JP2007237482A - Mold release agent composition for hot-pressing mold and board manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold release agent composition or an adhesive for a hot-pressing mold capable of easily and permanently releasing a board, which uses lignocelluloses and an inorganic material from a hot plate at the time of hot-pressing molding, excellent in mold releasability and productivity, making it extremely hard to cause the thermal deterioration due to the hot plate and excellent in heat resistance, and a manufacturing method of the board excellent in secondary processability, the coefficient of water absorbing expansion and bending elastic modulus due to the hot-pressing molding of a molding material containing lignocelluloses. <P>SOLUTION: The mold release agent composition contains a polyester compound (I) produced by reacting a polyhydric alcohol (A), a dibasic acid (B) and a saturated fatty acid (C) in a molar ratio of (A):(B):(C)=1:0.5-1:2-3 and a low density polyethylene (II) in a weight ratio of (I):(II)=1:4-4:1. Further, the adhesive is composed of the mold release agent composition and an organic polyisocyanate compound (D). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention comprises a release agent composition comprising as an essential component a polyester compound produced by reacting a dibasic acid, a polyhydric alcohol, and a saturated fatty acid, and the release agent composition and an organic polyisocyanate compound. And a method for producing a board by hot pressing using the release agent composition.

  Conventionally, particle board, wafer board, OSB, insulation board, hard board, lichen cell board such as chrysanthemum board formed by molding medium fiber board and rice husk and coriander board formed by molding cola stalk, As an adhesive or binder for hot-press molding of inorganic boards (hereinafter referred to as boards) manufactured from inorganic materials, thermosetting urea resins, melamine resins, urea melamine resins, melamine urea resins, phenol resins, Melamine phenolic resins (hereinafter referred to as formalin adhesives) are widely used. These formalin-based adhesives are inexpensive, have excellent adhesive strength, and have properties of curing in a relatively short time. However, formalins released from products after hot-press molding of these formalin adhesives are regarded as environmental problems. Conventionally, as a countermeasure, in order to reduce the released formalin, the amount of free formalin in the formalin resin is reduced in actual use, or a formalin catcher agent is added when blending a formalin adhesive. ing. However, these measures not only increase the burden on the manufacturing process, but are not always perfect in terms of effectiveness.

  On the other hand, the use of non-formalin adhesives as another means has been studied. For example, the use of isocyanate adhesives for board production has been proposed (Patent Documents 1 and 2). . However, when hot-press molding is performed using an isocyanate adhesive as an adhesive for board hot-press molding, adhesion to the surface of the hot platen occurs due to its excellent excessive adhesiveness. A great deal of labor is required for the removal, and the molded product after the removal is damaged and the value as a product is lost.

  In order to solve the problem of such adhesion, as a compounding component to organic isocyanate, an additive (referred to as an internal mold release agent) that improves release properties from metals, such as alkyl phosphates or pyrophosphates (patents) Document 3), wax and liquid ester (Patent Document 4), and aliphatic carboxylic acid (Patent Document 5) have been proposed.

  In addition, it is also considered that a release agent is directly applied to a hot platen before hot pressing (referred to as an external release agent). For example, formation of a release layer using metal soap (Patent Document 6). Has been proposed.

  However, in order to obtain sufficient effects by these methods, it is essential to add a large amount to lignocellulose and inorganic materials and to apply a large amount of release agent to a hot platen. Will be reduced. In addition, the use of an external release agent alone has a problem with the durability of the surface, and frequent application of the external release agent is required. Particularly, the use in a multi-stage press requires a lot of labor and lacks productivity. It will be. Further, the addition and application of a large amount of wax or mold release agent reduces the wettability of the finished board surface, making it difficult to use for secondary processing.

  As a mold release agent for polyurethane molding, at least one aliphatic, aromatic, alicyclic or dimeric diacid and at least one linear or branched aliphatic monoalcohol are used. A mold release agent composed of one kind of diester (Patent Document 7) has been proposed, but it is suitable as a mold release agent for general polyurethane resins, but it is used at a high temperature as in hot-press molding of boards. In some cases, the effect is small, and good mold release cannot be obtained.

  In addition, an adhesive composition (Patent Document 8) using a low melting point low density polyethylene has been proposed. However, although the releasability is certainly excellent, when continuously used at a high temperature, the low melting point low density polyethylene itself lacks the thermal stability and is not yet sufficient for obtaining a continuous and stable releasability.

There are various problems in any of the conventional methods as described above, and it cannot be endured for a long time in an actual site, and at present the technology that can be satisfied is almost established. Some factories have attempted to use organic isocyanate for the inner layer that does not contact the hot platen, and to use conventional formaldehyde adhesive for the front and back parts that contact the hot plate. Is not satisfactory and is not practical in terms of board manufacture and performance.
JP-A-57-131538 JP-A-57-147567 Japanese Patent Publication No. 03-8068 Japanese Patent Publication No. 04-54390 JP 58-36430 A JP 52-154875 A JP-A-11-315154 Japanese Patent Laid-Open No. 11-71566

  The present invention solves the problems of the prior art from the background as described above, and can easily release the board using lignocelluloses and inorganic materials from the hot platen at the time of hot pressing. Provides a release agent composition and an adhesive that are excellent in releasability and productivity, and are extremely resistant to heat deterioration on a hot platen and excellent in heat resistance. It is an object of the present invention to provide a method for producing a board by hot-press molding of a molding material containing lignocellulose, which is excellent in workability, water absorption expansion coefficient and flexural modulus.

