JP2007222963A - Working fluid supply device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a working fluid supply device, using a working fluid filling up a container, and performing replacement work without suspending machining work in replacing with a new container filled with a working fluid. <P>SOLUTION: The working fluid supply device for supplying a working fluid to a workpiece machined by a machining device includes: two working fluid containers; a first pump for delivering a working fluid stored in one of the two working fluid containers; a second pump for delivering a working fluid stored in the other working fluid container; a storage container for storing the working fluid delivered by the first pump and the second pump; a first water level detecting sensor, a second water level detecting sensor and a third water level detecting sensor which detect the water level of the working fluid stored in the storage container; and a control means. The control means stops the operation of one of the active first pump and the second pump when a detection signal is input from the third water level detecting sensor, or operates the other of the inactive first pump and the second pump. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a machining fluid supply device that is provided in a machining device such as a cutting device that cuts a workpiece such as a semiconductor wafer and supplies a machining fluid to a machining portion.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of a sapphire substrate are also divided into individual optical devices such as light emitting diodes and laser diodes by cutting along the streets, and are widely used in electrical equipment. ing.

  Cutting along the streets of the above-described semiconductor wafer, optical device wafer or the like is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a semiconductor wafer, a cutting means having a cutting blade for cutting the workpiece held on the chuck table, and supplying cutting water to the cutting blade. The cutting water is supplied to the cutting blade that rotates by supplying the processing water to the cutting blade that rotates, and the cutting water is supplied to the cutting portion of the workpiece by the cutting blade. Carry out cutting work.

There is a problem in that the water ejected from the nozzle of the processing water supply means is charged during the cutting described above, and the device formed on the surface of the wafer causes electrostatic breakdown. In order to solve this problem, a processing method has been proposed in which additives such as carbon dioxide and a surfactant are mixed in the processing water to prevent the processing water from being charged. (For example, see Patent Document 1 and Patent Document 2.)
JP-A-63-28608 JP-A-3-227556

  However, when a workpiece such as a wafer is cut with a cutting blade, cutting waste is generated, and this cutting waste adheres to the surface of the wafer, thereby degrading the quality of the device. In order to solve such a problem, the present applicant has applied a processing method in which an anionic or cationic additive is mixed in the processing water to prevent cutting chips from adhering to the surface of the wafer. Japanese Patent Application No. 2004-347209 And proposed as Japanese Patent Application No. 2004-354069.

  Thus, if the additive mixed in the processing water is consumed and the additive container is emptied, the processing operation must be interrupted when the container is replaced with a new container filled with additive. There is a problem that is bad.

  The present invention has been made in view of the above facts, and the main technical problem thereof is that when the processing liquid contained in the container is consumed and the container becomes empty, a new container filled with the processing liquid is used. An object of the present invention is to provide a machining liquid supply device capable of performing a replacement operation without interrupting the processing operation when the replacement is performed.

In order to solve the main technical problem, according to the present invention, in a processing liquid supply apparatus for supplying a processing liquid to a workpiece processed by a processing apparatus,
At least two processing liquid containers, a first pump for sending out the processing liquid stored in one of the two processing liquid containers, and a processing liquid stored in the other processing liquid container A second pump, a storage container for storing the processing liquid respectively sent by the first pump and the second pump, and a processing liquid sending means for sending the processing liquid stored in the storage container; A first water level detection sensor for detecting a full water level of the processing liquid stored in the storage container; a second water level detection sensor for detecting an appropriate lower limit water level of the processing liquid stored in the storage container; and the storage container On the basis of detection signals from the third water level detection sensor for detecting the limit water level of the processing fluid stored in the first liquid level, the first water level detection sensor, the second water level detection sensor, and the third water level detection sensor. The first pump and Comprising a control means for controlling the second pump, and
When the detection signal is input from the first water level detection sensor, the control unit stops the operation of one of the first pump and the second pump that is operating, and from the second water level detection sensor When a detection signal is inputted, one of the first pump and the second pump which are stopped when the detection signal is inputted from the first water level detection sensor is operated, and the third water level detection sensor is operated. When the detection signal is inputted from the first pump, the first pump or the second pump that is operating is stopped and the other one of the first pump or the second pump that is not operating is operated. Squeeze,
A working fluid supply apparatus is provided.

