JP2007258487A - Soldering device, and cooling device therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering device which can perform reflow soldering operation with a high quality and without fluctuations in quality, and to provide a cooling device for the soldering device. <P>SOLUTION: The soldering device 1 is arranged to cool in the cooling device 10 a substrate W heated in a heating furnace 2 to solidify solder. The cooling device 10 has a plurality of nozzles 16 capable of blowing a gas on the substrate W. The cooling device 1 has a temperature distribution detecting means 13 which can detect a temperature distribution in the substrate W. The amount of gas blown from each nozzle 16 is adjusted on the basis of a detection result of the temperature distribution detecting means 13. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling device for a soldering device that can be suitably used for soldering, and a soldering device.

Conventionally, a soldering device cooling device and a soldering device as disclosed in Patent Documents 1 and 2 below have been used for soldering.
JP 2003-179341 A Japanese Patent Application Laid-Open No. 2004-235381

  In the prior art disclosed in the above-mentioned Patent Document 1, a configuration is adopted in which the substrate is cooled by gently blowing a gas cooled by a cooler onto the substrate side taken out from the heating furnace of the soldering device and flowing on the conveyor device. ing.

  In the prior art disclosed in Patent Document 2, the substrate taken out from the heating furnace of the soldering device is first exposed to a gentle air flow generated by operating the fan, and then the cold air that is vigorously discharged from the air nozzle. The structure which cools a board | substrate is employ | adopted.

  In the prior art soldering apparatus cooling apparatus and soldering apparatus as disclosed in Patent Documents 1 and 2, the solder is solidified by cooling the substrate and solder heated in the heating furnace of the soldering apparatus. Can be promoted and fixed, and components such as electric components and electronic components can be attached to the substrate.

  Here, when components are attached to the substrate, the arrangement and density of the components with respect to the substrate are often not uniform, and the heat capacities of the components are often different. Therefore, in the configuration of the prior art, even if the gas can be blown substantially uniformly to the substrate taken out from the heating furnace, the cooling condition varies depending on the part, the soldering quality varies, or the soldering is poor. Could happen.

  Accordingly, in order to solve such a problem, the present invention provides a cooling device for a soldering apparatus, which can cool a substrate or solder in a heated state substantially uniformly regardless of a part and can perform high-quality soldering, and solder. The purpose is to provide an attaching device.

  Therefore, the invention according to claim 1 provided based on such knowledge is a cooling device for a soldering apparatus for cooling a substrate and / or solder attached to the substrate in a heated and molten state. And a cooling means and a temperature distribution detecting means capable of detecting a temperature distribution in the substrate, wherein the cooling means adheres to the substrate and / or the substrate by blowing a gas toward the substrate side. The soldering apparatus cooling is characterized in that the supply state of the gas supplied toward the substrate side can be adjusted according to the temperature distribution detected by the temperature distribution detecting means. Device.

  According to such a configuration, even if the arrangement and density of components with respect to the substrate and the heat capacities of the components are different, the substrate and the solder can be cooled substantially uniformly regardless of the part. Therefore, according to the cooling device for a soldering apparatus of the present invention, it is possible to perform soldering with high quality and without quality variation.

  Here, in general, in order to improve the soldering quality, it is desirable to cool the solder in a heated and melted state as soon as possible. On the other hand, when a large amount of gas is blown at once to solder in a heated and melted state in order to accelerate the solidification of the solder, the solder may be deformed or scattered, and the soldering quality may be deteriorated.

  Therefore, the invention according to claim 2 provided based on such knowledge has precooling means capable of cooling the substrate and / or solder attached to the substrate in a heated and molten state, The soldering apparatus cooling device according to claim 1, wherein the solder and / or the substrate cooled by the pre-cooling means can be further cooled by the cooling means.

  In the cooling device for a soldering apparatus according to the present invention, the solder in the heated and melted state and / or the substrate to which the solder is attached is pre-cooled by the cooling means, and after the solder is solidified to a certain degree to be in a stable state, And the substrate can be further cooled to further solidify the solder. That is, in the cooling device for a soldering apparatus according to the present invention, the precooling means and the cooling means can cool the substrate and the solder attached thereto in a stepwise manner. Therefore, according to the cooling device for a soldering apparatus of the present invention, it is possible to suppress the deterioration of the soldering quality accompanying the solder deformation as described above, and to further improve the soldering quality.