  As a result of diligent research, the present inventors have made a special polyester compound and low-density polyethylene as a release agent component for use in the adhesive. It has been found that a permanent good release property from the hot plate can be obtained by using it, and the present invention has been completed.

  That is, in the release agent composition according to the present invention, first, the molar ratio of the polyhydric alcohol (A), the dibasic acid (B), and the saturated fatty acid (C) is (A) :( B): (C) = 1: 0.5-1: The polyester compound (I) produced | generated by making it react in the ratio of 2-3 and low density polyethylene (II), (I) :( II) = 1: 4. It is characterized by containing at a weight ratio of ˜4: 1.

  Second, the polyester compound (I) is characterized in that the viscosity at 120 ° C. is in the range of 15 to 100 mPa · s.

  Third, the number average molecular weight (Mn) of the polyester compound (I) by gel permeation chromatography is in the range of 2500 to 5000 in terms of monodisperse polystyrene.

Fourth, any one of the above releasing agent compositions is dispersed in water.
Fifth, an adhesive agent of the release agent composition and the organic polyisocyanate compound.

  The board manufacturing method of the present invention using any one of the above releasing agents and adhesives is characterized by the following.

  First, when the molding material made of lignocellulose or an inorganic material is hot-press molded, the mold release material composition is mixed with the molding material together with the organic polyisocyanate compound (D) and molded. It is characterized by that.

  Second, the mold release agent composition is applied as an external mold release agent to a coking board or a coking board and a hot-pressing surface, and is hot-press molded.

  Thirdly, in the method of the second feature, a means for mixing the release agent composition with a molding material made of lignocellulose or an inorganic material is used in combination.

  According to the present invention, when producing a board using lignocelluloses or an inorganic material, the board can be easily released from the hot platen by using the features as described above, and a multistage press or a continuous press is used. Continuous board production can be performed stably.

  And it becomes possible to manufacture the board using lignocellulose and inorganic material excellent in secondary workability, a water absorption expansion coefficient, and a bending elastic modulus with high productivity.

  The present invention has the features as described above, and an embodiment thereof will be described below.

First, the release agent composition of the present invention will be described.
(Polyester compound)
The polyester compound used in the release agent composition of the present invention needs to have a molar ratio of constituent raw materials within a certain range, and the ratio is closely related to the viscosity and molecular weight of the polyester compound.

  The molar ratio of the polyhydric alcohol (A), dibasic acid (B), and saturated fatty acid (C) constituting the polyester compound by reaction is (A) :( B) :( C) = 1: 0.5 to 1: It is important to be in the range of 2-3. When the molar ratio of the dibasic acid (B) to the polyhydric alcohol (A) is less than 0.5, a polyester compound having a sufficient degree of polymerization cannot be obtained and the releasability is insufficient. On the other hand, when it exceeds 1, polymerization proceeds too much, and when it is used as an internally added release agent, the transfer to the hot plate is not performed quickly, resulting in insufficient releasability. Also, when the ratio of the saturated fatty acid (C) to the polyhydric alcohol (A) is less than 2, the polymerization of the polyester compound proceeds too much, and when it is greater than 3, a sufficient degree of polymerization cannot be obtained. Insufficient releasability.

  And the viscosity of the polyester compound in 120 degreeC has the preferable range of 15-100 mPa * s, and a favorable mold release effect is acquired in the range of this viscosity. Moreover, although the molecular weight of a polyester compound can be measured by gel permeation chromatography (GPC), the number average molecular weight (Mn) of a polyester compound has the preferable range of 2500-5000. A good mold release effect can be obtained within this weight average molecular weight range.

  As the polyhydric alcohol (A) used in the present invention, an aliphatic polyhydric alcohol having 3 to 10 carbon atoms, such as glycerin, diglycerin, trimethylolpropane, pentaerythritol, and dipentaerythritol is preferable. Take as an example.

  As the dibasic acid (B), oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, suberic acid, sebacic acid, cyclohexanedicarboxylic acid, phthalic acid, etc., usually a chain having 2 to 10 carbon atoms Or an alicyclic and aromatic dibasic acid is mentioned as an example of a suitable thing.

  Examples of suitable saturated fatty acids include aliphatic hydrocarbons having 10 to 28 carbon atoms, such as capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, behenic acid, and montanic acid.

In the reaction of polyhydric alcohol (A), dibasic acid (B) and saturated fatty acid (C), usually, temperature: 100 to 200 ° C., reaction time: 2 to 8 hours, reaction atmosphere: nitrogen substitution, catalyst is used. In some cases, catalyzing p-toluenesulfonic acid or the like is considered as a condition.
(Low density polyethylene)
The low density polyethylene used in the release agent composition of the present invention is not particularly limited as long as it has a normal temperature density of 0.96 g / cm ³ or less and is waxy, but it has a low melting point in view of ease of water dispersion. It is preferable that Examples of such low density polyethylene include WEISSEN-0252C (manufactured by Nippon Seiwa Co., Ltd., melting point 73 ° C.) and WEISSEN-0453 (manufactured by Nippon Seiwa Co., Ltd., melting point 55 ° C.).
(Releasing agent composition)
The release agent composition of the present invention contains the polyester compound as described above and low-density polyethylene as essential components, and the composition ratio thereof is polyester compound (I) and low-density polyethylene (II). Is within the range of the weight ratio of (I) :( II) = 1: 4 to 4: 1. When the proportion of the polyester compound (I) is less than this range, the composition lacks thermal stability. On the contrary, when the amount is excessive, the releasability deteriorates and the board productivity is low. Deteriorate. In addition, the product value of the finished board is lost due to the poor release properties.

