JP2007250797A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely taking a wafer out of a pod by hooking a part of the periphery of the wafer with a hooking part. <P>SOLUTION: A wafer transporter 40 is equipped with a tweezers 50 for taking a wafer 1 in/out of a pod 2. The tweezers 50 comprise base end side placements 52 and 52 and tip end side placing parts 54 and 54 for placing the wafer 1 and base end side displacement preventing parts 53 and 53 and tip end side hooks 55 and 55 for hooking the periphery of the wafer 1. The tip end side hooks 55 and 55 are so designed that an included angle Θb with the placement surface of the tip end side placing parts 54 and 54 is right or acute angle, with the height h from the placement surface being designed at least a half of thickness (t) of the wafer 1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus, and more particularly to a technique for transporting a substrate as a workpiece. For example, in a method of manufacturing a semiconductor integrated circuit device (hereinafter referred to as an IC), a semiconductor in which an integrated circuit including a semiconductor element is fabricated. The present invention relates to a material effective for forming an oxide film, a nitride film, a metal film, and a semiconductor film on a wafer (hereinafter referred to as a wafer).

Conventional wafer carriers used in this type of substrate processing apparatus include an open cassette, which is a substantially cubic storage container having a pair of side walls opened to each other, and a substantially cubic shape having one side wall opened. There is a FOUP (front opening unified pod, hereinafter referred to as a pod) that is a storage container that is formed and has a cap detachably attached to an opening.
When a pod is used as a wafer carrier, since the wafer is transported in a sealed state, the cleanliness of the wafer can be maintained even if particles or the like are present in the surrounding atmosphere.
As a result, by reducing the cleanliness of the clean room where the substrate processing apparatus is installed, it is possible to reduce the cost required for the clean room, so in recent substrate processing apparatuses, pods have been used as wafer carriers. Yes.

When a wafer is taken out from the pod, a tweezer for picking up the wafer is inserted into the pod by a wafer transfer equipment and moved in three dimensions to pick up and take out the wafer. For example, see Patent Document 1.
Japanese Patent Laying-Open No. 2005-93868

  However, when the wafer is taken out from the pot by the tweezer, when the tweezer tries to pick up the wafer, the tweezer slides against the wafer and cannot pick up the wafer, so the wafer is taken out from the pod. It may not be possible.

  An object of the present invention is to provide a substrate processing apparatus that can reliably take out a substrate from a substrate storage container.

Typical means for solving the above-described problems are as follows.
(1) In a substrate processing apparatus including a substrate transfer device having a substrate mounting plate for taking a substrate into and out of a substrate storage container,
The substrate mounting plate is configured to hook a mounting portion for mounting the substrate and a peripheral edge portion of the substrate inside the substrate storage container when the substrate is taken out from the substrate storage container. And a hook part.
The hooking portion is disposed on the tip side from the mounting portion, the depression angle with respect to the mounting surface of the mounting portion is set to a right angle or an acute angle, and the height relative to the mounting portion is the thickness of the substrate. The substrate processing apparatus is characterized by being set to more than half of the above.
(2) The hooking portion is disposed so as to be positioned in the vicinity of a portion sandwiched on the back side in the storage container when the substrate is taken out from the substrate storage container. ) Substrate processing apparatus.

  According to the above (1), when the substrate is taken out from the substrate storage container by the substrate mounting plate, a part of the peripheral edge of the substrate can be hooked on the hook portion, so that the substrate can be surely taken out from the substrate storage container. Can do.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

In this embodiment, as shown in FIG. 1, FIG. 2 and FIG. 3, the substrate processing apparatus according to the present invention is a batch type vertical hot wall type CVD apparatus (hereinafter referred to as a CVD process) for performing a CVD process in an IC manufacturing method. , Referred to as a CVD apparatus).
In this CVD apparatus, a pod 2 is used as a wafer carrier for transporting the wafer 1.

As shown in FIG. 1 to FIG. 3, the CVD apparatus 10 includes a housing 11 constructed in a rectangular parallelepiped box shape by using a steel plate or a steel plate. A pod loading / unloading port 12 is opened on the front wall of the housing 11 so as to communicate with the inside and outside of the housing 11, and the pod loading / unloading port 12 is opened and closed by a front shutter 13.
A pod stage 14 is installed in front of the pod loading / unloading port 12, and the pod stage 14 is configured to place the pod 2 and perform alignment. The pod 2 is loaded onto the pod stage 14 by an in-process transfer device (not shown), and is also unloaded from the pod stage 14.

