JP2007251026A - Substrate processing apparatus, substrate processing method, and substrate processing program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent drying failure in drying processing from happening even when a batch subjected to batch processing is not constituted with the maximum sheets of substrates. <P>SOLUTION: In a substrate processing apparatus where a batch constituted with substrates to be batch processed is disposed in a drying processing tank and the substrates are dried for every batch by supplying dried vapor into the drying processing tank, supply conditions of the dried vapor to the drying processing tank (amount of supply of the dried vapor to the drying processing tank per unit time and supply time of the dried vapor to the drying processing tank, etc) are changed in accordance with constitution conditions of the substrates constituting the batch (the number of the sheets of the substrates involved in the batch and whether or not substrates to be situated next to the surface side of the substrates constituting the batch are not enough). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus, a substrate processing method, and a substrate processing program for performing a drying process on a substrate such as a semiconductor wafer or a liquid crystal substrate.

  2. Description of the Related Art Conventionally, in a manufacturing process of a semiconductor component or a flat display, a drying process for performing a drying process on various substrates such as a cleaned semiconductor wafer and a liquid crystal substrate is provided. As a substrate processing apparatus used in this drying process, drying vapor (IPA gas: isopropyl alcohol vapor or the like) for drying the substrate is supplied to the drying treatment tank, and the drying vapor is applied to the surface of the substrate inside the drying treatment tank. Is configured to perform a drying process on a substrate by bringing them into contact with each other (see, for example, Patent Document 1).

  In this conventional substrate processing apparatus, a batch that is processed in batch by one or a plurality of substrates is configured, and this batch is disposed inside the drying processing tank, and the dry steam supplied to the inside of the drying processing tank is used. The substrate is configured to be dried in batches.

In the conventional substrate processing apparatus, the maximum number of substrates constituting a batch that can collectively process the supply state set by the supply time of dry steam supplied to the drying processing tank and the supply amount (supply rate) per unit time. (For example, 50 ml) is fixed and set (for example, 90 seconds at 2.0 ml / sec), so that the maximum number of substrates constituting a batch can be satisfactorily dried.
Japanese Patent Laid-Open No. 11-186212

  However, in the conventional substrate processing apparatus described above, the supply time of dry steam supplied to the drying processing tank and the supply amount per unit time are fixed and set according to the maximum number of substrates constituting a batch that can be batch processed. Therefore, although the maximum number of substrates can be satisfactorily dried, the batch is not necessarily composed of the maximum number of substrates, and it is possible to dry a substrate less than the maximum number of substrates. When the treatment is performed, the amount of dry vapor per substrate increases, and the amount of particles adhering to the surface of the substrate increases due to the adsorption of excessive dry vapor, which may cause poor drying. It was.

  In addition, when a batch is not configured with the maximum number of substrates, an insufficient number of dummy substrates is added, and the batch is always configured with the maximum number of substrates and dried to prevent the occurrence of dry defects. In this case, however, there is a problem in that the dry steam is wasted to the dummy substrate, and the running cost of the drying process increases.

  Accordingly, in the present invention according to claim 1, a batch composed of substrates to be collectively processed is disposed in a drying processing tank, and a drying steam is supplied into the drying processing tank to dry the substrates for each batch. In the processing apparatus, the supply state of the dry steam to the dry processing tank is changed according to the configuration state of the substrates constituting the batch.

  Also, in the present invention according to claim 2, in the present invention according to claim 1, the number of substrates included in the batch is used as the configuration state of the substrates constituting the batch.

  Moreover, in this invention which concerns on Claim 3, in this invention which concerns on the said Claim 1, whether the board | substrate which should adjoin the board | substrate which comprises the said batch is insufficient as a structure state of the board | substrate which comprises the said batch. Decided to use.

  Moreover, in this invention which concerns on Claim 4, in this invention which concerns on any one of the said Claims 1-3, dry steam is supplied to the said drying treatment tank as a supply state of the drying steam to the said drying treatment tank We decided to use the supply per unit time.

  Moreover, in this invention which concerns on Claim 5, in this invention which concerns on any one of the said Claims 1-3, dry steam is supplied to the said drying treatment tank as a supply state of the drying steam to the said drying treatment tank It was decided to use the supply time.

  Further, in the present invention according to claim 6, in the present invention according to any one of the above claims 1 to 5, when there is a shortage of substrates that should be adjacent to the surface side of the substrate constituting the batch, A batch knitting means for knitting a batch by arranging dummy substrates at insufficient positions is provided.

  Further, in the present invention according to claim 7, in the present invention according to any one of claims 1 to 6, when the substrate to be adjacent to the back side of the substrate constituting the batch is insufficient, A batch knitting means for knitting a batch by arranging dummy substrates at insufficient positions is provided.

  Moreover, in this invention which concerns on Claim 8, in this invention which concerns on any one of said Claims 1-7, when the partial shortage arises in the board | substrate which comprises the said batch, the board | substrate which comprises the said batch Therefore, it was decided to have a batch knitting means for knitting a batch by solving the partial shortage occurring in the process.

  Moreover, in this invention which concerns on Claim 9, in the substrate processing method which performs a dry process for every batch comprised with the board | substrate comprised with the board | substrate processed collectively using the dry vapor | steam supplied into the inside of the drying process tank, The structure of the board | substrate which comprises the said batch According to the state, the supply state of the dry steam to the drying treatment tank was changed.

  Further, in the present invention according to claim 10, in the present invention according to claim 9, the number of substrates included in the batch is used as the configuration state of the substrates constituting the batch.

  Moreover, in this invention which concerns on Claim 11, in this invention which concerns on the said Claim 9, whether the board | substrate which should adjoin the board | substrate which comprises the said batch is insufficient as a structure state of the board | substrate which comprises the said batch. Decided to use.

  Further, in the present invention according to claim 12, in the present invention according to any one of claims 9 to 11, dry steam is supplied to the drying treatment tank as a supply state of the drying steam to the drying treatment tank. We decided to use the supply per unit time.

  Further, in the present invention according to claim 13, in the present invention according to any one of claims 9 to 11, dry steam is supplied to the drying treatment tank as a supply state of the drying steam to the drying treatment tank. It was decided to use the supply time.

  Further, in the present invention according to claim 14, in the present invention according to any one of claims 9 to 13, when the substrate to be adjacent to the surface side of the substrate constituting the batch is insufficient, We decided to organize the batch by placing dummy substrates at the shortage.

  Further, in the present invention according to claim 15, in the present invention according to any one of claims 9 to 14, when a substrate to be adjacent to the back side of the substrate constituting the batch is insufficient, We decided to organize the batch by placing dummy substrates at the shortage.

  Further, in the present invention according to claim 16, in the present invention according to any one of claims 9 to 15, the substrate constituting the batch when the substrate constituting the batch is partially deficient. It was decided to organize the batch by eliminating the partial shortage that occurred.

  Moreover, in this invention which concerns on Claim 17, in the board | substrate processing program which dry-processes for every batch comprised with the board | substrate comprised with the board | substrate processed collectively using the dry vapor | steam supplied inside the drying processing tank, the structure of the board | substrate which comprises the said batch According to the state, it was decided to have a step of changing the supply state of the dry steam to the drying treatment tank.

  Further, in the present invention according to claim 18, in the present invention according to claim 17, the number of substrates included in the batch is used as the configuration state of the substrates constituting the batch.

  Further, in the present invention according to claim 19, in the present invention according to claim 17, whether or not a substrate to be adjacent to the substrate constituting the batch is insufficient as the configuration state of the substrate constituting the batch. Decided to use.

  Further, in the present invention according to claim 20, in the present invention according to any one of claims 17 to 19, dry steam is supplied to the drying treatment tank as a supply state of the drying steam to the drying treatment tank. We decided to use the supply per unit time.

  Further, in the present invention according to claim 21, in the present invention according to any one of claims 17 to 19, dry steam is supplied to the drying treatment tank as a supply state of the drying steam to the drying treatment tank. It was decided to use the supply time.

  Further, in the present invention according to claim 22, in the present invention according to any of claims 17 to 21, when there is a shortage of substrates to be adjacent to the surface side of the substrate constituting the batch, It was decided to have a step of knitting a batch by disposing dummy substrates at positions that are insufficient.

  Further, in the present invention according to claim 23, in the present invention according to any one of claims 17 to 22, when the substrate to be adjacent to the back side of the substrate constituting the batch is insufficient, It was decided to have a step of knitting a batch by disposing dummy substrates at positions that are insufficient.

  Further, in the present invention according to claim 24, in the present invention according to any one of claims 17 to 23, when a partial shortage occurs in the substrate constituting the batch, the substrate constituting the batch. It was decided to have a step of organizing the batch by solving the partial shortage occurring in the process.

  And in this invention, there exists an effect described below.

  That is, in the present invention, since the supply state of the dry steam to the drying treatment tank is changed according to the configuration state of the substrates constituting the batch, the number of substrates constituting the batch and the substrates constituting the batch By changing the supply time (supply rate) per unit time and the supply time of dry steam according to the composition state of the batch determined by whether there is a shortage of substrates that should be adjacent to the front side or back side Thus, it is possible to perform a drying process suitable for the configuration state, and it is possible to prevent the occurrence of poor drying.

  In particular, when the number of substrates included in the batch is used as the configuration state of the substrates constituting the batch, the drying process is performed in a state suitable for the number of substrates even if the batch is not configured with the maximum number of substrates. And the occurrence of poor drying can be prevented.