  The release agent composition of the present invention may be composed only of the above-described polyester compound (I) and low-density polyethylene (II), and may contain other additive components as long as the object and effects of the present invention are not impaired. You may mix | blend. For example, emulsifiers and dispersants are considered as additive components. However, the blending of these additive components is desirably suppressed to 10% by weight or less of the total amount.

  The method of using the release agent composition of the present invention is not limited as long as it exists between the board and the caul board (and the hot press surface (platen)). For example, it may be applied directly to the surface of a coal board (and hot press surface (platen)), raw material elements (for example, chips for particle boards, fibers for fiber boards such as MDF, strands for OSB, inorganic boards) In this case, it may be used by mixing with an inorganic powder or the like. In the case of a lignocellulose board, the element may be mixed before the element is dried, or may be mixed with a blender or a blow line (in the case of MDF) at the same time as the adhesive. Usually, it is desirable to use it mixed with an adhesive.

  As will be described in detail in the board manufacturing method, when the board obtained using a lignocellulosic material or an inorganic material as a raw material has a structure other than a one-layer structure, when used as an internal mold release agent, it is costly and economically a mold release agent for the surface layer. It is preferred to use a composition.

  In order to obtain a continuous release effect, the composition containing the polyester compound (I) and the low density polyethylene (II) is preferably used as an aqueous dispersion, and the particle size measured by a laser particle size measuring device is 100 to 100. More preferably, it is 1000 nm. In addition, it is industrially desirable to use an aqueous dispersion mixed with the adhesive composition.

  Also, when used as an internal mold release agent, the amount of the mold release agent that moves to the surface of the coal board and the hot press surface is insufficient. It is more preferable to apply a mold composition.

As a method for dispersing in water, a general method for producing a wax emulsion is applied. The polyester compound and low density polyethylene may be added after being melted in water or water containing a dispersant, or may be mechanically forcedly dispersed using a pulverizer such as a ball mill.
(Board manufacturing method)
In the board manufacturing method according to the present invention, lignocelluloses and inorganic material chips are used. As the lignocellulosic material, particle board, OSB (oriented strand board), wafer board, LSL (laminate) are used. Strand chips, dust chips, flake chips used in wood chips for Ted Strand Lumber), fiber and sorghum stalks used in hardboards, MDF, insulation boards, bagasse, rice husks, rice grass, wheat grass, etc. Agricultural products are examples. These raw materials may be used alone or in combination of two or more.

On the other hand, inorganic materials include, for example, porous permite, vermiculite, foamed shirasu, glass, alumina, fly ash, cinnabar, tributeite, which are obtained by heating and foaming rock wool, pearlite, obsidian, leechite, shirasu, etc. These are glass balloons, shirasu balloons, etc., which are made of micro hollow bodies and the like. In order to obtain a lightweight molded body, the bulk density of the inorganic foam-containing particles is desirably 0.3 g / cm ³ or less. The inorganic foam-containing particles may be those subjected to a surface treatment using a silane coupling agent or the like in order to improve the adhesion with the binder.

  The board obtained using the lignocellulosic material and inorganic material of the present invention as a raw material has a single-layer structure or a three-layer structure consisting of a surface layer, a core layer, and a surface layer structure, or two or more surface layers and two or more core layers. A multilayer structure composed of two or more surface layers is exemplified, but there is no particular limitation. Furthermore, a lignocellulosic material or an inorganic material can be mixed, or can be used as a multilayer structure randomly such as a lignocellulose material, an inorganic material, a lignocellulose material, or an inorganic material, a lignocellulose material, or an inorganic material.

  An organic polyisocyanate compound is used as a substantial adhesive component in the production of the board of the present invention. The polyester compound and low density polyethylene which are the release agent composition are release agent components.

  The organic polyisocyanate compound (D) used in the present invention is not particularly limited as long as it is a compound having an isocyanate group that is usually used in the production of polyurethane and the like. Examples thereof include aliphatic polyisocyanates, alicyclic polyisocyanates, araliphatic polyisocyanates, aromatic polyisocyanates, and derivatives and modified products of these isocyanates.

  Examples of the aliphatic polyisocyanate include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 1,2-butylene diisocyanate, 2,3-butylene diisocyanate, 1,3- Aliphatic diisocyanates such as butylene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, 2,6-diisocyanate methyl caproate; lysine ester triisocyanate, 1,4,8-triisodia Nate octane, 1,6,11-triisocyanate undecane, 1,8-diisocyanate-4-isocyanate methyloctane, 1,3,6-triisocyanate hexa , 3,5,7 and aliphatic triisocyanates such as trimethyl-1,8-diisocyanate-5-isocyanatomethyl octane.

  Examples of the alicyclic polyisocyanate include 1,3-cyclopentene diisocyanate, 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (hereinafter, isophorone diisocyanate). 4,4'-methylenebis (cyclohexyl isocyanate), methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 1,3- or 1,4-bis (isocyanatomethyl) cyclohexane ( (Hereinafter also referred to as hydrogenated xylylene diisocyanate)) or a mixture thereof, alicyclic diisocyanate such as norbornane diisocyanate; 1,3,5-triisocyanate Hexane, 1,3,5-trimethylisocyanatocyclohexane, 2- (3-isocyanatopropyl) -2,5-di (isocyanatomethyl) -bicyclo (2,2,1) heptane, 2- (3-isocyanatopropyl)- 2,6-di (isocyanatomethyl) -bicyclo (2,2,1) heptane, 3- (3-isocyanatopropyl) -2,5-di (isocyanatomethyl) -bicyclo (2,2,1) heptane, 5 -(2-isocyanatoethyl) -2-isocyanatomethyl-3- (3-isocyanatopropyl) -bicyclo (2,2,1) heptane, 6- (2-isocyanatoethyl) -2-isocyanatomethyl-3- (3 -Isocyanatopropyl) -bicyclo (2,2,1) heptane, 5- (2-isocyanatoethyl)- -Isocyanatomethyl-2- (3-isocyanatopropyl) -bicyclo (2,2,1) -heptane, 6- (2-isocyanatoethyl) -2-isocyanatomethyl-2- (3-isocyanatopropyl) -bicyclo (2 , 2, 1) Alicyclic triisocyanates such as heptane.