  Here, as described above, when soldering, the entire substrate is generally accommodated in a heating means such as a heating furnace and heated. For this reason, immediately after the substrate is taken out from the heating means described above, it is assumed that the temperature distribution is relatively small over substantially the entire substrate. However, when the substrate is taken out of the heating means and removed for a while, the temperature distribution in each part of the substrate tends to become remarkable due to the influence of the number, density, heat capacity, etc. of the components attached to the substrate. The present inventors pay attention to such a phenomenon, and even after the substrate is taken out of the heating means and cooled to some extent, if the entire substrate is cooled as it is, the difference in the cooling degree in each part on the substrate becomes remarkable, and soldering is performed. It has been found that there is a possibility that the quality of solder may vary and the soldering quality may not be maintained.

  Accordingly, the invention according to claim 3 provided based on such knowledge is such that the temperature distribution detecting means can detect the temperature distribution in the substrate cooled by the pre-cooling means, and the cooling means includes the temperature distribution. 3. The cooling device for a soldering apparatus according to claim 2, wherein the gas supply state can be adjusted based on the temperature distribution in the substrate cooled by the pre-cooling means detected by the detecting means.

  In the cooling device for a soldering apparatus according to the present invention, the temperature distribution of the substrate after being cooled to some extent by the pre-cooling means is detected, and the cooling capacity of the cooling means is adjusted based on this. Therefore, according to the present invention, it is possible to provide a cooling device for a soldering apparatus capable of achieving a high quality soldering state regardless of the number, density, heat capacity, etc. of components attached to the substrate. .

  Here, generally, the solder has a tendency that the faster the cooling rate, the finer the crystal grains, the higher the strength and hardness, and the less likely the cracks at the grain boundaries occur. Therefore, in order to improve the soldering quality, it is desirable to cool the solder in a molten state as soon as possible.

  Accordingly, the invention according to claim 4 provided based on such knowledge is characterized in that the cooling means is capable of injecting the compressed gas to the substrate side. The soldering device cooling device according to any one of the above.

  According to such a configuration, even if the substrate or the components soldered thereto have variations in heat capacity, the cooling rate of the solder can be improved, and the soldering quality can be further improved.

  Here, in the cooling device for a soldering apparatus according to any one of the first to fourth aspects, the cooling unit can adjust the gas supply state by adjusting the supply amount of the gas supplied toward the substrate. It may be anything. (Claim 5)

  Even with this configuration, it is possible to cool the substrate and the solder adhering to the substrate without unevenness and improve the soldering quality.

  The invention according to claim 6 is for cooling the substrate that moves relative to the cooling means and the temperature distribution detecting means and / or solder that is attached to the substrate while being heated and melted. The means has a plurality of gas supply ports capable of supplying gas toward a substrate passing on a predetermined plane, and the gas supply state in one or a group of gas supply ports selected from the plurality of gas supply ports, The gas supply port can be adjusted so as to be different from the gas supply state in another one or a group of gas supply ports selected from the plurality of gas supply ports, and the gas supply port is a relative movement direction of the substrate with respect to the cooling means and / or 6. The soldering device cooling device according to claim 1, wherein a plurality of the cooling devices are provided in a direction intersecting the relative movement direction.

  In the cooling device for a soldering apparatus of the present invention, the cooling means has a plurality of gas supply ports, and the gas supply state at each gas supply port can be adjusted for each or one group. Therefore, according to the cooling device for a soldering apparatus of the present invention, gas can be supplied to the substrate side in a state suitable for solder solidification according to the temperature distribution of the substrate. Therefore, according to the cooling device for a soldering apparatus of the present invention, high-quality soldering can be performed.

  In the present invention, the number of gas supply ports may be two or more, or a plurality of two or more groups, and the number of gas supply ports is not limited to two or two groups. Further, in the present invention, the “other one or group of gas supply ports” may be a plurality or a plurality of groups excluding “one or a group of gas supply ports” even if they are all except “one or a group of gas supply ports”. One or a group of gas supply ports selected from these gas supply ports may be used.

  The invention according to claim 7 is to cool the substrate that moves relative to the cooling means and / or the solder that is attached to the substrate while being heated and melted. The temperature distribution in the substrate can be detected on the upstream side in the passage direction of the substrate with respect to one or a plurality of gas supply ports selected from the plurality of gas supply ports arranged in the relative movement direction of the substrate with respect to the cooling unit, and the temperature distribution detection unit Based on the detected temperature distribution, the gas supply state is adjusted at the one or more gas supply ports and / or the gas supply port that is located downstream of the one or more gas supply ports in the relative movement direction of the substrate. The soldering device cooling device according to claim 6, wherein the soldering device cooling device is a soldering device cooling device.

  According to such a configuration, the cooling capacity of the cooling means can be adjusted to a state suitable for the solidification of the solder based on the temperature distribution of the substrate.