  In addition, when the configuration state of the substrate constituting the batch is used as to whether or not the substrate to be adjacent to the substrate constituting the batch is insufficient, the occurrence of poor drying of the substrate, which is important in circuit formation or the like, is generated. In particular, it can be prevented.

  Moreover, when the supply amount per unit time for supplying the drying steam to the drying processing tank is used as the supply state of the drying steam to the drying processing tank, waste of the drying steam that does not contribute to the drying process can be prevented, and the drying process can be prevented. The running cost for processing can be reduced.

  In addition, when the supply time for supplying the drying steam to the drying processing tank is used as the supply state of the drying steam to the drying processing tank, the processing time required for the drying process can be shortened, and the substrate processing throughput can be reduced. Can be improved.

  In addition, when there are not enough substrates to be adjacent to the surface side of the substrate constituting the batch, when the batch is knitted by arranging dummy substrates at the insufficient positions, the work time required for the dummy substrate placement and It is possible to reduce the number of dummy substrates used, reduce the consumption of dry steam to the dummy substrates, and prevent the occurrence of poor drying on the surface side of the substrate, which is important for circuit formation etc. can do.

  In addition, when there is a shortage of substrates to be adjacent to the back side of the substrates constituting the batch, when the batch is knitted by arranging dummy substrates in the insufficient positions, the work time required for the dummy substrate placement and The number of dummy substrates used can be reduced, the consumption of dry steam to the dummy substrate can be reduced, and the amount of dry steam supplied to the back side of the substrate is increased. The occurrence of poor drying on the surface side can be particularly prevented.

  In addition, when a partial shortage occurs in the substrates constituting the batch, when the batch is knitted by eliminating the partial shortage occurring in the substrates constituting the batch, the front side and the back side of the substrate are Both can be satisfactorily dried and the occurrence of poor drying due to partial shortage of the substrate can be prevented.

  Hereinafter, a specific configuration of the substrate processing apparatus according to the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the substrate processing apparatus 1 includes a carrier loading / unloading unit 4 that loads and unloads a carrier 3 that stores a plurality of wafers 2 (substrates), and a wafer 2 that is stored in a plurality of carriers 3. A batch knitting unit 6) for knitting batches 5 to be batch-processed by combining them, and a substrate processing unit 7 for cleaning and drying the wafers 2 for each batch 5 are configured. Here, the carrier loading / unloading unit 4, the batch knitting unit 6, and the substrate processing unit 7 constituting the substrate processing apparatus 1 are unitized, and a plurality of types of carrier loading / unloading unit 4, batch knitting unit 6, substrate processing The substrate processing apparatus 1 can be configured by combining the units 7. Therefore, the batch knitting unit 6 functions as a batch knitting means by itself.

  The carrier loading / unloading unit 4 forms a sealed opening / closing door 9 on a carrier stage 8 on which the carrier 3 is placed, and a carrier transfer mechanism 10 is disposed inside the opening / closing door 9. The carrier 3 placed on the stage 8 is temporarily stored in the carrier stock 11 as needed, and is carried into the carrier placement table 12.

  The carrier loading / unloading unit 4 requires the carrier 3 mounted on the carrier mounting table 12, contrary to the above loading, for the carrier 3 containing the wafer 2 processed by the substrate processing unit 7. Accordingly, the carrier is temporarily stored in the carrier stock 11 by the carrier transport mechanism 10 and is transported to the carrier stage 8.

  The batch knitting unit 6 forms a hermetic opening / closing door 13 with the carrier loading / unloading unit 4, and a substrate for simultaneously transferring a plurality of wafers 2 accommodated in the carrier 3 inside the opening / closing door 13. The transfer mechanism 14, the batch forming mechanism 15 for forming the batch 5 by changing the arrangement interval of the wafers 2 transferred by the substrate transfer mechanism 14 in half, and the arrangement of the wafers 2 transferred by the substrate transfer mechanism 14 A batch for transferring the batch 5 formed by the arrangement order changing mechanism 16 for changing the order and the batch forming mechanism 15 between the batch knitting unit 6 and the substrate processing unit 7 and transporting the inside of the substrate processing unit 7 A transport mechanism 17 is provided. The batch knitting unit 6 includes a wafer accommodation state detection sensor 18 for detecting the accommodation state of the wafer 2 accommodated in the carrier 3 and a notch for adjusting the positions of the notches of the plurality of wafers 2 accommodated in the carrier 3. An aligner 19 is provided. The specific structure of the batch knitting unit 6 will be described in detail later.

  The substrate processing unit 7 includes a cleaning / drying mechanism 20 that cleans and dries the wafer 2 and a cleaning mechanism 21 that cleans the wafer 2, and the cleaning / drying mechanism 20 moves the batch 5 up and down by an elevating mechanism 22. The cleaning / drying tank 23 for cleaning and drying and the cleaning tank 24 for cleaning the batch transport mechanism 17 are arranged in parallel, and the cleaning mechanism 21 includes first to first chemical treatments of the batch 5. The first to third pure water tanks 28, 29, 30 for treating the third chemical liquid tanks 25, 26, 27 and the batch 5 with pure water, the first to third chemical liquid tanks 25, 26, 27, and the first First to third transfer devices 31, 32, and 33 for transferring the batch 5 between the third pure water tanks 28, 29, and 30 are disposed. The specific structure of the cleaning / drying mechanism 20 will be described in detail later.

  Further, the substrate processing unit 7 is provided with a batch transport mechanism 17 along the cleaning / drying mechanism 20 and the cleaning mechanism 21, and a start end portion of the batch transport mechanism 17 is provided in the batch knitting unit 6.

  Then, the substrate processing unit 7 uses the batch conveying mechanism 17 to move the batch 5 knitted by the batch knitting unit 6 to the lifting / lowering mechanism 22 of the cleaning / drying mechanism 20 and the first to third conveying devices 31, 32, 33 of the cleaning mechanism 21. The cleaning / drying mechanism 20 and the cleaning mechanism 21 process the wafer 2 for each batch 5, and then the processed batch 5 is moved up and down by the cleaning / drying mechanism 20 and the first to first mechanisms of the cleaning mechanism 21. The batch transport mechanism 17 transfers the batch 5 after processing to the batch knitting unit 6 from the third transport devices 31, 32, 33.

  As described above, the substrate processing apparatus 1 carries the wafer 2 together with the carrier 3 into the batch knitting unit 6 by the carrier carry-in / out unit 4, and forms the batch 5 to be batch processed by the substrate processing unit 7 in the batch knitting unit 6. Delivered to the processing unit 7, the substrate processing unit 7 performs batch processing for each batch 5, and then delivers the processed batch 5 to the batch knitting unit 6, and the batch knitting unit 6 forms the wafers 2 constituting the batch 5. It is accommodated in the carrier 3 and conveyed to the carrier loading / unloading unit 4, and the carrier 3 containing the processed wafer 2 is unloaded by the carrier loading / unloading unit 4.

  The substrate processing apparatus 1 includes a plurality of (for example, 25) wafers 2 accommodated in a plurality of (for example, two) carriers 3 that are loaded from the carrier loading / unloading section 4 in the batch knitting unit 6. Are combined to form a batch 5 composed of a plurality of (for example, 50) wafers 2 that are collectively processed by the substrate processing unit 7.

  A specific structure of the batch knitting unit 6 (batch knitting means) will be described below.

  As shown in FIGS. 2 and 3, the batch knitting unit 6 is provided with an opening / closing door 13 on the front left side of the box-shaped batch knitting chamber 34, and a wafer accommodation state detection on the inner left side of the opening / closing door 13. A sensor 18 is provided. The wafer accommodation state detection sensor 18 detects the position and number of wafers 2 actually accommodated in the carrier 3 and whether the wafer 2 is accommodated in a normal state (horizontal state). 2 to detect the accommodation state of the wafer 2 by receiving the reflected light from the wafer 2.

  Further, the batch knitting unit 6 has a mounting table 35 disposed substantially in the center of the batch knitting chamber 34, a notch aligner 19 disposed on the upper left side of the mounting table 35, and a substrate on the upper right side of the mounting table 35. The transport mechanism 14 is disposed, the batch forming mechanism 15 and the start end of the batch transport mechanism 17 are disposed on the right side of the batch knitting chamber 34, and the arrangement order changing mechanism 16 is disposed at the rear of the batch knitting chamber 34. It is arranged up and down.

  As described above, the batch knitting unit 6 has the substrate transport mechanism 14 disposed in the center of the batch knitting chamber 34 and the batch forming mechanism 15 disposed on the right side of the substrate transport mechanism 14. An arrangement order changing mechanism 16 is disposed in the middle of the transfer path for transferring the wafer 2 to the substrate 15 by the substrate transfer mechanism 14.

  Below, the concrete structure of the board | substrate conveyance mechanism 14, the batch formation mechanism 15, and the arrangement | sequence order change mechanism 16 which comprise the batch organization part 6 is demonstrated.

  First, the structure of the substrate transport mechanism 14 will be described. As shown in FIGS. 4 and 5, the substrate transport mechanism 14 is attached to a multi-axis robot 36 (here, a 5-axis robot) installed on the mounting table 35. A wafer holder 37 is attached.