  Examples of the araliphatic polyisocyanate include 1,3- or 1,4-xylylene diisocyanate or a mixture thereof, ω, ω′-diisocyanate-1,4-diethylbenzene, 1,3- or 1,4-bis ( 1-isocyanate-1-methylethyl) benzene (hereinafter also referred to as tetramethylxylylene diisocyanate) or a mixture thereof; an araliphatic diisocyanate such as 1,3,5-triisocyanate methylbenzene; Is mentioned.

  Examples of the aromatic polyisocyanate include m-phenylene diisocyanate, p-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,5-naphthalene diisocyanate, 2,4- or 4,4′-diphenylmethane diisocyanate (hereinafter referred to as MDI). Or a mixture thereof, 2,4- or 2,6-tolylene diisocyanate (hereinafter also referred to as TDI) or a mixture thereof, 4,4′-toluidine diisocyanate, 4,4′-diphenyl ether diisocyanate, and the like. Aromatic diisocyanates; triphenylmethane-4,4 ′, 4 ″ -triisocyanate, 1,3,5-triisocyanatebenzene, 2,4,6-triisocyanate toluene; Enirumetan 2,2 ', and aromatic tetraisocyanates, such as 5,5' isocyanate.

  Examples of these polyisocyanate derivatives include dimer, trimer, biuret, allophanate, carbodiimide, uretdione, oxadiazine trione, polymethylene polyphenyl polyisocyanate (hereinafter also referred to as crude MDI or polymeric MDI). .) And Crude TDI.

  Examples of the modified polyisocyanate include, for example, the above polyisocyanate or a polyisocyanate derivative and a low molecular weight polyol or a low molecular weight polyamine, which will be described later, so that an isocyanate group remains, that is, an isocyanate of polyisocyanate or a derivative thereof. Examples thereof include a polyol-modified product and a polyamine-modified product of isocyanate obtained by reacting a group in an excess ratio with respect to a hydroxyl group of a low molecular weight polyol or an amino group of a low molecular weight polyamine.

These organic polyisocyanate compounds may be used individually by 1 type, and may be used in combination of 2 or more type. Of the organic polyisocyanate compounds exemplified above, aromatic diisocyanates are preferred, and polymeric MDI is more preferred.
(adhesive)
In the adhesive comprising the release agent composition and the organic polyisocyanate compound, the total dry weight ratio of the active ingredient of the release agent composition and the organic polyisocyanate compound is in the range of 1:50 to 3000, preferably Is in the range of 1: 100-2000. When it exceeds 3000 parts by weight with respect to the total dry weight ratio of the organic polyisocyanate compound to 1 part by weight of the active ingredient of the release agent composition, it tends to be difficult to obtain a sufficient release effect, and is less than 50 parts by weight. Although good releasability is obtained, physical strength such as peel strength, water resistance and adhesion of the finished product after secondary processing is difficult to obtain. Further, when the amount is less than 50 parts by weight, the amount of the release agent composition in the adhesive is large, which is wasteful in cost.

  The use ratio of the adhesive to the lignocellulosic material or inorganic material is such that the organic polyisocyanate compound (D), which is an active ingredient in the adhesive, and the lignocellulosic material or inorganic material are in a total dry weight ratio of 2: 100 to It is in the range of 30: 100, preferably in the range of 3: 100 to 20: 100. If the organic polyisocyanate compound (D) is less than 2 parts by weight relative to 100 parts by weight of the lignocellulosic material or inorganic material, it tends to be difficult to obtain an effect as an adhesive, and 30 parts by weight provides sufficient board properties. Therefore, even if an amount of adhesive exceeding 30 parts by weight is used, it is wasteful in terms of cost and industry.

  In the present invention, a known mixer can be used when the organic polyisocyanate compound (D) and the water-dispersed release agent composition are mixed. In the present invention, the following mixer is used. It is preferable to do.

  The in-line mixer as a mixer that can be used in the present invention may be a static type mixer or a mechanical mixer having a rotor / stator in a pipeline. Furthermore, the type which collides and mixes each liquid by high pressure may be sufficient. Examples of each machine are the Kenix type for the static type, the Hydro shear made by Gorin, the Lamond mixer made by Lamond, the TK homomic line mill made by Special Machine Industries, the Ebara Milder made by Ebara Machinery, etc. can give. In the high pressure collision mixing type, a general polyurethane high pressure injection machine, high pressure foaming machine, or polyurethane high pressure spray coating machine can be substituted. Specific examples include MEG-HK series manufactured by Marukaka Koki and H-2000 manufactured by GUSMER. However, there are many types of mixers, and the present invention is not limited to the above mixers. In the case of a lignocellulosic board that uses waste chips as raw materials, such as particleboard, formaldehyde is not generated from the adhesive, but formaldehyde is generated from the waste chips that are raw materials. In addition, the adhesive described in the present invention may be used in combination with a conventional formaldehyde adhesive, and in this case, the emitted formaldehyde from the board is not zero. Therefore, in such a case, it is effective to add a formaldehyde catcher to the surface layer and / or the core layer for the purpose of reducing the formaldehyde. Any formaldehyde catcher is effective as long as it reacts with formaldehyde, and ammonium salts of acids, alkali metal sulfites, and the like are also effective. Of these, urea, guanylurea, melamine, ammonia and the like having an amino group are preferred. As a method of addition, it is sufficient if it is present in the board at the time of board production, it may be added in the adhesive, or it is also effective to add and mix the material element before drying and the material element in the blender.