  In the invention according to claim 8, the cooling means supplies a gas to the part detected as being high temperature by the temperature distribution detecting means by supplying more gas than the part detected as being low temperature. The soldering device cooling device according to claim 1, wherein the soldering device cooling device can be adjusted.

  According to such a configuration, the cooling capacity of the cooling means is appropriately adjusted according to the temperature distribution in the substrate, and the substrate and the solder attached thereto can be cooled substantially uniformly throughout the entire area. Therefore, according to the cooling device for a soldering apparatus of the present invention, the quality of soldering can be improved.

  Invention of Claim 9 is equipped with the heating means which heats the solder adhering to a board | substrate, and makes it the molten state, The cooling device for soldering apparatuses in any one of Claims 1-8 A soldering apparatus characterized by comprising:

  Since the soldering apparatus of the present invention includes the cooling device for a soldering apparatus according to any one of the first to eighth aspects, it is possible to suppress variations in soldering quality and deterioration in quality. .

  ADVANTAGE OF THE INVENTION According to this invention, the cooling device for soldering apparatuses and the soldering apparatus which can implement soldering in the state which does not have quality variation and quality variation can be provided.

  Subsequently, as an example of a soldering apparatus according to an embodiment of the present invention and a soldering apparatus cooling apparatus, refer to the drawings regarding a soldering apparatus for performing reflow soldering and a cooling apparatus used therefor. However, it explains in detail. In FIG. 1, reference numeral 1 denotes a soldering apparatus according to the present embodiment, and reference numeral 10 denotes a soldering apparatus cooling apparatus (hereinafter simply referred to as a cooling apparatus). The soldering apparatus 1 is an apparatus for reflow soldering parts such as electric parts and electronic parts mounted on the board W to the board W by using solder generally called cream solder. is there.

  The soldering apparatus 1 includes a conveyor 3 for transporting the substrate W, a control unit 5, and a cooling device 10 in addition to a heating furnace 2 (heating unit) for heating the substrate W to bring the solder into a molten state. It is configured. The heating furnace 2 can raise the temperature to a temperature higher than the temperature at which the solder melts. More specifically, the heating furnace 2 can maintain the internal atmospheric temperature at a high temperature of about 200 ° C. to 250 ° C. The conveyor 3 can transport the substrate W from the heating furnace 2 side to the cooling device 10 side at a predetermined speed. The cooling device 10 is for cooling the substrate W heated in the heating furnace 2 and the solder adhering thereto.

  More specifically, in the soldering apparatus 1, the conveyor 3 is configured by a conventionally known conveyor such as a roller conveyor, a chain conveyor, a belt conveyor, and the like. It is set as the structure which can be conveyed so that it may pass through the heating furnace 2 and heat and may reach | attain the cooling device 10. That is, the soldering device 1 is configured to be able to move the one mounted on the conveyor 3 relative to the cooling device 10.

  As shown in FIG. 1, the cooling device 10 is roughly configured to include a pre-cooling unit 11, a cooling unit 12, and a temperature distribution detection unit 13. The pre-cooling means 11 is configured by a conventionally known fan or the like, and is provided at a position adjacent to the downstream side in the transport direction of the substrate W transported by the conveyor 3 with respect to the heating furnace 2. The cooling device 10 can activate the pre-cooling means 11 to generate an air flow toward the substrate W mounted on the transport surface 3a of the conveyor 3, and cool the substrate W by exposing the air flow to the substrate W side. The pre-cooling means 11 is configured such that the airflow generated by the operation substantially uniformly strikes the substrate W mounted on the transport surface 3a of the conveyor 3 regardless of the part.

  As shown in FIG. 1, the cooling means 12 includes a main body portion 15, and a nozzle 16 and a gas compression means 17 are connected to the main body portion 15. The main body 15 of the cooling means 12 is installed above the transport surface 3 a of the conveyor 3. As shown in FIG. 1, a gas compression means 17 is connected to the main body portion 15 via a connecting pipe 18. Therefore, the cooling unit 12 can supply the gas compressed in the gas compression unit 17 (air in this embodiment) to the main body 15 through the connection pipe 18. In this embodiment, it is set as the structure which can supply the gas compressed to about 0.3 MPa-about 0.6 MPa to the main-body part 15 side at normal temperature.

  As shown in FIG. 3, nine nozzles 16 are connected to the main body portion 15. Each of the nozzles 16 has a flow rate adjusting valve 20, which can be opened and closed and the opening degree thereof can be adjusted based on a control signal transmitted from the control means 5. The nozzle 16 opens and closes the flow rate adjusting valve 20, thereby allowing the gas (air) supplied in a compressed state to the main body portion 15 from the jet port 21 (gas supply port) provided at the tip thereof, below the main body portion 15, That is, it is set as the structure which can be ejected toward the conveyance surface 3a side of the conveyor 3. FIG. Therefore, the airflow ejected from the nozzle 16 is stronger than the airflow generated by operating the precooling means 11.