An alarm device is provided for alarming that the working fluid stored in the storage container has reached the limit water level, and the control means activates the alarm device when a detection signal is input from the third water level detection sensor.
The two machining fluid containers contain a machining fluid as an additive, and the machining fluid delivery means sends out the machining fluid stored in the storage container, and the flow regulation pump delivers the machining fluid. A mixing chamber for mixing the processed liquid, and main processing liquid supply means for supplying the main processing liquid to the mixing chamber. The main processing liquid and the processing liquid are mixed in the mixing chamber.
The main machining fluid supply means is provided with a flow meter for detecting the flow rate of the main machining fluid, and the control means controls the flow rate adjusting pump based on a signal from the flow meter.
The processing fluid as the additive is an organic additive such as anionic, cationic or nonionic, or an inorganic additive such as ammonia, and the main processing fluid is pure water.

  In the machining fluid supply apparatus according to the present invention, when the detection signal is input from the third water level detection sensor, the operation of one of the first pump or the second pump that is operating is stopped and the operation is stopped. When the other one of the first pump or the second pump is operated and the processing liquid stored in the first processing liquid container or the second processing liquid container is consumed and emptied, Since the processing liquid container for supplying the processing liquid to the storage container is switched, one of the empty processing liquid containers is replaced with a new processing liquid container filled with the processing liquid without interrupting the operation of the processing apparatus. be able to.

  Hereinafter, a preferred embodiment of a working fluid supply apparatus constructed according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a cutting apparatus equipped with a machining fluid supply apparatus constructed according to the present invention. The cutting device in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 for holding a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 31 is provided with a clamp 33 for fixing a support frame for supporting a semiconductor wafer, which will be described later, as a workpiece through a protective tape. The chuck table 3 configured as described above can be moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  The cutting apparatus in the illustrated embodiment includes a spindle unit 4 as cutting means. The spindle unit 4 is moved in an index feed direction indicated by an arrow Y in FIG. 1 by an index feed means (not shown), and is moved in a cut feed direction indicated by an arrow Z in FIG. 1 by a notch feed means (not shown). ing. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction, and the spindle housing 41 is freely rotatable. And a cutting blade 43 attached to the front end of the rotating spindle 42. As shown in FIG. 2, for example, the cutting blade 43 has a disk-shaped base 431 formed of aluminum, and diamond abrasive grains are solidified by nickel plating on the outer peripheral side surface of the base 431 to a thickness of 15 to 30 μm. The grinding wheel portion 432 is formed.

  Continuing with reference to FIG. 2, a blade cover 44 covering the upper half of the cutting blade 43 is attached to the front end of the spindle housing 41. The blade cover 44 includes a first cover member 441 mounted on the spindle housing 41 and a second cover member 442 mounted on the first cover member 441 in the illustrated embodiment. A female screw hole 441a and two positioning pins 441b are provided in the side surface of the first cover member 441, and an insertion hole 442a is provided in a position corresponding to the female screw hole 441a in the second cover member 442. It has been. Further, on the surface of the second cover member 442 facing the first cover member 441, two recesses (not shown) into which the two positioning pins 441b are fitted are formed. The first cover member 441 and the second cover member 442 configured in this way are provided with two recesses (not shown) formed in the second cover member 442 provided in the first cover member 441. The positioning is performed by fitting to the positioning pin 441b. Then, the fastening bolt 443 is inserted into the insertion hole 442a of the second cover member 442, and is screwed into the female screw hole 441a provided in the first cover member 441, whereby the second cover member 442 is engaged with the first cover member 442. The cover member 441 is attached.