A rotary pod shelf 15 is installed in an upper portion of the housing 11 at a substantially central portion in the front-rear direction, and the rotary pod shelf 15 is configured to store a plurality of pods 2.
That is, the rotary pod shelf 15 includes a support column 16 that is vertically set up and intermittently rotated in a horizontal plane, and a plurality of shelf plates 17 that are radially supported by the support column 16 at each of the upper, middle, and lower levels. The plurality of shelf boards 17 are configured to hold the pod 2 in a state where a plurality of the pods 2 are respectively placed.
A pod transfer device 18 is installed between the pod stage 14 and the rotary pod shelf 15 in the housing 11, and the pod transfer device 18 is provided between the pod stage 14 and the rotary pod shelf 15 and the rotary pod shelf 15. The pod 2 is transported between the pod shelf 15 and the pod opener 21.

A sub-housing 19 is constructed across the rear end of the lower portion of the housing 11 at a substantially central portion in the front-rear direction. A pair of wafer loading / unloading ports 20 for loading / unloading the wafer 1 into / from the sub-casing 19 are arranged on the front wall of the sub-casing 19 in two vertical rows. A pair of pod openers 21 and 21 are respectively installed at the wafer loading / unloading ports 20 and 20.
The pod opener 21 includes a mounting table 22 for mounting the pod 2 and a cap attaching / detaching mechanism 23 for attaching / detaching the cap of the pod 2. The pod opener 21 is configured to open and close the wafer loading / unloading port of the pod 2 by attaching / detaching the cap of the pod 2 mounted on the mounting table 22 by the cap attaching / detaching mechanism 23.
The pod 2 is carried into and out of the mounting table 22 of the pod opener 21 by the pod transfer device 18.

A transfer chamber 24 is formed in a front region in the sub-housing 19. The transfer chamber 24 is configured to load (charge) the wafer 1 with respect to the boat 25 and transfer (discharge) the wafer 1 to / from the boat 25. A device (described later) is installed.
In the rear region in the sub-housing 19, a standby chamber 26 for accommodating and waiting for the boat is formed. A boat elevator 27 for raising and lowering the boat 25 is installed in the waiting room 26. The boat elevator 27 is configured by a motor-driven feed screw shaft device, a bellows, or the like.
A seal cap 29 is horizontally installed on an arm 28 connected to a lifting platform of the boat elevator 27, and the seal cap 29 is configured to support the boat 25 vertically.
The boat 25 includes a plurality of holding members, and holds a plurality of (for example, about 50 to 150) wafers 1 horizontally, with their centers aligned and vertically aligned. It is configured.

As shown in FIG. 3, a reaction furnace opening is provided in the ceiling wall of the casing 11.
A reactor 30 is concentrically installed at the position of the reactor opening of the housing 11. The reaction furnace 30 includes an outer tube 31 and an inner tube 32 that are arranged concentrically with each other.
The outer tube 31 is made of a heat-resistant material such as silicon carbide or quartz, and is formed in a cylindrical shape with the upper end closed and the lower end open.
The inner tube 32 is made of a heat-resistant material such as quartz or silicon carbide, and is formed in a cylindrical shape whose upper and lower ends are open. A processing chamber 33 of the reaction furnace 30 is formed by the cylindrical hollow portion of the inner tube 32.
A cylindrical space formed between the outer tube 31 and the inner tube 32 forms a gas passage 34 through which gas flows.

A manifold 35 is installed at the lower ends of the outer tube 31 and the inner tube 32, and the manifold 35 is formed in a cylindrical shape using stainless steel or the like.
One end of an exhaust line 36 is connected to the manifold 35, and the other end of the exhaust line 36 is connected to an exhaust device (not shown) configured by a vacuum pump or the like. The exhaust line 36 exhausts the gas flowing through the gas passage 34 between the outer tube 31 and the inner tube 32.
The gas is supplied to the processing chamber 33 by a gas supply line 37 provided below the processing chamber 33.