  The multi-axis robot 36 is attached to a base 38 fixed to the mounting table 35 via a first rotation shaft so as to be rotatable left and right, and to the rotation table 39 via a second rotation shaft. A base end portion of the first lifting arm 40 is attached so as to be pivotable up and down, and a base end portion of the second lifting arm 41 is turned up and down via a third pivot shaft at a tip portion of the first lifting arm 40. A base end portion of the third elevating arm 42 is attached to a distal end portion of the second elevating arm 41 via a fourth rotation shaft so as to be rotatable up and down. A proximal end portion of the rotation arm 43 is attached to the distal end portion via a fifth rotation shaft so as to be rotatable left and right, and a wafer holder 37 is attached to the distal end portion of the rotation arm 43.

  As shown in FIGS. 6 and 7, the wafer holder 37 has 25 fork-shaped wafer holding plates 45 vertically spaced at a predetermined interval in the front opening of the casing 44 connected to the tip of the rotating arm 43. A pair of left and right locking pieces 46 and 47 for locking the wafer 2 are mounted on the front and back sides of the wafer holding plate 45 and the wafer 2 is locked to the front end of the wafer holding plate 45. A pair of left and right locking pieces 48, 49 are attached to the front and back. Note that the vertical interval of the wafer holding plates 45 is the same as the arrangement interval of the wafers 2 accommodated in the carrier 3.

  Further, the wafer holder 37 has a cylinder 50 attached to the inside of the casing 44, and a central portion on the back side of the movable body 52 that is vertically extended is attached to the tip of the rod 51 of the cylinder 50. In addition, 25 movable plates 53 are attached vertically with a predetermined interval, and a locking piece 54 for locking the wafer 2 is attached to the front and back of the movable plate 53 at the front end.

  The wafer holder 37 is configured to drive the cylinder 50 on the side surface of the wafer 2 by driving the cylinder 50 in a state where the wafer 2 is locked by the locking pieces 46, 47, 48, 49 attached to the wafer holding plate 45. The wafer 2 can be held by the wafer holding plate 45 by moving forward. The wafer holder 37 is configured so that the locking pieces 46, 47, 48, 49, 54 are attached to the front and back of each wafer holding plate 45 so that the wafer 2 can be held on the front and back of each wafer holding plate 45. . Therefore, the unprocessed wafer 2 that has not been processed in the substrate processing unit 7 is held on the front surface side of the wafer holding plate 45, while the processed wafer 2 that has been processed in the substrate processing unit 7 is processed as a wafer. Contaminants adhering to the unprocessed wafer 2 are reattached to the processed wafer 2 through the locking pieces 46, 47, 48, 49, 54 so as to be held on the back side of the holding plate 45. Can be prevented.

  In the substrate transfer mechanism 14, the multi-axis robot 36 appropriately changes the posture of the wafer holder 37 to take out the unprocessed wafer 2 from the carrier 3, and the wafer 2 accommodated in the carrier 3 is transferred to the batch forming mechanism 15. In addition, the wafer 2 is transferred to an arbitrary position of the arrangement order changing mechanism 16, and the attitude of the wafer 2 is changed from the horizontal attitude stored in the carrier 3 to the vertical attitude in the middle of the transfer. The processed wafer 2 is transferred from the order change mechanism 16 to the carrier 3, and the posture of the wafer 2 is changed from the vertical posture to the horizontal posture during the transfer.

  Here, since the substrate transport mechanism 14 transports the wafer 2 accommodated in the carrier 3 by the multi-axis robot 36 to any position of the batch forming mechanism 15 and the arrangement order changing mechanism 16, for example, knitting When there is a margin in the number of batches 5 to be processed (when one batch 5 is knitted with 40 wafers 2), the batches are shifted so that the wafers 2 are concentrated on the central portion on the batch forming mechanism 15. Place the wafer 2 on the forming mechanism 15 or remove the wafer 2 from the arrangement order changing mechanism 16 in advance and place it on the batch forming mechanism 15 so that the wafer 2 is concentrated on the central portion of the batch forming mechanism 15. Can do. As described above, when there is a margin in the number of batches 5 to be knitted, the wafers 2 are transferred to the batch forming mechanism 15 by the substrate transfer mechanism 14 so that the wafers 2 are concentrated on the central portion on the batch forming mechanism 15. Thus, even when the number of wafers 2 to be processed at a time is small, the wafers 2 can be arranged substantially symmetrically from the center of the batch 5, and process characteristics such as cleaning and drying in subsequent processing at the substrate processing unit 7. Can be improved.

  Next, the structure of the batch forming mechanism 15 will be described. As shown in FIGS. 8 and 9, the batch forming mechanism 15 has a base 55 disposed on the right side of the batch knitting chamber 34, and is moved up and down on the base 55. A table 56 is attached so as to be movable up and down, a pair of left and right support arms 57 and 58 are attached to the upper end of the elevator table 56, and wafer holding tables 59 and 60 are attached to the support arms 57 and 58, respectively.

  In each of the wafer holding stands 59, 60, holding grooves 61, 62 for holding 50 wafers 2 in a horizontal state are formed at intervals in the front-rear direction. The interval between the holding grooves 61 and 62 is set to be half the arrangement interval of the wafers 2 accommodated in the carrier 3.

  The batch forming mechanism 15 then places the wafer 2 on the first time and the position on which the wafer 2 is placed on the second time when the substrate 2 is placed on the wafer holders 59 and 60 by the substrate transport mechanism 14. Thus, the wafer holders 59, 60 are shifted at half the interval between the wafers 2 accommodated in the carrier 3 and placed on the wafer holders 59, 60 so that the wafers 2 are accommodated at half intervals of the wafers 2 accommodated in the carrier 3. The wafer 2 is placed on the wafer 2, thereby changing the arrangement interval of the wafers 2 in half. The wafer holders 59 and 60 are configured to be extendable and configured to change the arrangement interval of the wafers 2 by shortening the wafer holders 59 and 60 after the wafer 2 is placed by the substrate transfer mechanism 14. May be.

  Further, the batch forming mechanism 15 is configured such that the three wafer holding chucks 63 of the batch transfer mechanism 17 can be inserted between the left and right wafer holding stands 59, 60. The batch 5 composed of a plurality of wafers 2 can be delivered between the wafer holding tables 59 and 60 and the wafer holding chuck 63 of the batch transfer mechanism 17.

  Next, the structure of the arrangement order changing mechanism 16 will be described. As shown in FIGS. 10 to 12, the arrangement order changing mechanism 16 has a base 64 extended left and right behind the batch knitting chamber 34. Support plates 65, 66 are attached to the left and right ends of the base 64, and wafer supports 67, 68, 69 are installed between the left and right support plates 65, 66. In each of the wafer supports 67, 68, 69, a holding groove 70 for holding the wafer 2 in a vertical state is formed on the peripheral surface with a gap left and right. The interval between the holding grooves 70 is the same as the arrangement interval of the wafers 2 accommodated in the carrier 3.

  In addition, the arrangement sequence changing mechanism 16 is attached to the upper part of the base 64 so that the movable base 71 can be moved to the left and right, the support 72 is attached to the upper part of the mobile base 71, and the lift 73 is attached to the support 72 so that it can be raised and lowered Further, a wafer holder 74 is attached to the front side portion of the lifting platform 73, and a locking piece 75 for locking the wafer 2 is attached to the front and back of the wafer holder 74, and the base end portion of the wafer holder 74 is attached. A pair of upper and lower locking pieces 76, 77 that can be moved back and forth in the front-rear direction are attached to the front and back sides.

  Then, the arrangement order changing mechanism 16 holds the wafers 2 transferred to the wafer supports 67, 68, 69 by the substrate transfer mechanism 14 one by one by the locking pieces 75, 76, 77 of the wafer holding plate 74, and moves up and down. By moving the table 73 up and down and moving the moving table 71, the wafers 2 can be moved one by one, and the arrangement order of the wafers 2 can be changed.

  Further, in the arrangement order changing mechanism 16, a plurality of dummy substrates having the same shape as the wafer 2 are placed in advance on the wafer supports 67, 68, and 69, and the dummy holding substrates one by one as needed. It is held by the locking pieces 75, 76, 77 of 74, and the elevator 73 is moved up and down and the moving table 71 is moved so that it can be moved next to the wafer 2. Thereby, the batch 5 can be knitted using the wafer 2 and the dummy substrate accommodated in the carrier 3.

  As shown in FIG. 13, the substrate transport mechanism 14, the batch forming mechanism 15, the arrangement order changing mechanism 16, and the batch transport mechanism 17 constituting the batch knitting apparatus disposed in the batch knitting unit 6 described above are controlled by a control unit 78. The drive is controlled by. The control unit 78 includes a controller 79 composed of a CPU and a storage medium 80 connected to the controller 79. The control unit 78 controls not only the batch knitting unit 6, but also the carrier loading / unloading unit 4 and the substrate processing unit 7. Also configured to do. The controller 78 can be communicably connected to a host computer provided separately from the substrate processing apparatus 1. The storage medium 80 stores various setting data and a substrate processing program 81 to be described later, and may be a memory such as a ROM or a RAM, or may be a disk-shaped storage medium such as a hard disk or a CD-ROM.

  The control unit 78 controls driving of the batch knitting unit 6, the carry-in / out unit 4, and the substrate processing unit 7 in accordance with the substrate processing program 81 stored in the storage medium 80. The substrate processing program 81 mainly includes a batch knitting subroutine 82 for driving and controlling the batch knitting unit 6, and a cleaning subroutine 83 and a drying subroutine 84 for driving and controlling the substrate processing unit 7.

  Then, the control unit 78 drives and controls the substrate transport mechanism 14, the batch forming mechanism 15, the arrangement order changing mechanism 16, and the batch transport mechanism 17 according to the batch knitting subroutine 82, and is accommodated in the plurality of carriers 3 in the batch knitting unit 6. By combining a plurality of wafers 2, a batch 5 for batch processing by the substrate processing unit 7 is knitted.