  The organic polyisocyanate compound (D) in the present invention has an amine catalyst, a curing accelerator, an ultraviolet absorber, an antioxidant, a plasticizer, a silane coupling agent, and a metal catalyst depending on the purpose within a range not inhibiting the desired effect. Synthetic or natural rubber latex, acrylic emulsion, vinyl acetate emulsion, water-repellent agent, antifoaming agent and the like may be used in combination.

An embodiment will be described. Of course, the present invention is not limited to these examples.
<Example 1>
In Example 1, the production of the release agent composition of the present invention and its thermal stability performance will be described together with a comparative example.
(Preparation of polyester compound)
A polyhydric alcohol, a dibasic acid, and a saturated fatty acid are blended according to the contents of Table 1, and reacted at a reaction temperature of 160 to 200 ° C. and a reaction time of 8 to 10 hours using tetra-n-butyl orthotitanate as a catalyst. The polyester compound 1-4 of this invention shown in Table 1 was obtained. The polyester compound was measured for viscosity and number average molecular weight, and the results are also shown in Table 1.

The case of the polyester compound 5 for comparison is also shown in Table 1.
(Measurement method)
Viscosity: Viscosity at 120 ° C according to JIS K6662 Number average molecular weight: Monodispersed polystyrene equivalent molecular weight by gel permeation chromatography

（離型剤の製造）
上記のポリエステル化合物１を５００ｇと低密度ポリエチレン（日本精蝋製、商品名：ＷＥＩＳＳＥＮ−０４５３）５００ｇを２Ｌフラスコに入れ、オイルバスで８０℃まで加熱溶融し均一分散し、冷却して表２に示した実施例１−１のとおりの離型剤組成物を得た。

(Manufacture of release agent)
500 g of the above polyester compound 1 and 500 g of low density polyethylene (manufactured by Nippon Seiwa Co., Ltd., trade name: WEISSEN-0453) are placed in a 2 L flask, heated and melted to 80 ° C. in an oil bath, uniformly dispersed, and cooled to Table 2. A release agent composition as shown in Example 1-1 was obtained.

  Further, 180 g of each of the above polyester compounds 1 to 5 and 180 g of low density polyethylene (manufactured by Nippon Seiwa, trade name: WEISSEN-0453) are placed in a 2 L flask, and an α-olefin / maleic anhydride copolymer ( 40 g of Mitsubishi Chemical, trade name: Diacarna 30) was added, and the mixture was heated and melted to 80 ° C. in an oil bath. Separately, 580 g of distilled water was put into a 1 L beaker, 20 g of morpholine (manufactured by Nippon Dispersant) was added, and this was heated to 80 ° C. in an oil bath. Next, the aqueous morpholine solution was added to the flask while stirring the solution of the polyester compound or the like. After the addition of the aqueous morpholine solution, the aqueous dispersion was further emulsified with a homomixer (trade name: TK-1000, manufactured by Tokushu Kika Kogyo Co., Ltd.) to obtain a fine dispersion. % Of Example 2 to Example 1-5 in Table 2 and Comparative Example 1-1 were obtained.

  Furthermore, 500 g of the above polyester compound 5 and 500 g of low density polyethylene (manufactured by Nippon Seiwa Co., Ltd., trade name: WEISSEN-0453) are placed in a 2 L flask, heated to 80 ° C. in an oil bath, uniformly dispersed, cooled and compared. A release agent composition of Example 1-2 was obtained.

（熱安定性の評価）
熱盤上にコール盤を敷き、予め２２０℃に温めておいたコール盤上に実施例１−１から１−５並びに比較例１−１と１−２の離型剤組成物、さらには、ポリエステル化合物の調製で得られたポリエステル化合物１〜５、低密度ポリエチレン（日本精蝋製、商品名：ＷＥＩＳＳＥＮ−０４５３）の各々を５０ｇ載せガラス棒にて攪拌し、５ｃｍ各内に均一に延ばす、１時間放置し、離型剤組成物の粘性を観察した。それぞれ比較例１−３から１−８とした。均一に延ばした時の粘性と同等の場合「○」印で、増粘樹脂化が若干進みコール盤上から綿布にて（どうにか）拭き取れる場合「△」印、増粘し樹脂化が進みコール盤上から綿布にて拭き取れない場合「×」印で表３に表示した。

(Evaluation of thermal stability)
A release board composition of Examples 1-1 to 1-5 and Comparative Examples 1-1 and 1-2 was placed on a call board laid on a heating board and preheated to 220 ° C., 50 g of each of polyester compounds 1 to 5 and low density polyethylene (manufactured by Nippon Seiwa Co., Ltd., trade name: WEISSEN-0453) obtained by the preparation of the polyester compound are stirred with a glass rod and uniformly spread within 5 cm. After standing for 1 hour, the viscosity of the release agent composition was observed. These were designated as Comparative Examples 1-3 to 1-8, respectively. When it is equal to the viscosity when it is evenly stretched, it is marked with “○”, and the thickening resin progresses slightly. When it cannot be wiped off with cotton cloth from the board, it is displayed in Table 3 with “x” mark.

