사 Power semiconductor module having latchable lead member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101482326B1 (en) 2012-12-20 2015-01-13 삼성전기주식회사 Power semiconductor module having latchable lead member

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Effective date: 20090602