  Hereinafter, a case where the batch 5 is knitted from the two carriers 3 by the batch knitting subroutine 82 will be described as an example.

  In the batch knitting subroutine 82, as shown in FIG. 14, first, the wafer 2 is loaded from the first carrier 3 (first wafer loading step S1).

  In the first wafer loading step S1, after the first carrier 3 is placed on the carrier loading table 12 in the carrier loading / unloading section 4, the open / close door 13 is opened, and the wafer 2 is accommodated by the wafer accommodation state detection sensor 18. After detecting the state, the posture of the wafer holder 37 is changed by the multi-axis robot 36 of the substrate transfer mechanism 14, the wafer 2 accommodated in the carrier 3 is taken out by the wafer holding plate 45 of the wafer holder 37, and the door is opened 13 is closed, and the position of the notch of the wafer 2 is adjusted by the notch aligner 19.

  Next, the batch organization subroutine 82 determines whether to transfer the wafer 2 directly to the batch forming mechanism 15 or once to transfer the wafer 2 to the arrangement order changing mechanism 16 based on the detection result of the wafer accommodation state detection sensor 18. (First transport path determination step S2).

  In this first transfer path determination step S2, it is detected by the wafer accommodation state detection sensor 18 whether or not a partial deficiency (missing) has occurred in the wafer 2 accommodated in the first carrier 3. If there is no shortage, it is determined that the wafer 2 is directly transferred to the batch forming mechanism 15. On the other hand, if there is a partial shortage, it is determined that the wafer 2 is once transferred to the arrangement order changing mechanism 16. To do.

  In the first transfer path determination step S2, when it is determined that the wafer 2 is directly transferred to the batch forming mechanism 15, the attitude of the wafer 2 is changed from the horizontal position to the vertical position by the substrate transfer mechanism 14 (first position). Then, the wafer 2 is placed in odd-numbered holding grooves 61, 62 formed on the wafer holding bases 59, 60 of the batch forming mechanism 15 (first wafer placement step S4). Thereafter, the batch knitting subroutine 82 executes a second wafer carry-in step S6 described later.

  On the other hand, if it is determined in the first transfer path determination step S2 that the wafer 2 is once transferred to the arrangement order change mechanism 16, the substrate transfer mechanism 14 causes the left side of the wafer supports 67, 68, 69 of the arrangement order change mechanism 16 to be left. The wafer 2 is transferred to the holding groove 70 formed in the part (first wafer transfer step S5).

  Next, the batch knitting subroutine 82 carries the wafer 2 from the second carrier 3 (second wafer carry-in step S6).

  In the second wafer carry-in step S6, as in the first wafer carry-in step S1, after the second carrier 3 is placed on the carrier placing table 12 in the carrier carry-in / out section 4, the open / close door 13 is opened to open the wafer. The accommodation state detection sensor 18 detects the accommodation state of the wafer 2, and then the posture of the wafer holder 37 is changed by the multi-axis robot 36 of the substrate transfer mechanism 14, and the carrier 3 is attached to the carrier 3 by the wafer holding plate 45 of the wafer holder 37. The accommodated wafer 2 is taken out, the door 13 is closed, and the position of the notch of the wafer 2 is adjusted by the notch aligner 19.

  Next, the batch organization subroutine 82 determines whether to transfer the wafer 2 directly to the batch forming mechanism 15 or once to transfer the wafer 2 to the arrangement order changing mechanism 16 based on the detection result of the wafer accommodation state detection sensor 18. (Second transport path determination step S7).

  In this second transfer path determination step S7, it is detected by the wafer containing state detection sensor 18 whether or not a partial deficiency (missing) has occurred in the wafer 2 accommodated in the second carrier 3. If there is no shortage, it is determined that the wafer 2 is directly transferred to the batch forming mechanism 15. On the other hand, if there is a partial shortage, it is determined that the wafer 2 is once transferred to the arrangement order changing mechanism 16. To do.

  In the second transfer path determination step S7, when it is determined that the wafer 2 is directly transferred to the batch forming mechanism 15, the substrate transfer mechanism 14 changes the posture of the wafer 2 from the horizontal posture to the vertical posture (first step). 2 wafer posture changing step S8), the front and back of the wafer 2 are reversed (wafer front and back reversing step S9), and then the wafer 2 is inserted into the even-numbered holding grooves 61 and 62 formed on the wafer holding bases 59 and 60 of the batch forming mechanism 15. Is placed (second wafer placement step S10).

  Here, in the batch knitting subroutine 82, the wafer 2 accommodated in the first carrier 3 and the second carrier are reversed by reversing the front and back of the wafer 2 accommodated in the second carrier 3 in the wafer front / back reversing step S9. The front and back surfaces of the wafer 2 accommodated in the wafer 3 face each other so as to prevent the reattachment of contaminants. Depending on the processing conditions in the substrate processing unit 7, the wafer front / back reversing step S9 may not be executed.

  On the other hand, if it is determined in the second transfer path determination step S7 that the wafer 2 is once transferred to the arrangement order changing mechanism 16, the substrate transfer mechanism 14 causes the right side of the wafer supports 67, 68, 69 of the arrangement order changing mechanism 16. The wafer 2 is transferred to the holding groove 70 formed in the part (second wafer transfer step S11).

  Next, the batch knitting subroutine 82 determines whether or not to transfer the wafer 2 to the arrangement order changing mechanism 16 in either the first transfer path determination step S2 or the second transfer path determination step S7 (transfer determination step S12). In the case of transfer, the arrangement order changing mechanism 16 is driven to change the arrangement order of the wafers 2 (arrangement order changing step S13). On the other hand, if not transferred, the arrangement order changing step S13 is executed. Without performing this, a batch forming step S23 described later is executed.

  In the arrangement order changing step S13, the arrangement order changing mechanism 16 is used to place the wafer 2 positioned at either the left or right end in the part where the partial shortage of the wafer 2 occurs based on the detection result of the wafer accommodation state detection sensor 18. By using it and moving it, a partial deficiency occurring in the wafer 2 accommodated in the carrier 3 is resolved. For example, when the fifth wafer 2 from the right among the wafers 2 accommodated in the carrier 3 is insufficient, the wafer 2 located on the rightmost side is moved to the fifth position from the right, and the fifth wafer 2 from the right is moved. The shortage of the wafer 2 which has occurred second is solved.

  Further, in the arrangement order changing step S13, when the partial shortage of the wafer 2 cannot be completely solved only by the movement of the wafer 2 accommodated in the first carrier 3 or the second carrier 3, the first or second is changed. The portion generated in the wafer 2 accommodated in the carrier 3 by moving the wafer 2 accommodated in the second carrier 3 to the insufficient portion occurring in the wafer 2 accommodated in the second or first carrier 3. To solve this shortage.

  Further, in the arrangement order changing step S13, when the wafer 2 accommodated in the first carrier 3 or the second carrier 3 is partially insufficient, or the first carrier 3 and the second carrier 3 When the partial deficiency of the wafer 2 cannot be completely eliminated only by moving the wafer 2 accommodated in the wafer 2, the wafer 2 accommodated in the carrier 3 is moved by moving the dummy substrate using the arrangement order changing mechanism 16. It is also possible to eliminate the partial shortage that has occurred.

  Furthermore, in the arrangement order changing step S13, when the wafers 2 to be adjacent to the front surface side or the back surface side of the wafers 2 constituting the batch 5 to be knitted are insufficient, the dummy substrate may be moved only to the shortage position. it can.

  Thereafter, the batch knitting subroutine 82 determines whether or not the wafer 2 accommodated in the first carrier 3 has been transferred to the arrangement order changing mechanism 16 (first transfer determination step S14). The wafer 2 held in the holding groove 70 formed on the left side of the wafer supports 67, 68, 69 of the order changing mechanism 16 is held by the wafer holder 37 of the substrate transfer mechanism 14 (first wafer holding step S15). Thereafter, the posture of the wafer 2 is changed from the horizontal posture to the vertical posture by the substrate transfer mechanism 14 (first wafer posture changing step S16), and the odd-numbered holding formed on the wafer holders 59 and 60 of the batch forming mechanism 15 is performed. The wafer 2 is placed in the grooves 61 and 62 (first wafer placement step S17).

  Further, the batch knitting subroutine 82 determines whether or not the wafer 2 accommodated in the second carrier 3 has been transferred to the arrangement order changing mechanism 16 (second transfer determination step S18). The wafer 2 held in the holding groove 70 formed on the right side of the wafer supports 67, 68, 69 of the order changing mechanism 16 is held by the wafer holder 37 of the substrate transfer mechanism 14 (second wafer holding step S19). Then, the posture of the wafer 2 is changed from the horizontal posture to the vertical posture by the substrate transfer mechanism 14 (second wafer posture changing step S20), the front and back of the wafer 2 are reversed (wafer front and back reversing step S21), and then The wafer 2 is placed in the even-numbered holding grooves 61, 62 formed on the wafer holding bases 59, 60 of the batch forming mechanism 15 (second wafer placement step S22).

  Finally, the batch knitting subroutine 82 forms the batch 5 in the batch forming mechanism 15 (batch forming step S23), and transfers the formed batch 5 from the batch forming mechanism 15 to the batch transport mechanism 17 (batch delivery step S24).