A heater unit 38 is concentrically installed on the outer periphery of the outer tube 31, and the heater unit 38 is configured to heat the temperature in the outer tube 31 to a predetermined temperature.
A temperature sensor 39 as a temperature detector is installed in the outer tube 31. A temperature control unit (not shown) is connected to the heater unit 38 and the temperature sensor, and by adjusting the power supply to the heater unit 38 based on the temperature information detected by the temperature sensor 39, the processing chamber It is configured to control at a desired timing so that the temperature in 33 has a desired temperature distribution.

As shown in FIG. 4, the wafer transfer device 40 includes a rotary actuator 41, and the rotary actuator 41 has a linear actuator 43 installed on the upper surface thereof and a horizontal center O of the rotary actuator 41 as the center. , Configured to rotate in a horizontal plane.
A moving table 44 is installed on the upper surface of the linear actuator 43, and the linear actuator 43 is configured to move the moving table 44 horizontally.
A plurality of tweezers 50 (five in the present embodiment) as substrate mounting plates for holding the wafer 1 from below are arranged on the moving table 44 at equal intervals via a mounting block 45 and mounted horizontally. Yes.
The wafer transfer device 40 is configured to be lifted and lowered by an elevator (not shown) constituted by a feed screw device or the like.

As shown in FIG. 5, the tweezer 50 is formed in the shape of a bifurcated fork-shaped plate (plate body) that can pick up the wafer 1 and support it from below.
A counterbore 51 for preventing the positional deviation of the wafer 1 is submerged in a circular hole shape on the top surface of the tweezer 50, and the diameter Da of the arc surface formed by the rising surface of the counterbore 51 is the diameter of the wafer 1. It is set slightly larger than Dw.
For example, when the diameter Dw of the wafer 1 is 300 mm, the diameter Da of the spot facing 51 is set to be slightly larger than the diameter Dw of the wafer 1, for example, about 2 to 5 mm.

On the base end side of the tweezers 50 on the side of the counterbore 51, base end side mounting portions 52 and 52 are provided so as to form a pair at both ends. The base end side mounting portions 52, 52 are paired with the base end side positional deviation prevention portions 53, 53 one by one so as to be the same surface as the rising surface on the base end side of the spot facing 51, respectively. It is configured.
The included angle Θa formed between the upper surface, which is the mounting surface of the base end side position shift preventing portions 53 and 53 and the base end side mounting portion 52, is set to an obtuse angle. In the illustrated example, the depression angle Θa is set to 120 degrees.
Note that the base end side displacement prevention units 53 and 53 may not be the same surface as the rising surface, and the rising surface may be recessed from the base end side displacement prevention units 53 and 53.
At the peripheral edge portion of the spot facing 51 and at each of the pair of tip portions of the tweezers 50, tip side mounting portions 54 and 54 project so as to form a pair of tweezer outer ends one by one. The front-end-side hooks 55, 55 are configured to be a pair so that the front-end-side placement parts 54, 54 are on the same plane as the rising surface of the counterbore 51. The included angle Θb between the upper surfaces 55 and 55 and the upper surface that is the placement surface of the distal-side placement portion 54 is set to a right angle or an acute angle. In the present embodiment, the depression angle Θb is set to a right angle.

The upper surfaces of the both base end side mounting portions 52 and 52 and the upper surfaces of the both distal end side mounting portions 54 and 54 constitute the same plane so that the wafer 1 can be mounted without backlash. The upper surfaces of both base end side mounting portions 52 and 52 and the upper surfaces of both distal end side mounting portions 54 and 54 lift the wafer 1 from the bottom surface of the counterbore 51 and support it, thereby increasing the contact area with the wafer 1. This reduces the amount of foreign matter adhering to the wafer 1.
The heights h of the front-end hooks 55 and 55 are set to be at least half the thickness t of the wafer 1. That is, it is set so as to satisfy h ≧ t / 2.
In the present embodiment, it is designed so that h = t × 5/7.
Both front end side hooks 55, 55 are arranged so as to be located in the vicinity of the portion sandwiched on the back side in the pod 2 of the wafer 1 when taken out from the pod 2.

