JP2007222900A - Soldering machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering machine which can suppress the generation of unevenness on the surface of a molten solder jetted from a nozzle, and can perform soldering of high quality. <P>SOLUTION: A metal plate 50 is provided inside a cylinder body 22 of a nozzle 21 having a certain opening area, specifically, an opening area of 1,200 mm<SP>2</SP>or larger among a plurality of nozzles 21 of a solder storing body 16. This can damp a stream of a molten solder 14 to be sent in the cylinder body 22 from a storing space 18 via a through hole 27 formed in a support plate 19, specifically the stream of the molten solder 14 directing to the vertical one end part 22a from the vertical the other end part 22b, so that the generation of unevenness is suppressed on the surface of the molten solder 14 jetted from the hole 23 for attaching the nozzle 21. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a soldering apparatus that locally solders an object.

  When an electronic component is locally soldered to an object such as a printed wiring board, a local soldering apparatus is used. As a local soldering device, the motor is driven to rotate the impeller at a predetermined number of revolutions, the molten solder in the solder tank is made to flow and fed to the nozzle, and the molten solder is ejected from the opening of the nozzle. There is a soldering device called a jet type (hereinafter referred to as a “jet type soldering device”) in which an object is brought into contact with a jet portion of molten solder that has been ejected and soldered.

  Moreover, as a local soldering device other than the jet-type soldering device, the height of the molten solder ejected from the openings of the plurality of nozzles by the pressure of pumping the molten solder from the solder bath and pushing the molten solder by the pump, respectively There is a soldering apparatus (hereinafter referred to as “non-jet type soldering apparatus”) in which molten solder is brought into contact with an object and soldered while being held constant.

  Among the above-mentioned local soldering devices, particularly in the jet-type soldering device, pulsation occurs in the molten solder passing through the nozzle due to pressure fluctuations in the portion where the molten solder is fed to the nozzle, and the nozzle is ejected from the nozzle opening. There is a problem that irregularities occur in the surface portion of the molten solder (hereinafter, sometimes referred to as “soldering surface portion”). In order to solve this problem, Patent Documents 1 and 2 disclose that the molten solder is provided by arranging a rectifying plate in which holes are formed at appropriate intervals in a solder inner tank provided in the solder tank. A technique is shown in which rectification is performed at the stage before flowing into the nozzle to suppress the occurrence of pulsation. Patent Document 3 discloses a technique for fixing a rectifying plate having a large number of holes in a nozzle and rectifying molten solder pumped by a pump.

JP 2000-133927 A Japanese Patent Laid-Open No. 2000-200696 Japanese Patent Application Laid-Open No. 8-64952

  FIG. 1 is a cross-sectional view showing a nozzle 1 of a prior art non-jet soldering apparatus. FIG. 2 is a right side view showing the nozzle 1. The nozzle 1 has a nozzle body 2 formed in a cylindrical shape having both ends opened. The nozzle 1 avoids the one end portion 3 and has an ejection hole 4 formed in the vicinity of the one end portion 3. The nozzle 1 is supplied so that the molten solder 5 reaches the one end portion 3 in a state where the molten solder 5 is ejected from the ejection hole 4 and does not overflow from the one end portion 3. Configured to solder.

  The non-jet type soldering device has unevenness on the soldering surface compared to the jet type soldering device that drives the motor and rotates the impeller at a predetermined rotational speed to feed molten solder to the nozzle. Hard to occur. Here, since the lead-free solder, so-called lead-free solder, has a tin (Sn) concentration as high as about 97% compared to tin-lead (Sn—Pb) eutectic solder, the solder flow tends to be disturbed. The surface tension is also considered low. Therefore, even in a non-jet type soldering apparatus, when lead-free solder is used as the molten solder, the molten solder 5 supplied from one end 3 of the nozzle 1 is compared with the case where eutectic solder is used. As shown in FIG. 2, irregularities as shown in FIG.

  In a non-jet type soldering apparatus, a nozzle having a relatively large opening area requires a higher motor driving speed because a larger amount of molten solder flows into the nozzle than a nozzle having a relatively small opening area. is there. When molten solder having a high flow rate flows into the nozzle, the flow rate is suppressed by the resistance of the molten solder staying in the nozzle, but the flow rate can be suppressed as the flow rate of molten solder flowing into the nozzle increases. The pressure of the molten solder flowing from the other end of the nozzle to the one end increases. Therefore, as in Patent Documents 1 and 2, there is a problem in that it is not possible to suppress the occurrence of unevenness on the soldered surface portion only by rectifying by the rectifying plate at the stage before the molten solder flows into the nozzle.

  Furthermore, due to the occurrence of irregularities on the soldering surface, when more than the required amount of molten solder comes into contact with the target substrate, the copper in the land portion of the substrate reacts with the tin contained in the molten solder. Is eroded and defects occur in the soldered substrate. This causes a problem that the quality of the soldered substrate is deteriorated.

  In Patent Document 3, since the opening area of the nozzle is not taken into consideration when the rectifying plate is provided in the nozzle, the rectifying plate is used even for a nozzle having a relatively small nozzle opening area in which unevenness does not occur on the soldering surface portion of the nozzle. There is a problem that the number of manufacturing steps and the manufacturing cost increase.

  The objective of this invention is providing the soldering apparatus which can suppress generation | occurrence | production of the unevenness | corrugation of the surface part of the molten solder ejected from a nozzle, and can perform high quality soldering.

  According to the present invention, a solder reservoir is provided in a solder tank in which molten solder is stored. The solder reservoir is provided with a solder reservoir. A support plate is provided in the solder storage tank, and forms a storage space for storing molten solder in cooperation with the solder storage tank. The support plate is provided with a plurality of nozzles for attaching the molten solder stored in the storage space to the object. The flow of the molten solder supplied to the nozzle from the storage space can be attenuated by the attenuating means provided in the nozzle having a predetermined opening area among the plurality of nozzles.

  According to the present invention, the nozzle having a predetermined opening area among the plurality of nozzles is provided with the attenuating means for attenuating the flow of the molten solder, so that the flow of the molten solder supplied from the storage space to the nozzle is attenuated. be able to. Therefore, it can suppress that an unevenness | corrugation generate | occur | produces in the surface part of the molten solder supplied from the opening part of the nozzle which has a predetermined opening area among several nozzles. Thereby, the molten solder ejected from the opening of the nozzle can be firmly and suitably attached to the object, and high-quality soldering can be performed.

  Hereinafter, a plurality of modes for carrying out the present invention will be described. In the following description, portions corresponding to the matters described in advance are denoted by the same reference numerals, and redundant description may be omitted. When only a part of the configuration is described, the other parts of the configuration are the same as the parts described in advance.

  FIG. 3 is a cross-sectional view showing the soldering apparatus 10 including the solder reservoir 16 according to the first embodiment of the present invention. FIG. 4 is an enlarged cross-sectional view showing the vicinity of the hole 11 a of the substrate 11. The soldering apparatus 10 locally has a molten solder 14 (hereinafter simply referred to as “solder”) with respect to an individual object such as a printed wiring board (hereinafter also referred to as “soldering object”). ) Is used for soldering. The soldering apparatus 10 includes a solder tank 15 and a solder reservoir 16 in which molten solder 14 is stored. The solder reservoir 16 is provided in the solder bath 15. The solder storage body 16 is provided in the solder storage tank 17 in which the molten solder 14 is stored and the solder storage tank 17, and cooperates with the solder storage tank 17 to form a storage space 18 in which the molten solder 14 is stored. It has a support plate 19 and a plurality of nozzles 21 that are provided on the support plate 19 and adhere the molten solder 14 stored in the storage space 18 to the object. 3 and FIG. 5 and FIG. 6 to be described later, a solder reservoir 16 having two nozzles 21 is shown for easy understanding. The nozzle 21 constitutes a portion to which the molten solder 14 is attached in the soldering apparatus 10. The arrangement positions of the plurality of nozzles 21 provided on the support plate 19 are determined according to the soldering object. When the object to be soldered changes, the support plate 19 and the nozzle 21 provided on the support plate 19 can be replaced accordingly.