  Further, the flow rate adjustment valve 20 provided in each nozzle 16 is configured such that the opening degree can be adjusted independently. Therefore, the cooling means 12 adjusts the flow rate distribution of the air blown to the conveyor 3 side by independently adjusting the opening degree of the flow rate adjusting valve 20 of each nozzle 16 based on the control signal transmitted from the control means 5. It can be adjusted arbitrarily.

  As shown in FIGS. 2 and 3, the nozzles 16 are arranged at substantially equal intervals over 3 rows and 3 columns. That is, the nozzles 16 are arranged in three rows in the traveling direction of the transport surface 3a of the conveyor 3 (the transport direction of the substrate W mounted on the transport surface 3a), and are substantially orthogonal to the transport direction of the substrate W. It is also arranged side by side over three rows. More specifically, the nozzles 16 are arranged in a matrix form (matrix form) as shown in FIGS.

  Here, as shown in FIG. 4A, the three nozzles 16 arranged in the direction intersecting the traveling direction of the transport surface 3a (the width direction of the transport surface 3a) are classified as one group, and these groups Are the nozzle groups in the X, Y, and Z rows in order from the upstream side in the traveling direction of the transport surface 3a, the nozzle groups in the X, Y, and Z rows are arranged at equal intervals in the traveling direction of the transport surface 3a. Yes. Further, between the nozzle groups of the X and Y rows and between the nozzle groups of the Y and Z rows, the temperature distribution detecting means 13 is arranged with the nozzles 16 constituting the nozzle groups of the X, Y, and Z rows. Arranged along the direction.

  Further, as shown in FIG. 4B, the three nozzles 16 arranged in the traveling direction of the transport surface 3a are classified as one group, and these groups are arranged in order from the one on the one end side in the width direction of the transport surface 3a. , Y, z row nozzle groups are defined, the x, y, z row nozzle groups are arranged at equal intervals in the width direction of the transport surface 3a. Further, as shown in FIG. 2, each of the nozzles 16 (hereinafter, referred to as nozzles 16a, 16b, and 16c as necessary) constituting the nozzle group in the x, y, and z rows is respectively provided on the transport surface 3a. It arrange | positions so that it may line up on the virtual lines L1, L2, L3 extended along the advancing direction.

  As shown in FIG. 1, four temperature distribution detectors 13 are provided in the direction of travel of the conveyor 3, that is, the direction in which the substrate W mounted on the transport surface 3a moves when the conveyor 3 is operated. . The temperature distribution detection means 13 has three temperature sensors 25 (25a to 25c) in a direction intersecting (substantially orthogonal to) the traveling direction as shown in FIGS. The temperature sensor 25 is configured by a so-called non-contact thermometer or infrared thermometer, and can detect a temperature substantially below the temperature sensor 25 and transmit the detected data to the control means 5. ing. Therefore, the control means 5 is mounted on the conveyor 3 by checking the temperatures detected by the temperature sensors 25a to 25c constituting the temperature distribution detection means 13 at a predetermined time, and immediately below the temperature distribution detection means 13. In the passing substrate W, it is detected what temperature distribution is formed in the width direction of the conveyor 3, that is, in a direction substantially orthogonal to the traveling direction of the conveyor 3 and the substrate W mounted thereon. Can do.

  Here, as shown in FIG. 2, each temperature distribution detection means 13 includes a virtual line L <b> 1 in which the temperature sensors 25 a to 25 c are arranged with the nozzles 16 constituting the nozzle group in the x, y, and z rows described above. , L2 and L3 are arranged side by side. Therefore, the temperature sensor 25a can detect the temperature of the portion that is mounted on the transport surface 3a and passes below the nozzles 16 constituting the x-th nozzle group on the transported substrate W. Similarly, the temperature of the part mounted on the transport surface 3a and passing below each nozzle 16 constituting the nozzle group in the y and z rows on the transported substrate W is detected by the temperature sensors 25b and 25c. be able to.

  As shown in FIGS. 1 and 2, a plurality of temperature distribution detecting means 13 are provided in the traveling direction of the conveyor surface 3 a of the conveyor 3 (the traveling direction of the substrate W). The temperature distribution detection means 13 is set so that each of the temperature sensors 25a to 25c is arranged in a direction intersecting (substantially orthogonal in the present embodiment) with respect to the traveling direction of the transport surface 3a of the conveyor 3.