  Note that in the batch knitting subroutine 82, the first wafer placement steps S4 and S17, the first wafer transfer step S5, the second wafer placement steps S10 and S22, and the second wafer transfer step S11 are multiaxial. By simply changing the posture of the wafer holder 37 by the robot 36, the wafer 2 is transferred to any position on the wafer holders 59, 60 of the batch forming mechanism 15 and the wafer supports 67, 68, 69 of the arrangement order changing mechanism 16. You can do that.

  In the batch knitting subroutine 82, the wafer 2 is directly transferred to the batch forming mechanism 15 based on the detection result of the wafer accommodation state detection sensor 18 in the first transfer path determination step S2 and the second transfer path determination step S7. Although it is determined whether the wafer 2 is once transferred to the arrangement order changing mechanism 16, the present invention is not limited to this. Information from the host computer connected to the control unit 78 or information from the operator input to the control unit 78 is used. Based on this, it is possible to grasp the accommodation state of the wafer 2 and determine whether the wafer 2 is directly transferred to the batch forming mechanism 15 or whether the wafer 2 is once transferred to the arrangement order changing mechanism 16. Based on the instructions from the connected host computer and the instructions from the operator input to the control unit 78, the wafers 2 can be batch-shaped regardless of the accommodation state of the wafers 2. Or conveyed directly to the mechanism 15 may be temporarily determines whether to transfer the wafer 2 to the positional relationship changing mechanism 16.

  In the batch knitting subroutine 82, if there is no partial shortage in the wafer 2 accommodated in the carrier 3 in the first transfer path determination step S2 and the second transfer path determination step S7, the wafer 2 is stored. Although it is determined that the wafer is directly transferred to the batch forming mechanism 15, the present invention is not limited to this, and even if there is no partial shortage in the wafer 2 accommodated in the carrier 3, the wafer 2 is arranged in the arrangement order changing mechanism 16. May be once transported. For example, when the number of wafers 2 accommodated in the first carrier 3 and the second carrier 3 is different, the wafers 2 accommodated in both carriers 3 are once transported to the arrangement order changing mechanism 16 and the arrangement order changing mechanism. The arrangement order of the wafers 2 may be changed by 16 and then transferred to the batch forming mechanism 15. As described above, when the number of wafers 2 accommodated in the carrier 3 forming the batch 5 is different, when the wafer 2 is directly conveyed to the batch forming mechanism 15, the wafer 2 is partially formed into the batch 5 formed by the batch forming mechanism 15. Since the shortage will occur, changing the arrangement order of the wafers 2 by the arrangement order changing mechanism 16 may prevent a partial shortage of the wafers 2 from occurring in the batch 5 formed by the batch forming mechanism 15. it can.

  The controller 78 shows the initial state of the wafers 2 accommodated in the carriers 3 and the knitting history indicating how the batch 5 is knitted by the substrate transport mechanism 14, the batch forming mechanism 15, and the arrangement order changing mechanism 16. Is stored in the storage medium 80, and after the processing in the substrate processing section 7, the substrate 2 is transferred so that the wafers 2 constituting the batch 5 are accommodated in the original carrier 3 again based on the stored initial state and knitting history. The mechanism 14, the batch forming mechanism 15, and the arrangement order changing mechanism 16 are controlled. Here, the control unit 78 accommodates the wafer 2 after processing in the substrate processing unit 7 in a carrier 3 different from the carrier 3 before batch organization based on an instruction from the host computer or an instruction from the operator. It can also be controlled.

  Further, the control unit 78 is configured such that the configuration state of the wafers 2 constituting the batch 5 knitted by the batch knitting means 6, that is, the number and position of the wafers 2 constituting the batch 5, and the front side or back side of the wafer 2. The state of the wafer 2 such as whether or not the wafer 2 to be adjacent to it is insufficient is stored in the storage medium 80, and the configuration state can be used for processing in the substrate processing unit 7.

  As described above, in the substrate processing apparatus 1 configured as described above, the substrate transport mechanism 14 that transports a plurality of wafers 2 accommodated in each carrier 3 and the arrangement interval of the wafers 2 transported by the substrate transport mechanism 14. The batch forming mechanism 15 for changing the arrangement of the wafers 2 and the arrangement order changing mechanism 16 for changing the arrangement order of the wafers 2 transferred by the substrate transfer mechanism 14. The batch 5 can be knitted by arbitrarily changing the arrangement order of the wafers 2.

  Therefore, for example, as described above, even if a partial shortage occurs in the plurality of wafers 2 accommodated in each carrier 3, the wafer 2 is changed by changing the arrangement order of the wafers 2 by the arrangement order changing mechanism 16. This eliminates the partial shortage of the wafers 2 constituting the knitted batch 5, and the subsequent batch due to the partial shortage of the wafers 2. Problems such as poor cleaning and poor drying that may occur in the treatment can be prevented in advance.

  In addition, in the substrate processing apparatus 1, since the arrangement order changing mechanism 16 is disposed in the middle of the transfer path for transferring the wafer 2 to the batch forming mechanism 15 by the substrate transfer mechanism 14, the transfer distance of the wafer 2. Thus, the time required for batch knitting can be shortened, and the throughput can be improved.

  Further, in the substrate processing apparatus 1, according to the accommodation state of the wafers 2 accommodated in the carrier 3, whether the plurality of wafers 2 accommodated in the carrier 3 are directly conveyed to the batch forming mechanism 15 by the substrate conveyance mechanism 14. Alternatively, the plurality of wafers 2 accommodated in the carrier 3 are transferred to the arrangement order changing mechanism 16 by the substrate transfer mechanism 14 and then transferred to the batch forming mechanism 15 after changing the arrangement order of the wafers 2. In addition, when there is no need to change the arrangement order of the wafers 2 such as when there is no partial shortage in the plurality of wafers 2 accommodated in the carrier 3, the wafers 2 are directly transferred to the batch forming mechanism 15. Thus, the time required for batch organization can be shortened.

  In the substrate processing apparatus 1, since the wafer 2 accommodated in the carrier 3 is changed in posture from the horizontal posture to the vertical posture while being transferred by the substrate transfer mechanism 14, it is necessary to provide a separate posture changing device. Thus, the apparatus can be simplified, and the labor, time, and cost required for manufacturing the apparatus can be reduced.

  In the substrate processing apparatus 1, a plurality of wafers 2 accommodated in the carrier 3 are transported to any position of the batch forming mechanism 15 or the arrangement order changing mechanism 16 by the substrate transport mechanism 14. Even when the wafer 2 is not accommodated at the end of the carrier 3 and a partial shortage of the wafer 2 occurs, the wafer 2 is shifted when transported to the batch forming mechanism 15 or the arrangement order changing mechanism 16. It is possible to easily solve the partial shortage of the end portion.

  Further, in the substrate processing apparatus 1, the arrangement order of the wafers 2 is changed by the arrangement order changing mechanism 16 so as to eliminate the partial shortage occurring in the plurality of wafers 2 accommodated in each carrier 3. For this reason, partial shortage does not occur in the wafers 2 constituting the organized batch 5, and problems that may occur in subsequent batch processing due to partial shortage of the wafers 2 are obviated. Can be prevented.

  Further, in the substrate processing apparatus 1, partial deficiencies occurring in the plurality of wafers 2 are solved by changing the arrangement order of the wafers 2 accommodated in different carriers 3 by the arrangement order changing mechanism 16. Therefore, even when the arrangement order of the wafers 2 accommodated in one carrier 3 is changed, even if the partial shortage in the entire batch 5 cannot be resolved, it is accommodated in another carrier 3. The partial shortage of the entire batch 5 can be solved by using the wafer 2.

  In the substrate processing apparatus 1, since the multi-axis robot 36 is used as the substrate transport mechanism 14, the arrangement between the carrier 3 and the batch forming mechanism 15 or the arrangement order changing mechanism 16 and the arrangement order changing with the batch forming mechanism 15 are changed. Transfer of the wafer 2 to and from the mechanism 16, change of the posture of the wafer 2 during transfer (from horizontal state to vertical state or from vertical state to horizontal state), any of the batch forming mechanism 15 or the arrangement order changing mechanism 16 Transport to a position can be performed, and batch knitting with a high degree of freedom can be easily realized.

  Next, a specific structure of the cleaning / drying mechanism 20 of the substrate processing unit 7 will be described below.

  As shown in FIGS. 15 to 17, the cleaning / drying mechanism 20 integrally includes a cleaning unit 85 for cleaning the wafers 2 in batches 5 and a drying unit 86 for drying the wafers 2 in batches 5. A substrate support 87 for moving the wafer 2 up and down in batches 5 between the units 85 and 86 is disposed in the cleaning unit 85 and the drying unit 86 so as to be movable up and down. ing.

  First, the specific structure of the substrate support 87 will be described. As shown in FIGS. 16 and 17, the substrate support 87 is extended in the front-rear direction to the front lower end portion of the arm 88 extended in the vertical direction. Four support bodies 89, 90, 91, and 92 are attached in parallel with a space left and right, and connecting bodies 93 and 94 are installed between the ends of the left and right support bodies 89 and 90 (91 and 92). ing.

  In addition, the substrate support 87 has support grooves 95, 96, 97, 98 for supporting the wafer 2 vertically one by one at the upper ends of the supports 89, 90, 91, 92 at a predetermined interval in the front-rear direction. The wafer 2 is supported by the support grooves 95, 96, 97, and 98, so that a plurality of wafers 2 can be supported in parallel at predetermined intervals. In this substrate support 87, the arm 88 is linked to the lifting mechanism 22, and the lifting mechanism 22 can lift and lower the wafer 2 together with the batch 5 between the cleaning unit 85 and the drying unit 86. Yes. A controller 78 is connected to the elevating mechanism 22, and the elevating mechanism 22 is driven and controlled by the controller 78.