  In the solder tank 15, for example, the heater is controlled by the control means so that the temperature detected by the temperature sensor is maintained at a temperature suitable for predetermined soldering, for example, 260 degrees, and the molten solder 14 is stored. Yes. Similarly to the solder tank 15, the solder storage tank 17 stores molten solder 14 that is maintained at a temperature suitable for soldering. The solder (in this embodiment, the solidified solder is given the same reference numeral as the molten solder) 14 is a lead-free solder that does not contain lead.

  The soldering apparatus 10 is used, for example, to form a control circuit board mounted on an automobile. Specifically, the soldering apparatus 10 causes the lead 12a to be inserted into the hole 11a of the substrate 11 and attaches the molten solder 14 to the hole 11a using the precursor on which the electronic component 12 is mounted as an object. Thus, as shown in FIG. 4, the lead 12a is soldered to the hole 11a so as to fill the gap between the hole 11a of the substrate 11 and the lead 12a. Land portions 13 are formed on one surface portion facing the hole portion 11 a of the substrate 11, an end portion near the hole portion 11 a of the substrate 11, and both surface portions in the thickness direction of the substrate 11. The land portion 13 is a copper foil and has a substantially C-shaped cross section as shown in FIG.

  The nozzle 21 draws up the molten solder 14 stored in the storage space 18 and adheres it to the hole 11 a of the substrate 11. The nozzle 21 has a cylindrical cylindrical body 22 with both ends 22a and 22b in the vertical direction open, and an attachment hole 23 that opens to the outside is formed. Further, on both side portions of the cylindrical body 22 in the width direction, ejection holes 24 are formed in the vicinity of the vertical end portion 22a, avoiding the vertical end portion 22a. The ejection hole 24 is formed to have a diameter dimension such that the liquid level of the molten solder 14 supplied into the cylindrical body 22 does not drop in the other direction in the vertical direction. The diameter dimension of the ejection hole 24 is 4 mm, for example. The nozzle 21 is supplied so that the molten solder 14 reaches the one end 22 a in the vertical direction in a state where the molten solder 14 is ejected from the ejection hole 24 and does not overflow from the adhesion hole 23. The electronic component 12 is configured to be soldered.

  In the present embodiment, the ejection hole 24 ejects a part of the molten solder 14 flowing into the cylindrical body 22 and returns to the solder tank so that the temperature of the molten solder 14 supplied to the nozzle 21 does not decrease. It is formed for the purpose of maintaining the temperature.

  FIG. 5 is an exploded perspective view showing a part of the solder reservoir 16. Referring also to FIG. 3, the solder reservoir 16 is formed with a solder reservoir 17, a nozzle 21 having a rectangular cylindrical body 22 that is open at both ends 22 a and 22 b in the vertical direction, and a through hole 27. And a support plate 19. The solder storage tank 17 is a substantially rectangular parallelepiped housing and has a storage tank opening 26 that opens to one side in the vertical direction. The support plate 19 is detachably provided so as to close the storage tank opening 26 of the solder storage tank 17. The nozzle 21 is provided on the support plate 19. More specifically, the nozzle 21 may be provided integrally with the support plate 19 or may be provided detachably on the support plate 19. In the nozzle 21, the other end 22 b in the vertical direction is connected to the support plate 19, and the space in the cylindrical body 22 is formed by the solder reservoir 17 and the support plate 19 through the through hole 27 and the reservoir opening 26. It is provided so as to continue to the storage space 18. The support plate 19 forms a storage space 18 in cooperation with the solder storage tank 17, and transfers the molten solder 14 fed into the cylindrical body 22 from the vertical end 1 a of the cylindrical body 22 to the other vertical end. It is not lowered in the direction toward the portion 22b.

  Further, as described above, a plurality of ejection holes 24 are formed in the vicinity of one end portion 22a in the vertical direction of the cylinder body 22 on both sides in the width direction of the cylinder body 22. In the present embodiment, in order to facilitate understanding, in FIG. 5, three ejection holes 24 are shown on one side and the other side in the width direction of the cylindrical body 22.

  The soldering apparatus 10 has a drive source 30 and a pump 31. The drive source 30 is realized by a servo motor. The pump 31 has a cylindrical part 32 and a movable part 33. The cylindrical portion 32 is formed in a cylindrical shape having both ends opened, and is provided in a part of the solder storage tank 17. The movable portion 33 is connected to the rotation shaft of the drive source 30 and is provided so as to be displaced in the vertical direction along the inner peripheral wall of the cylindrical portion 32. When the rotational force from the drive source 30 is transmitted to the movable portion 33, the movable portion 33 can be driven up and down along the inner peripheral wall of the cylindrical portion 32.

  More specifically, the movable portion 33 is displaced in a downward direction from one side to the other in the vertical direction, thereby applying pressure to the molten solder 14 stored in the storage space 18, and causing the molten solder 14 to move from the solder storage tank 17. The molten solder 14 can be ejected from the attachment hole 23 and the ejection hole 24 of the nozzle 21 by being fed into the cylindrical body 22 of the nozzle 21 through the storage tank opening 26 and the through hole 27.

  FIG. 6 is a cross-sectional view showing the soldering device 10 in a state in which a portion where the attachment hole 23 of the soldering device 10 is formed appears upward from the liquid level 35 of the molten solder 14 stored in the solder bath 15. is there. The soldering apparatus 10 has an in / out means 36 (not shown in FIGS. 3 to 6) described later, and a part in which the attachment hole 23 of the nozzle 21 is formed is stored in the solder tank 15 by the in / out means 36. The molten solder 14 is made to appear and disappear. Specifically, the portion where the attachment hole 23 of the nozzle 21 is formed is immersed below the liquid level 35 of the molten solder 14 stored in the solder bath 15 as shown in FIG. As shown in FIG. 4, the state is changed to a state in which the molten solder 14 stored in the solder bath 15 protrudes upward from the liquid level 35.

  In the present embodiment, the in / out means 36 is a means for moving the solder reservoir 16 up and down with respect to the solder bath 15. Accordingly, the intruding means 36 extends the solder reservoir 16 from the immersion position 37 to the appearance position 38 and the immersion position 37 from the appearance position 38 over the immersion position 37 shown in FIG. 3 and the appearance position 38 shown in FIG. In the downward direction A2 toward 37, the displacement is driven.

  As shown in FIG. 3, the soldering apparatus 10 is configured such that the substrate 11 on which the electronic component 12 to be soldered is mounted is connected to the hole 11 a and the leads in a state where the solder reservoir 16 is disposed at the immersion position 37. An actuator 41, which will be described later, is held above the solder bath 15 so that 12a is positioned above the cylinder 22 in which the attachment hole 23 of the nozzle 21 is formed. In this state, the solder reservoir 16 is raised by the intruding means 36 and moved to the appearance position 38. As a result, the molten solder 14 is drawn up from the storage space 18, and the molten solder 14 is attached to the hole 11 a and the lead 12 a of the substrate 11 through the attachment hole 23. It can be soldered in this way.

  FIG. 7 is a perspective view showing the intruding means 36 in a simplified manner. The in / out means 36 includes a support body 40 that supports the solder reservoir 16 and an actuator 41 that drives the support body 40 to be displaced. The support body 40 includes a pair of support beams 42 and 43 provided horizontally, and suspension members 44 and 45 connected to the support beams 42 and 43 and extending downward, and the lower ends of the suspension members 44 and 45. Is connected to the solder reservoir 16. As a result, the solder reservoir 16 can be suspended and supported by the support 40. The support body 40 is provided so as to be displaceable in the vertical direction.

  The actuator 41 is realized by a fluid pressure cylinder such as hydraulic pressure and pneumatic pressure. This fluid pressure cylinder may be a single-acting type or a double-acting type. In the actuator 41, the cylinder tube is connected to a fixed position such as a floor, and the piston rod is connected to the support body 40. Accordingly, the solder reservoir 16 can be driven up and down by driving the support 40 up and down by the actuator 41.