  Among the temperature distribution detection means 13, the one located most upstream in the traveling direction of the conveying surface 3 a of the conveyor 3 is adjacent to the outlet 2 b of the heating furnace 2, and the traveling direction of the conveying surface 3 a of the conveyor 3 than the pre-cooling means 11 ( It is provided at a position upstream of the traveling direction of the substrate W). Further, the temperature distribution detection means 13 is also provided at a position downstream of the precooling means 11. That is, the temperature distribution detection means 13 is a position between the pre-cooling means 11 and the cooling means 12 and the X-th row nozzle group provided in the direction intersecting the traveling direction of the transport surface 3a, the X-th row nozzle. And a position between the nozzle group of the Y-th row and a position between the nozzle group of the Y-th row and the nozzle group of the Z-th row. In other words, in the present embodiment, the temperature distribution detection means 13 (hereinafter, each is required) at a position adjacent to the pre-cooling means 11 and the nozzle group in the X, Y, and Z rows on the upstream side in the traveling direction of the transport surface 3a. The temperature distribution detecting means 13a to 13d are sequentially provided from the upstream side in the traveling direction of the transport surface 3a.

  In the present embodiment, the rotation speed of the fan constituting the precooling means 11 and the opening degree of the flow rate adjusting valve 20 of each nozzle 16 constituting the nozzle group in the X, Y, Z rows are determined by the precooling means 11 and the X, Y. , And are adjusted based on information detected by temperature distribution detection means 13a to 13d provided at positions adjacent to the upstream side of the nozzle group in the Z-th row. That is, the opening degree of the flow rate adjusting valve 20 provided in the precooling means 11 and each nozzle 16 is feedback-controlled based on the detection information of the temperature distribution detection means 13a to 13d.

  Subsequently, operations of the soldering apparatus 1 and the cooling apparatus 10 of the present embodiment will be described in detail. When the substrate W is mounted on the transport surface 3a of the conveyor 3 on the upstream side (the right end side in FIGS. 1 and 2) of the heating furnace 2, the soldering apparatus 1 can be introduced into the heating furnace 2. Moreover, the heating furnace 2 can make internal atmospheric temperature higher than the melting temperature of solder. For this reason, the substrate W is prepared as a state in which components such as electric parts and electronic parts are mounted and unmelted solder is attached (mounted state), and the internal atmosphere temperature of the heating furnace 2 is set to be higher than the melting temperature of the solder. When the substrate W in a mounted state is mounted on the transport surface 3a of the conveyor 3 in an operating state, the substrate W is introduced into the heating furnace 2 from the inlet 2a. As a result, the solder attached to the substrate W is melted.

  When the conveyor 3 further operates, the substrate W heated in the heating furnace 2 comes out from the outlet 2b of the heating furnace 2. When the substrate W comes out of the heating furnace 2, the temperature of the substrate W is detected by the temperature sensors 25a to 25c of the temperature distribution detection means 13a provided at a position adjacent to the outlet 2b, and this detection signal is controlled by the control means. 5 is sent. The control means 5 adjusts the rotational speed of the fan constituting the pre-cooling means 11 based on the temperature of the substrate W detected by the temperature distribution detection means 13a. That is, if the detected temperature of the temperature distribution detecting means 13a is high, the rotational speed of the fan constituting the precooling means 11 is controlled to be high. If the detected temperature of the temperature distribution detecting means 13a is low, the precooling means 11 is controlled. Control is performed so that the rotational speed of the constituent fan is lowered. Thereby, the substrate W and the solder in a molten state on the substrate W are cooled, and the solder is solidified to some extent.

  When the conveyor 3 further operates and the substrate W moves downstream of the pre-cooling means 11, the temperature distribution detecting means of the substrate W is detected by the temperature sensors 25a to 25c constituting the temperature distribution detecting means 13 (13b to 13d). The temperature of the part located below 13 (13b-13d) is detected, and the detection result is transmitted to the control means 5. As a result, the control unit 5 determines which portion of the substrate W is located immediately below the temperature distribution detection unit 13 (13b to 13d) in the width direction of the transport surface 3a (a direction substantially orthogonal to the traveling direction). It is grasped whether such a temperature distribution is formed.