  Processing liquid supply pipes 451 and 452 are disposed on the first cover member 441 and the second cover member 442 constituting the blade cover 44, respectively. The upper ends of the machining liquid supply pipes 451 and 452 are connected to a machining liquid supply apparatus 5 described later. Connected to the lower ends of the machining fluid supply pipes 451 and 452 are nozzles 461 and 462 that are respectively disposed on both sides of the grinding wheel portion 432 of the cutting blade 43 and inject the machining fluid toward both side surfaces of the grinding stone portion 432. .

  When the description continues with reference to FIG. 2, the machining liquid supply apparatus 5 in the illustrated embodiment stores a main machining liquid tank 51 that stores pure water as the main machining liquid, and the machining liquid from the main machining liquid tank 51. A main machining liquid feed pump 52 to be fed and a machining liquid feed pipe 53 for feeding the machining liquid sent from the main machining liquid feed pump 52 to the machining liquid supply pipes 451 and 452 are provided. The main machining liquid tank 51, the main machining liquid delivery pump 52, and the machining liquid delivery pipe 53 function as main machining liquid supply means for supplying pure water as the main machining liquid. Further, the machining liquid supply device 5 in the illustrated embodiment includes a first machining liquid container 54a and a second machining liquid container 54b that contain the machining liquid mixed into the main machining liquid sent from the main machining liquid delivery pump 52. A first pump 55a (P1) for sending out the processing liquid stored in the first processing liquid container 54a, and a second pump 55b for sending out the processing liquid stored in the second processing liquid container 54b. (P2), a storage container 56 for storing the processing liquid sent from each of the first pump 55a (P1) and the second pump 55b (P2), and the processing liquid stored in the storage container 56 A machining fluid delivery means 57 for mixing with the main machining fluid delivered from the main machining fluid delivery pump 52 is provided.

  The first machining fluid container 54a and the second machining fluid container 54b are provided for preventing the cutting waste generated when the workpiece is cut by the cutting blade 43 from adhering to the surface of the workpiece. Contains additives. As this additive, for example, an organic additive such as anionic, cationic or nonionic, or an inorganic additive such as ammonia can be used. In the storage container 56, a first water level detection sensor 56a (SW1) for detecting the full water level of the processing liquid stored in the storage container 56 and an appropriate lower limit water level of the processing liquid stored in the storage container 56 are detected. And a third water level detection sensor 56c (SW3) for detecting the limit water level of the working fluid stored in the storage container 56. In the illustrated embodiment, the first water level detection sensor 56a (SW1), the second water level detection sensor 56b (SW2), and the third water level detection sensor 56c (SW3) are ON in the state where they are in contact with the machining fluid. However, it is turned OFF when it is not touching the machining fluid, and outputs ON and OFF signals to the control means 20 described later. The machining fluid delivery means 57 includes a flow rate adjustment pump 571 for delivering the machining fluid stored in the storage container 56, and a machining fluid delivered by the flow rate adjustment pump 571 from the main machining fluid delivery pump 52. It comprises a mixing chamber 572 for mixing with the processing liquid.

  The machining fluid supply device 5 in the illustrated embodiment includes a flow meter 58 that detects the flow rate of the main machining fluid delivered by the main machining fluid delivery pump 52, and the flow meter 58 outputs the detected flow rate signal to be described later. Output to the control means 20. The control means 20 inputs detection signals from the first water level detection sensor 56a (SW1), the second water level detection sensor 56b (SW2), the third water level detection sensor 56c (SW3), and the flow meter 58, Control signals are output to the main machining fluid delivery pump 52, the first pump 55a (P1), the second pump 55b (P2), the flow rate adjustment pump 571, and the alarm device 59 (AL).