＜実施例２＞
実施例１において製造した離型剤組成物を用いてボードを製造した。以下、その例を説明する。
（ボード製造条件）
以下に性能評価用ボード製造条件を述べる。
原料：ファインチップ（表層用 鋸屑状の木片）、ストランドチップ（芯層用 ストランド状木片）、ロックウール それぞれ含水率３％に調整
設定厚み：１８ｍｍ
熱圧温度：２１０℃
プレス圧力：３．０ＭＰａ
プレス時間：４分
（実施例２−１）
ファインチップ固形分に対し、有機ポリイソシアネート（三井武田ケミカル（株）製 商品名コスモネート Ｍ−５０Ｗ）が１０％になる量を計量し、ファインチップ固形分に対し、マット含水率１２％になる量の水及び、内部離型剤として実施例１−２で得られた離型剤組成物有効成分で０．３％になる量の離型剤を混合し、それぞれをブレンダー中のファインチップへスプレーガンを用いて噴霧塗布した。噴霧後のチップを成型後のボード密度が０．７５になるよう計量し、予め１５０℃コール盤上に外部離型剤として実施例１−１で得られた離型剤組成物を均一塗布し冷却しておいた鋼製コール盤に上に４０ｃｍ×４０ｃｍの大きさに均一にフォーミングし、更に予め１５０℃コール盤上に外部離型剤として実施例１−１で得られた離型剤組成物を均一塗布し冷却しておいた鋼製のコール盤をかぶせ、上記ボード製造条件で熱圧プレスした。繰り返し１００回プレスしたが、熱盤への付着は全く認められなかったので試験を終え、離型試験に要したボード５枚を通風の良い所へ１週間放置後、後述評価試験を実施し、離型試験及び評価試験結果を表４に表示した。
（実施例２−２）
表層用ファインチップ固形分に対し、有機ポリイソシアネート（三井武田ケミカル（株）製 商品名コスモネート Ｍ−２５０Ｗ）が９％になるよう計量し、ファインチップ固形分に対し、マット含水率１２％になる量の水及び、内部離型剤として実施例１−３で得られた離型剤組成物有効成分で０．５％になる量の離型剤を混合し、それぞれをブレンダー中の表層用ファインチップへスプレーガンを用いて噴霧塗布した。

<Example 2>
A board was produced using the release agent composition produced in Example 1. Examples thereof will be described below.
(Board manufacturing conditions)
The board manufacturing conditions for performance evaluation are described below.
Ingredients: Fine tip (sawdust-like piece of wood for surface layer), strand tip (strand-like piece of wood for core layer), rock wool each adjusted to 3% moisture content Set thickness: 18mm
Hot pressure temperature: 210 ° C
Press pressure: 3.0 MPa
Press time: 4 minutes (Example 2-1)
The amount of organic polyisocyanate (trade name Cosmonate M-50W manufactured by Mitsui Takeda Chemical Co., Ltd.) is 10% of the fine chip solid content, and the mat moisture content is 12% of the fine chip solid content. An amount of water and 0.3% of the release agent composition active ingredient obtained in Example 1-2 as an internal release agent were mixed, and each was mixed into a fine chip in a blender. Spray application was performed using a spray gun. The chips after spraying are weighed so that the board density after molding becomes 0.75, and the release agent composition obtained in Example 1-1 is applied uniformly as an external release agent on a 150 ° C. call board in advance. Molding agent composition formed in Example 1-1 as an external mold release agent on a 150 ° C. call board in advance, uniformly formed into a 40 cm × 40 cm size on a cooled steel call board. A steel coal board that had been uniformly coated and cooled was covered and hot-pressed under the above board production conditions. Pressed 100 times repeatedly, but no adhesion to the heating plate was observed, so the test was finished, and after leaving the 5 boards required for the release test in a well-ventilated place for 1 week, the evaluation test described below was carried out. The release test and evaluation test results are shown in Table 4.
(Example 2-2)
Weighed organic polyisocyanate (trade name Cosmonate M-250W manufactured by Mitsui Takeda Chemical Co., Ltd.) to 9% with respect to fine chip solids for the surface layer. The amount of water and the amount of release agent 0.5% of the active ingredient of the release agent composition obtained in Example 1-3 as an internal release agent are mixed, and each is used for the surface layer in the blender. Spray coating was applied to the fine tip using a spray gun.

  Subsequently, it measured so that organic polyisocyanate (Brand name Cosmonate M-250W by Mitsui Takeda Chemical Co., Ltd.) might be 6% with respect to the strand chip solid content for core layers, and it was a mat | matte moisture content with respect to the strand chip solid content. A 6% amount of water was weighed, and each was spray-coated onto a fine tip for a core layer in a blender using a spray gun.

The chip after spraying is weighed so that the board density after molding is 0.75, the surface layer is 40% solid weight, and the core layer is 60% solid weight. Further, a half amount of the surface layer fine chip, the core layer strand chip, and a half amount of the surface layer fine chip which were previously weighed were uniformly formed in this order, further covered with a steel caul board, and hot-pressed under the above board manufacturing conditions. Pressed 100 times repeatedly, but no adhesion to the heating plate was observed, so the test was finished, and after leaving the 5 boards required for the release test in a well-ventilated place for 1 week, the evaluation test described below was carried out. The release test and evaluation test results are shown in Table 4.
(Example 2-3)
Weigh so that the organic polyisocyanate (trade name Cosmonate M-50 manufactured by Mitsui Takeda Chemical Co., Ltd.) is 12% of the rock wool solids for the surface layer, and the mat moisture content is 12% of the fine chip solids. The amount of water and the amount of the release agent that is 0.4% of the active ingredient of the release agent composition obtained in Example 1-4 as the internal release agent are mixed, and each is used for the surface layer in the blender. The rock wool was sprayed using a spray gun.