  Based on the detected temperature detected by the temperature distribution detection means 13 (13b to 13d), the control means 5 is located adjacent to the temperature distribution detection means 13 (13b to 13d) on the downstream side in the traveling direction of the transport surface 3a. The degree of opening of the flow rate adjustment valve 20 of each nozzle 16 constituting any one of the nozzle groups in the X, Y, and Z rows is controlled. Moreover, the timing of the opening degree adjustment of the flow rate adjustment valve 20 constitutes the temperature distribution detection means 13 (13b to 13d) and any one of the nozzle groups in the X, Y, and Z rows provided at positions adjacent thereto. Temperature distribution detected by the temperature distribution detection means 13 (13b-13d) based on the interval between the nozzles 16 to be installed (interval in the traveling direction of the transfer surface 3a) and the transfer speed of the substrate W by the conveyor 3. Is adjusted based on the timing at which it is assumed that the portion of the substrate W that has become the lower side of the nozzle group in the X, Y, and Z rows adjacent to the downstream side in the transport direction.

  More specifically, for example, as shown in FIG. 5A, when the substrate W arrives below the temperature distribution detection means 13 (13b to 13d), the temperature of the substrate W is detected by the temperature sensors 25a to 25c. As a result, if the substrate W passing under the temperature distribution detection means 13 has a temperature distribution as shown in FIG. 5B in the width direction of the transport surface 3, this temperature distribution detection means. 13, the flow rate adjustment for the nozzles 16 a, 16 b, and 16 c constituting the nozzle groups in the X, Y, and Z rows located adjacent to the downstream side of the substrate W in the transport direction (the arrow direction in FIG. 5A). The opening degree of the valves 20, 20, 20 is adjusted as shown in FIG. That is, as shown in FIG. 5B, the detected temperature of the temperature sensor 25b installed at the approximate center in the width direction of the transport surface 3a is the highest, the detected temperature of the temperature sensor 25c is the lowest, and the detected temperature of the temperature sensor 25a. Is about the middle of these, the flow rate adjustment valve 20 for the nozzle 16b is adjusted to the largest opening degree, and the flow rate adjustment valve 20 for the nozzle 16c is adjusted to the smallest opening degree. Further, the opening degree of the flow rate adjusting valve 20 for the nozzle 16a is adjusted to be intermediate between the opening degree of the flow rate adjusting valves 20 and 20 for the nozzles 16b and 16c.

  As described above, in the cooling device 10 employed in the soldering apparatus 1 of the present embodiment, the amount of gas (air) blown from the nozzles 16 constituting the cooling unit 12 to the substrate W is determined by the nozzles. 16 is adjusted based on the temperature distribution on the substrate W detected by the temperature distribution detecting means 13 on the upstream side in the transport direction of the substrate W. That is, more gas is blown to the portion where the substrate W is hot than the portion where the substrate W is low. Therefore, in the soldering apparatus 1 of the present embodiment, the cooling of the substrate W and the solder adhering thereto in the cooling apparatus 10 proceeds substantially uniformly. Therefore, according to the soldering apparatus 1 of the present embodiment, the arrangement density (distribution) of components to be mounted on the substrate W, the heat capacity distribution on the substrate W in a state in which the components are mounted (mounted state), and the like. The substrate W that has been heat-treated in the heating furnace 2 and the solder adhering thereto can be cooled substantially uniformly to promote solidification. Therefore, according to the soldering apparatus 1, high-quality reflow soldering can be performed with little variation in quality.

  In the soldering apparatus 1 of the above embodiment, the temperature distribution detecting means 13b, 13c, 13d provided at positions adjacent to the upstream side with respect to the nozzle groups of the X, Y, Z rows arranged in the moving direction of the substrate W. Thus, the temperature distribution of the substrate W passing below these is partially detected, and the opening degree of the flow rate adjusting valve 20 of each nozzle 16 is adjusted according to this result. Therefore, even if the temperature distribution changes as the substrate W moves downstream, the amount of gas blown out at each nozzle 16 is adjusted to reflect the change and the substrate W can be cooled substantially uniformly.

  In the above embodiment, based on the detection results of the temperature distribution detection means 13b, 13c, and 13d, the flow rate adjustment valves 20 of the nozzles 16 constituting the nozzle group in the X, Y, and Z rows adjacent to the downstream side of these. However, the present invention is not limited to this. More specifically, the soldering apparatus 1 and the cooling apparatus 10 according to the above-described embodiment are preliminarily applied to the entire substrate W before the position where each nozzle 16 is provided after the substrate W comes out of the heating furnace 2. The temperature distribution may be detected, and the opening degree of the flow rate adjustment valve 20 of each nozzle 16 constituting the nozzle group in the X, Y, and Z rows may be adjusted according to the result. In the case of such a configuration, it is impossible to grasp the temperature change of the substrate W one by one as in the above embodiment, but it is possible to cool the substrate W and the solder in an optimal state for solidification of the solder. it can.