FIG. 8 is a cross-sectional view showing a part of the solder reservoir 16 of the present embodiment. The cross-sectional view of the solder reservoir 16 shown in FIG. 8 is a cross-sectional view seen from the section line III-III in FIG. In FIG. 8, the ejection holes 24 are omitted for easy understanding. The arrows shown in FIG. 8 indicate the direction in which the molten solder 14 flows (hereinafter sometimes referred to as “flow direction”). Among the plurality of nozzles 21 in the solder reservoir 16, the nozzle 21 having a relatively large opening area, specifically, the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more, is an intermediate portion in the vertical direction and is vertically A rectangular flat plate-like metal plate 50 is provided near the other end portion 22b in the direction. Specifically, the metal plate 50 is provided so as to be parallel to the support plate 19 and at a predetermined interval from one surface portion in the thickness direction of the support plate 19 to one side in the vertical direction. The length dimension h1 between the one surface portion in the vertical direction of the support plate 19 and the other surface portion in the vertical direction of the metal plate 50, in other words, one surface portion in the thickness direction of the support plate 19 and the other surface portion in the thickness direction of the metal plate 50 The length dimension h1 between is 10 mm.

One end portion in the longitudinal direction of the metal plate 50 is welded to one side portion in the longitudinal direction of the cylindrical body 22. Further, both end portions in the short direction of the metal plate 50 are welded to both side portions in the width direction of the cylindrical body 22. The metal plate 50 is provided such that the length dimension in the longitudinal direction of the metal plate 50 is shorter than the length dimension in the longitudinal direction of the cylindrical body 22. In the metal plate 50, the other end portion in the longitudinal direction of the metal plate 50 and the other end portion in the longitudinal direction of the cylindrical body 22 are provided with a predetermined interval w <b> 1 in the longitudinal direction of the cylindrical body 22. The predetermined interval w1 of the present embodiment is 10 mm when the opening area of the attachment hole 23 of the nozzle 21 is 3500 mm ² .

  The metal plate 50 is an attenuation unit that attenuates the flow of the molten solder 14, and is realized by a stainless steel plate (for example, SUS316). The length dimension t1 in the thickness direction of the metal plate 50 of the present embodiment is 1 mm. In the present embodiment, the length dimension h in the vertical direction of the cylindrical body 22 is 150 mm.

  In the position facing the metal plate 50 of the support plate 19, a plurality of through holes 27 that penetrate in the thickness direction in the present embodiment are formed at intervals in the longitudinal direction of the support plate 19. . In the present embodiment, the diameter of the through hole 27 is 4.3 mm.

  The molten solder 14 fed into the cylindrical body 22 of the nozzle 21 from the storage space 18 formed by the solder storage tank 17 and the support plate 19 through the through hole 27 is a metal as shown by arrows in FIG. After colliding with the plate 50 and the flow is attenuated, it passes through a gap between the other side in the longitudinal direction of the cylinder 22 and the other end in the longitudinal direction of the metal plate 50, and the other end 22 b in the vertical direction of the cylinder 22. Ascending in the direction toward the one end 22a in the vertical direction, and ejected from the attachment hole 23 and the ejection hole 24.

As described above, according to the present embodiment, among the plurality of nozzles 21 of the solder reservoir 16, a predetermined opening area, specifically, the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more, By providing the metal plate 50, the molten solder 14 fed into the cylindrical body 22 from the storage space 18 through the through holes 27 formed in the support plate 19 is moved from the vertical other end 22b to the vertical one end. It is possible to alleviate the flow when rising toward 22a. In other words, the flow of the molten solder 14, specifically, the flow of the molten solder 14 in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction can be attenuated. As a result, it is possible to suppress the occurrence of unevenness on the surface portion of the molten solder 14 ejected from the attachment hole 23 of the nozzle 21.

  Thus, since it can suppress that an unevenness | corrugation generate | occur | produces in the surface part of the molten solder 14 ejected from the hole 23 for adhesion, it can prevent the molten solder 14 more than a necessary amount contacting target objects, such as the board | substrate 11. It is possible to prevent the copper in the land portion 13 of the substrate 11 from reacting with the tin contained in the molten solder 14 to erode the copper and cause problems such as disconnection in the soldered substrate 11. In other words, the molten solder 14 ejected from the attachment hole 23 can be firmly and suitably attached to an object such as the substrate 11, and high-quality soldering can be performed.

Moreover, according to this Embodiment, an unevenness | corrugation tends to generate | occur | produce in the surface part of the molten solder 14 ejected from the hole 23 for adhesion among the some nozzles 21 with which the solder storage body 16 of the soldering apparatus 10 is equipped. Since the attenuating means is provided only in the nozzle 21, specifically, the nozzle 21 having an opening area of the attachment hole 23 of 1200 mm ² or more, the attenuating means is provided in all the nozzles 21 provided in the solder reservoir 16. In comparison with this, it is possible to reduce the number of manufacturing steps and the manufacturing cost of the solder reservoir 16 and the soldering apparatus 10 including the same.

  Next, a solder reservoir 55 according to a second embodiment of the present invention will be described. FIG. 9 is a cross-sectional view showing a part of the solder reservoir 55 according to the second embodiment of the present invention. The cross-sectional view of the solder reservoir 55 shown in FIG. 9 is a cross-sectional view taken along the section line III-III in FIG. In FIG. 9, the ejection holes 24 are omitted for easy understanding. The arrows shown in FIG. 9 indicate the flow direction of the molten solder 14. Since the solder reservoir 55 of the present embodiment is similar in configuration to the solder reservoir 16 of the first embodiment, the corresponding components are denoted by the same reference numerals, and only different configurations will be described. .

In the present embodiment, among the plurality of nozzles 21 in the solder reservoir 55, the nozzle 21 having a relatively large opening area, specifically, the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more is arranged in the vertical direction. A rectangular flat plate-like first metal plate 56 is provided at a portion near the other end 22b in the vertical direction, and a rectangular shape at a portion closer to the one end 22a in the vertical direction than the first metal plate 56. A flat second metal plate 57 is provided.

  The first metal plate 56 is provided so as to be parallel to the support plate 19 and at a predetermined interval from one surface portion in the thickness direction of the support plate 19 to one side in the vertical direction. A length dimension h11 between one surface portion in the vertical direction of the support plate 19 and the other surface portion in the vertical direction of the first metal plate 56, in other words, one surface portion in the thickness direction of the support plate 19 and the first metal plate 56. The length dimension h11 between the other surface portions in the thickness direction is 10 mm.

One end in the longitudinal direction of the first metal plate 56 is welded to one side in the longitudinal direction of the cylindrical body 22. Further, both end portions in the short direction of the first metal plate 56 are welded to both side portions in the width direction of the cylindrical body 22. The first metal plate 56 is provided so that the length dimension in the longitudinal direction of the first metal plate 56 is shorter than the length dimension in the longitudinal direction of the cylindrical body 22. The first metal plate 56 is provided such that the other end portion in the longitudinal direction of the first metal plate 56 and the other side portion in the longitudinal direction of the cylindrical body 22 are provided with a predetermined interval w11 in the longitudinal direction of the cylindrical body 22. Yes. The predetermined interval w11 of the present embodiment is 10 mm when the opening area of the attachment hole of the nozzle 21 is 3500 mm ² .

  The second metal plate 57 is provided so as to be parallel to the support plate 19 and at a predetermined interval from one surface portion in the thickness direction of the first metal plate 56 to one side in the vertical direction. A length dimension h12 between one surface portion in the vertical direction of the first metal plate 56 and another surface portion in the vertical direction of the second metal plate 57, in other words, one surface portion in the thickness direction of the first metal plate and the second surface portion. The length dimension h12 between the metal plate 57 and the other surface portion in the thickness direction is 10 mm.

The other end portion in the longitudinal direction of the second metal plate 57 is welded to the other side portion in the longitudinal direction of the cylindrical body 22. Both ends in the lateral direction of the second metal plate 57 are welded to both sides in the width direction of the cylindrical body 22. The second metal plate 57 is provided such that the longitudinal dimension of the second metal plate 57 is shorter than the longitudinal dimension of the cylindrical body 22. In the second metal plate 57, one end in the longitudinal direction of the second metal plate 57 and one side in the longitudinal direction of the cylindrical body 22 are provided with a predetermined interval w <b> 12 in the longitudinal direction of the cylindrical body 22. . The predetermined interval w12 of the present embodiment is 15 mm when the opening area of the attachment hole of the nozzle 21 is 3500 mm ² .