The machining fluid supply device 5 in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
When the main machining liquid delivery pump 52 is operated to supply pure water as the main machining liquid stored in the main machining liquid tank 51 to the nozzles 461 and 462, the first pump 55a (P1) or The second pump 55 b (P 2) is operated to send the processing liquid as an additive contained in the first processing liquid container 54 a or the second processing liquid container 54 b to the storage container 56. When the liquid level of the processing liquid introduced into the storage container 56 reaches the first water level detection sensor 56a (SW1) that detects the full water level, the first pump 55a (P1) or the second pump 55b (P2 ) Is stopped. Next, the main machining liquid delivery pump 52 is operated to deliver pure water as the main machining liquid stored in the main machining liquid tank 51, and the flow rate adjustment pump 571 is operated to be stored in the storage container 56. The processing fluid as an additive is sent out. The pure water as the main working liquid sent out by the main working liquid sending pump 52 and the working liquid as the additive sent out by the flow rate adjusting pump 571 are mixed in the mixing chamber 572, and the mixed working liquid is sent out as the working liquid. It is supplied to the nozzles 461 and 462 through the pipe 53 and the machining liquid supply pipes 451 and 452. When supplying the machining fluid, the flow rate of the pure water as the main machining fluid is detected by the flow meter 58, and the detection signal is sent to the control means 20. The control means 20 calculates the supply amount of the machining fluid as the additive based on the flow signal from the flow meter 58, and controls the flow rate adjustment pump 571 based on the calculation result. The supply amount of pure water as the main processing liquid may be about 2 liters / minute, for example, and the supply amount of the processing liquid as additives may be about 0.2 to 2 cc / minute.

  If the above-described supply of the processing liquid is continued, the processing liquid in the storage container 56 decreases, so it is necessary to replenish the processing liquid stored in the first processing liquid container 54a or the second processing liquid container 54b. . Further, when the processing liquid stored in the first processing liquid container 54a or the second processing liquid container 54b is consumed and emptied, it is necessary to replace it with a new processing liquid container filled with the processing liquid. . Hereinafter, the replenishment of the machining fluid and the operation when one of the machining fluid containers becomes empty will be described with reference to the flowchart of FIG.

  The control means 20 first checks whether or not the first water level detection sensor 56a (SW1) is ON (step S1). If the first water level detection sensor 56a (SW1) is ON in step S1, the control means 20 determines that the liquid level of the processing liquid introduced into the storage container 56 has reached the full water level, and proceeds to step S2. Then, an OFF signal is output to the first pump 55a (P1) and the second pump 55b (P2). As a result, the operation of one of the operating first pump 55a (P1) or second pump 55b (P2) is stopped. And the control means 20 returns to said step S1.

  If the first water level detection sensor 56a (SW1) is not ON in step S1, the control means 20 determines that the liquid level of the processing liquid introduced into the storage container 56 is lower than the full water level, and step S3. Then, it is checked whether the second water level detection sensor 56b (SW2) is OFF. If the second water level detection sensor 56b (SW2) is not OFF in step S3, the control means 20 determines that the liquid level of the processing liquid introduced into the storage container 56 is between the full water level and the appropriate lower limit water level. Return to step S1.

  If the second water level detection sensor 56b (SW2) is OFF in step S3, the control means 20 determines that the level of the processing liquid introduced into the storage container 56 has fallen below the appropriate lower limit water level, and the process proceeds to step S4. It is checked whether or not the container flag is set, that is, whether the container flag is “0” or “1”. If the container flag is not set in step S4 ("0"), the control means 20 determines that the processing liquid container that is currently supplying the processing liquid to the storage container 56 is the first processing liquid container 54a. In step S5, the first pump 55a (P1) is operated. On the other hand, when the container flag is set in step S4 ("1"), the processing liquid container that is currently supplying the processing liquid to the storage container 56 is the second processing liquid container 54b. The process proceeds to step S6, where the second pump 55b (P2) is operated.