  In the above embodiment, each nozzle 16 is classified into three rows of nozzle groups consisting of X, Y, and Z, and the configuration in which the amount of gas ejected from each nozzle 16 is adjusted based on this is illustrated. It is not limited to this. That is, it is good also as a structure which classifies each nozzle 16 by methods other than the classification by the above-mentioned row | line | column or column, and adjusts the quantity of the gas ejected from each nozzle 16 based on this.

  In the soldering apparatus 1 of the above embodiment, the cooling device 10 is provided with the pre-cooling means 11, and the substrate W immediately after the heat treatment in the heating furnace 2 is cooled to some extent (pre-cooling) and then cooled by the cooling means 12. It is said that. For this reason, if reflow soldering is performed by the soldering apparatus 1, there is no problem that the solder is deformed or scattered when the solder in the molten state is cooled.

  In the above embodiment, the temperature distribution on the substrate W is detected by the temperature distribution detection means 13 after being cooled to some extent by the pre-cooling means 11, and the gas ejected from each nozzle 16 arranged on the downstream side based on the detection result The amount is adjusted. Therefore, the soldering apparatus 1 can accurately grasp the temperature distribution in the substrate W that has been cooled to some extent, and can cool the entire substrate W so that the temperature is substantially uniform regardless of the temperature distribution. Therefore, according to the soldering apparatus 1, the entire substrate W can be cooled substantially uniformly even if there are variations in the density and heat capacity of the components mounted on the substrate W. Therefore, according to the soldering apparatus 1, it is possible to perform reflow soldering with high quality and little variation.

  In the above embodiment, the pre-cooling means 11 is provided, and the configuration in which the substrate W immediately after being heated in the heating furnace 2 can be cooled by this is exemplified. However, the present invention is not limited to this, and the pre-cooling means is provided. It is good also as a structure which does not have 11. In the case of such a configuration, there is a possibility that the above-described solder deformation and scattering suppression effect, etc. may be diminished. However, as with the soldering apparatus 1 of the above embodiment, high quality reflow soldering is performed with little variation in quality. be able to.

  As described above, in this embodiment, the cooling unit 12 is configured to be able to blow high-pressure air from each nozzle 16 toward the substrate W side. Therefore, in the soldering apparatus 1 of this embodiment, the cooling effect of the board | substrate W in the cooling means 12 is high, and the board | substrate W and solder can be cooled quickly. Therefore, according to the soldering apparatus 1 of this embodiment, the quality of reflow soldering can be further improved.

  In the above embodiment, the configuration in which the compressed gas is supplied to all the nozzles 16 and can be sprayed on the substrate W side is illustrated, but the present invention is not limited to this, for example, Among the nozzles 16 constituting the cooling means 12, only a part of the nozzles 16 can be compressed, or the pressure of the gas blown toward the substrate W is different for each nozzle 16. There may be.

  Moreover, in the said embodiment, although the structure which can adjust the quantity of the gas which blows off from the nozzle 16 with the flow regulating valve 20 was illustrated, this is only one Embodiment of this invention, and the soldering apparatus 1 has another structure. It may be adopted. More specifically, in the above-described embodiment, each nozzle 16 is fixed with respect to the main body portion 15. However, the nozzle 16 is configured to be freely movable, and the nozzle is set according to the temperature distribution on the substrate W. It is good also as a structure by which arrangement | positioning of 16 is changed. That is, a configuration may be adopted in which more nozzles 16 are collected above the portion having a high temperature in the substrate W than the portion having a low temperature and the gas is blown toward the substrate W. In the case of such a configuration, an operation mechanism of the nozzle 16 is required, but the distribution of the amount of gas blown to the substrate W side is adjusted according to the temperature distribution of the substrate W as in the above embodiment, The entire substrate W can be cooled substantially uniformly.

  In the said embodiment, although the structure which the conveyance surface 3a of the conveyor 3 moves with respect to the cooling device 10 was illustrated, this invention is not limited to this. More specifically, the soldering apparatus 1 and the cooling apparatus 10 are configured such that, for example, the precooling means 11 and the cooling means 12 move relative to the substrate W, that is, the precooling means 11 and the cooling means 12 move relative to the substrate W. Any configuration can be used.

  The soldering apparatus 1 of the above embodiment has a configuration in which a gas such as air supplied from the outside is compressed and supplied by the gas compression means 17 and blown out from the nozzle 16 toward the substrate W. However, the present invention is not limited thereto, and a cooling unit capable of cooling the gas may be separately provided, and the gas cooled by the cooling unit may be blown out from the nozzle 16. According to such a configuration, the cooling effect of the substrate W and the solder can be further improved, and the quality of reflow soldering can be further improved.