  The first and second metal plates 56 and 57 of the present embodiment are damping means for damping the flow of the molten solder 14, and are realized by a stainless steel plate (for example, SUS316). The length dimension t1 in the thickness direction of the first metal plate 56 and the length dimension t2 in the thickness direction of the second metal plate 57 of the present embodiment are each 1 mm. In the present embodiment, the length dimension h in the vertical direction of the cylindrical body 22 is 150 mm.

  The position of the support plate 19 facing the first metal plate 56 and the position facing the gap between the other longitudinal end of the first metal plate 56 and the other longitudinal end of the cylindrical body 22 are in the thickness direction. In the present embodiment, a plurality of through-holes 27 are formed at intervals in the longitudinal direction of the support plate 19. In the present embodiment, the diameter of the through hole 27 is 4.3 mm.

  The storage space 18 formed by the solder storage tank 17 and the support plate 19 is fed into the cylindrical body 22 of the nozzle 21 through the through hole 27 formed at a position facing the first metal plate 56 of the support plate 19. As shown by the arrow in FIG. 9, the melted solder 14 first collides with the first metal plate 56 to attenuate the flow, and then the other side in the longitudinal direction of the cylindrical body 22 and the first metal plate. The second metal plate 57 collides with the other end in the longitudinal direction of 56. The molten solder 14 that has collided with the second metal plate 57 passes between the first metal plate 56 and the second metal plate 57, and is disposed on one side in the longitudinal direction of the cylindrical body 22 and the second metal plate 57. It passes through the gap between the one end in the longitudinal direction, rises in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction, and is ejected from the attachment hole 23 and the ejection hole 24.

  Further, the cylinder of the nozzle 21 is formed through a through hole 27 formed at a position facing the gap between the other end in the longitudinal direction of the first metal plate 56 and the other side in the longitudinal direction of the cylindrical body 22 from the storage space 18. The molten solder 14 fed into the body 22 has a gap between the other side in the longitudinal direction of the cylindrical body 22 and the other end in the longitudinal direction of the first metal plate 56, as indicated by arrows in FIG. After passing through and colliding with the second metal plate 57, it passes between the first metal plate 56 and the second metal plate 57, and one side in the longitudinal direction of the cylindrical body 22 and the second metal plate 57 It passes through the gap between the one end in the longitudinal direction, rises in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction, and is ejected from the attachment hole 23 and the ejection hole 24.

As described above, according to the present embodiment, among the plurality of nozzles 21 of the solder reservoir 55, a predetermined opening area, specifically, the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more, By providing the first and second metal plates 56, 57, the molten solder 14 fed from the storage space 18 into the cylindrical body 22 through the through holes 27 formed in the support plate 19 can be moved in other directions. The flow force when rising from the end portion 22b toward the one end portion 22a in the vertical direction can be further relaxed than in the first embodiment in which one metal plate 50 is provided in the cylindrical body 22. In other words, the flow of the molten solder 14, more specifically, the flow of the molten solder 14 in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction is further improved than in the first embodiment. Can be attenuated.

  As a result, it is possible to further suppress the occurrence of irregularities in the surface portion of the molten solder 14 ejected from the adhesion hole 23 of the nozzle 21 as compared with the first embodiment. As a result, the same effect as in the first embodiment can be achieved.

  Next, a solder reservoir 60 according to a third embodiment of the present invention will be described. FIG. 10 is a cross-sectional view showing a part of a solder reservoir 60 according to the third embodiment of the present invention. The cross-sectional view of the solder reservoir 60 shown in FIG. 10 is a cross-sectional view seen from the section line III-III in FIG. In FIG. 10, the ejection holes 24 are omitted for easy understanding. The arrows shown in FIG. 10 indicate the flow direction of the molten solder 14. Since the solder reservoir 60 according to the present embodiment is similar in configuration to the solder reservoir 55 according to the second embodiment, the corresponding components are denoted by the same reference numerals, and only different components will be described. .

  In the present embodiment, one through hole 61 penetrating in the thickness direction is formed at a position facing the longitudinal end of the first metal plate 56 of the support plate 19. The diameter of the through hole 61 of the present embodiment is specifically set to 15 mm so that the diameter of the through hole 61 is larger than the diameter of the through hole 27 of the first and second embodiments described above. Is formed.

  The cylindrical body of the nozzle 21 through a through hole 61 formed at a position facing the longitudinal end of the first metal plate 56 of the support plate 19 from the storage space 18 formed by the solder storage tank 17 and the support plate 19. As shown by an arrow in FIG. 10, the molten solder 14 fed into 22 first collides with the first metal plate 56 and the flow is attenuated. The first metal plate 56 passes through a gap between the other ends in the longitudinal direction and collides with the second metal plate 57. The molten solder 14 that has collided with the second metal plate 57 passes between the first metal plate 56 and the second metal plate 57, and is disposed on one side in the longitudinal direction of the cylindrical body 22 and the second metal plate 57. It passes through the gap between the one end in the longitudinal direction, rises in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction, and is ejected from the attachment hole 23 and the ejection hole 24.

As described above, according to the present embodiment, as in the second embodiment, among the plurality of nozzles 21 of the solder reservoir 60, the nozzle 21 having a relatively large opening area, specifically, the opening area. First and second metal plates 56 and 57 are provided in the cylindrical body 22 of the nozzle 21 of 1200 mm ² or more. Further, a through hole 61 is formed at a position facing the longitudinal end of the first metal plate 56 of the support plate 19.

  Therefore, in the present embodiment, the cylindrical body 22 is provided through the through holes 61 formed in the support plate 19 from the storage space 18 as compared with the second embodiment in which the support plate 19 has a plurality of through holes 27 formed therein. It is possible to increase the distance of the path through which the molten solder 14 that has been fed into passes through the adhesion hole 23. Accordingly, it is possible to relieve the flow force when the molten solder 14 fed into the cylindrical body 22 rises from the vertical other end 22b toward the vertical one end 22a. In other words, the flow of the molten solder 14, specifically, the flow of the molten solder 14 in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction can be further attenuated.

  As a result, it is possible to further suppress the occurrence of unevenness on the surface portion of the molten solder 14 ejected from the attachment hole 23 of the nozzle 21. As a result, the same effect as in the first embodiment can be achieved.

  Next, a solder reservoir 65 according to a fourth embodiment of the present invention will be described. FIG. 11 is a cross-sectional view showing a part of a solder reservoir 65 according to the fourth embodiment of the present invention. The cross-sectional view of the solder reservoir 65 shown in FIG. 11 is a cross-sectional view seen from the section line III-III in FIG. FIG. 12 is a plan view showing the porous body 66. FIG. 13 is an enlarged plan view of section IV of FIG. FIG. 14 is an enlarged cross-sectional view showing a part of the nozzle 21 in the solder reservoir 65. The cross-sectional view of the nozzle 21 shown in FIG. 14 is a cross-sectional view seen from the cutting plane line III-III in FIG. In FIG. 11, the ejection holes 24 are omitted for easy understanding. The arrows shown in FIG. 11 indicate the flow direction of the molten solder 14.

Among the plurality of nozzles 21 in the solder reservoir 65, the nozzle 21 having a relatively large opening area, specifically, the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more, is an intermediate portion in the vertical direction and is vertically A rectangular flat plate-like porous body 66 is provided near the other end 22b in the direction. The porous body 66 is an attenuating means for attenuating the flow of the molten solder 14, and is realized by a punching metal made of a stainless steel plate (for example, SUS316). In the porous body 66, as shown in FIG. 12, a plurality of through holes 67 penetrating in the thickness direction are formed. The plurality of through holes 67 are formed in a circular shape. The through holes 67 formed in rows adjacent to each other are arranged in a staggered pattern as viewed from one thickness direction of the porous body 66. The diameter dimension d1 of the through hole 67 of the present embodiment is 2 mm.