  In addition, the substrate support 87 is approximately on the front surface of the arm 88, that is, the surface facing the wafer 2 closest to the arm 88 among the plurality of wafers 2 supported by the supports 89, 90, 91, 92. A semi-disc-shaped shield 99 is detachably attached by a pair of upper and lower connectors 100 and 101.

  Accordingly, the substrate support 87 forms a shielding surface 102 that faces the wafer 2 and covers the surface of the wafer 2 between the arm 88 and the wafer 2. The shielding surface 102 is formed in substantially the same shape as the surface of the wafer 2 by the lower end front surface 103 of the arm 88 and the front surface 104 of the shielding body 99. The shielding surface 102 shields the processing agent from flowing from the left and right sides of the arm 88 toward the surface of the wafer 2 closest to the arm 88, and the processing agent on the surface of the wafer 2 closest to the arm 88. Has a function to make the flow state of the same as that of the other wafers 2.

  Next, the specific structure of the cleaning unit 85 will be described. The cleaning unit 85 supplies a cleaning liquid for injecting and supplying the cleaning liquid to the left and right side walls 106 and 107 of the bottomed rectangular box-shaped cleaning processing tank 105 having an upper end opened. The nozzles 108 and 109 are installed, a drain pipe 111 is connected to the bottom wall 110, an open / close valve 112 is provided in the middle of the drain pipe 111, and an annular overflow tank is provided at the upper outer portion of the cleaning tank 105. 113 is attached, a drain pipe 115 is connected to the bottom wall 114 of the overflow tank 113, and an open / close valve 116 is provided in the middle of the drain pipe 115.

  Here, to the cleaning liquid supply nozzles 108 and 109, a pure water supply source 117 for supplying pure water and a chemical liquid supply source 118 for supplying chemical liquid are connected via a three-way cock 119. Is switched so that pure water or chemical liquid can be supplied into the cleaning treatment tank 105 from the cleaning liquid supply nozzles 108 and 109. Further, a controller 78 is connected to the on-off valves 112 and 116 and the three-way cock 119, and the on-off valves 112 and 116 and the three-way cock 119 are driven and controlled by the controller 78.

  Next, the specific structure of the drying unit 86 will be described. In the drying unit 86, a shutter mechanism 121 is disposed below a substantially box-shaped drying processing tank 120 having an open lower end. The shutter mechanism 121 has a shutter accommodating portion 123 formed on the left side portion of the casing 122, and a shutter 124 is accommodated in the shutter accommodating portion 123 so as to be freely opened and closed.

  Here, in the shutter mechanism 121, an opening / closing mechanism 125 is linked to the shutter 124, the opening / closing mechanism 125 is connected to a control unit 78, and the opening / closing mechanism 125 is driven and controlled by the control unit 78.

  Further, the drying unit 86 forms the upper part of the drying treatment tank 120 in a semicircular arc cross-sectional shape, and forms a through hole 126 through which the arm 88 of the substrate support 87 is inserted at the upper end portion. Packing 127 is attached. Thus, the drying treatment tank 120 can maintain an airtight state even when the arm 88 is inserted.

  Here, an elevating mechanism 128 is linked to the drying treatment tank 120, and the elevating mechanism 128 is connected to the control unit 78, and the elevating mechanism 128 is driven and controlled by the control unit 78. When the drying processing tank 120 is lowered by the lifting mechanism 128, the flange 129 formed at the lower end of the drying processing tank 120 is in close contact with the shutter 124 of the shutter mechanism 121.

  Further, the drying unit 86 has a pair of left and right drying steam supply nozzles 130 and 131 for injecting and supplying drying steam (IPA gas: isopropyl alcohol gas or the like) to the inner upper portion of the drying treatment tank 120.

  The dry steam supply nozzles 130 and 131 are formed with gas discharge ports 132 and 133 for discharging dry steam toward the upper part on the inner side with an interval in the front-rear direction.

  Here, a drying steam supply source 134 for supplying the drying steam together with the carrier gas is connected to the drying steam supply nozzles 130 and 131 via an opening / closing valve 135, and the opening / closing valve 135 is opened. The drying steam can be supplied from the drying steam supply nozzles 130 and 131 to the inside of the drying treatment tank 120. Further, a controller 78 is connected to the opening / closing valve 135, and the opening / closing valve 135 is driven and controlled by the controller 78.

  The cleaning / drying mechanism 20 is configured as described above, and is driven and controlled by the control unit 78.

  The control unit 78 drives and controls the cleaning / drying mechanism 20 according to the cleaning subroutine 83 and the drying subroutine 84 of the substrate processing program 81 stored in the storage medium 80, so that the cleaning process and the drying process of the wafer 2 are performed continuously. ing.

  First, in the cleaning subroutine 83, as shown in FIG. 18, first, the cleaning / drying mechanism 20 is initially set (initial setting step S21).

  Specifically, as shown in FIG. 19 (a), the control unit 78 sets the opening / closing valve 112 of the cleaning treatment tank 105 and the opening / closing valve 116 of the overflow tank 113 to be closed, and uses the opening / closing mechanism 125. Then, the shutter 124 is opened, and the substrate support 87 is disposed above the shutter mechanism 121 using the lifting mechanism 22 and spaced above the substrate support 87 using the lifting mechanism 128. The drying tank 120 is disposed. Thereafter, the control unit 78 drives and controls the three-way cock 119 to supply pure water from the pure water supply source 117 into the cleaning treatment tank 105 through the cleaning liquid supply nozzles 108 and 109 of the cleaning treatment tank 105. At this time, the control unit 78 opens the opening / closing valve 116 of the overflow tank 113 so that the pure water overflowed from the cleaning treatment tank 105 can be discharged.

  Next, the cleaning subroutine 83 receives the batch 5 composed of a plurality of (for example, 50) wafers 2 on the substrate support 87 (wafer receiving step S22). The batch 5 is knitted by the batch knitting unit 6.

  Specifically, as shown in FIG. 19B, the control unit 78 drives and controls the batch transfer mechanism 17 to transfer each wafer 2 constituting the batch 5 transferred by the batch transfer mechanism 17 to the substrate support 87. Are placed in support grooves 95 to 98 formed in the support bodies 89 to 92.

  Next, the cleaning subroutine 83 prepares for the cleaning process by immersing the wafer 2 placed on the substrate support 87 in pure water stored in the cleaning processing tank 105 (cleaning preparation step S23).

  Specifically, as shown in FIG.20 (a), the control unit 78 is placed on the substrate support 87 by lowering the substrate support 87 to the inside of the cleaning treatment tank 105 using the lifting mechanism 22. The wafer 2 is immersed in pure water stored in the cleaning tank 105.

  Next, the cleaning subroutine 83 performs the cleaning process of the wafer 2 inside the cleaning process tank 105 (cleaning process step S24).

  Specifically, the control unit 78 controls the driving of the three-way cock 119 while keeping the opening / closing valve 112 of the cleaning tank 105 closed and keeping the opening / closing valve 116 of the overflow tank 113 open. The chemical liquid (cleaning liquid) is supplied from the chemical liquid supply source 118 to the inside of the cleaning processing tank 105 through the cleaning liquid supply nozzles 108 and 109 of the cleaning processing tank 105, whereby the pure water gradually overflows from the cleaning processing tank 105 to the overflow tank 113. Eventually, the chemical solution is stored in the cleaning tank 105. Thereafter, the wafer 2 immersed in the chemical solution stored in the cleaning treatment tank 105 is cleaned with the chemical solution (chemical solution cleaning process). Thereafter, the controller 78 drives the three-way cock 119 to supply pure water while keeping the opening / closing valve 112 of the cleaning tank 105 closed and the opening / closing valve 116 of the overflow tank 113 open. Pure water (cleaning liquid) is supplied from the source 117 to the inside of the cleaning processing tank 105 through the cleaning liquid supply nozzles 108 and 109 of the cleaning processing tank 105, so that the chemical solution gradually overflows from the cleaning processing tank 105 to the overflow tank 113. Finally, pure water is stored in the cleaning treatment tank 105. Thereafter, the wafer 2 immersed in pure water stored in the cleaning processing tank 105 is cleaned (rinsed) with pure water.

  Finally, the cleaning subroutine 83 raises the wafer 2 placed on the substrate support 87 from the inside of the cleaning processing bath 105 to the inside of the drying processing bath 120 (wafer raising step S25).

  Specifically, as shown in FIG.20 (b), the control unit 78 lowers the drying treatment tank 120 directly above the shutter mechanism 121 using the lifting mechanism 128 and supports the substrate using the lifting mechanism 22. The wafer 2 placed on the substrate support 87 is transferred to the inside of the drying processing tank 102 by raising the tool 87 from the inside of the cleaning processing tank 105 to the inside of the drying processing tank 120.

  Next, in the drying subroutine 84, as shown in FIG. 21, first, the lower end opening of the drying processing tank 102 is closed by the shutter 124 of the shutter mechanism 121 (shutter closing step S26).

  Specifically, as shown in FIG. 22 (a), the control unit 78 closes the shutter 124 of the shutter mechanism 121 using the opening / closing mechanism 125, and the shutter 124 is in close contact with the lower end opening of the drying processing tank 120. Let

  Next, the drying subroutine 84 supplies dry steam to the inside of the drying processing tank 120 (dry steam supply step S27).