  Subsequently, it measured so that organic polyisocyanate (Brand name Cosmonate M-50 made by Mitsui Takeda Chemical Co., Ltd.) might be 5% with respect to the strand chip solid content for the core layer, and the mat moisture content with respect to the strand chip solid content. An amount of water of 5.5% was weighed, and each was spray-coated on a fine tip for a core layer in a blender using a spray gun.

The chip after spraying is weighed so that the board density after molding is 0.75, the surface layer is 35% as solid weight, and the core layer is 65% as solid weight. Further, half of the surface rock fool weighed in advance, the core layer strand chip, and half of the surface rock wool were uniformly formed in this order, and further covered with a steel caul board, and hot-pressed under the above board production conditions. Pressed 100 times repeatedly, but no adhesion to the heating plate was observed, so the test was finished, and after leaving the 5 boards required for the release test in a well-ventilated place for 1 week, the evaluation test described below was carried out. The release test and evaluation test results are shown in Table 4.
(Example 2-4)
The amount of organic polyisocyanate (trade name Cosmonate M-300 manufactured by Mitsui Takeda Chemical Co., Ltd.) is 9.5% with respect to the strand chip solid content, and the mat moisture content is 10% with respect to the strand chip solid content. The amount of water and the release agent composition active ingredient obtained in Example 1-5 as an internal release agent were mixed with 0.3% of the release agent, and each was mixed with a fine in the blender. The tip was spray applied using a spray gun. The chip after spraying is weighed so that the board density after molding becomes 0.75, and the release agent composition obtained in Example 1-5 is uniformly applied as an external release agent on a 150 ° C. call board in advance. Molding agent composition obtained in Example 1-5, which was uniformly formed into a size of 40 cm × 40 cm on a cooled steel call board, and was previously used as an external release agent on a 150 ° C. call board. A steel coal board that had been uniformly coated and cooled was covered and hot-pressed under the above board production conditions. Repeated pressing 100 times, but no adhesion to the hot plate was observed, so the test was completed, and after leaving the 5 boards required for the mold release test in a well-ventilated place for 1 week, an evaluation test described below was conducted. The mold test and evaluation test results are shown in Table 4.
(Example 2-5)
The amount of organic polyisocyanate (trade name Cosmonate M-250W manufactured by Mitsui Takeda Chemical Co., Ltd.) is 11% of the fine chip solid content, and the mat moisture content is 12% of the fine chip solid content. The amount of water and 0.4% of the active ingredient of the release agent composition obtained in Example 1-1 that had been finely pulverized to 0.7 mm or less using a pulverizer in advance was mixed with a homomixer (special The product was dispersed in water with a product name of KK-1000 manufactured by Meika Kogyo Co., Ltd., and each was spray-coated onto a fine chip in a blender using a spray gun. The chips after spraying are weighed so that the board density after molding becomes 0.75, and the release agent composition obtained in Example 1-1 is applied uniformly as an external release agent on a 150 ° C. call board in advance. Molding agent composition formed in Example 1-1 as an external mold release agent on a 150 ° C. call board in advance, uniformly formed into a 40 cm × 40 cm size on a cooled steel call board. A steel coal board that had been uniformly coated and cooled was covered and hot-pressed under the above board production conditions. Pressed 100 times repeatedly, but no adhesion to the heating plate was observed, so the test was finished, and after leaving the 5 boards required for the release test in a well-ventilated place for 1 week, the evaluation test described below was carried out. The release test and evaluation test results are shown in Table 4.
(Comparative Example 2-1)
The internal mold release agent of Example 2-1 was homogenized with polyester compound 3 obtained by preparing a polyester compound finely pulverized to 0.7 mm or less in advance using a pulverizer and water having a mat moisture content of 12%. Disperse in water using a mixer (trade name: TK-1000, manufactured by Tokushu Kika Kogyo Co., Ltd.), spray each of them onto a fine chip in a blender using a spray gun, and use a polyester compound as an external release agent. A similar test was performed except that the polyester compound 3 obtained in the preparation was used. It started to adhere slightly to the surface of the call board from around the 40th press, and since it adhered to the surface of the call board considerably in the 45th time, the test was finished. Furthermore, although it was hot-pressed using a different call board, it adhered slightly to the surface of the call board from around the 40th press as in the first test, and considerably adhered to the surface of the call board in the 46th time. Times. The five boards required for the release test were left in a well-ventilated place for 1 week, and then an evaluation test described later was performed. The release test and the evaluation test results are shown in Table 4.
(Comparative Example 2-2)
As the internal mold release agent of Example 2-1, low density polyethylene (manufactured by Nippon Seiwa Co., Ltd., trade name: WEISSEN-0453), which had been finely pulverized to 0.7 mm or less in advance using a pulverizer, was previously finely pulverized. Water with a water content of 12% is dispersed with a homomixer (trade name: TK-1000, manufactured by Tokushu Kika Kogyo Co., Ltd.), and each is spray-coated onto a fine chip in a blender using a spray gun. Then, the same test was carried out except that low density polyethylene (manufactured by Nippon Seiwa, trade name: WEISSEN-0453) was used as the external mold release agent. It started to adhere slightly to the surface of the call board from around the 60th press, and since it adhered to the surface of the call board considerably at the 64th time, the test was finished. Furthermore, although it was hot-pressed using a different call board, it slightly adhered to the surface of the call board from around the 60th press as in the first test, and considerably adhered to the surface of the call board in the 65th test. Times. The five boards required for the release test were left in a well-ventilated place for 1 week, and then an evaluation test described later was performed. The release test and the evaluation test results are shown in Table 4.
(Comparative Example 2-3)
A similar test was conducted except that the internal release agent and the external release agent of Example 2-1 were not used. Although it adhered to the surface of the call board from the first time and peeled off the board, the board was broken into two from the core layer part. Furthermore, although it was hot-pressed using a different caul board, it adhered to the surface of the caul board from the first press and peeled off the board as in the first test, but the board was broken into two from the core layer part. Therefore, the test was completed and the number of mold releases was one. Since the board was broken into two from the core layer, the physical property evaluation test was abandoned.
(Comparative Example 2-4)
A similar test was conducted except that the release agent composition of Comparative Example 1-1 was used as the internal release agent of Example 2-2. Slight adhesion to the surface of the call board was observed from the first press, but the test was continued, and it adhered more firmly than the second press, and the board was peeled off. It broke into one. Furthermore, hot press was performed using a different caul board, but as with the first test, the second press was stubbornly adhered to the surface of the caul board and the board was peeled off. Therefore, the test was finished and the number of mold release was set to 2 times. Since the board was broken into two from the core layer, the physical property evaluation test was abandoned.
(Comparative Example 2-5)
The release agent composition of Comparative Example 1-2 that had been finely pulverized to 0.7 mm or less in advance using the pulverizer for the internal release agent of Example 2-1, and Comparative Example 1-2 as the external release agent. A similar test was conducted except that the release agent composition was used. Slight adhesion to the surface of the call board was recognized from the first press, but the degree of adhesion increased each time the test was repeated and the press was repeated. The board broke in two from the core layer. In addition, hot press using a different call board, the degree of adhesion increased with each press as in the first test, and the work adhered more firmly than the third press, and the board was peeled off. Since it was cracked in two from the layer part, the test was finished and the number of mold release was set to three. Since the board was broken into two from the core layer, the physical property evaluation test was abandoned.
(Evaluation test)
Evaluation was performed according to the test item “Particle Board JIS-A-5908” from the samples obtained in Examples and Comparative Examples.
1. Bending strength Ten test pieces were cut into 50 mm width and 320 mm length (span 270 mm) from the boards obtained in the examples and comparative examples, and the bending strength test was performed. The results are shown in Table 4 as the average bending strength of 10 pieces.
2. Wet bending strength (A test)
Ten test pieces were cut into a board obtained in Examples and Comparative Examples having a width of 50 mm and a length of 320 mm (span 270 mm). Next, after measuring the thickness of the cut board, the test piece was immersed in warm water of 70 ± 3 ° C. for 2 hours and immersed in normal temperature water for 1 hour. After measuring the thickness of the board in the wet state, a bending strength test was performed. The results are shown in Table 4 as the average wet A bending strength of 10 pieces and the change in thickness of 10 pieces after water absorption as 70 ° C. water absorption thickness expansion coefficient.
3. 20 ° C. water absorption thickness expansion coefficient Ten test pieces having a width of 50 mm and a length of 50 mm were cut from the boards obtained in Examples and Comparative Examples. Next, after measuring the thickness of the cut board, the test piece was immersed in water at 20 ± 3 ° C. for 24 hours. The board thickness was measured while still wet. The average value of 10 pieces of thickness change after water absorption is shown in Table 4 as 20 ° C. water absorption thickness expansion coefficient.
4). Releasability test At the time of hot pressing, a steel call board was used, and the adhesion state of the chip to the call board of the hot pressing board was visually confirmed. This operation was repeated up to 100 times, and the number of times until adhesion was confirmed was recorded. In the case of 100 times or more, “○” mark is shown. When adhesion is confirmed, “x” and the number of times adhesion is confirmed are shown in Table 4.