  As shown in FIG. 13, the first to third through holes 67a to 67c adjacent to each other of the porous body 66 have a distance between the centers of the first through hole 67a and the second through hole 67b that is the second through hole. The holes are arranged so that the distance between the centers of the holes 67b and the third through holes 67c is equal to the distance between the centers of the first through holes 67a and the third through holes 67b. In the present embodiment, a length dimension p1 of a line segment (hereinafter referred to as “first line segment”) connecting the centers of the first through hole 67a and the second through hole 67b is 4 mm.

  An angle α1 formed by the first line segment and a line segment connecting the centers of the second through-hole 67b and the third through-hole 67c (hereinafter referred to as “second line segment”) is 45 degrees, An angle β1 formed by a line segment and a line segment connecting the centers of the third through-hole 67c and the first through-hole 67a (hereinafter referred to as “third line segment”) is 90 degrees. The angle γ1 formed with one line segment is 45 degrees.

  The distance between the centers of the second and third through holes 67b and 67c in the direction perpendicular to the first line segment, in other words, the straight line extending in parallel with the first line segment from the center of the third through hole 67c and the second line. The length dimension p2 of the line segment connecting the intersection of the straight line extending in the direction perpendicular to the first line segment from the center of the through hole 67b and the center of the second through hole 67b is 2 mm.

  The porous body 66 is provided so as to be parallel to the support plate 19 and at a predetermined interval from one surface portion in the thickness direction of the support plate 19 to one side in the vertical direction. The length dimension h21 between the one surface portion in the vertical direction of the support plate 19 and the multiple surface portions in the vertical direction of the porous body 66, in other words, one surface portion in the thickness direction of the support plate 19 and the other surface portion in the thickness direction of the porous body 66. The length dimension h21 between is 10 mm. The length dimension t21 in the thickness direction of the porous body 66 of the present embodiment is 1 mm. In the present embodiment, the length dimension h in the vertical direction of the cylindrical body 22 is 150 mm.

  As shown in FIG. 14, both ends in the longitudinal direction of the porous body 66 are formed in a taper shape that inclines toward the other end in the thickness direction, in other words, the other in the vertical direction of the cylindrical body 22. . As a result, the porous body 66 can be disposed at a predetermined position in the cylindrical body 22. When the high-temperature molten solder 14 is fed into the cylindrical body 22 in this state, both ends in the longitudinal direction of the porous body 66 are expanded by the heat of the molten solder 14, and the taper angle δ at both ends in the longitudinal direction is the molten solder. 14 is smaller than the taper angle before being fed into the cylindrical body 22. As a result, both ends in the longitudinal direction of the porous body 66 are securely locked to both sides in the longitudinal direction of the cylindrical body 22.

  The porous body 66 is provided so as to be detachable from the cylindrical body 22. More specifically, by cooling the high-temperature molten solder in the cylindrical body 22, both longitudinal ends of the porous body 66 are contracted, and the taper angles δ at both longitudinal ends of the porous body 66 are set at the time of thermal expansion. Larger than the taper angle. As a result, the locked state between the longitudinal ends of the porous body 66 and both longitudinal ends of the cylindrical body 22 can be released, and the porous body 66 can be easily detached from the cylindrical body 22. Since the porous body 66 can be easily detached from the cylindrical body 22, dirt such as oxide of solder attached to the porous body 66 can be easily removed.

  In the position of the support plate 19 facing the porous body 66, a plurality of through holes 27 that penetrate in the thickness direction in the present embodiment are formed at intervals in the longitudinal direction of the support plate 19. In the present embodiment, the diameter of the through hole 27 is 4.3 mm.

  The molten solder 14 fed from the storage space 18 formed by the solder storage tank 17 and the support plate 19 into the cylindrical body 22 of the nozzle 21 through the through hole 27 is formed in a portion other than the through hole 67 of the porous body 66. The flow is attenuated by collision or passing through the through hole 67 of the porous body 66 as indicated by arrows in FIG. The molten solder 14 whose flow has been attenuated rises in the direction from the other end 22 b in the vertical direction toward the one end 22 a in the vertical direction of the cylindrical body 22 and is ejected from the attachment hole 23 and the ejection hole 24.

As described above, according to the present embodiment, among the plurality of nozzles 21 of the solder reservoir 65, a predetermined opening area, specifically, in the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more, By providing the porous body 66, the molten solder 14 fed from the storage space 18 into the cylindrical body 22 through the through holes 27 formed in the support plate 19 from the vertical other end 22 b to the vertical one end. It is possible to alleviate the flow when rising toward 22a. In other words, the flow of the molten solder 14, specifically, the flow of the molten solder 14 in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction can be attenuated. As a result, it is possible to suppress the occurrence of unevenness on the surface portion of the molten solder 14 ejected from the attachment hole 23 of the nozzle 21. As a result, the same effect as in the first embodiment can be achieved.

  Next, a solder reservoir 70 according to a fifth embodiment of the present invention will be described. FIG. 15 is a cross-sectional view showing a part of a solder reservoir 70 according to the fifth embodiment of the present invention. The cross-sectional view of the solder reservoir 70 shown in FIG. 15 is a cross-sectional view taken along the section line III-III in FIG. In FIG. 15, the ejection holes 24 are omitted for easy understanding. The arrows shown in FIG. 15 indicate the flow direction of the molten solder 14. Since the solder reservoir 70 of the present embodiment is similar in configuration to the solder reservoir 65 of the fourth embodiment, the corresponding reference numerals are assigned to the corresponding components, and only different configurations will be described. .

In the present embodiment, among the plurality of nozzles 21 in the solder reservoir 70, the nozzle 21 having a relatively large opening area, specifically, the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more is arranged in the vertical direction. A rectangular porous plate-like first porous body 71 is provided at a portion near the other end portion 22b in the vertical direction, and a rectangular shape is disposed at a portion closer to the one end portion 22a in the vertical direction than the first porous body 71. A flat plate-like second porous body 72 is provided. The first and second porous bodies 71 and 72 are attenuating means for attenuating the flow of the molten solder 14, and are realized by a punching metal made of a stainless steel plate (for example, SUS316). In the first and second porous bodies 71 and 72, as shown in FIG. 12, a plurality of through holes 67 penetrating in the thickness direction are formed. The first and second porous bodies 71 and 72 have the same configuration as the porous body 66 of the above-described fourth embodiment.

  The first porous body 71 is provided so as to be parallel to the support plate 19 and at a predetermined interval from one surface portion in the thickness direction of the support plate 19 to one side in the vertical direction. A length dimension h31 between the one surface portion in the vertical direction of the support plate 19 and the other surface portion in the vertical direction of the first porous body 71, in other words, one surface portion in the thickness direction of the support plate 19 and the first porous body 71. The length dimension h31 between the other surface portions in the thickness direction is 10 mm.

  The second porous body 72 is provided so as to be parallel to the support plate 19 and at a predetermined interval from one surface portion in the thickness direction of the first porous body 71 to one side in the vertical direction. A length dimension h32 between one surface portion in the vertical direction of the first porous body 71 and another surface portion in the vertical direction of the second porous body 72, in other words, one surface portion in the thickness direction of the first porous body 71 and the first surface portion in the thickness direction. The length dimension h32 between the two porous bodies 72 in the thickness direction and the other surface portion is 10 mm. The length dimension t31 in the thickness direction of the first porous body 71 and the length dimension t32 in the thickness direction of the second porous body 72 of the present embodiment are each 1 mm. In the present embodiment, the length dimension h in the vertical direction of the cylindrical body 22 is 150 mm.

  The molten solder 14 fed from the storage space 18 formed by the solder storage tank 17 and the support plate 19 into the cylindrical body 22 of the nozzle 21 through the through-hole 27 is first the through hole 67 of the first porous body 71. The flow is attenuated by colliding with other parts or passing through the through hole 67 of the first porous body 71 as indicated by arrows in FIG. The molten solder 14 whose flow is attenuated by the first porous body 71 collides with a portion other than the through hole 67 of the second porous body 72, or as shown by an arrow in FIG. The flow is further attenuated by passing through the 72 through holes 67. The molten solder 14 whose flow is attenuated by the first and second porous bodies 71, 72 rises in the direction from the other end 22 b in the vertical direction toward the one end 22 a in the vertical direction of the cylindrical body 22, and the attachment hole 23. And it ejects from the ejection hole 24.