  Specifically, the control unit 78 is in a state where the opening / closing valve 135 is opened. As a result, dry steam having a predetermined temperature is supplied from the dry steam supply source 134 into the drying processing tank 120 through the gas discharge ports 132 and 133 of the dry steam supply nozzles 130 and 131.

  Here, in the dry steam supply step S27, the configuration state of the wafers 2 constituting the batch 5 knitted by the batch knitting unit 6 stored in the storage medium 80, that is, the number and position of the wafers 2 constituting the batch 5. Furthermore, depending on the state of the wafer 2 such as whether or not the wafer 2 to be adjacent to the front surface side or the back surface side of the wafer 2 is insufficient, the supply state of the dry steam, that is, the dry steam per unit time The supply amount (supply rate), supply time, concentration, and other states are changed.

  Specifically, the control unit 78 sets the supply rate as 2.0 ml / sec and the supply time as 90 seconds as the initial values of the dry steam, stores them in the storage medium 80, and converts the conversion table 136 shown in FIG. Is stored in the storage medium 80, and an initial value is shown in the conversion table 136 according to the number of wafers 2 constituting the batch 5 and whether or not the wafers 2 to be adjacent to the surface side of the wafers 2 are insufficient. The dry steam supply rate or supply time is calculated by integrating the calculated coefficients, and the open / close valve 135 is driven and controlled to supply the dry steam to the drying treatment tank 120 at the calculated supply rate or supply time.

  For example, when changing the supply rate of dry steam according to the number of wafers 2 constituting the batch 5, when the maximum number of wafers 2 constituting the batch 5 is 50, 2.0 ml / sec as the initial value. When the number of wafers 2 constituting the batch 5 is 25, the drying steam is supplied for 90 seconds at the initial value, that is, 1.8 ml / sec, and the wafer 2 constituting the batch 5 is supplied for 90 seconds. Is one sheet, dry steam is supplied for 90 seconds at 82% of the initial value, that is, 1.64 ml / sec.

  In addition, when the wafer 2 to be adjacent to the surface side of the wafer 2 constituting the batch 5 is insufficient and the batch 5 is partially insufficient, the number of wafers 2 constituting the batch 5 is 25. When 90% × 0.9 of the initial value, that is, 1.62 ml / sec, dry steam is supplied for 90 seconds, and when the number of wafers 2 constituting the batch 5 is one, 82% × 0.9 of the initial value, that is, Supply dry steam for 90 seconds at 1.476ml / sec.

  Here, in the case where a partial shortage occurs in the batch 5, not only the control is performed only by the number of wafers 2 constituting the batch 5 as described above, but also in a portion where the partial shortage does not occur. It is also possible to control in consideration of the number of wafers 2 and the number of wafers 2 in a portion where a partial shortage occurs. For example, when the number of wafers 2 constituting the batch 5 is 25, the number of wafers 2 in the portion where the number of wafers 2 to be adjacent to the front side is not insufficient is 20, and the number of wafers 2 to be adjacent to the front side is When the number of wafers 2 in the lacking part is 5, the initial value (2 ml / sec) x 90%, which is the supply amount of dry steam corresponding to the part where the wafer 2 to be adjacent to the front side is not lacking x (20/25) and an initial value (2 ml / sec) x 90% x 0.9 x (5/25) which is a supply amount of dry steam corresponding to a portion where the wafer 2 to be adjacent to the front side is insufficient 1.76 ml / sec of dry steam added with is supplied for 90 seconds.

  In addition, when the drying steam supply time is changed according to the number of wafers 2 constituting the batch 5, when the maximum number of wafers 2 constituting the batch 5 is 50, 2.0 ml / sec as the initial value. When the number of wafers 2 constituting the batch 5 is 25, the drying steam is supplied at 96% of the initial value, that is, 2.0 ml / sec for 86.4 seconds, and the wafers 2 constituting the batch 5 are supplied. When there is one sheet, dry steam is supplied for 82.8 seconds at 92% of the initial value, that is, 2.0 ml / sec.

  In addition, when the wafer 2 to be adjacent to the surface side of the wafer 2 constituting the batch 5 is insufficient and the batch 5 is partially insufficient, the number of wafers 2 constituting the batch 5 is 25. When 96% × 0.9 of the initial value, that is, 2.0 ml / sec, dry steam is supplied for 77.76 seconds, and when the number of wafers 2 constituting the batch 5 is one, 92% × 0.9 of the initial value, that is, Supply dry steam at 2.0 ml / sec for 74.52 seconds.

  Here, in the case where a partial shortage occurs in the batch 5, not only the control is performed only by the number of wafers 2 constituting the batch 5 as described above, but also in a portion where the partial shortage does not occur. It is also possible to control in consideration of the number of wafers 2 and the number of wafers 2 in a portion where a partial shortage occurs. For example, when the number of wafers 2 constituting the batch 5 is 25, the number of wafers 2 in the portion where the number of wafers 2 to be adjacent to the front side is not insufficient is 20, and the number of wafers 2 to be adjacent to the front side is When the number of wafers 2 in the lacking part is 5, the initial value (90 seconds) x 90% x which is the supply time of the dry steam corresponding to the part where the wafer 2 to be adjacent to the front side is not lacking (20/25) and the initial value (90 seconds) x 90% x 0.9 x (5/25) which is the supply time of the dry steam corresponding to the portion where the wafer 2 to be adjacent to the front side is insufficient Supply dry steam at 2.0ml / sec for 84.62 seconds.

  Finally, the drying subroutine 84 delivers the wafer 2 subjected to the cleaning process and the drying process to the batch transfer mechanism 17 (wafer delivery step S28).

  Specifically, as shown in FIG. 22B, the control unit 78 raises the drying processing tank 120 by the lifting mechanism 128 and receives the wafer 2 from the substrate support 87 by the batch transfer mechanism 17.

  As described above, in the drying subroutine 84 of the substrate processing program 81, the supply state of the dry steam to the dry processing tank 120 is changed in the dry steam supply step S27 according to the configuration state of the wafers 2 constituting the batch 5. I am doing so.

  Therefore, in the substrate processing apparatus 1, the batch 5 determined by the number of wafers 2 constituting the batch 5 and whether or not the wafers 2 to be adjacent to the front side or the back side of the wafer 2 constituting the batch 5 are insufficient. By changing the supply time of dry steam and the supply amount (supply rate) per unit time in accordance with the configuration state, it is possible to perform a drying process suitable for the configuration state and prevent the occurrence of defective drying. be able to.

  In particular, when the number of wafers 2 included in the batch 5 is used as the configuration state of the wafers 2 constituting the batch 5, even if the batch 5 is not composed of the maximum number of wafers 2, Thus, the drying process can be performed in a state suitable for the above, and the occurrence of poor drying can be prevented.

  Further, when it is used as a configuration state of the wafers 2 constituting the batch 5 whether or not the wafers 2 to be adjacent to the surface side of the wafers 2 constituting the batch 5 are insufficient, it is important for circuit formation or the like. In particular, it is possible to prevent the occurrence of poor drying on the surface side of the wafer 2 to be formed.

  Further, when the configuration state of the wafers 2 constituting the batch 5 is used as to whether or not the wafers 2 to be adjacent to the back side of the wafers 2 constituting the batch 5 are insufficient, the circuit formation or the like can be similarly performed. The occurrence of poor drying on the surface side of the wafer 2 which is important can be particularly prevented. This is because the dry steam supplied to the back surface side of the wafer 2 does not directly contribute to the drying of the front surface side of the wafer 2, but the dry steam is supplied to the back surface side of the wafer 2 to This is because the temperature on the side rises and affects the drying on the surface side of the wafer 2. That is, since the wafer 2 is rinsed with pure water during the cleaning process before the drying process, the temperature of the wafer 2 is substantially equal to the water temperature on both the front surface side and the back surface side. When the vapor is supplied, the dry vapor adsorbed on the wafer 2 gives the heat of condensation equal to the heat of vaporization to the wafer 2, and the temperature of the wafer 2 rises not only on the back surface but also on the front surface. As a result, as the temperature on the surface side of the wafer 2 rises, the amount of dry vapor adsorbed on the surface side of the wafer 2 decreases, resulting in poor drying on the surface side of the wafer 2. Therefore, even when there is a shortage of wafers 2 that should be adjacent to the back side of the wafers 2 constituting the batch 5, there is a shortage of wafers 2 that should be adjacent to the front side of the wafers 2 constituting the batch 5. Similarly, it is desirable to change the supply state of the dry steam.

  Further, when the supply amount of dry steam to the drying treatment tank 120 is used as a supply amount per unit time for supplying the drying steam to the drying treatment tank 120, waste of the drying steam that does not contribute to the drying treatment can be prevented. The running cost for the drying process can be reduced.

  Further, when the supply time for supplying the drying steam to the drying processing tank 120 is used as the supply state of the drying steam to the drying processing tank 120, the processing time required for the drying process can be shortened. Throughput can be improved.

  In addition, when the number of wafers 2 that should be adjacent to the surface side of the wafers 2 constituting the batch 5 is insufficient, when the dummy substrate is arranged at the insufficient position and the batch 5 is knitted, the dummy substrate is arranged. The required working time and the number of dummy substrates used can be reduced, the consumption of dry steam to the dummy substrates can be reduced, and the dryness of the wafer 2 on the surface side, which is important for circuit formation, can be reduced. Generation | occurrence | production can be prevented especially.