  Next, the control means 20 proceeds to step S7 and checks whether or not the third water level detection sensor 56c (SW3) is ON. If the 3rd water level detection sensor 56c (SW3) is not OFF in step S7, the control means 20 will judge that the process liquid stored in the storage container 56 has not reached the limit water level, and the 1st pump 55a ( P1) or the second pump 55b (P2) is operated, and the process returns to step S1.

  If the third water level detection sensor 56c (SW3) is OFF in step S7, the control means 20 determines that the working fluid stored in the storage container 56 has fallen below the limit water level, and proceeds to step S8. Check whether the container flag is “0” or “1”. If the container flag is “0” in step S8, the control means 20 is currently supplying the machining fluid from the first machining fluid container 54a, but the machining fluid stored in the storage container 56 is at the critical water level. Since it is lower, it is determined that the machining fluid in the first machining fluid container 54a has been consumed and emptied, and the process proceeds to step S9 to stop the first pump 55a (P1) and the second pump 55b (P2). Activate the. As a result, the processing liquid stored in the second processing liquid container 54b is supplied to the storage container 56 by the second pump 55b (P2).

  Next, the control means 20 proceeds to step S10 to set the container flag to “1”, further proceeds to step S11 to activate (ON) the alarm device 59 (AL), and the processing liquid container is emptied to the operator. Let me know.

On the other hand, when the container flag is “1” in step S8, the control means 20 is currently supplied with the processing liquid from the second processing liquid container 54b, but the processing liquid stored in the storage container 56 is not stored. Since it is below the limit water level, it is determined that the machining fluid in the second machining fluid container 54b has been consumed and emptied, the process proceeds to step S12, the second pump 55b (P2) is stopped, and the first pump 55a ( Activate P1). As a result, the processing liquid stored in the first processing liquid container 54a is supplied to the storage container 56 by the first pump 55a (P1). Then, the control means 20 proceeds to step S13 to set the container flag to “0”, and further proceeds to step S11 to activate (ON) the alarm device 59 (AL).
When the alarm device 59 (AL) is activated in this manner, the operator replaces one of the emptied processing liquid containers with a new processing liquid container filled with the processing liquid.

  As described above, in the machining liquid supply device 5 in the illustrated embodiment, when the machining liquid stored in the first machining liquid container 54a or the second machining liquid container 54b is consumed and emptied, Since the processing liquid container for supplying the processing liquid to the storage container 56 is switched, one empty processing liquid container is replaced with a new processing liquid container filled with the processing liquid without interrupting the operation of the cutting apparatus. be able to.

  Referring back to FIG. 1, the description of the cutting apparatus in the illustrated embodiment is for imaging the surface of the workpiece held on the chuck table 3 and detecting a region to be cut by the cutting blade 43. The imaging means 6 is provided. The imaging means 6 is composed of optical means such as a microscope and a CCD camera. In addition, the cutting apparatus includes a display unit 7 that displays an image captured by the imaging unit 6.

  In the cassette mounting area 8a of the apparatus housing 2, a cassette mounting table 8 for mounting a cassette for storing a workpiece is disposed. The cassette mounting table 8 is configured to be movable in the vertical direction by a lifting means (not shown). On the cassette mounting table 8, a cassette 9 for storing a semiconductor wafer 10 as a workpiece is placed. The semiconductor wafer 10 accommodated in the cassette 9 has a grid-like street formed on the surface thereof, and devices such as IC and LSI are formed in a plurality of rectangular areas partitioned by the grid-like street. The semiconductor wafer 10 thus formed is accommodated in the cassette 9 with the back surface adhered to the front surface of the protective tape 12 mounted on the annular support frame 11.

  Further, the cutting device in the illustrated embodiment is a semiconductor wafer 10 accommodated in a cassette 9 placed on a cassette placement table 8 (a state in which the wafer is supported on an annular frame 11 via a protective tape 12). The unloading means 14 for unloading the semiconductor wafer 10 onto the temporary table 13, the transporting means 15 for transporting the semiconductor wafer 10 unloaded onto the temporary table 13 onto the chuck table 3, and the semiconductor wafer 10 cut on the chuck table 3. Cleaning means 16 for cleaning the semiconductor wafer 10 and cleaning transport means 17 for transporting the semiconductor wafer 10 cut on the chuck table 3 to the cleaning means 16.