As described above, according to the present embodiment, among the plurality of nozzles 21 of the solder reservoir 70, in the cylindrical body 22 of the nozzle 21 having a predetermined opening area, specifically, an opening area of 1200 mm ² or more, By providing the first and second porous bodies 71 and 72, the molten solder 14 fed into the cylindrical body 22 from the storage space 18 through the through holes 27 formed in the support plate 19 is connected to the other end in the vertical direction. The flow force when rising from the portion 22b toward the one end portion 22a in the vertical direction can be further relaxed than in the fourth embodiment in which one porous body 66 is provided in the cylindrical body 22. In other words, the flow of the molten solder 14, more specifically, the flow of the molten solder 14 in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction is further increased than in the fourth embodiment. Can be attenuated.

  As a result, it is possible to further suppress the occurrence of irregularities in the surface portion of the molten solder 14 ejected from the attachment hole 23 of the nozzle 21 as compared with the fourth embodiment described above. As a result, the same effect as in the first embodiment can be achieved.

  Next, a solder reservoir 75 according to a sixth embodiment of the present invention will be described. FIG. 16 is a cross-sectional view showing a part of a solder reservoir 75 according to the sixth embodiment of the present invention. The cross-sectional view of the solder reservoir 75 shown in FIG. 16 is a cross-sectional view taken along the section line III-III in FIG. FIG. 17 is a plan view showing the second porous body 76. In FIG. 16, the ejection holes 24 are omitted for easy understanding. The arrows shown in FIG. 16 indicate the flow direction of the molten solder 14. Since the solder reservoir 75 of the present embodiment is similar in configuration to the solder reservoir 70 of the fifth embodiment, the corresponding components are denoted by the same reference numerals, and only different configurations will be described. .

In the present embodiment, among the plurality of nozzles 21 in the solder reservoir 75, a nozzle 21 having a relatively large opening area, specifically, a rectangular flat plate is provided in the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more. The first and second porous bodies 71 and 76 are provided at the same positions as in the fifth embodiment. The first and second porous bodies 71 and 76 are attenuating means for attenuating the flow of the molten solder 14, and are realized by a punching metal made of a stainless steel plate (for example, SUS316).

  The first porous body of the present embodiment has the same configuration as the first porous body 71 of the fifth embodiment described above. As shown in FIG. 17, the second porous body 76 has a plurality of through holes 67 penetrating in the thickness direction. The plurality of through holes 67 are formed in a circular shape. The through-holes 67 formed in rows adjacent to each other are arranged in a staggered pattern as viewed from one thickness direction of the second porous body 76. The through hole 67 formed in the first and second porous bodies 71 and 76 of the present embodiment has a diameter of 2 mm.

  The second porous body 76 is different from the first porous body 71 in the formation position of the through hole 67. Specifically, the through holes 67 of the second porous body 76 are different from the through holes 67 formed in parallel with the short direction of the first porous body 71 in the short direction of the first porous body 71. On the other hand, it is formed at a position displaced by a length dimension corresponding to the diameter dimension of the through hole 67.

  The molten solder 14 fed from the storage space 18 formed by the solder storage tank 17 and the support plate 19 into the cylindrical body 22 of the nozzle 21 through the through-hole 27 is first the through hole 67 of the first porous body 71. The flow is attenuated by colliding with other parts or passing through the through hole 67 of the first porous body 71 as indicated by arrows in FIG. The molten solder 14 whose flow is attenuated by the first porous body 71 collides with a portion other than the through hole 67 of the second porous body 76, or as shown by an arrow in FIG. The flow is further attenuated by passing through the through holes 67 of 76. The molten solder 14, whose flow is attenuated by the first and second porous bodies 71 and 76, rises in the direction from the other end 22 b in the vertical direction toward the one end 22 a in the vertical direction of the cylindrical body 22. And it ejects from the ejection hole 24.

As described above, according to the present embodiment, among the plurality of nozzles 21 of the solder reservoir 75, a predetermined opening area, specifically, in the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more, By providing the first and second porous bodies 71 and 76 in which the through holes 67 are formed at different positions, the through holes 67 are fed into the cylindrical body 22 from the storage space 18 through the through holes 27 formed in the support plate 19. When the molten solder 14 rises from the other end 22b in the vertical direction toward the one end 22a in the vertical direction, the first and second porous bodies in which the through holes 67 are formed in the cylindrical body 22 have the same position. Compared to the fifth embodiment in which 71 and 72 are provided, it can be relieved significantly. In other words, the flow of the molten solder 14, specifically, the flow of the molten solder 14 in the direction from the other end 22 b in the vertical direction toward the one end 22 a in the vertical direction is much higher than that in the fifth embodiment. Can be attenuated.

  As a result, it is possible to remarkably suppress the occurrence of irregularities in the surface portion of the molten solder 14 ejected from the attachment hole 23 of the nozzle 21. As a result, the same effect as in the first embodiment can be achieved.

  Next, a solder reservoir 80 according to a seventh embodiment of the present invention will be described. FIG. 18 is a cross-sectional view showing a part of a solder reservoir 80 according to the seventh embodiment of the present invention. The cross-sectional view of the solder reservoir 80 shown in FIG. 18 is a cross-sectional view seen from the section line III-III in FIG. FIG. 19 is a plan view showing the first porous body 81. FIG. 20 is an enlarged plan view of section VI of FIG. In FIG. 18, the ejection holes 24 are omitted for easy understanding. The arrows shown in FIG. 18 indicate the flow direction of the molten solder 14. Since the solder reservoir 80 according to the present embodiment is similar in configuration to the solder reservoir 70 according to the fifth embodiment, the corresponding reference numerals are assigned to the corresponding components, and only different configurations will be described. .

In the present embodiment, among the plurality of nozzles 21 in the solder reservoir 80, a nozzle 21 having a relatively large opening area, specifically, a rectangular flat plate is disposed in the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more. The first and second porous bodies 81 and 72 are provided at the same positions as the first and second porous bodies 71 and 72 of the fifth embodiment described above. The first and second porous bodies 81 and 72 are attenuating means for attenuating the flow of the molten solder 14, and are realized by a punching metal made of a stainless steel plate (for example, SUS316).

  In the first porous body 81 of the present embodiment, as shown in FIG. 19, a plurality of through holes 82 penetrating in the thickness direction are formed. The plurality of through holes 82 are formed in a circular shape. The through holes 82 formed in rows adjacent to each other are arranged in a staggered pattern as viewed from one thickness direction of the first porous body 81. The diameter dimension d2 of the through hole 82 formed in the first porous body 81 of the present embodiment is 3 mm. The second porous body has a configuration similar to that of the second porous body 72 of the fifth embodiment described above. The diameter of the through hole 67 formed in the second porous body 72 is 2 mm, which is different from the diameter of the through hole 82 formed in the first porous body 81.

  As shown in FIG. 20, the first to third through holes 82a to 82c adjacent to each other of the first porous body 81 have a distance between centers of the first through hole 82a and the second through hole 82b. The center distance between the two through holes 82b and the third through hole 82c and the distance between the centers of the first through hole 82a and the third through hole 82c are arranged to be equal to each other. In the present embodiment, the length dimension p11 of the first line segment connecting the centers of the first through hole 82a and the second through hole 82b is 6 mm.

  The angle α11 formed by the first line segment and the second line segment connecting the centers of the second through hole 82b and the third through hole 82c is 45 degrees, and the second line segment and the third through hole 82c. The angle β11 formed by the third line segment connecting the centers of the first through holes 82a is 90 degrees, and the angle γ11 formed by the third line segment and the first line segment is 45 degrees.

  The distance between the centers of the second and third through holes 82b and 82c in the direction perpendicular to the first line segment, in other words, a straight line extending in parallel with the first line segment from the center of the third through hole 82c and the second line. The length dimension p2 of the line segment connecting the intersection of the straight line extending in the direction perpendicular to the first line segment from the center of the through hole 82b and the center of the second through hole 82b is 3 mm.