The pod 2 is configured as shown in FIG.
That is, the pod 2 includes a main body 3 formed in a substantially cubic box shape having a wafer loading / unloading port 4 that is a substantially square opening on one side wall, and a cap 7 that is detachably attached to the wafer loading / unloading port 4. I have.
Of the upper, lower, left and right side walls adjacent to the wafer loading / unloading port 4 of the main body 3, a plurality of holding pieces 5 are arranged at equal intervals on the inner surfaces of the left and right side walls and project at right angles to the side surfaces. The holding part pieces 5 are set to form the same plane and hold the wafer 1 horizontally.
In addition, a pair of back side positioning portions 6 and 6 are formed on the inner surfaces of the left and right side walls, and the back side positioning portions 6 and 6 are respectively provided at two locations on the outer periphery of the wafer 1 held by the holding piece 5. It is set so as to regulate the position of the back side of the wafer 1 by contact.
A front-side positioning portion 8 is provided at the center of the inner surface of the cap 7, and the front-side positioning portion 8 abuts on one location on the outer periphery of the wafer 1 held by the holding piece 5 and regulates the position of the front side of the wafer 1. By doing so, it is set so as to prevent rattling of the wafer 1 in cooperation with the back side positioning portions 6 and 6.
A lock 9 is attached to the cap 7, and the lock 9 is configured to lock the cap 7 to the main body 3 by engaging with a part of the wafer loading / unloading port 4 of the main body 3.

  The CVD process in the IC manufacturing method by the CVD apparatus having the above configuration will be described.

As shown in FIGS. 1 and 2, when the pod 2 is supplied to the pod stage 14, the pod loading / unloading port 12 is opened by the front shutter 13, and the pod 2 above the pod stage 14 is connected to the pod transfer device. 18 is carried into the housing 11 from the pod loading / unloading port 12.
The loaded pod 2 is automatically transferred to the designated shelf plate 17 of the rotary pod shelf 15 by the pod transfer device 18 and delivered, and temporarily stored on the shelf plate 17.
The stored pod 2 is transferred to one pod opener 21 by the pod transfer device 18 and transferred to the mounting table 22.
At this time, the wafer loading / unloading port 20 of the pod opener 21 is closed by the cap attaching / detaching mechanism 23, and the transfer chamber 24 is filled with nitrogen gas.

The pod 2 mounted on the mounting table 22 has its opening-side end face pressed against the opening edge of the wafer loading / unloading port 20 on the front surface of the sub-casing 19, and the cap is removed by the cap attaching / detaching mechanism 23. Mouth open.
The plurality of wafers 1 stored in the pod 2 are picked up by a tweezer 50 of the wafer transfer device 40, transferred from the wafer loading / unloading port 20 to the standby chamber 26 through the transfer chamber 24, and loaded into the boat 25 (charging). )
The wafer transfer device 40 that has transferred the wafer 1 to the boat 25 returns to the pod 2 and loads the next wafer 1 into the boat 25.
Note that the wafer transfer device 40 rotates the pod 2 side to the boat 25 side to place the wafer 1 on both the tip side mounting parts 54 and 54 and both base side mounting parts 52 and 52 of the tweezer 50. In this state, the tweezer 50 and the moving table 44 are moved horizontally to the position shown in FIG. 4B, and then rotated by the rotary actuator 41.
That is, in the wafer 1, both the distal end side mounting portions 54, 54 of the tweezers 50 rotate at positions farther from the rotation center than the both proximal end side mounting portions 52, 52.

  By repeating the above operation, all the wafers 1 of the pod 2 on the mounting table 22 of one pod opener 21 are sequentially loaded into the boat 25.

  During the loading operation of the wafer into the boat 25 by the wafer transfer device 40 in the one (upper or lower) pod opener 21, the other (lower or upper) pod opener 21 receives another pod from the rotary pod shelf 15. 2 is transferred and transferred by the pod transfer device 18, and the opening operation of the pod 2 by the pod opener 21 is simultaneously performed.

When a predetermined number of wafers 1 are loaded into the boat 25, the boat 25 holding the group of wafers is carried into the processing chamber 33 of the inner tube 32 by raising the seal cap 29 by the boat elevator 27 ( Go boat loading).
As shown in FIG. 3, when the upper limit is reached, the seal cap 29 is pressed against the manifold 35 to seal the inside of the outer tube 31. The boat 25 is left in the processing chamber 33 while being supported by the seal cap 29.