A cutting procedure for cutting the semiconductor wafer 10 along a predetermined street using the cutting apparatus configured as described above will be briefly described.
The semiconductor wafer 10 (supported by the annular frame 11 via the protective tape 12) accommodated in a predetermined position of the cassette 9 placed on the cassette placement table 8 is moved by an elevator means (not shown). The mounting table 8 is moved to the carry-out position by moving up and down. Next, the unloading means 14 moves forward and backward, and the semiconductor wafer 10 positioned at the unloading position is unloaded onto the temporary placement table 13. The semiconductor wafer 10 carried out to the temporary placement table 13 is transferred onto the chuck table 3 by the turning operation of the transfer means 15. When the semiconductor wafer 10 is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the semiconductor wafer 10 on the chuck table 3. The support frame 11 that supports the semiconductor wafer 10 via the protective tape 12 is fixed by the clamp 33. In this way, the chuck table 3 holding the semiconductor wafer 10 is moved to a position directly below the imaging means 6. When the chuck table 3 is positioned immediately below the image pickup means 6, the street formed on the semiconductor wafer 10 is detected by the image pickup means 6, and the spindle unit 4 is moved and adjusted in the arrow Y direction as an indexing direction to cut the street and the cutting. A precision alignment operation with the blade 43 is performed.

  Thereafter, the cutting blade 43 is cut and fed by a predetermined amount in the direction indicated by the arrow Z and rotated in the predetermined direction, while the chuck table 3 holding the semiconductor wafer 10 is sucked and held in the direction indicated by the arrow X (cutting blade 43). The semiconductor wafer 10 held on the chuck table 3 is cut along a predetermined street by the cutting blade 43 (cutting process). In this cutting process, the machining fluid supply device 5 is operated and the machining fluid is sprayed from the nozzles 461 and 462 toward the side surface of the grindstone portion 432 of the cutting blade 43. When the semiconductor wafer 10 is cut along a predetermined street in this way, the chuck table 3 is indexed and fed in the direction indicated by the arrow Y by the street interval, and the above-described cutting process is performed. When the cutting process is performed along all the streets extending in the predetermined direction of the semiconductor wafer 10, the chuck table 3 is rotated 90 degrees to extend in a direction orthogonal to the predetermined direction of the semiconductor wafer 10. By executing the cutting process along the streets, all the streets formed in a lattice shape on the semiconductor wafer 10 are cut and divided into individual chips. Note that the divided chips do not fall apart due to the action of the protective tape 12, and the state of the wafer supported by the frame 11 is maintained. The machining fluid sprayed from the nozzles 461 and 462 in the above-described cutting process is for preventing the cutting waste generated at the time of cutting from adhering to the surface of the workpiece in the pure water as the main machining fluid as described above. Since it is a processing liquid in which an additive is mixed, cutting waste does not adhere to the surface of the semiconductor wafer 10.

  As described above, when the cutting process is completed along the street of the semiconductor wafer 10, the chuck table 3 holding the semiconductor wafer 10 is first returned to the position where the semiconductor wafer 10 is sucked and held. Then, the suction holding of the semiconductor wafer 10 is released. Next, the semiconductor wafer 10 is transferred to the cleaning unit 16 by the cleaning transfer unit 17. The semiconductor wafer 10 conveyed to the cleaning means 16 is cleaned and dried here. The semiconductor wafer 10 thus cleaned and dried is transported to the temporary placement table 13 by the transport means 15. Then, the semiconductor wafer 10 is stored in a predetermined position of the cassette 9 by the unloading means 14.