  In the above-described embodiment, the configuration in which a plurality of nozzles 16 are provided has been exemplified. However, the present invention is not limited to this, and for example, a cooling gas supply means for supplying a cooling gas is provided and the cooling gas is provided. A plurality of gas ejection openings may be provided in the supply means, and the opening area of the openings may be appropriately changed. With this configuration, instead of adjusting the flow rate adjusting valve provided corresponding to each nozzle 16 in the above embodiment, the opening area of the gas jetting opening is adjusted, so that the jetting is performed toward the substrate W side. The amount of gas to be adjusted can be adjusted, and the same effects as those shown in the above embodiment can be obtained.

It is a front view showing typically composition of a soldering device and a cooling device for soldering devices concerning one embodiment of the present invention. It is an A direction arrow directional view of FIG. It is a perspective view which shows the state which observed the cooling device for soldering apparatuses shown in FIG. 1 from the downward side. (A), (b) is a conceptual diagram which shows typically the positional relationship of the nozzle and temperature distribution detection means in the cooling device for soldering apparatuses shown in FIG. (A) is a conceptual diagram which shows the positional relationship of the nozzle and temperature distribution detection means in the cooling device for soldering apparatuses shown in FIG. 1, (b) is an example of the state of the temperature distribution detected by the temperature distribution means. The graph which shows, (c) is a graph which shows an example of the opening degree of a flow regulating valve.

Explanation of symbols

1 Soldering equipment 2 Heating furnace (heating means)
3 Conveyor 3a Conveying surface 10 Soldering device cooling device (cooling device)
11 Precooling means 12 Cooling means 13 Temperature distribution detecting means 16 Nozzle 17 Gas compression means 20 Flow rate adjusting valve

Claims (9)

A cooling device for a soldering apparatus for cooling a substrate and / or solder adhered to the substrate while being heated and melted,
A cooling means and a temperature distribution detecting means capable of detecting the temperature distribution in the substrate;
The cooling means cools the substrate and / or the solder adhering to the substrate by blowing gas toward the substrate side, and the supply state of the gas supplied toward the substrate side is determined by temperature distribution. A cooling device for a soldering apparatus, which can be adjusted according to a temperature distribution detected by a detection means. Having a pre-cooling means capable of cooling the substrate and / or solder adhered to the substrate while being heated and melted;
The soldering device cooling apparatus according to claim 1, wherein the solder and / or the substrate cooled by the precooling means can be further cooled by the cooling means. The temperature distribution detecting means can detect the temperature distribution in the substrate cooled by the pre-cooling means,
3. The soldering apparatus according to claim 2, wherein the cooling means is capable of adjusting a gas supply state based on a temperature distribution in the substrate cooled by the pre-cooling means detected by the temperature distribution detecting means. Cooling system.   The cooling device for a soldering apparatus according to any one of claims 1 to 3, wherein the cooling means is capable of ejecting a compressed gas to the substrate side.   The cooling for a soldering apparatus according to any one of claims 1 to 4, wherein the cooling means is capable of adjusting a supply state of the gas by adjusting a supply amount of the gas supplied toward the substrate. apparatus. The substrate that moves relative to the cooling means and the temperature distribution detection means and / or the solder that is attached to the substrate while being heated and melted is cooled.
The cooling means has a plurality of gas supply ports capable of supplying gas toward the substrate passing on a predetermined plane, and the gas supply state in one or a group of gas supply ports selected from the plurality of gas supply ports The gas supply state can be adjusted to be different from the gas supply port of the other one or a group selected from the plurality of gas supply ports,
Soldering according to any one of claims 1 to 5, wherein a plurality of gas supply ports are provided in a direction of relative movement of the substrate with respect to the cooling means and / or in a direction crossing the direction of relative movement. Cooling device for equipment. The substrate that moves relative to the cooling means and / or the solder that is heated and melted with respect to the substrate is cooled.
The temperature distribution detection means can detect the temperature distribution in the substrate on the upstream side in the passage direction of the substrate from one or more gas supply ports selected from the plurality of gas supply ports arranged in the relative movement direction of the substrate with respect to the cooling means,
Based on the temperature distribution detected by the temperature distribution detecting means, the one or more gas supply ports and / or the gas supply port existing on the downstream side in the relative movement direction of the substrate with respect to the one or more gas supply ports. The cooling device for a soldering apparatus according to claim 6, wherein a supply state of the gas is adjusted.   The cooling means is capable of adjusting the gas supply state by supplying more gas to the part detected as high temperature by the temperature distribution detecting means than the part detected as low temperature. The cooling device for a soldering apparatus according to any one of claims 1 to 7.   A soldering apparatus comprising: heating means for heating the solder attached to the substrate to a molten state; and the cooling device for a soldering apparatus according to any one of claims 1 to 8. .

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