In this state, when the temperature of the processing chamber 33 is raised to a predetermined processing temperature by the heater unit 38 and the pressure in the processing chamber 33 is reduced to a predetermined pressure by the exhaust device, a predetermined processing gas is supplied to the gas. It is supplied to the processing chamber 33 by a line 37.
A CVD film is deposited on the wafer 1 when the processing gas contacts the wafer 1.

After the film forming process is performed in the processing chamber 33 of the reaction furnace 30, the boat 25 is unloaded (boat unloading) by the boat elevator 27.
Next, the processed wafer 1 of the boat 25 is detached (wafer discharge) by the tweezer 50 of the wafer transfer device 40 and stored in the pod 2.
By repeating the above operation, the CVD process is performed on the wafer 1.

By the way, in order to prevent rattling in the stored state in the pod 2, the wafer 1 is pressed against the back side positioning portions 6 and 6 by the cap 7 as shown in FIG. 6. Therefore, when the wafer 1 is taken out from the pod 2 by the tweezer 50 of the wafer transfer device 40, the wafer 1 is in a state of being pressed against both the rear side positioning portions 6 and 6.
When the wafer 1 is in a state of being pressed against the back side positioning portions 6 and 6 in this manner, the wafer 1 is sandwiched from both sides by the back side positioning portions 6 and 6.
When the wafer 1 is taken out from the pod 2 by the tweezer of the wafer transfer device in the above-described CVD process, if it is normal, the wafer transfer device is placed between each of the plurality of wafers 1 stored in the pod 2. 40 of the tweezers 50 are inserted under the wafer 1 to be taken out, and then the wafer 1 is scooped up by the tweezers 50. , 52 are placed on the wafer 1. Next, the wafer 1 is scooped out from the pod 2 by the tweezer 50 by pulling out the tweezer 50 with the wafer 1 placed.
However, as shown in FIG. 7A, the both-side positioning portions 6 are formed by the tweezers 50 ′ having the front-side hooks 55 ′ formed so that the depression angle Θb is an obtuse angle (120 degrees in the illustrated example). , 6, the wafer 1 in a state of being sandwiched between the pods 2 may be pulled out from the pod 2 by the tweezer 50 ′.
If the wafer 1 is pulled out from the pod 2 in a state where the front-end-side hook 55 'is not caught and the wafer 1 is placed on the tweezer 50', the wafer 1 is moved during the transfer. In some cases, the wafer 1 is damaged due to falling from the top of the tweezer 50 '.

However, in the present embodiment, as shown in FIG. 7B, the depression angle Θb of the tip side hook portion 55 is formed at a right angle (90 °), so that the tip side hook portion 55 is The wafer 1 can be reliably and properly pulled out from the pod 2 by the tweezers 50 so that the wafer 1 is reliably caught on the peripheral edge of the back side of the wafer 1.
Occurrence of a situation where the wafer 1 is pulled out from the pod 2 in a state where the wafer 1 is placed on the tweezers 50 in order for the both front end side hook portions 55 and 55 to be securely hooked to the peripheral edge portion on the back side of the wafer 1. Can be prevented beforehand.
In addition, when the wafer 1 is pulled out by the tweezers 50, the two hooks 55 and 55 are disposed so as to be positioned in the vicinity of the two rear positioning parts 6 and 6 in the pod 2, respectively. Since the acting force of the both hooks 55 and 55 is effectively applied as a force to remove the wafer 1 from between the portions, the wafer 1 can be reliably pulled out from the pod 2 by the tweezer 50.

  According to the embodiment, the following effects can be obtained.

1) By forming the included angle with the mounting surface of the mounting portion of the tip side hook portion of the tweezer at a right angle, the tip side hook portion is securely hooked to the peripheral edge portion on the back side of the wafer. Can be pulled out reliably and properly by tweezers.
Further, as shown in FIG. 4B, the wafer transfer device rotates in a state where the wafer 1 is placed on both the tip end side placement portions 54 and 54 and the both base end side placement portions 52 and 52 of the tweezers. Even when the operation is performed, the front-side hooking portion that is away from the rotation center is reliably hooked to the peripheral edge of the wafer. Therefore, even if the rotation speed is increased, the wafer 1 is not displaced, and the wafer transfer speed is increased. Can be improved.