  The molten solder 14 fed from the storage space 18 formed by the solder storage tank 17 and the support plate 19 into the cylindrical body 22 of the nozzle 21 through the through hole 27 is firstly the through hole 82 of the first porous body 81. The flow is attenuated by colliding with other parts or passing through the through hole 82 of the first porous body 81 as indicated by arrows in FIG. The molten solder 14 whose flow is attenuated by the first porous body 81 collides with a portion other than the through hole 67 of the second porous body 72, or as shown by an arrow in FIG. The flow is further attenuated by passing through the 72 through holes 67. The molten solder 14, whose flow is attenuated by the first and second porous bodies 81, 72, rises in the direction from the other end 22 b in the vertical direction toward the one end 22 a in the vertical direction of the cylindrical body 22. And it ejects from the ejection hole 24.

As described above, according to the present embodiment, among the plurality of nozzles 21 of the solder reservoir 80, a predetermined opening area, specifically, in the cylindrical body 22 of the nozzle 21 having an opening area of 1200 mm ² or more, By providing the first and second porous bodies 81 and 72 having different diameter dimensions of the through holes 82 and 67, the through holes 82 and 67 are fed into the cylindrical body 22 from the storage space 18 through the through holes 27 formed in the support plate 19. It is possible to alleviate the flow force when the molten solder 14 that is inserted rises from the other end 22b in the vertical direction toward the one end 22a in the vertical direction. In other words, the flow of the molten solder 14, specifically, the flow of the molten solder 14 in the direction from the other end 22b in the vertical direction toward the one end 22a in the vertical direction can be significantly attenuated.

  As a result, it is possible to remarkably suppress the occurrence of irregularities in the surface portion of the molten solder 14 ejected from the attachment hole 23 of the nozzle 21. As a result, the same effect as in the first embodiment can be achieved.

  Next, a solder reservoir 85 according to an eighth embodiment of the present invention will be described. FIG. 21 is a cross-sectional view showing a part of a solder reservoir 85 according to the eighth embodiment of the present invention. The cross-sectional view of the solder reservoir 85 shown in FIG. 21 is a cross-sectional view seen from the section line III-III in FIG. In FIG. 21, the ejection holes 24 are omitted for easy understanding. 21 represents the flow direction of the molten solder 14.

Of the plurality of nozzles 21 in the solder reservoir 85, the nozzle 21 having a relatively large opening area, specifically, the nozzle 21 having an opening area of 1200 mm ² or more includes a first protrusion 86 and a second protrusion 87. Yes. The first protrusion 86 is provided at the other end in the longitudinal direction of the cylindrical body 22 and at one end in the longitudinal direction, and the second protrusion 87 is disposed at the other end in the vertical direction of the cylindrical body 22 and at the other end in the longitudinal direction. Provided. The first and second projecting portions 86 and 87 are formed in a shape that curves so as to project outward, as viewed from one side in the width direction of the cylindrical body 22. The first and second projecting portions 86 and 87 are respectively connected to both side portions in the longitudinal direction of the cylindrical body 22.

  Guide holes 88 are formed in the other end 22b in the vertical direction on both sides of the cylindrical body 22 in the longitudinal direction. The guide hole 88 guides the molten solder 14 fed from the storage space 18 formed by the solder storage tank 17 and the support plate 19 through a through-hole 89 formed in the support plate 19 described later into the cylindrical body 22. Formed to do.

  At positions facing the first and second projecting portions 86 and 87 of the support plate 19, through-holes 89 penetrating in the thickness direction are formed. The diameter dimension of the through hole 89 of the present embodiment is 11 mm. In the present embodiment, the first and second protrusions 86 and 87 and the guide hole 88 are damping means for damping the flow of the molten solder 14.

  The molten solder 14 stored in the storage space 18 formed by the solder storage tank 17 and the support plate 19 is applied to the first and second protrusions 86 and 87 of the support plate 19 as indicated by arrows in FIG. It passes through each through-hole 89 formed at the facing position, and collides with the inner wall portions of the first and second projecting portions 86 and 87. As a result, the flow of the molten solder 14 is attenuated, and the flow direction of the molten solder 14 is changed. Specifically, the flow direction of the molten solder 14 is changed from the direction from the other in the vertical direction to the other in the direction from both longitudinal ends of the cylindrical body 22 to the central portion in the longitudinal direction.

  The molten solder 14 whose flow is attenuated and whose flow direction is changed passes through the guide holes 88 formed at both ends in the longitudinal direction of the cylindrical body 22 and is sent into the cylindrical body 22. The molten solder 14 fed into the cylinder 22 rises in the direction from the other end 22 b in the vertical direction toward the one end 22 a in the vertical direction, and is ejected from the attachment hole 23 and the ejection hole 24.

As described above, according to the present embodiment, among the plurality of nozzles 21 of the solder reservoir 85, the first nozzle 21 has a relatively large opening area, specifically, the nozzle 21 having an opening area of 1200 mm ² or more. By providing the second protrusions 86 and 87, the molten solder 14 that has passed through the through-hole 89 collides with the inner wall portions of the first and second protrusions 86 and 87, so the flow of the molten solder 14 is alleviated. In other words, the flow of the molten solder 14 can be attenuated.

  Further, by forming guide holes 88 at both longitudinal ends of the cylindrical body 22 and at the other end 22b in the vertical direction, the molten metal collides with the inner wall portions of the first and second projecting portions 86 and 87 to attenuate the flow. The solder 14 can be guided into the cylindrical body 22. Formed at the flow direction of the molten solder (hereinafter sometimes referred to as “first molten solder”) that has passed through the guide hole 88 formed at one end in the longitudinal direction of the cylindrical body 22 and at the other longitudinal end of the cylindrical body 22. The flow directions of the molten solder that has passed through the guide holes 88 (hereinafter sometimes referred to as “second molten solder”) are opposite to each other as indicated by arrows in FIG. Therefore, the first molten solder and the second molten solder are merged in the cylindrical body 22 to attenuate the flow of the first and second molten solders in the direction from the vertical other end 22b toward the vertical one end 22a. be able to.

  As a result, it is possible to suppress the occurrence of unevenness on the surface portion of the molten solder 14 ejected from the attachment hole 23 of the nozzle 21. As a result, the same effect as in the first embodiment can be achieved.

  In the following, in the fourth and sixth embodiments in which the porous body is provided in the cylindrical body 22 of the nozzle 21, unevenness is generated on the surface portion of the molten solder 14 ejected from the adhesion hole 23. In order to determine which form can be most suppressed, the result of soldering to the substrate 11 and measuring the amount of remaining copper in the land portion 13 formed on the substrate 11 will be described.

  The amount of remaining copper in the land portion 13 is measured, and as the measured amount of remaining copper is smaller, it is determined that unevenness is generated on the surface portion of the molten solder 14 ejected from the adhesion hole 23, and the inside of the cylindrical body 22 It is determined that the molten solder 14 has a strong flow. In other words, the closer the amount of remaining copper after soldering is to the amount of copper before soldering, the more it can be determined that the occurrence of irregularities in the surface portion of the molten solder 14 ejected from the adhesion hole 23 is suppressed, It can be determined that the flow of the molten solder 14 in the cylindrical body 22 can be effectively attenuated. For this reason, the amount of remaining copper in the land portion 13 is measured in order to specify the form that can most effectively suppress the occurrence of unevenness in the surface portion of the molten solder 14 ejected from the adhesion hole 23. To do.

  22 is an enlarged cross-sectional view of section II of FIG. The intersection of the other end in the thickness direction of the substrate 11 and the other surface portion in the thickness direction of the substrate 11 is defined as a first intersection M1. Further, the other end portion in the axial direction of the land portion 13 parallel to the lead 12a (not shown in FIG. 22), the end portion near the hole portion 11a of the substrate 11, and the land portion formed on both surface portions in the thickness direction of the substrate 11. A crossing portion with the other surface portion in the thickness direction of 13 is a second crossing portion M2. The measurement of the remaining copper amount of the land portion 13 is substituted by measuring the length dimension k of the line segment connecting the first intersecting portion M1 and the second intersecting portion M2. In the following description, the length dimension k of the line segment connecting the first intersecting portion M1 and the second intersecting portion M2 may be referred to as the remaining copper amount of the land portion 13 or simply the remaining copper amount.