  As mentioned above, although this invention was demonstrated based on embodiment of illustration, this invention is not limited only to embodiment, In the range of the meaning of this invention, various deformation | transformation are possible. For example, in the illustrated embodiment, the example in which the machining fluid supply device according to the present invention is applied to a cutting device has been shown. However, the present invention may be applied to a grinding device that grinds the back surface of a wafer.

The perspective view of the cutting device equipped with the machining fluid supply apparatus comprised according to this invention. 1 is a block configuration diagram of a machining fluid supply device configured according to the present invention. The flowchart which shows the operation | movement procedure of the control means which comprises the machining fluid supply apparatus by this invention.

Explanation of symbols

2: Device housing 3: Chuck table 4: Spindle unit 43: Cutting blade 44: Blade cover 461, 462: Nozzle 5: Processing fluid supply device 51: Main processing fluid tank 52: Main processing fluid delivery pump 53: Processing fluid delivery tube 54a: first processing liquid container 54b: second processing liquid container 55a: first pump (P1)
55b: Second pump (P2)
56: Storage container 56a: First water level detection sensor (SW1)
56b: Second water level detection sensor (SW2)
56c: Third water level detection sensor (SW3)
57: Processing fluid delivery means 571: Flow rate adjusting pump 572: Mixing chamber 58: Flow meter 59: Alarm (AL)
6: Imaging means 7: Display means 8: Cassette mounting table 9: Cassette 10: Semiconductor wafer (workpiece)
11: annular support frame 12: protective tape 13: temporary placement table 14: carry-out means 15: transport means 16: cleaning means 17: cleaning transport means 20: control means

Claims (5)

In a processing liquid supply apparatus that supplies a processing liquid to a workpiece processed by the processing apparatus,
At least two processing liquid containers, a first pump for sending out the processing liquid stored in one of the two processing liquid containers, and a processing liquid stored in the other processing liquid container A second pump, a storage container for storing the processing liquid respectively sent by the first pump and the second pump, and a processing liquid sending means for sending the processing liquid stored in the storage container; A first water level detection sensor for detecting a full water level of the processing liquid stored in the storage container; a second water level detection sensor for detecting an appropriate lower limit water level of the processing liquid stored in the storage container; and the storage container On the basis of detection signals from the third water level detection sensor for detecting the limit water level of the processing fluid stored in the first liquid level, the first water level detection sensor, the second water level detection sensor, and the third water level detection sensor. The first pump and Comprising a control means for controlling the second pump, and
When the detection signal is input from the first water level detection sensor, the control unit stops the operation of one of the first pump and the second pump that is operating, and from the second water level detection sensor When a detection signal is inputted, one of the first pump and the second pump which are stopped when the detection signal is inputted from the first water level detection sensor is operated, and the third water level detection sensor is operated. When the detection signal is inputted from the first pump, the first pump or the second pump that is operating is stopped and the other one of the first pump or the second pump that is not operating is operated. Squeeze,
A machining fluid supply apparatus characterized by the above.   An alarm device that warns that the working fluid stored in the storage container has reached a limit water level, and the control means activates the alarm device when a detection signal is input from the third water level detection sensor; The machining fluid supply device according to claim 1. The two processing fluid containers contain processing fluid as an additive,
The working fluid delivery means includes a flow rate adjusting pump for sending the working fluid stored in the storage container, and a mixing chamber for mixing the working fluid sent by the flow rate adjusting pump.
The machining fluid supply device according to claim 1, further comprising main machining fluid supply means for supplying a main machining fluid to the mixing chamber, wherein the main machining fluid and the machining fluid are mixed in the mixing chamber.   4. The main machining fluid supply means is provided with a flow meter for detecting the flow rate of the main machining fluid, and the control means controls the flow rate adjusting pump based on a signal from the flow meter. Processing fluid supply device.   The processing fluid according to claim 3 or 4, wherein the processing fluid as the additive is an organic additive such as anionic, cationic, or nonionic or an inorganic additive such as ammonia, and the main processing fluid is pure water. Feeding device.

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