2) Because the front-end hook is securely hooked to the back edge of the wafer, it is possible to prevent the wafer from being pulled out of the pod while the wafer is on the tweezer. , It is possible to prevent the wafer from falling from the tweezers and causing damage.

3) When pulling out the wafer with the tweezers, arrange both hooks so that the hooks on both ends are located in the vicinity of both rear positioning parts in the pod. Since the force can be effectively applied as a force for removing the wafer from the sandwiched portion, the tweezer can more reliably pull out the wafer from the pod.

  Needless to say, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  For example, the included angle formed with the mounting surface of the mounting portion of the tip side hook portion is not limited to a right angle, but may be an acute angle.

  The shape of the tweezers is not limited to the bifurcated fork-shaped plate shape, but may be formed into, for example, a rectangular plate shape of the tweezer 50B as shown in FIG. 8 or other plate shapes. May be.

  Although the CVD apparatus has been described in the above embodiment, the present invention can be applied to all substrate processing apparatuses such as an oxidation apparatus, a diffusion apparatus, and a heat treatment apparatus.

  Further, the case of processing a wafer has been described, but the present invention can be applied to all substrates such as a liquid crystal panel, a magnetic disk, and an optical disk.

It is a partially-omission perspective view which shows the CVD apparatus which is one embodiment of this invention. FIG. It is front sectional drawing which shows a reaction furnace. The wafer transfer apparatus is shown, (a) is a front view, (b) is a top view. The tweezers are shown, (a) is a plan view, (b) is a partially omitted sectional view taken along line bb in (a), and (c) is a detailed view of a portion c in (b). It is a plane sectional view of a pod. It is each schematic diagram explaining the effect | action of a front end side hook part, (a) has shown the case of the comparative example, (b) has shown the case of this Embodiment. It is a top view which shows other embodiment of Tweezers.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wafer (substrate), 2 ... Pod (substrate storage container), 3 ... Main body, 4 ... Wafer taking-in / out opening, 5 ... Holding part piece, 6 ... Back side positioning part, 7 ... Cap, 8 ... Front side positioning part, 9 DESCRIPTION OF SYMBOLS: Lock, 10 ... CVD apparatus (substrate processing apparatus), 11 ... housing, 12 ... pod loading / unloading port, 13 ... front shutter, 14 ... pod stage, 15 ... rotary pod shelf, 16 ... post, 17 ... shelf , 18 ... Pod transfer device, 19 ... Sub housing, 20 ... Wafer loading / unloading exit, 21 ... Pod opener, 22 ... Mounting table, 23 ... Cap attaching / detaching mechanism, 24 ... Transfer chamber, 25 ... Boat, 26 ... Standby chamber 27 ... Boat elevator, 28 ... Arm, 29 ... Seal cap, 30 ... Reactor, 31 ... Outer tube, 32 ... Inner tube, 33 ... Processing chamber, 34 ... Gas passage, 35 ... Manifold, 36 ... Exhaust line 37 ... Gas supply line, 38 ... Heater unit, 39 ... Temperature sensor, 40 ... Wafer transfer device, 41 ... Rotary actuator, 43 ... Linear actuator, 44 ... Moving table, 45 ... Mounting block, 50 ... Tweezer (mounting) Plate), 51 ... Counterbore, 52 ... Base end side mounting portion, 53 ... Base end side positional displacement prevention portion, Θa ... Angular angle formed with the upper surface of the base end side mounting portion of the base end side positional shift prevention portion, 54 ... Tip side mounting portion, 55... Tip side hooking portion, .THETA.b... Angle formed with the top surface of the tip side mounting portion of the tip side hooking portion, h... Height of tip side hooking portion, t.

Claims (1)

In a substrate processing apparatus provided with a substrate transfer device having a substrate mounting plate for taking a substrate into and out of a substrate storage container,
The substrate mounting plate is configured to hook a mounting portion for mounting the substrate and a peripheral edge portion of the substrate inside the substrate storage container when the substrate is taken out from the substrate storage container. And a hook part.
The hooking portion is disposed on the tip side from the mounting portion, the depression angle with respect to the mounting surface of the mounting portion is set to a right angle or an acute angle, and the height relative to the mounting portion is the thickness of the substrate. The substrate processing apparatus is characterized by being set to more than half of the above.

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