  In addition, when the number of wafers 2 that should be adjacent to the back surface side of the wafers 2 constituting the batch 5 is insufficient, a dummy substrate is arranged at the insufficient position and the batch 5 is knitted. It is possible to reduce the working time required and the number of dummy substrates used, reduce the consumption of dry vapor to the dummy substrate, and increase the supply amount of dry vapor to the back side of the wafer 2. The occurrence of poor drying on the surface side of the wafer 2 can be particularly prevented.

  Further, when a partial shortage occurs in the wafers 2 constituting the batch 5, when the partial shortage occurring in the wafers 2 constituting the batch 5 is resolved and the batch 5 is knitted, Both the front surface side and the back surface side can be satisfactorily dried, and the occurrence of poor drying due to a partial shortage of the wafer 2 can be prevented.

  In the substrate processing apparatus 1, the dry steam is jetted from all the gas discharge ports 132 and 133 formed in the dry steam supply nozzles 130 and 131 at the same time. However, the batch 5 is configured in the dry steam supply nozzles 130 and 131. The gas discharge ports 132 and 133 are formed so as to be positioned between the wafers 2 adjacent to the wafer 2 at equal intervals, and a means for adjusting the spray amount of the dry steam is provided in each of the gas discharge ports 132 and 133, so that the batch 5 Depending on the configuration state of the wafer 2 to be configured, the supply rate and supply time of the drying vapor supplied from the gas discharge ports 132 and 133 to the drying processing tank 120 may be changed.

The top view which shows the substrate processing apparatus which concerns on this invention. The top view which shows a batch organization part. The front view. The top view which shows a board | substrate conveyance mechanism. The front view. The plane sectional view showing a wafer holder. FIG. The top view which shows a batch formation mechanism. The same side view. The top view which shows an arrangement | sequence order change mechanism. The front view. The same side view. The block diagram which shows a control part. The flowchart which shows a batch organization subroutine. The block diagram which shows a washing-drying mechanism. FIG. FIG. The flowchart of a washing subroutine. Operation | movement explanatory drawing of a washing-drying mechanism (before washing processing). Operation explanatory diagram of the cleaning and drying mechanism (during cleaning processing). The flowchart of a drying subroutine. Operation | movement explanatory drawing of a washing-drying mechanism (at the time of a drying process). Explanatory drawing which shows a conversion table.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Wafer 3 Carrier 4 Carrier carrying in / out part 5 Batch 6 Batch knitting part 7 Substrate processing part 8 Carrier stage 9 Opening and closing door 10 Carrier conveyance mechanism
11 Carrier stock 12 Carrier mounting table
13 Opening / closing door 14 Board transfer mechanism
15 Batch formation mechanism 16 Array order change mechanism
17 Batch transfer mechanism 18 Wafer containment state detection sensor
19 Notch aligner 20 Cleaning and drying mechanism
21 Cleaning mechanism 22 Lifting mechanism
23 Washing / drying tank 24 Washing tank
25 First chemical tank 26 Second chemical tank
27 Third chemical tank 28 First pure water tank
29 Second pure water tank 30 Third pure water tank
31 First transport device 32 Second transport device
33 Third conveyor 34 Batch knitting room
35 Mounting table 36 Multi-axis robot
37 Wafer holder 38 Base
39 Turntable 40 First lifting arm
41 Second lifting arm 42 Third lifting arm
43 Rotating arm 44 Casing
45 Wafer holding plate 46, 47 Locking piece
48,49 Locking piece 50 cylinder
51 Rod 52 Movable body
53 Movable plate 54 Locking piece
55 Base 56 Lift platform
57,58 Support arm 59,60 Wafer holder
61,62 Holding groove 63 Wafer holding chuck
64 Base 65,66 Support plate
67, 68, 69 Wafer support 70 Holding groove
71 Moving platform 72 Prop
73 Lifting platform 74 Wafer holder
75 Locking piece 76,77 Locking piece
78 Controller 79 Controller
80 Storage medium 81 Substrate processing program
82 Batch organization subroutine 83 Cleaning subroutine
84 Drying subroutine 85 Cleaning unit
86 Drying unit 87 Substrate support
88 Arm 89,90,91,92 Support
93,94 Linkage 95,96,97,98 Support groove
99 Shield 100,101 Connector
102 Shielding surface 103 Lower end front
104 Front 105 Cleaning tank
106,107 Left and right side walls 108,109 Cleaning liquid supply nozzle
110 Bottom wall 111 Drain pipe
112 Open / close valve 113 Overflow tank
114 Bottom wall 115 Drain pipe
116 Open / close valve 117 Pure water supply source
118 Chemical source 119 Three-way cock
120 Drying tank 121 Shutter mechanism
122 Casing 123 Shutter housing
124 Shutter 125 Opening / closing mechanism
126 Through hole 127 Packing
128 Lifting mechanism 129 Flange
130,131 Dry steam supply nozzle 132,133 Gas outlet
134 Dry steam supply source 135 Open / close valve
136 Conversion table

Claims (24)

In the substrate processing apparatus that arranges the batch composed of the substrates to be batch processed inside the drying processing tank, supplies the drying steam to the inside of the drying processing tank and performs the drying processing of the substrates for each batch,
A substrate processing apparatus configured to change a supply state of dry steam to the drying processing tank in accordance with a configuration state of substrates constituting the batch.   The substrate processing apparatus according to claim 1, wherein the number of substrates included in the batch is used as the configuration state of the substrates constituting the batch.   The substrate processing apparatus according to claim 1, wherein whether or not a substrate to be adjacent to the substrate constituting the batch is insufficient is used as a configuration state of the substrate constituting the batch.   The substrate according to any one of claims 1 to 3, wherein a supply amount per unit time for supplying the drying steam to the drying treatment tank is used as a supply state of the drying steam to the drying treatment tank. Processing equipment.   The substrate processing apparatus according to claim 1, wherein a supply time for supplying the dry steam to the dry processing tank is used as a supply state of the dry steam to the dry processing tank.   2. A batch knitting means for knitting a batch by arranging a dummy substrate at a shortage position when a substrate to be adjacent to the surface side of the substrate constituting the batch is insufficient. The substrate processing apparatus according to claim 5.   2. A batch knitting means for knitting a batch by arranging a dummy substrate at a shortage position when a substrate to be adjacent to a back surface side of the substrate constituting the batch is insufficient. The substrate processing apparatus according to claim 6.   The batch knitting means for knitting the batch by eliminating the partial shortage occurring in the substrate constituting the batch when the substrate constituting the batch is partially deficient. The substrate processing apparatus in any one of Claims 1-7. In the substrate processing method of performing a drying process for each batch composed of substrates that are collectively processed using dry steam supplied to the inside of the drying processing tank,
The substrate processing method characterized by changing the supply state of the dry steam to the dry processing tank according to the configuration state of the substrates constituting the batch.   The substrate processing method according to claim 9, wherein the number of substrates included in the batch is used as a configuration state of the substrates constituting the batch.   The substrate processing method according to claim 9, wherein whether or not a substrate to be adjacent to the substrate constituting the batch is insufficient is used as a configuration state of the substrate constituting the batch.   The substrate according to any one of claims 9 to 11, wherein a supply amount per unit time for supplying the dry steam to the dry treatment tank is used as a supply state of the dry steam to the dry treatment tank. Processing method.   The substrate processing method according to claim 9, wherein a supply time for supplying the drying steam to the drying processing tank is used as a supply state of the drying steam to the drying processing tank.   14. The batch is formed by arranging dummy substrates at positions where the substrates to be adjacent are insufficient when the substrates to be adjacent to the surface side of the substrates constituting the batch are insufficient. A substrate processing method according to claim 1.   15. The batch is formed by arranging dummy substrates at positions where the substrates are insufficient when the substrates to be adjacent to the back surface side of the substrates constituting the batch are insufficient. A substrate processing method according to claim 1.   16. When a partial deficiency occurs in the substrates constituting the batch, the partial deficiency occurring in the substrates constituting the batch is resolved and the batch is organized. The substrate processing method according to any one of the above. In the substrate processing program for performing the drying process for each batch composed of the substrates to be collectively processed using the dry steam supplied to the inside of the drying processing tank,
A substrate processing program comprising a step of changing a supply state of dry steam to the drying processing tank in accordance with a configuration state of substrates constituting the batch.   The substrate processing program according to claim 17, wherein the number of substrates included in the batch is used as the configuration state of the substrates constituting the batch.   The substrate processing program according to claim 17, wherein whether or not a substrate to be adjacent to the substrate constituting the batch is insufficient is used as a configuration state of the substrate constituting the batch.   20. The substrate according to claim 17, wherein a supply amount per unit time for supplying the dry steam to the dry processing tank is used as a supply state of the dry steam to the dry processing tank. Processing program.   20. The substrate processing program according to claim 17, wherein a supply time for supplying the drying steam to the drying processing tank is used as a supply state of the drying steam to the drying processing tank.   18. When the substrate to be adjacent to the surface side of the substrate constituting the batch is insufficient, the method includes a step of arranging a dummy substrate at a shortage position and knitting the batch. The substrate processing program according to any one of 21.   The method of arranging a batch by arranging a dummy substrate at a shortage position when a substrate to be adjacent to a back surface side of a substrate constituting the batch is insufficient. The substrate processing program according to any one of 22.   18. When the partial shortage occurs in the substrates constituting the batch, the method includes the step of organizing the batch by eliminating the partial shortage occurring in the substrates constituting the batch. The substrate processing program according to claim 23.

Images