Claims (7)

  The molar ratio of polyhydric alcohol (A), dibasic acid (B) and saturated fatty acid (C) is (A) :( B) :( C) = 1: 0.5-1: 2-3 Release comprising the polyester compound (I) produced by the reaction and the low density polyethylene (II) in a weight ratio of (I) :( II) = 1: 4 to 4: 1 Agent composition.   The release agent composition according to claim 1, wherein the viscosity of the polyester compound (I) at 120 ° C is in the range of 15 to 100 mPa · s.   The release agent composition according to claim 1, wherein the number average molecular weight (Mn) of the polyester compound (I) by gel permeation chromatography is in the range of 2500 to 5000 in terms of monodisperse polystyrene.   A release agent composition according to any one of claims 1 to 3, wherein the release agent composition is dispersed in water.   An adhesive comprising the release agent composition according to claim 1 and an organic polyisocyanate compound (D).   5. A method for producing a board by hot-pressing a molding material comprising lignocellulose, an inorganic material or a mixture thereof, wherein the release board is a coking board using the release agent composition according to claim 1 as an external release agent. Or the manufacturing method of the board characterized by apply | coating to a call board and the surface of a hot-press press, and hot-press-molding.   7. The method according to claim 6, wherein the release agent composition according to any one of claims 1 to 4 is mixed with the molding material together with the organic polyisocyanate compound (D) and hot-press molded. Manufacturing method.