  FIG. 23 is a plan view showing the substrate 11 used for measuring the amount of remaining copper. The substrate 11 has a plurality of holes 11a. T0 to T5 in FIG. 23 are measurement regions of the remaining copper amount. The measurement area T0 is an area that is not soldered. Table 1 shows the types of solder reservoirs, the number of porous bodies, and the diameter dimensions of through holes formed in the porous bodies.

  “No. 1” shown in Table 1 is a case where no porous body is provided in the cylindrical body 22 of the nozzle 21. “No. 2” corresponds to the fourth embodiment in which the porous body 66 is provided in the cylindrical body 22 of the nozzle 21. “No. 3” and “No. 4” correspond to the sixth embodiment in which the first and second porous bodies 71 and 76 are provided in the cylindrical body 22 of the nozzle 21. “No. 3” and “No. 4” have different diameter dimensions of the through-holes 67 formed in the first and second porous bodies 71 and 76, respectively. About each form of these "No. 1"-"No. 4", the above-mentioned amount of remaining copper is measured.

  More specifically, among the holes 11a formed in the substrate 11, the lead 14a is filled with the solder 14 between the holes 11a formed in the measurement regions T1 to T5 and the leads 12a. 12a is soldered to the hole 11a. After the solder is solidified, the length dimension k corresponding to the amount of remaining copper is measured in each of the measurement regions T1 to T5.

  FIG. 24 is a graph showing measurement results of the remaining copper amount. The horizontal axis of the graph represents the type of the solder reservoir, and the vertical axis of the graph represents the remaining copper amount [μm] of the land portion 13. In FIG. 24, the point indicated by the symbol “◯” before soldering represents the maximum value among the plurality of length dimensions k measured in the measurement region T0, and the point indicated by the symbol “Δ” indicates the measurement region. The minimum value among the plurality of length dimensions k measured at T0 and the point indicated by the symbol “□” represent the average value of the plurality of length dimensions k measured in the measurement region T0. Yes.

  In FIG. 24, the points indicated by the symbol “◯” in “No. 1” to “No. 4” represent the maximum value among the plurality of length dimensions k measured in the measurement regions T1 to T5. , The point indicated by the symbol “Δ” represents the minimum value of the plurality of length dimensions k measured in each of the measurement regions T1 to T5, and the point indicated by the symbol “□” The average value of the plurality of length dimensions k measured at T5 is shown.

  The measured variation of the length dimension k is the smallest and the length dimension k is the largest, in other words, the difference between the maximum value and the minimum value of the length dimension k is the smallest, and before soldering In which the difference between the average value of the length dimension k and the average value of the length dimension k after soldering is minimal is uneven on the surface portion of the molten solder 14 ejected from the adhesion hole 23 It is the form which can suppress most to do.

  From the measurement result of the remaining copper amount shown in FIG. 24, the formation position of the through hole 67 having a diameter of 3 mm in the form of “No. 3”, specifically, in the cylinder 22 of the nozzle 21 having a predetermined opening area. It can be seen that when two porous bodies different from each other are provided, it is possible to most effectively suppress the occurrence of unevenness on the surface portion of the molten solder 14 ejected from the adhesion hole 23. Further, from the measurement result of the remaining copper amount shown in FIG. 24, after the “No. 3” form, the “No. 4” form corresponding to the sixth embodiment of the present invention, the fourth implementation of the present invention. It can be seen that the occurrence of the unevenness can be effectively suppressed in the order of “No.

  Each above-mentioned embodiment is only illustration of this invention, and can change a structure. For example, the actuator 41 that raises and lowers the support body 40 may be realized by a motor.

  Moreover, the cylinder 22 can take various shapes according to the shape of the soldering object. In the above-described eighth embodiment, the first and second projecting portions 86 and 87 are formed in a curved shape so as to project outward as viewed from one side in the width direction of the cylindrical body 22. The shape is not limited to this.

  In another embodiment of the present invention, the cylindrical body 22 is configured such that the first and second projecting portions 86 and 87 are inclined to the other in the vertical direction of the cylindrical body 22 toward the both longitudinal ends of the cylindrical body 22. It may be formed in a triangular shape when viewed from one side in the width direction. In still another embodiment of the present invention, the first and second protrusions 86 and 87 may be formed in a square shape or a rectangular shape when viewed from one side in the width direction of the cylindrical body 22. Even when configured as in the other embodiments of the present invention described above and still other embodiments of the present invention, effects similar to those of the eighth embodiment described above can be achieved. .

It is sectional drawing which shows the nozzle 1 of the non-jet type soldering apparatus of a prior art. 3 is a right side view showing the nozzle 1. FIG. It is sectional drawing which shows the soldering apparatus 10 provided with the solder storage body 16 of the 1st Embodiment of this invention. 3 is an enlarged cross-sectional view showing the vicinity of a hole 11a of a substrate 11. FIG. 2 is an exploded perspective view showing a part of a solder reservoir 16. FIG. FIG. 3 is a cross-sectional view showing the soldering device 10 in a state in which a portion where the attachment hole 23 of the soldering device 10 is formed appears upward from the liquid level 35 of the molten solder 14 stored in the solder bath 15. It is a perspective view which simplifies and shows the intruding means 36. FIG. It is sectional drawing which shows a part of solder storage body 16 of this Embodiment. It is sectional drawing which shows a part of solder reservoir 55 of the 2nd Embodiment of this invention. It is sectional drawing which shows a part of solder reservoir 60 of the 3rd Embodiment of this invention. It is sectional drawing which shows a part of solder reservoir 65 of the 4th Embodiment of this invention. 3 is a plan view showing a porous body 66. FIG. It is the top view to which section IV of FIG. 12 was expanded. 4 is an enlarged cross-sectional view showing a part of a nozzle 21 in a solder reservoir 65. FIG. It is sectional drawing which shows a part of solder reservoir 70 of the 5th Embodiment of this invention. It is sectional drawing which shows a part of solder reservoir 75 of the 6th Embodiment of this invention. 7 is a plan view showing a second porous body 76. FIG. It is sectional drawing which shows a part of solder reservoir 80 of the 7th Embodiment of this invention. 4 is a plan view showing a first porous body 81. FIG. It is the top view to which section VI of FIG. 19 was expanded.

It is sectional drawing which shows a part of solder reservoir 85 of the 8th Embodiment of this invention. It is sectional drawing to which section II of FIG. 4 was expanded. It is a top view which shows the board | substrate 11 used for the measurement of the amount of remaining copper. It is a graph which shows the measurement result of the amount of remaining copper.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Soldering apparatus 11 Board | substrate 11a Hole part 12 Electronic component 12a Lead 13 Land part 14 (Fused) Solder 15 Solder tank 16, 55, 60, 65, 70, 75, 80, 85 Solder reservoir 17 Solder reservoir 18 Storage space DESCRIPTION OF SYMBOLS 19 Support plate 21 Nozzle 22 Cylindrical body 23 Attachment hole 24 Ejection hole 26 Reservoir opening part 27,61,89 Through-hole 50 Metal plate 56 1st metal plate 57 2nd metal plate 66 Porous body 67,82 Through-hole 71,81 1st porous body 72,76 2nd porous body 86 1st protrusion part 87 2nd protrusion part 88 Guide hole

Claims (1)

A soldering apparatus having a solder tank in which molten solder is stored and a solder storage body provided in the solder tank,
The solder reservoir is
A solder reservoir,
A support plate that is provided in the solder storage tank and forms a storage space for storing molten solder in cooperation with the solder storage tank;
A plurality of nozzles provided on the support plate, and a plurality of nozzles for attaching the molten solder stored in the storage space to the object,
A soldering apparatus, wherein an attenuating means for attenuating a flow of molten solder is provided in a nozzle having a predetermined opening area among a plurality of nozzles.

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